JPH1195871A - Heat radiation structure of electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently radiate the heat generated by a heating component to the internal surface of a housing through projection parts by forming a heat-conductive film on the surfaces of the projection parts projecting on the internal surface of the housing and the internal surface of the housing and providing a heat radiation plate which comes into contact with the heat- conductive films atop of the projection parts. SOLUTION: On the bottom part internal surface of the housing 14, ribs 13 which increase the rigidity of the housing 14 are projected and the heat radiation plate 12 are connected to their tips thermally conductively. Here, the ribs 13 are formed by covering the projection parts 31 projecting from the internal surface bottom part of the housing 14 and the internal surface bottom part of the housing 14 with the heat-conductive thin film 32. The heat- conductive thin films 32 of the ribs 13 are brought into thermally conductive contact with the heat radiation plate 12 which is in contact with the heating component 11. The ribs 13 are so shaped as to maintain the strength of the housing 14 and the heat radiating component 1 is arranged on the intersections of the radially formed ribs 13 to transmit the heat of the heating component 11 radially and speedily to the housing 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating structure for an electronic device, such as a portable personal computer (hereinafter abbreviated as a portable personal computer), which cools an electronic component that generates heat provided in the electronic device.

[0002]

2. Description of the Related Art With the advancement of functions of a CPU (central processing unit), which is an electronic component used in a portable personal computer,
The amount of heat generated from integrated circuit components such as PUs is steadily increasing. For this reason, in the portable personal computer, if the heat radiation is not performed properly, the operation of the CPU becomes unstable due to the heat generated by the CPU itself, and a malfunction occurs. In order to prevent such malfunctions, various heat dissipation measures have been considered in portable personal computers. Less than,
A general heat dissipation structure of a heat-generating component in a conventional small electronic device will be described with reference to the drawings. FIG. 5 is a longitudinal sectional view showing a heat dissipation structure of a heat-generating component in a small electronic device according to a first conventional example. In FIG. 5, a heat radiating plate 3 as a heat radiating member is provided on the upper surface of the CPU which is the heat generating component 1 mounted on the circuit board 2. The heat radiation structure shown in FIG. 5 is configured such that heat generated from the operated heat generating component 1 is transmitted to the flat heat radiation plate 3 and radiated. The heat radiating plate 3 is formed of a material having high thermal conductivity such as aluminum (Al). The heat radiating plate 3 is fixed to the upper surface of the heat generating component 1 by an adhesive having thermal conductivity or a double-sided tape.

FIG. 6 is a longitudinal sectional view showing a heat radiating structure of a heat generating component 1 in a small electronic device according to a second conventional example.
In FIG. 6, the heat generating component 1 mounted on the circuit board 2 is provided with a heat sink 4 as a heat radiating member.
The heat radiating structure of the second conventional example is configured so that heat generated from the activated heat generating component 1 is transmitted to the heat sink 4 having a plurality of fins and radiated. The heat sink 4 is made of a metal material having a high thermal conductivity such as aluminum. As described above, the difference between the first conventional example and the second conventional example is the configuration of the heat radiating member. The first conventional example is a flat heat radiating plate, and the second conventional example has a plurality of fins. It is a heat sink. In general, the heat-generating component is radiated by using the above-described heat-radiating plate or heat sink to form a large heat-radiating area, quickly dissipate the heat to the surrounding space, and cool the heat-generating component. Further, in the heat dissipation structure of the conventional electronic device configured as described above, a fan is provided for forcibly cooling the heat dissipation plate and the heat sink to further enhance the heat dissipation effect.

[0004]

However, in either of the first conventional example and the second conventional example,
Because of the structure in which the heat of the heat generating component is radiated from the surface of the heat radiating member, the amount of reduction in the temperature of the heat generating component depends on the surface area of the heat radiating plate or the heat sink. Therefore, in order to further enhance the cooling effect of the conventional heat dissipating member, it is necessary to set the surface area of the heat dissipating member larger. However, as electronic devices become smaller and lighter, as represented by portable personal computers, the space in which components can be installed in the housing decreases, and the weight restrictions become stricter. There is a problem that a large heat sink or heat sink that can be installed cannot be installed in a small electronic device. Further, in a conventional electronic device, the surface area of the heat sink or the size of the heat sink can be set small by forcibly air-cooling a heat-generating component such as a heat sink or a heat sink by a fan. There is a problem in that power is required and power consumption of the electronic device is increased. In a small electronic device such as a portable personal computer, long-term use with a battery is an important issue to be achieved along with reduction in size and weight, and reduction of power consumption is an important issue for achieving the issue of long-term use. This is a mandatory condition. It has been desired to avoid forced air cooling by a fan from the viewpoint of the installation space in the housing and power consumption.

[0005]

In order to solve the above-mentioned problems, a heat dissipation structure of an electronic device according to the present invention is provided in an electronic device having a heat-generating component in a housing, and is integrally formed with the housing.
A projection protruding from an inner surface of the housing and providing rigidity to the housing, a heat conductive film formed so as to cover at least a surface of the projection and an inner surface of the housing, and the heat-generating component are fixed. And a heat dissipating member arranged to be in contact with the heat conductive film at the tip of the protrusion. For this reason,
In the heat dissipation structure of the electronic device of the present invention, the heat-generating component or the heat-dissipating member in contact with the heat-generating component contacts the heat conductive thin film on the surface of the protrusion of the housing, and transfers the heat of the heat-generating component to the inner surface of the housing through the protrusion. It is configured to escape.

In the heat radiating structure for an electronic device according to the present invention, the protrusion has the same height from the inner surface of the housing, and is formed so that at least a part thereof spreads radially, and is fixed to the heat radiating member. The heat-generating component is arranged at a position corresponding to a center point of the radial shape in the protrusion. Therefore, in the heat dissipation structure of the electronic device of the present invention, the heat of the heat-generating component is efficiently and radially transmitted to the outer surface of the housing through the protrusion.

In the heat dissipation structure for an electronic device according to the present invention, the heat conductive film is formed of a heat dissipation member made of aluminum, copper, or graphite. Therefore, in the heat dissipation structure of the electronic device of the present invention, the heat of the heat-generating component is transmitted through the heat-dissipation member having high thermal conductivity, and is efficiently transmitted to the outer surface of the housing.

In the heat dissipation structure for an electronic device according to the present invention, the heat conductive film is provided so as to cover a surface of the projection, an inner surface of the housing, and an outer surface of the housing. Heat conductive films provided on both the inner surface and the outer surface are thermally connected by a heat conductive member embedded in the housing. For this reason, in the heat dissipation structure of the electronic device of the present invention, the heat of the heat-generating component is transmitted to the outer surface of the housing via the heat-dissipation member having high thermal conductivity,
Heat is dissipated efficiently.

In the heat dissipation structure for an electronic device according to the present invention, the heat conductive member is formed of an aluminum material, a copper material, or a graphite material. Therefore, in the heat dissipation structure of the electronic device of the present invention, the heat of the heat-generating component is transmitted through the heat-dissipation member having high thermal conductivity, and is efficiently transmitted to the outer surface of the housing.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment and a second embodiment of a portable personal computer having an electronic apparatus according to the present invention having a heat dissipation structure will be described below with reference to the accompanying drawings. << First Embodiment >> FIG. 1 is a perspective view showing a housing having a heat dissipation structure of a portable personal computer according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view of the housing having the heat dissipation structure of the first embodiment. In FIG. 1 and FIG. 2, a heat generating component 11 (for example,
The CPU is mounted on the circuit board 10, and a heat radiating plate 12, which is a heat radiating member having excellent heat conductivity, is adhered to a surface thereof (a lower surface of the circuit board 10 in FIG. 2). The radiator plate 12 of the first embodiment is formed in a flat plate shape from an aluminum material. As shown in FIG. 2, a plurality of ribs 13 project from the inner surface of the bottom of the housing 14 of the portable personal computer of the first embodiment to increase the rigidity of the housing. A heat radiating plate 12 bonded to the heat generating component 11 is thermally conductively connected to a leading end of the rib 13 which is a protruding end.

FIG. 3 is an enlarged sectional view of the bottom of the inner surface of the housing 14 having the ribs 13. In FIG. 3, a rib 1 formed on a housing 14 of a portable personal computer is shown.
Reference numeral 3 denotes a protrusion 31 formed by projecting a part of the housing 14 formed of a resin material, and a heat conductive thin film 32 covering the protrusion 31 and an inner bottom surface of the housing 14. . Therefore, in the configuration of the first embodiment, the heat radiating plate 12 in contact with the heat generating component 11 is in thermal conductive contact with the heat conductive thin film 32 of the plurality of ribs 13. In the first embodiment, the heat conductive thin film 32 is formed by bonding an aluminum film to the projection 31. However, the heat conductive thin film 32 may be formed by bonding a heat conductive member made of a copper material. May be applied. As the heat conductive thin film 32, a heat radiation member made of graphite having a high orientation as disclosed in Japanese Patent Application Laid-Open No. Hei 8-23183, which is disclosed by the same applicant as the present invention, is used, so that the heat conductivity is higher than that of aluminum. Can be secured.

As described above, in the heat radiating structure of the first embodiment, the heat of the operated heat generating component 11 is transmitted through the heat conductive thin film 32 formed on the surface of the rib 13 via the heat radiating plate 12. The heat of the heat generating component 11 transmitted to the heat conductive thin film 32 is transmitted to the entire heat conductive thin film 32 covering the bottom inner surface of the housing 14, and is diffused in the housing 14 via the protrusion 31. In the first embodiment, as shown in FIG. 1, the heat-generating component 11 is disposed on the intersection of the radially formed ribs 13 having thermal conductivity, and the heat of the heat-generating component 11 is quickly radiated to the housing. 14. The shape of the rib 13 formed in the housing 14 is
Any shape that can maintain the housing 14 at a desired strength may be used.
The shape of the rib 13 of the first embodiment shown in FIG. 1 is not limited. Therefore, the shape of the rib in the heat dissipation structure of the present invention is determined so that the strength of the housing can be maintained and heat conduction is efficiently performed in consideration of the arrangement of other components provided in the housing. .

As described above, the heat radiation structure of the portable personal computer according to the first embodiment generates heat by using the ribs originally formed for the purpose of maintaining the strength of the housing or mounting the circuit board. This is a structure that conducts heat from components to the housing. As described above, the rib provided for the purpose of securing the strength or attaching the circuit board in the conventional portable personal computer is used as the heat conducting member in the first embodiment, so that the conventional portable personal computer can be used. In comparison, there is no need to provide a separate heat sink, and the heat of the heat generating component can be efficiently diffused to the housing without increasing the weight. Further, by optimizing the arrangement of the ribs by using the ribs as the heat transfer medium as in the first embodiment, the heat transfer state at the bottom of the housing is dispersed, and the local temperature rise does not occur. In addition, the temperature of the entire housing can be made uniform.

Second Embodiment A portable personal computer according to a second embodiment of the present invention having a heat dissipation structure for an electronic device will be described below with reference to the accompanying drawings. FIG. 4 is an enlarged sectional view showing a bottom portion of a housing having a heat radiation structure of a portable personal computer according to a second embodiment of the present invention. In the second embodiment, a plurality of ribs 23 are formed on the housing 24 of the portable personal computer as in the first embodiment. Also,
The heat-generating component 11 mounted on the circuit board 10 has a heat-radiating plate 12 as a heat-radiating member having excellent thermal conductivity adhered to the surface (the lower surface of the heat-generating component 11 in FIG. 4). The radiator plate 12 of the second embodiment is formed of an aluminum material. A plurality of ribs 23 for increasing the rigidity of the housing are formed on the inner surface of the bottom of the housing 24 of the portable personal computer according to the second embodiment. The heat radiating plate 12 to which the heat generating component 11 is adhered is thermally conductively arranged so as to contact the tips of the plurality of ribs 23. The ribs 23 formed on the housing 24 are formed by projecting portions 41 formed by projecting a part of the resin material forming the housing 24.
And a heat conductive film 42 covering the projection 41.

As shown in FIG. 4, the housing 2 of the second embodiment
At the bottom of 4, the resin portion 44 constituting the base of the housing 24 is covered on its inner and outer surfaces (upper and lower surfaces in FIG. 4) with a heat conductive film 42 covering the projection 41. A plurality of heat conductive members 43 penetrating through the resin portion 44 of the housing 24 are provided on the bottom of the housing 24. Further, the heat conductive member 43 is formed so as to penetrate the rib 23 for securing the rigidity of the housing 24. For this reason, the heat conductive films 42 provided on both the inner surface and the outer surface of the housing 24 are thermally conductively connected via the heat conductive member 43. In the second embodiment, the heat conductive film 42
The resin portion 44 is formed by bonding an aluminum film, but may be formed by bonding a copper plate, or by applying a material such as aluminum or copper. Further, by using a heat-dissipating member made of graphite having a high orientation disclosed in JP-A-8-23183 as the heat conductive film 42, a higher heat conductivity than aluminum can be secured.

According to the heat radiating structure of the portable personal computer of the second embodiment configured as described above, the heat generated in the heat generating component 11 is transferred to the heat conductive film 42 on the rib surface via the heat radiating plate 12. The heat is diffused to the inner surface of the bottom of the housing 24 and is also transmitted to the heat conductive film 42 formed on the outer surface of the bottom of the housing 24 via the heat conductive member 43. in this way,
In the second embodiment, the heat of the heat generating component 11 is
The heat is dissipated in the heat conductive films 42 formed on both the inner surface and the outer surface, and these heat conductive films 42 function as heat radiating portions. With the above configuration, the portable personal computer of the second embodiment has a large heat dissipation area by diffusing heat to the housing, and the heat dissipation effect of the heat generating component 11 is smaller than that of the first embodiment. It is even better than in comparison. In the heat radiation structure of the portable personal computer according to the second embodiment, the housing 1
Since the heat conductive film 42 formed on the outer surface of No. 4 radiates heat to the outside of the housing, the amount of heat stored in the housing is greatly reduced.

[0017]

As described above, in the heat dissipation structure of an electronic device according to the present invention, the heat generated from the heat-generating component is conventionally used by using the ribs in the housing formed for the purpose of securing the strength, attaching the circuit board, and the like. It is configured to transfer heat to the housing and diffuse it. Therefore, the heat dissipation structure of the electronic device according to the present invention can efficiently dissipate the heat of the heat-generating component without a significant increase in cost and weight due to installation of a special heat dissipation mechanism. Further, in the heat dissipation structure of the electronic device of the present invention, by optimizing the arrangement of the ribs in the housing, it is possible to suppress a local temperature rise of the housing and to make the temperature distribution of the housing uniform. Furthermore, the heat dissipation structure of the electronic device according to the present invention is characterized in that a heat conductive film having high heat conductivity is provided on both inner and outer surfaces of the housing and both heat conductive films are connected via a heat conductive member. Heat can be dissipated on both the inner and outer surfaces of the body. Therefore, according to the present invention,
The heat radiation effect is greatly improved, and the heat from the heat-generating components can be quickly dissipated, and the amount of heat stored in the housing can be significantly reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a housing having a heat radiation structure of a portable personal computer according to a first embodiment of the present invention.

FIG. 2 is a sectional view of the housing of the first embodiment.

FIG. 3 is an enlarged sectional view showing a part of the housing of the first embodiment.

FIG. 4 is an enlarged sectional view showing a part of a housing having a heat radiation structure of a portable personal computer according to a second embodiment of the present invention.

FIG. 5 is a longitudinal sectional view showing a heat radiation structure of a heat-generating component in a small electronic device as a first conventional example.

FIG. 6 is a longitudinal sectional view showing a heat radiation structure of a heat-generating component in a small electronic device according to a second conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Circuit board 11 Heat generating component 12 Heat sink 13 Rib 14 Housing 31 Projection part 32 Thermal conductive thin film

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[Procedure amendment]

[Submission date] December 25, 1997

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claim 2

[Correction method] Change

[Correction contents]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] Claim 3

[Correction method] Change

[Correction contents]

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] Claim 5

[Correction method] Change

[Correction contents]

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0007

[Correction method] Change

[Correction contents]

Further, the heat dissipation structure of the electronic apparatus of the present invention, the thermally conductive film, an aluminum material, and is formed by a copper material, or grapher <br/> wells material. Therefore, in the heat dissipation structure of the electronic device of the present invention, the heat of the heat-generating component is transmitted through the heat-dissipation member having high thermal conductivity, and is efficiently transmitted to the outer surface of the housing.

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

[Correction contents]

In the heat dissipation structure for an electronic device according to the present invention, the heat conductive member is formed of an aluminum material, a copper material, or a graphite material. Therefore, in the heat dissipation structure of the electronic device of the present invention, the heat of the heat-generating component is transmitted through the heat-dissipation member having high thermal conductivity, and is efficiently transmitted to the outer surface of the housing.

[Procedure amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0015

[Correction method] Change

[Correction contents]

As shown in FIG. 4, the housing 2 of the second embodiment
At the bottom of 4, the resin portion 44 constituting the base of the housing 24 is covered on its inner and outer surfaces (upper and lower surfaces in FIG. 4) with a heat conductive film 42 covering the projection 41. A plurality of heat conductive members 43 penetrating through the resin portion 44 of the housing 24 are provided on the bottom of the housing 24. Further, the heat conductive member 43 is formed so as to penetrate the rib 23 for securing the rigidity of the housing 24. For this reason, the heat conductive films 42 provided on both the inner surface and the outer surface of the housing 24 are thermally conductively connected via the heat conductive member 43. In the second embodiment, the heat conductive film 42
The resin portion 44 is formed by bonding an aluminum film, but may be formed by bonding a copper plate, or by applying a material such as aluminum or copper. Further, by using a heat-dissipating member made of graphite having a high orientation disclosed in JP-A-8-23183 as the heat conductive film 42, a higher heat conductivity than aluminum can be secured. Also heat
As the conductive member 43, an aluminum material, a copper material, or
It is formed of a graphite material.

Claims (5)

[Claims] 1. An electronic device having a heat-generating component in a housing, wherein the projection is formed integrally with the housing, protrudes from an inner surface of the housing, and provides rigidity to the housing; A heat conductive film formed so as to cover an inner surface of the housing; and a heat dissipating member to which the heat generating component is fixed and arranged to be in contact with the heat conductive film at the tip of the protrusion. Heat dissipation structure of electronic equipment characterized by the following. 2. The projection has the same height from the inner surface of the housing, and is formed so that at least a part thereof spreads radially, and a heat-generating component fixed to the heat radiation member has a heat radiation shape of the projection. 2. The heat dissipation structure for an electronic device according to claim 1, wherein the heat dissipation structure is arranged at a position corresponding to the center point. 3. The heat radiating structure for an electronic device according to claim 1, wherein said heat conductive film is formed of a heat radiating member made of aluminum, copper, or graphite. 4. The method according to claim 1, wherein the heat conductive film is provided on a surface of the protrusion,
A heat conductive film is provided to cover the inner surface of the housing and the outer surface of the housing, and the heat conductive films provided on both the inner surface and the outer surface of the housing are thermally connected by a heat conductive member embedded in the housing. The heat dissipation structure of an electronic device according to claim 1, wherein the heat dissipation structure is connected. 5. The heat conductive member is made of an aluminum material,
The heat dissipation structure for an electronic device according to claim 4, wherein the heat dissipation structure is made of a copper material or a graphite material.