JP2004150927A - Probing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To satisfactorily test an inspecting object operated at 10 GHz or more, and to reduce damage in a test substrate. <P>SOLUTION: An inspecting object 1 is pressed to the test substrate 2 by pushing down a press jig 5 provided in an upper part of the object 1 such as a semiconductor device to connect a high-frequency signal terminal of the inspecting object 1 to a high-frequency signal wiring on the test substrate 2. An electric power source terminal, a grounding terminal and a signal line terminal other than the high-frequency signal terminal of the inspecting object 1 are connected by an extendable probe pin 2a. The press jig 5 is provided with a load limiting means and a face aligning mechanism, restricts contact pressure between the inspecting object 1 and the test substrate, and makes one face of the inspecting object follow to a face of the test substrate. In this constitution, an interposer having a connection terminal is interposed between the inspecting object 1 and the test substrate, and the inspecting object 1 is also allowed to be connected to the test substrate 2 via the connection terminal. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a test device such as a semiconductor device, and more particularly to a method for testing electrical characteristics of a device under test such as a semiconductor device and a probing device for connecting the device under test and a test board.
[0002]
[Prior art]
Connection between the device under test and the test substrate such as a semiconductor device operating at a frequency of up to several GH _Z and 10GH _Z position, for example, as shown in FIG. 7, all of the terminals and the wiring of the test substrate 2 of the device under test 1 The connection is made using probe pins 2a as short as possible, or as shown in FIG. 8, a current flows between the test board 2 and the device under test 1 in the vertical direction but hardly flows in the horizontal direction. The anisotropic conductive rubber sheet 10 is sandwiched and pressurized to realize electrical connection.
However, the test of the device under test to operate at 10GH _Z above, the method is not applicable in the case of using the probe pins, for example, good coaxial high-frequency characteristics as described in Patent Document 1 below It was necessary to use shaped probe pins.
Therefore, when testing the device under test to operate at 10GH _Z above is usually subjected to solder plating or the like on all of the wiring or connecting portion of the test substrate, the electrically connection test by pressing the device Was.
[0003]
[Patent Document 1]
JP 2002-98736 A
Patent Document 1 discloses a contact sheet made of a thin insulator, which is provided with a first electrode having a first through hole at a position facing a power electrode and a ground electrode of a semiconductor device, and a signal electrode of the semiconductor device. Measurement including the above-mentioned contact sheet and a base plate for fixing the elastomer so that the elastomer having the second through-hole and the third through-hole and the positions of the first to third through-holes coincide with each other. A head portion and a coaxial probe portion having good high frequency characteristics and coming into contact with a signal electrode of a semiconductor device from the through hole are provided.
[0005]
[Problems to be solved by the invention]
Those shown in FIG. 7 is for connecting the probe pins to the high-frequency signal terminal has the disadvantage that the loss due to the length is large, the test of the device under test to operate at 10GH _Z above were not suitable .
The one shown in FIG. 8, but is to use an anisotropic conductive rubber sheet, the anisotropic conductive rubber sheet, loss or several GH _Z increases, the test subject to operate at 10GH _Z or It was not suitable for the test described above, and had disadvantages such as low durability of the rubber portion and generation of dust.
Further, in the above-described method in which all wirings or connection portions of the test substrate are subjected to solder plating or the like and the device is pressed, there is a problem that the test substrate is severely damaged by the pressing force and stable connection cannot be secured.
Further, in the probe described in Patent Document 1, it is necessary to use a coaxial probe having good high-frequency characteristics as a probe to be connected to the high-frequency signal terminal, and there is a problem that the cost increases.
The present invention has been made in view of the above circumstances, and an object of the present invention is to enable a test of an object to be inspected operating at 10 GHz or more without using an expensive high-frequency probe, It is to reduce the damage.
[0006]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, in the present invention, high-frequency signal terminals are connected as short as possible, and non-high-frequency signals, power supply lines, and ground lines are connected by a connection method using an elastic body (for example, a probe pin). .
That is, the test of the test object is performed as follows.
(1) The high-frequency signal terminal of the device under test is directly connected to the high-frequency signal wiring on the test board or connected via an extremely thin conductor. Non-high-frequency signals, power supply lines, and ground lines are connected to extendable probe pins. And so on.
(2) For this reason, for example, the test board is provided with a hole through which the probing pin passes, and the probe pin is connected to a terminal other than the high-frequency terminal of the device under test via the hole.
(3) As means for connecting the high-frequency signal terminal of the device under test and the high-frequency signal wiring on the test substrate via the thin conductor as described above, a device under test is provided between the test substrate and the device under test. And a connection plate made of an insulator having an electrical conductor for connecting the high-frequency signal wiring on the test board.
With this configuration, even if the conductor of the connection plate is damaged, it can be easily replaced by pressing the test object against the test board, and the operation efficiency is improved.
(4) Load limiting means for preventing an excessive load from being applied to the test object, the test substrate, or the connection plate is provided in the pressing means for pressing the test object against the test board.
Thus, the load applied to the test object, the test board, or the conductor of the connection plate can be limited, and the damage of the terminal of the test object, the wiring of the test board, the conductor of the connection plate, and the like can be reduced. it can.
(5) The pressing means or the means for supporting the test substrate is provided with a surface aligning mechanism such that one surface of the device under test or the test substrate is aligned with the other opposing surface. As a result, stable electrical connection between the high-frequency signal terminal of the device under test and the conductor of the test board can be ensured.
[0007]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a diagram showing an overall configuration of a probing apparatus according to a first embodiment of the present invention.
In FIG. 1, reference numeral 1 denotes a test object such as a semiconductor device having a high-frequency signal terminal and terminals other than the high-frequency signal terminal, and 2 denotes a test board provided with a high-frequency signal wiring connected to the terminal of the test object.
The test board 2 is placed on a test board supporting portion 3 provided on a base 3a, and input connectors 4a and output connectors 4b are connected to terminal portions provided at both ends of the test board 2, respectively. A high-frequency signal is input, and an output is taken out from the output connector 4b.
An extendable probe pin 2a projects through a hole provided in the test board 2, and a power supply terminal, a ground terminal, and a signal line terminal other than the high-frequency signal terminal of the device under test 1 are connected to the professional terminal. The pin 2a is connected to a power supply, a ground, and the like.
[0008]
A press jig 5 is provided on the upper part of the test object 1. The test jig 1 is pressed against the test substrate 2 by pressing down the press jig 5, and the high-frequency signal terminal of the test object 1 and the test substrate 2 The high-frequency signal wiring provided above contacts with a desired contact pressure.
The press jig 5 includes, as described later, a load limiting unit and a surface alignment mechanism. The load limiting unit limits the contact pressure between the test object 1 and the test board. Thus, one terminal of the device under test is made to face the surface of the test substrate facing the other, and each terminal of the device under test 1 and the wiring on the test substrate are brought into contact with a desired contact pressure, and the entire surfaces of both are evenly distributed. Press to make contact.
[0009]
FIG. 2 is a diagram showing a configuration of a connection portion between the test object 1 and the test board 2 in FIG.
As shown in FIG. 1, the device under test 1 is provided with a high-frequency signal terminal 1a, a power terminal other than the high-frequency signal terminal, a ground terminal, and a signal line terminal 1b. A high-frequency signal wiring 2b is provided which is in contact with and electrically connected to the signal terminal 1a. The terminal 1a and the conductor 2b are electrically connected by pressing the test object 1 downward with the press jig 2.
In the figure, a spherical terminal is taken as an example of a connection terminal of the DUT 1, but another connection terminal such as a plane connection terminal may be used.
[0010]
A hole 2c is provided in the test board 2, and a probe pin 2a protrudes from the hole 2c, and is electrically connected to a terminal 1b other than the high-frequency signal terminal of the device under test 1. The probe pin 2a is configured to be expandable and contractable by a spring or the like, and the probe pin 2a is pressed against the terminal 1b by a spring pressure.
Although the mounting portion of the probe bin 2a is not shown in the figure, the probe pin 2a may be mounted on, for example, the test board support portion 3 (however, the probe pin for the power supply and the signal line is electrically insulated from the surroundings). Or a structure in which it is directly attached to the back surface of the test board 2 and connected.
Further, a second test board for power supply may be provided below the test board 2, and the probe pins fixed to the test board may be directly connected through holes provided in the test board.
That is, as shown in FIG. 3, a second test board 6 for supplying power or the like is arranged below the test board 2, and a socket 2a-1 of the probe pin 2a is provided on the second test board 6. Install. A pressing means such as a spring is provided inside the socket portion 2a-1. The probe pin 2a is pressed against the terminal 1b of the device under test 1 by the pressing means.
Although FIG. 2 shows only two high-frequency signal terminals 1a and two terminals 1b other than the high-frequency terminals, there are usually several high-frequency signal terminals, power supply terminals, and non-high-frequency signal terminals, and a ground terminal. There are 10 to several tens.
[0011]
Next, the structure of the press jig 5 shown in FIG. 1 will be described with reference to FIG. The press arm 5a is moved up and down in the direction of the white arrow in FIG.
Note that the press arm 5 is supported by a support member (not shown) so as to be movable in the vertical direction.
The base plate 5b is mounted slidably in the vertical direction with respect to the guide bar 5a-1 of the press arm 5a, and a spring stopper 5a-2 provided at an end of the guide bar 5a-1 and the base plate 5b. A spring 5c is provided therebetween, and the base plate 5b is pressed against the press arm 5a. Therefore, the base plate 5b moves integrally with the press arm 5a. However, when a force greater than the spring pressure of the spring 5c is applied to the base plate 5b from below, the base plate 5b does not descend and is balanced with the spring pressure. Maintain position.
A pressing plate attaching member 5d is attached to the base plate 5b. A pressing plate 5f for pressing the device under test 1 is attached to a pressing plate attaching member 5d via an O-ring 5e.
Since the O-ring 5e is provided between the pressing plate mounting member 5d and the pressing plate 5f, when an uneven force is applied to the pressing plate 5e from below, the O-ring 5e bends and the pressing plate mounting member 5d is bent. On the other hand, the pressing plate 5f is inclined.
[0012]
Since the press jig of the present embodiment has the above-described configuration, the base plate 5b acts to escape when a load greater than a predetermined load is applied to the pressing plate 5b from below. Therefore, a load equal to or more than a predetermined value is not applied between the device under test 1 and the test board 2, and the terminal 1 a of the device under test 1 and the high-frequency signal wiring 2 b on the test board 2 can be protected.
The spring pressure F of the spring 5c is represented by p, the load per probe pin, the number n, the number m of terminals of the device 1 to be contacted with the high-frequency signal wiring of the test substrate 2, and the number of terminals of the device 1 and the test substrate 2. Assuming that the load received by the high-frequency signal wiring 2b is q and the friction of the sliding part is α, the following equation (1) is used.
F = p × n + q × m + α (1)
Therefore, the spring pressure F may be set based on the above equation (1) so that the load applied to the test object 1 and the high-frequency signal wiring 2b of the test board is such that q becomes a predetermined value.
If the number of the springs 5c is N, the number of springs may be F / N.
[0013]
Further, in the press jig of this embodiment, since the O-ring 5e is provided between the pressing plate mounting member 5d and the pressing plate 5f, the contact surface between the pressing plate 5e and the test object 1 is not parallel, Even when the surface on which the terminals 1a and 1b of the test object 1 are provided is not parallel to the surface of the test substrate 2 facing the same, when pressed, the pressing plate 5f tilts, and the surface Can be aligned. Therefore, each terminal 1a of the device under test 1 can be brought into contact with the high-frequency signal wiring 2b of the test board 2 with a substantially uniform contact pressure.
In the above description, the case where an O-ring is used as the mechanism for aligning surfaces has been described. However, other well-known mechanisms can be used as the aligning mechanism. In short, when a force is applied from below, the applied force is reduced. Any mechanism may be used as long as the mechanism can tilt the pressing plate 5a accordingly.
Further, the distance between the base plate 5b and the pressing plate 5e can be made variable by using fine adjustment parts such as a spring and a micrometer. Further, the spring pressure of the spring 5c can be adjusted by changing the position of the spring stopper or changing the strength of the spring itself.
In the above embodiment, the case where the mechanism for aligning the surfaces is provided between the pressing plate 5e of the press jig 5 and the pressing plate mounting member 5d has been described. When an uneven force is applied, the test substrate 2 may be tilted.
[0014]
As described above, in the probing apparatus of the present embodiment, the high-frequency signal terminal 1a of the device under test 1 is directly pressed against the high-frequency signal wiring of the test board by the press jig 5, so that the connection line length of the high-frequency signal is minimized. it can.
In addition, terminals 1b such as a power supply terminal, a ground terminal, and a signal line of the test object other than the high-frequency signal of the device under test 1 are stably connected by the extendable probe pins 2b supported by the test substrate support 3 and the like. can do.
Furthermore, since only the high-frequency signal terminal 1a of the device under test 1 is connected to the high-frequency signal wiring 2b on the test board by pressing, even if the height of the terminal 1a of the device under test 1 is somewhat irregular, a relatively small pressing is performed. By force, all the terminals 1a can be connected to the high-frequency signal wiring 2b on the test board, and the pressing force can be reduced as compared with the conventional case where all the terminals are connected by the pressing force. In addition, damage to the high-frequency signal wiring 2b can be suppressed.
Further, since the press jig 5 is provided with a load limiting means including a spring 5a or the like, a predetermined load or more is not applied between the test object 1 and the test board 2, and the terminal of the test object 1 and the test board 2 can be protected.
Further, since the surface aligning mechanism having the O-ring 5f is provided, each terminal 1a of the device under test 1 can be brought into contact with the high-frequency signal wiring 2b of the test board 2 with a substantially uniform contact pressure.
[0015]
FIG. 5 is a diagram showing the entire configuration of a probing apparatus according to a second embodiment of the present invention. In this embodiment, the terminal 1a of the device under test 1 and the high-frequency signal wiring 2b of the test board 2 in FIG. A case is shown in which a connection plate 7 (hereinafter, referred to as an interposer) having convex high-frequency signal connection terminals on both surfaces is provided therebetween.
The other configuration is the same as that shown in FIG. 1. As described above, the press jig 5 is provided with the load limiting means including the spring 5a and the like. 2 to protect the terminals of the device under test 1 and the high-frequency signal wiring 2b on the test board 2 from being applied.
The press jig 5 or the test substrate support 3 is provided with a surface alignment mechanism having the O-ring 5f and the like.
[0016]
FIG. 6 shows a configuration of a connection portion when the interposer 7 is interposed between the test object 1 and the test substrate 2 in FIG.
The interposer 7 has a configuration in which a convex high-frequency signal connection terminal 7b is provided on both surfaces of an insulator 7a made of a CFC-based substrate or the like, and a hole 7c through which a probe pin passes is provided in a connection terminal portion other than the high-frequency signal. . A pair of convex terminals (hereinafter referred to as "pumps") projecting from both sides of the insulating plate 7a are electrically connected in the vertical direction.
Note that the connection terminal 7b of the interposer 7 does not necessarily have to be convex as described above, and may be flat, or a flat (or convex) terminal may be provided on both surfaces of the insulating plate 7a. And these may be connected via a through hole.
[0017]
In this embodiment, as in the first embodiment, the probe pins 2a may be attached to the test board support 3, or the probe pins 2a may be directly attached to the back surface of the test board 2 for connection. It is good also as a structure which does.
As shown in FIG. 3, a second test board 6 for supplying power is provided below the test board 2, and probe pins fixed to the test board are directly connected through holes provided in the test board. May be configured.
Although only two high-frequency signal terminals 1a and two terminals 1b other than the high-frequency terminal are shown in FIGS. 5 and 6, as in the first embodiment, a high-frequency signal terminal, a power supply terminal, and a non-high-frequency signal terminal are provided. Are present, and there are ten to several tens ground terminals.
[0018]
In the present embodiment, as described above, the interposer 7 is interposed between the device under test 1 and the test substrate 2, and the high-frequency signal terminal 1 a of the device 1 under test and the high-frequency signal wiring 2 b of the test substrate 2 are interposer 7. Are connected via the connection terminals 7b provided in the interposer 7, even if the connection terminals 7b of the interposer 7 are damaged by pressing the device under test 1 to the test substrate 2 via the interposer 7. it can.
The high-frequency signal wiring portion of the test board 2 receiving the connection terminal 7b of the interposer 7 is plated with a strong material such as nickel plating, and the connection terminal 7b of the interposer 7 is made of a relatively soft plating material such as copper plating. By doing so, when the device under test 1 is pressed against the test board 2 via the interposer 7, the connection terminals 7b of the interposer 7 are deformed, and the variation in the height of the terminals 1a of the device under test 1 can be absorbed. it can.
For this reason, the electrical connection between the terminal 1a of the device under test 1 and the test board 2 can be made well, and the damage of the terminal of the device under test 1a and the high-frequency signal wiring of the test board 2 can be reduced. Can be.
In this case, the spring pressure F of the spring 5c of the press jig 5 is such that the load per probe pin is p, the number is n, the number of connection terminals 7b of the interposer 7 is m, and the load received by the connection terminals 7b is m. Assuming that q is the friction of the sliding portion and α is expressed by equation (1), as described above.
Therefore, if the spring pressure F is set so that the load q received by the connection terminal 7b of the interposer 7 becomes a predetermined value based on the above equation (1), the high frequency of the terminal of the test object 1a and the test board 2 The test object 1 and the test board 2 can be connected well without damaging the signal wiring and without crushing the connection terminals 7b of the interposer 7.
[0019]
(Supplementary Note 1) The device under test provided with a high-frequency signal terminal and a terminal other than the high-frequency signal terminal, the terminal, the high-frequency signal wiring on the test board, and the probing pin are electrically connected to each other to electrically connect the device under test. A probing device in a test device for testing characteristics,
The high-frequency signal terminal of the device under test is connected to the high-frequency signal wiring provided on the test substrate by pressing against the test substrate,
A probing apparatus, wherein a terminal other than the high frequency of the object to be inspected is connected to the probing pin using expansion and contraction of an elastic body.
(Supplementary Note 2) The test board is provided with a hole through which the probing pin passes,
The probing apparatus according to claim 1, wherein the probe pin is connected to a terminal other than the high-frequency terminal of the device under test via the hole.
(Supplementary Note 3) A connection plate composed of an insulator having an electric conductor for connecting a terminal of the test object and a high-frequency signal wiring on the test substrate is provided between the test substrate and the test object. The probing device according to appendix 1 or 2, characterized in that:
(Supplementary Note 4) There is provided pressing means for pressing the test object against a test substrate,
The probing apparatus according to attachment 1, 2 or 3, wherein the pressing means includes a load limiting means for preventing an excessive load from being applied to the test object, the test board, or the connection plate.
(Supplementary Note 5) There is provided pressing means for pressing the test object against a test substrate,
The pressing means or the means for supporting the test substrate includes a surface aligning mechanism for tilting the pressing means or the test substrate so that one surface of the device under test or the test substrate is aligned with the other surface facing the test object. 5. The probing device according to claim 1, wherein the probing device is provided.
(Supplementary Note 6) A test method of a device under test including a high-frequency signal terminal and a terminal other than the high-frequency signal terminal,
The high-frequency signal terminal of the device under test is connected to the high-frequency signal wiring provided on the test substrate by pressing against the test substrate,
A test method, characterized in that a terminal other than the high frequency of the object to be inspected is connected to a probing pin by utilizing expansion and contraction of an elastic body to test the electrical characteristics of the object to be inspected.
[0020]
【The invention's effect】
As described above, in the present invention, the following effects can be obtained.
(1) Transmission of a high-frequency signal by a probe pin in the past has been limited by the loss due to the line length and the upper limit has been limited. However, according to the present invention, the high-frequency signal can be connected with the shortest line or a line length close to the shortest, so that 10 GHz It can be used up to the above high frequency, and does not require an expensive high frequency probe.
(2) By interposing a connection plate (interposer) composed of an insulating plate having a conductor between the test object and the test board, damage to the test board can be reduced. In addition, since the interposer can be easily replaced, the operation efficiency can be improved.
(3) The load applied to the test object, the test substrate, or the conductor of the connection plate can be limited by providing the load limiting means on the press jig for pressing the test object against the test substrate. Damage to the terminals, the wiring of the test board, and the conductor of the connection board can be reduced.
(4) A pressing jig for pressing the test object against the test substrate or a means for supporting the test substrate is provided with a surface alignment mechanism such that one surface of the test object or the test substrate is aligned with the other surface facing the test substrate. Thus, stable electrical connection between the high-frequency signal terminal of the device under test and the conductor of the test board can be ensured.
[Brief description of the drawings]
FIG. 1 is a diagram showing an overall configuration of a probing apparatus according to a first embodiment of the present invention.
FIG. 2 is a diagram showing a configuration of a connection portion between a test object 1 and a test board 2 in FIG.
FIG. 3 is a diagram illustrating a configuration example when a second test board for power supply is provided.
FIG. 4 is a diagram illustrating a configuration of a press jig.
FIG. 5 is a diagram illustrating an overall configuration of a probing apparatus according to a second embodiment of the present invention.
FIG. 6 is a diagram showing a configuration example when an interposer is interposed between a test object and a test substrate.
FIG. 7 is a diagram showing a conventional example in which all terminals of an object to be inspected and wiring of a test board are connected using probe pins.
FIG. 8 is a diagram showing a conventional example in which an anisotropic conductive rubber sheet is connected between a test substrate and a test object.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Inspection object 2 Test board 3 Test board support part 4a Input connector 4b Output connector 5 Press jig 6 Second test board 7 Interposer

Claims (5)

A device under test having a high-frequency signal terminal and a terminal other than the high-frequency signal terminal,
A probing apparatus in a test apparatus for electrically connecting the terminal and a high-frequency signal wiring and a probing pin on a test board to test an electrical characteristic of the device under test,
The high-frequency signal terminal of the device under test is connected to the high-frequency signal wiring provided on the test substrate by pressing against the test substrate,
A probing apparatus, wherein a terminal other than the high frequency of the object to be inspected is connected to the probing pin using expansion and contraction of an elastic body. The test substrate is provided with a hole through which the probing pin passes,
2. The probing apparatus according to claim 1, wherein the probe pin is connected to a terminal other than the high-frequency terminal of the device under test via the hole. A connection plate comprising an insulator having an electrical conductor for connecting a terminal of the test object and a high-frequency signal wiring on the test substrate is provided between the test substrate and the test object. The probing apparatus according to claim 1 or 2. The test object is provided with pressing means for pressing the test object against a test board, and the pressing means is provided with a load limiting means for preventing an excessive load from being applied to the test object, the test board, or the connection plate. The probing apparatus according to claim 1, 2, 3, or 3, wherein: The test device further includes pressing means for pressing the test object against a test substrate, and the pressing means or the means for supporting the test substrate is configured such that one surface of the test object or the test substrate follows the other surface facing the test object. 5. The probing apparatus according to claim 1, further comprising a pressing means or a plane aligning mechanism for tilting the test substrate.

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