JP2017220544A - Component mounting machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imaging apparatus capable of obtaining a side image of a nozzle tip part and an image of a substrate surface without complicating the construction of the apparatus.SOLUTION: A side camera 80 is provided to a head unit comprising a rotary head. As an optical system 84 of the side camera 80, A plurality of mirrors 88a to 88f is provided when a suction nozzle 61 of a mounting position A0 mounts a component P at a mounting position of a substrate S, so as to image the mounting position of the suction nozzle of a mounting just before position A1, the suction nozzle of a mounting just after position A2, and the substrate S. Thus, the device can be simplified and miniaturized than one which individually images a plurality of positions by a camera. Since the mounting just before position, the mounting just after position, and a substrate image can be acquired at one time of imaging, a time for imaging can be reduced.SELECTED DRAWING: Figure 4

Description

The present invention relates to a component mounter that holds components and mounts them on a substrate surface.

Conventionally, as this kind of component mounting machine, an apparatus in which an imaging device is provided on a head has been proposed in which a component is sucked and mounted on a substrate surface by a suction nozzle held by the head (for example, a patent document) 1). In this component mounting machine, a component is adsorbed to an adsorption nozzle by one imaging device by disposing a mirror at a position on the optical axis of the imaging device and rotating the mirror so that the optical axis is directed upward and downward. And imaging of the substrate surface are possible.

JP 2011-86847 A

However, the above-described component mounter requires a switching mechanism for switching the imaging target, which complicates the imaging device. In addition, in order to acquire an image of a component sucked by the suction nozzle, an image of the substrate surface, and the like, it is necessary to perform imaging for the number of times corresponding to the number of images to be acquired, resulting in a longer time required for imaging. The production efficiency of the mounting board will deteriorate.

The main object of the present invention is to provide an imaging apparatus that can obtain a side image of a nozzle tip and an image of a substrate surface without complicating the apparatus.

The present invention adopts the following means in order to achieve the main object described above.

A first component mounter of the present invention is a component mounter that holds a component and mounts it on a substrate surface, the head having a nozzle capable of holding the component at a nozzle tip, and the head as the substrate. Horizontal moving means for moving the nozzle in the horizontal direction with respect to the surface, vertical moving means for moving the nozzle in the vertical direction with respect to the substrate surface, and the nozzle to move the nozzle above the mounting position on the substrate surface Mounting control means for performing a mounting operation for mounting a component held by the nozzle at a mounting position on the substrate surface by moving the head to be positioned and lowering the nozzle by the vertical moving means; and An imaging unit that is provided in the head and picks up the imaging object by receiving incident light from the direction of the imaging object to the imaging element via the optical system, and the optical system includes: A first optical system that guides incident light from the side of the nozzle tip to the first region of the image sensor; and incidence from the direction of the substrate surface with the nozzle being above the substrate surface A second optical system that guides light to the second region of the imaging device, and the imaging means includes a side image of a nozzle tip that may include at least a part of a component held by the nozzle, and the The gist of the present invention is that an image of the substrate surface can be captured through the first optical system and the second optical system, respectively.

The first component mounter according to the present invention includes an imaging unit that is provided on the head and captures the imaging object by receiving incident light from the direction of the imaging object on the imaging element via the optical system. . And as an optical system, the 1st optical system which guides the incident light from the direction of the side of a nozzle tip part to the 1st field of an image sensor, and the direction from the substrate surface in the state where a nozzle is above the substrate surface By providing a second optical system that guides incident light to the second region of the image sensor, a side image of the nozzle tip that can include at least part of the components held by the nozzle and an image of the substrate surface are obtained. The imaging can be performed through the first optical system and the second optical system, respectively. Thereby, it is possible to obtain a side image of the nozzle tip and an image of the substrate surface with a single imaging means without providing a complicated mechanism. Further, if the side image of the nozzle tip and the image of the substrate surface are obtained by one imaging, the imaging time can be shortened and the production efficiency can be prevented from deteriorating. Furthermore, by using the side image of the tip of the nozzle and the image of the board surface, it becomes easy to determine whether or not the component is normally mounted on the board surface.

In such a first component mounting machine of the present invention, the head is a rotary type head in which a plurality of nozzles are arranged in the circumferential direction and the plurality of nozzles can be swung in the circumferential direction. By moving the head so that the mounting target nozzle is located above the mounting position on the substrate surface by the horizontal moving means, and lowering the mounting target nozzle by the vertical moving means, the mounting A mounting operation for mounting the component held by the target nozzle at a mounting position on the surface of the substrate is performed, and the imaging unit includes a side image of a front end portion of the nozzle before mounting that performs the mounting operation of the component after the mounting target nozzle; A first image that is at least one of a side image of a tip portion of a post-mounting nozzle that has performed a component mounting operation before the mounting target nozzle; and the mounting target nozzle And a second image is an image of the substrate surface when performing a component mounting operation, it can be assumed to be respectively imaged through said second optical system and the first optical system.

In the first component mounting machine of the present invention of this aspect, the optical system includes a third optical system that guides incident light from the direction of the mounting target nozzle to a third region of the imaging element, The imaging means is configured to display the first image, the second image, and the third image that is an image of the mounting target nozzle, the first optical system, the second optical system, and the third optical, respectively. It can also be assumed that imaging is possible via the system. In this way, it is possible to determine the presence or absence of the mounting target nozzle using the third image.

In the first component mounter of the present invention, when the nozzle is lowered by the vertical movement means, the component held by the nozzle comes into contact with the substrate surface at a first timing. An imaging control unit that controls the imaging unit so that an image is captured may be provided. In this way, it is possible to determine whether or not the component is normally mounted on the substrate surface based on the image of the substrate surface imaged at the first timing. In the first component mounter of this aspect of the present invention, the imaging control means captures a side image of the tip of the nozzle after performing the component mounting operation after the first timing. The nozzle is controlled normally based on the image of the substrate surface imaged at the first timing and the side image of the tip of the nozzle imaged after the first timing by controlling the imaging means. It can also be provided with a determination means for determining whether or not is mounted. In this way, it is possible to determine whether the nozzle has not brought back the component after the nozzle has mounted the component on the substrate surface.

Further, in the first component mounter of the present invention, after the nozzle performs a component mounting operation, an image of the substrate surface is taken at a second timing when the nozzle is moved up by a predetermined amount by the vertical movement means. It is also possible to provide imaging control means for controlling the imaging means as described above. In this way, it is possible to determine whether or not the component is normally mounted on the substrate surface based on the image of the substrate surface imaged at the second timing. It is also possible to determine whether or not the nozzle has brought back the component after the nozzle has mounted the component on the substrate surface. In the first component mounter of this aspect of the present invention, the imaging control unit may capture a side image of the tip of the nozzle before performing the component mounting operation before the second timing. The nozzle is controlled normally based on the image of the substrate surface imaged at the second timing and the side image of the tip of the nozzle imaged before the second timing by controlling the imaging means A determination unit that determines whether or not a component is mounted may be provided. In this way, it is possible to determine whether or not a component is held by the nozzle before performing the mounting operation.

A second component mounter of the present invention is a component mounter that holds a component and mounts it on a substrate surface, and a plurality of nozzles are arranged in the circumferential direction, and the plurality of nozzles can be swung in the circumferential direction. A rotary type head, horizontal moving means for moving the head in a horizontal direction with respect to the substrate surface, vertical moving means for moving the nozzle in a vertical direction with respect to the substrate surface, and the horizontal moving means The mounting target nozzle is held by moving the head so that the mounting target nozzle is positioned above the mounting position on the surface of the substrate and lowering the mounting target nozzle by the vertical moving means. Mounting control means for performing a mounting operation for mounting a component that is mounted on a mounting position on the substrate surface, and imaging means provided on the head, wherein the imaging means includes the mounting pair. At least one of a side image of the tip part of the nozzle before mounting that performs the mounting operation of the component after the nozzle, a side image of the tip part of the nozzle after mounting that performs the mounting operation of the component before the nozzle to be mounted, and the mounting target The gist is that it is possible to capture an image of the substrate surface when the nozzle performs a component mounting operation.

The second component mounting machine of the present invention includes a rotary type head capable of turning a plurality of nozzles in the circumferential direction and an imaging unit provided on the head, and the imaging unit is disposed behind the mounting target nozzle. Side image of the tip of the pre-mounting nozzle that mounts the component, side image of the tip of the post-mounting nozzle that mounts the component before the mounting target nozzle, and image of the board surface when the mounting target nozzle mounts the component Can be imaged. Thus, by using at least one of the side image of the tip part of the nozzle before mounting and the side image of the tip part of the nozzle after mounting, and the image of the substrate surface when the mounting target nozzle performs the component mounting operation, the component It is easy to determine whether or not is normally mounted on the substrate surface.

1 is a configuration diagram showing an outline of the configuration of a component mounting system 1. FIG. FIG. 3 is a configuration diagram showing an outline of the configuration of a head unit 60. FIG. 3 is a configuration diagram showing an outline of configurations of a rotary head 64 and a side camera 80. 2 is a configuration diagram showing an outline of a configuration of an optical system 84 of a side camera 80. FIG. 3 is a block diagram illustrating an electrical connection relationship between a control device 100 and a management device 110. FIG. It is explanatory drawing which shows an example of the captured image obtained by the imaging of the side camera. 3 is a flowchart illustrating an example of a component mounting process executed by a CPU 101 of a control device 100. 3 is a flowchart illustrating an example of a mounting operation execution process executed by a CPU 101 of a control device 100. It is explanatory drawing explaining the imaging timing of the side camera 80 of an Example. It is explanatory drawing which shows the mode of the suction nozzle 61 and the board | substrate S in the imaging timing of FIG. 3 is a flowchart illustrating an example of a mounting confirmation process executed by a CPU 101 of a control device 100. It is explanatory drawing explaining the imaging timing of the side camera 80 of a modification. It is explanatory drawing which shows the mode of the suction nozzle 61 and the board | substrate S in the imaging timing of FIG.

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram showing an outline of the configuration of the component mounting system 1. 2 is a configuration diagram showing an outline of the configuration of the head unit 60, FIG. 3 is a configuration diagram showing an outline of the configuration of the rotary head 64 and the side camera 80, and FIG. 4 is an optical system of the side camera 80. FIG. 5 is a block diagram showing an electrical connection relationship between the control device 100 and the management device 110. As shown in FIG.

The component mounting system 1 includes a component mounter 10 that mounts (mounts) an electronic component (hereinafter referred to as “component”) P on a circuit board (hereinafter referred to as “substrate”) S, and a management device 110 that manages the entire system. With. In this embodiment, the left-right direction in FIG. 1 is the X-axis direction, the front-rear direction is the Y-axis direction, and the up-down direction is the Z-axis direction.

As shown in FIG. 1, the component mounter 10 includes a component supply device 20 including a reel and a tray that accommodates a component P, a substrate transport device 30 that transports the substrate S, and a backup device that backs up the transported substrate S. 40, a head unit 60 that sucks the component P by the suction nozzle 61 and mounts it on the substrate S, an XY robot 50 that moves the head unit 60 in the XY direction, and a control device 100 that controls the entire mounting machine (see FIG. 5). ). The substrate transfer device 30, the backup device 40, the XY robot 50, and the head unit 60 are accommodated in the housing 12. In addition to these components, the component mounter 10 also includes a parts camera 90 for imaging the suction posture of the component P sucked by the suction nozzle 61 from below, and a board positioning reference mark attached to the board S from above. A mark camera 92 for imaging, a nozzle stocker 94 for stocking a plurality of types of suction nozzles 61 for replacement according to the size of the component P to be mounted, and the like are also provided.

As shown in FIG. 1, the component supply device 20 includes a tape feeder 22 detachably attached to the front side of the housing 12. The tape feeder 22 is provided with a reel 22a around which a tape in which the parts P are accommodated at predetermined intervals is wound. A driving motor (not shown) is driven to pull out the tape from the reels 22a, thereby supplying the parts P to the parts supply position. Send out until.

As shown in FIG. 1, the substrate transport device 30 includes a belt conveyor device 32, and transports the substrate S from the left to the right (substrate transport direction) in FIG. 1 by driving the belt conveyor device 32. A backup device 40 that backs up the transported substrate S from the back side is provided at the center of the substrate transport device 30 in the substrate transport direction (X-axis direction).

As shown in FIG. 1, the XY robot 50 includes a guide rail 56 provided in the upper part of the apparatus along the Y-axis direction, a Y-axis slider 58 that can move along the guide rail 56, and a Y-axis slider 58. A guide rail 52 provided on the side surface along the X-axis direction, and an X-axis slider 54 that is movable along the guide rail 52 and to which the head unit 60 is attached.

As shown in FIG. 2, the head unit 60 includes a rotary head 64 in which a plurality of nozzle holders 62 holding suction nozzles 61 are arranged on a circumference coaxial with the rotation axis at a predetermined angular interval (for example, 30 degrees). The R-axis actuator 66 that rotates the rotary head 64, the Z-axis actuator 70 that moves the nozzle holder 62 in the Z-axis direction, the suction nozzle 61, the side surface of the component P sucked by the suction nozzle 61, and the surface of the substrate S And a side camera 80 capable of capturing the image.

The nozzle holder 62 is configured as a hollow cylindrical member that extends in the Z-axis direction. The upper end portion 62 a of the nozzle holder 62 is formed in a columnar shape having a larger diameter than the shaft portion of the nozzle holder 62. The nozzle holder 62 has a flange portion 62b having a diameter larger than that of the shaft portion at a predetermined position below the upper end portion 62a. A spring (coil spring) 65 is disposed between an annular surface below the flange portion 62 b and a recess (not shown) formed on the upper surface of the rotary head 64. For this reason, the spring 65 urges the nozzle holder 62 (flange portion 62b) upward with the depression on the upper surface of the rotary head 64 as a spring receiver.

As shown in FIG. 3, the rotary head 64 has a plurality of (for example, 12) suction nozzles 61 mounted on a nozzle holder 62 (see FIG. 2) arranged in the circumferential direction. A cylindrical reflector 64 a that can reflect light is attached to the center of the lower surface of the rotary head 64. The rotary head 64 of this embodiment includes a Q-axis actuator 69 (see FIG. 5) that rotates each nozzle holder 62 individually. Although not shown, the Q-axis actuator 69 includes a drive gear meshed with a gear provided on the outer circumference of the nozzle holder 62 and a drive motor connected to the rotation shaft of the drive gear. Therefore, in the present embodiment, the plurality of nozzle holders 62 can be individually rotated around the axis (Q direction), and accordingly, each suction nozzle 61 can also be individually rotated.

As shown in FIG. 2, the R-axis actuator 66 includes a rotary shaft 67 connected to the rotary head 64 and a drive motor 68 connected to the rotary shaft 67. The R-axis actuator 66 intermittently rotates the rotary head 64 by a predetermined angle by driving the drive motor 68 intermittently by a predetermined angle (for example, 30 degrees). As a result, each suction nozzle 61 arranged in the rotary head 64 pivots by a predetermined angle in the circumferential direction. Here, when the suction nozzle 61 is located at the 12 o'clock position in FIG. 3 among the plurality of movable positions, the suction nozzle 61 sucks the component P supplied from the component supply device 20 to the component supply position and also to the substrate S. The component P is mounted. For this reason, this 12 o'clock position is referred to as a mounting position A0. 3 is a position immediately before (immediately before) the mounting position A0 when the suction nozzle 61 moves in the circumferential direction (the arrow direction in the figure). The 1 o'clock position in FIG. 3 is a position immediately after the mounting position A0 when the suction nozzle 61 moves in the circumferential direction (in the direction of the arrow in the figure). .

As shown in FIG. 2, the Z-axis actuator 70 includes a screw shaft 74 that extends in the Z-axis direction and moves the ball screw nut 72, a Z-axis slider 76 that is attached to the ball screw nut 72, and a rotation shaft that is connected to the screw shaft 74. The feed screw mechanism includes a drive motor 78 connected thereto. The Z-axis actuator 70 rotates the drive motor 78 to move the Z-axis slider 76 in the Z-axis direction. The Z-axis slider 76 is formed with a substantially L-shaped lever portion 77 projecting toward the rotary head 64 side. The lever portion 77 can come into contact with the upper end portion 62a of the nozzle holder 62 located in a predetermined range including the mounting position P0. Therefore, when the lever portion 77 moves in the Z-axis direction as the Z-axis slider 76 moves in the Z-axis direction, the nozzle holder 62 (suction nozzle 61) located within a predetermined range can be moved in the Z-axis direction. it can.

As shown in FIGS. 3 and 4, the side camera 80 includes a camera body 82 that is provided below the head unit 60 and incorporates an image sensor 82 a such as a CCD or CMOS, and an optical system that forms an image on the image sensor 82 a. 84. In the optical system 84, three incident ports, a left incident port 86a, a right incident port 86b, and an upper incident port 86c, are formed on the nozzle head 64 side, and a camera connection port 86d is formed on the camera body 82 side. The upper entrance 86c is formed at a position facing the base end of the suction nozzle 51 at the mounting position A0, and the left entrance 86a is formed at a position facing the tip of the suction nozzle 51 at the position A1 immediately before mounting. The right entrance 86b is formed at a position facing the tip of the suction nozzle 51 at the position A2 immediately after mounting. The optical system 84 includes a plurality of light emitters 87 such as LEDs that emit light toward the reflector 64 a of the rotary head 64 on the outer peripheral surface on the nozzle head 64 side. The optical system 84 includes a plurality of mirrors (a left mirror 88a, a right mirror 88b, a middle mirror 88c, and an upper mirror 88d) that refract the light incident from the incident ports 86a, 86b, and 86c and guide the light to the imaging element 82a. , Rear mirrors 88e, 88f). The left mirror 88a is disposed at the left entrance 86a, refracts light incident from the left entrance 86a to the middle mirror 88c, and the right mirror 88c is disposed at the right entrance 86b and is incident from the right entrance 86b. Refracted light to the middle mirror 88c. The middle mirror 88c is disposed between the left mirror 88a and the right mirror 88b, refracts the light from the left mirror 88a to the lower left region of the back mirror 88e, and directs the light from the right mirror 88b to the right of the back mirror 88e. Refract to the lower region. The upper mirror 88d is disposed at the upper entrance 86c and refracts light incident on the substrate S from a direction of about 45 degrees into the middle region of the back mirror 88e. The upper entrance 86c is open in an area above the area that receives light from the upper mirror 88d of the rear mirror 88e, and light incident from the upper part of the upper mirror 88d is directed to the upper area of the rear mirror 88e. It comes to reach directly. The back mirrors 88e and 88f translate the light incident on the back mirror 88e so as to be refracted toward the image sensor 82a. From the above, the light from the direction of the suction nozzle 61 at the position A1 immediately before mounting enters the left entrance 86a and is refracted by the left mirror 88a, the middle mirror 88c, and the back mirrors 88e and 88f (first optical system). To the first area A of the image sensor 82a. Light from the direction of the suction nozzle 61 at the position A2 immediately after mounting enters the right incident port 86b, is refracted by the right mirror 88b, the middle mirror 88c, and the back mirrors 88e and 88f (first optical system) and is imaged. The first area B of 82a is reached. The light from the oblique 45 ° direction below the suction nozzle 61 is refracted by the upper mirror 88d and the back mirrors 88e and 88f (second optical system) and reaches the second region of the image sensor 82a. The light from the direction of the suction nozzle 61 at the mounting position A0 enters the upper incident port 86c and directly reaches the back mirror 88e, and is refracted by the back mirrors 88e and 88f (third optical system) to be reflected by the imaging element 82a. Reach the third area. Thereby, the image sensor 82a forms images from different directions in different regions.

In this way, the side camera 80 is mounted in a single imaging operation with the suction nozzle 61 (nozzle imaging area) at the mounting position A0, the suction nozzle 61 (immediately before mounting) at the mounting position A1. The picked-up nozzle 61 (imaging area immediately after mounting) located immediately after the position A2 can be imaged and each captured image can be acquired. Further, when the side camera 80 is imaged in a state where the suction nozzle 61 at the mounting position A0 is located on the substrate S, in addition to the above three captured images, a captured image of the surface of the substrate S (substrate imaging area). Can also get. FIG. 6 is an example of an image acquired by imaging by the side camera 80. 6 shows a side image (hereinafter referred to as an image immediately after mounting) of the tip of the suction nozzle 61 at the position A2 immediately after mounting immediately after the suction nozzle 61 mounts the component P on the substrate S, and the suction nozzle 61 mounts the component P. A side image (hereinafter referred to as an image immediately before mounting) of the suction nozzle 61 at a position A1 immediately before mounting immediately before mounting, and a side image (hereinafter referred to as a nozzle image) of a proximal end portion of the suction nozzle 61 at a mounting position A0. , An image of the substrate S (hereinafter referred to as a substrate image).

As illustrated in FIG. 5, the control device 100 is configured as a microprocessor centered on the CPU 101, and includes a ROM 102, an HDD 103, a RAM 104, an input / output interface 105, and the like in addition to the CPU 101. These are connected via a bus 106. The control device 100 inputs image signals from the side camera 80, the parts camera 90, and the mark camera 92 via the input / output interface 105. The X-axis slider 54, the Y-axis slider 58, the Z-axis actuator 70, the Q-axis actuator 69, and the R-axis actuator 66 are equipped with position sensors (not shown). Also input location information. The control device 100 also includes a component supply device 20, a substrate transport device 30, a backup device 40, an X-axis actuator 55 that moves the X-axis slider 54, a Y-axis actuator 59 that moves the Y-axis slider 58, and a Z-axis actuator 70 ( Drive signal to drive valve 78, Q-axis actuator 69 (drive motor), R-axis actuator 66 (drive motor 68), electromagnetic valve 79 that connects and disconnects vacuum pump (not shown) and suction nozzle 61, etc. Output via the output interface 105.

The management device 110 is a general-purpose computer, for example. As shown in FIG. 5, the management device 110 includes a CPU 111, a ROM 112, an HDD 113 for storing production data of the board, a RAM 114, an input / output interface 115, and the like. These are connected via a bus 116. The management apparatus 110 receives an input signal from an input device 117 such as a mouse or a keyboard via the input / output interface 115. Further, the management device 110 outputs an image signal to the display 118 via the input / output interface 115. Here, the board production data is data that defines which parts P are mounted on the board in which order in the component mounter 10, and how many boards S on which the parts P are mounted are produced. It is. This production data is input in advance by an operator, and is transmitted from the management apparatus 110 to the component mounting machine 10 when production is started.

Next, details of the operation of the component mounter 10 thus configured will be described. FIG. 7 is a flowchart illustrating an example of a component mounting process executed by the CPU 101 of the control device 100. This process is executed when production data is received from the management apparatus 110 and an instruction to start production is given.

In the component mounting process, the CPU 101 of the control device 100 first performs a board transfer process for controlling the board transfer device 30 to transfer the board S (S100). Subsequently, the CPU 101 controls the X-axis actuator 55 and the Y-axis actuator 59 so that the mounting position A0 of the rotary head 64 moves to the component supply position of the component supply apparatus 20 (S110), and the suction nozzle at the position A1 immediately before mounting. The R-axis actuator 66 and the Z-axis actuator 70 are controlled so that the suction nozzle 61 is lowered while the 61 is pivoted to the mounting position A0, and a negative pressure is applied to the suction nozzle 61 to suck the component P onto the suction nozzle 61. An adsorption operation for controlling the electromagnetic valve 79 is performed (S120). When performing the suction operation, the CPU 101 determines whether there is a component P to be sucked next (S130). If the CPU 101 determines that there is a component P to be sucked next, the CPU 101 returns to S120 and repeats the suction operation. If it is determined that there is no component P to be sucked next, the CPU 101 proceeds to the next processing of S140.

Next, the CPU 101 moves the head unit 60 on the substrate S by controlling the X-axis actuator 55 and the Y-axis actuator 59 so that the mounting position A0 of the rotary head 64 moves directly above the mounting position of the substrate S. (S140). The head unit 60 is moved via the part camera 90. When the head unit 60 passes above the parts camera 90, the parts P sucked by the suction nozzle 61 by the parts camera 90 are imaged, and the position shift of the parts P with respect to the suction nozzle 61 based on the obtained image. Detect the amount.

When the head unit 60 moves to the mounting position, the CPU 101 executes a mounting operation for mounting the component P on the substrate S (S150), and performs a mounting confirmation process for checking whether the mounting operation has been performed normally (S160). ). Then, the CPU 101 determines whether there is a component P to be mounted next (S170). If it is determined that there is a component P to be mounted next, the CPU 101 returns to S150 and repeats the mounting operation and the mounting confirmation process. If it is determined that there is no component P to be mounted, the component mounting process is terminated.

The mounting operation in S150 is performed by executing the mounting operation execution process in FIG. In the mounting operation execution process of FIG. 8, the CPU 101 controls the R-axis actuator 66 and the Z-axis actuator 70 so as to lower the suction nozzle 61 while rotating the suction nozzle 61 at the position A1 immediately before mounting to the mounting position A0. Then, the process waits for the component P sucked by the suction nozzle 61 to contact the substrate S (S210). Note that the determination in S210 can be made based on, for example, a detection value from a position sensor attached to the Z-axis actuator 70. When the CPU 101 determines that the component P has contacted the substrate S, the CPU 101 performs imaging by the side camera 80 (S220), and applies a positive pressure to the suction nozzle 61 to mount the component P on the substrate S. Control is performed (S230). Here, the images obtained by the imaging of the side camera 80 include a side image (nozzle image) of the suction nozzle 61 at the mounting position A0, and a side image (image just before mounting) of the suction nozzle 61 at the position A1 immediately before mounting. The side image (immediately after mounting) of the suction nozzle 61 at the position A2 immediately after mounting and the surface image (substrate image) at the mounting position of the substrate S are included. Thereafter, the CPU 101 controls the Z-axis actuator 70 to raise the suction nozzle 61 (S240), and waits for the suction nozzle 61 to rise by a predetermined amount (for example, 1 mm) in the Z-axis direction (S250). Here, in the process of S240, the suction nozzle 61 is moved only in the Z-axis direction and is not moved in the X-axis, Y-axis, and R-axis directions. The determination in S250 can be performed based on, for example, a detection value from a position sensor attached to the Z-axis actuator 70. When the Z-axis of the suction nozzle 61 rises by a predetermined amount, the CPU 101 performs imaging with the side camera 80 (S260) and ends the mounting operation execution process. Note that the CPU 101 performs mounting confirmation processing described later after imaging by the side camera 80, and performs the mounting operation of the next component P when it is confirmed that no mounting error has occurred in the mounting confirmation processing. Then, the movement in the X-axis, Y-axis, and R-axis directions is started.

FIG. 9 is an explanatory diagram illustrating the imaging timing of the side camera 80 of the embodiment, and FIG. 10 is an explanatory diagram illustrating the appearance of the suction nozzle 61 and the substrate S at the imaging timing of FIG. As shown in the drawing, the imaging by the side camera 80 is performed in the first timing when the component P sucked by the suction nozzle 61 contacts the substrate S, and after the component P is mounted, the suction nozzle 61 moves in the Z-axis direction by a predetermined amount. Is executed at the second timing which has risen to the second. As shown in the imaging area (substrate imaging area) of FIG. 10A, the image obtained when the side camera 80 is imaged at the first timing is that the component P sucked by the suction nozzle 61 is the substrate S. This is an image of the state of being in contact with the surface of the screen as seen obliquely from above. In addition, the image obtained when the side camera 80 is imaged at the second timing is shown in the imaging area (substrate imaging area) of FIG. This is an image of the state of being away from S viewed obliquely from above.

The mounting confirmation process of S160 is performed by executing the mounting confirmation process of FIG. In the mounting confirmation processing of FIG. 11, the CPU 101 of the control device 100 first performs image processing on the captured images obtained by capturing the side camera 80 at the first timing and the second timing, respectively. Then, the mounting confirmation of the component P is performed (S300). Here, the process of S300 extracts the board image in the board imaging area (see FIG. 10A) from the captured image obtained by the imaging at the first timing, and corresponds to the mounting position in the extracted board image. It is determined whether or not the component P exists at the mounting position by examining the luminance value of the pixel to be processed. Thereby, it can be determined whether or not a positional deviation (mounting error) has occurred in the component P placed with respect to the mounting position of the substrate S. In the process of S300, the board image (see FIG. 10B) in the board imaging area is extracted from the captured image obtained by the imaging at the second timing, and the extracted board image is extracted at the first timing. It is determined whether or not there is a change in the component P at the mounting position of the substrate S before and after by comparing the substrate image obtained by imaging and determining the difference between them. Thereby, after mounting the component P, it is possible to determine whether or not a take-out error (mounting error) in which the suction nozzle 61 brings back the component P has occurred. Here, the determination of the difference between the captured image at the first timing and the captured image at the second timing may be performed based on the suction nozzle 61 in both captured images, or both captured images. The mounting position estimated by estimating the mounting position of the component P based on the peripheral components and solder shown in FIG. Also, these criteria may be selected by the operator. Consider a case where the substrate S is warped. In this case, when the substrate S is imaged in a state where the component P is pressed against the substrate S by the suction nozzle 61 (first timing), and after the mounting operation is completed, the suction nozzle 61 is raised and pressed by the suction nozzle 61. The imaging position of the substrate S may be deviated when the substrate S is imaged in a state where the force is released (second timing). In this case, the position of the component P can be accurately recognized if the difference between the two captured images is determined with reference to the mounting position of the component P specified based on the peripheral components and solder that appear in both captured images. Can do.

In the embodiment, the process of S300 extracts an image immediately before mounting in the imaging area immediately before mounting from the captured image, and examines luminance values of pixels around the tip of the suction nozzle 61 in the extracted immediately preceding mounting image. Then, it is also determined whether or not the suction nozzle 61 at the position A1 immediately before mounting is sucking the component P (whether or not the component P is in the suction nozzle 61). In the image immediately before mounting shown in FIG. 6, the entire part P held by the nozzle is imaged, but at least a part of the part P may be imaged. As described above, the take-out determination of the component P is performed by comparing the captured image (substrate image) at the first timing with the captured image (substrate image) at the second timing. In this case, by confirming that the component P is sucked (there is the component P) on the suction nozzle 61 at the position A1 immediately before mounting based on the captured image (image immediately before mounting), the suction at the position A1 immediately before mounting is confirmed. When the nozzle 61 moves to the mounting position A0 and performs the mounting operation, the take-out of the component P is determined by simple comparison between the first timing captured image (substrate image) and the second timing captured image (substrate image). can do. That is, when there is no component P in the suction nozzle 61 at the position A1 immediately before mounting, the first timing captured image (substrate image) and the second timing imaging when moving to the mounting position A0 and performing the mounting operation. No change occurs in the image (board image), and it is not possible to determine whether the component P has been taken away by simple comparison. For this reason, when it is unclear whether or not there is the component P in the suction nozzle 61 at the position A1 immediately before mounting, processing (recognition processing) for recognizing the component P in the captured image (board image) at the first timing is performed. Need arises. Such recognition processing is not preferable because it complicates image processing and causes erroneous recognition. In this embodiment, it is confirmed that the component P is present at the suction nozzle 61 at the position A1 immediately before mounting based on the captured image (image immediately before mounting), and the suction nozzle 61 at the position A1 immediately before mounting is moved to the mounting position A0. By performing a simple comparison between the captured image (board image) at the first timing and the captured image (board image) at the second timing when performing the mounting operation, the recognition process is not required and the take-out is performed. Can be determined more simply and accurately.

Then, the CPU 101 determines whether or not a mounting error has occurred based on the above-described image processing (S310). When determining that no mounting error has occurred, the CPU 101 ends the mounting confirmation processing. On the other hand, when determining that a mounting error has occurred, the CPU 101 determines whether or not the mounting error is a take-out error of the component P (S320). If the CPU 101 determines that the mounting error is not a take-out error of the component P, the mounting confirmation process is terminated. In this case, the substrate S on which a mounting error (mounting position shift) has occurred can be disposed of after being inspected by an inspection device (not shown) in a subsequent process. Note that the CPU 101 may end the component mounting process in FIG. 7 after completing the mounting confirmation process, thereby preventing subsequent mounting of the component P on the board S in which a mounting error has occurred.

On the other hand, if the CPU 101 determines that the mounting error is a take-away error of the component P, the CPU 101 moves the suction nozzle 61 that has performed the mounting operation of the component P from the mounting position A0 to the position A2 immediately after mounting (S330), and then the side camera. (S340), and image processing is performed on the captured image obtained by the imaging (S350). The process of S350 extracts the immediately after mounting image in the imaging area immediately after mounting from the captured image, and examines the luminance value of the pixel around the tip of the suction nozzle 61 of the extracted immediately mounting image, thereby obtaining the position A2 immediately after mounting. It is determined whether or not there is a part P (take-out part) in a certain suction nozzle 61. As in the image immediately before mounting, it is not essential that the entire component P can be imaged in the image immediately after mounting, and at least a part of the component P may be captured. If the CPU 101 determines that a take-out component exists in the imaging area immediately after mounting (S360), the CPU 101 discards the component P in a discard box (not shown) (S370). Then, the CPU 101 replaces the suction nozzle 61 with a new nozzle for mounting the next component P (S380), and ends the mounting confirmation process. When the suction nozzle 61 is replaced with a new nozzle, the CPU 101 performs imaging by the side camera 80, extracts a nozzle image in the nozzle imaging area from the obtained captured image, and based on the extracted nozzle image, the suction nozzle 61. It is determined whether or not is attached. Thereby, it can be confirmed whether the suction nozzle 61 has been replaced. When the suction nozzle 61 is replaced and the mounting confirmation process is completed, the CPU 101 returns to S170 of the component mounting process of FIG. 7 and proceeds with the process to resume mounting of the next component P.

If the CPU 101 determines in S360 that there is no part to be taken back in the imaging area immediately after mounting, the CPU 101 determines that there is a possibility that the component P has fallen on the board S, and automatically stops the component mounter 10 (S390). An error display for instructing the operator to remove P is performed (S400). Then, the CPU 101 waits until an instruction to resume production is received from the operator (S410). When an instruction to resume production is given, the suction nozzle 61 is replaced with a new nozzle in order to resume the component mounting process ( S380), the mounting confirmation process is terminated. Note that the CPU 101 ends the mounting confirmation processing instead of displaying the error in S400, and after finishing the mounting confirmation processing, ends the component mounting processing in FIG. On the other hand, the subsequent component P may not be mounted. Also in this case, the substrate S in which the take-out error has occurred can be disposed of after being inspected by an inspection apparatus (not shown) in a subsequent process.

Here, the mounting confirmation processing of FIG. 11 is performed for a case where a small component having a size smaller than a predetermined size is mounted. The component P is mounted by pressing the component P sucked by the suction nozzle 61 onto the solder paste printed on the substrate S, and causing the suction nozzle 61 to act on the component P with a positive pressure air force. For this reason, when the size of the component P is small, the solder paste rises as the component P is pressed, and the solder may adhere to the suction nozzle 61. On the other hand, the suction nozzle 61 is selected according to the size of the component P to be mounted. When mounting a small component, the inner diameter of the selected suction nozzle 61 is reduced, and the positive pressure air force is reduced. For this reason, when the solder adheres to the suction port of the suction nozzle 61, the adhesive force of the solder may overcome the positive pressure air force from the suction nozzle 61, and the Z axis may rise while the component P remains attached to the suction nozzle 61. (Take home part P). On the other hand, when a large component is mounted, the inner diameter of the selected suction nozzle 61 is also increased, and the positive pressure air force is increased. Further, since the component size is large, the adhesive force to the substrate S when the component P is pressed against the solder paste is large, and the thickness of the component P is also high, so that the solder swell when the component P is pressed against the solder paste is small. As described above, when mounting a large component, it is unlikely that solder will adhere to the suction nozzle 61, and even if solder adheres to the suction nozzle 61, there is almost no possibility of take-away. It is done. Based on these reasons, the mounting confirmation process is performed when a small component having a size smaller than a predetermined size is mounted.

The component mounting machine 10 according to the embodiment described above includes the side camera 80 in the head unit 60, and the suction nozzle 61 at the mounting position A0 mounts the component P at the mounting position of the substrate S as the optical system 84 of the side camera 80. At this time, a plurality of mirrors 88a to 88f are provided so as to simultaneously image the suction nozzle 61 at the position A1 immediately before mounting, the suction nozzle 61 at the position A2 immediately after mounting, and the surface (mounting position) of the substrate S. As a result, the apparatus can be simplified and the apparatus can be downsized as compared with the case where a plurality of positions are captured by separate cameras. Further, since the image immediately before mounting, the image immediately after mounting, and the substrate image can be acquired by one imaging, the imaging time can be shortened.

Further, in the component mounting machine 10 of the embodiment, the first timing when the Z-axis of the suction nozzle 61 at the mounting position A0 descends and the component P contacts the substrate S, and after the component P is mounted, the suction nozzle 61 is located. Imaging by the side camera 80 is performed at each second timing after the fixed amount has been increased. Thereby, in addition to the determination as to whether or not the component P is mounted on the board S at the correct mounting position, it is also possible to determine whether or not the suction nozzle 61 has brought back the component P after mounting the component P. The status of mounting errors can be grasped more accurately.

Furthermore, since the component mounter 10 of the embodiment also images the nozzle imaging area at the mounting position A0 with the side camera 80, it can also be determined whether or not the suction nozzle 61 exists at the mounting position A0. Thereby, in particular, it can be confirmed whether or not the suction nozzle 61 is mounted when the suction nozzle 61 is replaced.

In the component mounting machine 10 of the embodiment, in the mounting confirmation process of FIG. 11, when it is determined in S320 that the component P has been taken home, the suction nozzle 61 is moved to the position A2 immediately after mounting and imaging is performed by the side camera 80. However, such imaging may not be performed.

In the component mounting machine 10 of the embodiment, the timing at which the suction nozzle 61 descends and the component P contacts the substrate S (first timing), and the timing at which the suction nozzle 61 rises by a predetermined amount after mounting the component P ( The board image is acquired by performing the imaging by the side camera 80 at the second timing), but the imaging at the second timing may not be performed. In this case, the movement in the XY direction and the movement in the R direction can be started at an earlier timing than that in which imaging is performed at the second timing. FIG. 12 is an explanatory diagram for explaining the imaging timing of the side camera 80 according to a modified example, and FIG. 13 is an explanatory diagram showing the state of the suction nozzle 61 and the substrate S at the imaging timing of FIG. As shown in the drawing, the imaging by the side camera 80 is executed at the first timing when the component P sucked by the suction nozzle 61 contacts the substrate S. In the captured image obtained by imaging at the first timing, the component P sucked by the suction nozzle 61 is in contact with the surface of the substrate S, as shown in the imaging area (substrate imaging area) of FIG. This is an image of the situation seen from above. In this case, it cannot be determined from the board image in the board imaging area whether or not the suction nozzle 61 at the mounting position A0 has brought back the part P, but whether or not the part P is mounted at the mounting position of the board S. Can be determined. Here, when the suction nozzle 61 at the position A1 immediately before mounting moves to the mounting position A0 to mount the component P, the suction nozzle 61 at the mounting position A0 moves to the position A2 immediately after mounting. For this reason, among the captured images obtained by the imaging of the side camera 80, the image in the imaging area immediately after the mounting is the part P if the suction nozzle 61 that has performed the mounting operation immediately mounts the part P. If the suction nozzle 61 that has performed the mounting operation immediately before has taken the part P home, the part P is shown. Therefore, by examining the image in the imaging area immediately after mounting among the captured images, it is possible to determine whether the component P of the suction nozzle 61 that has just performed the mounting operation has been taken home.

In the component mounting machine 10 of the embodiment, the suction nozzle 61 at the position A2 immediately after mounting and the suction nozzle 61 at the position A1 immediately before mounting are simultaneously imaged by the side camera 80 to acquire the image immediately after mounting and the image immediately before mounting. However, the present invention is not limited to this, and only one of the position A2 immediately after mounting and the position A1 immediately before mounting may be imaged. In addition, the side camera 80 captures the suction nozzle 61 at the mounting position A0 and acquires the nozzle image. However, the suction nozzle 61 at the mounting position A0 may not be captured.

In the component mounting machine 10 according to the embodiment, a camera for imaging the suction nozzle 61 at the position A2 immediately after mounting and acquiring the image immediately after mounting, and an image of the suction nozzle 61 at the position A1 immediately before mounting and acquiring the image immediately before mounting are acquired. However, the present invention is not limited to this, and each camera is provided separately. However, this is not limited thereto. It may be a thing.

In the component mounter 10 of the embodiment, when a mounting error occurs, the mounting error is dealt with according to the mounting confirmation process of FIG. 11, but the present invention is not limited to this, and a coping method (for example, S370) Whether or not the component P is discarded, whether or not the nozzle is replaced in S380, whether or not the automatic stop is performed in S390, whether or not the board S in which a mounting error has occurred is discarded, and whether or not the subsequent mounting of the component P is continued even after the mounting error occurs Etc.) may be selected by the operator.

In the component mounter 10 of the embodiment, the control device 100 causes the component P to be placed in the suction nozzle 61 at the position A1 immediately before mounting based on the image immediately before mounting among the images captured by the side camera 80 in S300 of the mounting confirmation process of FIG. It was also determined whether or not there was. In this case, if it is determined that there is the component P in the suction nozzle 61 at the position A1 immediately before mounting, the mounting operation of the next component P is performed in S150 of the component mounting process of FIG. If it is determined that there is no component P in the suction nozzle 61 at A1, it may be determined that the component P has dropped during movement, and the component mounter 10 may be automatically stopped (error stopped).

In the component mounting machine 10 according to the embodiment, the side camera 80 is used for acquiring an image (substrate image) for determining whether or not the component P sucked by the suction nozzle 61 is normally mounted on the substrate S. However, the present invention is not limited to this. Acquisition of an image for determining whether or not the component P is normally sucked when the component P supplied by the component supply device 20 is sucked by the suction nozzle 61 is obtained. It is good also as what is used for. In this case, for example, the component mounting machine 10 (the control device 100) moves the side camera 80 at the first timing when it lowers the suction nozzle 61 at the mounting position A0 and contacts the component P in S120 of the component mounting process of FIG. Imaging by the side camera 80 may be performed at a second timing after the suction nozzle 61 is lifted by a predetermined amount after the suction nozzle 61 is suctioned, Imaging by the side camera 80 may be performed at both the first timing and the second timing. When imaging is performed at the first timing, it can be determined whether the suction nozzle 61 is performing the suction operation of the component P at the correct position based on the image in the area corresponding to the board imaging area of the embodiment. Further, when imaging is performed at the second timing, it is determined based on an image in an area corresponding to the board imaging area of the embodiment whether a suction error in which the component P is not sucked by the suction nozzle 61 has occurred. Can do. Further, out of the captured images obtained by capturing with the side camera 80, there is an abnormality in the suction nozzle 61 before the component suction (for example, damage to the suction nozzle 61, presence or absence of attached matter, etc.) based on the image at the position A1 immediately before mounting. It is also possible to confirm whether the component P is attracted (for example, whether the component P is attracted or whether the component P is present) based on the image at the position A2 immediately after mounting.

In the embodiments, the present invention has been described by applying the suction nozzle 61 mounted on the rotary head 64 to the image picked up by the side camera 80. However, the present invention is not limited to this, and the suction nozzle mounted on the non-rotating head is disposed on the side surface. It is good also as what is applied to what is imaged with a camera.

Here, the correspondence between the main elements of the present embodiment and the main elements of the invention described in the column of means for solving the problems will be described. That is, the rotary head 64 corresponds to the “head”, the XY robot 50 corresponds to the “horizontal moving means”, the Z-axis actuator 70 corresponds to the “vertical moving means”, and the control for executing the component mounting process of FIG. The CPU 101 of the apparatus 100 corresponds to “mounting control means”, the side camera 80 corresponds to “imaging means”, the mirrors 88a to 88c, 88e, and 88f correspond to “first optical system”, and the mirrors 88d to 88f. Corresponds to a “second optical system”. Further, the mirrors 88e and 88f correspond to a “third optical system”. Further, the CPU 101 of the control apparatus 100 that executes the processes of S210, S220, S250, and S260 of the mounting process of FIG. 8 corresponds to “imaging control means”, and the CPU 101 of the control apparatus 100 that executes the mounting confirmation process of FIG. This corresponds to “determination means”.

In addition, this invention is not limited to the Example mentioned above at all, and as long as it belongs to the technical scope of this invention, it cannot be overemphasized that it can implement with a various aspect.

The present invention can be used in the manufacturing industry of component mounters.

DESCRIPTION OF SYMBOLS 1 Component mounting system, 10 Component mounting apparatus, 12 Housing | casing, 20 Component supply apparatus, 22 Tape feeder, 22a Reel, 30 Substrate conveyance apparatus, 32 Belt conveyor apparatus, 40 Backup apparatus, 50 XY robot, 52,56 Guide rail, 54 X-axis slider, 55 X-axis actuator, 58 Y-axis slider, 59 Y-axis actuator, 60 head unit, 61 suction nozzle, 62 nozzle holder, 62a upper end, 62b flange, 64 rotary head, 64a reflector, 65 spring (Coil spring), 66 R-axis actuator, 67 rotary shaft, 68 drive motor, 69 Q-axis actuator, 70 Z-axis actuator, 72 ball screw nut, 74 screw shaft, 76 Z-axis slider, 77 lever part, 78 drive motor, 79 Solenoid valve, 80 Side camera, 82 Camera body, 82 Image sensor, 84 Optical system, 86a Left entrance port, 86b Right entrance port, 86c Upper entrance port, 86d Camera connection port, 87 Light emitter, 88a-88f Mirror, 90 parts camera, 92 mark Camera, 94 nozzle stocker, 100 control device, 101, 111 CPU, 102, 112 ROM, 103, 113 HDD, 104, 114 RAM, 105, 115 I / O interface, 106, 116 bus, 110 management device, 117 input device, 118 Display, A0 mounting position, A1 Position immediately before mounting, A2 Position immediately after mounting, P component, S board.

Claims (8)

A component mounter that holds components and mounts them on the surface of a board,
A head having a nozzle capable of holding the component at a nozzle tip;
Horizontal moving means for moving the head in a horizontal direction with respect to the substrate surface;
Vertical movement means for moving the nozzle in a direction perpendicular to the substrate surface;
The head is moved by the horizontal moving means so that the nozzle is positioned above the mounting position on the surface of the substrate, and the nozzle is lowered by the vertical moving means, whereby the component held by the nozzle is moved to the substrate. Mounting control means for performing mounting operation to be mounted at the mounting position on the surface;
An imaging means provided on the head, for imaging the imaging object by receiving incident light from the direction of the imaging object on an imaging device via an optical system;
With
The optical system includes: a first optical system that guides incident light from the side surface direction of the nozzle tip to the first region of the imaging element; and the substrate surface in a state where the nozzle is above the substrate surface. A second optical system for guiding incident light from the direction to the second region of the image sensor,
The imaging means is configured to display a side image of a nozzle tip portion and an image of the substrate surface, which may include at least a part of a component held by the nozzle, and the first optical system and the second optical system, respectively. A component mounter characterized in that imaging is possible via The component mounting machine according to claim 1,
The head is a rotary head in which a plurality of nozzles are arranged in the circumferential direction, and the plurality of nozzles can be swung in the circumferential direction,
The mounting control means moves the head so that the mounting target nozzle is located above the mounting position on the substrate surface among the plurality of nozzles by the horizontal moving means, and lowers the mounting target nozzle by the vertical moving means. By performing the mounting operation to mount the component held by the mounting target nozzle at the mounting position on the substrate surface,
The imaging means includes a side image of a tip portion of a pre-mounting nozzle that performs a component mounting operation after the mounting target nozzle and a side image of a tip portion of a post-mounting nozzle that performs a component mounting operation before the mounting target nozzle. A first image that is at least one of the second image and a second image that is an image of the substrate surface when the mounting target nozzle performs a component mounting operation, respectively, and the first optical system and the second optical system, respectively. A component mounter that can be imaged via The component mounting machine according to claim 2,
The optical system includes a third optical system that guides incident light from the direction of the mounting target nozzle to a third region of the imaging element,
The imaging unit is configured to display the first image, the second image, and the third image that is an image of the mounting target nozzle, respectively, the first optical system, the second optical system, and the third image. A component mounter capable of imaging through an optical system. The component mounting machine according to any one of claims 1 to 3,
Imaging that controls the imaging unit so that an image of the substrate surface is captured at a first timing when a component held by the nozzle contacts the substrate surface when the nozzle is lowered by the vertical movement unit A component mounting machine comprising a control means. The component mounting machine according to claim 4,
The imaging control means controls the imaging means so that a side image of the tip portion of the nozzle after performing a component mounting operation after the first timing is taken,
Whether or not the nozzle has successfully mounted the component based on the image of the substrate surface imaged at the first timing and the side image of the tip of the nozzle imaged after the first timing. A component mounter comprising a determination means for determining. The component mounting machine according to any one of claims 1 to 4,
An imaging control means for controlling the imaging means so that an image of the surface of the substrate is taken at a second timing when the nozzle is moved up by a predetermined amount by the vertical movement means after the nozzle performs a component mounting operation; A component mounting machine characterized by comprising. The component mounting machine according to claim 6,
The imaging control means controls the imaging means so that a side image of the tip of the nozzle before performing a component mounting operation is taken before the second timing,
Whether or not the nozzle has successfully mounted the component based on the image of the substrate surface imaged at the second timing and the side image of the tip of the nozzle imaged before the second timing A component mounter comprising: a determination unit that determines A component mounter that holds components and mounts them on the surface of a board,
A plurality of nozzles arranged in the circumferential direction, and a rotary type head capable of turning the plurality of nozzles in the circumferential direction;
Horizontal moving means for moving the head in a horizontal direction with respect to the substrate surface;
Vertical movement means for moving the nozzle in a direction perpendicular to the substrate surface;
By moving the head so that the mounting target nozzle is located above the mounting position on the substrate surface by the horizontal moving means, and lowering the mounting target nozzle by the vertical moving means, the mounting A mounting control means for performing a mounting operation for mounting the component held by the target nozzle on the mounting position of the substrate surface;
Imaging means provided in the head;
With
The imaging means includes a side image of a tip portion of a pre-mounting nozzle that performs a component mounting operation after the mounting target nozzle and a side image of a tip portion of a post-mounting nozzle that performs a component mounting operation before the mounting target nozzle. A component mounter capable of capturing at least one of the image and an image of the substrate surface when the mounting target nozzle performs a component mounting operation.