JP2004221184A - Compression bonding device and method for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component compression bonding device and method for uniformly compression bonding an electronic component to a substrate in the simplified and low cost structure. <P>SOLUTION: The device performs the compression bonding of the electronic component 8 using a compression bonding head 21 to the edge of a substrate 7 held with a substrate holding portion 6. In this device, when pressing the head 21 to the substrate 7 down-loaded with a down-loading portion 17 by applying the pressing force F to the head 21 from the upper side with a cylinder 24, a reaction force R of pressing work in the upper direction during pressing work with the cylinder 24 is received by an upper frame 12, and this upper frame 12 and a base 10 for supporting the down-loading portion 17 are coupled and fixed with a side frame having the higher rigidity for receiving the load during the pressing work as a load. Accordingly, application of a bending load to the mechanical portions such as the head 21 and head holding unit 18 can be prevented and electronic components can be uniformly crimped in the simplified and low cost structure. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component crimping apparatus and a method for crimping an electronic component to an edge of a substrate such as a display panel.
[0002]
[Prior art]
At the edge of a substrate such as a display panel such as a liquid crystal panel or a plasma display, a plurality of electronic components such as a driver flip chip and a tape carrier package having a bare chip mounted on a film carrier are mounted in parallel. When mounting these electronic components, a large number of connection terminals such as bumps and outer leads formed on the lower surface of the electronic components at narrow pitches are aligned with the electrodes arranged side by side at the edge of the substrate, and the electronic components are mounted on the substrate. To press the connection terminal to the electrode.
[0003]
In this mounting operation by crimping, it is necessary to press the electronic component while keeping it in a position strictly parallel to the substrate. For this reason, a crimping tool that contacts and presses an electronic component and a pressurizing mechanism that applies a load to the crimping tool are separately provided so that a moment due to the pressing load is not transmitted to the crimping tool. (See Patent Document 1).
[0004]
[Patent Document 1]
JP-A-63-232345 (FIG. 1)
[0005]
[Problems to be solved by the invention]
However, in the electronic component crimping apparatus described in the above prior art, the pressing mechanism provided separately from the crimping tool has low rigidity, and it is difficult to generate a high pressing force for electronic components that require a high crimping load. Met. In order to enable a high crimping load in the above-described configuration, it is necessary to use mechanical parts such as guides having high rigidity, and there has been a problem that the entire mechanism becomes complicated and expensive.
[0006]
Therefore, an object of the present invention is to provide an electronic component crimping apparatus and an electronic component crimping method capable of uniformly crimping an electronic component to a substrate with a simple and low-cost structure.
[0007]
[Means for Solving the Problems]
The electronic component crimping device according to claim 1, wherein the electronic component crimping device is configured to crimp the electronic component by a crimping head to a substrate held by a substrate holding unit, the electronic component crimping device being supported by a base and receiving the substrate from below. A receiving portion, a head holding portion for holding the crimping head so as to be able to move up and down, and raising and lowering the crimping head with respect to the head holding portion, and applying a pressing force to the crimping head from above to lower the receiving portion with the lower receiving portion. Lifting and lowering mechanism for pressing against the substrate, a reaction receiving portion for receiving an upward pressing reaction force when pressed by the lifting and lowering mechanism, and fixedly connecting the reaction receiving portion and the base. Then, the connecting part to which the load at the time of pressing is applied, and the pressing head unit including the pressing head, the head holding part, and the lifting / lowering pressing mechanism are relatively horizontally moved with respect to the substrate. And a horizontal movement means.
[0008]
An electronic component crimping apparatus according to a second aspect is the electronic component crimping apparatus according to the first aspect, wherein the head holding portion and the lower receiving portion are connected and horizontally move integrally.
[0009]
An electronic component crimping device according to a third aspect is the electronic component crimping device according to the first or second aspect, further comprising fixing means for fixing the lower receiving portion to the base.
[0010]
An electronic component crimping device according to a fourth aspect is the electronic component crimping device according to the first to third aspects, further comprising a plurality of the crimping head units, wherein a pressing reaction force of the lifting / lowering pressing mechanism is used as a common reaction force receiving portion. Receive by
[0011]
The method for crimping an electronic component according to claim 5, wherein: a lower receiving portion that is supported by the base portion and receives the substrate from the lower surface side; a head holding portion that holds the pressure bonding head so as to be able to move up and down; An elevating / lowering pressing mechanism that raises and lowers the pressing head and applies a pressing force to the pressing head from above, a reaction receiving portion that receives an upward pressing reaction force when pressed by the lifting and lowering mechanism, An electronic component crimping apparatus comprising: a connecting portion for fixedly connecting a base portion; and a horizontal moving unit for relatively horizontally moving a pressing head unit including a pressing head, a head holding unit, and a lifting / lowering pressing mechanism with respect to the substrate. An electronic component crimping method for crimping an electronic component to the board by a crimping head, wherein the crimping head unit is moved relative to an electronic component mounting target position on the board. A positioning step of moving horizontally to position the electronic component mounting target, a pressing head lowering step of lowering the pressing head by the lifting / lowering pressing mechanism, and applying a pressing force to the pressing head from above by the lifting / lowering pressing mechanism. A pressing step of pressing the electronic component against the substrate by pressing against the substrate received by the lower receiving portion, and in the pressing step, the upward pressing reaction force when pressed by the lifting / lowering pressing mechanism is used. The load at the time of the pressing is applied to the connecting portion which is received by the reaction force receiving portion and fixedly connects the reaction force receiving portion and the base.
[0012]
According to the present invention, a pressing step in which a pressing force is applied to a pressure bonding head from above by a lifting / lowering pressing mechanism, and a pressure bonding head is pressed against a substrate received by a lower receiving portion, thereby pressing an electronic component onto a substrate. In the above, the upward pressing reaction force at the time of pressing by the lifting / lowering pressing mechanism is received by the reaction force receiving portion, and the load at the time of pressing is applied to the connecting portion for fixedly connecting the reaction force receiving portion and the base supporting the lower receiving portion. By applying a pressure, it is possible to prevent a bending load from acting on the crimping head and the mechanism for holding the crimping head, and it is possible to uniformly crimp the electronic component to the substrate with a simple and low-cost structure. .
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a display panel assembling apparatus according to an embodiment of the present invention, FIG. 2 is a front view of an electronic component crimping apparatus according to an embodiment of the present invention, and FIG. FIG. 4 is a side view of a component crimping apparatus, FIG. 4 is a flowchart of an electronic component crimping method according to an embodiment of the present invention, and FIGS. 5 and 6 are operation explanatory diagrams of the electronic component crimping apparatus according to an embodiment of the present invention. .
[0014]
First, the configuration of the display panel assembling apparatus will be described with reference to FIG. In FIG. 1, an ACF attaching section 2, a component mounting section 3, and a component crimping section 4 are disposed on the upper surface of the base 1 from the upstream side (left side in FIG. 1). Positioning tables 5A, 5B, 5C having a substrate holding section 6 are arranged.
[0015]
The substrate 7 transported from the upstream side is carried into the positioning table 5A and held by the substrate holding unit 6. Then, the positioning table 5A is driven to position the substrate 7 with respect to the tape sticking unit 2a, and the tape sticking unit 2a performs a tape sticking operation, so that the ACF tape cut to a fixed size at the edge of the substrate 7 (Anisotropic conductive tape) is adhered.
[0016]
The substrate 7 to which the ACF tape has been attached is transported to the positioning table 5B, and is held by the substrate holding unit 6. The electronic component 8 (see FIG. 3) is mounted on the ACF tape adhered to the substrate 7 by aligning the substrate 7 with the component mounting unit 3a and causing the component mounting unit 3a to perform a component mounting operation. Tentatively crimped.
[0017]
Next, the board 7 on which the components are mounted is transported to the positioning table 5B and held by the board holding unit 6. Then, the board 7 is aligned with the component crimping unit 4a, and the component crimping unit 4a performs a crimping operation, whereby the electronic component in the temporarily crimped state is completely crimped to the board 7 by heat and load.
[0018]
Next, the structure of the component crimping unit 4a will be described with reference to FIGS. As described above, the component crimping unit 4a has a configuration as an electronic component crimping apparatus that crimps an electronic component to an edge of the substrate 7 held by the substrate holding unit 6 using a crimping head described below.
[0019]
2 and 3, on the upper surface of the base 1, an elongated base 10 that supports the entire component crimping unit 4a is disposed in the board transfer direction. Side frames 11 are erected on both ends of the base 10, and the upper ends of the side frames 11 are rigidly connected by a horizontal upper frame 12. The two side frames 11 and the upper frame 12 constitute a portal frame whose lower end is fixed to the base 10.
[0020]
A guide rail 14 is disposed on the upper surface of the base 10 in the substrate transfer direction. Three sliders 15 slidably fitted on the guide rail 14 are provided with pressure bonding head units 13A, 13B, 13C is bound. The pressure bonding head units 13A, 13B, and 13C are connected to belts 26A, 26B, and 26C, which are horizontally extended by a pair of pulleys 27, via connecting members 25, respectively, and the belts 26A, 26B, and 26C are connected to each other. Each is driven by a motor 28A, 28B, 28C.
[0021]
By driving the motors 28A, 28B, 28C, the pressure bonding head units 13A, 13B, 13C move in the horizontal direction via the belts 26A, 26B, 26C, respectively. Thus, the pressure bonding position of the pressure bonding head units 13A, 13B, 13C to the substrate 7 can be adjusted. Therefore, the motors 28A, 28B, 28C and the belts 26A, 26B, 26C serve as horizontal movement means for horizontally moving the pressure bonding head units 13A, 13B, 13C relative to the substrate 7 held by the substrate holding unit 6. Has become.
[0022]
As shown in FIG. 3, an electromagnet 9 for fixing the position is embedded in the crimping position set on the base 10, and the electromagnet 9 is excited in a state where the crimping head units 13A, 13B, 13C have moved to the crimping position. Thereby, the positions of the lower receiving portion 17 and the pressure bonding head units 13A, 13B, 13C are firmly fixed via the slider 15 which is a magnetic material and the bottom plate 16 connected thereto. Therefore, the electromagnet 9 serves as fixing means for fixing the lower receiving portion 17 supporting the substrate 7 to the base 10.
[0023]
Next, the configuration of the pressure bonding head units 13A, 13B, 13C will be described. As shown in FIG. 3, the lower end of the vertical head holding portion 18 is fixed to the bottom plate 16, and the lower receiving portion 17 is disposed on the bottom plate 16. The lower receiving portion 17 receives the edge of the substrate 7 from the lower surface side when the electronic component is pressed onto the substrate 7. In this configuration, the lower receiving portion 17 is connected to the head holding portion 18 and horizontally moves integrally. A pressure bonding head 21 is held on the head holding portion 18 by a slide mechanism including a guide rail 19 and a slider 20 so as to be able to move up and down.
[0024]
The crimping head 21 includes a crimping tool 21a at a lower end, and a cylinder 24 is coupled to the upper end with the rod 24a facing upward. Further, the pressure bonding head 21 is urged upward by a tension spring 23. The pressure bonding head 21 is pushed down by driving the cylinder 24 to protrude the rod 24 a and bring the upper end of the rod 24 a into contact with the upper frame 12. At this time, the crimping tool 21a presses the edge of the substrate 7 downward by bringing the crimping tool 21a into contact with the substrate 7 whose edge is received by the lower receiving portion 17.
[0025]
Then, when the driving of the cylinder 24 is stopped and the rod 24 a is retracted, the pressure bonding head 21 is pulled upward by the urging force of the tension spring 23. Accordingly, the cylinder 24 and the tension spring 23 raise and lower the pressure bonding head 21 with respect to the head holding portion 18, and apply a pressing force to the pressure bonding head 21 from above to thereby prevent the edge of the substrate 7 received by the lower receiving portion 17. It is an elevating and lowering pressing mechanism for pressing against the part. In addition to the combination of the cylinder 24 and the tension spring 23 shown here, various mechanisms such as a linear motion mechanism using a motor and a feed screw can be used as the lifting / lowering mechanism.
[0026]
This component crimping unit is configured as described above. Next, referring to the flow of FIG. 4 and FIGS. 5 and 6, the electronic component crimping operation in the display panel assembling process and the pressing reaction force in the component crimping operation will be described. The support will be described. Prior to the start of the electronic component crimping operation, an ACF tape is attached to the edge of the substrate 7 by the ACF attaching section 2, and electronic components such as a flip chip for a driver of a display panel are mounted on the ACF tape. Then, it is temporarily crimped. Then, the board 7 in this state is placed on the board holding section 6 of the component crimping section 4.
[0027]
First, the positioning table 5 is driven to align the edge of the substrate 7 held by the substrate holding portion 6 with the lower receiving portion 17 (see FIG. 4), and then the substrate 7 on which the electronic component 8 is mounted is mounted. Then, the pressure bonding head units 13A, 13B, and 13C are relatively horizontally moved to align with the electronic component 8 as the electronic component mounting target position (positioning step) (ST1). Then, the position of each pressure bonding head unit is fixed by the electromagnet 9.
[0028]
Next, the pressure bonding head 21 is lowered by projecting the rod 24a of the cylinder 24 and making contact with the lower surface of the upper frame 12, and the pressure bonding tool 21a is brought into contact with the upper surface of the electronic component 8 (pressure bonding head lowering step) (ST2). ). Thereafter, by continuing to pressurize the cylinder 24, a pressing force F is applied to the pressure bonding head 21 from above to press the edge of the substrate 7 received by the lower receiving portion 17 (pressing step). (ST3). Then, the electronic component 8 is heated by the crimping tool 21a while maintaining the pressed state (ST4). By continuing the pressing and heating for a predetermined time, the electronic component 8 is pressed against the edge of the substrate 7 via the ACF tape.
[0029]
In this pressing step, an upward pressing reaction force R when pressed by the cylinder 24 is supported by the upper frame 12 as shown in FIGS. Therefore, the upper frame 12 is a reaction force receiving portion that receives an upward pressing reaction force R by the cylinder 24.
[0030]
This reaction force receiving portion is configured to receive the pressing reaction force R of the cylinder 24 of each of the plurality of pressure bonding head units 13A, 13B, 13C by the common upper frame 12. The pressing reaction force R is transmitted to the base 10 by the portal frame composed of the upper frame 12 and the side frame 11, where the pressing force F is balanced by the pressing force F, whereby the load at the time of pressing generated by the cylinder 24 is held. You.
[0031]
That is, the side frame 11 is a connecting portion that connects the upper frame 12, which is a reaction force receiving portion, to the base 10. In this configuration of the connecting portion, a large upward load acts on the portal frame, but since both the upper frame 12 and the side frame 11 are structural members that can easily ensure high rigidity, they are necessary and sufficient. High strength.
[0032]
On the other hand, as shown in FIGS. 5 and 6, a cylinder 24 positioned immediately above the electronic component 8 to be pressed is applied to a mechanical portion including a movable portion such as the pressure bonding head 21 and the head holding portion 18. The pressing force F is applied only in the form of an axial compressive load. That is, a bending load does not act on a mechanism portion such as the pressure bonding head 21 in the transmission path of the pressing force F.
[0033]
Therefore, at the time of pressing by the pressure bonding head 21, the electronic component can be maintained in a posture that is correctly parallel to the substrate, and even when targeting an electronic component requiring a high pressure bonding load, a high rigidity pressure bonding mechanism is not required. With a simple and low-cost structure, an electronic component can be uniformly pressed on a substrate.
[0034]
Note that, in the above-described example, the crimping head presses the electronic component in a state where the electronic component is mounted in advance on the substrate at the electronic component mounting target position, but the present invention is not limited to this. For example, the present invention can also be applied to a case where a crimping head holds an electronic component by vacuum suction or the like, and the electronic component is pressed against a position on the substrate where the electronic component is to be mounted by the crimping head.
[0035]
【The invention's effect】
According to the present invention, a pressing step in which a pressing force is applied to a pressure bonding head from above by a lifting / lowering pressing mechanism, and a pressure bonding head is pressed against a substrate received by a lower receiving portion, thereby pressing an electronic component onto a substrate. In the above, the upward pressing reaction force at the time of pressing by the lifting / lowering pressing mechanism is received by the reaction force receiving portion, and the load at the time of pressing is applied to the connecting portion for fixedly connecting the reaction force receiving portion and the base supporting the lower receiving portion. To prevent the bending load from acting on the crimping head and the mechanism holding the crimping head, and to uniformly crimp the electronic component onto the substrate with a simple and low-cost structure. Can be.
[Brief description of the drawings]
FIG. 1 is a perspective view of a display panel assembling apparatus according to an embodiment of the present invention; FIG. 2 is a front view of an electronic component crimping apparatus according to an embodiment of the present invention; FIG. FIG. 4 is a side view of an electronic component crimping apparatus. FIG. 4 is a flowchart of an electronic component crimping method according to an embodiment of the present invention. FIG. 5 is an operation explanatory diagram of an electronic component crimping apparatus according to an embodiment of the present invention. Explanatory drawing of operation of an electronic component crimping apparatus according to an embodiment of the present invention [Description of reference numerals]
2 ACF adhering part 3 Component mounting part 4 Component crimping part 6 Substrate holding part 10 Base part 11 Side frame 12 Upper frames 13A, 13B, 13C Crimping head unit 17 Lower receiving part 18 Head holding part 21 Crimping head 23 Tension spring 24 Cylinder

Claims (5)

An electronic component crimping apparatus for crimping an electronic component by a crimping head to a substrate held by a substrate holding unit, the lower receiving unit being supported by a base and receiving the substrate from a lower surface side, and allowing the crimping head to move up and down. A head holding unit for holding, and a lifting / lowering press for raising / lowering the pressure bonding head with respect to the head holding unit and applying a pressing force to the pressure bonding head from above to press against the substrate received by the lower receiving unit A mechanism, a reaction force receiving portion that receives an upward pressing reaction force when pressed by the lifting / lowering pressing mechanism, and a connection in which the reaction force receiving portion is fixedly connected to the base to receive a load during the pressing. And a horizontal moving unit for relatively horizontally moving a pressure bonding head unit including the pressure bonding head, the head holding unit, and the lifting / lowering pressing mechanism with respect to the substrate. Electronic parts crimping machine to. 2. The electronic component crimping apparatus according to claim 1, wherein the head holding unit and the lower receiving unit are connected and horizontally move integrally. 3. The electronic component crimping apparatus according to claim 1, further comprising a fixing unit that fixes the lower receiving portion to the base. 4. The electronic component crimping apparatus according to claim 1, wherein a plurality of the crimping head units are provided, and a pressing reaction force of the lifting and lowering mechanism is received by a common reaction force receiving unit. 5. A lower receiving portion that is supported by the base portion and receives the substrate from the lower surface side; a head holding portion that holds the pressure bonding head so as to be able to move up and down; An elevating / lowering pressing mechanism for applying a pressing force, a reaction force receiving portion receiving an upward pressing reaction force at the time of pressing by the elevating / lowering pressing mechanism, and a connecting portion for fixedly connecting the reaction force receiving portion to the base. An electronic component crimping apparatus comprising: a crimping head including a crimping head, a head holding unit, and a lifting / lowering mechanism; Electronic component crimping method,
A positioning step of relatively horizontally moving the pressure bonding head unit with respect to the electronic component mounting target position on the substrate to position the electronic component mounting target position, and lowering the pressure bonding head by the lifting / lowering pressing mechanism And a pressing step of pressing the electronic component against the substrate by applying a pressing force to the pressing head from above by a lifting / lowering pressing mechanism and pressing against the substrate received by the lower receiving portion. In the pressing step, an upward pressing reaction force at the time of pressing by the lifting / lowering pressing mechanism is received by the reaction force receiving portion, and a load at the time of pressing is applied to a connecting portion that fixedly connects the reaction force receiving portion and the base portion. A method for crimping electronic components.

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