JP2010080615A - Multilayer capacitor, mounting structure for the multilayer capacitor and method for manufacturing the multilayer capacitor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multilayer capacitor capable of easily identifying a mounting direction, while realizing increase in the equivalent series resistance and decrease in the equivalent series inductance, and to provide a mounting structure of the multilayer capacitor and a method for manufacturing the multilayer capacitor. <P>SOLUTION: A capacitor blank 10 of the multilayer capacitor C1 has first and second main surface 101, 102; first and second side surfaces 103, 104 adjacent to both the first and second main surfaces; third and fourth side surfaces 105, 106 adjacent to both the first and second main surfaces; a first ridge portion 107 for coupling the first main surface to the first side surface; and a second ridge portion 108 for coupling the second main surface to the first side surface. The first and second ridge portions 107, 108 each have a curvature which bends in a convex manner, in a direction of separating from the center axis Ax of the capacitor blank 10, along the opposite direction of the third and fourth side surfaces. The first ridge portion 107 has a curvature which is smaller than that of the second ridge portion 108. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a multilayer capacitor, a multilayer capacitor mounting structure, and a multilayer capacitor manufacturing method.

  2. Description of the Related Art Conventionally, there is a multilayer capacitor that includes a capacitor body in which insulator layers and internal electrodes are alternately stacked, and a terminal electrode and an external connection conductor that are formed on the side surfaces of the capacitor body and are electrically insulated from each other. .

An example of such a multilayer capacitor is a multilayer capacitor described in Patent Document 1. This multilayer capacitor has four types of internal electrodes. Two of the internal electrodes are connected to both the terminal electrode and the external connection conductor. On the other hand, the other two types of internal electrodes are connected only to the external connection conductors and are not connected to the terminal electrodes. In the multilayer capacitor described in Patent Document 1, the equivalent series resistance is increased by providing the internal electrode that is not directly connected to the terminal electrode.
JP 2003-168621 A

  An object of the present invention is to provide a multilayer capacitor, a multilayer capacitor mounting structure, and a multilayer capacitor manufacturing method capable of easily identifying the mounting direction while realizing an increase in equivalent series resistance and a reduction in equivalent series inductance. .

  Incidentally, the multilayer capacitor described in Patent Document 1 is used as a decoupling capacitor in an IC, for example. In the present situation where the speed and voltage of ICs are increasing, it is required to realize both improvement of ESR (equivalent series resistance) and reduction of ESL (equivalent series inductance) in a multilayer capacitor.

  In a multilayer capacitor, the magnetic field generated due to the flowing current can be reduced by shortening the length of the current path flowing through the multilayer capacitor. Therefore, the inventor of the present application has mounted the internal electrode directly connected to both the terminal electrode and the external connection conductor so that the path of the current flowing from the land electrode formed on the circuit board to the terminal electrode is shortened. We came up with a multilayer capacitor placed in the vicinity.

  However, in such a multilayer capacitor, if it is mounted in a direction different from the intended direction, the current path from the land electrode to the internal electrode may be lengthened. In view of this, the inventors of the present application have made extensive studies on a multilayer capacitor having an increased equivalent series resistance and capable of identifying the mounting direction in which the equivalent series inductance is reduced. As a result, the inventors of the present application have come up with the present invention.

  Therefore, based on the above-described examination results, the multilayer capacitor according to the present invention includes the first and second main surfaces facing each other, the first and second main surfaces adjacent to each other, and the first and second main surfaces facing each other. A first ridge connecting the second side surface, the third and fourth side surfaces adjacent to each other and facing both the first and second main surfaces, and the first main surface and the first side surface And a second ridge that connects the second main surface and the first side surface, and a plurality of insulator layers are stacked in the opposing direction of the first and second main surfaces And a plurality of first and second internal electrodes arranged alternately in the first region in the capacitor body so as to face each other with at least one of the plurality of insulator layers interposed therebetween, and the capacitor body Each of at least one third and fourth internal electrodes disposed in the second region of The first internal electrode includes a first main electrode portion that forms a capacitance in cooperation with the second internal electrode, and a first lead electrode portion that connects the main electrode portion to the first external connection conductor And each second internal electrode has a second main electrode portion that forms a capacitance in cooperation with the first internal electrode, and the main electrode portion serves as a second external connection conductor. A second lead electrode portion to be connected, each third internal electrode having a third main electrode portion and a third lead electrode for connecting the third main electrode portion to the first external connection conductor An electrode portion and a fourth lead electrode portion connecting the third main electrode portion to the first terminal electrode. Each fourth internal electrode includes a fourth main electrode portion, a fourth main electrode portion, and a fourth main electrode portion. A fifth lead electrode portion for connecting the main electrode portion to the second external connection conductor, and a sixth lead electrode for connecting the fourth main electrode portion to the second terminal electrode. The first and second regions are juxtaposed along the stacking direction of the plurality of insulator layers, and the second region is more in the stacking direction than the first region. 2, the total number of third and fourth internal electrodes is smaller than the total number of first and second internal electrodes, and the first and second ridges are both And the curvature of the first ridge is curved in the direction away from the central axis of the capacitor body along the opposing direction of the third and fourth side surfaces, and the curvature of the first ridge is the curvature of the second ridge It is characterized by being smaller than.

  Since the multilayer capacitor described above includes the first and second internal electrodes connected only to the external connection conductor and the third and fourth internal electrodes connected to both the external connection conductor and the terminal electrode, The resistance can be increased. Furthermore, since the total number of the third and fourth internal electrodes is smaller than the total number of the first and second internal electrodes, the equivalent series resistance can be further increased. In the multilayer capacitor described above, the second region in which the third and fourth internal electrodes are disposed is second in the stacking direction than the first region in which the first and second internal electrodes are disposed. It is arranged on the main surface side. Therefore, when the second main surface is mounted on a substrate or the like as a mounting surface, the length of the current path that passes through the first and second terminal electrodes and reaches the third and fourth internal electrodes may be shortened. Thus, the equivalent series inductance can be reduced. Furthermore, in this multilayer capacitor, the curvature of the first ridge portion that connects the first main surface and the first side surface is the curvature of the second ridge portion that connects the second main surface and the first side surface. Smaller than. Therefore, the first main surface and the second main surface can be easily identified by visually comparing the curvatures of the ridges.

  The capacitor body further includes a third ridge portion that connects the first main surface and the second side surface, and a fourth ridge portion that connects the second main surface and the second side surface, Each of the third and fourth ridges has a curvature that curves convexly in a direction away from the central axis of the capacitor body along the opposing direction of the third and fourth side surfaces. The curvature of the ridge is preferably smaller than the curvature of the fourth ridge. In this case, the first main surface and the second main surface can be more easily identified.

  The capacitor element body has a rectangular parallelepiped shape that is curved so that the apex portion and the ridge portion have a curvature, the first and second main surfaces have a rectangular shape, and the first and second side surfaces have a first shape and a second side surface, respectively. The first and second main surfaces preferably extend in the long side direction, and the third and fourth side surfaces preferably extend in the short side direction of the first and second main surfaces. In this case, since the first and second ridges correspond to the long side direction of the rectangular first and second main surfaces, the difference in curvature can be easily identified.

  The third and fourth internal electrodes arranged in the capacitor body are preferably only one layer each. In this case, the equivalent series resistance can be further increased.

  The first external connection conductor is disposed on the first side surface of the capacitor body, the second external connection conductor is disposed on the second side surface of the capacitor body, and the first terminal electrode is formed on the capacitor body. The second terminal electrode may be disposed on the fourth side surface of the capacitor body.

  The width along the opposing direction of the third and fourth side surfaces of the third extraction electrode portion and the width along the opposing direction of the first and second side surfaces of the fourth extraction electrode portion are both the first The width of the fifth extraction electrode portion that is narrower than the width along the opposing direction of the third and fourth side surfaces, the width of the fifth extraction electrode portion along the opposing direction of the third and fourth side surfaces, and the sixth extraction electrode portion. It is preferable that the width along the opposing direction of the first and second side surfaces is narrower than the width along the opposing direction of the third and fourth side surfaces of the second extraction electrode portion. Thus, by narrowing the lead electrode portion of the internal electrode connected to the terminal electrode, the equivalent series resistance can be further increased.

  The width along the opposing direction of the third and fourth side surfaces of the third extraction electrode portion and the width along the opposing direction of the first and second side surfaces of the fourth extraction electrode portion are both the first Narrower than the width along the facing direction of the first and second side surfaces of the main electrode portion, narrower than the width along the facing direction of the third and fourth side surfaces of the first main electrode portion, and the first A width of the fifth extraction electrode portion that is wider than the third and fourth side surfaces in the opposing direction, and a width of the fifth extraction electrode portion in the opposite direction of the third and fourth side surfaces and the sixth extraction electrode. The width along the opposing direction of the first and second side surfaces of the portion is smaller than the width along the opposing direction of the first and second side surfaces of the second main electrode portion, and the second main electrode The third and fourth sides of the second lead electrode portion are narrower than the width along the opposing direction of the third and fourth side surfaces of the portion. It is preferably wider than the width along the opposing direction of the side surface. Thus, the equivalent series resistance is further increased by making the width of the lead electrode portion of the internal electrode connected to the terminal electrode narrower than the width of the main electrode portion of the internal electrode connected only to the external connection conductor. It becomes possible. Furthermore, by making the width of the extraction electrode portion of the third and fourth internal electrodes wider than the width of the extraction electrode portion of the first and second internal electrodes, the extraction electrode is not exposed on the surface of the capacitor body. The occurrence of so-called open defects can be suppressed.

  The width along the opposing direction of the first and second side surfaces of the fourth lead electrode portion is narrower than the width along the opposing direction of the third and fourth side surfaces of the third lead electrode portion, The width along the opposing direction of the first and second side surfaces of the extraction electrode portion is preferably narrower than the width along the opposing direction of the third and fourth side surfaces of the fifth extraction electrode portion.

  In this case, in the third and fourth internal electrodes, the width of the lead electrode portion for connecting the terminal electrode is narrower than the width of the lead electrode portion for connecting the external connection conductor, so that the equivalent series resistance is further increased. Is possible.

  A first or second internal electrode disposed closest to the second region in the first region, and a third or fourth internal electrode disposed closest to the first region in the second region. The interval between them is preferably larger than the interlayer distance between the first and second internal electrodes in the first region. In this case, the lead electrodes for connecting the terminal electrodes of the third and fourth internal electrodes are located near the second main surface. Therefore, when the second main surface is mounted facing the substrate or the like, the current path from the terminal electrode to the third and fourth internal electrodes can be shortened. This can be further reduced.

  A multilayer capacitor mounting structure according to the present invention includes the above multilayer capacitor and a circuit board on which at least two land electrodes and wirings are attached, and a second main surface faces the circuit board, and the multilayer capacitor has a first structure. The first and second terminal electrodes are connected to different land electrodes of at least two land electrodes, respectively.

  The method for manufacturing a multilayer capacitor in accordance with the present invention includes a capacitor body in which a plurality of insulator layers and first to fourth internal electrodes are stacked, a third internal body provided on the outer surface of the capacitor body, and A first terminal electrode connected to the electrode; a second terminal electrode provided on the outer surface of the capacitor element body; and connected to the fourth inner electrode; and provided on an outer surface of the capacitor element body; And a first external connection conductor connected to the third internal electrode, and a method of manufacturing a multilayer capacitor provided with second and fourth external connection conductors provided on the outer surface of the capacitor body. A first green region formed by laminating a plurality of ceramic green sheets corresponding to a part of the plurality of insulator layers and first and second internal electrode patterns corresponding to the first and second internal electrodes; , Corresponding to some of the multiple insulator layers Preparing a green laminate having a number of ceramic green sheets and a second green region in which third and fourth internal electrode patterns corresponding to the third and fourth internal electrodes are laminated; A second green region side of the green laminate is fixed with a mold, and the green laminate is pressed from the first green region side of the green laminate, and the green laminate is cut and fired to form a capacitor A firing step for obtaining an element body and an electrode formation step for forming first and second external connection conductors and first and second terminal electrodes on an outer surface of the capacitor element body are provided.

  In the manufacturing method described above, in the pressing step, the second green region side of the green laminate is fixed with a mold, and the green laminate is pressed from the first green region side. Therefore, disconnection of a portion corresponding to the lead electrode portion of the third and fourth internal electrode patterns corresponding to the third and fourth internal electrodes is suppressed. In the pressing step, the second green region side of the green laminate is fixed with a mold, and the green laminate is pressed from the first green region side. The side further shrinks at the periphery compared to the second green region side. Therefore, the direction of the obtained capacitor body can be easily identified.

  In the pressing step, the green laminate is preferably hydrostatically pressed. In this case, since the green laminated body is uniformly pressed, the peripheral portion of the green laminated body is further contracted as compared with the central portion, and the direction of the obtained capacitor element body is further easily identified.

  According to the present invention, it is possible to provide a multilayer capacitor, a multilayer capacitor mounting structure, and a multilayer capacitor manufacturing method capable of easily identifying the mounting direction while realizing an increase in equivalent series resistance and a reduction in equivalent series inductance. .

  Hereinafter, preferred embodiments will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

(First embodiment)
A configuration of the multilayer capacitor C1 according to the first embodiment will be described with reference to FIGS. FIG. 1 is a perspective view of the multilayer capacitor in accordance with the first embodiment. FIG. 2 is a side view of the multilayer capacitor in accordance with the first embodiment. FIG. 3A is a cross-sectional view taken along the line IIIa-IIIa of the multilayer capacitor in accordance with the first embodiment. FIG. 3B is a cross-sectional view taken along the arrow IIIb-IIIb of the multilayer capacitor in accordance with the first embodiment. FIG. 4 is an exploded perspective view of the capacitor body included in the multilayer capacitor in accordance with the first embodiment.

  As shown in FIG. 1, the multilayer capacitor C <b> 1 has a substantially rectangular parallelepiped capacitor element 10 that is curved so that its apex and ridges have a curvature, and a first capacitor element 10 disposed on the outer surface of the capacitor element 10. 1 terminal electrode 1 and second terminal electrode 2, and a first external connection conductor 3 and a second external connection conductor 4 disposed on the outer surface of the capacitor body 10.

  The capacitor body 10 includes a first main surface 101 and a second main surface 102 that are substantially rectangular and facing each other, a first side surface 103 and a second side surface 104 that are facing each other, and a third surface that is facing each other. A side surface 105 and a fourth side surface 106 are included. The first and second side surfaces 103 and 104 extend in the long side direction of the first and second main surfaces 101 and 102 so as to connect the first and second main surfaces 101 and 102. The third and fourth side surfaces 105 and 106 extend in the short side direction of the first and second main surfaces 101 and 102 so as to connect the first and second main surfaces 101 and 102.

  The 1st and 2nd main surfaces 101 and 102 and the 1st-4th side surfaces 103-106 exhibit the substantially rectangular shape curved so that the vertex part may have a curvature.

  The first and second side surfaces 103 and 104 are adjacent to both the first and second main surfaces 101 and 102, respectively. The third and fourth side surfaces 105 and 106 are adjacent to both the first and second main surfaces 101 and 102, respectively.

  The capacitor body 10 includes a first ridge 107 that connects the first main surface 101 and the first side surface 103, and a second ridge that connects the second main surface 102 and the first side surface 103. Part 108. The capacitor body 10 further includes a third ridge 109 that connects the first main surface 101 and the second side surface 104, and a fourth ridge that connects the second main surface 102 and the second side surface 104. And a ridge 110.

  The first ridge 107 extends from an edge on the first side surface 103 side of the first main surface 101 that is a flat surface to an edge on the first main surface 101 side of the first side surface 103 that is a flat surface. A curved surface. The second ridge 108 extends from the edge on the first side surface 103 side of the second main surface 102 that is a flat surface to the edge on the second main surface 102 side of the first side surface 103 that is a flat surface. A curved surface. The third ridge 109 extends from an edge on the second side surface 104 side of the first main surface 101 that is a flat surface to an edge on the first main surface 101 side of the second side surface 104 that is a flat surface. A curved surface. The fourth ridge portion 110 extends from an edge on the second side surface 104 side of the second main surface 102 that is a flat surface to an edge on the second main surface 102 side of the second side surface 104 that is a flat surface. A curved surface.

  Curvatures such that each of the first to fourth ridges 107 to 110 is convexly curved in a direction away from the central axis Ax of the capacitor body 10 along the facing direction of the third and fourth side surfaces 105 and 106. have. The central axis Ax passes through the centers of the third and fourth side surfaces 105 and 106.

  As shown in FIG. 3A, the curvature of the first ridge 107 is smaller than the curvature of the second ridge 108. The curvature of the third ridge 109 is smaller than the curvature of the fourth ridge 110. Here, the curvature of the first ridge 107 is the first main surface 101 of the first side surface 103 that is a plane from the edge on the first side surface 103 side of the first main surface 101 that is a plane. The average curvature of the curved surface to the side edge. The curvature of the second ridge portion 108 is the end of the first main surface 102 that is a plane from the end of the second main surface 102 that is a flat surface on the second main surface 102 side. The average curvature of the curved surface up to the edge. The curvature of the third ridge 109 is the edge on the first main surface 101 side of the second side surface 104 that is a flat surface from the edge of the first main surface 101 that is a flat surface on the second side surface 104 side. The average curvature of the curved surface up to the edge. The curvature of the fourth ridge 110 is the end of the second side surface 104 side of the second main surface 102 that is a flat surface to the end of the second side surface 104 that is a plane of the second main surface 102 side. The average curvature of the curved surface up to the edge.

  The first terminal electrode 1 extends over both the first and second main surfaces 101 and 102 on the third side surface 105 of the capacitor body 10 and on both the first and second side surfaces 103 and 104. It is arranged to straddle. That is, the first terminal electrode 1 covers the entire area of the third side surface 105, and the portions disposed on all of the first and second main surfaces 101 and 102 and the first and second side surfaces 103 and 104. Have. The second terminal electrode 2 extends on both the first and second main surfaces 101 and 102 on the fourth side surface 106 of the capacitor body 10 and on both the first and second side surfaces 103 and 104. It is arranged to straddle. That is, the second terminal electrode 2 covers portions of the first and second main surfaces 101 and 102 and the first and second side surfaces 103 and 104 while covering the entire area of the fourth side surface 106. Have.

  The first external connection conductor 3 passes on the first side surface 103 of the capacitor body 10, passes through the first ridge 107, straddles the first main surface 101, and passes through the second ridge 108. Then, they are arranged so as to straddle the second main surface 102. The first outer connecting conductor 3 is disposed at a substantially central position in the longitudinal direction of the first side surface 103. The second external connection conductor 4 passes on the second side surface 104 of the capacitor body 10, passes through the third ridge 109, straddles the first main surface 101, and passes through the fourth ridge 110. Then, they are arranged so as to straddle the second main surface 102. The second outer connecting conductor 4 is disposed at a substantially central position in the longitudinal direction of the second side surface 104.

  As shown in FIG. 4, the capacitor body 10 includes a first region 11 and a second region 12 that are juxtaposed along the opposing direction of the first and second main surfaces 101 and 102. The second region 12 is disposed closer to the second main surface 102 than the first region 11 in the facing direction of the first and second main surfaces 101 and 102. The capacitor body 10 includes a plurality of stacked insulator layers 21 to 29 and has dielectric characteristics.

  Each of the insulator layers 21 to 29 extends in a direction parallel to the first and second main surfaces 101 and 102, and is laminated in a direction opposite to the first and second main surfaces 101 and 102. Each insulator layer 21-29 is comprised from the sintered compact of the ceramic green sheet containing dielectric ceramic, for example. Each of the insulator layers 21 to 29 may be composed of, for example, a sintered body of a single ceramic green sheet, or may be composed of a sintered body of a plurality of ceramic green sheets. The insulator layers 21 and 29 may be thicker than the other insulator layers 22 to 28, for example, and the thickness may depend on the number of laminated ceramic green sheets or the thickness of the ceramic green sheets themselves. In the actual multilayer capacitor C1, the insulator layers 21 to 29 are integrated to such an extent that the boundaries between the insulator layers 21 to 29 cannot be visually recognized.

  As shown in FIG. 4, the first region 11 includes a plurality (seven layers in this embodiment) of insulator layers 21 to 27 and a plurality (three layers in this embodiment) of first internal electrodes 31. To 33 and a plurality (three layers in this embodiment) of second internal electrodes 41 to 43 are arranged. The first inner electrodes 31 to 33 and the second inner electrodes 41 to 43 are formed by stacking insulator layers 21 to 29 with one insulator layer 22 to 26 that is a part of the capacitor body 10 interposed therebetween. They are arranged alternately so as to face each other. The 1st and 2nd internal electrodes 31-33, 41-43 are comprised from the sintered compact of an electrically conductive paste.

  Each of the first internal electrodes 31 to 33 includes first main electrode portions 31a to 33a and first lead electrode portions 31b to 33b. The first main electrode portions 31a to 33a have a rectangular shape, and form a capacitance in cooperation with main electrode portions 41a to 43a of second internal electrodes 41 to 43 described later. The first lead electrode portions 31 b to 33 b extend so as to be drawn from the corresponding first main electrode portions 31 a to 33 a to the first side surface 103, and are mechanically and electrically connected to the first external connection conductor 3. Is done.

  Each of the second inner electrodes 41 to 43 includes second main electrode portions 41a to 43a and second lead electrode portions 41b to 43b. The second main electrode portions 41a to 43a have a rectangular shape and form a capacitance in cooperation with the main electrode portions 31a to 33a of the first inner electrodes 31 to 33. The second lead electrode portions 41 b to 43 b extend so as to be drawn from the corresponding second main electrode portions 41 a to 43 a to the second side surface 104, and are mechanically and electrically connected to the second external connection conductor 4. Is done.

  As shown in FIG. 4, the second region 12 includes a plurality of (in this embodiment, two layers) insulator layers 28 and 29, a single layer of the third internal electrode 51, and a main layer in this embodiment. In the embodiment, one layer of the fourth internal electrode 61 is disposed. The third internal electrode 51 and the fourth internal electrode 61 are opposed to each other in the stacking direction of the insulator layers 21 to 29 with one insulator layer 28 that is a part of the capacitor body 10 interposed therebetween. Has been placed. The 3rd and 4th internal electrodes 51 and 61 are comprised from the sintered compact of the electrically conductive paste.

  The third internal electrode 51 includes a third main electrode portion 51a, a third lead electrode portion 51b, and a fourth lead electrode portion 51c. The third main electrode portion 51a has a rectangular shape, and forms a capacitance in cooperation with the main electrode portion 43a of the second internal electrode 43 and the main electrode portion 61a of the fourth internal electrode 61 described later. . The third lead electrode portion 51 b extends so as to be drawn from the third main electrode portion 51 a to the first side surface 103 and is mechanically and electrically connected to the first external connection conductor 3. The fourth lead electrode portion 51 c extends so as to be drawn from the third main electrode portion 51 a to the third side surface 105, and is mechanically and electrically connected to the first terminal electrode 1.

  The fourth internal electrode 61 includes a fourth main electrode portion 61a, a fifth lead electrode portion 61b, and a sixth lead electrode portion 61c. The fourth main electrode portion 61 a has a rectangular shape and forms a capacitance in cooperation with the main electrode portion 51 a of the fifth internal electrode 51. The fifth lead electrode portion 61b extends so as to be drawn from the fourth main electrode portion 61a to the second side surface 104, and is mechanically and electrically connected to the second external connection conductor 4. The sixth extraction electrode portion 61c extends so as to be extracted from the fourth main electrode portion 61a to the fourth side surface 106, and is mechanically and electrically connected to the second terminal electrode 2.

  The total number of the third and fourth internal electrodes 51 and 61 is 2, which is smaller than 6, which is the total number of the first and second internal electrodes 31 to 33 and 41 to 43.

  Next, a method for manufacturing the multilayer capacitor C1 according to the embodiment will be described with reference to FIG. First, as shown in FIG. 5A, a plurality of ceramic green sheets and first and second internal electrodes 31 to 33 corresponding to a plurality of insulator layers (seven layers in this embodiment) 21 to 27, A first green region G11 in which first and second internal electrode patterns 131 to 133 and 141 to 143 corresponding to 41 to 43 are stacked, and a plurality of insulator layers (two layers in this embodiment) 28 , 29 and a second green region G12 in which a plurality of ceramic green sheets and third and fourth internal electrode patterns 151, 161 corresponding to the third and fourth internal electrodes 51, 61 are laminated. Are prepared (preparation step). The green multilayer body G1 includes a green multilayer chip G10 corresponding to a capacitor body of a plurality of multilayer capacitors.

  Subsequently, as shown in FIG. 5B, the second green region G12 side of the green laminate G1 prepared in the preparation step is fixed by the lower mold 121, and the upper side from the first green region G11 side is fixed. Using the mold 122, the green laminate G1 is pressed at a pressure F1 (pressing process). In the pressing step, as shown in FIG. 5C, the green laminate G1 is hydrostatically pressed at a pressure F2. Through the pressing process, the central portion of each green multilayer chip G10 in which the first to fourth internal electrode patterns 131 to 133, 141 to 143, 151, and 161 are stacked and the portion corresponding to the lead electrode portion of the internal electrode pattern are stacked. The shrinkage is greatly different from the end of each green laminated chip G10. That is, at the end portion of each green multilayer chip G10 in which the portions corresponding to the lead electrode portions of the internal electrode pattern are stacked, the shrinkage increases because all the internal electrode portions are not drawn there.

  Subsequently, the green multilayer body G1 is cut to obtain a plurality of green multilayer chips G10. Then, the obtained green multilayer chip G10 is fired to obtain the capacitor body 10 (firing step).

  Subsequently, the first and second external connection conductors 3 and 4 and the first and second terminal electrodes 1 and 2 are formed on the outer surface of the capacitor body 10 (electrode formation step).

  Next, referring to FIG. 6, the multilayer capacitor C <b> 1 according to the present embodiment is a circuit in which two different polarity land electrodes 201, 202 and wirings 203, 204 connected to the land electrodes 201, 202 are attached. A mounting structure to be mounted on the substrate S will be described. FIG. 6 is a diagram for explaining a cross-sectional configuration of a mounting structure in which the multilayer capacitor C1 is mounted on the circuit board S.

  As shown in FIG. 6, the multilayer capacitor C <b> 1 is mounted so that the second main surface 102 faces the circuit board S. Furthermore, the multilayer capacitor C1 is mounted such that the first and second terminal electrodes 1 and 2 are connected to the land electrodes 201 and 202, respectively. At this time, the first and second external connection conductors 3 and 4 are not directly connected to the land electrodes 201 and 202 formed on the circuit board S. Therefore, the signal current A passes through, for example, the wiring 203, the land electrode 201, the first terminal electrode 1, and the third internal electrode 51 in this order to form a capacitance, and the fourth internal electrode 61, 2 terminal electrode 2, land electrode 202, and wiring 204 are passed in this order.

  The multilayer capacitor C1 is connected to both the first and second internal electrodes 31 to 33 and 41 to 43 connected to only the external connection conductors 3 and 4 and the external connection conductors 3 and 4 and the terminal electrodes 1 and 2. Third and fourth internal electrodes 51 and 61 are provided. That is, the internal electrodes directly connected to the terminal electrodes 1 and 2 are only the third and fourth internal electrodes 51 and 61 among the plurality of internal electrodes 31 to 33, 41 to 43, 51 and 61. Therefore, in the multilayer capacitor C1, the equivalent series resistance can be increased.

  In particular, the total number of the third and fourth internal electrodes 51 and 61 is 2, which is smaller than the total number 6 of the first and second internal electrodes 31 to 33 and 41 to 44. Therefore, in the multilayer capacitor C1, the equivalent series resistance can be further increased.

  In the multilayer capacitor C1, the second region 12 in which the third and fourth internal electrodes 51 and 61 are disposed has the first and second internal electrodes 31 to 33 and 41 to 43 disposed in the stacking direction. It is arranged on the second main surface 102 side with respect to the first region 11 formed. Therefore, as shown in FIG. 6, when the second main surface 102 is mounted on a substrate or the like with the mounting surface as the mounting surface, the third and third electrodes 201 and 202, the first and second terminal electrodes 1 and 2 pass through The length of the current path of the signal current A reaching the fourth inner electrodes 51 and 61 can be shortened. Since the equivalent series inductance depends on the length of the current path, the value can be reduced.

  However, this is a case where the second main surface 102 is mounted facing the substrate S, and when the first main surface 101 side is mounted on the substrate S, the first and first are reversed. The path through the terminal electrodes 1 and 2 of 2 becomes long, and as a result, the equivalent series inductance is increased. On the other hand, in the multilayer capacitor C 1, the curvature of the first ridge 107 connecting the first main surface 101 and the first side surface 103 connects the second main surface 102 and the first side surface 103. Smaller than the curvature of the second ridge 108. Therefore, the ridge 107 observed when the multilayer capacitor C1 is viewed from the first main surface 101 side and the ridge 108 observed when the multilayer capacitor C1 is viewed from the second main surface 102 side. Since the curvatures are different, it is possible to easily identify the first main surface 101 side or the second main surface 102 side by visual observation. Therefore, it can be easily mounted in a direction that reduces the equivalent series inductance.

  In particular, in the multilayer capacitor C <b> 1, the curvature of the third ridge portion 109 that connects the first main surface 101 and the second side surface 104 is such that the second main surface 102 and the second side surface 104 are connected. It is smaller than the curvature of the four ridges 110. Therefore, in the multilayer capacitor C1, the first main surface 101 and the second main surface 102 can be identified more easily.

  Since each of the first and second ridges 107 and 108 and the third and fourth ridges 109 and 110 corresponds to the long side direction of the first or second main surface 101 or 102, a difference in curvature is caused. Identification becomes easier.

  In the multilayer capacitor C1, the third and fourth internal electrodes 51 and 61 arranged in the capacitor body 10 are each only one layer. Therefore, it is possible to further increase the equivalent series resistance.

  In the method of manufacturing the multilayer capacitor C1, in the pressing step, the second green region G12 side of the green multilayer body G1 is fixed by the mold 121, and the green multilayer body G1 is pressed from the first green region G11 side. Therefore, the portions corresponding to the third and fourth internal electrode patterns 151 and 161 corresponding to the third and fourth internal electrodes 51 and 61 are separated from the pressure application side, so that these are Disconnection is suppressed.

  In the pressing step, the second green region G12 side of the green laminate G1 is fixed by the mold 121, and the green laminate G1 is pressed from the first green region G11 side. Therefore, in the green laminated body G1, the 1st green area | region G11 side shrinks | reduces in a peripheral part much more compared with the 2nd green area | region G12 side. Therefore, in the obtained capacitor body 10, the curvatures of the first and third ridges 107 and 109 are smaller than the curvatures of the second and fourth ridges 108 and 110.

  Further, in the method of manufacturing the multilayer capacitor C1, the third and fourth internal electrode patterns 151 and 161 corresponding to the lead electrode portions 51b and 61b of the third and fourth internal electrodes 51 and 61 are formed from the stacking direction. There are no other overlapping conductors to see. That is, the density of the electrode pattern is low in the stacking direction. Therefore, the capacitor body 10 is more likely to shrink at that location.

  In the pressing step, since the green laminate G1 is hydrostatically pressed, the green laminate G1 is uniformly pressed. Therefore, the peripheral part of the green laminated body G1 is further contracted compared to the central part, and the direction of the obtained capacitor element body 10 can be more easily identified.

  FIG. 7 shows a multilayer capacitor C1A that is a modification of the multilayer capacitor C1 according to the first embodiment. In the multilayer capacitor C1A, the second internal electrode 43 disposed closest to the second region 12 in the first region 11, and the third internal electrode 43 disposed closest to the first region 11 in the second region 12. The interlayer distance D3, which is the distance between the internal electrode 51, is the interlayer distance D1 between the first and second internal electrodes 31-33, 41-43 in the first region 11 and the third and third in the second region 12. It is larger than the interlayer distance D2 of the fourth inner electrodes 51, 61.

  Therefore, in the multilayer capacitor C1A, the lead electrode portions 51b and 61b for connecting the terminal electrodes of the third and fourth internal electrodes 51 and 61 are positioned near the second main surface 102. Therefore, when the second main surface 102 is mounted facing the substrate S or the like, the current path from the terminal electrodes 1 and 2 to the third and fourth internal electrodes 51 and 61 is shortened. Therefore, the equivalent series inductance can be further reduced.

  Further, by arranging the third and fourth inner electrodes 51 and 61 closer to the second main surface 102 of the capacitor body 10, the occurrence of poor connection with the terminal electrodes 1 and 2 can be reduced. It becomes possible.

  In the case where the multilayer capacitor C1 has a 2012 shape, when it is mounted in the direction shown in FIG. 6, for example, the inductance is about 1/4 compared to the case where it is mounted in the opposite direction. Specifically, for example, when the inductance when mounted as shown in FIG. 6 with a signal of 1 GHz is 250 pH, the inductance when mounted in the opposite direction to FIG. 6 with a signal of 100 MHz is 1000 pH. Further, in the case where the multilayer capacitor C1 has a 2012 shape, when it is mounted in the direction shown in FIG. 6, for example, the impedance is about 1/5 to 1/10 as compared with the case where it is mounted in the opposite direction. Become.

(Second Embodiment)
Next, the multilayer capacitor according to the second embodiment will be described with reference to FIG. The multilayer capacitor in accordance with the second embodiment differs from the multilayer capacitor C1 in accordance with the first embodiment in the shape of the third and fourth internal electrodes 51, 61. FIG. 8 is an exploded perspective view of the capacitor body 70 provided in the multilayer capacitor in accordance with the second embodiment.

  The capacitor body 70 includes a first region 71 in which the first and second inner electrodes 31 to 33 and 41 to 43 are disposed, and a second region in which the third and fourth inner electrodes 51 and 61 are disposed. Region 72.

  The third internal electrode 51 includes a third main electrode portion 51a, a third lead electrode portion 51b, and a fourth lead electrode portion 51c. The third main electrode portion 51a has an L shape. The third lead electrode portion 51 b is an L-shaped extension portion of the third main electrode portion 51 a and extends so as to be drawn from the third main electrode portion 51 a to the first side surface 103. The third lead electrode portion 51 b is mechanically and electrically connected to the first external connection conductor 3. The fourth lead electrode portion 51 c is an extended portion of the other L-shaped piece of the third main electrode portion 51 a and extends so as to be drawn from the third main electrode portion 51 a to the third side surface 105. The fourth lead electrode portion 51 c is mechanically and electrically connected to the first terminal electrode 1.

  The fourth internal electrode 61 includes a fourth main electrode portion 61a, a fifth lead electrode portion 61b, and a sixth lead electrode portion 61c. The fourth main electrode portion 61a has an L shape. The fifth lead electrode portion 61 b is an L-shaped extension of the fourth main electrode portion 61 a and extends so as to be drawn from the fourth main electrode portion 61 a to the second side surface 104. The fifth lead electrode portion 61 b is mechanically and electrically connected to the second external connection conductor 4. The sixth lead electrode portion 61c is an extended portion of the other L-shaped piece of the fourth main electrode portion 61a, and extends so as to be drawn from the fourth main electrode portion 61a to the fourth side surface 106. The sixth lead electrode portion 61 c is mechanically and electrically connected to the second terminal electrode 2.

  The width W1 along the opposing direction of the third and fourth side surfaces 105, 106 of the third extraction electrode portion 51b and the opposing direction of the first and second side surfaces 103, 104 of the fourth extraction electrode portion 51c. The width W3 is smaller than the width W5 along the opposing direction of the third and fourth side surfaces 105 and 106 of the first extraction electrode portions 31b to 33b. That is, W1 <W5 and W3 <W5 hold.

  The width W3 along the opposing direction of the first and second side surfaces 103 and 104 of the fourth extraction electrode portion 51c is in the opposing direction of the third and fourth side surfaces 105 and 106 of the third extraction electrode portion 51b. It is narrower than the width W1 along. That is, W3 <W1 holds.

  The width W2 along the opposing direction of the third and fourth side surfaces 105, 106 of the fifth extraction electrode portion 61b and the opposing direction of the first and second side surfaces 103, 104 of the sixth extraction electrode portion 61c. The width W4 is smaller than the width W6 along the opposing direction of the third and fourth side surfaces 105 and 106 of the second extraction electrode portions 41b to 43b. That is, W2 <W6 and W4 <W6 hold.

  The width W4 along the opposing direction of the first and second side surfaces 103, 104 of the sixth extraction electrode portion 61c is in the opposing direction of the third and fourth side surfaces 105, 106 of the fifth extraction electrode portion 61b. Narrower than the width W2 along. That is, W4 <W2 holds.

  In the multilayer capacitor according to the second embodiment, the following effects are obtained in addition to the effects of the multilayer capacitor C1 according to the first embodiment.

  In the multilayer capacitor according to the second embodiment, W1 <W5, W3 <W5, W2 <W6, and W4 <W6 are established. That is, the fourth lead electrode portion 51 c of the third internal electrode 51 connected to the first terminal electrode 1 and the sixth lead electrode portion of the fourth internal electrode 61 connected to the second terminal electrode 2. 61c is narrower. Therefore, in the multilayer capacitor according to the second embodiment, the equivalent series resistance can be further increased.

  Furthermore, in the multilayer capacitor according to the second embodiment, W3 <W1 and W4 <W2 are established. That is, in the third and fourth inner electrodes 51 and 61, the widths of the fourth and sixth lead electrode portions 51c and 61c for connecting the terminal electrode are the same as the third and fifth lead electrodes for connecting the external connection conductor. It is narrower than the width of the portions 51b and 61b. Therefore, in the multilayer capacitor according to the second embodiment, the equivalent series resistance can be further increased.

(Third embodiment)
Next, the multilayer capacitor in accordance with the third embodiment will be explained based on FIG. The multilayer capacitor in accordance with the third embodiment is different from the multilayer capacitor C1 in accordance with the first embodiment in the shape of the third and fourth internal electrodes 51, 61. FIG. 9 is an exploded perspective view of the capacitor body 80 included in the multilayer capacitor in accordance with the third embodiment.

  The capacitor body 80 includes a first region 81 in which the first and second inner electrodes 31 to 33 and 41 to 43 are disposed, and a second region in which the third and fourth inner electrodes 51 and 61 are disposed. Region 82.

  The third internal electrode 51 includes a third main electrode portion 51a, a third lead electrode portion 51b, and a fourth lead electrode portion 51c. The third main electrode portion 51a has an L shape. The third lead electrode portion 51 b is an L-shaped extension portion of the third main electrode portion 51 a and extends so as to be drawn from the third main electrode portion 51 a to the first side surface 103. The third lead electrode portion 51 b is mechanically and electrically connected to the first external connection conductor 3. The fourth lead electrode portion 51 c is an extended portion of the other L-shaped piece of the third main electrode portion 51 a and extends so as to be drawn from the third main electrode portion 51 a to the third side surface 105. The fourth lead electrode portion 51 c is mechanically and electrically connected to the first terminal electrode 1.

  The fourth internal electrode 61 includes a fourth main electrode portion 61a, a fifth lead electrode portion 61b, and a sixth lead electrode portion 61c. The fourth main electrode portion 61a has an L shape. The fifth lead electrode portion 61 b is an L-shaped extension of the fourth main electrode portion 61 a and extends so as to be drawn from the fourth main electrode portion 61 a to the second side surface 104. The fifth lead electrode portion 61 b is mechanically and electrically connected to the second external connection conductor 4. The sixth lead electrode portion 61c is an extended portion of the other L-shaped piece of the fourth main electrode portion 61a, and extends so as to be drawn from the fourth main electrode portion 61a to the fourth side surface 106. The sixth lead electrode portion 61 c is mechanically and electrically connected to the second terminal electrode 2.

  The width W1 along the opposing direction of the third and fourth side surfaces 105 and 106 of the third extraction electrode portion 51b is the opposite of the first and second side surfaces 103 and 104 of the first main electrode portions 31a to 33a. Narrower than the width L2 along the direction, narrower than the width L1 along the opposing direction of the third and fourth side surfaces 105, 106 of the first main electrode portions 31a-33a, and the first lead electrode portion 31b. It is wider than the width W5 along the facing direction of the third and fourth side surfaces 105 and 106 of .about.33b. That is, W1 <L1, W1 <L2, and W1> W5 hold.

  The width W3 along the opposing direction of the first and second side surfaces 103 and 104 of the fourth lead electrode portion 51c is the opposite of the first and second side surfaces 103 and 104 of the first main electrode portions 31a to 33a. Narrower than the width L2 along the direction, narrower than the width L1 along the opposing direction of the third and fourth side surfaces 105, 106 of the first main electrode portions 31a-33a, and the first lead electrode portion 31b. It is wider than the width W5 along the facing direction of the third and fourth side surfaces 105 and 106 of .about.33b. That is, W3 <L1, W3 <L2, and W3> W5 hold.

  The width W2 along the opposing direction of the third and fourth side surfaces 105 and 106 of the fifth lead electrode portion 61b is the opposite of the first and second side surfaces 103 and 104 of the second main electrode portions 41a to 43a. Narrower than the width L4 along the direction, narrower than the width L3 along the opposing direction of the third and fourth side surfaces 105, 106 of the second main electrode portions 41a to 43a, and the second lead electrode portion 41b. It is wider than the width W6 along the opposing direction of the third and fourth side surfaces 105 and 106 of .about.43b. That is, W2 <L4, W2 <L3, and W2> W6 hold.

  The width W4 along the opposing direction of the first and second side surfaces 103 and 104 of the sixth lead electrode portion 61c is the opposite of the first and second side surfaces 103 and 104 of the second main electrode portions 41a to 43a. Narrower than the width L4 along the direction, narrower than the width L3 along the opposing direction of the third and fourth side surfaces 105, 106 of the second main electrode portions 41a to 43a, and the second lead electrode portion 41b. It is wider than the width W6 along the opposing direction of the third and fourth side surfaces 105 and 106 of .about.43b. That is, W4 <L4, W4 <L3, W4> W6 holds.

  In the multilayer capacitor in accordance with the third embodiment, the following effects are obtained in addition to the effects of the multilayer capacitor C1 in accordance with the first embodiment.

  In the multilayer capacitor in accordance with the third embodiment, W1 <L1, W1 <L2, W3 <L1, W3 <L2, W2 <L4, W2 <L3, W4 <L4, and W4 <L3. That is, in the multilayer capacitor in accordance with the third embodiment, the widths W1 to W4 of the lead electrode portions 51b, 51c, 61b, 61c of the internal electrodes 51, 61 connected to the terminal electrodes 1, 2 are set to the external connection conductors 3, 4 By making the widths L1 to L4 of the main electrode portions 31a to 33a and 41a to 43a of the internal electrodes 31 to 33 and 41 to 43 connected only to the inner electrodes 31 to 33, the equivalent series resistance can be further increased.

  Furthermore, in the multilayer capacitor according to the third embodiment, W1> W5, W3> W5, W2> W6, and W4> W6 are established. That is, the widths W1 to W4 of the extraction electrode portions 51b, 51c, 61b, and 61c of the third and fourth internal electrodes 51 and 61 are the extraction electrode portions of the first and second internal electrodes 31 to 33 and 41 to 43, respectively. It is wider than the widths W5 and W6 of 31b to 34b and 41b to 44b. Therefore, in the multilayer capacitor according to the third embodiment, the occurrence of open defects can be suppressed.

The preferred embodiments of the present invention have been described above. However, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.
For example, the number of laminated insulator layers 21 to 29 and the internal electrodes 31 to 33, 41 to 44, 51 and 61, the number of terminal electrodes 1 and 2, and the number of external connection conductors 3 and 4 are the same as those in the embodiment and the modification. The number is not limited. The arrangement of the terminal electrodes 1 and 2 and the external connection conductors 3 and 4 is not limited to the arrangement in the embodiment and the modified example. Further, the second regions 12, 72, 82 may have more third and fourth internal electrodes 51, 61, respectively. The curvature of the third ridge 109 may be greater than or equal to the curvature of the fourth ridge 110.

1 is a perspective view of a multilayer capacitor according to a first embodiment. 1 is a side view of a multilayer capacitor according to a first embodiment. 1 is a cross-sectional view of a multilayer capacitor according to a first embodiment. It is a disassembled perspective view of the capacitor body with which the multilayer capacitor concerning a 1st embodiment is provided. It is a figure for demonstrating the manufacturing method of the multilayer capacitor which concerns on 1st Embodiment. It is a figure for demonstrating the cross-sectional structure of the mounting structure which mounted the multilayer capacitor in the circuit board. It is sectional drawing of the modification of the multilayer capacitor which concerns on 1st Embodiment. It is a disassembled perspective view of the capacitor body with which the multilayer capacitor concerning a 2nd embodiment is provided. It is a disassembled perspective view of the capacitor body with which the multilayer capacitor concerning a 3rd embodiment is provided.

Explanation of symbols

C1 ... multilayer capacitor, 10, 70, 80 ... capacitor body, 101 ... first main surface, 102 ... second main surface, 103-106 ... first to fourth side surfaces, 107-110 ... first to first 4th edge part, 1 ... 1st terminal electrode, 2 ... 2nd terminal electrode, 3 ... 1st external connection conductor, 4 ... 2nd external connection conductor, 11, 71, 81 ... 1st area | region , 12, 72, 82 ... second region, 21-29 ... insulator layer, 31-33 ... first internal electrode, 31a-33a ... first main electrode portion, 31b-33b ... first extraction electrode Part 41-43 ... 2nd internal electrode, 41a-43a ... 2nd main electrode part, 41b-43b ... 2nd extraction electrode part, 51 ... 3rd internal electrode, 51a ... 3rd main electrode part , 51b ... third extraction electrode portion, 51c ... fourth extraction electrode portion, 61 ... fourth interior Electrode, 61a ... fourth main electrode portion of, 61b ... fifth lead electrode portion of, 61c ... sixth lead electrode portion of the.

Claims (12)

The first and second main surfaces facing each other, the first and second side surfaces adjacent to each other and facing each other, and the first and second main surfaces. Third and fourth side surfaces adjacent to each other and facing each other, a first ridge portion connecting the first main surface and the first side surface, the second main surface and the first A capacitor body having a plurality of insulator layers laminated in the opposing direction of the first and second main surfaces, and a second ridge portion connecting the side surfaces of the first and second main surfaces;
A plurality of first and second internal electrodes alternately arranged in a first region in the capacitor body so as to face each other with at least one of the plurality of insulator layers interposed therebetween;
Each of at least one third and fourth internal electrodes disposed in a second region in the capacitor body,
Each of the first internal electrodes includes a first main electrode portion that forms a capacitance in cooperation with the second internal electrode, and a first main electrode portion that connects the main electrode portion to the first external connection conductor. 1 extraction electrode portion, and
Each of the second internal electrodes includes a second main electrode portion that forms a capacitance in cooperation with the first internal electrode, and a second main electrode portion that connects the main electrode portion to the second external connection conductor. Two lead electrode portions,
Each of the third internal electrodes includes a third main electrode portion, a third lead electrode portion connecting the third main electrode portion to the first external connection conductor, and the third main electrode portion. A fourth lead electrode portion connecting the first terminal electrode to the first terminal electrode,
Each of the fourth internal electrodes includes a fourth main electrode portion, a fifth lead electrode portion connecting the fourth main electrode portion to the second external connection conductor, and the fourth main electrode portion. And a sixth lead electrode portion connecting the second terminal electrode to the second terminal electrode,
The first and second regions are juxtaposed along the stacking direction of the plurality of insulator layers, and the second region is more second in the stacking direction than the first region in the stacking direction. It is arranged on the surface side,
The total number of the third and fourth internal electrodes is less than the total number of the first and second internal electrodes;
Each of the first and second ridges has a curvature that curves convexly in a direction away from the central axis of the capacitor body along the opposing direction of the third and fourth side surfaces. ,
The multilayer capacitor characterized in that the curvature of the first ridge is smaller than the curvature of the second ridge. The capacitor body includes a third ridge portion that connects the first main surface and the second side surface, and a fourth ridge portion that connects the second main surface and the second side surface. And further comprising
Each of the third and fourth ridges has a curvature that curves convexly in a direction away from the central axis of the capacitor body along the opposing direction of the third and fourth side surfaces. And
The multilayer capacitor according to claim 1, wherein the curvature of the third ridge is smaller than the curvature of the fourth ridge. The capacitor body has a rectangular parallelepiped shape that is curved so that the apex portion and the ridge portion have a curvature,
The first and second main surfaces have a rectangular shape,
The first and second side surfaces extend in a long side direction of the first and second main surfaces,
The multilayer capacitor according to claim 1, wherein the third and fourth side surfaces extend in a short side direction of the first and second main surfaces.   4. The multilayer capacitor according to claim 1, wherein each of the third and fourth internal electrodes arranged in the capacitor body has only one layer. 5. The first external connection conductor is disposed on the first side surface of the capacitor body,
The second external connection conductor is disposed on the second side surface of the capacitor body,
The first terminal electrode is disposed on the third side surface of the capacitor body,
5. The multilayer capacitor according to claim 1, wherein the second terminal electrode is disposed on the fourth side surface of the capacitor body. 6. The width of the third extraction electrode portion along the opposing direction of the third and fourth side surfaces and the width of the fourth extraction electrode portion along the opposing direction of the first and second side surfaces are both , Narrower than the width along the opposing direction of the third and fourth side surfaces of the first lead electrode portion,
The width along the facing direction of the third and fourth side surfaces of the fifth lead electrode portion and the width along the facing direction of the first and second side surfaces of the sixth lead electrode portion are both 6. The multilayer capacitor according to claim 5, wherein the width of the second lead electrode portion is narrower than the width along the opposing direction of the third and fourth side surfaces. The width of the third extraction electrode portion along the opposing direction of the third and fourth side surfaces and the width of the fourth extraction electrode portion along the opposing direction of the first and second side surfaces are both , Narrower than the width of the first main electrode portion along the opposing direction of the first and second side surfaces, and along the opposing direction of the third and fourth side surfaces of the first main electrode portion. Narrower than the width and wider than the width along the opposing direction of the third and fourth side surfaces of the first extraction electrode portion,
The width along the facing direction of the third and fourth side surfaces of the fifth lead electrode portion and the width along the facing direction of the first and second side surfaces of the sixth lead electrode portion are both , Narrower than the width of the second main electrode portion along the opposing direction of the first and second side surfaces, and along the opposing direction of the third and fourth side surfaces of the second main electrode portion. 6. The multilayer capacitor according to claim 5, wherein the multilayer capacitor is narrower than a width and wider than a width along a facing direction of the third and fourth side surfaces of the second lead electrode portion. The width of the fourth lead electrode portion along the facing direction of the first and second side surfaces is narrower than the width of the third lead electrode portion along the facing direction of the third and fourth side surfaces. ,
The width of the sixth lead electrode portion along the facing direction of the first and second side surfaces is larger than the width of the fifth lead electrode portion along the facing direction of the third and fourth side surfaces. The multilayer capacitor according to claim 5, wherein the multilayer capacitor is narrow.   The first or second internal electrode disposed closest to the second region in the first region, and the third or fourth internal electrode disposed closest to the first region in the second region. The multilayer capacitor according to claim 1, wherein a distance between the internal electrodes is larger than an interlayer distance between the first and second internal electrodes in the first region. A multilayer capacitor according to any one of claims 1 to 9,
A circuit board having at least two land electrodes and wiring attached thereto,
The second main surface faces the circuit board;
The multilayer capacitor mounting structure, wherein the first and second terminal electrodes of the multilayer capacitor are respectively connected to different land electrodes of the at least two land electrodes. A capacitor element body in which a plurality of insulator layers and first to fourth internal electrodes are laminated, and a first terminal provided on the outer surface of the capacitor element body and connected to the third internal electrode An electrode, a second terminal electrode provided on the outer surface of the capacitor element body and connected to the fourth inner electrode, and an outer surface of the capacitor element element and the first and third inner electrodes A method for producing a multilayer capacitor comprising: a first external connection conductor connected to an electrode; and the second and fourth external connection conductors provided on the outer surface of the capacitor body,
A first green region formed by laminating a plurality of ceramic green sheets corresponding to a part of the plurality of insulator layers and first and second internal electrode patterns corresponding to the first and second internal electrodes. And a plurality of ceramic green sheets corresponding to a part of the plurality of insulator layers and a third and fourth internal electrode patterns corresponding to the third and fourth internal electrodes, A preparation step of preparing a green laminate having a green region;
A pressing step of fixing the second green region side of the green laminate with a mold and pressing the green laminate from the first green region side of the green laminate;
A firing step of cutting and firing the green laminate to obtain a capacitor body;
An electrode forming step of forming first and second external connection conductors and first and second terminal electrodes on the outer surface of the capacitor element body. The method for manufacturing a multilayer capacitor according to claim 11, wherein the green multilayer body is hydrostatically pressed in the pressing step.

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