JP2003232830A - Washing method of burn-in board and washing tool of burn-in board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely remove refuse or the like from a socket loaded on a burn-in board. <P>SOLUTION: This washing tool has a body part 1 and a cover part 2 where many openings 1a, 2a are formed. When washing the burn-in board where the socket 33 is loaded, the socket is turned upward and the burn-in board is mounted on the body part 1 [(a)]. In this case, the contact part of a contact pin 33b of the socket 33 is in contact with the upper face of a base 33a of the socket 33 by an elastic force of the contact pin. When the cover part 2 is closed, a lid body 33d of the socket 33 is pressed and pushed down by the cover part 2. Hereby, the contact pin 33b is pressed and widened, and the contact pin 33b is separated from the base 33d [(b)]. The washing tool is dipped into a cleaning fluid and washed together with the burn-in board. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning method and a cleaning jig for a burn-in board mounted with a socket for mounting a semiconductor device, which is used when performing a burn-in to a packaged semiconductor device. Is.

[0002]

2. Description of the Related Art Burn-in is performed on a semiconductor device before shipment. This is a screening process in which the semiconductor device is operated by the manufacturer for a certain period of time in a stressed state to reveal a latent failure. FIG. 6A is a perspective view of a burn-in board used for performing burn-in. As shown in the figure, a plurality of sockets 33 for mounting semiconductor devices are mounted on a printed circuit board 32 supported by a support plate 31. This socket is called an open top socket, and the semiconductor device is dropped from above and mounted. A sectional view of the socket in a steady state is shown in FIG. The socket 33 includes a base 33a made of an insulating material and a contact pin 33b made of an elastic metal material having one end embedded in the base 33a.
A lever 33c which is rotatably supported by the case and is made of an insulating material; a lid 33d that can move up and down; and a base 3
It has an IC receiver 33e provided on the upper surface of 3a, with which the bottom surface of the package abuts. Due to the elastic force of the contact pin 33b, one end of the upper tip portion presses the upper surface of the base and the other end of the upper tip portion imparts a rotational force to the lever 33c, which causes the lid 33d to move upward. Pushing up.

When mounting the semiconductor device in the socket 33, the lid 33d is pushed down as shown in FIG. 6 (c). As a result, the lever 33c rotates to push the contact pin 33b apart. In this state, QFP (quad flat
When a (package) type semiconductor device (product) is placed on the base 33a, the bottom surface of the package contacts the IC receiver 33e, and the external terminals contact the base 33a. When the pressing force on the lid 33d is released, the contact pin 33b is rotated inward by its elastic force to rotate the lever 33c to push up the lid 33a and contact the external terminal of the product. Then, it is put in a burn-in furnace and the plug terminal 32a of the printed board 32 is connected to a connector in the furnace for burn-in. That is, voltage / voltage
By applying stress such as temperature, the initial failure of the product is revealed. Electrical stress such as voltage is applied from the connector of the furnace to the wiring of the burn-in board and from the contact pin of the socket to the external terminal of the product. After applying stress, remove the burn-in board from the furnace,
After removing the product from the burn-in board (the procedure reverse to the insertion), the electrical characteristics of the product are tested to remove the initial defective product.

When the burn-in board is used multiple times,
Since there is a high possibility that dust and dirt will adhere and contact failure will occur, it is necessary to clean regularly. In the conventional cleaning method, the burn-in board is immersed in the cleaning liquid in a state where the semiconductor device is removed from the socket [the state shown in FIG. 6 (b)], and ultrasonic vibration is applied to perform cleaning.

[0005]

In the above-mentioned conventional cleaning method, since the cleaning is performed in the state where the terminal contact portion of the contact pin is in contact with the base, dirt and solder scraps adhering to the contact surface of the contact pin are In some cases, dust such as fiber dust and the like sandwiched between contact pins could not be removed. As a result, the socket has a poor contact, the burn-in is not properly performed, and an erroneous determination is caused, so that the reliability of the burn-in is impaired. An object of the present invention is to solve the above-mentioned problems of the prior art, and an object thereof is to reliably remove dirt and dust when cleaning a burn-in board to prevent contact failure of the socket. To increase the reliability of burn-in.

[0006]

In order to achieve the above object, according to the present invention, a burn-in board mounted with a socket in which a contact portion of a contact pin contacting an external terminal of a semiconductor integrated circuit is closed in a steady state. The method for cleaning a burn-in board, comprising: cleaning the contact portion of the contact pin in an open state. Then, preferably, the burn-in board on which the socket is mounted is dipped in a cleaning liquid to perform cleaning while applying ultrasonic vibration.

In order to achieve the above object, according to the present invention, there is provided a socket having a contact pin which is in contact with an external terminal of a semiconductor integrated circuit and which is closed in a steady state without mounting the semiconductor integrated circuit. A cleaning jig for a burn-in board, wherein the mounted cleaning jig can be cleaned with the contact pin open. And, preferably, the main body,
A cover part that can be opened and closed with respect to the main body, and opens the contact part of the contact pin by pressing the lid of the socket mounted on the burn-in board when the main body and the cover are closed. Turn it on.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Next, an embodiment of the present invention will be described in detail with reference to the drawings according to an embodiment. [First Embodiment] FIG. 1A is a perspective view showing an opened state of a first embodiment of a cleaning jig of the present invention.
(B) is a side view showing the closed state. The cleaning jig of the present embodiment has a box-shaped main body 1 having a large number of openings 1a on its bottom and side surfaces, a plate-shaped cover 2 having a large number of openings 2a, and a main body 1. A butterfly plate 3 for connecting the cover part 2 and the cover part 2 in an openable and closable manner, and fixed to the bottom surface of the main body part 1,
The elastic fixture 4 is made of an elastic material and has a substantially "U" shape.

When cleaning the burn-in board (see FIG. 6) on which the socket is mounted, the burn-in board is mounted in the main body 1 of the cleaning jig with the socket facing upward. A partial cross-sectional view in this state is shown in FIG. At this time, the contact portion of the contact pin 33b of the socket 33 is in contact with the upper surface of the base 33a by the elastic force of the contact pin, and the lid 33d is lifted upward by the elastic force of the contact pin via the lever 33c. There is. After mounting the burn-in board in the main body 1 of the cleaning jig, the cover 2 is closed. In order to close the cover 2 from the state shown in FIG. 1A, the elastic fixing tool 4 is pulled toward the front side, the cover 2 is aligned with the main body 1, and the pulling of the elastic fixing tool 4 is released. The cover part 2 is fixed to the main body part 1. A partial cross-sectional view in this state is shown in FIG.
It shows in (b). At this time, the lid 33d of the socket 33 is pressed down by the cover portion 2 of the cleaning jig.
As a result, the lever 33c is rotated to push the contact pin 33b apart. Therefore, the contact pin 33b
Is separated from the base 33d.

Next, the cleaning jig in which the socket-equipped burn-in board is housed is immersed in the cleaning liquid, and ultrasonic vibration is applied to perform cleaning. At this time, since the contact portion of the contact pin of the socket 33 is in the open state, the attached matter and the contamination on the contact surface are effectively removed. In addition, the cleaning will not end in the state where dust is sandwiched between the contact portion of the contact pin 33b and the base 33d. For cleaning, instead of ultrasonic cleaning, spraying or QDR
The socket may be exposed to the cleaning solution by a (quick dumping rinse) method or the like. Alternatively, the cleaning may be performed by simply injecting a gas such as dry air. Furthermore, cleaning can be performed by combining some of these cleaning methods.

[Second Embodiment] FIG. 3 (a) is a plan view showing a second embodiment of the cleaning jig of the present invention in a closed state, and FIG. 3 (b) is a front view thereof. It is a figure. Also, FIG.
FIG. 4A is a bottom view showing a closed state of the second embodiment of the cleaning jig of the present invention, and FIG. 4B is a side view thereof. A plurality of openings 11a and 12a are formed in the bottom plate 11 and the cover plate 12, respectively. Then, the cover plate 12 and the bottom plate 11 have upper sides [see FIG.
(A), the upper side of the figure is the upper side in the state shown in FIG. 4 (a)], the three upper bearings 13 and the lower bearings 14 are fixed, and these bearings are penetrated. Shaft 1
5 is inserted (see FIG. 4B). Upper bearing 13
The lower bearing 14 is rotatable with respect to the shaft 15, and the bottom plate 11 and the cover plate 12 can be opened and closed with the shaft 15 as the center of rotation.

On the left and right sides of the lower side of the cover plate 12, there are formed protrusions which serve as shaft member mounting portions 12b. The shaft member 20 is fixed to the bottom plate 11 side of the shaft member mounting portion 12b. The left and right ends of the shaft member 20 are processed into a cylindrical shape as a shaft portion 20a, and a pair of "L" -shaped L metal fittings 16 are rotatably attached to the shaft portion 20a. On the outer side of the bent portion of the pair of L fittings 16, a pair of locking rod supports 17 having a substantially "concave" shape is rotatably attached via a connecting member 19. A locking rod 18 is attached to the end of the locking rod support 17 on the side opposite to the engaging portion with the connecting member 19. Further, a handle 21 is attached to the end of the L metal fitting 16 on the side opposite to the engaging portion with the shaft portion 20a.

Locking bent portions 1 are provided at both ends of the bottom side of the bottom plate 11.
The protrusion 1b is formed, and the engaging bent portion 1 is formed.
1b is bent at an angle of about 15 ° in the direction away from the cover plate 12 (see FIG. 4 (b)). The bottom plate 1 is provided at two places inside the locking bent portion 11b on the lower side of the bottom plate 11.
A stand 11c extending vertically from 1 is formed.
The stand 11c functions as a stopper when closing the cover plate 12.

Next, a method of using the cleaning jig of this embodiment will be described with reference to FIG. To open the cleaning jig in the closed state shown in FIGS. 3 and 4, the handle 21 is lifted from the state shown in FIG. 4B to rotate the L fitting 16 in the counterclockwise direction. The locking rod support 17 is rotated clockwise to release the engagement of the locking rod 18 with the locking bent portion 11b of the bottom plate 11, and the cover plate 12 is opened [Fig.
(A)]. Next, a burn-in board (not shown) having sockets mounted thereon is mounted on the bottom plate 11, and the cover plate 12 is placed thereon. Then, the locking rod support 17 is rotated to hook the locking rod 18 on the locking bent portion 11b of the bottom plate 11 [FIG. 5 (b)]. Next, the handle 21 is used to rotate the L fitting 16 clockwise to close the cover plate 12. At this time, the lid body of the socket, not shown, covers the cover plate 12.
The contact pin of the socket with the base is released by being pressed by. Next, the burn-in board is cleaned, and the cleaning method is the same as in the case of the first embodiment. That is, a method such as ultrasonic cleaning, injection of cleaning liquid or gas can be used.

Although the preferred embodiments have been described above, the present invention is not limited to these embodiments.
Appropriate changes can be made without departing from the scope of the present invention. For example, the method of engaging the main body portion (bottom plate) and the cover portion (cover plate) is not limited to that described in the embodiments, and any known means can be adopted.

[0016]

As described above, by using the cleaning jig of the present invention, it is possible to perform cleaning with the contact pin open, and the cleaning liquid flows into the contact surface of the contact pin. Therefore, it becomes possible to remove dust that has been pinched by the contact pins, dust that has adhered to the contact surface, and dirt. Therefore, according to the present invention, it is possible to prevent a contact failure of the socket of the burn-in board and perform a highly reliable burn-in test.

[Brief description of drawings]

FIG. 1 is a perspective view and a side view showing a first embodiment of the present invention.

FIG. 2 is a sectional view for explaining the operation of the first embodiment of the present invention.

3A and 3B are a plan view and a front view showing a second embodiment of the present invention.

FIG. 4 is a bottom view and a side view showing a second embodiment of the present invention.

FIG. 5 is an operation explanatory diagram of the second embodiment of the present invention.

FIG. 6 is a perspective view of a burn-in board to be cleaned and a cross-sectional view for explaining the operation of a socket mounted on the burn-in board.

[Explanation of symbols]

1 body 1a, 2a, 11a, 12a openings 2 cover 3 hinges 4 Elastic fixture 11 bottom plate 11b Locking bent part 11c stand 12 cover plates 12b Shaft member mounting part 13 Upper bearing 14 Lower bearing 15 shaft 16 L metal fittings 17 Locking rod support 18 Locking rod 19 Connection member 20 Shaft member 20a shaft part 21 Handle 31 Support plate 32 printed circuit board 32a Plug terminal part 33 socket 33a base 33b contact pin 33c lever 33d lid 33e IC receiver

Claims (9)

[Claims] 1. A method for cleaning a burn-in board in which a socket, in which a contact portion of a contact pin that contacts an external terminal of a semiconductor integrated circuit is closed in a steady state is mounted, is cleaned with the contact portion of the contact pin open. A method for cleaning a burn-in board, which is characterized in that 2. The method for cleaning a burn-in board according to claim 1, wherein the contact portion of the contact pin is in contact with the base of the socket in a steady state. 3. The method for cleaning a burn-in board according to claim 1, wherein the burn-in board having the socket mounted thereon is immersed in a cleaning liquid to perform cleaning while applying ultrasonic vibration. 4. The burn-in board cleaning method according to claim 1, wherein the burn-in board mounted with the socket is cleaned by injecting a fluid. 5. The burn-in board cleaning method according to claim 4, wherein the fluid is a cleaning liquid. 6. A contact with an external terminal of a semiconductor integrated circuit,
A burn-in jig equipped with a socket having a contact pin that is not mounted with a semiconductor integrated circuit and is closed in a steady state, wherein the contact pin can be washed in an open state. Cleaning jig. 7. A main body portion and a cover portion that can be opened and closed with respect to the main body portion, and presses a lid of a socket mounted on the burn-in board in a state where the main body portion and the cover portion are closed. The jig for cleaning a burn-in board according to claim 6, wherein the contact portion of the contact pin is opened. 8. The jig for cleaning a burn-in board according to claim 7, wherein the main body portion and the cover portion are connected via a hinge mechanism. 9. The burn-in according to claim 7, further comprising a lock mechanism for holding the cover portion in a closed state when the cover portion is closed with respect to the main body portion. A jig for cleaning the board.