JP2006108193A - Pickup device and pickup method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pickup device that eliminates unnecessary processing as well as wasteful operations, and is useful for speeding up, and to provide a pickup method. <P>SOLUTION: The pickup device comprises a pickup reversing mechanism 2 which is provided with a absorption head 17 on the outer periphery that vertically oscillates to pick up a chip component 6 from a chip component assembly 5, and has a rotation face plate 14 for intermittently rotating to reverse the chip component 6; a testing device 3 for determining the quality of the chip component 6; and a transfer means 4 for transferring the picked up chip component 6 to a next process. The quality determination by the testing device 3 allows the pickup device to pick up only good quality chip components 6. This enables the implementation of a pickup device that has improved working efficiency and is provided for speeding up. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a pickup device that picks up chip components one by one from a chip component assembly such as a carrier tape or a wafer, and transports them to the next process, and more particularly to a pickup device and a pickup method that support high speed.

  Chip-like electronic components such as ICs are formed by forming a plurality of circuits, electrodes, etc. on a semiconductor wafer, and then sticking the wafer to an adhesive film whose outer periphery is reinforced with a ring frame for transportation, and then cutting the chips individually. It becomes a shaped electronic component.

  Accordingly, since the chip-like electronic component (hereinafter referred to as a workpiece) has an electrode on the upper side and is attached to the adhesive film, the subsequent steps are (1) removing the workpiece from the adhesive film (pickup: electrode is up) ( 2) Reversing the work (work reversal: the electrode is down) (3) Loading the work into the transport means (tape, etc.) (taping: the electrode is down) (4) Taking the work out of the transport means and placing it on the printed circuit board (Mount: electrode is down), and finally in (4), “electrode is down” needs to be reversed, and inversion (here, (2)) is necessary. In addition, inspection (for example, appearance) is performed between steps (1) to (4).

Hereinafter, the pickup process (1) will be described in detail.
FIG. 9 is a perspective view showing an example of a conventional pickup device 50 disclosed in Japanese Patent Laid-Open No. 11-261292. In FIG. 9, a plurality of IC chips 52 are assembled on a wafer 51 mounted on a mounting table 56 that can move in the XY directions. After the mounting table 56 is positioned, a pickup mechanism of an IC chip transport unit 57 is arranged. By 58, the IC chips 52 are sucked and separated one by one.

When an empty strip tape-shaped support 55 stored in the storage magazine stocker 53 is sent out onto the rail 59, the pickup mechanism 58 that sucks and holds the IC chip 52 moves onto the strip tape-shaped support 55 and sucks it. After the held IC chip 52 is transferred to the strip tape-shaped support 55, it is moved again onto the wafer 51, and the next IC chip 52 is separated and adsorbed and conveyed onto the strip tape-shaped support 55. ing.
When a predetermined number of IC chips 52 are transferred to the strip tape-shaped support 55, they move on the rail 59 and are stored in the storage magazine stocker 54.
Japanese Patent Laid-Open No. 11-261292

However, in the above pick-up method, since each IC chip 52 must be picked up and transported by reciprocating operation, it takes a lot of time to process all the IC chips 52 and it is difficult to increase the speed. There is a circumstance that it is.
Furthermore, since no inspection means for individual IC chips is provided at the wafer 51 level, even defective IC chips 52 are all transported and transferred, so inferior products are inspected in subsequent processes. Even if this is performed, there is a situation in this process that it takes unnecessary time to transfer and transfer a defective product.

  The external electrodes of the IC chips 52 assembled on the wafer 51 are arranged on the upper surface side, like the external electrodes 6a of the chip component 6 shown in the example of FIG. The external electrode of the IC chip 52 transferred to 55 remains on the upper surface side.

Further, the pickup device 50 includes a post-mounting process, after the inspection of the IC chip 52 taken out from the strip tape-shaped support 55 and the marking of the bad mark or the removal of defective products. The non-defective product is picked up and inverted so that the external electrode is on the lower surface side, then transferred to the mounting suction head, transported to a predetermined position, and mounted.
Therefore, since many processes must be performed before mounting, including the conveyance of the strip tape-shaped support 55, there is a situation in which the mounting work efficiency is reduced.
In recent years, the number of transfer processes has increased along with the miniaturization of chip parts, so that it is required to shorten the processing time and increase the speed.

The technical problem of the present invention has been made in view of the above circumstances, and its purpose is as follows:
An object of the present invention is to provide a pickup device and a pickup method that can eliminate unnecessary processing and useless operations and can cope with high speed.
The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  In order to achieve the object, the invention according to claim 1 is provided with a suction head in the vicinity of the outer peripheral edge, and swings in a vertical direction about a rotating shaft positioned substantially horizontally, and is carried below the suction head. Pickup reversing means provided with a rotating face plate for picking up chip parts from the chip part assembly and rotating the chip parts by intermittent rotation, and pick-up swinging means for swinging the rotating shaft of the rotating face plate in the vertical direction And a conveying means provided above the pick-up position for conveying the inverted chip part to the next process, and an inspection means for inspecting and judging the quality of the chip part. .

  According to this configuration, based on the result of the pass / fail judgment, only the non-defective chip parts are sucked and held and picked up, and are turned upside down by the rotating face plate and delivered to the conveying means. This eliminates the waste of transporting defective chip parts, eliminates the need for many processes such as pass / fail judgment, removal of defective products, and reversal of the front and back in the post-process. Disappears.

According to a second aspect of the present invention, in the first aspect, the pickup reversing unit includes a plurality of the suction heads, and the suction heads are provided so as to protrude on the surface of the rotating face plate and be arranged equally. The suction surface of the suction head is provided so as to face the outer peripheral direction and be equidistant from the rotation center of the rotary face plate.
According to a third aspect of the present invention, in the first or second aspect, when the suction head is at a pickup position or at a supply position for supplying the inverted chip component to the conveying means, the suction head is used as necessary. And a communication hole that can supply negative pressure to the suction head, and communicated with a communication groove that constantly supplies negative pressure when the chip part is reversed from the pickup position to the supply position. Is.

According to a fourth aspect of the present invention, in any one of the first to third aspects, the pickup oscillating means includes a support shaft that is a fulcrum of oscillating and a oscillating mechanism that generates oscillating. The shaft is provided between the pickup inverting means and the swing mechanism.
According to a fifth aspect of the present invention, in any one of the first to third aspects, the pickup rocking means includes a support shaft that is a fulcrum of rocking and a rocking mechanism that generates rocking, A reversing means is provided between the support shaft and the swing mechanism.
According to a sixth aspect of the present invention, in the fourth or fifth aspect, the swing mechanism is a cam mechanism including a cam and a cam follower.

The invention according to a seventh aspect is the invention according to any one of the first to sixth aspects, wherein the transfer means includes a transfer means, a plurality of suction nozzles provided in the transfer means for sucking and transferring the chip components, and the suction nozzle. And a negative pressure supply means for supplying a negative pressure.
The invention according to claim 8 is the invention according to claim 7, wherein the transfer means is a disk-shaped index table that performs intermittent rotation, and the suction nozzle is placed on a plate surface of the index table in the vicinity of the outer periphery of the index table. It is characterized by being provided vertically and equidistantly from the center of rotation.

The invention according to claim 9 is characterized in that, in claim 7 or 8, the suction nozzle is provided so as to be movable up and down with respect to the transfer means.
The invention according to claim 10 is any one of claims 1 to 9, wherein the inspection means is an illumination observation means for irradiating light to the chip component, an imaging means for imaging reflected light of the chip component, and the Chip part determination means, and the illumination observation means is provided near the center of the rotary face plate and in non-contact with the rotary face plate and the suction head, and is scheduled to be picked up near the illumination observation means. The chip component is positioned.

According to an eleventh aspect of the present invention, in the tenth aspect, the illumination observation unit includes a reflection / transmission unit configured to bend the illumination optical axis from the illumination device and guide the light to the chip component. The reflected light is transmitted through the reflection / transmission means and then guided to the imaging means.
The invention according to claim 12 is characterized in that, in claim 11, the reflection / transmission means is a splitter.
The invention according to claim 13 is the invention according to claim 11, wherein the reflection / transmission means is a half mirror.

The invention according to claim 14 is characterized in that, in any one of claims 10 to 13, the inspection means inspects the appearance of the chip part, and the determination means determines the quality of the chip part. It is.
According to a fifteenth aspect of the present invention, in any one of the tenth to thirteenth aspects, the inspection unit detects a displacement of the chip component with respect to a pickup position.
According to a sixteenth aspect of the present invention, there is provided a pickup process for picking up a chip part from a positioned chip part assembly by swinging, a pickup inversion process for inverting the picked-up chip part, and the inverted chip part as a next process. Including a conveying step of conveying and an inspection step of inspecting the chip component, inspecting the chip component at the positioned pickup position by the inspection step, and picking up only the chip component determined to be non-defective It is characterized by.

According to a seventeenth aspect of the present invention, in the sixteenth aspect, a plurality of suction heads are provided on a rotating face plate used in the pickup and pickup reversing step, and the inspection step is performed between two adjacent suction heads in the vicinity of the pickup position. It is characterized by performing from.
According to an eighteenth aspect of the present invention, in the seventeenth aspect, between the two adjacent suction heads means that the suction head at the pickup position is approximately ½ of the distance (pitch) between the two adjacent suction heads. Only the rotating face plate is rotated.
The invention according to claim 19 is characterized in that, in any one of claims 16 to 18, the inspection step inspects the appearance of the chip component after inspecting the position of the chip component and correcting the positional deviation. It is what.

According to the configuration of the present invention, the chip part is positioned at the pick-up position by the appearance inspection means, the quality of the chip part is determined, only the non-defective chip part is picked up and picked up, and is reversed and conveyed by the rotating face plate. Since it is transferred to the means, waste of transferring defective chip parts can be eliminated, and many processes such as pass / fail judgment in the subsequent process, elimination of defective products, reversing the front and back, and the like can be eliminated, and work efficiency can be improved.
In addition, since there is no transfer process by reciprocating operation from the pickup to delivery to the transfer means, a pickup apparatus corresponding to high speed can be obtained.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a front view showing an embodiment of a pickup device 1 of the present invention, FIG. 2 is an enlarged view of a pickup reversing mechanism 2, FIG. 3 is an enlarged view of a chip delivery section, and FIG. 5, FIG. 5 and FIG. 6 are enlarged views of essential parts of FIG. 4, and FIG. 7 is a perspective view showing an example of the chip component 6. In FIG.

In FIG. 1, the pickup device 1 includes a pickup reversing mechanism 2, an inspection device 3, and a conveying means 4.
As shown in FIG. 2, the pickup reversing mechanism 2 is provided with a base 15 fixed to one end of a horizontally provided sleeve 18, and the other end coupled to one end of a swing lever 19. A cam follower 21 composed of an inscribed cam follower 21a and an circumscribed cam follower 21b provided at the other end of the swing lever 19 abuts on a cylindrical eccentric cam 20 that is rotated by a motor 22, and a sleeve having a support shaft 24 as a fulcrum. 18 The tip is swung vertically. A drive shaft (not shown) penetrating the sleeve 18 and the base 15 is connected to the motor 23 at one end and directly connected to the rotary face plate 14 so that the rotary face plate 14 is rotated on the vertical surface of the base 15. It has become.

A plurality of suction heads 17 are provided in the vicinity of the peripheral edge of the rotary face plate 14 and are provided so as to protrude from the rotary face plate 14.The suction face 17a of the suction head 17 faces the outer circumferential direction and from the rotation center of the rotary face plate 14. It is supposed to be equidistant.
The base 15 is provided with a vacuum pipe 16 and communicates with the communication holes 16a and 16c and the communication groove 16b provided in the base 15 as shown in FIG. Pressure is supplied. Although the communication groove 16b is always at a negative pressure, the communication holes 16a and 16c can be independently turned on and off (atmospheric pressure or positive pressure) as necessary by a control device (not shown). .

  As shown in FIGS. 4 and 6, the inspection apparatus 3 includes a plurality of mirrors 29 and a splitter 30 to form an illumination observation apparatus 25 that uses illumination such as coaxial epi-illumination. The rotating face plate 14 is disposed at the approximate center position.

As shown in FIG. 1, the conveying means 4 has a plurality of suction nozzles 9 arranged equally on the peripheral edge of a circular index table 7 that can be indexed and positioned by a drive motor 8 so as to be rotatable in the horizontal direction. As shown in FIG. 3, the suction nozzle 9 and the suction head 17 are disposed so as to face each other. The suction nozzle 9 is slidably provided through the index table 7, is fitted through the connecting plate 10b on the lower surface side of the index table 7, and is inserted and provided on the upper surface side of the index table 7. Thus, the connecting plate 10b is pressed against the lower surface of the index table 7.
A vacuum pipe 9b is connected to the suction nozzle 9 so that a vacuum can be appropriately supplied by suction or release of the chip component 6.

Further, a rod 10 slidably penetrating the index table 7 is screwed into the connecting plate 10b, and is urged upward by a spring 10a inserted on the upper surface side of the index table 7.
At a position where the suction head 17 and the suction nozzle 9 are opposed to each other, a spool 11 that is driven by the motor 12 and can be moved in and out in the vertical direction is provided to face the upper end of the rod 10.

Next, the operation will be described in detail with reference to FIGS.
In the chip part assembly 5 shown in FIGS. 1 to 5, for example, as in the example of the chip part 6 shown in FIG. 7, the electrode 6a is provided on the upper surface, and the lower surface side is attached to a carrier base film or the like. In many cases, the electrode 6a needs to be on the lower surface when mounted by a mounting device. In the pickup device 1 of the present invention shown in FIG. 1, the chip component 6 picked up from the chip component assembly 5 can be transferred upside down and delivered to the next process.

  In FIG. 2, when the eccentric cam 20 is rotated by the motor 22 of the pickup reversing mechanism 2, the swing lever 19 swings in the direction indicated by the arrow as guided by the internal cam follower 20 a and the external cam follower 21 b that sandwich the eccentric cam 20. Then, it is converted into a rotational motion with the support shaft 24 as a fulcrum, whereby the rotary face plate 14 disposed at the tip of the sleeve 18 is swung in the vertical direction.

  The pick-up method when the chip part to be picked up is a non-defective product is as follows. When the rotating face plate 14 is rotated by the motor 23 and the suction head 17 is positioned at a position facing the chip component assembly 5 mounted on the mounting table 13, the eccentric cam 20 is rotated and the suction head 17 is rotated. , And the suction surface 17a comes into contact with the chip component assembly 5. At this time, the chip components 6 are pushed up one by one from the lower surface of the chip component assembly by a separation mechanism such as a not-shown pin, and as the suction head 17 is raised by the next rotation of the return cam 20, the chip component assembly is It becomes easy to peel off from the adhesive film.

  Then, as shown in FIG. 5, when the tip component 6 is sucked and held by the suction head 17 by the negative pressure supplied from the vacuum pipe 16 through the communication hole 16a, the eccentric cam 20 is rotated again. The suction head 17 is raised to move the chip component 6 away from the chip component assembly 5.

Here, an inspection method for chip parts will be described.
When the rotating face plate 14 is turned by 1/2 pitch, the gap between the suction head 17 that holds the chip component 6 by suction and the adjacent suction head 17 becomes the upper surface of the chip component assembly 5. Illumination light emitted from the light guide 26, which is an illumination observation device 25 light source disposed at the approximate center of the rotating face plate 14, is emitted from the gap onto the chip component assembly 5 placed on the placement table 13, The reflected light is guided as the image optical axis 31 and input to the image pickup hand 27, and the image data is transmitted to a control unit (not shown). As a result, the pickup position and pass / fail judgment of the chip component 6 is performed. Yes.

  That is, in the illumination observation device 25, as shown in FIGS. 4 to 6, the illumination light irradiated from the light guide 26 advances along the illumination optical axis 32, is reflected by the splitter 30, and is bent by 90 °, The chip component 6 is irradiated. The image optical axis 31 reflected from the chip component 6 is transmitted through the splitter 30 and guided to the imaging means 27 such as a camera by a plurality of mirrors 29, and the image data is transmitted and processed to a control unit (not shown) to be processed by the chip component 6 The pick-up position and the quality of the appearance such as chipping and peeling are determined.

  Although not shown, the mounting table 13 has a positioning function in the planar direction by XY or rotation with respect to each of the chip components 6 of the mounted chip component assembly 5, and from the chip component assembly 5 Each time the chip component 6 is picked up or determined to be defective, the next chip component 6 is positioned.

  Therefore, if the positioning of the chip component 6 is determined to be defective, the mounting table 13 is not shown, for example, the X and Y positions or the index angle of the table are corrected as in the case of an XY table or a rotary table. If it is determined as defective, the pick-up reversing mechanism 2 does not pick up the chip component 6, but the mounting table 13 operates to position the next chip component 6, and the pass / fail determination is performed again. When it is determined that the position of the chip component 6 is correct and is determined to be a non-defective product, the rotating face plate 14 rotates by 1/2 pitch, and the empty suction head 17 reaches the position of the non-defective chip component 6. The eccentric cam 20 rotates to lower the suction head 17, and the suction surface 17a comes into contact with and holds the chip component 6 in a state where the negative pressure of the communication hole 16a is applied.

  Thereafter, by repeating the above, the chip component 6 is sequentially sucked and held by the suction head 17 (the communication groove 16b is always negative pressure) and conveyed, and the first good chip component 6 sucked and held is the vertical apex of the rotating face plate 14 , The front and back are reversed from the posture of the chip component 6 when it is in the chip component assembly 5. That is, the electrode 6a is the lower surface side and the back surface is the upper surface.

  In FIG. 3, when the chip component 6 is conveyed to the vertical apex by the suction head 17 (the communication hole 16 c is negative pressure), the motor 12 is driven to project the spool 11 and press the rod 10 of the index table 7. The suction nozzle 9 is lowered against the urging force of the springs 9a and 10a. When the suction nozzle 9 comes into contact with the chip component 6, negative pressure is supplied to the suction nozzle 9 from the vacuum pipe 9b, and the chip component 6 is sucked and held by the suction nozzle 9, and at the same time, the suction head 17 is connected to the communication hole 16c. The negative pressure control supplies a positive pressure such as atmospheric release or compressed air to release the chip component 6.

  When the chip component 6 is sucked and held by the suction nozzle 9, the motor 12 is driven again, the spool 11 is pulled in, the springs 9a and 10a are urged, the suction nozzle 9 and the rod 10 are lifted, and the connecting plate 10b is Stops in contact with the lower surface of the index table 7. The chip component 6 sucked and held by the suction nozzle 9 is sequentially transported to the next process (not shown) such as taping on a carrier tape by the index table 7 which is intermittently rotated by one pitch by the drive motor 8 of FIG. It has become.

  Since the pickup reversing mechanism 2 swings in the vertical direction, the level of the suction surface 17a of the suction head 17 when rising and lowering is slightly inclined. For this reason, it is desirable that the suction surface 17a is horizontal both when it comes into contact with the chip component assembly 5 and when the chip component 6 is delivered to the suction nozzle 9, so that the pickup reversing mechanism 2 is lowered. At the position, the pickup of the chip component 6 and the delivery to the suction nozzle 9 are performed with the suction surface 17a being almost horizontal.

FIG. 8 schematically shows another embodiment of the pickup reversing mechanism 40, where (a) is a plan view and (b) is a front view. 1 and 2, the suction head 17 is swung by the cam follower 21 and the eccentric cam 20 of the swing lever 19, whereas the pickup reversing mechanism 40 shown in FIG. The swing lever 42 is extended from the connecting ring 44 fitted to the sleeve 18 to the front side of the sleeve 18 on the opposite side to the axis 41 that is the fulcrum of the sleeve.
The extended rocking lever 42 is rocked in the vertical direction by a rocking mechanism 43 shown by a black box. The rocking mechanism 43 is, for example, a general free-curve cam as in the above embodiment. It is not related to a method such as a method using a cam follower, a method using a pneumatic pressure of a cylinder or the like, an electromagnetic method or a crank mechanism.

  In the other embodiment shown in FIG. 8, the suction head 17 is between the swing mechanism 43 and the support shaft 41, and is more resistant to vibration than the first proposal. In the illumination device 25, the illumination optical axis 32 of the light guide 26 is bent by 90 ° by the splitter 30, but a half mirror may be used instead of the splitter 30. Furthermore, although the inscribed cam follower 21a and the circumscribed cam follower 21b are used in combination as the cam follower 21, the circumscribed cam follower 21b may be pressed against the eccentric cam 20 by an elastic body without using the inscribed cam follower 21a. The cam has been described as the eccentric cam 20, but it may be a free-curve cam that matches the operation.

  As described above, in the present embodiment, the pickup reversing mechanism 2 is provided with a plurality of suction heads 17 arranged in the vicinity of the periphery of the rotary face plate 14 provided so as to be rotatable in the vertical direction. Since the chip component 6 determined as a non-defective product is previously picked up from the chip component assembly 5 by the suction head 17 at the rocking lower limit position, the conventional pick-up of all the products is performed. In addition to shortening the time required, the number of chip parts 6 to be processed can be reduced, and the time for subsequent processes can be shortened.

In addition, the waste of transporting the defective chip component 6 can be eliminated, and many processes such as pass / fail judgment in the subsequent process, elimination of defective products, and front / back reversal are not required, thereby improving work efficiency.
Furthermore, since there is no transfer process by reciprocating operation from pick-up to delivery to the transfer means 4, work speed can be increased.

It is a front view which shows one Example of the pick-up apparatus of this invention. It is an enlarged view of the pick-up reversing mechanism of FIG. It is an enlarged view of a chip delivery part. It is a partial cross-sectional enlarged view of an appearance inspection apparatus. FIG. 5 is an enlarged side view of FIG. 4. It is a principal part enlarged view of FIG. It is a perspective view which shows an example of a chip component. FIG. 6 schematically shows another embodiment of the pickup reversing mechanism, where (a) is a plan view and (b) is a front view. It is a perspective view of the pick-up apparatus in a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Pickup apparatus 2 Pickup reversal mechanism 3 Inspection apparatus 4 Conveying means 5 Chip component aggregate 6 Chip parts 6a Electrode 7 Index table 8 Drive motor 9 Adsorption nozzle 9a, 10a Spring 9b Vacuum piping 10 Rod 10b Connecting plate 11 Spool
12 Motor 13 Mounting table 14 Rotating face plate 15 Base 16 Vacuum piping 16a, 16c Communication hole 16b Communication groove 17 Adsorption head 17a Adsorption surface 17b Adsorption hole 18 Sleeve 19, 42 Oscillating lever 20 Eccentric cam 21 Cam follower 21a Internal cam follower 21b External cam follower 21b 22, 23 Motor 24 Support shaft 25 Illumination observation device 26 Light guide 27 Imaging means 28 Lens barrel 29 Mirror 30 Splitter 31 Image optical axis 32 Illumination optical axis 40 Pickup reversing mechanism 41 Support shaft 43 Oscillating mechanism 44 Connecting ring

Claims (19)

  A suction head is provided in the vicinity of the outer peripheral edge, and a rotary shaft positioned substantially horizontally is swung vertically to pick up a chip component from a chip component assembly carried under the suction head and rotate intermittently. Pickup reversing means having a rotating face plate for reversing the chip part, picking up swinging means for swinging the rotating shaft of the rotating face plate in the vertical direction, and the inverted chip provided above the pickup position 2. A pickup apparatus comprising: a conveying unit that conveys a component to a next process; and an inspection unit that inspects and determines the quality of the chip component.   The pick-up reversing means has a plurality of the suction heads, and these suction heads are provided so as to protrude and be equally arranged on the surface of the rotating face plate, and the suction surfaces of the suction heads face the outer circumferential direction and The pickup device according to claim 1, wherein the pickup device is provided so as to be equidistant from the rotation center of the rotating face plate.   When the suction head is at the pickup position or at the supply position for supplying the inverted chip component to the conveying means, the suction head communicates with a communication hole that can supply negative pressure to the suction head as necessary. The pickup device according to claim 1, wherein the chip component communicates with a communication groove that constantly supplies a negative pressure when the chip part is reversed from the pickup position to the supply position.   The pickup swinging means has a support shaft that is a support point of swinging and a swinging mechanism that generates swinging, and the support shaft is provided between the pickup reversing means and the swinging mechanism. The pickup device according to any one of claims 1 to 3, wherein   The pickup oscillating means has a support shaft that is a fulcrum of swing and a swing mechanism that generates swing, and the pickup reversing means is provided between the support shaft and the swing mechanism. The pickup device according to claim 1, wherein   6. The pickup device according to claim 4, wherein the swing mechanism is a cam mechanism including a cam and a cam follower.   The transport means includes a transport means, a plurality of suction nozzles provided on the transport means for sucking and transporting the chip components, and a negative pressure supply means for supplying a negative pressure to the suction nozzle. The pickup device according to claim 1.   The transfer means is a disk-shaped index table that performs intermittent rotation, and the suction nozzles are provided in the vicinity of the outer periphery of the index table so as to be perpendicular to the plate surface of the index table and equidistant from the center of rotation. The pickup device according to claim 7, wherein the pickup device is provided.   9. The pickup device according to claim 7, wherein the suction nozzle is provided so as to be movable up and down with respect to the transfer means.   The inspection means includes illumination observation means for irradiating light to the chip component, imaging means for imaging reflected light of the chip component, and determination means for the chip component, and the illumination observation means includes the rotating face plate 10. The chip component to be picked up is positioned in the vicinity of the center of the head and in a non-contact manner with the rotating face plate and the suction head, and near the illumination observation means. The pickup device according to any one of the above.   The illumination observation means has reflection / transmission means for bending the illumination optical axis from the illumination device and guiding the light to the chip component, and after allowing the reflected light from the chip component to pass through the reflection / transmission means, The pickup apparatus according to claim 10, wherein light is guided to the imaging unit.   The pickup apparatus according to claim 11, wherein the reflection / transmission means is a splitter.   The pickup apparatus according to claim 11, wherein the reflection / transmission means is a half mirror.   The pickup device according to claim 10, wherein the inspection unit inspects the appearance of the chip component, and the determination unit determines whether the chip component is good or bad.   The pickup device according to claim 10, wherein the inspection unit detects a displacement of the chip component with respect to a pickup position.   Pickup process for picking up chip parts from a positioned chip part assembly by swinging, pickup reversing process for reversing the picked-up chip parts, transporting process for transporting the reversed chip parts to the next process, and the chip A pick-up method comprising: inspecting a chip part at the positioned pick-up position, and picking up only the chip part determined to be non-defective.   The rotary face plate used in the pickup and pickup reversing step is provided with a plurality of suction heads, and the inspection step is performed between two adjacent suction heads in the vicinity of the pickup position. Pickup method.   The term “between two adjacent suction heads” means that the rotary face plate is rotated by approximately ½ of the distance (pitch) between the two adjacent suction heads at the pickup position. The pickup method according to claim 17, wherein the pickup method is characterized in that: 19. The pick-up method according to claim 16, wherein the inspection step inspects the appearance of the chip component after inspecting the position of the chip component and correcting a positional shift.

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