JP2006303039A - Light emitting device and lighting system using same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device of which optical output and long-term reliability is hard to be degraded, and to provide a lighting system. <P>SOLUTION: The light emitting device includes a substrate 1 wherein a light emitting element 3 is placed on its upper surface, a frame 2 which has an inner peripheral surface serving as an optically reflecting surface 2a is adhered to the upper surface of the substrate 1 by means of a light transmitting adhesive 5 so that the light emitting element 3 may be surrounded, and a light transmitting member 4 which is provided inside the frame 2 so as to cover the light emitting element 3. The first adhesion face 1c of the substrate 1 to which the light transmitting adhesive 5 is adhered is used as a light scattering surface, and the light transmitting adhesive 5 is smaller in refractive index than the light transmitting member 4. Thus, a light leaking to the outside of the light emitting device can be reduced after transmitting the light transmitting adhesive 5. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a light emitting device and an illumination device that efficiently emits light emitted from a light emitting element to the outside.

  FIG. 7 shows a light emitting device that emits light by converting light such as near-ultraviolet light and blue light emitted from a light emitting element such as a conventional light emitting diode (LED) into light having a visible region wavelength such as red, green, blue, and yellow. Show. In FIG. 7, 11 is a base made of an insulator, 12 is a metal or resin frame, 12a is a light reflecting surface formed on the inner peripheral surface of the frame 12, 13 is a light emitting element, and 14 is translucent. A member, 15 is an adhesive for bonding the frame 12 to the upper surface of the base 11, and 16 is a conductive member.

  The conventional light emitting device has a mounting portion 11a for mounting the light emitting element 13 on the upper surface, and a wiring conductor 11b that electrically connects the inside and outside of the light emitting device 11 from the mounting portion 11a and its periphery is formed. The base body 11 made of an insulating material and a through hole having an upper opening larger than the lower opening are formed, and the inner peripheral surface thereof is a light reflecting surface 12a that reflects light emitted from the light emitting element 13, and the base body 11 A frame body 12 which is bonded and fixed via an adhesive 15 so as to surround the mounting portion 11a on the upper surface of the light emitting element 13, a light emitting element 13 which is electrically connected and fixed to the wiring conductor 11b via a conductive member 16, It is mainly composed of a translucent member 14 provided so as to cover the light emitting element 13 inside the frame body 12.

  The adhesive 15 includes an adhesive 15 made of a metal material such as lead (Pb) -tin (Sn) solder and silver (Ag) -copper (Cu) brazing material, transparent particles such as inorganic particles such as alumina, An adhesive 15 made of a resin material containing metal particles is used, and the base 11 and the frame 12 are bonded. Including inorganic particles or metal particles in the resin material prevents light emitted from the light emitting element 13 from passing through the adhesive 15 between the frame 12 and the base 11 and leaking out of the light emitting device. This is because the light is reflected again to the inside of the light emitting device and used as waste light of the light emitting device without waste.

Further, the adhesive 15 is such that when the light emitted from the light emitting element 13 is from the ultraviolet region to the near ultraviolet region, the adhesive 15 absorbs light of an emission spectrum having a large energy at such a short wavelength. Adhesive made of transparent resin such as silicone resin, acrylic resin, epoxy resin with low light absorption and high transmissivity, and transmittance of 80% or more in order to suppress the deterioration of bonding strength and translucency 15 is used.
JP 2004-319634 A JP 1996-330637

  However, in the conventional light emitting device, when the base 11 and the frame 12 are bonded using an adhesive 15 made of a metal material such as Pb—Sn solder or Ag—Cu brazing material, the range from the ultraviolet region to the near ultraviolet region. There is a problem that the reflectance with respect to light and blue light is remarkably lowered and absorbed by the adhesive 15.

  In addition, when bonding with transparent resin using adhesive 15 made of resin material containing inorganic particles and metal particles, light is scattered between the inorganic particles and metal particles, resulting in light absorption loss in the adhesive 15 Or the molecular bond of the resin material is cut by the light energy from the light emitting element 13, and the moisture permeability and bonding strength of the adhesive 15 are significantly deteriorated. As a result, there has been a problem that the light output emitted to the outside of the light emitting device is reduced or the long-term reliability is deteriorated.

  Further, when a transparent resin having a high transmittance is used, there is a problem that light emitted from the light emitting element 13 leaks outside the light emitting device through the transparent resin. When the light emitted from the light-emitting element 13 is from the ultraviolet region to the near ultraviolet region, there is a problem in that if such light having a short wavelength and large energy leaks outside, the surroundings may be adversely affected.

  Therefore, the present invention has been completed in view of the above-described conventional problems, and the object thereof is to prevent light from leaking from the space between the base and the frame toward the outside of the light emitting device. An object of the present invention is to provide a light-emitting device and a lighting device that do not easily deteriorate long-term reliability and do not adversely affect surroundings due to leaked light.

  The light emitting device of the present invention has a base on which a light emitting element is mounted on an upper surface, an inner peripheral surface serving as a light reflecting surface, and is bonded to the upper surface of the base via a translucent adhesive so as to surround the light emitting element. And a translucent member provided so as to cover the light emitting element inside the frame, wherein the base is coated with at least the translucent adhesive. The first adhesive surface is a light diffusing surface, and the refractive index of the translucent adhesive is smaller than the refractive index of the translucent member.

  In the light emitting device of the present invention, it is preferable that the frame has a light diffusion surface as a second bonding surface bonded to the base via at least the translucent adhesive. .

  The illuminating device of the present invention is characterized by using the light emitting device of the present invention as a light source.

  In the light emitting device of the present invention, since the refractive index of the translucent adhesive is smaller than the refractive index of the translucent member, the light from the light emitting element is transmitted through the translucent adhesive and the translucent member inside the frame. Light absorption loss due to the light-transmitting adhesive caused by light entering into the light-transmitting adhesive and reducing light absorption by the light energy of the light-emitting element that has entered. It is possible to reduce deterioration of the moisture-permeable adhesive and the bonding strength.

  In addition, since at least the first adhesive surface to which the translucent adhesive of the substrate is applied is at least a light diffusing surface, part of the light of the light emitting element that has entered the translucent adhesive is The light is diffusely reflected by the light diffusion surface formed on the first adhesive surface. As a result, the intensity of light that passes through the translucent adhesive and leaks to the outside of the light-emitting device is attenuated, and the light-emitting device is highly safe against the external environment that does not adversely affect the surroundings due to the leaked light. be able to. The

  Further, since the first adhesive surface is a light diffusing surface, the light reflected on the light transmissive member side on the light diffusing surface is a light-transmitting member having a refractive index larger than that of the light-transmitting adhesive. It is returned to the translucent member again without being totally reflected at the interface. Therefore, light loss can be reduced and the light output of the light emitting device is improved.

  In the light-emitting device of the present invention, preferably, the second adhesive surface that is bonded to the substrate through at least the light-transmitting adhesive of the frame is a light diffusion surface. Along with the light diffusion surface, light emitted from the light emitting element that has entered the light transmissive adhesive from more light emitting elements can be diffusely reflected, and therefore leaks from the light transmissive adhesive to the outside of the light emitting device. The light intensity can be further reduced, and the light incident on the translucent adhesive can be returned again into the translucent member by the light diffusion surface, so that the light output of the light emitting device is improved.

  Since the lighting device of the present invention uses the light-emitting device of the present invention as a light source, a semiconductor light-emitting element due to electron recombination can be used for the light-emitting device, which is lower in consumption than a lighting device using a conventional discharge. It is possible to provide a small lighting device that can radiate light emitted from a light-emitting element having power and a long lifetime to the outside more efficiently. Since the light-emitting device is efficient, the light-emitting element can be operated with low power consumption, and the temperature rise of the light-emitting element can be reduced. As a result, fluctuations in the center wavelength of light emitted from the light-emitting element are suppressed. Therefore, it is possible to provide an illuminating device that can continuously irradiate light having a stable emitted light intensity over a long period of time.

  In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and a reflector, an optical lens, a light diffusing plate, etc. optically designed in an appropriate shape are installed around these light emitting devices. It can be set as the illuminating device which radiates | emits the light of a simple light distribution.

  The light emitting device of the present invention and the lighting device using the same will be described in detail below. FIG. 1 is a schematic sectional view showing an example of an embodiment of a light emitting device of the present invention. In this figure, 3 is a light-emitting element, 1 is a base on which the light-emitting element 3 is mounted, and 2 is a light-reflecting surface 2a on the inner peripheral surface. A frame body 4 bonded through a transparent adhesive material 5, a translucent member provided so as to cover the light emitting element 3 inside the frame body 2, and a translucent adhesive material 5, mainly composed of these. The light emitting device of the present invention is configured.

  The substrate 1 of the present invention is made of an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, ceramics such as glass ceramics, a resin, or the like. Part 1a is formed. The light emitting element 3 is attached to the mounting portion 1a via a resin adhesive, a low melting point brazing material such as tin (Sn) -lead (Pb) solder, gold (Au) -Sn solder, or the like. The substrate 1 functions as a support member for supporting and placing the light emitting element 3.

  In addition, one end of a wiring conductor 1b led out to the outside of the base 1 of the light emitting device is formed in the vicinity of the mounting portion 1a. The mounting portion 1a may be provided on the upper surface of the protruding portion provided in the central portion of the upper surface of the base 1, and the light of the light emitting element 3 emitted in all directions of the light emitting element 3 is efficiently transmitted to the outside of the light emitting device. A light emitting device that can be taken out can be obtained.

  When the substrate 1 is made of ceramic, the wiring conductor 1b has a metallized layer mainly composed of tungsten (W), molybdenum (Mo), manganese (Mn), copper (Cu), silver (Ag), etc. And formed by forming inside. Alternatively, when the substrate 1 is made of a resin such as epoxy or LCP, it is formed by embedding lead terminals such as iron (Fe) -nickel (Ni) -cobalt (Co) alloy and exposing one end to the mounting portion 1a. Is done. Alternatively, an input / output terminal made of an insulator on which the wiring conductor 1 b is formed is provided by being fitted and joined to a through hole provided in the base 1.

  Moreover, it is preferable to deposit a metal having excellent corrosion resistance such as Ni or Au with a thickness of about 1 to 20 μm on the exposed surface of the wiring conductor 1b, effectively preventing oxidative corrosion of the wiring conductor 1b. In addition, the electrical connection between the light emitting element 3 and the wiring conductor 1b can be strengthened. Therefore, for example, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the wiring conductor 1b by an electrolytic plating method or an electroless plating method. More preferably.

  The other end of the wiring conductor 1b is led to the outer surface of the light emitting device through a wiring layer formed inside the base 1, and is connected to the light emitting device driving circuit board, whereby the light emitting element 4 and the light emitting device are connected. It has a function of electrically connecting to the drive circuit board.

  Further, the frame body 2 is made of a translucent material made of a resin such as a silicone resin, an epoxy resin, an acrylic resin, or a fluororesin so as to surround the mounting portion 1a on which the light emitting element 3 is mounted on the upper surface of the substrate 1. A first bonding surface 1c bonded through an adhesive 5 is provided, and at least the first bonding surface 1c is a light diffusion surface. Note that the entire upper surface of the substrate 1 may be a light diffusion surface.

  The translucent adhesive 5 is formed by depositing an uncured resin on the first adhesive surface provided so as to surround the mounting portion 1a on the upper surface of the substrate 1 with an injector such as a dispenser. It is formed by placing the body 2 on its upper surface and curing it by heating.

  In addition, since the refractive index of the translucent adhesive 5 is smaller than the refractive index of the translucent member 4, the light from the light emitting element 3 is totally transmitted at the interface between the translucent adhesive 5 and the translucent member 4. Since the incident angle of the reflected light is increased, the light entering the translucent adhesive 5 can be reduced. As a result, deterioration of the light-transmitting adhesive 5 with respect to moisture permeability and bonding strength can be reduced by the light energy of the light-emitting element 3 that has entered the light-transmitting adhesive 5.

  That is, when the light emitted from the light emitting element 3 is from the ultraviolet region to the near ultraviolet region, the light transmissive adhesive material 5 has light emission spectrum light having a large energy at a short wavelength. The bonding strength and translucency are degraded. Therefore, in order to prevent the light transmissive adhesive material 5 from being deteriorated by transmitting light absorbed by the light transmissive adhesive material 5, a silicone resin, acrylic resin, epoxy resin, or the like having a transmittance of 80% or more is used. A translucent adhesive material 5 made of a transparent resin is used.

  Further, since the base 1 has at least a first adhesive surface 1c to which the translucent adhesive 5 is applied as a light diffusion surface, the light of the light emitting element 3 that has entered the translucent adhesive 5 is transmitted. A part is reflected and diffused by the first adhesive surface 1 c formed on the substrate 1. As a result, the light intensity that is transmitted through the translucent adhesive 5 and leaks outside the light emitting device is attenuated. As a result, the high energy harmful light leaking from the light emitting device is attenuated and the energy thereof is lowered. As a result, the light emitting device has little adverse effect on the external environment. Further, since light that passes through the translucent adhesive 5 and leaks to the outside of the light emitting device is reduced, the light leaked from other than the predetermined light emitting surface of the light emitting device is diffusely reflected by the mounting substrate or the like and emitted. The light contrast on the irradiated surface is not deteriorated.

  Further, the light reflected by the light diffusing surface provided on the first adhesive surface 1 c toward the translucent member 4 side is at the interface with the translucent member 4 having a refractive index larger than that of the translucent adhesive 5. The light is returned to the translucent member 4 again without being totally reflected. And since the light returned in the translucent member 4 is utilized as emitted light of the light emitting device, the light output of the light emitting device is improved.

  This light diffusing surface is formed by forming a plurality of fine concave portions or convex portions on the first adhesive surface 1c. Thereby, the light incident on the translucent adhesive material 5 is diffused by the first adhesive surface 1 c and reflected toward the translucent member 4. Further, the light diffusing surface may be formed so that a protrusion having a triangular cross-sectional shape surrounds the outer periphery of the light emitting element, and the light incident on the translucent adhesive 5 is transmitted through the first adhesive surface 1c. It is diffused and reflected toward the translucent member 4. The light diffusing surface can be formed using blasting, cutting, or molding. Since the surface of the first adhesive surface 1c is a light diffusing surface such as a fine concavo-convex structure, the adhesive force with the translucent adhesive 5 is also strengthened.

  In addition to the above, the outer peripheral side of the light diffusing surface in the outer direction of the light emitting device may be colored with a light-absorbing color such as black or coated with a light-absorbing substance. Good. As the substance to be applied, for example, a substance that is difficult to be decomposed by high energy light such as carbon particles is preferable. As a result, the amount of light leaking from the translucent adhesive 5 to the outside of the light emitting device can be extremely reduced. Moreover, since light of high energy is absorbed by the light diffusing surface and light scattered into the translucent adhesive material 5 is reduced, deterioration of the translucent adhesive material 5 can also be prevented.

  Next, the frame 2 has an inner peripheral surface facing the light emitting element 3 as a light reflecting surface 2a, and a translucent member 4 is formed in a recess formed by the base body 1 and the frame 2 on the inside. Injection is performed so as to cover the light emitting element 3. In addition, the inner peripheral surface of the frame 2 is an inclined surface with the upper end spreading outward rather than the lower end, and the light reflecting surface 2a is formed on the inclined surface.

  The frame 2 is made of metal such as Al, stainless steel (SUS), Ag, iron (Fe) -Ni-cobalt (Co) alloy, Fe-Ni alloy, resin, ceramics, or the like. When the frame body 2 is made of metal, the inner peripheral surface is mirror-finished by a method such as polishing, so that the inner peripheral surface reflects light emitted from the light emitting element 3 or scattered light in the translucent member 4 well. It can be set as the light reflection surface 2a which can do. In the case where the inner peripheral surface is made of resin, ceramics, or the like, a metal layer made of Au, Ag, Al, Cu, or the like is formed on the inner peripheral surface by plating, vapor deposition, or the like. It can be set as the light reflection surface 2a which can reflect the scattered light in the translucent member 4 favorably.

  The frame 2 is made of Al or SUS from the viewpoint that the light reflecting surface 2a with high light reflection efficiency can be more easily manufactured and that corrosion due to oxidation or the like can be prevented. Is preferred. Further, when such a frame body 2 is made of metal, the frame body 2 is formed into a predetermined shape by subjecting an ingot of the material to conventionally known metal processing such as cutting, rolling, and punching.

  The light reflecting surface 2a may have a flat (straight) shape as shown in FIG. 1 or a circular arc (curved) shape as shown in FIG. In the case of the arc shape, the light having the directivity or diffusibility can be uniformly emitted upward by converging the light of the light emitting element 3.

  In addition, as shown in FIG. 2, it is preferable that the second bonding surface 2 b bonded to the substrate 1 through at least the translucent adhesive 5 is a light diffusion surface of the frame body 2. Since the second adhesive surface 2b is a light diffusion surface, in addition to the light scattering surface provided on the first adhesive surface, the light scattering surface of the second adhesive surface 2b is also formed between the substrate 1 and the frame body 2. It is possible to better reflect and diffuse the light in the translucent adhesive 5 sandwiched between the two. As a result, the intensity of light leaking from the light-transmitting adhesive 5 to the outside of the light emitting device can be further attenuated, and the light is also incident on the light-transmitting adhesive 5 by the light scattering surface of the second adhesive surface 2b. A highly safe light-emitting device that can reflect light toward the translucent member 4 and further improve the light output of the light-emitting device, has excellent long-term reliability, and has little adverse effect on the external environment; can do. Needless to say, the outer peripheral side of the light scattering surface of the second adhesive surface 2b is preferably light-absorbing.

  The light-emitting element 3 has a wire bonding (not shown) at one end of the wiring conductor 1b formed in the vicinity of the mounting portion 1a of the base 1 or the electrode portion of the light-emitting element 3 on the Au-Sn. Flip chip bonding is performed by a conductive member 6 made of a solder material such as solder or Pb-Sn solder or a conductive resin such as Ag paste. Preferably, a flip-chip bonding method is used, whereby a connection portion with the wiring conductor 1b can be provided immediately below the light emitting element 3, and therefore the wiring conductor 1b is provided on the upper surface of the substrate 1 around the light emitting element 3. It becomes unnecessary to provide a space. As a result, it is possible to suppress the light emitted from the light emitting element 3 from being absorbed by the connection portion of the base 1 with the wiring conductor 1b and the intensity of the emitted light of the light emitting device from being lowered. Furthermore, since the heat generated by the operation of the light emitting element 3 is efficiently conducted to the substrate 1 through the wiring conductor 1b, the temperature rise of the light emitting element 3 during the operation of the light emitting device can be suppressed, and the light emission efficiency. And the fluctuation of the emission wavelength can be suppressed.

  The conductive member 6 has a paste material such as Au-Sn or Pb-Sn, or a paste such as Ag paste placed on the wiring conductor 1b by using a dispenser or the like. The electrode of the light emitting element 3 and the upper surface of the conductive member 6 The light-emitting element 3 is placed so that the electrodes are in contact with each other, and then the whole is heated at about 250 ° C. to 350 ° C., so that the electrode of the light-emitting element 3 and the wiring conductor 1b are flip-chip mounted by the conductive member 6 to be electrically Connected light emitting devices can be manufactured.

  The light emitting element 3 may have any peak wavelength of emitted energy from the ultraviolet region to the infrared region. However, from the viewpoint of emitting white light and various colors of light with good visibility, the light emitting device 3 has a wavelength of about 300 to 500 nm. It is preferable that the element emits light from ultraviolet to blue. For example, a buffer layer composed of gallium (Ga) -nitrogen (N), Al-Ga-N, indium (In) -GaN, etc., an N-type layer, a light-emitting layer, and a P-type layer are sequentially stacked on a sapphire substrate. A gallium nitride compound semiconductor or a silicon carbide (SiC) compound semiconductor is used.

  Then, after the light emitting element 3 is placed on the placement portion 1 a and electrically connected to the wiring conductor 1 b via the conductive member 6, the light emitting element 3 is placed on the upper surface of the base 1 or the inside of the frame 2. The translucent member 4 is disposed so as to cover the surface.

  The translucent member 4 is made of a transparent resin such as an epoxy resin or a silicone resin, or transparent glass. When the translucent member 4 is made of a transparent resin, an uncured transparent member is placed inside the frame body 2 by an injector such as a dispenser. It is formed by injecting so as to cover and heat-curing. Thereby, for example, the refractive index difference between the inner side and the outer side of the light-emitting element 3 in which the refractive index of the light-emitting layer made of gallium nitride is 2.5 and the refractive index of the substrate made of sapphire on which the light-emitting layer is formed is 1.7 is reduced. A light emitting device can be manufactured in which more light can be extracted from the light emitting element 3, the emission intensity can be improved, and the emitted light intensity and luminance can be significantly improved.

  The translucent member 4 is formed by injecting an uncured transparent member containing a phosphor into the inside of the frame 2 so as to cover the light emitting element 3 with an injector such as a dispenser, and heat curing. Thus, a light-emitting device that can emit light having an arbitrary wavelength spectrum using the light of the phosphor can be manufactured.

  Further, the translucent member 4 is a transparent member that contains the phosphor so that the translucent member 4 that does not contain the phosphor is disposed inside the frame 2 so as to cover the light emitting element 3 and closes the upper surface thereof. You may make it the structure by which the produced sheet-like fluorescent film is arrange | positioned. By not arranging the phosphor around the light emitting element 3 in this way, light confinement by the phosphor is suppressed, and deterioration of the resin around the light emitting element 3 and light absorption loss are suppressed. As a result, it is possible to efficiently extract light from the light emitting element 3 and irradiate the sheet-like phosphor film with light, so that the light output generated from the phosphor increases and the color unevenness is small and the luminous efficiency is high. Can be produced.

Various materials are used for the phosphor. For example, red is La ₂ O ₂ S: Eu (Eu-doped La ₂ O ₂ S) phosphor, LiEuW ₂ O ₈ , and green is ZnS: Cu, Al or SrAl. ₂ O ₄ : Eu phosphor, and blue is (BaMgAl) ₁₀ O ₁₂ : Eu, BaMgAl ₁₀ O ₁₇ : Eu and the like are used. Furthermore, the phosphor is not limited to one type, and a light emitting device capable of outputting light having a desired emission spectrum and color can be obtained by blending a plurality of phosphors at an arbitrary ratio.

  Next, the light emitting device of the present invention can be obtained by using one light source as a light source, or a plurality of light emitting devices, for example, a lattice shape, a staggered shape, a radial shape, a circular shape or a polygonal shape made up of a plurality of light emitting devices, etc. The light emitting device group of the present invention can be used as a light source arranged in a predetermined arrangement such as a plurality of light emitting device groups formed concentrically. As a result, the lighting device of the present invention can have lower power consumption and longer life than the conventional lighting device using discharge when utilizing light emission of the light emitting element 3 made of semiconductor, and further generates heat. It can be a small lighting device with little. As a result of being able to operate efficiently with low power, the amount of heat generated by the light emitting element 3 is small, fluctuations in the center wavelength of the light generated from the light emitting element 3 can be suppressed, and stable radiated light over a long period of time. While being able to irradiate light with an intensity and a radiated light angle (light distribution), it is possible to provide an illuminating device with less color unevenness and uneven illuminance distribution on the irradiated surface.

  In addition to installing the light emitting device of the present invention as a light source in a predetermined arrangement, by installing a reflector, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which can irradiate the light of light distribution.

  For example, a plurality of light emitting devices 101 of the present invention are arranged in a plurality of rows on the light emitting device driving circuit board 102 as shown in the plan view and the sectional view shown in FIGS. In the case of an illuminating device in which an optically designed reflector 103 is installed, an arrangement in which adjacent rows of light emitting devices 101 are arranged between a plurality of light emitting devices 101 arranged in a row, a so-called staggered arrangement. It is preferable. That is, when the light emitting devices 101 are arranged in a vertical and horizontal grid, the glare is strengthened by arranging the light emitting devices 101 as light sources on a straight line, and such a lighting device enters human vision. However, the staggered arrangement can suppress glare and reduce discomfort and damage to the eyes of the human eye. Furthermore, compared to the case where the light emitting devices 101 are arranged in a grid pattern in the vertical and horizontal directions, the distance between the adjacent light emitting devices 101 is increased, so that thermal interference between the adjacent light emitting devices 101 is effectively suppressed, and light emission. Heat accumulation in the light emitting device driving circuit board 102 on which the device 101 is mounted is suppressed, and heat is efficiently dissipated outside the light emitting device 101. As a result, it is possible to manufacture a long-life lighting device with stable optical characteristics over a long period of time with little obstacles to human eyes.

  Further, the lighting device is a concentric arrangement of a circular or polygonal light emitting device 101 group composed of a plurality of light emitting devices 101 on the light emitting device drive circuit board 102 as shown in the plan view and the cross-sectional view shown in FIGS. In the case of a plurality of illuminating devices arranged in a group, it is preferable that the number of light emitting devices 101 arranged in one circular or polygonal light emitting device 101 group be increased from the central side of the illuminating device toward the outer peripheral side. Thereby, it is possible to arrange more light emitting devices 101 while maintaining an appropriate interval between the light emitting devices 101, and it is possible to further improve the illuminance of the lighting device. In addition, the density of the light emitting device 101 in the central portion of the lighting device can be reduced to suppress heat accumulation in the central portion of the light emitting device driving circuit board 102. Therefore, the temperature distribution in the light emitting device driving circuit board 102 becomes uniform, heat is efficiently transmitted to the external electric circuit board and the heat sink on which the lighting device is installed, and the temperature rise of the light emitting device 101 can be suppressed. As a result, the light-emitting device 101 can operate stably over a long period of time, and a long-life lighting device can be manufactured.

  Examples of such lighting devices include general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, display lighting fixtures, and street lamp lighting fixtures that are used indoors and outdoors. , Guide light fixtures and signaling devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency lighting fixtures, flashlights , Electronic bulletin boards and the like, backlights such as dimmers, automatic flashers, displays, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, in-vehicle lights, and the like.

  In addition, this invention is not limited to the example of the above embodiment, If it is in the range which does not deviate from the summary of this invention, it will not interfere at all.

  For example, a plurality of light emitting elements 3 may be provided on the base 1 in order to improve the radiation intensity.

  Further, the lighting device of the present invention is not limited to one in which a plurality of light emitting devices 101 are installed in a predetermined arrangement, but may be one in which one light emitting device 101 is installed in a predetermined arrangement. For example, one light emitting device 101 may be arranged at the center of the lighting device.

It is sectional drawing which shows an example of embodiment of the light-emitting device of this invention. It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. It is a top view which shows an example of embodiment of the illuminating device of this invention. It is sectional drawing of the illuminating device of FIG. It is a top view which shows the other example of embodiment of the illuminating device of this invention. It is sectional drawing of the illuminating device of FIG. It is sectional drawing which shows the example of the conventional light-emitting device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1: Base 1a: Mounting part 1b: Wiring conductor 1c: 1st adhesion surface 2: Frame body 2a: Light reflection surface 2b: 2nd adhesion surface 3: Light emitting element 4: Translucent member 5: Translucency Adhesive 6: Conductive member

Claims (3)

A base on which a light emitting element is mounted on an upper surface, a frame body having an inner peripheral surface as a light reflecting surface, and bonded to the upper surface of the base via a translucent adhesive so as to surround the light emitting element; A light-emitting device including a light-transmitting member provided so as to cover the light-emitting element inside a frame, wherein the base has at least a first adhesive surface to which the light-transmitting adhesive is attached A light-emitting device, wherein the light-transmitting adhesive has a refractive index smaller than that of the light-transmitting member. 2. The light emitting device according to claim 1, wherein the frame body has a light diffusing surface as a second bonding surface bonded to the base body through at least the translucent adhesive. 3. An illumination device using the light-emitting device according to claim 1 as a light source.

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