CN116364637B

CN116364637B - Chip sorting and placing manipulator and chip sorting and placing method

Info

Publication number: CN116364637B
Application number: CN202310649533.1A
Authority: CN
Inventors: 赵臣龙; 霍风祥; 张超
Original assignee: Lima Optoelectronic Technology Beijing Co ltd
Current assignee: Lima Optoelectronic Technology Beijing Co ltd
Priority date: 2023-06-02
Filing date: 2023-06-02
Publication date: 2023-07-25
Anticipated expiration: 2043-06-02
Also published as: CN116364637A

Abstract

The invention discloses a chip arranging and placing manipulator and a chip arranging and placing method. The manipulator includes: a housing (4); a movement frame (64) provided so as to be movable in the Z direction with respect to the housing (4); a first suction pen (1) which can move between an extending position and a retracting position along the Z direction under the drive of a moving frame (64), wherein a suction nozzle of the first suction pen can rotate around the self axis; the second suction pen (2) is arranged to be capable of overturning between an initial position and an overturning position, the extending direction of the second suction pen (2) is parallel to the extending direction of the first suction pen (1) in the initial position, the extending direction of the second suction pen (2) is collinear with the extending direction of the first suction pen (1) in the overturning position, and the second suction nozzle and the first suction nozzle are respectively positioned on two opposite sides of a sucked chip. The chip arranging and placing manipulator and the method can realize efficient arranging and placing of chips.

Description

Chip sorting and placing manipulator and chip sorting and placing method

Technical Field

The invention relates to the technical field of chip robots or chip manipulators, in particular to a chip sorting and placing manipulator and a chip sorting and placing method.

Background

In the existing chip gripping robot or chip transferring robot, the chip gripping robot or the chip transferring robot is generally installed on a highly automated production line for gripping or transferring chips. Under the application scene such as chip secondary screening, the chip that needs to snatch or transmit is various, and single batch quantity is somewhat different, in whole experimental procedure, the general place of chip is in the tray and is had enough to meet the need, and the position and the positive and negative of chip can be in disorder this moment, and adopts the manual test mode usually, consequently is difficult to use current chip to snatch manipulator or chip transmission manipulator. At present, under the application scene, the chips are manually adjusted to be in a uniform direction one by one, and the efficiency is low.

Disclosure of Invention

The invention aims to provide a chip arranging and placing manipulator and a chip arranging and placing method for realizing efficient arrangement and placement of chips.

In order to achieve the above object, the present invention provides a chip sorting and placing manipulator, including: a housing having a grip or connection provided thereon, wherein the grip is for being held by a user; the connecting part is used for being connected with the driving unit so as to drive the shell to move between the chip taking position and the chip placing position; a moving frame provided so as to be movable in a Z direction with respect to the housing; the first suction pen is provided with a first suction nozzle and is used for sucking the chip, the first suction pen can move between an extending position and a retracting position along the Z direction under the drive of the moving frame, the first suction nozzle is positioned outside the shell in the extending position, and the first suction nozzle and/or the sucked chip thereof is positioned inside the shell in the retracting position; the first suction nozzle can rotate around the axis of the first suction nozzle so as to adjust the angle position of the sucked chip; and the second suction pen is provided with a second suction nozzle for sucking the chip, the second suction pen is arranged to be capable of overturning between an initial position and a turnover position, the extension direction of the second suction pen is parallel to the extension direction of the first suction pen in the initial position, the extension direction of the second suction pen is collinear with the extension direction of the first suction pen in the turnover position, and the second suction nozzle and the first suction nozzle are respectively positioned on two opposite sides of the sucked chip.

Preferably, a rack is fixedly mounted on the shell, and extends along the Z direction; the motion frame is provided with a gear and a first driving motor, the gear is matched with the rack, the first driving motor is used for driving the gear to realize Z-direction motion of the motion frame relative to the shell, and the first suction pen is installed on the motion frame and moves along with the motion frame in the Z direction.

Preferably, two driven wheels are arranged on the motion frame and are in rolling contact with one side of the rack, which is away from the toothed structure, so that the toothed structure of the rack is kept meshed with the gear, wherein the Z-direction height of one driven wheel is higher than that of the gear; the Z-directional height of the other driven wheel is lower than that of the gear.

Preferably, the moving frame includes: the first mounting plate comprises two mutually parallel vertical plates and a connecting plate for connecting the two vertical plates; the second mounting plate is in a flat plate shape; the first mounting plate and the second mounting plate are connected with each other to form a rectangular frame extending vertically,

the gear and the two driven wheels are arranged in an inner space defined by the rectangular frame, and the first driving motor is arranged on the outer side of one vertical plate;

The chip arranging and placing manipulator also comprises a position detection module for detecting the Z-direction movement position of the movement frame and/or the overturning movement of the second suction pen,

a first sensing protrusion is arranged on the first mounting plate and is matched with a first photoelectric switch of the position detection module to detect the retraction position of the first suction pen, wherein the first photoelectric switch is fixedly mounted relative to the shell;

the inside of shell is provided with the second and responds to the arch, the second is responded to protruding and the second photoelectric switch of position detection module mutually support to detect the position that stretches out of first suction pen, the second photoelectric switch sets up the outside of moving the frame, wherein, the bellied quantity of second is a plurality of, and evenly arranges in Z.

Preferably, the chip sorting and placing manipulator further comprises a roll-over stand, the roll-over stand is arranged at the lower part of the rack and can rotate relative to the rack, the second suction pen is arranged on the roll-over stand so as to turn over between an initial position and a roll-over position along with the second suction pen,

the turnover frame is provided with third sensing protrusions, the number of the third sensing protrusions is multiple, the third sensing protrusions are circumferentially and evenly arranged, a circumferential included angle between the initial third sensing protrusions and the end third sensing protrusions is 180 degrees, the initial third sensing protrusions correspond to the initial positions of the second suction pens, and the end third sensing protrusions correspond to the turnover positions of the second suction pens.

Preferably, the chip sorting and placing manipulator further comprises a camera module, wherein the camera module is used for identifying the front and back directions and the rotation angles of the chips sucked by the first suction pen, the camera module is arranged on the roll-over stand, and when the roll-over stand is in a roll-over position for driving the second suction pen to roll over, the camera module identifies the front and back directions and the angle positions of the chips sucked by the first suction pen.

Preferably, the chip sorting and placing manipulator includes a cleaning module, an outlet of which is aligned with the chip sucked by the first suction pen in the retracted position to blow air onto the chip through the outlet of the cleaning module, and clean the surface of the chip, wherein the outlet of the cleaning module is higher than the chip in the cleaning state, and one side of the housing is opposite to the outlet and is opened at a lower portion so that the air is discharged out of the housing.

Preferably, the driving unit drives the housing to move in an X direction and/or a Y direction, wherein the X direction and the Y direction are perpendicular to each other and are perpendicular to the Z direction, and the housing is driven by the driving unit to move only in a plane defined by the X direction and the Y direction.

The invention also provides a chip arranging and placing method, which adopts the chip arranging and placing manipulator to arrange and place chips, and comprises the following steps:

step 1, enabling a chip arranging and placing manipulator to be in an initial state, wherein a first suction pen is in a retracted position, and a second suction pen is in an initial position which is not turned over;

step 2, enabling the first suction pen to extend out of the shell, moving the first suction pen to a chip to be sucked, and sucking the chip to be sucked by the first suction pen;

step 3, enabling the first suction pen to retract to a retracted position along the Z direction along with the chip;

step 4, enabling the second suction pen to turn over from the initial position to the turning-over position; the angular position and/or the front-back orientation of the chip is identified by the camera module,

if the chip has angular position deviation, enabling the first suction pen to rotate so as to eliminate the angular position deviation;

if the front and back directions of the chip do not need to be adjusted, turning to the step 5; if the front and back faces of the chip are required to be adjusted, the second suction pen is used for sucking the lower side of the chip; and turning to the step 6;

step 5, the second suction pen is turned to an initial position, and the first suction pen discharges the chip to a placement position;

And 6, releasing the chip by the first suction pen, turning the chip to an initial position by the second suction pen, and releasing the chip to a placement position by the second suction pen.

Preferably, in step 4, the first suction pen and the second suction pen are made to apply suction to the chip at the same time, and dry air is blown out to clean the surface of the chip.

The chip arranging and placing manipulator and the method can realize efficient arranging and placing of chips.

Drawings

Fig. 1 is a schematic diagram illustrating a use of a chip sorting and placement robot according to an embodiment of the invention. The manipulator is used for efficiently placing chips in the right tray into the left tray.

Fig. 2 is a schematic view of a housing of the chip sort and placement robot shown in fig. 1.

Fig. 3 is a schematic view illustrating an internal structure of a chip sorting and placing robot according to an embodiment of the present invention, and in fig. 1, a housing is removed to more clearly show the internal structure.

Fig. 4 is a side view of the internal structure of fig. 2.

Fig. 5 is a schematic cross-sectional view taken along section line A-A in fig. 4.

Fig. 6 is a front view schematically showing the internal structure shown in fig. 4.

FIG. 7 is a schematic cross-sectional view taken along section line B-B in FIG. 6.

Fig. 8 is a rear view of a robot arm showing a housing according to an embodiment of the present invention.

Fig. 9 is a schematic cross-sectional view taken along line C-C in fig. 8.

Fig. 10 is a schematic view of a manipulator in an initial state according to an embodiment of the present invention.

Fig. 11 is a schematic view of a manipulator according to an embodiment of the present invention in a state that one chip is sucked by a first suction pen.

Fig. 12 is a schematic cross-sectional view of a manipulator in a first suction pen retracted state according to an embodiment of the present invention.

Fig. 13 is a schematic cross-sectional view of a manipulator in a second suction pen flipped state according to an embodiment of the present invention.

Fig. 14 is a schematic diagram showing the relative positions of the dry air outlet of the cleaning module and the chip.

Fig. 15 is a schematic view of the first mounting plate of the motion frame.

Fig. 16 is a schematic view of a roll-over stand.

1. First suction pen 2 second suction pen 3 camera module 4 housing 5 cleaning module

6. The position detection module 8 of the gear rack structure 7 is provided with a turnover frame 9, a chip 11 first suction head 21, a second suction head 41, a gripper 42, an air outlet 52, an air channel 61 with an opening 51 at the lower part of a connecting part 43, a rack 62, a gear 63, a fixed bolt 64, a first driving motor 66 of the rack 65, a driven wheel 71, a first photoelectric switch 72, a second photoelectric switch 73, a third photoelectric switch 401, a second sensing protrusion 641, a first sensing protrusion 642, a first mounting plate 643, a second mounting plate 801, a third sensing protrusion 802 and a second driving motor

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings and examples.

The chip arranging and placing manipulator provided by the embodiment of the invention can be applied to chip arranging in the process of testing chips in a laboratory or used in the chip two-sieve industry. The specific chip size can be a chip with the length and width within 30X30 mm. According to the chip arranging and placing manipulator disclosed by the embodiment of the invention, the chips can be placed rapidly, and basic conditions can be provided for the follow-up process steps by adopting an automatic test scheme.

As shown in fig. 1, the chip sorting and placing manipulator according to the embodiment of the invention can be used for helping to efficiently and neatly arrange the randomly placed chips in the right tray into the left tray. One specific application scenario is chip secondary screening. In an alternative embodiment, the chip sorting and placing manipulator has a built-in control unit, and the control unit controls the cooperative action of the parts. In another alternative embodiment, the chip sorting and placing manipulator can also be set to communicate with a remote host computer, and work is performed under the control of the host computer.

As shown in fig. 1 to 3, a chip sorting and placing manipulator according to an embodiment of the present invention includes: a housing 4 and a motion frame 64.

Referring to fig. 1, a connection portion 42 is provided on the housing 4 for connection with a drive unit (not shown) to drive the housing 4 between a chip taking position (e.g., at the right tray in fig. 1) and a chip placing position (e.g., at the left tray in fig. 1). The driving unit can be a part of the chip arranging and placing manipulator of the invention, and can also be arranged outside the chip arranging and placing manipulator of the invention. In other words, a plurality of mounting holes may be provided on the housing 4 in order to facilitate mounting to the automation apparatus.

For example, the driving unit, not shown, drives the housing 4 to move in the X-direction and/or the Y-direction, wherein the X-direction and the Y-direction are perpendicular to each other and are perpendicular to the Z-direction. The Z-direction is generally the up-down direction in fig. 1, or vertical direction, more specifically, may be defined as the longitudinal extension direction of the rack hereinafter. The housing moves only in a plane defined by the X-direction and the Y-direction under the driving of the driving unit. Thus, the driving unit can be simplified.

Referring to fig. 11, for convenience of hand holding, a grip 41 is provided on the housing 4. The shape of the grip may be set as desired, and is not limited to the illustrated shape. That is, the grip 41 is for being held by a user to manually move the housing and the entire robot.

A movement frame 64 (see fig. 3) is provided so as to be movable in the Z direction with respect to the housing 4. The Z direction is the up-down direction in fig. 3. Typically, but not limited to, a vertical direction. The Z-direction is, for example, in particular the longitudinal extension of the rack in fig. 3. As shown in fig. 1 to 3, the chip sorting and placing manipulator according to the embodiment of the invention further includes: a first suction pen 1 and a second suction pen 2. The first suction pen 1 and the second suction pen 2 may take any suitable structure and form. The first suction pen 1 and the second suction pen 2 may for example be used to suck chips, in particular chips 9 optionally placed in an epicyclic tray, in any suitable way, such as vacuum suction, or even magnetic suction. The chip 9 may be, for example, a chip having a length and width of 30X30mm or less, but may be any other chip having a different size.

The first suction pen 1 and the second suction pen 2 are both provided to have a suction state and a discharge state, and are capable of switching between the suction state and the discharge state as needed. In the suction state, the suction pen sucks and holds the chips, especially the individual chips, in the vicinity of its suction nozzle. Specifically, suction is generated at the suction nozzle. Typically, the dimensions of the suction nozzle are designed to be smaller than the top-view projected area of the chip, e.g. the dimensions of the suction nozzle are only 10% of the top-view projected area of the chip. In the payout state, the suction force is interrupted, so that the sucked chip can be detached or separated from the suction nozzle by its own weight or other force.

The suction heads and the suction nozzles of the first suction pen 1 and the second suction pen 2 can be in replaceable forms so as to facilitate maintenance and adapt to different chip specifications. Thus, the manipulator of the embodiment of the invention can process various packaged chips by replacing the suction nozzles (for example, replacing suction nozzles with different sizes and adapting to different suction forces), and is not limited to the SOP8 packaged chips. The suction nozzle, the corresponding suction control mode and the like can adopt the prior art and new technology developed in future, which are not innovation points of the invention and are not repeated in the invention.

The rear end of the suction pen can be connected with a vacuum air source to provide suction force to suck the chip. It is noted that the suction force is controlled, for example by means of a solenoid valve.

The first stylus may be referred to as a telescopic stylus. Referring to fig. 3, the first suction pen 1 is provided with a first suction head 11, and a first suction nozzle is provided at the first suction head 11 for sucking the chip 9. The first suction head 11 is arranged to be movable in a telescopic direction (i.e. up-down direction in fig. 3, Z-direction) between an extended position and a retracted position, in particular, in the Z-direction, under the drive of the moving frame 64. The mechanism for effecting the telescopic movement may be any suitable mechanism. For example, a linear drive motor, a crank block mechanism, or the like may be used. In the illustrated embodiment, a rack and pinion arrangement 6 is used, the gear 61 of the rack and pinion arrangement 6 being driven by a first drive motor 65.

In the extended position, the first suction nozzle is located outside the housing 4, and in the retracted position, the first suction nozzle and/or the chip it suctions is located inside the housing 4.

In order to be able to adjust the angular position of the sucked chips 9 so that the finally placed chips all have the same angular position, the first suction head 11 is arranged to be able to spin about its own axis in order to adjust the angular position of the sucked chips 9. The first suction head 11 is driven to rotate by a second drive motor (not shown). The second drive motor is for example a stepper motor to achieve a precise adjustment of the angular position of the chip 9. The stepper motor may be integrated in the first suction pen 1, determining the rotation of the first suction head 11 about its own axis in accordance with control instructions. For example, a difference between the current angular position and the target angular position is used as a control input, and the difference is known to be zero or smaller than a set threshold value. The threshold is small, for example, a suitable value of 1 degree, 3 degrees, 5 degrees, or the like. The rotation axis of the first suction head is parallel to the telescoping direction or collinear therewith.

The second stylus may be referred to as a flip stylus. The second suction pen 2 is provided with a second suction nozzle, and the second suction nozzle is arranged at the second suction nozzle and is used for sucking the chip 9; the second suction head is arranged to be capable of tipping movement between a first position (initial position) and a second position (tipped position).

In the first position (initial position), the extension direction of the second tip is parallel to the extension direction of the first tip, and the second tip is spaced apart from the first tip. That is, in the present invention, the direction of extension of the second tip is parallel to the direction of extension of the first tip, excluding collineation. In said first position, the second suction head extends downwards, the second suction nozzle is directed downwards, and the camera module 3 is also directed downwards.

It should be noted that the extending direction of the suction head or the suction pen is the longitudinal extending direction of the suction pen. Typically, the direction of extension of the suction pen, i.e. the orientation of the suction nozzle.

In the second position (inverted position), the direction of extension of the second tip is collinear (including substantially collinear) with the direction of extension of the first tip, and the two are oppositely directed. Substantially collinear means that the distance between the two is small, e.g. less than 3mm. In said second position, the second suction head extends upwards and the camera module 3 is also facing upwards. In the second position, the second suction nozzle of the second suction pen and the first suction nozzle of the first suction pen are respectively positioned at two opposite sides of the sucked chip. More specifically, the second suction nozzle is located on the lower side; the first suction nozzle is positioned at the upper side. If desired, the chip sucked by the first suction nozzle of the first suction pen may be adjusted to be sucked by the second suction nozzle of the second suction pen. That is, the suction force of the first suction pen is cut off, and only the suction force of the second suction pen is maintained.

It should be noted that the turning axis of the second suction pen is perpendicular to the extending direction of the first suction pen. For example, the first suction pen extends up and down, while the flip axis of the second suction pen is disposed horizontally.

Still referring to fig. 3, the chip sorting and placing manipulator includes a camera module 3, and the camera module 3 is used for identifying the front and back directions and the rotation angles of the chips 9 sucked by the first suction pen 1. The camera module 3 may be of any suitable construction and imaging, for example a CCD camera.

Specifically, the front-back orientation is determined according to the content of the front-back printing of the chip 9; or on the direction of extension of the pin of the chip 9 or on the shape characteristics of the front and back sides.

For reference, the front and back sides can be distinguished in the following manner: the front surface of the chip is generally flat and smooth; (2) The front side is generally provided with printed characters, and information (the back side is not provided) for representing the type, manufacturer, batch number and the like of the chip; (3) The front surface is generally provided with a positioning point, which is usually a small dot; (4) SOIC, QFP packaged chip, there are pins on the side, the pin bends to the back; (5) QFN chip, there is the chip pad on the back.

The camera module 3 has a photographing unit that can take a picture of the chip 9. In order to compare the photographed picture with a pre-stored image (front and back pictures, etc.), a storage unit, a data processing unit, etc. are also required to be provided accordingly. The storage unit and the data processing unit may be integrated into the camera module 3, or may be provided in a control module (not shown) independent of the camera module 3. The control module can be a controller of the whole chip arranging and placing manipulator or a controller arranged in the upper computer.

The front and back sides of the chip 9 can be set as needed. For example, one side adjacent to the pin foot end may be defined as the back side and the opposite side as the front side. Of course, the opposite definition is also possible.

The timing of shooting the chip 9 by the camera module 3 may be when or before the first suction pen 1 starts to suck the chip; it may also be after the first suction pen 1 sucks the chip 9 and rotates and/or retracts. Advantageously, after the first suction pen 1 sucks the chip 9 and rotates and/or retracts, the camera module 3 photographs the chip 9. In one embodiment, the chip is photographed in both of the foregoing stages. Thus, there is an initial determination of the orientation and rotation angle of the chip before the chip suction is started. After rotation, the orientation and rotation angle of the chip were checked and reconfirmed.

In order to accurately determine the position of the first suction head in the up-down direction, the chip sorting and placing manipulator comprises: a position detection module 7 which detects the position of the first suction head. The position detection module 7 may adopt any suitable detection mode, for example, a micro switch, a magnetic switch, etc. may be adopted. In one embodiment, the position detection module 7 employs a photoelectric switch. The photoelectric switch can identify whether an object exists at the designated position of the sensor and output a switch signal. For example, if an object blocks the optical path of the photoelectric switch, a low level is output (it can be determined that the photoelectric switch is located at a specific position), and if no object blocks the optical path of the photoelectric switch, a high level is output (it can be determined that the photoelectric switch is not located at a specific position). Such a function of the photoelectric switch can also be realized by the encoder, but the encoder has larger volume, higher cost and higher precision. The embodiment of the invention can meet the use requirement by adopting the simple positioning mode.

More specifically, the position detection module 7 includes a first photoelectric switch 71. The first photoelectric switch 71 is fixedly provided with respect to the housing 4. The first sensing protrusion 641 is provided on the moving frame 64. The first sensing boss 641 moves up and down along with the moving frame 64. When the carriage 64 is moved to the uppermost position, the first cleaner head is also moved to the uppermost position. At this time, the first sensing boss 641 interrupts the optical path of the first photoelectric switch 71, and signals that the highest position has been reached (i.e., the first suction head is in the retracted position). For subsequent corresponding processing.

The position detection module 7 further includes a second photoelectric switch 72 and a third photoelectric switch 73. The second photoelectric switch 72 detects the lowermost position of the moving frame 64. More specifically, the second photoelectric switch 72 detects the distance of downward movement of the moving frame 64 from the uppermost position. Referring to fig. 9, a second sensing protrusion 401 is provided on the housing 4. The second sensing protrusion 401 cooperates with the second photo switch 72 to detect the lowermost position of the moving frame 64 or the distance moved downward from the uppermost position. Specifically, the number of the second sensing protrusions 401 is plural and is uniformly spaced apart in the up-down direction. The distance that the moving frame 64 moves downward from the uppermost position is determined by the number of second sensing protrusions 401 passing by (which may be, in particular, the number of square waves according to the corresponding output waveform of the second photoelectric switch 72) moving downward from the uppermost position. At each power-up, the first suction pen 1 is reset to the uppermost position (retracted position), and whether the first suction pen 1 is at the uppermost position (retracted position) is recognized by the first photoelectric switch 71.

That is, when the moving frame 64 moves up and down, the second photoelectric switch 72 outputs continuous square wave signals, and based on the number of square waves of the square wave signals, the distance of the moving frame 64 moving downward relative to the housing 4 (the distance corresponding to each square wave multiplied by the number of square waves) can be determined, thereby determining the extending distance of the first pen.

The third photoelectric switch 73 is used for detecting the position of the second suction head rotation. That is, the third photoelectric switch 73 is used to detect whether the second suction head is in the initial position or in the flipped position.

The third photoelectric switch 73 is fixedly mounted to the housing 4, or, in other words, the third photoelectric switch 73 is fixedly disposed with respect to the housing 4 or the rack 61. The third photoelectric switch 73 cooperates with a third sensing protrusion 801 on the roll-over stand 8 (see fig. 16) to determine the rotational position of the roll-over stand 8, and thus the rotational position (initial position and roll-over position) of the second suction pen 2. The number of the third sensing protrusions 801 may be set to be plural and uniformly distributed in the circumferential direction. In the illustrated embodiment, three third sensing protrusions 801 are provided, wherein two third sensing protrusions 801 are circumferentially spaced apart from each other by 180 degrees, one of which corresponds to the initial position of the second suction pen 2 (i.e., the first third sensing protrusion) and the other of which corresponds to the flipped position of the second suction pen 2 (i.e., the second sensing protrusion). The third sensing protrusion 801 is located between the aforementioned two third sensing protrusions 801 and is spaced apart from the aforementioned two third sensing protrusions 801 in the circumferential direction. On one hand, the initial position and the overturning position are accurately positioned; on the other hand, the normal operation of the overturning action is detected and confirmed in the overturning process.

In the illustrated embodiment, the roll-over stand 8 is installed at a lower portion of the rack 61 to be capable of being rotated forward or backward by 180 degrees with respect to the rack 61 to effect the roll-over of the second suction pen 2. In other words, the second suction pen 2 is provided on the roll-over stand 8 to follow the roll-over movement between the initial position and the roll-over position.

Because the rack 61 is fixed relative to the housing 4, the roll-over stand 8 can also be mounted on the housing 4. Accordingly, the third photoelectric switch 73 may also be mounted on the rack.

Under the condition that the first suction head is in a retracted position, the first suction head sucks the chip, and the chip faces to a reverse position, the second suction head is enabled to be overturned to a turning position, and the chip sucked by the first suction head is sucked. At this point, the first suction head no longer applies suction to the chip. Therefore, when the second suction head reversely overturns to the initial position, the forward and reverse directions of the chip are switched. It should be noted that "in the case where the chip orientation is in the reverse position" herein means that the chip forward direction orientation needs to be adjusted, that is, the flip operation needs to be performed on the chip.

As shown in fig. 3, the chip sorting and placing manipulator includes a cleaning module 5 for cleaning chips. The cleaning module 5 has a source of air (not shown) capable of delivering dry air or is in communication with an external source of air. As shown in fig. 5, air from the air source is delivered through an air passage 52 and onto the chip through an outlet (i.e., air outlet 51 in fig. 5) to clean the chip surface, such as to clean the chip surface of dust or to blow water droplets off the chip surface.

The outlet of the cleaning module 5 is aligned with the chip sucked by the first suction nozzle of the first suction nozzle in the retracted position, that is to say the direction of extension of the end section of the air channel 52 is substantially aligned with the chip. The dry air is blown onto the chip through the outlet of the cleaning module 5, so that the function of cleaning dust on the surface of the chip is realized. It should be noted that the outlet of the cleaning module 5 is aligned with the chip, meaning that the air jet direction of the air outlet 51 is aligned with the chip, and does not necessarily mean that the outlet of the cleaning module 5 is at the same height as the chip. Advantageously, the chip is rotated through its entire circumference (e.g., the first and second suction pens both suck the chip and simultaneously rotate the chip) while cleaning the chip to achieve better cleaning.

Because the chip may condense water vapor during various experiments, such as low temperature experiments, or may have dust on the surface of the chip during long storage, the chip may cause abnormal testing or stain the fixture if it is put into the test fixture with the impurities, resulting in the fixture not being able to be used continuously. The problem can be solved well by blowing dry air to clean the chip surface.

As shown in fig. 5 and 14 and 13, the air outlet 51 of the cleaning module 5 is higher than the chip in the cleaning state, and one side of the housing 4 is opposite to the outlet and is opened at the lower portion (i.e., the side is provided with a lower opening 43, the lower opening 43 is clearly shown in fig. 2) so that the air is discharged out of the housing 4. That is, the air outlet 51, the chip in a clean state, is substantially in line with the lower opening 43 of the housing 4.

It should be noted that the chip in the clean state refers to a chip in a state of being sucked by the first suction pen and the second suction pen at the same time.

The specific structure for realizing up-and-down motion in the chip sorting and placing manipulator is described in detail below: a rack and pinion arrangement 6. As shown in fig. 3 to 9, the rack-and-pinion structure 6 includes a rack 61, a pinion 62, and a first drive motor 65.

The rack 61 is fixedly mounted to the housing 4 and extends in the rack longitudinal direction (up-down direction in fig. 3). Specifically, the rack 1 is left with screw mounting holes, and is mounted to the housing 4 by screws.

The gear 62 is mounted to the moving frame 64 and cooperates with the rack gear 61 to drive the moving frame 64 to move longitudinally along the rack gear (up and down in the drawing). That is, the up-and-down movement is achieved by the cooperation of the rack 61 and the gear 62. In essence, the gear 62 moves up and down relative to the housing 4. More specifically, the gear 62 is mounted on the output shaft of the first drive motor 65. A first drive motor 65 is mounted on the motion frame 64.

The first driving motor 65 is used for driving the gear 62 to rotate. The first drive motor 65 employs a gear motor so as to be relatively slowly movable to provide accuracy of position control.

Wherein the first suction head is fixedly mounted on the moving frame 64, and moves longitudinally along the rack along with the moving frame 64 to perform telescopic movement.

Referring to fig. 5, the chip sorting and placing manipulator includes: two driven wheels 66, which driven wheels 66 are mounted on the movement frame 64 and rollingly bear against the side of the toothed rack 61 facing away from the toothed structure, so that the toothed structure of the toothed rack 61 remains engaged with the gear 62. The driven wheel 66 is mounted to the moving frame 64 by a fixing bolt 63. The fixing bolt 63 simultaneously serves as a support shaft for the driven wheel 66, and the driven wheel 66 is sleeved on the support shaft and rotates around the support shaft. Further, a rolling bearing may be provided between the driven wheel and the support shaft.

The manipulator of the embodiment of the invention can be held by hand or can be installed on automatic equipment for use. For mounting to automation equipment for use, the chip sorting and placement robot includes a drive unit. The driving unit is used for driving the shell 4 to do X-direction movement and Y-direction movement. Wherein the X direction and the Y direction are mutually perpendicular and are both perpendicular to the Z direction or the longitudinal direction of the rack. Thereby eventually arranging the plurality of scrambled chips in the tray into a neat chip array: the orientation is the same, and each adjacent chip has the same row spacing and column spacing. Furthermore, the chips in the chip array have the same positive orientation, i.e. all chips are facing upwards, or all chips are facing downwards.

The camera module 3 can be used to determine the position of the chip relative to the left and right trays in addition to the position of the chip to be suctioned/suctioned relative to the robot arm (e.g., housing or suction pen, etc.). Thereby assisting in orderly arranging the chips into the tray on the left side.

The moving frame 64 may have any suitable structure, as long as it can mount the gear 62 and the first driving motor 65 and drive the first suction pen 1 to move up and down, and is not limited to the illustrated structure.

In the illustrated embodiment, referring to fig. 3 and 5, the motion frame 64 includes: the first mounting plate 642 and the second mounting plate 643. The first mounting plate 642 and the second mounting plate 643 are connected in a rectangular frame, thereby having high strength. Moreover, the rectangular frame defines an interior space for facilitating placement of the gears and driven wheels within the rectangular frame. And the rectangular frame is constructed in a form that facilitates installation of the rack, the first driving motor 65, etc. The rack extends longitudinally through the rectangular frame.

Specifically, as shown in fig. 15, the first mounting plate 642 is generally open U-shaped, including two risers parallel to each other, and a connecting plate connecting the two risers. The second mounting plate (see fig. 3) is generally flat in shape. The first mounting plate 642 and the second mounting plate 643 are attached to each other, for example, by a plurality of screws. The distance between two risers, i.e. the width of the connection plate, is greater than the width of a single riser. The width of the riser, i.e., the distance between the connection plate and the second mounting plate 643.

A first sensing protrusion 641 is provided at an upper portion of the first mounting plate 642. The first sensing protrusion 641 cooperates with the first photoelectric switch 71 to detect the uppermost position of the moving frame 64 (i.e., the retracted position of the first suction pen 1).

The fixing bolts 63 for mounting the driven wheel 66 pass through two mutually parallel risers of the first mounting plate 642. The two ends of the support shaft of the gear 62 are each supported on one of the risers. The driven wheel 66, the gear 62 are both located between the two mutually parallel risers. The first driving motor 65 is installed on one of the risers and is installed outside the riser.

The second photoelectric switch 72 is disposed outside the moving frame 64 and cooperates with the second sensing protrusion 401 to detect a lowermost position (corresponding to an extended position of the first suction pen) of the moving frame 64 or a downward moving distance from an uppermost position (corresponding to a retracted position of the first suction pen), or an extended length. Specifically, the second photoelectric switch 72 is provided on the connection plate of the first mounting plate 642.

An embodiment of the present invention provides a method for placing and cleaning chips. The method is realized by adopting the chip arranging and placing manipulator, and comprises the following steps.

In an alternative embodiment, the chip sorting and placing manipulator has a built-in control unit, and the control unit controls the cooperative action of the parts. That is, the following steps may be realized under the control of the built-in control unit.

And step 1, enabling the chip arranging and placing manipulator to be in an initial state, wherein in the initial state, the first suction pen 1 is in a retracted position, and the second suction pen 2 is in an initial position which is not turned over. Before the step 1, the chip sorting and placing manipulator can be in a storage state, namely the first suction pen 1 is in a retracted position; the second suction pen 2 is in the flipped position. Advantageously, both the first and second suction pens 1, 2 are located within the housing 4, thereby providing better protection for the first and second suction pens.

Step 2, referring to fig. 8, the first suction pen 1 is in an extended position, and the first suction pen 1 is moved to the chip 9 to be sucked, and the chip 9 to be sucked is sucked by the first suction nozzle of the first suction pen 1.

Step 3, as shown in fig. 12, the first suction pen 1 is retracted longitudinally along the rack to a retracted position (bringing the chip up) and moves the chip 9 inside the housing 4.

Step 4, as shown in fig. 13, the second suction pen 2 and the camera module 3 are turned from the initial position to the turned position; the angular position and the front and back orientation of the chip are recognized by the camera module 3.

If the chip has angular deviation, the first suction pen 1 rotates to eliminate the angular deviation; eliminating the angular deviation includes making the angular deviation zero or making the angular deviation equal to or less than a set angular threshold (for example, may be set at an angle of 5 degrees or less).

If the front and back directions of the chip do not need to be adjusted, turning to the step 5; if the front and back faces of the chip need to be adjusted, the second suction pen 2 sucks the lower side of the chip 9, and the step 6 is carried out.

And 5, turning the second suction pen 2 to an initial position, and discharging the chip 9 from the placement position by the first suction pen 1. Specifically, the second suction pen 2 is returned to the initial position, the first suction pen 2 is switched to the extended position, and the robot is manually or automatically moved to place the chip 9 in place by the first suction pen 1. For example into a left tray.

And 6, releasing the chip by the first suction pen 1, turning the chip to an initial position by the second suction pen 2, and releasing the chip 9 to a placement position by the second suction pen 2. Specifically, the second suction pen 2 is returned to the initial position, the first suction pen 2 is switched to the extended position, and the robot is manually or automatically moved to place the chip 9 in place by the second suction pen 2. For example into a left tray.

In order to clean the chip 9, in step 3, the surface of the chip 9 is cleaned with dry air. Specifically, in step 3, the first suction pen 1 and the second suction pen 2 are caused to apply suction to the chip 9 at the same time, and dry air is blown out to clean the surface of the chip 9.

The manipulator and the method can realize the rapid placement of the chips.

Finally, it should be pointed out that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting. Those of ordinary skill in the art will appreciate that: the technical schemes described in the foregoing embodiments may be modified or some of the technical features may be replaced equivalently; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. Chip arrangement and put manipulator, its characterized in that includes:

a housing (4) on which a grip (41) or a connection (42) is arranged, wherein the grip (41) is intended to be held by a user; the connecting part is used for being connected with the driving unit so as to drive the shell (4) to move between the chip taking position and the chip placing position;

a movement frame (64) provided so as to be movable in the Z direction with respect to the housing (4);

the first suction pen (1) is provided with a first suction nozzle for sucking a chip (9), and the first suction pen (1) can move between an extending position and a retracting position along the Z direction under the driving of the moving frame (64), the first suction nozzle is positioned outside the shell (4) in the extending position, and the first suction nozzle and/or the sucked chip thereof is positioned inside the shell (4) in the retracting position; the first suction nozzle can rotate around the axis of the first suction nozzle so as to adjust the angle position of the sucked chip; and

the second is inhaled pen (2), and it is provided with the second suction nozzle for absorb chip (9), just second is inhaled pen (2) and is set up to can be in initial position and upset position between upset motion, and in initial position, the extending direction that second inhaled pen (2) is on a parallel with the extending direction of first inhaling pen (1), and in upset position, the extending direction that second inhaled pen (2) and the extending direction collineation of first inhaling pen (1), and second suction nozzle and first suction nozzle are located the relative both sides of being inhaled the chip respectively.

2. The chip sorting and placing manipulator according to claim 1, characterized in that a rack (61) is fixedly mounted on the housing (4), the rack (61) extending along the Z-direction; be provided with gear (62) and first driving motor (65) on moving frame (64), gear (62) with rack (61) cooperation, first driving motor (65) are used for driving the gear to realize moving frame (64) for Z to motion of shell (4), first suction pen (1) are installed on moving frame (64), and follow moving frame (64) are Z to the motion.

3. The chip sorting and placing manipulator according to claim 2, characterized in that two driven wheels (66) are provided on the movement frame (64), the two driven wheels (66) rollingly bearing against a side of the rack (61) facing away from the toothed structure, so that the toothed structure of the rack (61) remains in engagement with the gear (62), wherein the Z-direction height of one driven wheel (66) is higher than the gear (62); the other driven wheel (66) has a Z-direction height lower than that of the gear (62).

4. A chip sorting and placing robot according to claim 3, wherein the moving rack (64) comprises: a first mounting plate (642) and a second mounting plate (643), the first mounting plate (642) comprising two mutually parallel risers, and a connecting plate connecting the two risers; the second mounting plate is in a flat plate shape; the first mounting plate (642) and the second mounting plate (643) are connected to each other to form a vertically extending rectangular frame,

The gear (62) and the two driven wheels (66) are arranged in the inner space defined by the rectangular frame, and the first driving motor (65) is arranged outside one vertical plate;

the chip arranging and placing manipulator also comprises a position detection module (7) for detecting the Z-direction movement position of the movement frame (64) and/or the overturning movement of the second suction pen (2),

a first sensing protrusion (641) is arranged on the first mounting plate (642), and the first sensing protrusion (641) is matched with a first photoelectric switch (71) of the position detection module (7) to detect the retraction position of the first suction pen (1), wherein the first photoelectric switch (71) is fixedly mounted relative to the shell (4);

the inside of shell (4) is provided with second response protruding (401), second response protruding (401) cooperate with second photoelectric switch (72) of position detection module (7) to detect the position that stretches out of first suction pen (1), second photoelectric switch (72) set up the outside of motion frame (64), wherein, the quantity of second response protruding (401) is a plurality of, and evenly arranges in Z orientation.

5. The chip sorting and placing robot according to claim 4, further comprising a roll-over stand (8), the roll-over stand (8) being mounted on a lower portion of the rack (61) so as to be rotatable with respect to the rack (61), the second suction pen (2) being provided on the roll-over stand (8) so as to roll over between an initial position and a roll-over position in response thereto,

be provided with third response protruding (801) on roll-over stand (8), the quantity of third response protruding (801) is a plurality of, and circumference evenly arranges, and the circumference contained angle between the third response protruding (801) of start and the third response protruding (801) of end is 180 degrees, and wherein, the third response protruding (801) of start corresponds the initial position of second suction pen (2), and the third response protruding (801) of end corresponds the upset position of second suction pen (2).

6. The chip sorting and placing manipulator according to claim 5, further comprising a camera module (3), wherein the camera module (3) is used for identifying the front and back directions and the rotation angles of the chips (9) sucked by the first suction pen (1), the camera module (3) is arranged on the turnover frame (8), and the camera module (3) is used for identifying the front and back directions and the angle positions of the chips (9) sucked by the first suction pen (1) when the turnover frame is in the turnover position for driving the second suction pen to turn over.

7. Chip sorting and placing robot according to claim 1, characterized in that it comprises a cleaning module (5), the outlet of which cleaning module (5) is aligned with the chips sucked by the first suction pen (1) in the retracted position, to blow air onto the chips through the outlet of the cleaning module (5), cleaning the surfaces of the chips, wherein the outlet of the cleaning module (5) is higher than the chips in the cleaned state, one side of the housing (4) being opposite to the outlet and the side being open at the lower part, so that the air is discharged outside the housing (4).

8. Chip sorting and placing robot according to any of the claims 1-7, characterized in that the driving unit drives the housing (4) to move in X-direction and/or in Y-direction, wherein the X-direction and the Y-direction are perpendicular to each other and to the Z-direction, and the housing is driven by the driving unit to move only in a plane defined by the X-direction and the Y-direction.

9. Chip arranging and placing method, characterized in that the chip arranging and placing method adopts the chip arranging and placing manipulator according to any one of claims 1-8 to arrange and place chips, and the chip arranging and placing method comprises the following steps:

Step 1, enabling a chip arranging and placing manipulator to be in an initial state, wherein a first suction pen (1) is in a retracted position, and a second suction pen (2) is in an initial position which is not turned over;

step 2, enabling the first suction pen (1) to extend out of the shell, moving the first suction pen (1) to a chip (9) to be sucked, and sucking the chip (9) to be sucked by the first suction pen (1);

step 3, enabling the first suction pen (1) to retract to a retracted position along the Z direction along with the chip;

step 4, enabling the second suction pen (2) to turn over from the initial position to the turning-over position; the angular position and/or the front and back orientation of the chip (9) are detected by the camera module (3),

if the front and back directions of the chip do not need to be adjusted, turning to the step 5; if the front and back directions of the chip are required to be adjusted, the second suction pen (2) is used for sucking the lower side of the chip (9); and turning to the step 6;

step 5, the second suction pen (2) is turned to an initial position, and the first suction pen (1) discharges the chip (9) to a placement position;

and 6, releasing the chip by the first suction pen (1), turning the chip to an initial position by the second suction pen (2), and releasing the chip (9) to a placement position by the second suction pen (2).

10. The chip sorting and placing method according to claim 9, wherein in step 4, the first suction pen (1) and the second suction pen (2) are made to apply suction to the chip (9) at the same time, and dry air is blown out to clean the surface of the chip (9).