JP2006100441A - Light emitting element housing package, light emitting device, and illumination device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting element housing package along with a light emitting device and an illumination device, capable of manufacturing the light emitting device of which variation in brightness and color tone that occurs between adjoining light emitting elements is reduced for stable optical characteristics. <P>SOLUTION: The light emitting element housing package comprises a base body 2 which comprises, on its upper surface, a plurality of mounting parts 2a for light emitting elements 4 arrayed in straight, and a reflecting member 3 which is attached to the upper surface of the base body 2 and is provided with a plurality of through holes 3a formed to enclose the inner surfaces of the plurality of mounting parts 2a. A notch 3b is formed from the upper end on the inner surface of the through hole 3a to the upper end on the inner surface of an adjoining through hole 3a on the upper surface of the reflecting member 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a light emitting element storage package for accommodating a light emitting element, a light emitting device, and an illumination device.

  Conventionally, light-emitting devices using light-emitting elements such as light-emitting diodes (LEDs) and semiconductor lasers (LDs) have been attracting attention because they are expected to further reduce power consumption and extend their lifetime in the future. It has begun to be used in various fields such as various indicators, optical sensors, displays, photocouplers, backlights, and optical printer heads. In addition, light-emitting devices that are mounted with a plurality of light-emitting elements to increase the light output of the light-emitting device and aim at an increase in light output have begun to be used. A cross-sectional view of a light emitting device for mounting a plurality of conventional light emitting elements is shown in FIG.

  As shown in FIG. 7, the conventional light emitting device 11 has a base 12 generally made of various materials such as resins and ceramics. The base 12 is formed with a metallized layer formed by firing a conductive paste containing tungsten (W), molybdenum (Mo) -manganese (Mn), etc., and a nickel (Ni) plated layer or gold ( A wiring conductor (not shown) with an Au) plating layer is formed. Then, electric power is supplied from the outside to the light emitting element 14 in the light emitting device 11 through this wiring conductor, and the light emitting element 14 is operated.

  The base 12 is made of various resins, ceramics, aluminum (Al), silver (Ag), or the like having high reflectivity in the visible light region on one main surface inside the light emitting device 11, and on the upper and lower surfaces of the central portion. A square-shaped reflecting member 13 having a through hole is provided. This reflecting member 13 is attached to the base 12 by a conventionally known ceramic lamination method, or a brazing material such as Ag-copper (Cu) or a resin adhesive having a melting point of 700 to 900 ° C., and melted at 500 ° C. or less. It is fixed by low melting glass or Au-tin (Sn) low-temperature solder material.

  The light-emitting element 14 is die-bonded to the base 12 with Ag paste or the like, and the wiring conductor arranged around the mounting portion 12a and the electrode of the light-emitting element 14 are connected via a bonding wire (not shown) such as Au or Al. Electrically connected.

  Then, a transparent member 15 such as an epoxy resin or a silicone resin is filled inside the reflecting member 13 so as to cover the light emitting element 14, and is thermally cured, so that the light emitting element 14 is protected and firmly adhered to the substrate 12. The Alternatively, a transparent member 15 mixed with a phosphor (not shown) is applied around or on the surface of the light-emitting element 14 and thermally cured, whereby the light from the light-emitting element 14 is wavelength-converted by the phosphor and has a desired wavelength. It becomes possible to extract light having a spectrum. Then, a light-transmitting lid (not shown) is joined to the upper surface of the reflecting member 13 with solder, a resin bonding material, or the like, so that the light emitting device 11 is obtained.

  These light emitting devices 11 emit visible light by causing the light emitting element 14 to emit light by a drive current supplied from an external electric circuit (not shown). Applications include various indicators, optical sensors, displays, photocouplers, backlights, and optical printer heads. In recent years, the light-emitting device 11 has come to be used as a light source for a large display, and a light-emitting device having higher characteristics in terms of high luminance is required. Further, when used as a display light source, uniform color tone control and uniform brightness are required.

  Therefore, recently, in order to improve the light emission luminance of the light emitting device, a light emitting device in which a plurality of light emitting elements are mounted in the light emitting device is used. As an example, a cross-sectional view of the light emitting device is shown in FIG.

The light emitting device 21 shown in FIG. 8 has a structure in which the light emitting device 11 having one light emitting element 14 shown in FIG. 7 is connected. The light emitting device 21 having a plurality of light emitting elements 24 has a light emitting efficiency. In order to suppress improvement and color unevenness, a phosphor layer 26 containing a phosphor is disposed on the upper side of the transparent member 25, which corresponds to the high light output of the light emitting device 21.
Japanese Patent No. 30565263

  However, in the conventional light-emitting device 21 shown in FIG. 8, the light is blocked by the reflecting member 23 positioned between the light-emitting elements 24, resulting in non-uniform light intensity. There was a problem that the variation of the above occurred. That is, light is generated from the light-emitting element 24 that is reflected on the upper surface by the reflecting member 23, while a portion 26a where the light does not reach the upper side of the reflecting member 23 located between the light-emitting elements 24 is formed.

  Further, in the conventional light emitting device 21, the light emitted from the light emitting element 24 is incident on the phosphor layer 26 through the transparent member 25, and the light emitting device 21 that can convert the wavelength and extract the light having a desired wavelength spectrum can be formed. However, the light is limited to the light in the region surrounded by the reflecting member 23. In other words, the increase in brightness depends on the area of the phosphor layer 26 located in the region surrounded by the reflecting member 23 in plan view, and the package size is increased in order to cope with further increase in brightness. Therefore, there is a problem that the light emitting device 21 cannot be reduced in size.

  Therefore, the present invention has been completed in view of such conventional problems, and the object thereof is to reduce luminance variation and color variation generated between adjacent light emitting elements, and to achieve stable optical characteristics. It is an object of the present invention to provide a light emitting element storage package, a light emitting device, and an illuminating device that can produce a light emitting device that can be obtained.

  The light emitting element storage package of the present invention has a base having a plurality of light emitting element mounting portions arranged linearly on the upper surface, and an inner surface of each of the plurality of mounting portions attached to the upper surface of the base. In the light emitting element storage package comprising a reflective member provided with a plurality of through holes formed so as to surround the reflective member, the reflective member has an upper surface on the inner surface of the through hole adjacent to the upper end of the inner surface of the through hole. A notch portion is formed over the upper end of the substrate.

  Further, the light emitting device of the present invention is filled with the light emitting element storage package described above, the light emitting elements respectively mounted on the plurality of mounting portions, and covering the light emitting elements inside the plurality of through holes. And a transparent member that is continuous through the notch, and a phosphor layer that is formed so as to cover the transparent member and converts the wavelength of light of the light-emitting element. To do.

  Moreover, the illuminating device of the present invention is characterized in that the above light emitting device is installed as a light source.

  The light emitting element storage package of the present invention has a base having a plurality of light emitting element mounting portions arranged linearly on the upper surface, and an inner surface surrounding each of the plurality of mounting portions attached to the upper surface of the base. In the light emitting element storage package comprising a reflective member provided with a plurality of through holes formed in the reflective member, the reflective member is notched on the upper surface from the upper end of the inner surface of the through hole to the upper end of the inner surface of the adjacent through hole. Since the light emitting element is formed, the light emitted from the light emitting element can travel well on the reflecting member located between the through holes through the notch, and is generated between the adjacent light emitting elements. The luminance variation and the color tone variation to be reduced can be reduced, and a light-emitting device capable of obtaining stable optical characteristics can be manufactured.

  Further, light emitted from the light emitting element can be reflected very well to the outside by a portion other than the cutout portion of the reflecting member, and a light emitting device with high light emission efficiency can be manufactured. Therefore, it is not necessary to increase the light emission intensity by increasing the number of mounted light emitting elements as in the conventional case. If the light emitting device has the same light emission intensity as the conventional one, the number of light emitting elements can be reduced and the light emitting device can be downsized.

  The light-emitting device of the present invention includes the light-emitting element storage package, the light-emitting elements respectively mounted on the plurality of mounting portions, and filled with the light-emitting elements inside the plurality of through holes and the notch portions. A transparent member that is continuous through the phosphor, and a phosphor layer that is formed so as to cover the transparent member and converts the wavelength of the light of the light emitting device, so that the light emitted from the light emitting device is cut out. Can be evenly incident on the wavelength conversion layer above the reflecting member located between the through-holes through the part, and thus the luminance variation and color variation can be reduced and the phosphor layer used for wavelength conversion can be used. The possible range can be expanded and the luminous efficiency can be increased. As a result, it has excellent luminous efficiency and high performance capable of obtaining stable optical characteristics and color tone characteristics.

  In addition, the light traveling from the light emitting element and traveling sideways is reflected upwards well by a moderately high reflecting member surrounding the light emitting element, so that it is effective to enter the wavelength conversion layer in an extremely oblique direction. Can be suppressed. Therefore, the light emitted from the light emitting element enters the wavelength conversion layer at the same incident angle, and the path length passing through the wavelength conversion layer has the same value, so that unevenness of the light intensity distribution is suppressed.

  Since the illuminating device of the present invention is installed so that the above-described light emitting device of the present invention is used as a light source, it uses light emission by recombination of electrons of a light emitting element made of a semiconductor. It can be a small lighting device that can have lower power consumption and longer life than the device. As a result, fluctuations in the center wavelength of light generated from the light emitting element can be suppressed, light can be emitted with a stable radiant light intensity and radiant light angle (light distribution distribution) over a long period of time, and an irradiation surface It is possible to provide a lighting device in which uneven color and uneven illuminance distribution are suppressed.

  In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which radiates | emits the light of this light distribution.

  The light emitting element storage package, the light emitting device, and the lighting device of the present invention will be described in detail below. FIG. 1 is a cross-sectional view illustrating an example of an embodiment of a light-emitting element storage package and a light-emitting device according to the present invention. FIG. 2 is a cross-sectional view taken along line AA ′ of the light-emitting element storage package and the light-emitting device of FIG. FIG. In FIG. 1, 2 is a base, 3 is a reflecting member, and these mainly constitute a light-emitting element housing package for housing the light-emitting elements. Reference numeral 4 denotes a light emitting element, 5 denotes a transparent member, and 6 denotes a phosphor layer made of a translucent member containing a phosphor. The light emitting device 1 is mainly composed of these and the light emitting element storage package. .

  The light emitting element storage package according to the present invention includes a base body 2 having a plurality of light emitting element 4 mounting portions 2a arranged linearly on the upper surface, and a plurality of mounting portions 2a attached to the upper surface of the base body 2. The reflecting member 3 is provided with a plurality of through-holes 3a formed so as to surround the inner surface.

  The substrate 2 of the present invention functions as a support member for supporting and mounting the light emitting element 4 and a heat radiating member for radiating the heat of the light emitting element 4. The light emitting element 4 is attached to the mounting portion 2a on the upper surface of the base 2 via a low-melting-point brazing material such as a resin adhesive, Sn-lead (Pb) solder, or Sn-Au. And the heat | fever of the light emitting element 4 is maintained favorably because the heat | fever of the light emitting element 4 is transmitted to the base | substrate 2 via a resin adhesive and a low melting-point brazing material, and is efficiently dissipated outside. Further, the light emitted from the light emitting element 4 is reflected by the inner surface of the through hole 3a of the reflecting member 3 and radiated to the outside.

  The substrate 2 is made of ceramics such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, glass ceramics, a resin, glass, and the like. A wiring conductor (not shown) leading to the outer surface such as the lower surface is formed. Further, the base 2 may be a metal, and in this case, the wiring conductor is disposed on the base 2 via an insulator such as glass so that the insulation with the base 2 can be maintained.

  The wiring conductor formed on the substrate 2 is formed of, for example, a metallized layer such as W, Mo, Mn, or Cu. For example, a metal paste obtained by adding and mixing an organic solvent and a solvent to a powder such as W. Is formed on the substrate 2 by printing, coating and baking in a predetermined pattern. A metal layer such as a Ni layer having a thickness of 0.5 to 9 μm or an Au layer having a thickness of 0.5 to 5 μm is provided on the surface of the wiring conductor to prevent oxidation and to firmly connect a bonding wire (not shown). It is good to deposit by plating.

  The reflecting member 3 of the present invention is made of metal such as Al, stainless steel (SUS), Ag, iron (Fe) -Ni-cobalt (Co) alloy, Fe-Ni alloy, resin, ceramics, glass, or the like. The reflecting member 3 is preferably made of Al or SUS having high light reflectivity and excellent environmental resistance in order to enhance the light reflecting effect in the visible light region and the like and prevent corrosion due to oxidation.

  The reflecting member 3 may be coated with a metal or the like having excellent light reflection characteristics on the surface in order to improve light reflection characteristics.

  Moreover, the reflection member 3 is provided with a plurality of through holes 3a formed so that the inner surfaces surround each of the plurality of mounting portions 2a. Such a reflecting member 3 is formed in a predetermined shape by performing conventionally known metal processing such as cutting, rolling, and punching. The inner surface of the through-hole 3a may be a flat surface with a vertical cross-sectional shape, or may be a curved surface that is recessed downward or a curved surface that is convex upward.

  Further, a cutout portion 3b is formed on the upper surface of the reflecting member 3 from the upper end of the inner surface of the through hole 3a to the upper end of the inner surface of the adjacent through hole 3a. Thereby, the light of the light emitting element 4 accommodated in the light emitting device 1 can be favorably reflected by the inner surface of the through-hole 3a other than the notch 3b, and the luminance variation generated between the adjacent light emitting elements 4 can be achieved. And color variation can be reduced. Therefore, the light emission efficiency, luminance, and luminous intensity of the light emitting device 1 using the light emitting element storage package of the present invention can be made extremely high, and luminance variation and color variation can be reduced.

  The through hole 3a formed in the reflecting member 3 is preferably an inclined surface whose inner surface extends upward. Thereby, the light emitted from the light emitting element 4 can be favorably reflected upward.

  Further, when the angle formed between the inner surface of the through hole 3a of the reflecting member 3 and the upper surface of the base 2 is less than 35 degrees, the radiation angle spreads to 45 degrees or more, the amount of dispersed light increases, and the luminance and luminous intensity of light increase. It tends to decrease. On the other hand, when the angle exceeds 60 degrees, the light of the light emitting element 4 is not emitted well outside the light emitting device 1 and is easily diffusely reflected in the light emitting device 1. Therefore, the angle formed by the inner surface of the reflecting member 3 and the upper surface of the base 2 is preferably 35 to 60 degrees.

  Further, when the cross-sectional shape of the through hole 3a is a truncated cone shape, the angle formed between the inner surface of the through hole 3a and the upper surface of the base body 2 is preferably set to 35 to 60 degrees as described above. In some cases, at least a pair of opposing ramps may be defined at this angle. That is, even if the pair of opposing slopes is not in this range, the light emission efficiency can be extremely high as long as the other pair of slopes is within this angle range.

  Moreover, it is preferable that arithmetic mean roughness Ra of the inner surface of the through-hole 3a is 0.004-4 micrometers or less. That is, when the arithmetic average roughness Ra of the inner surface exceeds 4 μm, it becomes difficult to regularly reflect the light of the housed light emitting element 4 and emit it above the light emitting element housing package, and the light intensity is attenuated. Or bias is likely to occur. In addition, when the arithmetic average roughness Ra of the inner surface of the through hole 3a is less than 0.004 μm, it is difficult to form such a surface stably and efficiently, and the product cost tends to increase. Therefore, the arithmetic average roughness Ra of the inner surface is preferably 0.004 to 4 μm. In addition, in order to make Ra of the inner surface of through-hole 3a into said range, it can form by a conventionally well-known electrolytic polishing process, a chemical polishing process, or a cutting process. Further, a method of forming by transfer processing using the surface accuracy of the mold may be used.

  Further, a cutout portion 3b is formed on the upper surface of the reflecting member 3 from the upper end of the inner surface of the through hole 3a to the upper end of the inner surface of the adjacent through hole 3a. Depth D (see FIG. 2) and length L of notch 3b (distance from one end of notch 3b on one through hole 3a side to the other end on the other through hole 3a side: see FIG. 2) The length L is preferably not more than twice the length D. That is, when the length L exceeds twice the depth D, the ratio of the light of the light emitting element 4 incident on the phosphor layer 6 on the upper side of the central portion of the notch 3b is reduced, and the notch 3b is formed. The effect is reduced by approaching the same characteristics as the shape that has not been done.

  In order to make the dimension of the notch 3b within the above range, it can be formed by a conventionally known electrolytic polishing process, chemical polishing process or cutting process. Further, a method of forming by transfer processing using a mold may be used. The width of the notch 3b is not particularly specified, but is preferably equal to or smaller than the size of the upper opening of the through hole 3b from the viewpoint of reflecting light with high efficiency. Thereby, the reflection characteristic of the reflecting member 3 is not impaired, and the ratio of light incident on the phosphor layer 6 is not lowered.

  The reflecting member 3 is bonded to the upper surface of the base 2 with a resin adhesive such as silicone or epoxy, or a metal brazing material such as Ag—Cu brazing, Pb—Sn, Au—Sn, Au—silicon ( Joined by solder such as Si), Sn-Ag-Cu. The bonding material may be appropriately selected in consideration of the material of the base 2 and the reflecting member 3, the thermal expansion coefficient, and the like, and is not particularly limited. In addition, when high reliability of bonding between the base 2 and the reflecting member 3 is required, it is preferable to bond the base 2 and the reflecting member 3 with a metal brazing material or solder.

  The transparent member 5 is made of a light-transmitting transparent resin such as silicone resin or epoxy resin, or an inorganic material such as glass, and an uncured liquid material is placed inside the through hole 3a of the reflecting member 3 and inside the notch 3b. After being injected by a dispenser or the like, it is formed by being heated and cured at a temperature around 200 ° C. The transparent member 5 may be appropriately selected in consideration of the material of the base 2 and the reflecting member 3, the thermal expansion coefficient, and the like, and is not particularly limited. Moreover, when high reliability is required, it is preferable to use a transparent member containing glass or a sol-gel glass-based inorganic material.

  The phosphor layer 6 is excited by light from the light emitting element 3 and can emit fluorescence having a desired wavelength. For example, the phosphor layer 6 is at least selected from an alkaline earth aluminate phosphor and a rare earth element. Phosphors and pigments such as yttrium, aluminum, and garnet phosphors activated by a kind of element are contained in translucent members made of organic materials such as silicone resin and epoxy resin, and inorganic materials such as glass. Become.

  Such a phosphor layer 6 is produced as follows, for example. First, a translucent member containing a phosphor or a pigment is formed on a smooth substrate in a thick film shape, heated and cured, and then peeled off from the substrate to form a film-like phosphor layer 6. Next, a phosphor layer is formed by attaching the same material as that of the transparent member 5 as an adhesive to the upper surface of the transparent member 5 formed in the through hole 3a or the notch 3b of the reflecting member 3. 6 is configured.

  The light emitting device 4 may have any peak wavelength of energy to be emitted from the ultraviolet region to the infrared region, but from the viewpoint of emitting white light and light of various colors with good visibility, a near ultraviolet system of 300 to 500 nm. To an element that emits blue light. For example, a gallium nitride-based compound semiconductor such as GaN, GaAlN, InGaN, or InGaAlN, or a silicon carbide-based compound semiconductor or ZnSe (selenide) in which a buffer layer, an n-type layer, a light-emitting layer, and a p-type layer are sequentially stacked on a sapphire substrate. Zinc) or the like in which the light emitting layer is formed.

  The light emitting element 4 is electrically connected to a wiring conductor formed on the base 2 by a wire bonding method in which the light emitting element 4 is connected via a wire such as an Au wire or an Al wire. Alternatively, the electrode formed on the lower surface of the light emitting element 4 is connected to a solder bump such as Au—Sn solder, Sn—Ag solder, Sn—Ag—Cu solder or hSn—Pb solder, or a metal bump such as Au or Ag. It is electrically connected to the wiring conductor formed on the base body 2 by a method such as a flip chip bonding method. Preferably, the connection is made by a flip chip bonding method. Accordingly, since the wiring conductor can be provided immediately below the light emitting element 4 on the upper surface of the base body 2, it is not necessary to provide a wiring conductor region in the periphery of the light emitting element 4 on the upper surface of the base body 2. Therefore, it is possible to effectively suppress the light output emitted from the light emitting element 4 from being absorbed by the wiring conductor region of the substrate 2 and radiated.

  In addition, the light emitting device 1 of the present invention is configured by arranging a single device in a predetermined arrangement, or a plurality of light emitting devices 1, for example, a lattice shape, a staggered shape, a radial shape, or a plurality of light emitting devices 1. A lighting device can be obtained by installing a group of circular or polygonal light emitting devices in a predetermined arrangement such as a plurality of concentric groups. Thereby, since light emission by electron recombination of the light emitting element 4 made of a semiconductor is used, it is possible to achieve lower power consumption and longer life than a conventional lighting device using discharge, and generate less heat. It can be set as a small illuminating device. As a result, fluctuations in the center wavelength of the light generated from the light emitting element 4 can be suppressed, and light can be irradiated with a stable radiant light intensity and radiant light angle (light distribution) over a long period of time. It can be set as the illuminating device by which the color nonuniformity in the surface and the bias of illuminance distribution were suppressed.

  In addition, the light emitting device 1 of the present invention is installed in a predetermined arrangement as a light source, and a reflection jig, an optical lens, a light diffusing plate, or the like optically designed in an arbitrary shape is installed around the light emitting device 1 It can be set as the illuminating device which can radiate | emit light of arbitrary light distribution.

  For example, a plurality of light emitting devices 1 are arranged in a plurality of rows on the light emitting device driving circuit board 8 as shown in the plan view and the cross-sectional view shown in FIGS. 3 and 4, and are optically designed around the light emitting device 1 in an arbitrary shape. In the case of an illuminating device in which the reflecting jig 7 is installed, in a plurality of light emitting devices 1 arranged on an adjacent row, an arrangement in which the interval between adjacent light emitting devices 1 is not shortest, a so-called staggered pattern It is preferable that That is, when the light-emitting devices 1 are arranged in a grid, the light-emitting devices 1 serving as light sources are arranged on a straight line, so that glare is strong, and such a lighting device enters human vision. Thus, discomfort and eye damage are likely to occur, but by forming a staggered pattern, glare is suppressed and discomfort and damage to the eyes of the human eye can be reduced. Furthermore, since the distance between the adjacent light emitting devices 1 is increased, thermal interference between the adjacent light emitting devices 1 is effectively suppressed, and the heat in the light emitting device driving circuit board 8 on which the light emitting device 1 is mounted is reduced. Clouding is suppressed and heat is efficiently dissipated outside the light emitting device 1. As a result, it is possible to manufacture a long-life lighting device with stable optical characteristics over a long period of time with little obstacles to human eyes.

  Further, the lighting device is a concentric arrangement of a circular or polygonal light-emitting device group of a plurality of light-emitting devices 1 on the light-emitting device drive circuit board 8 as shown in the plan view and the cross-sectional view shown in FIGS. In the case of the illuminating device formed in a plurality of groups, it is preferable to increase the number of the light emitting devices 1 arranged in one circular or polygonal light emitting device 1 group toward the outer peripheral side from the center side of the illuminating device. Thereby, more light-emitting devices 1 can be arranged while keeping the interval between the light-emitting devices 1 moderately, and the illuminance of the illumination device can be further improved. Moreover, the density of the light-emitting device 1 in the center of the lighting device can be lowered to suppress heat accumulation in the center of the light-emitting device drive circuit board 8. Therefore, the temperature distribution in the light emitting device driving circuit board 8 becomes uniform, heat is efficiently transmitted to the external electric circuit board and the heat sink on which the lighting device is installed, and the temperature rise of the light emitting device 1 can be suppressed. As a result, the light emitting device 1 can operate stably over a long period of time, and a long-life lighting device can be manufactured.

  Examples of such lighting devices include general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, display lighting fixtures, street lighting fixtures, used indoors and outdoors. Guide light fixtures and signaling devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency lighting fixtures, flashlights, Examples include electronic bulletin boards and the like, backlights for dimmers, automatic flashers, displays and the like, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, in-vehicle lights, and the like.

  It should be noted that the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention.

It is sectional drawing which shows an example of embodiment of the light-emitting device of this invention. It is sectional drawing in A-A 'of the light-emitting device of FIG. It is a top view which shows an example of embodiment of the illuminating device of this invention. It is sectional drawing of the illuminating device of FIG. It is a top view which shows the other example of embodiment of the illuminating device of this invention. It is sectional drawing of the illuminating device of FIG. It is sectional drawing which shows the conventional light-emitting device. It is sectional drawing which shows the conventional light-emitting device.

Explanation of symbols

1: Light-emitting device 2: Base 2a: Mounting portion 3: Reflecting member 3a: Through-hole 3b: Notch portion 4: Light-emitting element 5: Transparent member 6: Phosphor layer

Claims (3)

A base having a plurality of light emitting element mounting portions arranged in a straight line on the upper surface, and a plurality of through holes attached to the upper surface of the base so as to surround each of the mounting portions. In the light emitting element storage package comprising the reflective member provided, the reflective member has a notch formed on an upper surface thereof from an upper end of the inner surface of the through hole to an upper end of the inner surface of the adjacent through hole. A package for storing light emitting elements. The light emitting element storage package according to claim 1, the light emitting elements respectively mounted on the plurality of mounting portions, and filled with the light emitting elements so as to cover the inside of the plurality of through holes and the notches. A light emitting device comprising: a transparent member continuous through a portion; and a phosphor layer formed to cover the transparent member and wavelength-converting light of the light emitting element. An illumination device, wherein the light emitting device according to claim 2 is installed as a light source.

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