JP2007035401A - Socket for semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To automatically remove extraneous matter increasing contact resistance in a contact part of a contact terminal. <P>SOLUTION: In this socket for a semiconductor device, a coil spring 34 energizing a roller 30 for a contact in contact with a terminal DVL of the semiconductor device DV is arranged at a position deflected at a predetermined distance with respect to a rotational center axis of the roller 30 for a contact; and an end 10CLB for a cleaning edge is formed in a periphery of a slit 10S from which a part of the roller 30 for a contact is exposed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a semiconductor device socket including a contact terminal electrically connected to a terminal of a semiconductor device.

  In a semiconductor device such as an integrated circuit or a bare chip provided with various semiconductor packages mounted on an electronic device or the like, the potential defects are removed by performing various tests before the mounting. A socket for a semiconductor device used for such a test is generally called an IC socket, and is supplied with a predetermined test signal and sends an abnormality detection signal indicating a short circuit from a semiconductor device as an object to be inspected. It is arranged on a test board or a burn-in board as a printed wiring board having an input / output unit.

  The socket for a semiconductor device includes a plurality of contacts that electrically connect the terminal of the semiconductor device and the electrode portion of the printed wiring board described above. The contact portion that contacts the terminal of the semiconductor device in each contact is repeatedly used for a plurality of semiconductor devices by removing the plating layer covering the lead terminal in a semiconductor device having a lead terminal. In some cases, the oxide of the shaving powder adheres to the contact portion. Even in a semiconductor device having solder bumps, solder powder scraped from the solder bumps may be deposited on the contact portions of the contact terminals. In such a case, the contact resistance is increased by the oxide or solder powder, so that the electrical characteristics may be deteriorated.

  As a countermeasure in such a case, for example, as disclosed in Patent Document 1 and Patent Document 2, a contact ball as a contact terminal for electrically connecting a solder ball of a semiconductor device and a conductive pattern of a test board is provided. It has been proposed to move the contact point of the contact ball with the terminal of the semiconductor device by rotating the contact ball by applying an impact to the base plate after the test.

Japanese Patent No. 3130883 JP 2003-151710 A

  However, as described above, by moving the contact point on the contact ball after the test, if the solder powder adhered to the surface is still on the surface of the contact ball, the contact ball surface Unless wiped off, the solder powder may adhere again to the surface of the solder ball of a new semiconductor device to be used for testing, thereby deteriorating electrical characteristics. Further, the work of wiping off the adhered solder powder at the end of each test is also complicated.

  In view of the above problems, the present invention provides a socket for a semiconductor device including a contact terminal that is electrically connected to a terminal of the semiconductor device, and deposits that increase the contact resistance at the contact portion of the contact terminal. An object of the present invention is to provide a socket for a semiconductor device that can be automatically removed.

  In order to achieve the above object, a semiconductor device socket according to the present invention includes a conductive contact rotating body having an outer peripheral surface that selectively contacts a terminal of a semiconductor device, and a rotation center axis of the contact rotating body. A conductive biasing member that is biased by a predetermined distance with respect to the substrate and biases the contact rotating body toward the terminal of the semiconductor device and electrically connects the contact rotating body to the conductive portion of the wiring board. And a support part that rotatably and movably supports the contact rotating body, and a housing portion that houses the biasing member, and a terminal of the semiconductor device against the biasing force of the biasing member on the outer peripheral surface of the contact rotating body. And a removing means for automatically removing deposits adhering to the outer peripheral surface of the contact rotating body in accordance with the rotation of the contact rotating body.

  As is apparent from the above description, according to the semiconductor device socket according to the present invention, the removing means presses the terminal of the semiconductor device against the outer peripheral surface of the contact rotating body against the urging force of the urging member. When the contact rotator is rotated, the adhering material adhering to the outer peripheral surface of the contact rotator is automatically removed, so that the adhering material that increases the contact resistance at the contact portion of the contact terminal is automatically removed. Can be removed.

  2 and 3 each show an example of a semiconductor device socket according to the present invention.

  In FIG. 2, the socket for a semiconductor device is a clamshell type, and a socket body 10 that detachably accommodates a semiconductor device DV to be tested, and terminals of the semiconductor device DV that are arranged and attached to the socket body 10 are provided. A contact terminal group CG that is electrically connected to each electrode portion of the printed wiring board PB and a lid unit that can be opened and closed with respect to the upper portion of the socket body 10 are configured.

  For example, the socket body 10 formed of resin has holes (not shown) at four corners into which fixing screws for fixing to the printed wiring board PB are inserted. On one side of the four sides of the socket body 10, a claw portion 10 </ b> N is formed in which a tip of a latch member 14 described later is selectively engaged. Moreover, the socket main body part 10 has the accommodating part 10a which accommodates the base part 26 which positions and supports the semiconductor device DV used for a test in the center. The semiconductor device DV is, for example, a substantially square semiconductor device having a QFP (Quad Flat Package) type package.

  In the present embodiment, the semiconductor device is meant to include, for example, silicon semiconductor devices such as silicon diodes and transistors, and compound semiconductor devices such as gallium nitride. A silicon semiconductor device is a digital signal processing LSI (including a digital AV processing LSI) including a microprocessor, a video encoder, a decoder, etc. including a hyperpolar transistor, MOSFET, semiconductor integrated circuit, memory LSI, logic LSI, microcomputer, etc. An analog / digital mixed LSI including an operational amplifier may be included. The types of integrated circuit packages include insertion type packages such as DIP type, surface mounting type packages such as PLCC and QFP types, bare chip mounting types, vertical mounting packages, multichip packages, memory modules, and multichip modules ( MCM), high frequency packages, and the like.

  Inside the pedestal portion 26 arranged at the bottom of the accommodating portion 10a, as shown in an enlarged view in FIG. 1, a conductive contact roller 30 and contact for each contact terminal constituting the contact terminal group CG. A conductive coil spring 34 that biases the roller 30 is disposed. As shown in FIGS. 4 and 5, the pedestal portion 26 made of an electrically insulating material has slits 10 </ b> S at predetermined intervals corresponding to the terminals DVL of the semiconductor device DV placed on the pedestal portion 26. Is formed. Inside the base portion 26 communicating with the slit 10S, a hole 10H extending through the bottom of the accommodating portion 10a of the socket body 10 is formed as an accommodating portion. A part of the wall is formed on the inner periphery of the slit 10S and in the inner periphery of the hole 10H as shown in an enlarged view in FIG. 4 so as to face the rotation direction of a contact roller 30 described later. A pair of end portions 10CLA and 10CLB are formed. The end portion 10CLB is formed as a cleaning edge that constitutes a part of a removing unit that automatically removes deposits that increase the contact resistance adhered to the outer peripheral surface of the contact roller 30 described later.

  As shown in an enlarged view in FIG. 5, the contact roller 30 disposed inside the hole 10H has a shaft portion 32 that is rotatably engaged with a groove 10G formed in the inner peripheral portion of the hole 10H. Have. As shown in FIG. 6, the groove 10 </ b> G is formed obliquely toward the lower right. The contact roller 30 is urged toward the slit 10 </ b> S by a coil spring 34 disposed below the contact roller 30. As a result, as shown in FIG. 4, a part of the outer peripheral portion of the contact roller 30 abuts against the pair of end portions 10CLA and 10CLB and is exposed to the space above the pedestal portion 26 via the slit 10S. .

  In FIG. 4, the coil spring 34 is disposed with a predetermined gap in the hole 10 </ b> H so that the center axis thereof is biased to the right by a predetermined distance D with respect to the center line of the shaft portion 32 of the contact roller 30. In FIG. 4, the coil spring 34 has one end (end winding) on the contact roller 30 side inclined obliquely upward to the right at a predetermined angle. Thereby, in FIG. 4, only the left side portion of the end winding, that is, the portion facing the end portion 10 CLB comes into contact with the outer peripheral portion of the contact roller 30. Accordingly, the coil spring 34 constitutes a part of the removing means.

  Further, the end portion of the coil spring 34 connected to the electrode portion of the printed wiring board PB is formed in a substantially tapered shape. The end winding is formed substantially parallel to the plane of the electrode portion.

  When the lid unit is held by the socket body 10, the lid body 12 covers the upper end of the socket body 10, and is provided rotatably on one side of the lid body 12 via the support shaft 16. A latch member 14 that selectively holds the portion 12 on the socket body 10, and a pushing member 20 that presses the outer surface of the package of the semiconductor device DV that is disposed and mounted on the lid body portion 12 on the side facing the socket body 10. Is the main element.

  The other side of the lid body 12 is rotatably connected to the socket body 10 via a support shaft 24. As a result, the lid main body 12 contacts the upper portion of the socket body 10 as shown in FIG. The covering position will be taken.

  The lid body 12 has a recess on one side where the latch member 14 is disposed. A recess is formed in the recess to receive one end of the coil spring 18 that urges the engaging end of the latch member 14 in a direction to engage the claw portion 10N. A concave portion into which the pushing member 20 is inserted is formed in the center portion of the lid main body portion. A hole into which both ends of the support shaft 22 for swingably supporting the substantially central portion of the pushing member 20 is inserted is formed around the recess.

  The pushing member 20 includes pressing portions 20A, 20B, 20C, and 20D that press each terminal DVL of the semiconductor device DV when the lid main body portion 12 covers the above-described position. Is arranged so as to be swingable.

  In such a configuration, after the semiconductor device DV is mounted on the pedestal portion 26 in the socket body 10, the lid unit is held by the socket body 10 by engaging the tip of the latch 16 with the claw portion 10N. It becomes. In this state, a predetermined test signal is supplied to the printed wiring board PB, whereby a predetermined test is performed on the semiconductor device DV.

  At that time, each terminal DVL of the semiconductor device DV placed on the outer peripheral surface of the contact roller 30 is pressed by the pressing portions 20A, 20B, 20C, and 20D in the direction indicated by the arrow P in FIG. . As a result, a gap is formed between the outer peripheral surface of the contact roller 30 and the periphery of the slit 10S, and the shaft portion 32 of the contact roller 30 is guided by the groove 10G and moved in the direction indicated by the arrow T in FIG. Accordingly, one end of the coil spring 34 on the contact roller 30 side is pressed in the direction indicated by the arrow T in FIG. As a result, the contact roller 30 is rotated in the direction indicated by the arrow, that is, in the clockwise direction by the frictional force caused by contact with one end of the coil spring 34. Thereby, the deposit PC attached to the surface of the contact roller 30 is automatically removed by the end winding and the end portion 10CLB of the coil spring 34 in sliding contact. Therefore, the test is performed in a state where the surface of the contact roller 30 is cleaned.

  FIG. 7 shows another example of a contact terminal used in an example of a socket for a semiconductor device according to the present invention. The contact terminals 40 shown in FIG. 7 also constitute the contact terminal group CG in the socket body 10 as shown in FIG.

  In the example shown in FIG. 1, a hole 10 </ b> H is formed in the socket body 10 as an accommodating portion for accommodating the contact roller 30 as a contact terminal and the coil spring 34, but in FIG. A pipe member 44 is used as a part, which is inserted into the socket body 10.

  In FIG. 7, the contact terminal 40 is connected to the contact ball plunger 42 that contacts the terminal DVL of the semiconductor device DV and the electrode portion of the printed wiring board PB, as shown in an enlarged view in FIG. A substrate electrode plunger 48 that contacts, a pipe member 44 that accommodates the contact ball plunger 42 and the substrate electrode plunger 48 therein, and between the contact ball plunger 42 and the substrate electrode plunger 48. And a coil spring 46 that is urged in a direction to be separated from each other.

  The pipe member 44 has an opening end at which a part of the outer peripheral portion of the conductive contact ball plunger 42 is exposed and an opening end at which the contact portion of the conductive substrate electrode plunger 48 protrudes at both ends. Yes. At the periphery of the opening end where the contact ball plunger 42 is disposed, as shown in an enlarged view in FIG. 8A, an end 44CL for holding the contact ball plunger 42 so as to be rotatable and movable. Is formed. The end portion 44CL is formed as a cleaning edge that constitutes a part of a removing unit that removes deposits that increase the contact resistance adhered to the outer peripheral surface of the contact ball plunger 42.

  As shown in the enlarged view of FIG. 8A, the conductive coil spring 46 has a contact portion of the end winding that contacts the contact ball plunger 42 at the center of the contact ball plunger 42. It is formed obliquely so as to contact a position eccentric to the left side by a predetermined distance D from the axis.

  Further, the end winding of the other end that contacts the substrate electrode plunger 48 is formed substantially in parallel so as to engage with a stepped portion connected to the contact portion of the substrate electrode plunger 48. The step portion of the substrate electrode plunger 48 is movably engaged with the periphery of the opening.

  Also in the socket body 10 to which the contact terminal 40 is mounted, as in the above-described example, as shown in FIG. 8A, the socket body 10 is placed on the outer peripheral surface exposed to the outside of the contact ball plunger 42. Each terminal DVL of the semiconductor device DV is pressed by the above-described pressing portions 20A, 20B, 20C, and 20D in the direction indicated by the arrow P in FIG. As a result, a gap is formed between the pressed outer peripheral surface of the contact ball plunger 42 and the periphery of the opening, and the contact ball plunger 42 moves inward along the end turn of the coil spring 46. Therefore, the end winding on the contact roller 42 side of the coil spring 46 is pressed. As a result, the contact ball plunger 42 is rotated in the direction indicated by the arrow, that is, in the clockwise direction by the frictional force caused by the contact with one end of the coil spring 46. Thereby, the adhering matter adhering to the surface of the contact ball plunger 42 is automatically removed by the one end portion and the end portion 44CL of the coil spring 46 which is in sliding contact as a removing means.

  FIG. 9 shows still another example of contact terminals used in an example of a socket for a semiconductor device according to the present invention.

  The contact terminal 50 shown in FIG. 9 is also mounted in the same manner as the contact terminal 40 described above, and constitutes the contact terminal group CG in the socket body 10 as shown in FIG.

  In FIG. 9, the contact terminal 50 includes a conductive contact ball plunger 52 that contacts the terminal DVL of the semiconductor device DV and a conductive substrate electrode plunger 62 that contacts the electrode portion of the printed wiring board PB. A pipe member 54 that accommodates the contact ball plunger 52 therein, a pipe member 58 that is coupled to one end of the pipe member 54 and accommodates the substrate electrode plunger 62 therein, and a contact ball plunger 52 and a conductive coil spring 56 arranged between one end of the pipe member 54 and urging the contact ball plunger 52 toward the open end, and the substrate electrode plunger 62 and the pipe member 58. A conductive coil spring 60 disposed between the one end portion and biasing the substrate electrode plunger 62 toward the open end. It is.

  The pipe member 54 has an opening end at which a part of the outer peripheral portion of the contact ball plunger 52 is exposed and an end portion to which a pipe member 58 described later is coupled at both ends. At the periphery of the opening end where the contact ball plunger 52 is disposed, an end 54CL for holding the contact ball plunger 52 so as to be rotatable and movable is formed. The end portion 54CL is formed as a cleaning edge that constitutes a part of a removing unit that removes deposits that increase the contact resistance adhered to the outer peripheral surface of the contact ball plunger 52.

  In FIG. 9, the coil spring 56 is in contact with a position where the contact portion of the end winding that contacts the contact ball plunger 52 is eccentric to the left side by a predetermined distance D from the center axis of the contact ball plunger 52. It is formed diagonally.

  Further, the end winding at the other end is formed substantially parallel to the end so as to contact the end of the pipe member 58 inserted into the pipe member 54.

  The step portion of the substrate electrode plunger 62 housed inside the pipe member 58 is engaged with the periphery of the opening of the pipe member 58. The substrate electrode plunger 62 is biased toward the open end by a coil spring 60.

  Also in the socket body 10 to which the contact terminal 50 is mounted, each terminal DVL of the semiconductor device DV placed on the outer peripheral surface exposed to the outside of the contact ball plunger 52 is similar to the above example. The pressing portions 20A, 20B, 20C and 20D are pressed toward the contact ball plunger 52. As a result, a gap is formed between the pressed outer peripheral surface of the contact ball plunger 52 and the peripheral edge of the opening of the pipe member 54, and the contact ball plunger 52 extends along the end turn of the coil spring 56. The coil spring 56 is pushed inward, so that the end winding on the contact ball plunger 52 side of the coil spring 56 is pressed. As a result, the contact ball plunger 52 is rotated in the clockwise direction by a frictional force caused by contact with one end of the coil spring 56. Thereby, the adhering matter adhering to the surface of the contact ball plunger 52 is automatically removed by the one end portion and the end portion 54CL of the coil spring 56 that is in sliding contact as the removing means.

  In the above example, an example of a semiconductor device socket according to the present invention is applied to a semiconductor device socket to which a substantially square semiconductor device having a QFP type package is mounted. Of course, the present invention may be applied to a clamshell type or open top type semiconductor device socket to which a semiconductor device having a BGA type package as described above is mounted.

It is a fragmentary sectional view which shows the principal part of an example of the socket for semiconductor devices which concerns on this invention. It is sectional drawing which shows the structure of an example of the socket for semiconductor devices which concerns on this invention with the mounted semiconductor device. FIG. 3 is a cross-sectional view showing a state where a lid unit is closed in the example shown in FIG. 2. It is a fragmentary sectional view which expands and shows the principal part in the example shown by FIG. It is the fragmentary sectional view seen from the side of the part shown by FIG. FIG. 3 is a partial cross-sectional view for explaining an operation in the example shown in FIG. 2. It is sectional drawing which shows the structure of the other example of the contact terminal used for an example of the socket for semiconductor devices which concerns on this invention. (A), (B) is a figure where each is provided for operation | movement description in the example shown by FIG. It is sectional drawing which shows the structure of the further another example of the contact terminal used for an example of the socket for semiconductor devices which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Socket body 26 Base part 30 Contact roller 34,46,56,60 Coil spring 40,50 Contact terminal 42,52 Contact ball plunger DV Semiconductor device

Claims (7)

A conductive contact rotating body having an outer peripheral surface selectively contacting a terminal of the semiconductor device;
The contact rotator is arranged at a predetermined distance from the rotation center axis of the contact rotator, biases the contact rotator toward the terminal of the semiconductor device, and the contact rotator is connected to the conductive portion of the wiring board. A conductive biasing member electrically connected to
A support portion that rotatably and movably supports the contact rotating body, and that stores the biasing member;
When the terminal of the semiconductor device is pressed against the outer peripheral surface of the contact rotating body against the biasing force of the biasing member, the outer peripheral surface of the contact rotating body according to the rotation of the contact rotating body Removing means for automatically removing the deposits attached to the
A socket for a semiconductor device comprising:   The semiconductor device socket according to claim 1, wherein the contact rotating body is a conductive contact roller, and the biasing member is a conductive coil spring.   2. The socket for a semiconductor device according to claim 1, wherein the contact rotating body is a conductive ball plunger for contact, and the biasing member is a conductive coil spring.   2. The semiconductor device socket according to claim 1, wherein the housing portion is a hole formed in a socket body in which the semiconductor device is arranged.   The socket for a semiconductor device according to claim 1, wherein the housing portion is a pipe member.   When the terminal of the semiconductor device is pressed against the outer peripheral surface of the contact rotating body against the urging force of the urging member, the removing means is for the contact according to the urging force of the urging member. In the housing portion, the outer peripheral surface of the contact rotating body is slidably contacted and removed from the outer peripheral surface of the contact rotating body by rotating and moving around the rotation center axis. 2. The semiconductor device socket according to claim 1, further comprising a wall portion. 2. The semiconductor device socket according to claim 1, wherein the urging member constitutes a part of the removing means.

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