JP2002280499A - Cooling module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that a CPU of a personal computer or the like needs to be cooled to prevent its thermal damage, a heat sink having heat sink fins is connected to radiate its heat, but when heating components of the CPU have irregularity in heights, the heat sink may not sometimes be strongly pressure contacted with the heating component, the thermal coupling of the component to the sink is deteriorated so that effective heat radiation cannot be executed. SOLUTION: A cooling module comprises the independent heat sink 10 contacted with the heating component 18 such as the CPU or the like and freely floatably disposed in a cooling module housing 9, an elastic member such as a coiled spring 14 or the like for energizing the sink 10 so as to be pressure contacted with the component 18, and a means for following to the height unevenness of the component 18. Thus, the sink 10 is surely thermally coupled to the component 18 to largely lower the temperature of the component 18. Hence, the thermal damage of the component 18 is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling module used for cooling a heat-generating component such as a CPU in a personal computer or other electronic equipment.

[0002]

2. Description of the Related Art In general, electrical equipment, for example, small electronic equipment such as a multifunctional, high-performance personal computer, etc.
A CPU is used as a functional component. In particular, notebook personal computers and the like have a very high operating frequency in the CPU and the like for image processing and the like, so that the temperature may be higher than the temperature at which the CPU is thermally destroyed. The heat generated by the CPU is dissipated to ensure the safety of the equipment.

FIG. 9 is a cross-sectional view of a conventional cooling module, showing an example of a conventional heat sink. The heat sink 1 is made of aluminum die-cast, has a plurality of radiating fins 2, and its thermal interface section 3 is provided. It is in contact with a heat-generating component 5 such as a CPU provided on the substrate 4.
The heat sink 1 has a structure in which the thermal interface unit 3 is fixed to the substrate 4 with the mounting member 7 in order to strongly press the thermal interface unit 3 against the heat-generating component 5 such as a CPU to thermally couple the same. If necessary, a fan 6 is provided to forcibly cool the radiation fins 2 by wind generated by the rotation of the fan 6.

In the above configuration, the heat generated by the heat-generating component 5 is guided to the heat sink 1 and is radiated by the heat-radiating fins 2 of the heat sink 1, and the temperature of the heat-generating component 5 is reduced by forced cooling by the fan 6. Is wearing.

[0005] As another mounting means for the thermal interface portion 3 of the thermal interface portion 3 to strongly press against the heat-generating component 5 such as a CPU, as shown in a sectional view of another conventional cooling module in FIG. There is also a structure in which a coil spring 8 is interposed in a mounting portion of the heat sink 1, and the heat sink 1 is urged by the coil spring 8 to be pressed against the heat generating component 5.

[0006]

By the way, in the configuration of the heat sink 1 shown in FIG. 9, when the heat-generating component 5 has a variation in height, or when the dimensions of the mounting portion vary, the heat sink 1 has a structure. If the thermal interface unit 3 is strongly pressed against the heat-generating component 5, the CPU and the substrate may be damaged. If the pressing force is reduced to avoid this, the thermal coupling between the heat-generating component 5 and the heat sink 1 is reduced. As a result, there is a problem that the desired effective heat radiation in the heat sink 1 cannot be performed.

In the configuration of the heat sink 1 shown in FIG.
Even a slight dimensional error in the mounting part may cause the heat sink 1 having a large shape to be greatly inclined, and the thermal interface part 3 of the heat sink 1 to form a gap with respect to the heat-generating component 5. In some cases, the heat sink 1 may be inclined by the external force of the heat sink 1, and the thermal interface 3 of the heat sink 1 may form a gap with respect to the heat-generating component 5. However, there was a problem that the desired effective heat radiation could not be achieved.

An object of the present invention is to provide a cooling module which ensures the thermal connection between a heat sink and a thermal interface of a heat-generating component, and has a high cooling effect, while keeping in mind the above conventional problems.

[0009]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides an aluminum substrate having a plurality of heat dissipating fins protruding on one surface and a thermal interface portion for contacting a heat-generating component such as a CPU on the other surface. An independent heat sink made of die-casting is placed in the housing so that its thermal interface can be exposed through the window,
A cooling module having a structure in which the heat sink is urged by an elastic member so that the thermal interface portion thereof comes into pressure contact with the heat-generating component, and means for following the height variation of the heat-generating component is provided.

According to the present invention, it is possible to provide a cooling module in which a heat sink is reliably thermally coupled to a heat-generating component, and the temperature of the heat-generating component is greatly reduced to prevent thermal destruction thereof.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is to provide an independent heat sink having a radiating fin and having a thermal interface portion on the outside for contacting a heat-generating component such as a CPU. Means for floatingly disposing the heat sink in the housing so that the interface part is exposed, urging the heat sink so that the thermal interface part is in pressure contact with the heat-generating component, and following the height variation of the heat-generating component. Cooling module provided,
Even if the height of the heat-generating component differs from the expected height due to variations, an independent heat sink moves following the different height of the heat-generating component, and the thermal interface is pressed against the heat-generating component to effectively dissipate heat. Has the effect of being able to.

According to a second aspect of the present invention, in the cooling module according to the first aspect, the thermal interface of the heat sink is urged so as to press against the heat generating component, and the height of the heat generating component varies. Is a coil spring that holds down the heat sink, and even if the height of the heat-generating component differs from the expected height due to variations, the independent heat sink also follows the different height of the heat-generating component. Then, the thermal interface portion is pressed against the heat-generating component to effectively release heat.

According to a third aspect of the present invention, in the cooling module according to the first aspect, the thermal interface of the heat sink is urged to press against the heat-generating component, and the height of the heat-generating component varies. Means to follow the movement of the heat sink, and a coil spring that is wound around this axis and presses the heat sink, even if the height of the heat-generating component differs from the expected height due to variations. In addition, the independent heat sink moves following the different heights of the heat-generating components, and has an effect that the thermal interface can be pressed against the heat-generating components to effectively dissipate heat.

According to a fourth aspect of the present invention, in the cooling module according to the first aspect, the thermal interface of the heat sink is urged to press against the heat-generating component, and the height of the heat-generating component varies. The means for following the heat sink is composed of a leaf spring that holds down the heat sink.Even if the height of the heat-generating component differs from the expected height due to variations, the independent heat sink also follows the different height of the heat-generating component. Then, the thermal interface portion is pressed against the heat-generating component to effectively release heat.

According to a fifth aspect of the present invention, in the cooling module according to the first aspect, the thermal interface of the heat sink is urged to press against the heat-generating component, and the height of the heat-generating component varies. The means for following the heat sink is composed of an elastic rubber plate or an elastic resin plate that holds the heat sink. Even if the height of the heat generating component differs from the expected height due to variations, the independent heat sink also has a different heat generating component. It has the effect of being able to move following the height and to press the thermal interface part against the heat-generating component to effectively dissipate heat.

According to a sixth aspect of the present invention, in the cooling module according to the first aspect, the heat sink comprises:
The thermal interface unit presses against the heat-generating component with good heat conductive grease or sheet interposed therebetween, and the independent heat sink moves to follow the different height of the heat-generating component, and the contact portion Even if a gap is formed, the grease or sheet having good thermal conductivity absorbs the gap, and has the effect that the thermal interface portion and the heat-generating component can be reliably thermally coupled to effectively release heat.

According to a seventh aspect of the present invention, in the cooling module according to any one of the first to sixth aspects, the housing has a fan for forcibly cooling the heat sink inside. In addition, the thermal interface section and the heat-generating component can be reliably thermally coupled, and the fan can be effectively cooled.

According to an eighth aspect of the present invention, in the cooling module according to any one of the first to seventh aspects, the housing is mounted on the board or the main body of the equipment by means of mounting means having an elastic member interposed therebetween. When the large-sized housing is greatly inclined, the entire housing is tilt-corrected and the position of the heat sink is also corrected independently, so the thermal interface of the heat sink can be used as a heat-generating component. This has the effect of ensuring reliable contact.

According to a ninth aspect of the present invention, in the cooling module according to the eighth aspect, the casing is made of a metal having good heat conductivity, and a part of the casing is pressed against the second heat generating component. When a large-sized housing is greatly tilted, the entire housing is tilt-corrected and the position of the heat sink is also corrected independently. And has the effect that the heat can be radiated from the plurality of heat-generating components.

According to a tenth aspect of the present invention, in the cooling module according to any one of the first to seventh aspects,
The housing is a housing of the main body of the device, and has the effect of simplifying the structure of the cooling module, increasing the degree of freedom in arranging the fans, and facilitating manufacturing.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1) FIG. 1 is a plan view of a cooling module according to Embodiment 1 of the present invention with a cover removed, FIG. 2 is a sectional view of the cooling module, and FIG. 3 is a fan of the cooling module. FIG.

As shown in FIGS. 1, 2 and 3, the cooling module of the first embodiment is
And a heat sink 10 provided therein. The cooling module housing 9 is made of a metal having good heat conductivity, and has a window 11 on the lower surface thereof. The heat sink 10 is made of aluminum die-cast, a plurality of radiating fins 12 are integrally provided upright on the back surface, and the lower surface is a thermal interface unit 13. The heat sink 10 is independent and is provided so as to be able to float inside the cooling module housing 9 so that the thermal interface unit 13 is exposed through the window 11 of the cooling module housing 9. A coil spring 14 is interposed between both ends of the back surface of the heat sink 10 and the inside of the top plate of the cooling module housing 9, and the thermal interface 13 of the heat sink 10 projects from the window 11 of the cooling module housing 9. Is being biased. Also, the cooling module housing 9
Inside, a fan 15 for forcibly cooling the radiating fins 12 of the heat sink 10 by blowing air is provided. The cooling module housing 9 is fixed to a substrate 16 by a mounting member 17, and a heating component 18 such as a CPU mounted on the substrate 16.
Is the thermal interface 1 of the heat sink 10
3 and thermally bonded. Note that 1 in FIG.
Reference numeral 9 denotes an air inlet, and reference numeral 20 denotes an air outlet.

In the cooling module of the first embodiment configured as described above, the heat of the heat-generating component 18 is
The heat is transmitted to the thermal interface unit 13 and further transmitted to the radiating fins 12 and radiated. At this time, the radiation fins 12 are forcibly cooled by the blown air from the fan 15, so that the temperature of the heat-generating component 18 is reduced, thereby preventing the heat-generating component 18 from being destroyed by heat.

Here, when the height of the heat-generating component 18 such as the CPU mounted on the substrate 16 is different from a predetermined height due to variation, or due to a dimensional error of the mounting member 17 of the cooling module housing 9, etc. When the housing 9 is tilted, a heat-generating component 18 such as a CPU
Is the thermal interface 1 of the heat sink 10
The heat sink 10 is provided independently and floatably in the cooling module housing 9 in order to form a gap with respect to the heat sink 3, and the position of the heat sink 10 is vertically corrected by the bias of the coil spring 14 or contraction. Then, the thermal interface unit 13 is securely pressed against the heat generating component 18. Therefore, the heat of the heat generating component 18 is
And the temperature is reduced by heat radiation.

If necessary, a grease 21 or a sheet having good thermal conductivity is interposed at the contact portion between the thermal interface section 13 and the heat-generating component 18 as shown in FIG. If a gap occurs in the contact portion between the portion 13 and the heat-generating component 18, the gap is absorbed by the grease 21 or a sheet so that the thermal interface portion 13 and the heat-generating component 18 are more reliably thermally coupled. Is also good. Although the fan 15 is provided in the first embodiment, the above-described effect can be obtained even without using the fan 15.

(Embodiment 2) FIG. 4 is a sectional view of a cooling module according to Embodiment 2 of the present invention.

The cooling module of the second embodiment urges the cooling module of the first embodiment so that the thermal interface of the heat sink is pressed against the heat-generating component, and reduces the height variation of the heat-generating component. The means to follow is different.

That is, as shown in FIG. 4, the independent heat sink 10 inside the cooling module housing 9 can be floated by the floating guide pin 22, and the coil spring 14 is wound around the floating guide pin 22. The coil spring 14 is interposed between both ends of the back surface of the heat sink 10 and the inside of the top plate of the cooling module housing 9 so that the heat sink 1
It is configured to energize 0.

The cooling module having this configuration includes the heat-generating component 1
Even if the height of the heat sink 8 differs from the expected height due to the variation, the independent heat sink 10 moves following the different height of the heat generating component 18, and the thermal interface 13 is pressed against the heat generating component 18. The heat can be effectively dissipated, and the following movement of the heat sink 10 is smoothly performed.

(Embodiment 3) FIG. 5 is a sectional view of a cooling module according to Embodiment 3 of the present invention.

In the cooling module according to the third embodiment, the thermal interface of the heat sink is urged against the cooling module according to the first embodiment so as to press against the heat-generating component, and the height of the heat-generating component is reduced. The means to follow is different.

That is, as shown in FIG. 5, the heat sink 10 which is provided independently and floatably inside the cooling module housing 9 has both ends of the plate portion 23 held down by the plate springs 24, and the heat sink 10 Is energized.

The cooling module having this configuration also has the heat generating component 1
Even if the height of the heat sink 8 is different from the expected height due to the variation, the independent heat sink 10 moves following the different height of the heat generating component 18, and the thermal interface 13 is pressed against the heat generating component 18. The heat can be dissipated effectively, and the follow-up movement / biasing structure of the heat sink 10 is simplified.

(Embodiment 4) FIG. 6 is a sectional view of a cooling module according to Embodiment 4 of the present invention.

The cooling module of the fourth embodiment urges the cooling module of the first embodiment so that the thermal interface of the heat sink is pressed against the heat-generating component, and reduces the height variation of the heat-generating component. The means to follow is different.

That is, as shown in FIG. 6, the heat sink 10 provided independently and floatably inside the cooling module housing 9 is interposed between the back portion thereof and the top plate of the cooling module housing 9. The elastic rubber plate 25 presses the heat sink 10. The elastic rubber plate 25 may have good thermal or electrical conductivity, or may be an elastic resin plate.

The cooling module having this configuration also has a heat-generating component 1
Even if the height of the heat sink 8 differs from the expected height due to the variation, the independent heat sink 10 moves following the different height of the heat generating component 18, and the thermal interface 13 is pressed against the heat generating component 18. The heat can be dissipated effectively, and the follow-up movement / biasing structure of the heat sink 10 is simplified.

(Embodiment 5) FIG. 7 is a sectional view of a cooling module according to Embodiment 5 of the present invention.

The cooling module according to the fifth embodiment is characterized by the means for attaching the cooling module housing.

That is, as shown in FIG. 7, an independent heat sink 10 is floated inside and a heat generating component 18 is provided.
The cooling module housing 9 provided so as to urge in the direction
A second floating guide pin 26 is attached to the substrate 16 so as to be freely floatable, and the heat generating component 18 is
It is configured to be biased in the direction. The cooling module housing 9 is made of a metal having good thermal conductivity, and a part thereof is attached to the substrate 16 so as to be pressed against the second heat generating component 28.

The cooling module thus configured is
Even when the cooling module has a large shape and is easily inclined due to a dimensional error of the mounting portion, the position of the entire cooling module is corrected according to the error, and the position of the heat sink 10 is also corrected independently. As a result, the heat sink 10 can surely radiate heat. Furthermore, since the cooling module housing 9 can be used as a heat sink because the position of the cooling module housing 9 is corrected and thermally coupled to the second heat generating component 28, it is convenient in the case where the cooling module housing 9 includes a plurality of heat generating components.

(Embodiment 6) FIG. 8 is a sectional view of a cooling module according to Embodiment 6 of the present invention.

The cooling module according to the sixth embodiment is characterized by a cooling module housing.

In other words, as shown in FIG. 8, the cooling module uses a housing 29 of a device main body such as a notebook personal computer as a cooling module housing, and an independent heat sink 10 floats in the housing 29 of the device main body. Arranged freely, the thermal interface unit 13 of the heat sink 10 is urged so as to press against the heat-generating component 18, follows the variation in height of the heat-generating component 18, and has a cooling fan 15. I have.

Since the cooling module having the above-described structure uses the housing of the device body as its housing, the structure can be simplified, the degree of freedom in the arrangement of the heat sink 10 and the fan 15 is increased, and the manufacturing is easy. Can be

[0047]

As is apparent from the above description, the cooling module according to the present invention can be used even when the height of the heat-generating component is different from the expected height due to variations, or when a dimensional error of the mounting portion occurs. The heat sink moves independently following the different heights and dimensional errors of the heat-generating components, and its thermal interface can be pressed against the heat-generating components. It can reduce the temperature of components to prevent thermal destruction.
The effect is large as a cooling module such as a PU.

[Brief description of the drawings]

FIG. 1 is a plan view of a cooling module according to a first embodiment of the present invention with a cover removed.

FIG. 2 is a sectional view of the cooling module.

FIG. 3 is a sectional view of the cooling module including a fan unit.

FIG. 4 is a sectional view of a cooling module according to a second embodiment of the present invention.

FIG. 5 is a sectional view of a cooling module according to a third embodiment of the present invention.

FIG. 6 is a sectional view of a cooling module according to a fourth embodiment of the present invention.

FIG. 7 is a sectional view of a cooling module according to a fifth embodiment of the present invention.

FIG. 8 is a sectional view of a cooling module according to a sixth embodiment of the present invention.

FIG. 9 is a cross-sectional view of a conventional cooling module.

FIG. 10 is a sectional view of another conventional cooling module.

[Explanation of symbols]

 REFERENCE SIGNS LIST 9 cooling module housing 10 heat sink 11 housing window 12 radiating fin 13 thermal interface unit 14 coil spring 15 fan 16 substrate 17 mounting member 18 heat generating component 19 air inlet 20 air outlet 21 grease 22 floating guide pin 23 heat sink plate Part 24 leaf spring 25 elastic rubber 26 second floating guide pin 27 elastic member 28 second heat generating component 29 housing of device body

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 7/20 H01L 23/46 C

Claims (10)

[Claims] 1. An independent heat sink having a radiating fin and a thermal interface portion on the outside of which a heat-generating component such as a CPU is brought into contact is floatably mounted in a housing so that the thermal interface portion is exposed. Place,
A cooling module, comprising: means for urging the heat sink so that its thermal interface portion comes into pressure contact with the heat-generating component, and following a variation in height of the heat-generating component. The means for urging the thermal interface portion of the heat sink so as to press against the heat-generating component and following the height variation of the heat-generating component is constituted by a coil spring for pressing the heat sink. Claim 1
The cooling module as described. 3. A means for urging the thermal interface portion of the heat sink so as to press against the heat-generating component and following the variation in height of the heat-generating component includes a shaft for guiding the movement of the heat sink and a shaft wound around the shaft. 2. A coil spring for holding a heat sink by pressing.
The cooling module as described. 4. The means for urging the thermal interface of the heat sink so as to press against the heat-generating component and following the height variation of the heat-generating component is constituted by a leaf spring for pressing the heat sink. The cooling module according to claim 1. The means for urging the thermal interface portion of the heat sink so as to press against the heat-generating component and following the height variation of the heat-generating component is constituted by an elastic rubber plate or an elastic resin plate for holding the heat sink. The cooling module according to claim 1, wherein: 6. The cooling module according to claim 1, wherein the heat sink has a thermal interface portion press-contacted to the heat-generating component with a grease or sheet having good thermal conductivity interposed therebetween. 7. The cooling module according to claim 1, wherein the housing has a fan for forcibly cooling the heat sink inside. 8. The cooling module according to claim 1, wherein the casing is attached to the board or the casing of the apparatus body by attaching means with an elastic member interposed. 9. The cooling module according to claim 8, wherein the housing is made of a metal having good thermal conductivity, and a part of the housing is attached to the substrate so as to press against the second heat generating component. 10. The cooling module according to claim 1, wherein the housing is a housing of an apparatus main body.