JP2019017147A - Power conversion device - Google Patents

Abstract

To obtain a power conversion device in which the number of assembly steps can be reduced and noise radiated from a heat generating component can be inhibited from being leaked to the outside.SOLUTION: The power conversion device includes a substrate 3 having a land pattern 32 and a ground pattern 31 and having a heat generating component 4 provided thereon such that the heat generating component 4 is electrically connected to the land pattern 32, a shielding plate 5 which is provided on the substrate 3 so as to cover the heat generating component 4 and which is electrically connected to the ground pattern 31, a metallic casing 1 which supports the substrate 3 and which is electrically connected to the ground pattern 31, and a capacitor member 9 which is provided on the substrate 3 so as to extend over the land pattern 32 and the ground pattern 31. Heat radiated from the heat generating component 4 is transmitted to the shielding plate 5 and the metallic casing 1 via the capacitor member 9.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a power conversion device mounted on, for example, an automobile.

  In power converters, it is necessary to shield noise radiated from power converters as the switching frequency of power devices increases. Moreover, in a power converter, since the switching loss and load current at the time of voltage transformation increase with the increase in output of the power device, it is necessary to discharge heat generated in the power converter to the outside.

  Conventionally, a substrate, a heat generating component provided on the substrate, a metal cover attached to the substrate in a state of covering the heat generating component, and a heat generating component while deforming according to each shape of the heat generating component and the metal cover, A gap conductive material is embedded in the gap between the metal cover and conducts heat generated by the heat generating component to the metal cover, and the ground pattern of the board and the metal cover are electrically connected. A power converter is known. Heat generated by the heat generating component is conducted to the metal cover through the gap conductive material and discharged to the outside, and noise emitted from the heat generating component is shielded by the ground pattern and the metal cover (for example, patents) Reference 1).

JP 2013-29644 A

  However, since a man-hour for filling the gap conductive material in the gap between the heat generating component and the metal cover is required, there is a problem that the number of assembling steps is large. In addition, there is a problem that noise radiated from the heat generating component leaks to the outside of the cable or the like via the substrate.

  The present invention has been made to solve the above-described problems, and its object is to reduce the number of assembling steps and to suppress leakage of noise radiated from the heat-generating component to the outside. A power converter is provided.

  The power conversion device according to the present invention has a land pattern and a ground pattern, and is provided on the substrate so as to cover the heat generating component and the substrate on which the heat generating component is provided so that the heat generating component is electrically connected to the land pattern. A shield plate that is electrically connected to the ground pattern, a metal housing that supports the substrate and is electrically connected to the ground pattern, and is provided on the substrate and is provided across the land pattern and the ground pattern. The heat generated by the heat generating component is conducted to the shield plate and the metal casing through the capacitor member.

  According to the power conversion device of the present invention, the noise radiated from the heat generating component is transmitted to the metal casing through the capacitor member, and the heat generated by the heat generating component is transmitted to the shield plate and the capacitor member through the capacitor member. Since it conducts to the metal casing, it is possible to reduce the number of assembly steps and to suppress leakage of noise radiated from the heat-generating component to the outside.

It is a block diagram which shows the power converter device which concerns on Embodiment 1 of this invention. It is a figure explaining the heat dissipation path | route in the power converter device of FIG. It is a top view which shows the board | substrate and shield board of FIG. It is a top view which shows the board | substrate of FIG. 1, a heat-emitting component, and a capacitor | condenser member. It is a block diagram which shows the power converter device which concerns on Embodiment 2 of this invention. It is a block diagram which shows the power converter device which concerns on Embodiment 3 of this invention. It is a block diagram which shows the power converter device which concerns on Embodiment 4 of this invention. It is a block diagram which shows the power converter device which concerns on Embodiment 5 of this invention. It is a block diagram which shows the power converter device which concerns on Embodiment 6 of this invention.

  Hereinafter, the power converter concerning each embodiment of the present invention is explained based on a drawing.

Embodiment 1 FIG.
1 is a block diagram showing a power conversion apparatus according to Embodiment 1 of the present invention. The power conversion device according to the first embodiment of the present invention includes a metal casing 1, a metal casing cover 2 in which an opening 21 is formed, and the opening 21 is opened and closed by the metal casing 1, and a ground. A substrate 3 having a pattern 31 and a land pattern 32; a heat generating component 4 provided on the substrate 3 so as to be electrically connected to the land pattern 32; a shield plate 5 provided on the substrate 3 and covering the heat generating component 4; It has.

  In addition, the power conversion device is fixed to the metal casing 1, and a plurality of metal joining members 6 that support the substrate 3, screws 7 that electrically connect the shield plate 5 and the ground pattern 31, and metal A screw 8 that electrically connects the bonding member 6 and the ground pattern 31 and a capacitor member 9 provided across the ground pattern 31 and the land pattern 32 are further provided.

  The substrate 3, the heat generating component 4, the shield plate 5, the metal joining member 6, the screw 7, the screw 8, and the capacitor member 9 are disposed in a space between the metal housing 1 and the metal housing cover 2. .

  The heat generating component 4 includes a main circuit system component that forms a current path when performing power conversion, and a control system component, such as a transformer, a reactor, a coil, a resistor, and a switching device. An example of the switching device is a field effect transistor (MOSFET). The heat generating component 4 may be other components.

  The substrate 3 is attached to the metal joining member 6 using screws 8. By attaching the substrate 3 to the metal joining member 6 using the screws 8, the ground pattern 31 is electrically connected to the metal casing 1 through the metal joining member 6.

  The shield plate 5 is attached to the substrate 3 using screws 7. The shield plate 5 is electrically connected to the ground pattern 31 by attaching the shield plate 5 to the substrate 3 using the screws 7. When the ground pattern 31 is electrically connected to the metal casing 1 and the shield plate 5, the metal casing 1 and the shield plate 5 are electrically connected to each other and have the same potential. When the metal casing 1 and the shield plate 5 are at the same potential, the potential of the shield plate 5 is stabilized, and the radiation noise radiated from the heat-generating component 4 as the electric circuit formed on the substrate 3 operates. In addition, there is an effect of reducing the influence of external noise radiated from the outside toward the heat generating component.

  FIG. 2 is a view for explaining a heat radiation path in the power conversion apparatus of FIG. Since the shield plate 5 covers the heat generating component 4, radiation noise emitted from the heat generating component 4 is cut off as the electric circuit formed on the substrate 3 operates.

  Since the land pattern 32 to which the heat generating component 4 is electrically connected is connected to the ground pattern 31 via the capacitor member 9, the heat generated by the heat generating component 4 is generated by the ground pattern 31 and the metal bonding member 6. Conducted to the metal housing 1 via In FIG. 2, a heat path A conducted from the ground pattern 31 to the metal casing 1 is indicated by a broken line.

  Further, since the land pattern 32 to which the heat generating component 4 is connected is connected to the ground pattern 31 via the capacitor member 9, the heat generated by the heat generating component 4 is applied to the shield plate 5 via the ground pattern 31. Conduct. In FIG. 2, a path B of heat conducted from the ground pattern 31 to the shield plate 5 is indicated by a one-dot chain line.

  The shield plate 5 is used as a heat dissipation path and serves as a heat dissipation plate. Thereby, the heat of the board 3 can be radiated not only in the metal casing 1 but also in the air in the space between the metal casing 1 and the metal casing cover 2, and the heat dissipation performance of the power conversion device Can be improved.

  The heat generating component 4 has a metal terminal. The terminals of the heat generating component 4 are electrically connected to the land pattern 32. The heat generated in the heat generating component 4 is conducted to the land pattern 32, conducted to the metal casing 1 through the heat dissipation path, and in the space between the metal casing 1 and the metal casing cover 2. Heat is released into the air.

  The land pattern 32 to which the heat generating component 4 is electrically connected is connected via the capacitor member 9 to the ground pattern 31 that is electrically connected to the metal casing 1 and the shield plate 5.

  The capacitor member 9 electrically insulates the land pattern 32 to which the heat generating component 4 is connected and the ground pattern 31 electrically connected to the metal casing 1 and the shield plate 5, and from the heat generating component 4 to the land pattern 32. The heat conducted to the pattern 32 is conducted to the ground pattern 31.

  FIG. 3 is a plan view showing the substrate 3 and the shield plate 5 of FIG. FIG. 3 shows a state where the substrate 3 and the shield plate 5 are disassembled. A through-hole 33 for fixing the shield plate 5 to the substrate 3 using screws 7 is formed in the substrate 3. Further, the substrate 3 is formed with a through hole 34 for fixing the substrate 3 to the metal joining member 6 using screws 8.

  The shield plate 5 is formed with a through hole 51 for fixing the shield plate 5 to the substrate 3 using screws 7.

  In the board | substrate 3, the location which fastens the board | substrate 3 and the shield board 5 and the location which fastens the board | substrate 3 and the metal housing | casing 1 are respectively different locations. Thereby, the shield plate 5 and the ground pattern 31 are used for shielding radiation noise, and the ground pattern 31 for connecting the metal casing 1 and the shield plate 5 at the same potential is used for the heat dissipation path.

  4 is a plan view showing the substrate 3, the heat generating component 4, and the capacitor member 9 of FIG. The capacitor member 9 has a plurality of capacitors 91. The capacitor 91 is composed of a ceramic capacitor. Ceramic capacitors have excellent heat resistance and high thermal conductivity. Therefore, more heat can be conducted between the ground pattern 31 and the land pattern 32 than when other capacitors such as a film capacitor and an electrolytic capacitor are used.

  A plurality of capacitors 91 are provided between the ground pattern 31 and the land pattern 32. The plurality of capacitors 91 are connected in parallel between the ground pattern 31 and the land pattern 32. Since a plurality of capacitors 91 are connected in parallel between the ground pattern 31 and the land pattern 32, the thermal resistance from the heat generating component 4 to the ground pattern 31 can be lowered, and the heat transfer from the heat generating component 4 to the ground pattern 31 can be reduced. The thermal effect can be improved. In addition, since the plurality of capacitors 91 are connected in parallel between the ground pattern 31 and the land pattern 32, the band of conduction noise to be removed can be widened.

  As shown in FIG. 1, the substrate 3 is supported by a metal casing 1 via a metal joining member 6. The substrate 3 is supported by the metal casing 1 through the metal joining member 6, thereby adjusting the position of the substrate 3 in the height direction with respect to the metal casing 1 and the width of the substrate 3 with respect to the metal casing 1. The degree of freedom in structural design, such as changing the position of the direction, can be increased, and the mold cost for manufacturing the metal housing 1 can be reduced. Further, by electrically connecting the shield plate 5 to the metal joining member 6 having the same potential as that of the metal casing 1, the potential of the shield plate 5 can be stabilized, and noise radiated from the substrate 3 is reduced. Let Further, by connecting the shield plate 5 to the metal joining member 6 having the same potential as that of the metal casing 1, a heat dissipation path from the substrate 3 to the metal casing 1 through the metal joining member 6 is formed. Can do.

  As described above, according to the power conversion device according to the first embodiment of the present invention, the noise radiated from the heat generating component 4 is transmitted to the metal casing 1 through the capacitor member 9, and the heat generating component 4 The heat generated in the step is conducted to the shield plate 5 and the metal casing 1 through the capacitor member 9, thereby reducing the number of assembly steps and suppressing the noise radiated from the heat generating component 4 from leaking to the outside. can do.

  Further, since the capacitor member 9 has a ceramic capacitor, more heat can be conducted between the ground pattern 31 and the land pattern 32.

  In addition, since the capacitor member 9 includes a plurality of capacitors 91 connected in parallel, the heat transfer effect from the heat generating component 4 to the ground pattern 31 can be improved, and the band of conduction noise to be removed is widened. be able to.

  The power conversion device further includes a metal joining member 6 that is provided over the substrate 3 and the metal housing 1 and electrically connects the ground pattern 31 and the metal housing 1. The degree of freedom in the structural design of the power conversion device can be increased, and the mold cost for manufacturing the metal casing 1 can be reduced.

  In the first embodiment, the configuration in which the screw 8 is used as the member for fixing the substrate 3 and the metal joining member 6 has been described. However, a member other than the screw 8 may be used. Moreover, although the structure which uses the screw 7 as a member which fixes the shield board 5 and the board | substrate 3 was demonstrated, members other than the screw 7 may be sufficient.

  In the first embodiment, the metal casing 1 may be a metal heat sink, a metal water-cooled cooler, a metal oil-cooled cooler, or the like.

  Further, in the first embodiment, the shield plate 5 has been described with respect to the configuration that improves the heat dissipation performance of the substrate 3 by using a metal having a high thermal conductivity such as aluminum, copper, or silver as the metal material. The material of the shield plate 5 may be other.

  In the first embodiment, the capacitor member 9 is a ceramic capacitor. However, the capacitor member 9 may be another capacitor.

Embodiment 2. FIG.
FIG. 5 is a block diagram showing a power conversion apparatus according to Embodiment 2 of the present invention. The power converter according to Embodiment 2 of the present invention includes a shield plate 5 having a fin structure. Since the shield plate 5 has a fin structure, the heat dissipation area of the shield plate 5 can be expanded. Thereby, the heat generated in the substrate 3 can be more efficiently released into the air in the space between the metal housing 1 and the metal housing cover 2, and the heat dissipation effect can be improved. .

  In addition, the structure which makes a part of shield board 5 contact the metal housing cover 2 may be sufficient. In this case, the heat dissipation effect can be further improved.

  An interval D between the fins of the shield plate 5 is an interval that does not resonate with FM band noise. Thereby, generation | occurrence | production of the new radiation noise which passed between the fins of the shield board 5 can be avoided. Other configurations are the same as those in the first embodiment.

  As described above, according to the power conversion device according to Embodiment 2 of the present invention, since the fin-structure shield plate 5 is provided, the heat dissipation effect of the power conversion device can be further improved.

Embodiment 3 FIG.
FIG. 6 is a block diagram showing a power conversion apparatus according to Embodiment 3 of the present invention. The power conversion device according to Embodiment 3 of the present invention is provided in the metal casing 1 and has a metal joining member 10 that supports the shield plate 5 and a screw 11 that fixes the shield plate 5 to the metal joining member 10. And further. The shield plate 5 is supported by the substrate 3 through the metal joining member 6 and is supported by the metal housing 1 through the metal joining member 10.

  Since the shield plate 5 is connected to the metal casing 1 via the metal joining member 10, the heat conducted from the substrate 3 to the shield plate 5 is also applied to the metal casing 1 via the metal joining member 10. Conduct. Thereby, a new heat dissipation path is formed in the power conversion device, and the heat dissipation effect of the substrate 3 can be further improved.

  Further, since the shield plate 5 is electrically connected to the metal casing 1 via the metal joining member 10, the potential of the shield plate 5 can be further stabilized. As a result, the radiation noise shielding performance by the shield plate 5 can be further improved. Other configurations are the same as those in the first embodiment. Other configurations may be the same as those in the second embodiment.

  As described above, according to the power conversion device according to Embodiment 3 of the present invention, the metal bonding member 10 provided in the metal casing 1 and supporting the shield plate 5 and the shield plate 5 are made of metal. Since the screw 11 fixed to the joining member 10 is provided, the heat dissipation effect of the substrate 3 can be further improved, and the shielding performance of radiation noise by the shield plate 5 can be further improved.

  In addition, the metal joining member 10 may be a metal having an electrical resistivity higher than that of the shield plate 5. In this case, it is possible to form a heat dissipation path from the shield plate 5 to the metal casing 1 via the metal joining member 10, and to connect the metal 3 to the metal casing 1 via the metal joining member 10. Circuit current wraparound can be suppressed, and deterioration of conduction noise can be suppressed.

  Further, the power conversion device may include a resin member having a high thermal conductivity that is provided in the metal casing 1 and supports the shield plate 5 instead of the metal bonding member 10. In this case, a heat dissipation path from the shield plate 5 through the resin member to the metal housing 1 can be formed, and circuit current from the substrate 3 to the metal housing 1 through the resin member can be prevented. In addition, deterioration of conduction noise can be avoided.

Embodiment 4 FIG.
FIG. 7 is a block diagram showing a power conversion apparatus according to Embodiment 4 of the present invention. The power conversion device according to Embodiment 4 of the present invention further includes a metal joining member 12 connected to the shield plate 5 and the metal housing cover 2. The shield plate 5 is supported by the substrate 3 and is connected to the metal casing cover 2 via the metal joining member 12.

  Since the shield plate 5 is connected to the metal housing cover 2 via the metal joining member 12, the heat conducted from the substrate 3 to the shield plate 5 is also conducted to the metal housing cover 2. Thereby, a new heat dissipation path is formed, and the heat dissipation effect of the substrate 3 can be further improved.

  Moreover, since the shield plate 5 is electrically connected to the metal casing cover 2 via the metal joining member 12, the potential of the shield plate 5 can be stabilized. Thereby, the noise shielding performance by the shield plate 5 can be further improved. Other configurations are the same as those in the first embodiment. Other configurations may be the same as those in the second embodiment or the third embodiment.

  As described above, according to the power conversion device according to the fourth embodiment of the present invention, the shield plate 5 is connected to the metal casing cover 2 via the metal joining member 12. The heat dissipation effect can be improved.

  Moreover, since the shield plate 5 is electrically connected to the metal casing cover 2 via the metal joining member 12, the noise shielding performance by the shield plate 5 can be further improved.

  Note that the metal joining member 12 may be a metal having an electrical resistivity higher than that of the shield plate 5. In this case, a heat dissipation path from the shield plate 5 to the metal housing cover 2 via the metal joining member 12 is formed, and a metal made from the substrate 3 via the metal joining member 12 and the metal housing cover 2 is formed. It is possible to suppress the circuit current from flowing into the housing 1 and suppress the deterioration of the conduction noise.

  Further, the power conversion device may include a resin member having a high thermal conductivity connected to the shield plate 5 and the metal casing cover 2 instead of the metal bonding member 12. In this case, a heat dissipation path from the shield plate 5 to the metal casing cover 2 via the resin member is formed, and a circuit from the substrate 3 to the metal casing 1 via the resin member and the metal casing cover 2 is formed. Current wraparound can be prevented and deterioration of conduction noise can be avoided.

Embodiment 5. FIG.
FIG. 8 is a block diagram showing a power conversion apparatus according to Embodiment 5 of the present invention. The power conversion device according to Embodiment 5 of the present invention further includes a heat dissipation sheet 13 provided across the shield plate 5 and the metal housing cover 2. The shield plate 5 is connected to the metal housing cover 2 via the heat dissipation sheet 13. The heat radiation sheet 13 is in surface contact with the shield plate 5 and the metal housing cover 2.

  Since the shield plate 5 is connected to the metal housing cover 2 via the heat dissipation sheet 13, the heat conducted from the substrate 3 to the shield plate 5 is also conducted to the metal housing cover 2 via the heat dissipation sheet 13. . Thereby, a new heat dissipation path is formed in the power conversion device, and the heat dissipation effect of the substrate 3 can be further improved. Other configurations are the same as those in the first embodiment. It may be the same as the second embodiment, the third embodiment, or the fourth embodiment.

  As described above, according to the power conversion device according to the fifth embodiment of the present invention, since the shield plate 5 is connected to the metal housing cover 2 via the heat dissipation sheet 13, the heat dissipation effect of the substrate 3 is achieved. Can be further improved.

Embodiment 6 FIG.
FIG. 9 is a block diagram showing a power conversion apparatus according to Embodiment 6 of the present invention. In the power conversion device according to Embodiment 6 of the present invention, a refrigerant flow path through which a refrigerant flows is formed inside shield plate 5. Moreover, in this power converter, the refrigerant flow path through which the refrigerant flows is formed inside the metal casing 1. That is, the metal housing 1 has a function as a cooler.

  In addition, this power conversion device includes a pipe 14 connected to the refrigerant flow path of the metal casing 1, and a metal pipe connected to the refrigerant flow path of the metal casing 1 and the refrigerant flow path of the shield plate 5. 15 is further provided. The metal casing 1 is electrically connected to the shield plate 5 through a metal pipe 15. The pipe 14 is made of metal.

  The refrigerant flowing through the pipe 14 and the metal pipe 15 may be a liquid such as water or oil, or may be a gas such as air. Other configurations are the same as those in the first embodiment. Other configurations may be the same as those in the second embodiment, the third embodiment, the fourth embodiment, or the fifth embodiment.

  According to the power conversion device according to Embodiment 6 of the present invention, the metal casing 1 has a function as a cooler, and the refrigerant flowing through the refrigerant flow path of the metal casing 1 is the refrigerant flow of the shield plate 5. Since it flows through the path, the heat of the substrate 3 can be radiated by the shield plate 5 and the heat radiation effect of the substrate 3 can be improved.

  In addition, in the said Embodiment 6, although the piping 14 and the metal piping 15 demonstrated the structure comprised from the metal, these may be comprised from resin, such as rubber | gum, for example.

  Moreover, although each said embodiment demonstrated the structure to which the board | substrate 3 was connected to the metal housing | casing 1 via the metal joining member 6, the board | substrate 3 was made from metal without going through the metal joining member 6. The structure connected to the housing | casing 1 may be sufficient.

  In the present invention, the embodiments can be freely combined within the scope of the invention. In addition, any component in each embodiment can be changed or omitted as appropriate.

  DESCRIPTION OF SYMBOLS 1 Metal housing, 2 Metal housing cover, 3 Substrate, 4 Heating component, 5 Shield plate, 6 Metal joining member, 7 Screw, 8 Screw, 9 Capacitor member, 10 Metal joining member, 11 Screw, 12 Metal joint member, 13 Heat radiation sheet, 14 pipe, 15 metal pipe, 21 opening, 31 ground pattern, 32 land pattern, 33 through hole, 34 through hole, 51 through hole, 91 capacitor.

The power conversion device according to the present invention has a land pattern and a ground pattern, and is provided on the substrate so as to cover the heat generating component and the substrate on which the heat generating component is provided so that the heat generating component is electrically connected to the land pattern. A shield plate that is electrically connected to the ground pattern, a metal housing that supports the substrate and is electrically connected to the ground pattern, and is provided on the substrate and is provided across the land pattern and the ground pattern. and a capacitor element which is, heat generated by the heat generating component, the shielding plate and conducted to the metallic chassis through the capacitor members, the structure of the shield plate, that has become a fin structure.

Claims (4)

A substrate having a land pattern and a ground pattern, and the heat generating component provided so that the heat generating component is electrically connected to the land pattern;
A shield plate provided on the substrate so as to cover the heat generating component and electrically connected to the ground pattern;
A metal housing that supports the substrate and is electrically connected to the ground pattern;
A capacitor member provided on the substrate and provided across the land pattern and the ground pattern;
The power conversion device in which heat released from the heat generating component is conducted to the shield plate and the metal casing through the capacitor member.   The power converter according to claim 1, wherein the capacitor member includes a ceramic capacitor.   The power conversion device according to claim 1, wherein the capacitor member includes a plurality of capacitors connected in parallel.   The metal bonding member provided over the said board | substrate and the said metal housing | casing, and further connecting the said ground pattern and the said metal housing | casing further, The metal joining member in any one of Claim 1-3 The power conversion device according to one item.

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