JP2006086359A - Multilayer ceramic capacitor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multilayer ceramic capacitor having superior heat dissipation capacity. <P>SOLUTION: The multilayer ceramic capacitor includes a parallelopiped multilayer chip 11, on which two first internal electrodes 12 present in the same layer and a common internal electrode 13 present in a layer different from the layer with the first electrodes 12 present are provided alternately via a ceramic layer (not numbered) and facing each other; two first external electrodes 14 provided on both sides of the lower surface of the multilayer chip 11 and one second external electrode 15 provided at the center of the lower surface without contacting the first external electrodes 14; and a heat-dissipating conductor 16 provided on the upper surface of the multilayer chip 11 and connecting to the upper edge of the common internal electrode 13. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a multilayer ceramic capacitor having a plurality of internal electrodes facing each other in a multilayer chip.

  1 to 3 show a conventional multilayer ceramic capacitor disclosed in JP-A-11-288838. 1 is a perspective view of the multilayer ceramic capacitor, FIG. 2 is a sectional view taken along line a1-a1 in FIG. 1, and FIG. 3 is a sectional view taken along line a2-a2 in FIG.

  The multilayer ceramic capacitor is arranged such that a plurality of internal electrodes 1 are opposed to each other with a ceramic layer 2 in a ceramic element having a rectangular parallelepiped shape. The plurality of internal electrodes 1 have a rectangular planar shape, and the lengthwise edges of the internal electrodes 1 are alternately drawn out to one surface 3a and the other surface 3b in the length direction of the ceramic element. ing. An edge of a part of the internal electrode 1 drawn to the surface 3a is connected to one external electrode 4a, and an edge of the remaining internal electrode 1 drawn to the surface 3b is connected to the other external electrode 4b. ing.

  Further, each of the ceramic layers 2 between the adjacent internal electrodes 1 is provided with a heat radiating internal electrode 5 in a non-contact manner with the internal electrode 1. The plurality of internal electrodes 5 for heat dissipation have a cross shape in plan, and the edges in the width direction of the internal electrodes 5 for heat dissipation are drawn out to one surface 6a and the other surface 6b in the width direction of the ceramic element. ing. The edges of all the heat dissipating internal electrodes 5 drawn to the surface 6a are connected to one heat dissipating external electrode 7a, and the edges of all the heat dissipating internal electrodes 5 drawn to the face 6b are the other heat dissipating elements. Connected to the external electrode 7b.

In this multilayer ceramic capacitor, by disposing the heat dissipating internal electrodes 5 between the internal electrodes 1 in the ceramic element in a non-contact manner, and connecting the plurality of heat dissipating internal electrodes 5 to the heat dissipating external electrodes 7a and 7b, The heat of the capacitor itself is released to the outside using the internal electrode 5 for heat dissipation and the external electrodes 7a and 7b for heat dissipation.
Japanese Patent Laid-Open No. 11-288838

  Incidentally, the temperature rise of the multilayer ceramic capacitor mainly depends on the heat generated in the internal electrode 1 when a voltage is applied and the heat transmitted from the mounting substrate to the internal electrode 1 through the external electrodes 4a and 4b.

  The multilayer ceramic capacitor uses a heat dissipating internal electrode 5 disposed in a non-contact manner between the internal electrodes 1 in the ceramic element and heat dissipating external electrodes 7a and 7b connected to the plurality of heat dissipating internal electrodes 5. However, since the ceramic layer 2 exists between the internal electrode 1 and the internal heat radiation electrode 5, the ceramic layer 2 is transferred from the internal electrode 1 to the internal heat radiation electrode 5. It becomes an obstacle to heat.

  That is, since the ceramic layer 2 is an insulating material whose heat conductivity is far lower than that of the conductor such as the internal electrode 1, it is difficult to efficiently transfer the heat of the internal electrode 1 to the internal electrode 5 for heat dissipation. It is difficult to suppress the temperature rise of the multilayer ceramic capacitor without performing the desired heat dissipation.

  The present invention was created in view of the above circumstances, and an object of the present invention is to provide a multilayer ceramic capacitor excellent in heat dissipation capability.

  In order to achieve the above object, a multilayer ceramic capacitor according to the present invention includes a ceramic layer in which two or more first internal electrodes in the same layer and a common internal electrode in a layer different from the layer in which the first internal electrode exists are formed. A rectangular parallelepiped laminated chip arranged alternately and oppositely via each other, two or more first external electrodes provided on one surface of the laminated chip and electrically connected to each first internal electrode, and a laminated chip The at least one second external electrode that is provided in contact with the first external electrode and is in contact with the common internal electrode, and is provided on at least one surface different from the one surface of the multilayer chip, It is characterized by comprising at least one of two or more first internal electrodes, or at least one heat radiating conductor portion conducting with the common internal electrode.

  In the multilayer ceramic capacitor according to the present invention, two or more first internal electrodes existing in the same layer and two or more second internal electrodes existing in a layer different from the layer where the first internal electrode exists include a ceramic layer. A rectangular parallelepiped laminated chip arranged alternately and opposed to each other, two or more first external electrodes provided on one surface of the laminated chip and electrically connected to each first internal electrode, and the laminated chip Two or more second external electrodes which are provided in contact with the first external electrode on one surface and are electrically connected to each second internal electrode, and are provided on at least one surface different from the one surface of the multilayer chip; It is characterized by comprising at least one of the two or more first internal electrodes or at least one heat radiating conductor portion that conducts with at least one of the two or more second internal electrodes.

  According to the multilayer ceramic capacitor, when heat is generated in each internal electrode when a voltage is applied to the multilayer ceramic capacitor after mounting, and when heat from the mounting substrate is transmitted to each internal electrode through each external electrode, this heat is generated. Is directly transmitted from at least one of the first internal electrodes or the common internal electrode, or at least one of the first internal electrodes, or at least one of the second internal electrodes to the heat radiating conductor, and is discharged to the outside from the heat radiating conductor. It will be. In short, the heat of the multilayer ceramic capacitor can be directly and efficiently transmitted to the heat dissipating conductor portion, and the heat of the capacitor itself can be effectively released to the outside to suppress the temperature rise.

  ADVANTAGE OF THE INVENTION According to this invention, the laminated ceramic capacitor excellent in the heat dissipation capability can be provided.

  The above object and other objects, structural features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

[First Embodiment]
4 to 9 show a first embodiment of the present invention. 4 is a perspective view as seen from the upper surface side of the multilayer ceramic capacitor, FIG. 5 is a perspective view as seen from the lower surface side of the multilayer ceramic capacitor, and FIGS. 6 (A) and 6 (B) are the multilayer ceramic capacitor shown in FIG. FIG. 7A and FIG. 7B show the multilayer capacitor shown in FIG. 4 parallel to the xx direction and at a position parallel to the xy direction. FIG. 8 (A) to FIG. 8 (C), FIG. 9 (A), and FIG. 9 (B) are longitudinal sectional views cut along two different lines, and are explanatory diagrams of a method for manufacturing the multilayer ceramic capacitor shown in FIG.

  The multilayer ceramic capacitor 10 of the first embodiment includes a multilayer chip 11 having a rectangular parallelepiped shape. In this multilayer chip 11, two first internal electrodes 12 existing in the same layer and a common internal electrode 13 existing in a layer different from the layer where the first internal electrode 12 exists are alternately arranged via a ceramic layer (not indicated). Moreover, it has the structure arranged oppositely. In the drawing, six layers each including the first internal electrode 12 and six layers including the common internal electrode 13 are alternately stacked. The number of both layers is arbitrarily determined according to the required capacitance. Is set.

  As shown in FIG. 6A, the two first internal electrodes 12 existing in the same layer each have a vertically long rectangle, and a predetermined gap is provided between them. Each first internal electrode 12 has a lead portion 12 a having a predetermined width on one lower end side, and the lower edge of the lead portion 12 a is exposed on the lower surface of the multilayer chip 11. In addition, the upper edge and the side edge of each first internal electrode 12 are at inner positions away from the upper surface of the multilayer chip 11 and one side surface in the yy direction.

  As shown in FIG. 6B, the common internal electrode 13 forms a horizontally long rectangle having a size sufficient to face the two first internal electrodes 12. The common internal electrode 13 has a lead portion 13 a having a predetermined width at the center of the lower end thereof, and the lower edge of the lead portion 13 a is exposed on the lower surface of the laminated chip 11 in a non-contact manner with the lead portion 12 a. Further, the upper edge of the common internal electrode 13 is exposed on the upper surface of the multilayer chip 11, and both side edges are at inner positions away from the two side surfaces of the multilayer chip 11 in the yy direction.

  The first external electrodes 14 are provided in a strip shape in the xx direction on both sides of the lower surface of the multilayer chip 11, and the second external electrodes 15 are not in contact with the two first external electrodes 14 in the center of the lower surface in the xx direction. It is provided in a band shape. 6A and 7A, the lower edge of the lead portion 12a of one first internal electrode 12 is connected to one first external electrode 14 and the other first internal electrode 12 is drawn. The lower edge of the portion 12 a is connected to the other first external electrode 14. As can be seen from FIGS. 6B and 7B, the lower edge of the lead-out portion 13 a of the common internal electrode 13 is connected to the second external electrode 15.

  Further, a heat radiating conductor 16 is provided on the upper surface of the multilayer chip 11 so as to cover the entire upper surface. As can be seen from FIGS. 6B, 7 </ b> A, and 7 </ b> B, the upper edge of the common internal electrode 13 is connected to the heat radiating conductor 16.

  When the multilayer ceramic capacitor 10 is manufactured, first, a conductor paste containing metal powder such as silver or nickel is printed on one surface of an unfired ceramic sheet containing dielectric powder such as barium titanate. The first sheet S11 (see FIG. 8A) on which the unfired internal electrode C11 for the electrode 12 is formed and the conductor paste containing metal powder such as silver or nickel printed on one surface of the unfired ceramic sheet A dummy made of unfired ceramic sheets in which unfired internal electrodes are not formed by alternately stacking a predetermined number of second sheets S12 (see FIG. 8B) on which unfired internal electrodes C12 for internal electrodes 13 are formed. A sheet S13 (see FIG. 8C) is superposed on both sides, and the whole is thermocompression bonded and fired. FIG. 8 shows an unfired ceramic sheet of a size corresponding to one part. In practice, however, an unfired ceramic sheet of a size that can be picked up in large numbers is used, and this is cut into component dimensions after laminating and pressing. Then, the multilayer chip 11 is obtained by firing.

  Next, a conductor paste containing metal powder such as silver or nickel is printed on the upper surface (see FIG. 9A) of the laminated chip 11 obtained by firing to form an unfired heat radiating conductor (not shown). In addition, a conductive paste containing a metal powder such as silver or nickel is printed on the lower surface of the multilayer chip 11 (see FIG. 9B), and two unfired first external electrodes (not shown) and one unfired Second external electrodes (not shown) are formed and subjected to a baking process. Of course, the baking process of the unsintered heat radiation conductor part, the unsintered first external electrode and the unsintered second external electrode can be performed simultaneously with the firing process of the laminated chip.

  In the multilayer ceramic capacitor 10 of the first embodiment, the facing area and the number of stacked layers between one first internal electrode 12 and a part of the common internal electrode 13 between one first external electrode 14 and the second external electrode 15. A predetermined capacitance according to the above can be obtained, and the opposing area of the other first internal electrode 12 and a part of the common internal electrode 13 between the other first external electrode 14 and the second external electrode 15. In addition, a predetermined capacitance according to the number of layers can be obtained. In addition, a predetermined capacitance according to the facing area and the number of stacked layers between the two first internal electrodes 12 and the common internal electrode 13 can be obtained between the two first external electrodes 14 and the common internal electrode 13. . That is, the multilayer ceramic capacitor 10 may be used as a capacitor array in which two capacitors are combined or as a single capacitor depending on the connection form between the two first external electrodes 14 and the one second external electrode 15. it can.

  In this multilayer ceramic capacitor 10, an unnecessary conductor layer does not exist between the two first internal electrodes 12 and the common internal electrode 13, that is, the conventional multilayer ceramic capacitor shown in FIGS. Thus, there is no heat dissipating internal electrode 5 different from the internal electrode 1 between the adjacent internal electrodes 1, so that between the first external electrode 14 and the second external electrode 15, the other first external electrode A desired electrostatic capacity can be stably ensured between the electrode 14 and the second external electrode 15 and between the two first external electrodes 14 and the second external electrode 15.

  In the multilayer ceramic capacitor 10, when heat is generated in the internal electrodes 12 and 13 when a voltage is applied to the multilayer ceramic capacitor 10 after mounting, the heat from the mounting substrate is also transferred to the external electrodes 14 and 15. Is transmitted from the common internal electrode 13 directly to the heat radiating conductor 16 and is released to the outside from the heat radiating conductor 16. In short, by transferring heat to the multilayer ceramic capacitor 10 directly and with high efficiency to the heat radiating conductor portion 16, it is possible to effectively release the heat of the capacitor itself to the outside and reliably suppress the temperature rise. it can. In addition, since a sufficient area can be secured in the heat radiating conductor portion 16, the heat release can be performed more effectively.

  1 to 9 show two first internal electrodes 12 provided in the same layer, but three or more first internal electrodes are provided in the same layer and have a size opposite to these. If an internal electrode is provided, a capacitor array in which three or more capacitors are combined (can be used as a single capacitor) can also be configured. When three or more first internal electrodes are provided, the number of external electrodes increases according to the number of first internal electrodes.

  The number of external electrodes is not necessarily the number of first internal electrodes + 1. For example, a lead-out portion 12a is provided at the center of the lower end of each first internal electrode 12 ′ as in the multilayer ceramic capacitor 10 ′ shown in FIG. The number of external electrodes can be increased arbitrarily by adopting a configuration in which a total of three lead portions 13a are provided at the center of the lower end of the common internal electrode 13 ′ and both sides of the lower end.

  Hereinafter, structural modifications of the first embodiment will be described with reference to FIGS.

  FIGS. 11 to 12 show a first structural modification example. The multilayer ceramic capacitor 10-1 is different from the multilayer ceramic capacitor 10 in that two heat radiating conductor portions 16-1 are connected to the y-y of the multilayer chip 11. FIG. Are provided on two side surfaces in the direction, and both side edges of the common internal electrode 13-1 are exposed on the two side surfaces in the yy direction of the laminated chip 11, and the upper edge is an inner side away from the upper surface of the laminated chip 11. It is in the point which employ | adopted the thing in position and connected both the side edges of this common internal electrode 13-1 to the thermal radiation conductor part 17-1. The manufacturing method and function are the same as those of the multilayer ceramic capacitor 10.

  According to the multilayer ceramic capacitor 10-1, the heat dissipation effect similar to that of the multilayer ceramic capacitor 10 can be obtained by directly and efficiently transmitting the heat of the multilayer ceramic capacitor 10-1 to the heat radiating conductor 16-1. Can be obtained. In this case, the heat radiating conductor portion is continuous with the two side surfaces in the y-y direction and one side surface in the xx direction of the multilayer chip 11 or the two side surfaces in the yy direction of the multilayer chip 11 and the xx direction. It may be provided continuously on the two side surfaces.

  FIGS. 13 to 14 show a second structural modification example. This multilayer ceramic capacitor 10-2 is different from the multilayer ceramic capacitor 10 in that the radiating conductor portion 16-2 is connected to the upper surface of the multilayer chip 11 and yy. It is in the point provided continuously on the two side surfaces of the direction. The manufacturing method and function are the same as those of the multilayer ceramic capacitor 10.

  According to the multilayer ceramic capacitor 10-2, the heat dissipation effect similar to that of the multilayer ceramic capacitor 10 can be obtained by directly and efficiently transmitting the heat of the multilayer ceramic capacitor 10-2 to the heat radiating conductor 16-2. Can be obtained. In this case, the heat radiating conductor portion is continuous with the upper surface of the multilayer chip 11, the two side surfaces in the yy direction, and the one side surface in the xx direction, or the upper surface of the multilayer chip 11 and the two side surfaces in the yy direction. It may be provided continuously on the two side surfaces in the xx direction.

  FIG. 15 shows a third structural modification example. This multilayer ceramic capacitor 10-3 is different from the multilayer ceramic capacitor 10 in that the heat dissipating conductor 16-2 is connected to the top surface of the multilayer chip 11 in the yy direction. An inner position where both side edges of the common internal electrode 13-1 are exposed on the two side surfaces in the yy direction of the multilayer chip 11 and the upper edge is away from the upper surface of the multilayer chip 11. And the both side edges of the common internal electrode 13-1 are respectively connected to the heat radiating conductor 16-2. The manufacturing method and function are the same as those of the multilayer ceramic capacitor 10.

  According to the multilayer ceramic capacitor 10-3, the heat dissipation effect similar to that of the multilayer ceramic capacitor 10 can be obtained by directly and efficiently transmitting the heat of the multilayer ceramic capacitor 10-3 to the heat radiating conductor 16-2. Can be obtained. In this case, the heat radiating conductor portion is continuous with the upper surface of the multilayer chip 11, the two side surfaces in the yy direction, and the one side surface in the xx direction, or the upper surface of the multilayer chip 11 and the two side surfaces in the yy direction. It may be provided continuously on the two side surfaces in the xx direction.

  FIGS. 16 to 17 show a fourth structural modification example. This multilayer ceramic capacitor 10-4 is different from the multilayer ceramic capacitor 10 in that the two radiating conductor portions 16-3 are separated on the upper surface of the multilayer chip 11. FIG. The two heat radiating conductors 16-4 are respectively provided on the two side surfaces of the multilayer chip 11 in the y-y direction, and both side edges of the common chip 13-2 are 2 in the y-y direction of the multilayer chip 11. The one exposed at the side surface and having the upper edges of the two lead portions 13b provided at the upper ends thereof exposed at the upper surface of the multilayer chip 11 is adopted, and both side edges of the common internal electrode 13-2 are connected to the heat radiation conductor portion 16-. 4 and the upper edge of the lead portion 13b is connected to the heat radiating conductor portion 16-3. The manufacturing method and function are the same as those of the multilayer ceramic capacitor 10.

  According to this multilayer ceramic capacitor 10-4, by transferring the heat of the multilayer ceramic capacitor 10-4 directly and highly efficiently to the heat radiating conductors 16-3 and 16-4, A similar heat dissipation effect can be obtained. In this case, the heat radiation conductor portion on the upper surface side is provided continuously with the upper surface of the multilayer chip 11 and one side surface in the xx direction, or continuously with the upper surface of the multilayer chip 11 and two side surfaces in the xx direction. On the other hand, the heat radiation conductor part on the side surface side is continuous with one side surface in the yy direction of the multilayer chip 11 and one side surface in the xx direction, or 1 in the yy direction of the multilayer chip 11. It may be provided continuously on the side surface and the two side surfaces in the xx direction.

[Second Embodiment]
18 to 20 show a second embodiment of the present invention. 18 is a perspective view seen from the upper surface side of the multilayer ceramic capacitor, and FIGS. 19A and 19B are views of the multilayer ceramic capacitor shown in FIG. 18 in two lines parallel to the y-y direction and having different positions. FIG. 20 (A) to FIG. 20 (C) are sectional views for explaining a method of manufacturing the multilayer ceramic capacitor shown in FIG.

  The multilayer ceramic capacitor 20 of the second embodiment includes a multilayer chip 21 having a rectangular parallelepiped shape. In this laminated chip 21, two first internal electrodes 22A and 22B in the same layer and a common electrode 23 in a layer different from the layer in which the first internal electrodes 22A and 22B exist have ceramic layers (no symbol). Via each other and opposite to each other. The number of layers in which the first internal electrodes 22A and 22B exist and the number of layers in which the common internal electrode 23 exists are arbitrarily set according to the required capacitance.

  As shown in FIG. 19A, the two first internal electrodes 22A and 22B each have a vertically long rectangle, and a predetermined gap is provided between them. One first internal electrode 22 </ b> A has a lead portion 22 </ b> Aa having a predetermined width on one lower end side, and the lower edge of the lead portion 22 </ b> Aa is exposed on the lower surface of the multilayer chip 21. Further, the upper edge of one first internal electrode 22A is exposed on the upper surface of the multilayer chip 21, and the side edge is at an inner position away from one side surface of the multilayer chip 21 in the yy direction. The other first internal electrode 22 </ b> B has a lead portion 22 </ b> Ba having a predetermined width on one lower end side, and the lower edge of the lead portion 22 </ b> Ba is exposed on the lower surface of the multilayer chip 21. Further, the upper edge and the side edge of the other first internal electrode 22B are located at the inner positions away from the upper surface of the multilayer chip 21 and one side surface in the yy direction.

  As shown in FIG. 19B, the common internal electrode 23 forms a horizontally long rectangle having a size sufficient to face the two first internal electrodes 22A and 22B. The common internal electrode 23 has a lead portion 23a having a predetermined width at the center of its lower end, and the lower edge of the lead portion 23a is exposed on the lower surface of the laminated chip 21 in a non-contact manner with the lead portions 22Aa and 22Ba. Further, the upper edge and both side edges of the common internal electrode 23 are located at inner positions away from the upper surface of the multilayer chip 21 and the two side surfaces in the yy direction.

  The first external electrodes 24 are provided in a strip shape in the xx direction on both sides of the lower surface of the multilayer chip 21, and the second external electrodes 25 are not in contact with the two first external electrodes 24 in the center of the lower surface in the xx direction. It is provided in a band shape. As can be seen from FIG. 19A, the lower edge of the lead portion 22Aa of one first internal electrode 22A is connected to one first external electrode 24, and the lower edge of the lead portion 22Ba of the other first internal electrode 22B is The other first external electrode 24 is connected. As can be seen from FIG. 19B, the lower edge of the lead portion 23 a of the common internal electrode 23 is connected to the second external electrode 25.

  Further, a heat radiating conductor portion 26 is provided on the upper surface of the multilayer chip 21 so as to cover the entire upper surface. As can be seen from FIG. 19A, the upper edge of one first internal electrode 22 </ b> A is connected to the heat radiating conductor portion 26.

  When the multilayer ceramic capacitor 20 is manufactured, first, a conductor paste containing a metal powder such as silver or nickel is printed on one surface of an unfired ceramic sheet containing a dielectric powder such as barium titanate. The first sheet S21 (see FIG. 20A) on which the unfired internal electrode C21A for the electrode 22A and the unfired internal electrode C21B for the first internal electrode 22B are formed, and silver, nickel, etc. on one surface of the unfired ceramic sheet A predetermined number of second sheets S22 (see FIG. 20B) on which a conductive paste containing the metal powder is printed to form an unfired internal electrode C22 for the common internal electrode 23 are alternately stacked to form an unfired interior. A dummy sheet S23 (see FIG. 20C) made of an unfired ceramic sheet on which no electrode is formed is superposed on both sides, and the whole is thermocompression bonded, Les firing. FIG. 20 shows an unfired ceramic sheet of a size corresponding to one part. In practice, however, an unfired ceramic sheet of a size that can be picked up in large numbers is used, and this is cut into component dimensions after laminating and pressing. Then, the laminated chip 21 is obtained by firing.

  Next, a conductive paste containing metal powder such as silver or nickel is printed on the upper surface of the laminated chip 21 obtained by firing to form an unfired heat radiating conductor (not shown), and the lower surface of the laminated chip 21 A conductive paste containing a metal powder such as silver or nickel is printed on the substrate to form two unfired first external electrodes (not shown) and one unfired second external electrode (not shown), which are baked. Apply. Of course, the baking process of the unsintered heat radiation conductor part, the unsintered first external electrode and the unsintered second external electrode can be performed simultaneously with the firing process of the laminated chip.

  In the multilayer ceramic capacitor 20 of the second embodiment, the facing area and the number of layers between one first internal electrode 22A and a part of the common internal electrode 23 between one first external electrode 24 and the second external electrode 25. A predetermined capacitance according to the above can be obtained, and the opposing area of the other first internal electrode 22B and a part of the common internal electrode 23 between the other first external electrode 24 and the second external electrode 25 In addition, a predetermined capacitance according to the number of layers can be obtained. Further, a predetermined capacitance according to the facing area and the number of stacked layers between the two first internal electrodes 22A and 22B and the common internal electrode 23 is obtained between the two first external electrodes 24 and the common internal electrode 23. Can do. That is, the multilayer ceramic capacitor 20 may be used as a capacitor array in which two capacitors are combined or as a single capacitor depending on the connection form between the two first external electrodes 24 and the one second external electrode 25. it can.

  In this multilayer ceramic capacitor 20, there is no unnecessary conductor layer between the two first internal electrodes 22A, 22B and the common internal electrode 23, that is, the conventional multilayer capacitor shown in FIGS. Since there is no heat dissipating internal electrode 5 different from the internal electrode 1 between the adjacent internal electrodes 1 like a ceramic capacitor, between the first external electrode 24 and the second external electrode 25, A desired capacitance can be stably secured between the first external electrode 24 and the second external electrode 25 and between the two first external electrodes 24 and the second external electrode 25. .

  In the multilayer ceramic capacitor 20, when heat is generated in the internal electrodes 22A, 22B, and 23 when a voltage is applied to the multilayer ceramic capacitor 20 after mounting, the heat from the mounting substrate is also transferred to the external electrodes 24. , 25 is transmitted to the internal electrodes 22A, 22B, 23 from the first internal electrode 22A, directly to the heat radiating conductor 26, and is released to the outside from the heat radiating conductor 26. In short, by transferring heat to the multilayer ceramic capacitor 20 directly and with high efficiency to the heat radiating conductor portion 26, it is possible to effectively release the heat of the capacitor itself to the outside and reliably suppress the temperature rise. it can. In addition, since a sufficient area can be secured in the heat radiating conductor portion 26, the heat release can be performed more effectively.

  18 to 20 show two first internal electrodes 22A and 22B provided in the same layer, but three or more first internal electrodes are provided in the same layer, and the size facing these is shown. If the common internal electrode which has is provided, it can also be comprised as a capacitor | condenser array (it can be used also as an independent capacitor | condenser) which combined the 3 or more capacitor | condenser. When three or more first internal electrodes are provided, the number of external electrodes increases according to the number of first internal electrodes.

  The number of external electrodes is not necessarily the number of first internal electrodes + 1. For example, as shown in the multilayer ceramic capacitor 20 ′ shown in FIG. 21, the external electrodes are led to the center of the lower ends of the first internal electrodes 22A ′ and 22B ′. By adopting a configuration in which the portion 22a is provided and a total of three lead portions 23a are provided at the center of the lower end of the common internal electrode 23 ′ and both sides of the lower end, the number of external electrodes can be arbitrarily increased.

  Hereinafter, structural modifications of the second embodiment will be described with reference to FIGS.

  22 to 23 show a first structural modification example. This multilayer ceramic capacitor 20-1 is different from the multilayer ceramic capacitor 20 in that two radiating conductor portions 26-1 are connected to the y-y of the multilayer chip 21. FIG. Are provided so as to be connected to the first external electrode 24 on the two side surfaces in the direction, and the first inner electrode 22A-1 has an upper edge at an inner position away from the upper surface of the laminated chip 21. It is in. The manufacturing method and function are the same as those of the multilayer ceramic capacitor 20.

  According to the multilayer ceramic capacitor 20-1, the heat radiation effect similar to that of the multilayer ceramic capacitor 20 is achieved by directly and efficiently transmitting the heat of the multilayer ceramic capacitor 20-1 to the heat radiation conductor 26-1. Can be obtained. In this case, each radiating conductor portion is continuous with one side surface in the yy direction and one side surface in the xx direction of the multilayer chip 21 or one side surface in the yy direction of the multilayer chip 21 and xx. It may be provided continuously on the two side surfaces in the direction.

  FIG. 24 shows a second structural modification example. This multilayer ceramic capacitor 20-2 is different from the multilayer ceramic capacitor 20 in that two heat radiating conductor portions 26-1 are arranged in the y-y direction of the multilayer chip 21. FIG. Each side surface is provided so as to be connected to the first external electrode 24, and the side edge of the first internal electrode 22 </ b> A- 2 is exposed on one side surface in the yy direction of the multilayer chip 21, and the upper edge thereof Is employed at an inner position away from the upper surface of the multilayer chip 21, and the side edge of the first internal electrode 22A-2 is connected to one of the heat radiating conductors 26-1, and the other first internal electrode As the electrode 22B-1, one whose side edge is exposed on one side surface in the y-y direction of the multilayer chip 21 is adopted, and the side edge of the first internal electrode 22B-1 is used as the other heat radiating conductor 26-1. It is at the point of connection. The manufacturing method and function are the same as those of the multilayer ceramic capacitor 20.

  According to the multilayer ceramic capacitor 20-2, the heat radiation effect similar to that of the multilayer ceramic capacitor 20 is achieved by directly and efficiently transmitting the heat of the multilayer ceramic capacitor 20-2 to the heat radiation conductor 26-1. Can be obtained. In this case, each radiating conductor portion is continuous with one side surface in the yy direction and one side surface in the xx direction of the multilayer chip 21 or one side surface in the yy direction of the multilayer chip 21 and xx. It may be provided continuously on the two side surfaces in the direction.

  FIG. 25 to FIG. 26 show a third structural modification. The laminated ceramic capacitor 20-3 is different from the laminated ceramic capacitor 20 in that the radiating conductor portion 26-2 is connected to the upper surface of the laminated chip 21 and yy. It is in the point provided continuously on the two side surfaces of the direction. The manufacturing method and function are the same as those of the multilayer ceramic capacitor 10.

  According to the multilayer ceramic capacitor 20-3, the heat dissipation effect similar to that of the multilayer ceramic capacitor 20 can be obtained by directly and efficiently transmitting the heat of the multilayer ceramic capacitor 20-3 to the heat radiation conductor 26-2. Can be obtained. In this case, the heat radiating conductor portion is continuous with the upper surface of the multilayer chip 21, the two side surfaces in the yy direction, and the one side surface in the xx direction, or the upper surface of the multilayer chip 21 and the two side surfaces in the yy direction. It may be provided continuously on the two side surfaces in the xx direction.

  FIG. 27 shows a fourth structural modification example. This multilayer ceramic capacitor 20-4 is different from the multilayer ceramic capacitor 20 in that the heat radiating conductor portion 26-2 is connected to the top surface of the multilayer chip 21 and 2 in the y-y direction. The first inner electrode 22 </ b> A- 3 is continuously provided on the side surface, the side edge of the first internal electrode 22 </ b> A- 3 is exposed on one side surface of the multilayer chip 21 in the y-y direction, and the upper edge is separated from the upper surface of the multilayer chip 21. What is in the inner position is that the side edge of the first internal electrode 22A-3 is connected to the heat radiating conductor 26-2. The manufacturing method and function are the same as those of the multilayer ceramic capacitor 20.

  According to the multilayer ceramic capacitor 20-4, the heat dissipation effect similar to that of the multilayer ceramic capacitor 20 can be obtained by directly and efficiently transmitting the heat of the multilayer ceramic capacitor 20-4 to the heat radiating conductor 26-2. Can be obtained. In this case, the heat radiating conductor portion is continuous with the upper surface of the multilayer chip 21, the two side surfaces in the yy direction, and the one side surface in the xx direction, or the upper surface of the multilayer chip 21 and the two side surfaces in the yy direction. It may be provided continuously on the two side surfaces in the xx direction.

  FIGS. 28 to 29 show a fifth structural modification example. This multilayer ceramic capacitor 20-5 is different from the multilayer ceramic capacitor 20 in that the heat radiation conductor portion 26-3 is separated by two on the upper surface of the multilayer chip 21. FIG. The two heat radiating conductors 26-4 are provided on the two side surfaces of the multilayer chip 21 in the y-y direction so as to be connected to the first external electrode 24, and the first internal electrodes 22A-4 and 22B-2 are provided. The one side edge is exposed on one side surface of the laminated chip 21 in the y-y direction, and the upper edge of the lead portions 22Ab and 22Bb provided on the upper end is exposed on the upper surface of the laminated chip 21. In addition, one side edge of each of the first internal electrodes 22A-4 and 22B-2 is connected to the heat radiating conductor portion 26-4, and the upper edge of each of the lead portions 22Ab and 22Bb is connected to the heat radiating conductor portion 26-3. To the point . The manufacturing method and function are the same as those of the multilayer ceramic capacitor 20.

  According to the multilayer ceramic capacitor 20-5, the heat of the multilayer ceramic capacitor 20-5 is directly and efficiently transmitted to the heat radiating conductors 26-3 and 26-4, so that the multilayer ceramic capacitor 20-5 A similar heat dissipation effect can be obtained. In this case, the radiating conductor portion on the upper surface side is continuously provided on the upper surface of the multilayer chip 21 and one side surface in the xx direction, or continuously on the upper surface of the multilayer chip 21 and two side surfaces in the xx direction. On the other hand, the radiating conductor portion on the side surface side is continuous with one side surface in the yy direction of the multilayer chip 21 and one side surface in the xx direction, or 1 in the yy direction of the multilayer chip 21. It may be provided continuously on the side surface and the two side surfaces in the xx direction.

[Third Embodiment]
30 to 32 show a third embodiment of the present invention. 30 is a perspective view seen from the upper surface side of the multilayer ceramic capacitor, and FIGS. 31A and 31B are views of the multilayer ceramic capacitor shown in FIG. 30 in two lines parallel to the y-y direction and having different positions. FIG. 32 (A) to FIG. 32 (C) are sectional views for explaining a method of manufacturing the multilayer ceramic capacitor shown in FIG.

  A multilayer ceramic capacitor 30 according to the third embodiment includes a multilayer chip 31 having a rectangular parallelepiped shape. In the multilayer chip 31, two first internal electrodes 32A and 32B existing in the same layer and a common electrode 33 existing in a layer different from the layer where the first internal electrodes 32A and 32B exist are ceramic layers (no symbol). Via each other and opposite to each other. The number of layers in which the first internal electrodes 22A and 22B exist and the number of layers in which the common internal electrode 33 exists are arbitrarily set according to the required capacitance.

  As shown in FIG. 31A, the two first internal electrodes 32A and 32B each have a vertically long rectangle, and a predetermined gap is provided between them. One first internal electrode 32 </ b> A has a lead portion 32 </ b> Aa having a predetermined width on one lower end side, and the lower edge of the lead portion 32 </ b> Aa is exposed on the lower surface of the multilayer chip 31. Further, the side edge of one first internal electrode 32 </ b> A is exposed on one side surface in the y-y direction of the multilayer chip 31, and the upper edge is in an inner position away from the upper surface of the multilayer chip 31. The other first internal electrode 32 </ b> B has a lead portion 32 </ b> Ba having a predetermined width on one lower end side, and the lower edge of the lead portion 32 </ b> Ba is exposed on the lower surface of the multilayer chip 31. The side edge of the other first internal electrode 32 </ b> B is exposed on one side surface in the y-y direction of the multilayer chip 31, and the upper edge is at an inner position away from the upper surface of the multilayer chip 31.

  As shown in FIG. 31B, the common internal electrode 33 forms a horizontally long rectangle having a size sufficient to face the two first internal electrodes 32A and 32B. The common internal electrode 33 has a lead portion 33a having a predetermined width at the center of its lower end, and the lower edge of the lead portion 33a is exposed on the lower surface of the laminated chip 31 in a non-contact manner with the lead portions 32Aa and 32Ba. Further, the upper edge of the common internal electrode 33 is exposed on the upper surface of the multilayer chip 31, and both side edges are located at inner positions away from the two side surfaces of the multilayer chip 31 in the yy direction.

  The first external electrodes 34 are provided in a strip shape in the xx direction on both sides of the lower surface of the multilayer chip 31, and the second external electrodes 35 are not in contact with the two first external electrodes 34 in the center of the lower surface in the xx direction. It is provided in a band shape. As can be seen from FIG. 31A, the lower edge of the lead portion 32Aa of one first inner electrode 32A is connected to one first outer electrode 34, and the lower edge of the lead portion 32Ba of the other first inner electrode 32B is The other first external electrode 34 is connected. As can be seen from FIG. 31B, the lower edge of the lead portion 33 a of the common internal electrode 33 is connected to the second external electrode 35.

  Further, a heat radiating conductor 36 is provided on the upper surface of the multilayer chip 31 so as to substantially cover the entire upper surface. As can be seen from FIG. 31B, the upper edge of the common internal electrode 33 is connected to the heat radiating conductor 36. Further, heat radiation conductors 37 are provided on the two side surfaces of the multilayer chip 31 in the yy direction so as to be connected to the first external electrode 34. As can be seen from FIG. 31A, the side edge of one first internal electrode 32A is connected to one heat radiating conductor portion 37, and the side edge of the other first internal electrode 32B is connected to the other heat radiating conductor portion 38. ing. In this case, the radiating conductor 36 on the upper surface side is provided continuously on the upper surface of the multilayer chip 31 and one side surface in the xx direction, or continuously on the upper surface of the multilayer chip 31 and two side surfaces in the xx direction. On the other hand, each of the heat radiation conductors 37 on the side surface side is continuous with one side surface in the yy direction of the multilayer chip 31 and one side surface in the xx direction, or in the yy direction of the multilayer chip 31. May be provided continuously on one side surface and two side surfaces in the xx direction.

  When the multilayer ceramic capacitor 30 is manufactured, first, a conductor paste containing a metal powder such as silver or nickel is printed on one surface of an unfired ceramic sheet containing a dielectric powder such as barium titanate. The first sheet S31 (see FIG. 32A) on which the unfired internal electrode C31A for the electrode 32A and the unfired internal electrode C31B for the first internal electrode 32B are formed, and silver, nickel, etc. on one surface of the unfired ceramic sheet A predetermined number of second sheets S32 (see FIG. 32B) on which a conductive paste containing the metal powder is printed to form the unfired internal electrode C32 for the common internal electrode 33 are alternately stacked, and the unfired interior A dummy sheet S33 (see FIG. 32C) made of an unfired ceramic sheet on which no electrode is formed is superimposed on both sides, and the whole is thermocompression bonded, Les firing. FIG. 32 shows an unfired ceramic sheet of a size corresponding to one part. However, in actuality, an unfired ceramic sheet of a size that can be picked up in large numbers is used, and this is cut into component dimensions after laminating and pressing. Then, the multilayer chip 31 is obtained by firing.

  Next, a conductive paste containing metal powder such as silver or nickel is printed on the upper surface and two side surfaces in the y-y direction of the laminated chip 31 obtained by firing to form an unfired heat radiating conductor (not shown). In addition, a conductor paste containing a metal powder such as silver or nickel is printed on the lower surface of the multilayer chip 31, and two unfired first external electrodes (not shown) and one unfired second external electrode (not shown) These are baked. Of course, the baking process of the unsintered heat radiation conductor part, the unsintered first external electrode and the unsintered second external electrode can be performed simultaneously with the firing process of the laminated chip.

  In the multilayer ceramic capacitor 30 of the third embodiment, the facing area and the number of stacked layers between one first internal electrode 32A and a part of the common internal electrode 33 between one first external electrode 34 and the second external electrode 35. A predetermined capacitance according to the above can be obtained, and the opposing area of the other first internal electrode 32B and a part of the common internal electrode 33 between the other first external electrode 34 and the second external electrode 35. In addition, a predetermined capacitance according to the number of layers can be obtained. Further, a predetermined capacitance according to the facing area and the number of stacked layers of the two first internal electrodes 32A, 32B and the common internal electrode 33 is obtained between the two first external electrodes 34 and the common internal electrode 33. Can do. That is, the multilayer ceramic capacitor 30 may be used as a capacitor array in which two capacitors are combined or as a single capacitor depending on the connection form of the two first external electrodes 34 and the one second external electrode 35. it can.

  In this multilayer ceramic capacitor 30, an unnecessary conductor layer does not exist between the two first internal electrodes 32A, 32B and the common internal electrode 33, that is, the conventional multilayer capacitor shown in FIGS. Since there is no heat dissipating internal electrode 5 different from the internal electrode 1 between the adjacent internal electrodes 1 like a ceramic capacitor, between the first external electrode 34 and the second external electrode 35, A desired capacitance can be stably secured between the first external electrode 34 and the second external electrode 35 and between the two first external electrodes 34 and the second external electrode 35. .

  Further, in this multilayer ceramic capacitor 30, when heat is generated in each of the internal electrodes 32A, 32B, 33 when a voltage is applied to the multilayer ceramic capacitor 30 after mounting, the heat from the mounting substrate is also transferred to each external electrode 34. , 35 is transmitted to the internal electrodes 32A, 32B, 33 from the first internal electrodes 32A, 32B directly to the side heat radiation conductors 37, and from the common internal electrode 33 to the heat radiation conductor on the upper surface side. It is directly transmitted to the portion 36 and is discharged to the outside from the heat radiating conductor portions 36 and 37. In short, by transferring heat directly to the radiating conductors 36 and 37 through the multilayer ceramic capacitor 30 with high efficiency, the heat of the capacitor itself is effectively released to the outside and the temperature rise is reliably suppressed. be able to. In addition, since a sufficient area can be secured for the heat radiating conductor portions 36 and 37, the heat release can be performed more effectively.

  30 to 32 show the case where two first internal electrodes 32A and 32B are provided in the same layer, but three or more first internal electrodes are provided in the same layer, and the size facing these is shown. If the common internal electrode which has is provided, it can also be comprised as a capacitor | condenser array (it can be used also as an independent capacitor | condenser) which combined the 3 or more capacitor | condenser. When three or more first internal electrodes are provided, the number of external electrodes increases according to the number of first internal electrodes.

  The number of external electrodes is not necessarily the number of first internal electrodes + 1. For example, as shown in the multilayer ceramic capacitor 30 ′ shown in FIG. 33, the external electrodes are led to the center of the lower ends of the first internal electrodes 32A ′ and 32B ′. If the configuration in which the portion 32a is provided and a total of three lead portions 33a are provided at the center of the lower end of the common internal electrode 33 ′ and both sides of the lower end is employed, the number of external electrodes can be arbitrarily increased.

  Hereinafter, structural modifications of the third embodiment will be described with reference to FIGS.

  34 to 35 show a first structural modification example. The multilayer ceramic capacitor 30-1 is different from the multilayer ceramic capacitor 30 in that two radiating conductor portions 37-1 are connected to the yy of the multilayer chip 31. FIG. The first outer electrode 34 is provided on two side surfaces in a non-contact manner, and the upper edge of the first inner electrode 32A-1 is exposed on the upper surface of the multilayer chip 31, and the side edge thereof is the multilayer chip 31. Of the first inner electrode 32A-1 is connected to the heat-radiating conductor 36 on the upper surface side, and the side edge is one side. Further, one side edge as the common internal electrode 33-1 is exposed on one side surface in the yy direction of the laminated chip 31, and the upper edge is laminated. Inside position away from the top surface of the chip 31 Adopted what is, lies in connecting the 1-side edge of the common internal electrodes 33-1 to heat conductor portion 37-1 of one side surface side. The manufacturing method and function are the same as those of the multilayer ceramic capacitor 30.

  According to the multilayer ceramic capacitor 30-1, the heat of the multilayer ceramic capacitor 30-1 is transmitted from one first internal electrode 32A-1 to the heat-radiating conductor 36 on the upper surface side, and from the other first internal electrode 32B to the side surface side. The heat radiation effect similar to that of the multilayer ceramic capacitor 30 can be obtained by transmitting to one heat radiation conductor portion 37-1 and transmitting from the common internal electrode 33-1 to the other heat radiation conductor portion 37-1. . In this case, the heat-radiating conductor 36 on the upper surface side is continuously provided on the upper surface of the multilayer chip 31 and one side surface in the xx direction, or continuously on the upper surface of the multilayer chip 31 and two side surfaces in the xx direction. On the other hand, each of the heat radiation conductors 37-1 on the side surface side is continuous with one side surface in the y-y direction and one side surface in the xx direction of the multilayer chip 31, or y of the multilayer chip 31. It may be provided continuously on one side surface in the −y direction and two side surfaces in the xx direction.

  FIG. 36 to FIG. 37 show a second structural modification example. This multilayer ceramic capacitor 30-2 is different from the multilayer ceramic capacitor 30 in that the two radiating conductor portions 36-1 are separated on the upper surface of the multilayer chip 31. FIG. The two heat radiating conductors 37-1 are provided on the two side surfaces in the y-y direction of the multilayer chip 31 in a non-contact manner with the first external electrode 34, respectively, and as the first internal electrodes 32A-1 and 32B-1 The first inner electrodes 32A-1, 32B- are formed by using the one whose upper edge is exposed on the upper surface of the multilayer chip 31 and whose side edge is exposed on one side surface in the yy direction of the multilayer chip 31. 1 is connected to the heat-radiating conductor 36-1 on the upper surface side, and both side edges of the common internal electrode 33-2 are exposed on the two side surfaces in the yy direction of the laminated chip 31, and The upper edge is a laminated chip 3 Adopted what is inside position apart from the upper surface, lies in that connected to the side edges of the common internal electrodes 33-2 to heat conductor portion 37-1. The manufacturing method and function are the same as those of the multilayer ceramic capacitor 30.

  According to this multilayer ceramic capacitor 30-2, the heat of the multilayer ceramic capacitor 30-2 is transferred from one first internal electrode 32A-1 to one heat radiating conductor 36-1 on the upper surface side, and the other first internal electrode The heat radiation similar to that of the multilayer ceramic capacitor 30 is transmitted from 32B-1 to the other heat radiating conductor portion 36-1 on the upper surface side and from the common internal electrode 33-1 to both heat radiating conductor portions 37-1 on the side surface side. An effect can be obtained. In this case, the heat radiation conductor 36-1 on the upper surface side is continuous with the upper surface of the multilayer chip 31 and one side surface in the xx direction, or is continuous with the upper surface of the multilayer chip 31 and two side surfaces in the xx direction. On the other hand, each heat radiation conductor 37-1 on the side surface side is continuous with one side surface in the yy direction and one side surface in the xx direction of the multilayer chip 31, or the multilayer chip 31. May be provided continuously on one side surface in the y-y direction and two side surfaces in the xx direction.

[Fourth Embodiment]
38 to 40 show a fourth embodiment of the present invention. FIG. 38 is a perspective view seen from the upper surface side of the multilayer ceramic capacitor, and FIGS. 39A and 39B are views of the multilayer ceramic capacitor shown in FIG. 38 in two lines parallel to the y-y direction and different in position. FIG. 40 (A) to FIG. 40 (C), which are cut longitudinal sectional views, are diagrams for explaining a method of manufacturing the multilayer ceramic capacitor shown in FIG.

  The multilayer ceramic capacitor 40 of the fourth embodiment includes a multilayer chip 41 having a rectangular parallelepiped shape. This laminated chip 41 includes two first internal electrodes 42A and 42B in the same layer and two second internal electrodes 43 in a layer different from the layer in which the first internal electrodes 42A and 42B exist. And a configuration in which they are arranged alternately and face each other. The number of layers in which the first internal electrodes 42A and 42B exist and the number of layers in which the second internal electrodes 43 exist are arbitrarily set according to the required capacitance.

  As shown in FIG. 39A, the two first internal electrodes 42A and 42B each have a vertically long rectangle, and a predetermined gap is provided between them. One first internal electrode 42 </ b> A has a leading portion 42 </ b> Aa having a predetermined width on one lower end side, and the lower edge of the leading portion 42 </ b> Aa is exposed on the lower surface of the multilayer chip 41. The upper edge of one first internal electrode 42A is exposed on the upper surface of the multilayer chip 41, and the side edge is at an inner position away from one side surface of the multilayer chip 41 in the yy direction. The other first internal electrode 42 </ b> B has a lead portion 42 </ b> Ba having a predetermined width on one lower end side, and the lower edge of the lead portion 42 </ b> Ba is exposed on the lower surface of the multilayer chip 41. The upper edge of the other first internal electrode 42B is at an inner position away from the upper surface of the multilayer chip 41, and the side edge is at an inner position away from one side surface of the multilayer chip 41 in the yy direction.

  As shown in FIG. 39B, the two second internal electrodes 43 each have a vertically long rectangle, and a predetermined gap is provided between them. Each second internal electrode 43 has a lead portion 43a having a predetermined width on one lower end side, and the lower edge of the lead portion 43a is exposed on the lower surface of the laminated chip 41 in a non-contact manner with the lead portions 42Aa and 42Ba. Further, the upper edge of each second internal electrode 43 is at an inner position away from the upper surface of the multilayer chip 41, and the side edge is at an inner position away from one side surface of the multilayer chip 41 in the yy direction.

  Two first external electrodes 44 are provided in a strip shape in the xx direction on the lower surface of the multilayer chip 41, and the two second external electrodes 45 are arranged in an x− direction so as to be alternately arranged with a distance from the first external electrode 46. It is provided in a strip shape in the x direction. As can be seen from FIG. 39A, the lower edge of the lead portion 42Aa of one first inner electrode 42A is connected to one first outer electrode 44, and the lower edge of the lead portion 42Ba of the other first inner electrode 42B is The other first external electrode 44 is connected. As can be seen from FIG. 39B, the lower edge of the lead portion 43a of one second internal electrode 43 is connected to one second external electrode 45, and the lower edge of the lead portion 43a of the other second internal electrode 43 is The other second external electrode 45 is connected.

  Further, a heat radiating conductor portion 46 is provided on the upper surface of the multilayer chip 41 so as to cover the entire upper surface. As can be seen from FIG. 39A, the upper edge of one first internal electrode 42A is connected to the heat radiating conductor 46.

  In manufacturing the multilayer ceramic capacitor 40, first, a conductor paste containing a metal powder such as silver or nickel is printed on one surface of an unfired ceramic sheet containing a dielectric powder such as barium titanate. The first sheet S41 (see FIG. 40A) on which the unfired internal electrode C41A for the electrode 42A and the unfired internal electrode C41B for the first internal electrode 42B are formed, and silver, nickel, etc. on one surface of the unfired ceramic sheet The second sheet S42 (see FIG. 40B) on which the conductive paste containing the metal powder is printed to form the two unfired internal electrodes C42 for the second internal electrodes 43 is alternately stacked a predetermined number of times, A dummy sheet S43 (see FIG. 40C) made of an unfired ceramic sheet on which unfired internal electrodes are not formed is superposed on both sides, and the whole is hot-pressed. And, I fired it. FIG. 40 shows an unfired ceramic sheet of a size corresponding to one part. In practice, however, an unfired ceramic sheet of a size that allows multiple pieces is used, and this is cut into component dimensions after laminating and pressing. Then, the laminated chip 41 is obtained by firing.

  Next, a conductive paste containing metal powder such as silver or nickel is printed on the upper surface of the laminated chip 41 obtained by firing to form an unfired heat radiating conductor (not shown), and the lower surface of the laminated chip 41 A conductive paste containing a metal powder such as silver or nickel is printed on the substrate to form two unfired first external electrodes (not shown) and two unfired second external electrodes (not shown), and these are baked. Apply. Of course, the baking process of the unsintered heat radiation conductor part, the unsintered first external electrode and the unsintered second external electrode can be performed simultaneously with the firing process of the laminated chip.

  The multilayer ceramic capacitor 40 according to the fourth embodiment includes an opposing area between one first internal electrode 42A and one second internal electrode 43 between one first external electrode 44 and one second external electrode 45. A predetermined capacitance according to the number of stacked layers can be obtained, and the other first internal electrode 42B and the other second internal electrode 43 are provided between the other first external electrode 44 and the other second external electrode 45. A predetermined capacitance according to the facing area and the number of stacked layers can be obtained. That is, the multilayer ceramic capacitor 40 can be used as a capacitor array in which two capacitors are combined. Of course, a capacitance equal to the sum of the capacitances of the two capacitors can be obtained between the two first external electrodes 44 and the two second external electrodes 45.

  In this multilayer ceramic capacitor 40, an unnecessary conductor layer does not exist between the two first internal electrodes 42A and 42B and the two second internal electrodes 43, that is, as shown in FIGS. Since there is no heat dissipating internal electrode 5 different from the internal electrode 1 between the adjacent internal electrodes 1 as in the conventional multilayer ceramic capacitor, there is no difference between one first external electrode 44 and one second external electrode 45. A desired electrostatic capacity can be stably ensured between the first external electrode 44 and the second external electrode 45 on the other side.

  In the multilayer ceramic capacitor 40, when heat is generated in each of the internal electrodes 42A, 42B, 43 when a voltage is applied to the multilayer ceramic capacitor 40 after mounting, the heat from the mounting substrate is also transferred to each external electrode 44. , 45 is transmitted to the internal electrodes 42A, 42B, 43 from the one first internal electrode 42A directly to the heat radiating conductor 46 and released from the heat radiating conductor 46 to the outside. In short, by transferring heat to the multilayer ceramic capacitor 40 directly and with high efficiency to the heat radiating conductor portion 46, it is possible to effectively release the heat of the capacitor itself to the outside and reliably suppress the temperature rise. it can. In addition, since a sufficient area can be secured in the heat radiating conductor 46, the heat release can be performed more effectively.

  In FIGS. 38 to 40, two first internal electrodes 42A and 42B are provided in the same layer and two second internal electrodes 43 are provided in a different layer. If the above first internal electrodes are provided and three or more second internal electrodes are provided on a different layer so as to face each first internal electrode, a capacitor array in which three or more capacitors are combined is configured. You can also When three or more first internal electrodes and second internal electrodes are provided, the number of external electrodes increases according to the number of first internal electrodes and second internal electrodes.

  38 to 40, one first internal electrode 42A and one second internal electrode 43 are opposed to each other, and the other first internal electrode 42B and the other second internal electrode 43 are opposed to each other. For example, like the multilayer ceramic capacitor 40 ′ shown in FIG. 41, the width of one first internal electrode 42A ′ is reduced and the width of the other first internal electrode 42B ′ is increased. If the first internal electrode 42B ′ is configured to face the two second internal electrodes 43, the capacitance obtained between one first external electrode 44 and one second external electrode 45, and the other The capacitance obtained between the first external electrode 44 and the other second external electrode 45 can also be changed. In this case, the heat radiating conductor portion 46 'may be connected to the first internal electrode 42B' or the first internal electrode 42A.

  Hereinafter, structural modifications of the fourth embodiment will be described with reference to FIGS.

  42 to 43 show a first structural modification example. The laminated ceramic capacitor 40-1 is different from the laminated ceramic capacitor 40 in that the radiating conductor portion 46-1 is arranged in the y-y direction of the laminated chip 41. FIG. It is provided on one side surface so as to be connected to one first external electrode 44, and the upper edge of one first internal electrode 42A-1 is at an inner position away from the upper surface of the laminated chip 41, and its side edge However, the one exposed on one side surface in the y-y direction of the multilayer chip 41 is adopted, and the side edge of the first internal electrode 42a-1 is connected to the heat radiating conductor 46-1. The manufacturing method and function are the same as those of the multilayer ceramic capacitor 40.

  According to the multilayer ceramic capacitor 40-1, the heat radiation effect similar to that of the multilayer ceramic capacitor 40 can be obtained by directly and efficiently transmitting the heat of the multilayer ceramic capacitor 40-1 to the heat radiating conductor 46-1. Can be obtained. In this case, the heat radiating conductor portion is continuous with one side surface in the yy direction and one side surface in the xx direction of the multilayer chip 41 or one side surface in the yy direction of the multilayer chip 41 and the xx direction. Further, the laminated chip 41 may be provided continuously on one side surface in the yy direction, two side surfaces in the xx direction, and one remaining side surface in the yy direction. .

  44 to 45 show a second structural modification example. The laminated ceramic capacitor 40-2 is different from the laminated ceramic capacitor 40 in that the radiating conductor portion 46-2 is connected to the upper surface of the laminated chip 41 and yy. It is in the point provided continuously on the two side surfaces of the direction. The manufacturing method and function are the same as those of the multilayer ceramic capacitor 40.

  According to the multilayer ceramic capacitor 40-2, the heat radiation effect similar to that of the multilayer ceramic capacitor 40 can be obtained by directly and efficiently transmitting the heat of the multilayer ceramic capacitor 40-2 to the heat radiation conductor 46-2. Can be obtained. In this case, the heat radiating conductor portion is continuous with the upper surface of the multilayer chip 41, two side surfaces in the yy direction, and one side surface in the xx direction, or the upper surface of the multilayer chip 41 and two side surfaces in the yy direction. It may be provided continuously on the two side surfaces in the xx direction.

  FIG. 46 shows a third structural modification example. This multilayer ceramic capacitor 40-3 is different from the multilayer ceramic capacitor 40 in that the heat radiating conductor portion 46-2 is connected to the top surface of the multilayer chip 41 in the yy direction. The first inner electrode 42 </ b> A- 2 is continuously provided on the side surface, and the side edge of the first internal electrode 42 </ b> A- 2 is exposed on one side surface in the yy direction of the multilayer chip 41, and the upper edge is separated from the upper surface of the multilayer chip 41. What is in the inner position is that the side edge of the first internal electrode 42A-2 is connected to the heat radiating conductor portion 46-2. The manufacturing method and function are the same as those of the multilayer ceramic capacitor 40.

  According to the multilayer ceramic capacitor 40-3, the heat dissipation effect similar to that of the multilayer ceramic capacitor 40 can be obtained by directly and efficiently transmitting the heat of the multilayer ceramic capacitor 40-3 to the heat radiating conductor portion 46-2. Can be obtained. In this case, the heat radiating conductor portion is continuous with the upper surface of the multilayer chip 41, two side surfaces in the yy direction, and one side surface in the xx direction, or the upper surface of the multilayer chip 41 and two side surfaces in the yy direction. It may be provided continuously on the two side surfaces in the xx direction.

[Fifth Embodiment]
47 to 49 show a fifth embodiment of the present invention. 47 is a perspective view seen from the upper surface side of the multilayer ceramic capacitor, and FIGS. 48A and 48B are views of the multilayer ceramic capacitor shown in FIG. 47 in two lines parallel to the y-y direction and having different positions. FIG. 49A to FIG. 49C are sectional views of the laminated ceramic capacitor shown in FIG.

  A multilayer ceramic capacitor 50 according to the fourth embodiment includes a multilayer chip 51 having a rectangular parallelepiped shape. In this multilayer chip 51, two first internal electrodes 52 that exist in the same layer and two second internal electrodes 53 that exist in a layer different from the layer in which the first internal electrode 52 exists include a ceramic layer (no symbol). Via each other and opposite to each other. The number of layers in which the first internal electrodes 52 exist and the number of layers in which the second internal electrodes 53 exist are arbitrarily set according to the required capacitance.

  As shown in FIG. 48A, the two first internal electrodes 52 each have a vertically long rectangle, and a predetermined gap is provided between them. Each first internal electrode 52 has a lead portion 52 a having a predetermined width on one lower end side, and the lower edge of the lead portion 52 a is exposed on the lower surface of the multilayer chip 51. Further, the upper edge of each first internal electrode 52 is exposed on the upper surface of the multilayer chip 51, and the side edge is at an inner position away from one side surface of the multilayer chip 51 in the yy direction.

  As shown in FIG. 48B, the two second internal electrodes 53 each have a vertically long rectangle, and a predetermined gap is provided between them. Each second internal electrode 53 has a leading portion 53a having a predetermined width on one lower end side, and the lower edge of the leading portion 53a is exposed on the lower surface of the multilayer chip 51 in a non-contact manner with the leading portion 52a. The upper edge of each second internal electrode 53 is at an inner position away from the upper surface of the multilayer chip 51, and the side edge is at an inner position away from one side surface of the multilayer chip 51 in the yy direction.

  Two first external electrodes 54 are provided in a strip shape in the xx direction on the lower surface of the multilayer chip 51, and the two second external electrodes 55 are arranged in an alternating manner with the first external electrodes 54 at intervals. It is provided in a strip shape in the x direction. As can be seen from FIG. 48A, the lower edge of the lead portion 52a of one first internal electrode 52 is connected to one first external electrode 54, and the lower edge of the lead portion 52a of the other first internal electrode 52 is The other first external electrode 54 is connected. 48B, the lower edge of the lead portion 53a of one second internal electrode 53 is connected to one second external electrode 55, and the lower edge of the lead portion 53a of the other second internal electrode 53 is The other second external electrode 54 is connected.

  Further, two heat radiating conductors 56 are provided on the upper surface of the multilayer chip 51 so as to be separated from each other. As can be seen from FIG. 48A, the upper edge of one first internal electrode 52 is connected to one heat radiating conductor 56, and the upper edge of the other first internal electrode 52 is connected to the other heat radiating conductor 56. ing.

  When manufacturing the multilayer ceramic capacitor 50, first, a conductive paste containing a metal powder such as silver or nickel is printed on one surface of an unfired ceramic sheet containing a dielectric powder such as barium titanate. A first sheet S51 (see FIG. 49A) on which two unfired internal electrodes C51 for the electrode 52 are formed, and a conductor paste containing metal powder such as silver or nickel are printed on one surface of the unfired ceramic sheet. A predetermined number of second sheets S52 (see FIG. 49B) on which two unfired internal electrodes C52 for the second internal electrode 53 are formed are alternately stacked to form unfired internal electrodes. A dummy sheet S53 (see FIG. 49C) made of a ceramic sheet is superposed on both sides, and the whole is thermocompression bonded and fired. FIG. 49 shows an unfired ceramic sheet of a size corresponding to one part. However, in practice, an unfired ceramic sheet of a size that can be picked up in large numbers is used, and this is cut into component dimensions after laminating and pressing. Then, the laminated chip 51 is obtained by firing.

  Next, a conductive paste containing metal powder such as silver or nickel is printed on the upper surface of the laminated chip 51 obtained by firing to form two unfired heat radiating conductor portions (not shown), and the laminated chip 51 A conductor paste containing a metal powder such as silver or nickel is printed on the lower surface of the substrate to form two unfired first external electrodes (not shown) and two unfired second external electrodes (not shown). A baking process is performed. Of course, the baking process of the unsintered heat radiation conductor part, the unsintered first external electrode and the unsintered second external electrode can be performed simultaneously with the firing process of the laminated chip.

  The multilayer ceramic capacitor 50 according to the fifth embodiment includes an opposing area between one first internal electrode 52 and one second internal electrode 53 between one first external electrode 54 and one second external electrode 55. A predetermined capacitance according to the number of stacked layers can be obtained, and the other first internal electrode 52 and the other second internal electrode 53 are provided between the other first external electrode 54 and the other second external electrode 55. A predetermined capacitance according to the facing area and the number of stacked layers can be obtained. That is, the multilayer ceramic capacitor 50 can be used as a capacitor array in which two capacitors are combined. Of course, a capacitance equal to the sum of the capacitances of the two capacitors can be obtained between the two first external electrodes 54 and the two second external electrodes 55.

  In this multilayer ceramic capacitor 50, an unnecessary conductor layer does not exist between the two first internal electrodes 52 and the two second internal electrodes 53, that is, the conventional ceramic capacitor 50 shown in FIGS. Since there is no heat radiating internal electrode 5 different from the internal electrode 1 between the adjacent internal electrodes 1 as in the case of a multilayer ceramic capacitor, between one first external electrode 54 and one second external electrode 55 The desired capacitance can be stably ensured between the other first external electrode 54 and the other second external electrode 55.

  In the multilayer ceramic capacitor 50, when heat is generated in the internal electrodes 52 and 53 when a voltage is applied to the multilayer ceramic capacitor 50 after mounting, the heat from the mounting substrate is also transferred to the external electrodes 54 and 55. When the heat is transmitted from the first internal electrodes 52 to the internal electrodes 52, 53, the heat is directly transmitted from the first internal electrodes 52 to the heat radiating conductors 56 and released from the heat radiating conductors 56 to the outside. In short, by transferring heat to the multilayer ceramic capacitor 50 directly and with high efficiency to the heat radiating conductor 56, it is possible to effectively release the heat of the capacitor itself to the outside and reliably suppress the temperature rise. it can. In addition, since a sufficient area can be secured in the heat radiating conductor portion 56, the heat release can be performed more effectively.

  47 to 49, two first internal electrodes 52 are provided in the same layer, and two second internal electrodes 53 are provided in a different layer, but three or more are provided in the same layer. If a first internal electrode is provided and three or more second internal electrodes are provided on a different layer so as to face each first internal electrode, a capacitor array in which three or more capacitors are combined may be configured. it can. When three or more first internal electrodes and second internal electrodes are provided, the number of external electrodes increases according to the number of first internal electrodes and second internal electrodes.

  Hereinafter, structural modifications of the fifth embodiment will be described with reference to FIGS. 50 to 56.

  50 to 51 show a first structural modification example. The laminated ceramic capacitor 50-1 is different from the laminated ceramic capacitor 50 in that two radiating conductor portions 56-1 are connected to the y-y of the laminated chip 51. FIG. Are provided so as to be connected to the first external electrode 54 on the two side surfaces in the direction, and the upper edge of the first internal electrode 52-1 is located at the inner position away from the upper surface of the multilayer chip 51, and the side The one whose edge is exposed on one side surface in the y-y direction of the multilayer chip 51 is adopted, the side edge of the first internal electrode 52-1 is connected to one heat radiation conductor portion 56-1, and the other As the first internal electrode 52-2, an electrode whose upper edge is at an inner position away from the upper surface of the multilayer chip 51 and whose side edge is exposed on one side surface in the yy direction of the multilayer chip 51 is adopted. The first internal electrode 52 A point of connecting the second side edge to the other heat conductor portion 56-1 is a two second external electrodes 55 between the two first outer electrode 54 in that spaced apart. The manufacturing method and function are the same as those of the multilayer ceramic capacitor 50.

  According to the multilayer ceramic capacitor 50-1, the heat dissipation effect similar to that of the multilayer ceramic capacitor 50 is achieved by directly and efficiently transmitting the heat of the multilayer ceramic capacitor 50-1 to the heat dissipation conductor portion 56-1. Can be obtained. In this case, each radiating conductor portion is continuous with one side surface in the yy direction and one side surface in the xx direction of the multilayer chip 51 or one side surface in the yy direction of the multilayer chip 51 and xx. It may be provided continuously on the two side surfaces in the direction.

  FIG. 52 shows a second structural modification example. This multilayer ceramic capacitor 50-2 is different from the multilayer ceramic capacitor 50 in that two radiating conductor portions 56-1 are arranged in the y-y direction of the multilayer chip 51. Each side surface is provided so as to be connected to the first external electrode 54, and the upper edge of the first internal electrode 52-3 is located at an inner position away from the upper surface of the multilayer chip 51, and the side edge is laminated. The chip 51 has an inner position away from one side surface in the y-y direction, and the upper edge of the other first internal electrode 52-4 is at an inner position away from the upper surface of the multilayer chip 51. In addition, two second external electrodes 55 are provided between the two first external electrodes 54 and the point that the side edge is located at an inner position away from one side surface in the y-y direction of the multilayer chip 51. Interval Lies in that provided Te. The manufacturing method and function are the same as those of the multilayer ceramic capacitor 50.

  According to the multilayer ceramic capacitor 50-2, the heat radiation effect similar to that of the multilayer ceramic capacitor 50 is achieved by directly and efficiently transmitting the heat of the multilayer ceramic capacitor 50-2 to the heat radiation conductor portion 56-1. Can be obtained. In this case, each radiating conductor portion is continuous with one side surface in the yy direction and one side surface in the xx direction of the multilayer chip 51 or one side surface in the yy direction of the multilayer chip 51 and xx. It may be provided continuously on the two side surfaces in the direction.

  53 to 54 show a third structural modification example. The laminated ceramic capacitor 50-3 is different from the laminated ceramic capacitor 50 in that two heat radiating conductor portions 56-2 are connected to the upper surface of the laminated chip 51 and y. Two second external electrodes 55 are spaced between two first external electrodes 54 and a point provided so as to be connected to the first external electrode 54 continuously on one side surface in the −y direction. It is in the point provided. The manufacturing method and function are the same as those of the multilayer ceramic capacitor 10.

  According to the multilayer ceramic capacitor 50-3, the heat dissipation effect similar to that of the multilayer ceramic capacitor 50 is achieved by directly and efficiently transmitting the heat of the multilayer ceramic capacitor 50-3 to the heat radiating conductor portion 56-2. Can be obtained. In this case, each radiating conductor portion is continuous with the upper surface of the multilayer chip 51, one side surface in the yy direction, and one side surface in the xx direction, or the upper surface of the multilayer chip 51 and one side surface in the yy direction. And may be provided continuously on two side surfaces in the xx direction.

  FIG. 55 shows a fourth structural modification example. This multilayer ceramic capacitor 50-4 is different from the multilayer ceramic capacitor 50 in that two radiating conductor portions 56-2 are arranged on the top surface of the multilayer chip 51 in the yy direction. Are provided so as to be connected to the first external electrode 54 and to be connected to the first external electrode 54, and the upper edge of the first internal electrode 52-1 is located at an inner position away from the upper surface of the multilayer chip 51, In addition, the one whose side edge is exposed on one side surface in the y-y direction of the multilayer chip 51 is adopted, and the side edge of the first internal electrode 52-1 is connected to one heat radiation conductor part 56-2, Furthermore, as the other first internal electrode 52-2, the upper edge is at an inner position away from the upper surface of the multilayer chip 51, and the side edge is exposed on one side surface of the multilayer chip 51 in the yy direction. Adopting the first The side edge of the partial electrode 52-2 is connected to the other heat radiating conductor portion 56-2, and two second external electrodes 55 are provided between the two first external electrodes 54 with a space therebetween. . The manufacturing method and function are the same as those of the multilayer ceramic capacitor 50.

  According to the multilayer ceramic capacitor 50-4, the heat dissipation effect similar to that of the multilayer ceramic capacitor 50 can be obtained by directly and efficiently transmitting the heat of the multilayer ceramic capacitor 50-4 to the heat radiating conductor 56-2. Can be obtained. In this case, each radiating conductor portion is continuous with the upper surface of the multilayer chip 51, one side surface in the yy direction, and one side surface in the xx direction, or the upper surface of the multilayer chip 51 and one side surface in the yy direction. And may be provided continuously on two side surfaces in the xx direction.

  FIG. 56 shows a fifth structural modification example. This multilayer ceramic capacitor 50-5 is different from the multilayer ceramic capacitor 50 in that two heat radiating conductor portions 56-2 are arranged on the top surface of the multilayer chip 51 in the yy direction. Are provided so as to be connected to the first external electrode 54 and connected to the first external electrode 54, and the upper edge of the first internal electrode 52-3 is located at an inner position away from the upper surface of the multilayer chip 51, In addition, the one whose side edge is at the inner position away from one side surface in the y-y direction of the multilayer chip 51 is adopted, and the upper edge is the upper surface of the multilayer chip 51 as the other first internal electrode 52-4. 2 between the two first external electrodes 54 and the point that the side edge is located at the inner position away from one side surface of the laminated chip 51 in the y-y direction. Second outside There electrodes 55 in that spaced apart. The manufacturing method and function are the same as those of the multilayer ceramic capacitor 50.

  According to the multilayer ceramic capacitor 50-5, the heat radiation effect similar to that of the multilayer ceramic capacitor 50 is achieved by directly and efficiently transmitting the heat of the multilayer ceramic capacitor 50-5 to the heat radiation conductor 56-2. Can be obtained. In this case, each radiating conductor portion is continuous with the upper surface of the multilayer chip 51, one side surface in the yy direction, and one side surface in the xx direction, or the upper surface of the multilayer chip 51 and one side surface in the yy direction. And may be provided continuously on two side surfaces in the xx direction.

[Sixth Embodiment]
57 to 59 show a sixth embodiment of the present invention. 57 is a perspective view of the multilayer ceramic capacitor as viewed from the upper surface side, and FIGS. 58A and 58B are views of the multilayer ceramic capacitor shown in FIG. 57 in two lines parallel to the y-y direction and having different positions. FIG. 59 (A) to FIG. 59 (C) are sectional views for explaining a method of manufacturing the multilayer ceramic capacitor shown in FIG.

  A multilayer ceramic capacitor 60 according to the fifth embodiment includes a multilayer chip 61 having a rectangular parallelepiped shape. The multilayer chip 61 includes two first internal electrodes 62A and 62B in the same layer, and two second internal electrodes 63A and 63B in a different layer from the layer in which the first internal electrodes 62A and 62B exist. It has a configuration in which layers are arranged alternately and opposed to each other through layers (no reference). The number of layers in which the first internal electrodes 62A and 62B exist and the number of layers in which the second internal electrodes 63A and 63B exist are arbitrarily set according to the required capacitance.

  As shown in FIG. 58 (A), the two first internal electrodes 62A and 62B each have a vertically long rectangle, and a predetermined gap is provided between them. One first internal electrode 62 </ b> A has a lead portion 62 </ b> Aa having a predetermined width on one lower end side, and the lower edge of the lead portion 62 </ b> Aa is exposed on the lower surface of the multilayer chip 61. The upper edge of one first internal electrode 62A is at an inner position away from the upper surface of the multilayer chip 61, and the side edge is at an inner position away from one side surface of the multilayer chip 61 in the yy direction. The other first internal electrode 62 </ b> B has a lead portion 62 </ b> Ba having a predetermined width on one lower end side, and the lower edge of the lead portion 62 </ b> Ba is exposed on the lower surface of the multilayer chip 61. The upper edge of the other first internal electrode 62B is at an inner position away from the upper surface of the multilayer chip 61, and the side edge is at an inner position away from one side surface of the multilayer chip 61 in the yy direction.

  As shown in FIG. 59 (B), the two second internal electrodes 63A and 63B each have a vertically long rectangle, and a predetermined gap is provided between them. One second internal electrode 63 </ b> A has a lead portion 63 </ b> Aa having a predetermined width on one lower end side, and the lower edge of the lead portion 63 </ b> Aa is exposed on the lower surface of the multilayer chip 61. The upper edge of one second internal electrode 63A is exposed on the upper surface of the multilayer chip 61, and the side edge is at an inner position away from one side surface of the multilayer chip 61 in the yy direction. The other second internal electrode 63 </ b> B has a lead portion 63 </ b> Ba having a predetermined width on one lower end side, and the lower edge of the lead portion 63 </ b> Ba is exposed on the lower surface of the multilayer chip 61. Further, the upper edge of the other second internal electrode 63B is exposed on the upper surface of the multilayer chip 61, and the side edge is at an inner position away from one side surface of the multilayer chip 61 in the yy direction.

  Two first external electrodes 64 are provided in strips in the xx direction on both sides of the lower surface of the multilayer chip 61, and the two second external electrodes 65 are spaced from the first external electrode 64 between the first external electrodes 64. In the xx direction. 58A, the lower edge of the lead portion 62Aa of one first internal electrode 62A is connected to one first external electrode 64, and the lower edge of the lead portion 62Ba of the other first internal electrode 62B is The other first external electrode 64 is connected. 58B, the lower edge of the lead portion 63Aa of one second internal electrode 63A is connected to one second external electrode 65, and the lower edge of the lead portion 63Ba of the other second internal electrode 63B is The other second external electrode 65 is connected.

  In addition, two heat radiating conductor portions 66 are provided on the upper surface of the multilayer chip 61 so as to be separated from each other, and two heat radiating conductor portions 67 are connected to the first external electrode 64 on two side surfaces in the yy direction of the multilayer chip 61. Are provided respectively. As can be seen from FIG. 58 (B), the upper edge of one second internal electrode 63A is connected to one heat radiation conductor 66 on the upper surface side, and the upper edge of the other second internal electrode 63B is the other heat radiation on the upper surface side. The conductor part 66 is connected. In this case, each radiating conductor 66 on the upper surface side is continuous with the upper surface of the multilayer chip 61 and one side surface in the xx direction, or continuously with the upper surface of the multilayer chip 61 and two side surfaces in the xx direction. On the other hand, each of the heat radiation conductors 67 on the side surface side may be continuous with one side surface in the yy direction and one side surface in the xx direction of the multilayer chip 61, or y of the multilayer chip 61. It may be provided continuously on one side surface in the −y direction and two side surfaces in the xx direction.

  In manufacturing the multilayer ceramic capacitor 60, first, a conductor paste containing a metal powder such as silver or nickel is printed on one surface of an unfired ceramic sheet containing a dielectric powder such as barium titanate. A first sheet S61 (see FIG. 59A) on which two unfired internal electrodes C61a and C61B for the electrodes 62A and 62B are formed, and a conductor containing a metal powder such as silver or nickel on one surface of the unfired ceramic sheet A predetermined number of second sheets S62 (see FIG. 59B) on which paste is printed to form the two unfired internal electrodes C62A and C62B for the second internal electrodes 63A and 63B are alternately stacked, and the unfired interior A dummy sheet S63 (see FIG. 59 (C)) made of an unfired ceramic sheet on which no electrode is formed is superposed on both sides, and the whole is heated and pressed. And, I fired it. 59 shows an unfired ceramic sheet of a size corresponding to one part, but in actuality, an unfired ceramic sheet of a size that can be picked up in large numbers is used, and this is cut into part dimensions after laminating and pressing. Then, the laminated chip 61 is obtained by firing.

  Next, a conductive paste containing metal powder such as silver or nickel is printed on the upper surface and two side surfaces in the y-y direction of the laminated chip 61 obtained by firing, and two unfired heat radiation conductor portions (illustrated on the upper surface side) (Not shown) and two unfired heat-radiating conductor portions (not shown) on the side surfaces are formed, and a conductor paste containing a metal powder such as silver or nickel is printed on the lower surface of the laminated chip 61 to obtain two unfired conductive parts. One external electrode (not shown) and two unfired second external electrodes (not shown) are formed and subjected to a baking process. Of course, the baking process of the unsintered heat radiation conductor part, the unsintered first external electrode and the unsintered second external electrode can be performed simultaneously with the firing process of the laminated chip.

  The multilayer ceramic capacitor 60 of the sixth embodiment includes an opposing area between one first internal electrode 62A and one second internal electrode 63A between one first external electrode 64 and one second external electrode 65, and A predetermined capacitance according to the number of layers can be obtained, and the other first internal electrode 62B and the other second internal electrode 63B are provided between the other first external electrode 64 and the other second external electrode 65. A predetermined capacitance according to the facing area and the number of stacked layers can be obtained. That is, the multilayer ceramic capacitor 60 can be used as a capacitor array in which two capacitors are combined. Of course, a capacitance equal to the sum of the capacitances of the two capacitors can be obtained between the two first external electrodes 64 and the two second external electrodes 65.

  In the multilayer ceramic capacitor 60, an unnecessary conductor layer does not exist between the two first internal electrodes 62A and 62B and the two second internal electrodes 63A and 63B. That is, in FIGS. Unlike the conventional multilayer ceramic capacitor shown, there is no internal heat dissipating electrode 5 different from the internal electrode 1 between the adjacent internal electrodes 1, so one first external electrode 64 and one second external electrode 65. , And between the other first external electrode 64 and the other second external electrode 65, a desired electrostatic capacity can be stably secured.

  Further, in this multilayer ceramic capacitor 60, when heat is generated in each of the internal electrodes 62A, 62B, 63A, 63B when a voltage is applied to the multilayer ceramic capacitor 60 after mounting, the heat from the mounting board is also transferred to each external electrode. When the heat is transmitted from the electrodes 64, 65 to the internal electrodes 62A, 62B, 63A, 63B, the heat is directly transmitted from the first internal electrodes 62A, 62B to the heat-radiating conductor 67 on the side surface and the second internal electrodes 63A. , 63B is directly transmitted to the heat radiating conductor portion 66 on the upper surface side, and is emitted to the outside from the heat radiating conductor portions 66, 67. In short, by directly transferring heat to the multilayer ceramic capacitor 60 to the heat radiating conductors 66 and 67 with high efficiency, the heat of the capacitor itself is effectively released to the outside and the temperature rise is reliably suppressed. be able to. In addition, since a sufficient area can be secured for the heat radiating conductor portions 66 and 67, the heat release can be performed more effectively.

  In FIGS. 57 to 59, two first internal electrodes 62A and 62B are provided in the same layer, and two second internal electrodes 63A and 63B are provided in a different layer. If three or more first internal electrodes are provided on the same layer, and three or more second internal electrodes are provided on a different layer so as to face each first internal electrode, a capacitor array in which three or more capacitors are combined. It can also be configured. When three or more first internal electrodes and second internal electrodes are provided, the number of external electrodes increases according to the number of first internal electrodes and second internal electrodes.

  57 to 59, one first internal electrode 62A and one second internal electrode 63A are opposed to each other, and the other first internal electrode 62B and the other second internal electrode 63B are opposed to each other. For example, like the multilayer ceramic capacitor 60 ′ shown in FIG. 60, the width of one first internal electrode 62A ′ is reduced and the width of the other first internal electrode 62B ′ is increased. If the first internal electrode 62B ′ is configured to face the two second internal electrodes 63A and 63B, a capacitance obtained between one first external electrode 64 and one second external electrode 65; The capacitance obtained between the other first external electrode 64 and the other second external electrode 65 can also be changed.

  Hereinafter, structural modifications of the sixth embodiment will be described with reference to FIGS.

  61 to 62 show a first structural modification example. This multilayer ceramic capacitor 60-1 is different from the multilayer ceramic capacitor 60 in that the two radiating conductor portions 67-1 on the side surface side of the multilayer chip 51 are arranged. The first external electrodes 64 are provided on the two side surfaces in the y-y direction so as not to be connected to each other, and the first inner electrodes 62A-1 and 62B-1 have their upper edges exposed on the upper surface of the multilayer chip 51. The upper edges of the first internal electrodes 62A-1 and 62B-1 are connected to the heat radiating conductor 66 on the upper surface side, and the upper edges are laminated as the second internal electrodes 63A-1 and 63B-1. The second internal electrodes 63A-1 and 63B- are employed by adopting the inner side of the chip 61 that is away from the upper surface and the side edges of which are exposed on one side surface of the laminated chip 61 in the yy direction. 1 side edge Lies in that connected to the side of the heat conductor portion 67-1.

  According to the multilayer ceramic capacitor 60-1, the heat of the multilayer ceramic capacitor 60-1 is directly and highly efficiently transmitted to the heat radiating conductors 66 and 67-1, thereby being the same as the multilayer ceramic capacitor 60. A heat dissipation effect can be obtained. In this case, each radiating conductor 66 on the upper surface side is continuous with the upper surface of the multilayer chip 61 and one side surface in the xx direction, or continuously with the upper surface of the multilayer chip 61 and two side surfaces in the xx direction. On the other hand, each of the heat radiation conductors 67-1 on the side surface side may be continuous with one side surface in the yy direction and one side surface in the xx direction of the multilayer chip 61, or the multilayer chip 61. May be provided continuously on one side surface in the y-y direction and two side surfaces in the xx direction.

It is a perspective view of the conventional multilayer ceramic capacitor. It is the a1-a1 sectional view taken on the line of FIG. FIG. 2 is a cross-sectional view taken along line a2-a2 of FIG. It is the perspective view seen from the upper surface side of the multilayer ceramic capacitor which shows 1st Embodiment of this invention. It is the perspective view seen from the lower surface side of the multilayer ceramic capacitor of FIG. FIG. 5 is a longitudinal sectional view of the multilayer ceramic capacitor shown in FIG. 4 cut along two lines that are parallel to the y-y direction and have different positions. FIG. 5 is a longitudinal sectional view of the multilayer capacitor shown in FIG. 4 cut along two lines parallel to the xx direction and having different positions. FIG. 5 is an explanatory diagram of a method for manufacturing the multilayer ceramic capacitor shown in FIG. 4. FIG. 5 is an explanatory diagram of a method for manufacturing the multilayer ceramic capacitor shown in FIG. 4. FIG. 5 is a longitudinal sectional view showing an example in which the number of external electrodes of the multilayer ceramic capacitor shown in FIG. 4 is increased. It is the perspective view seen from the upper surface side of the multilayer ceramic capacitor which shows the 1st structural modification of 1st Embodiment. FIG. 12 is a longitudinal sectional view of the multilayer ceramic capacitor shown in FIG. 11 cut along a line parallel to the yy direction. It is the perspective view seen from the upper surface side of the multilayer ceramic capacitor which shows the 2nd structural modification of 1st Embodiment. It is the longitudinal cross-sectional view which cut | disconnected the multilayer ceramic capacitor shown in FIG. 13 by the line parallel to yy direction. It is the longitudinal cross-sectional view which cut | disconnected the multilayer ceramic capacitor which shows the 3rd structural modification of 1st Embodiment by the line parallel to a yy direction. It is the perspective view seen from the upper surface side of the multilayer ceramic capacitor which shows the 4th structural modification of 1st Embodiment. FIG. 17 is a longitudinal sectional view of the multilayer ceramic capacitor shown in FIG. 16 cut along a line parallel to the yy direction. It is the perspective view seen from the upper surface side of the multilayer ceramic capacitor which shows 2nd Embodiment of this invention. It is the longitudinal cross-sectional view which cut | disconnected the multilayer ceramic capacitor shown in FIG. 18 by two lines which differ in a position in parallel with a yy direction. It is manufacturing method explanatory drawing of the multilayer ceramic capacitor shown in FIG. FIG. 19 is a longitudinal sectional view showing an example in which the number of external electrodes of the multilayer ceramic capacitor shown in FIG. 18 is increased. It is the perspective view seen from the upper surface side of the multilayer ceramic capacitor which shows the 1st structural modification of 2nd Embodiment. FIG. 23 is a longitudinal sectional view of the multilayer ceramic capacitor shown in FIG. 22 cut along a line parallel to the yy direction. It is the longitudinal cross-sectional view which cut | disconnected the multilayer ceramic capacitor which shows the 2nd structural modification of 2nd Embodiment by the line parallel to a yy direction. It is the perspective view seen from the upper surface side of the multilayer ceramic capacitor which shows the 3rd structural modification of 2nd Embodiment. FIG. 26 is a longitudinal sectional view of the multilayer ceramic capacitor shown in FIG. 25 cut along a line parallel to the yy direction. It is the longitudinal cross-sectional view which cut | disconnected the multilayer ceramic capacitor which shows the 4th structural modification of 2nd Embodiment by the line parallel to a yy direction. It is the perspective view seen from the upper surface side of the multilayer ceramic capacitor which shows the 5th structural modification of 2nd Embodiment. FIG. 29 is a longitudinal sectional view of the multilayer ceramic capacitor shown in FIG. 28 cut along a line parallel to the yy direction. It is the perspective view seen from the upper surface side of the multilayer ceramic capacitor which shows 3rd Embodiment of this invention. FIG. 31 is a longitudinal sectional view of the multilayer ceramic capacitor shown in FIG. 30 cut along two lines that are parallel to the y-y direction and have different positions. FIG. 31 is an explanatory diagram of a manufacturing method for the multilayer ceramic capacitor shown in FIG. 30. FIG. 31 is a longitudinal sectional view showing an example in which the number of external electrodes of the multilayer ceramic capacitor shown in FIG. 30 is increased. It is the perspective view seen from the upper surface side of the multilayer ceramic capacitor which shows the 1st structural modification of 3rd Embodiment. FIG. 35 is a longitudinal sectional view of the multilayer ceramic capacitor shown in FIG. 34 cut along a line parallel to the yy direction. It is the perspective view seen from the upper surface side of the multilayer ceramic capacitor which shows the 2nd structural modification of 3rd Embodiment. FIG. 37 is a longitudinal sectional view of the multilayer ceramic capacitor shown in FIG. 36 cut along a line parallel to the yy direction. It is the perspective view seen from the upper surface side of the multilayer ceramic capacitor which shows 4th Embodiment of this invention. FIG. 39 is a longitudinal sectional view of the multilayer ceramic capacitor shown in FIG. 38 cut along two lines that are parallel to the y-y direction and have different positions. FIG. 39 is an explanatory diagram of a production method for the multilayer ceramic capacitor shown in FIG. 38. It is a longitudinal cross-sectional view which shows the example which changed the internal electrode shape of the multilayer ceramic capacitor shown in FIG. It is the perspective view seen from the upper surface side of the multilayer ceramic capacitor which shows the 1st structure modification of 4th Embodiment. FIG. 43 is a longitudinal sectional view of the multilayer ceramic capacitor shown in FIG. 42 cut along a line parallel to the yy direction. It is the perspective view seen from the upper surface side of the multilayer ceramic capacitor which shows the 2nd structural modification of 4th Embodiment. FIG. 45 is a longitudinal sectional view of the multilayer ceramic capacitor shown in FIG. 44 cut along a line parallel to the yy direction. It is the longitudinal cross-sectional view which cut | disconnected the multilayer ceramic capacitor which shows the 3rd structural modification of 4th Embodiment by the line parallel to a yy direction. It is the perspective view seen from the upper surface side of the multilayer ceramic capacitor which shows 5th Embodiment of this invention. FIG. 48 is a longitudinal sectional view of the multilayer ceramic capacitor shown in FIG. 47 cut along two lines that are parallel to the y-y direction and have different positions. FIG. 48 is an explanatory diagram of a manufacturing method for the multilayer ceramic capacitor shown in FIG. 47. It is the perspective view seen from the upper surface side of the multilayer ceramic capacitor which shows the 1st structural modification of 5th Embodiment. It is the longitudinal cross-sectional view which cut | disconnected the multilayer ceramic capacitor shown in FIG. 50 by the line parallel to yy direction. It is the longitudinal cross-sectional view which cut | disconnected the multilayer ceramic capacitor which shows the 2nd structural modification of 5th Embodiment by the line parallel to a yy direction. It is the perspective view seen from the upper surface side of the multilayer ceramic capacitor which shows the 3rd structural modification of 5th Embodiment. FIG. 54 is a longitudinal sectional view of the multilayer ceramic capacitor shown in FIG. 53 cut along a line parallel to the yy direction. It is the longitudinal cross-sectional view which cut | disconnected the multilayer ceramic capacitor which shows the 4th structural modification of 5th Embodiment by the line parallel to a yy direction. It is the longitudinal cross-sectional view which cut | disconnected the multilayer ceramic capacitor which shows the 5th structural modification of 5th Embodiment by the line parallel to a yy direction. It is the perspective view seen from the upper surface side of the multilayer ceramic capacitor which shows 6th Embodiment of this invention. FIG. 58 is a longitudinal sectional view of the multilayer ceramic capacitor shown in FIG. 57 cut along two lines that are parallel to the y-y direction and have different positions. FIG. 58 is an explanatory diagram of a manufacturing method of the multilayer ceramic capacitor shown in FIG. 57. FIG. 58 is a longitudinal sectional view showing an example in which the internal electrode shape of the multilayer ceramic capacitor shown in FIG. 57 is changed. It is the perspective view seen from the upper surface side of the multilayer ceramic capacitor which shows the 1st structure modification of 6th Embodiment. FIG. 62 is a longitudinal sectional view of the multilayer ceramic capacitor shown in FIG. 61 cut along a line parallel to the yy direction.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10,10 ', 10-1,10-2,10-3,10-4 ... Multilayer ceramic capacitor, 11 ... Multilayer chip, 12, 12' ... 1st internal electrode, 13, 13 ', 13-1, 13 -2 ... 2nd internal electrode, 14 ... 1st external electrode, 15 ... 2nd external electrode, 16, 16-1, 16-2, 16-3, 16-4 ... Radiation conductor part, 20, 20 ', 20 -1, 20-2, 20-3, 20-4, 20-5 ... multilayer ceramic capacitor, 21 ... multilayer chip, 22A, 22A ', 22A-1, 22A-2, 22A-3, 22A-4, 22B , 22B ', 22B-1, 22B-2 ... first external internal electrode, 23, 23' ... second internal electrode, 24 ... first external electrode, 25 ... second external electrode, 26, 26-1, 26- 2, 26-3, 26-4 ... Radiating conductor part, 30, 30 ', 30-1, 30-2 ... Layer ceramic capacitor, 31 ... multilayer chip, 32A, 32A ', 32A-1, 32B, 32B', 22B-1 ... first external internal electrode, 33, 33 ', 33-1, 33-2 ... second internal electrode 34 ... 1st external electrode, 35 ... 2nd external electrode, 36, 36-1, 37, 37-1 ... Radiation conductor part, 40, 40 ', 40-1, 40-2, 40-3 ... Multilayer ceramic Capacitor 41 ... Multilayer chip, 42A, 42A ', 42A-1, 42A-2, 42B, 42B' ... First external internal electrode, 43 ... Second internal electrode, 44 ... First external electrode, 45 ... Second external Electrode, 46, 46 ', 46-1, 46-2 ... Radiation conductor, 50, 50-1, 50-2, 50-3, 50-4, 50-5 ... Multilayer ceramic capacitor, 51 ... Multilayer chip, 52, 52-1, 52-2, 52-3, 52 4 ... 1st external internal electrode, 53, 53-1, 2nd internal electrode, 54 ... 1st external electrode, 55 ... 2nd external electrode, 56, 56-1, 56-2 ... Radiation conductor part, 60, 60 ', 60-1 ... Multilayer ceramic capacitor, 61 ... Multilayer chip, 62A, 62A', 62A-1, 62B, 62B ', 62B-1 ... First external internal electrode, 63A, 63A-1, 63B, 63B-1 ... 2nd internal electrode, 64 ... 1st external electrode, 65 ... 2nd external electrode, 66, 67, 67-1 ... Radiation conductor part.

Claims (15)

A rectangular parallelepiped shape in which two or more first internal electrodes in the same layer and a common internal electrode in a layer different from the layer in which the first internal electrode exists are arranged alternately and facing each other through the ceramic layer A laminated chip of
Two or more first external electrodes provided on one surface of the multilayer chip and electrically connected to each first internal electrode;
At least one second external electrode provided in contact with the first external electrode on the one surface of the multilayer chip and electrically connected to the common internal electrode;
Provided on at least one surface different from the one surface of the multilayer chip, comprising at least one of two or more first internal electrodes, or at least one heat radiating conductor portion conducting to the common internal electrode,
A multilayer ceramic capacitor characterized by that. The heat dissipating conductor is provided on the surface facing the one surface of the multilayer chip.
The multilayer ceramic capacitor according to claim 1. The heat dissipation conductor portion is provided on at least one surface adjacent to the one surface of the multilayer chip.
The multilayer ceramic capacitor according to claim 1. The heat dissipating conductor portion is provided on a surface facing the one surface of the multilayer chip and at least one surface adjacent to the surface.
The multilayer ceramic capacitor according to claim 1. At least one of the first internal electrodes is in conduction with the heat dissipating conductor,
The multilayer ceramic capacitor according to any one of claims 1 to 4, wherein the multilayer ceramic capacitor is any one of the above. The common internal electrode is connected to the heat dissipation conductor,
The multilayer ceramic capacitor according to any one of claims 1 to 4, wherein the multilayer ceramic capacitor is any one of the above. At least one of the first internal electrodes and the common internal electrode are electrically connected to different heat conductor portions,
The multilayer ceramic capacitor according to any one of claims 1 to 4, wherein the multilayer ceramic capacitor is any one of the above. Two or more first internal electrodes in the same layer and two or more second internal electrodes in a layer different from the layer in which the first internal electrode exists are alternately arranged opposite to each other via the ceramic layer. A rectangular parallelepiped laminated chip,
Two or more first external electrodes provided on one surface of the multilayer chip and electrically connected to each first internal electrode;
Two or more second external electrodes provided on one surface of the multilayer chip in a non-contact manner with the first external electrodes and electrically connected to the respective second internal electrodes;
At least one heat radiating conductor provided on at least one surface different from the one surface of the multilayer chip and conducting with at least one of the two or more first internal electrodes or at least one of the two or more second internal electrodes. Comprising a part,
A multilayer ceramic capacitor characterized by that. The heat dissipating conductor is provided on the surface facing the one surface of the multilayer chip.
The multilayer ceramic capacitor according to claim 8. The heat dissipation conductor portion is provided on at least one surface adjacent to the one surface of the multilayer chip.
The multilayer ceramic capacitor according to claim 8. The heat dissipating conductor portion is provided on a surface facing the one surface of the multilayer chip and at least one surface adjacent to the surface.
The multilayer ceramic capacitor according to claim 8. At least one of the first internal electrodes is in conduction with the heat dissipating conductor,
The multilayer ceramic capacitor according to claim 8, wherein the multilayer ceramic capacitor is any one of claims 8 to 11. At least one of the second internal electrodes is in conduction with the heat dissipating conductor,
The multilayer ceramic capacitor according to claim 8, wherein the multilayer ceramic capacitor is any one of claims 8 to 11. At least one of the first internal electrodes and at least one of the second internal electrodes are electrically connected to separate heat-radiating conductor portions,
The multilayer ceramic capacitor according to claim 8, wherein the multilayer ceramic capacitor is any one of claims 8 to 11. The number of the first internal electrode, the second internal electrode, and the heat radiating conductor portion is 2 or more, and either the first internal electrode or the second internal electrode is electrically connected to each of the heat radiating conductor portions.
The multilayer ceramic capacitor according to claim 8, wherein the multilayer ceramic capacitor is any one of claims 8 to 11.

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