JP2002043208A - Method for coating and development - Google Patents

Abstract

PROBLEM TO BE SOLVED: To fix the time until pre-development heat treatment start after exposure. SOLUTION: After a wafer W is transported in an exposure system 4, the transporting body 5 of an interface section 4 is made to stand by at a standby position Q from which the body 5 can immediately access to a carry-out pedestal 39 on which the wafer W from the exposure system 4 is placed. In addition, a main transporter 11 which transports the wafer W from an extension device 36 to a PEB device 33 in a treatment station 3 is made to stand by at anther standby position P from which the transporter 11 can immediately access to the extension device 36. When exposure ends, the transporting body 5 immediately transports the wafer W on the pedestal 39 to the extension device 36 and the main transporter 11 immediately transports the wafer W transported to the device 36 to the PEB device 33.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for coating and developing a substrate.

[0002]

2. Description of the Related Art For example, in a photolithography process in a semiconductor device manufacturing process, a resist coating process for forming a resist film on a wafer surface, an exposure process for irradiating a wafer with a pattern, and an exposure process after the exposure and before a development process are performed. A post-exposure baking process for heating the wafer, a developing process for developing the wafer after the heating process, and the like are sequentially performed, and these processes are performed by each processing apparatus individually provided in a single coating and developing system. And in the exposure apparatus adjacent to the system. Further, the coating and developing system is configured so that a plurality of wafers can be processed at a time in a flow operation manner, and the transfer of wafers between the respective processing apparatuses is usually performed by one transfer apparatus.

The transfer device is constructed so as to be accessible to a plurality of processing devices, and transfers each wafer in each processing device to a processing device in which a next process is performed at a suitable timing according to a processing process. The operation is controlled so that a series of photolithography steps can be performed smoothly.

[0004]

However, since a large number of wafers are transferred by one transfer device as described above, for example, when one wafer is transferred in one processing device, another transfer device is used. When the processing of another wafer in the processing apparatus is completed, another wafer cannot be transferred until the transfer of one wafer is completed. On the other hand, when the transfer device is not transferring a wafer and is in a standby state, the other wafer can be transferred immediately. Therefore, the time required for the transfer device to pick up the wafer after the processing of the wafer is completed depends on the position and condition of the transfer device, and the total time required from the end of one process to the start of the next process. This time may be non-uniform between wafers.

When a chemically amplified resist is used as a resist solution for forming the resist film, an acid is generated by the exposure, and the acid reacts with the resist film to develop the exposed portion of the resist film. It changes to be soluble in liquid. Therefore, the degree of the development process, that is, the line width of the circuit pattern on the wafer largely depends on the progress of the chemical reaction by the acid, and the chemical reaction is greatly affected by the time from exposure to development.

Therefore, the time from the exposure processing to the development processing of the wafer, particularly the time required from the exposure processing to the post-exposure baking processing, is affected by the position and the state of the transfer device, and the time is unified. In such a case, there is a concern that the line width of the circuit pattern finally formed on the wafer is adversely affected.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has been made in consideration of the above-described problems, and has been made in consideration of the above circumstances. It is an object of the present invention to provide a developing method.

[0008]

According to the first aspect of the present invention, a step of exposing a substrate on which a coating film is formed and a step of transporting the exposed substrate to a heat treatment apparatus for performing a heat treatment before a development treatment. A coating and developing treatment method comprising the steps of:
There is provided a coating and developing method, wherein the carrying step is performed so that the time from the completion of the exposure of the substrate to the carrying of the substrate to the heat treatment apparatus is constant.

As described above, by performing the transfer step so that the time from the end of the exposure to the transfer to the heat treatment apparatus is constant, the degree of the chemical reaction of the coating film due to the above-described exposure is reduced between the substrates. Become uniform. Therefore, the development processing of each substrate is performed to the same extent, and the line width of the circuit pattern finally formed on the substrate is uniformly formed between the substrates. The term “the carrying step is performed so that the time from the completion of the exposure of the substrate to the time when the substrate is carried to the heat treatment apparatus” means that, for example, the substrate is transferred from the exposure apparatus to the heat treatment apparatus. This is performed by controlling the operation of the transfer device. Specifically, for example, the transfer device is set in standby before the exposure device, and the substrate is transferred to the heat treatment device immediately after the exposure is completed and the substrate comes out of the exposure device. It is proposed to always start the transfer of the substrate after a lapse of a predetermined time, or to stop the transfer device holding the substrate at a predetermined place and adjust the time.

According to the second aspect of the present invention, the step of exposing the substrate on which the coating film is formed in the exposure apparatus, and thereafter, the exposed substrate is once transported to the transfer section by the first transport apparatus, and then the first transport apparatus transfers the substrate to the transfer section. And a step of transporting the substrate in the transfer section to a heat treatment apparatus in which a heat treatment before the development processing is performed by the transfer device of (2), wherein at least when the exposure of the substrate is completed, The first transfer device is waiting at a first position where the substrate can be received, and transfers the substrate to the transfer unit immediately after the exposure of the substrate is completed, and at least transfers the substrate to the transfer unit. When the substrate is transported, the second transport device is waiting at a second position where the substrate can be received, and immediately after the substrate is transported into the transfer unit, the substrate is loaded with the substrate. Coating and developing processing method characterized by conveying to the processing apparatus is provided.

In the coating and developing method according to the second aspect,
When the exposure of the substrate is completed, the first transfer device is waiting at the first position where the substrate can be received, and the substrate can be transferred to the transfer section immediately after the exposure of the substrate is completed. . Further, when the substrate is transferred to the transfer unit, the second transfer device is on standby at a second position where the substrate can be received, and immediately after the substrate is transferred into the transfer unit, the substrate is transferred to the transfer unit. It can be transported to a heat treatment device. In addition, the first and second transfer devices wait at the predetermined positions in preference to the transfer of another substrate, so that each transfer device is transferring another substrate, for example, or transferring the substrate. The substrate is not moved to a position where it cannot be received immediately, and the transfer time of the substrate from the exposure processing to the heat treatment apparatus is kept constant. Therefore, since the chemical reaction solubilized in the developer described above proceeds uniformly,
The development processing of each substrate is performed uniformly, and variation in the line width of the finally formed pattern between the substrates is suppressed. It is sufficient that the first transfer device waits at a predetermined position at least when the exposure is completed, and the second transfer device waits at a predetermined position at least when the substrate is transferred to the transfer unit. The user may be on standby for a period of time, or may be on standby at that time.

According to the second aspect of the present invention, the third aspect
As described above, when the predetermined time T is required for the substrate exposure step, the predetermined time T
, The first transport device waits at the first position until a maximum standby time I longer than a predetermined time T has elapsed from the start of the exposure process. You may make it. Note that the predetermined time T means the time required for the exposure process when the minimum processing normally performed in the exposure process is performed smoothly and no trouble occurs. According to the third aspect, even when it takes longer than the predetermined time T normally required for the substrate exposure step, the first transfer device is kept at the first position until the maximum standby time I elapses. In this case, the substrate on which the exposure has been completed can be immediately transferred to the transfer unit. Further, since the maximum standby time I is set, for example, even if a trouble occurs during the exposure processing and the exposure processing of the substrate is not completed, the first transfer device does not wait forever, and for example, the first transfer apparatus does not wait. By canceling the standby state of the transfer device and transferring another substrate, it is possible to appropriately cope with the trouble.
Note that the exposure processing may not be performed in a usual time due to an alignment operation in the exposure apparatus or the like, and the maximum standby time I is determined in consideration of variations in the exposure process time. The longest time is preferred. Further, the step of exposing the substrate means a period from when the substrate is loaded into the exposure apparatus to when it is unloaded from the exposure apparatus.

Further, in the case where the predetermined time T is normally required for the exposure step of the substrate as in claim 4, even if the normal predetermined time T has elapsed without terminating the exposure step, the second step is performed. The second transport device may wait at the second position until a maximum standby time M longer than a predetermined time T has elapsed from the start of the exposure process. By providing the maximum standby time M in the second transfer device in the same manner as in the first transfer device, even if a trouble occurs during the exposure processing and the exposure processing of the substrate is not completed, for example, The second transport device does not wait at the second position forever, and for example, the standby of the second transport device is released, so that the trouble can be appropriately dealt with. The maximum standby time M may be set to be longer than the maximum standby time I according to claim 3 in consideration of the transport time of the substrate from the exposure apparatus to the transfer unit. If it is long enough to include the time, the maximum standby time I may be the same.

According to the fifth aspect of the present invention, the step of exposing the substrate on which the coating film is formed in the exposure apparatus, and thereafter the exposed substrate is once transported to the transfer section by the first transport apparatus, and thereafter the first substrate is transferred to the transfer section. And a step of transporting the substrate in the transfer section to a heat treatment apparatus in which a heat treatment before the development processing is performed by the transfer device of (2), wherein at least when the exposure of the substrate is completed, Wherein the first transfer device is on standby at a predetermined position where the substrate can be received, and transfers the substrate to the transfer section immediately after exposure of the substrate is completed. A method is provided.

[0015] In a fifth aspect of the present invention, in the fourth aspect, only the first transport device is made to stand by at a predetermined position. Depending on the transfer algorithm of the transfer device, there may be little variation in the transfer start timing of the second transfer device described above. In such a case, it is sufficient to make the transfer start timing of only the first transfer device uniform. Because. Therefore, the time from the end of the exposure process to the time when the substrate is carried into the heat treatment apparatus is improved so as to be constant or close to the constant between the substrates, and the variation in line width due to this is suppressed.

According to a fifth aspect of the present invention, when the predetermined time T is required for the exposure step of the substrate as in the sixth aspect, even if the predetermined time T has elapsed without completing the exposure step, The first transfer device may be configured to wait at the predetermined position until a maximum standby time I longer than a predetermined time T has elapsed from the start of the exposure process. According to the sixth aspect, even when the substrate exposure step takes longer than the normal predetermined time T as in the third aspect, the first transfer is performed until the maximum standby time I elapses. Since the apparatus stands by at the first position, the substrate on which exposure has been completed can be immediately transferred to the transfer unit. Further, by setting the maximum standby time I, the first transfer device does not wait at the predetermined position forever. For example, the standby of the first transfer device is released and another substrate is transferred. Thus, it is possible to suitably cope with the trouble of the exposure processing.

According to the seventh aspect, the step of exposing the substrate on which the coating film is formed in the exposure device, and thereafter the exposed substrate is once transported to the transfer section by the first transport device, and thereafter the second transport device is used. Transferring the substrate in the transfer unit to a heat treatment device in which a heat treatment before the development process is performed by the transfer device, wherein at least when the substrate is transferred to the transfer unit, Is characterized in that the second transfer device is standing by at a predetermined position where the substrate can be received, and transfers the substrate to the heat treatment device immediately after the substrate is transferred into the transfer unit. Is provided.

A seventh aspect is the invention according to the fourth aspect, wherein only the second transfer device is made to stand by at the predetermined position. Depending on the transfer algorithm of the transfer device, there may be little variation in the transfer start timing by the first transfer device described above. In such a case,
This is because it is sufficient that the transfer start timings of only the second transfer device are aligned. Therefore, according to the seventh aspect, the time from the end of the exposure processing to the transfer to the heat treatment apparatus is improved so as to be constant or close to constant between the substrates, and the variation in line width due to this is suppressed.

In the invention according to claim 7, when the predetermined time T is required for the exposure step of the substrate as in claim 8, even if the predetermined time T has elapsed without completing the exposure step, The second transport device may be in a standby state at the predetermined position until a maximum standby time M that is longer than a predetermined time T at the maximum from the start of the exposure process elapses. According to the seventh aspect, even when it takes longer than the predetermined time T normally required for the substrate exposure step, the second transfer device waits at the predetermined position until the maximum standby time M elapses. Therefore, the substrate transported to the transfer section can be immediately transported to the heat treatment apparatus. Also, by setting the maximum standby time M, the second
Is prevented from standing by at the predetermined position indefinitely. Therefore, in the same manner as in the above-described claim 4, for example, the standby of the second transfer device is released, so that it is suitable for troubles in the exposure processing. Can respond.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below. FIG. 1 is a perspective view of a coating and developing system 1 in which the coating and developing method of the present invention is performed.
FIG. 2 is a plan view schematically showing the coating and developing system.

As shown in FIGS. 1 and 2, the coating and developing system 1 carries a plurality of wafers W into and out of the coating and developing system 1 from the outside in cassette units, for example.
A cassette station 2 for loading and unloading wafers W into and out of the cassette C, and various processing apparatuses for performing predetermined processing on the wafers W in the coating and developing process in a single-wafer manner are arranged in parallel in two rows in the Y direction. Processing station 3
There is provided a transfer body 5 as a first transfer device which is provided adjacent to the processing station 3 and transfers the wafer W between the processing station 3 and the exposure device 4 provided outside the coating and developing processing system 1. It has a configuration in which the interface unit 6 is integrally connected.

In the cassette station 2, a plurality of cassettes C can be placed in a line in the X direction. And
A wafer transfer body 8 capable of transferring in the cassette arrangement direction (X direction) and the wafer arrangement direction (Z direction; vertical direction) of the wafers W accommodated in the cassette C is provided movably along a transfer path 9. Each cassette C can be selectively accessed.

The processing station 3 has a Y
A transfer rail 10 extending in the direction is provided, and the transfer rail 10 is provided with a main transfer device 11 as a second transfer device movable on the transfer rail 10. Various processing units are arranged along the Y direction on both sides of the transport rail 10. That is, the brush scrubber 12 for cleaning the wafer W taken out of the cassette C and the water washing for high-pressure jet cleaning of the wafer W are sequentially provided on the positive side in the X direction of the transfer rail 10 from the cassette station 2 side. A cleaning apparatus 13 and processing apparatus groups 14, 15, and 16 in which a plurality of heat treatment apparatuses for performing a predetermined heat treatment on the wafer W are arranged in multiple stages are arranged side by side. In order from the cassette station 2 side, resist coating devices 17 and 18 for applying a resist solution to the wafer W and developing devices 19 and 20 for developing the exposed wafer W are arranged side by side.

As shown in FIG. 3, for example, as shown in FIG.
1, an adhesion device 22 for improving the fixability between the resist solution and the wafer W, and prebaking devices 23 and 24 for evaporating the solvent in the resist solution are sequentially stacked from the bottom. Further, in the processing device group 15, cooling devices 26 and 27 and post baking devices 28 and 29 for performing a heating process on the wafer W after the development process are sequentially stacked from the bottom.

Further, the processing apparatus group 16 includes cooling apparatuses 30 and 31 and a post-exposure baking apparatus (hereinafter referred to as a “PEB apparatus”) as a heat processing apparatus for performing a heating process on the wafer W after the exposure process and before the development process. ) Are superimposed sequentially from the bottom.

The main transfer device 11 is movable in the rotation direction (θ direction) and the Z direction as shown in FIGS. 1 and 2 in addition to the Y direction described above. The wafer transfer unit 8 of the cassette station 2 and the extension devices 35 and 36 serving as transfer units for the interface unit 6 described below are accessed, and the wafer W can be transferred to each of them.

The main transfer device 11 is controlled by a main control device 37 having the transfer algorithm as a program. That is, the main transfer device 11 performs processing at the processing station 3 in accordance with a processing flow of a predetermined wafer W.
The wafers W being processed therein are controlled so as to be sequentially transferred to the respective processing apparatuses in which the next process is performed. In addition, at least when the wafer W that has been subjected to the exposure processing is transferred to the above-described extension device 36, the main controller 37 controls the extension device 36 as shown in FIG.
Is controlled so that the main transfer device 11 is kept on standby at a standby position P as a second position where the main transfer device 11 can access the extension device 36 on the transfer rail 10.

The main controller 37 includes the main carrier 1
1 is the maximum standby time M for keeping 1 in the standby position P
A timer function for counting the number of times is provided.
This timer function is for canceling the standby state of the main transfer device 11 when some trouble occurs in the exposure device 4 and the wafer W is not sent out from the exposure device 4. The timer function starts counting when a wafer W is loaded into the exposure apparatus 4, and stops counting when the wafer W is unloaded from the exposure apparatus 4. Therefore, the main transfer device 11 normally waits at the standby position P until the wafer W from the exposure device 4 is received by the extension device 36. However, the main transfer device 11 waits until the maximum standby time M counted by the timer function elapses. When W is not transmitted from the exposure device 4, the standby state of the main transport device 11 is released. In addition, as shown in FIG. 5, the time required for the exposure process from the time when the wafer W is loaded into the exposure apparatus 4 to the time when the wafer W is unloaded from the exposure apparatus 4 is usually referred to as an exposure processing time T as a predetermined time T. In this case, the maximum waiting time M is
Sufficiently longer than the exposure processing time T, for example, M = 2T
Set to.

As shown in FIGS. 1 and 2, on the processing station 3 side of the interface section 6 and on an extension of the transfer rail 10, the transfer of the wafer W between the main transfer device 11 and the transfer body 5 is performed. Extension device 3 for performing
5, 36 are arranged in order from the bottom. Each of the extension devices 35 and 36 is provided with a mounting table (not shown) for mounting the wafer W thereon and elevating pins (not shown) for raising and lowering the wafer W. The extension device 35 is used when the wafer W is transferred from the main transfer device 11 to the transfer body 5 side, and the extension device 36 is used when the wafer W is transferred from the transfer body 5 to the main transfer device 11 side.
Used when transported. Also, on the side of the exposure unit 4 of the interface unit 6, a loading table 3 on which the wafer W is temporarily placed when the wafer W is loaded into the exposure unit 4.
8 and an unloading mounting table 39 on which the wafer W is mounted when the wafer W is sent out from the exposure apparatus 4 are arranged side by side in the X direction.

Further, a rail 6a extending in the X direction is provided at the center of the interface section 6, and the above-mentioned carrier 5 is movably provided on the rail 6a. The carrier 5 is configured to be movable and rotatable in the X direction, the Z direction, and the θ direction (a rotation direction about the Z axis), and is provided to the extension devices 35 and 36, the loading / unloading table 38, and the unloading table 39. Access to
It is configured such that a wafer W can be transferred to each of them. Further, the carrier 5 is controlled by the main controller 37 in the same manner as the main carrier 11, and at least when the wafer W having undergone the exposure processing is placed on the carrying-out mounting table 39, as shown in FIG. Such a carrier 5 is controlled to be in a standby state at a standby position Q as a first position at which the wafer W of the carrying-out mounting table 39 can be received. The timer function of the main controller 37 is also used for the carrier 5, and the carrier 5 waits at the standby position Q until the maximum standby time I has elapsed at the maximum. If the wafer W is not sent from the exposure apparatus 4 before the time elapses, the standby state of the carrier 5 is released. In this embodiment, as shown in FIG. 5, the maximum standby time I of the carrier 5 is set to be the same as the maximum standby time M of the main transport device 11.

The exposure device 4 is provided adjacent to the interface unit 5 as shown in FIG. This exposure device 6
Is provided with a transfer port 40 through which the wafer W is transferred into and out of the exposure apparatus 4. A transfer unit (not shown) is provided in the exposure apparatus 4 so that the wafer W can be loaded from the loading / unloading table 38 and unloaded to the unloading / loading table 39. In addition, the transfer port 40
Detecting that the wafer W has been carried into and out of the exposure apparatus 4,
A sensor 41 for transmitting the signal to the main control device 37 is provided, and the count of the timer function in the main control device 37 is activated / stopped by using the signal as a trigger.

Next, a coating / developing method performed by the coating / developing system 1 configured as described above will be described along with a photolithography process.

First, at the cassette station 2,
The wafer carrier 8 removes one unprocessed wafer W from the cassette C
The wafer is taken out and the main carrier 11 directly receives the wafer W from the wafer carrier 8. Next, the main transfer device 11 transfers the wafer W to the brush scrubber 12 and the washing / cleaning device 13 sequentially, where the wafer W is subjected to a predetermined cleaning process. Thereafter, the wafer W is transferred again to the adhesion device 22 belonging to the processing device group 14 by the main transfer device 11 again.
An adhesion enhancer such as HMDS for improving the adhesion with the resist solution is applied. Thereafter, the wafer W is transferred to the cooling device 21 and the resist coating device 1 by the main transfer device 11.
7 or 18, the pre-baking device 23 or 24, and the cooling device 26 or 27 are sequentially transported and subjected to predetermined processing.

Thereafter, the wafer W cooled to a predetermined temperature by the cooling device 26 or 27 is transferred to the main transfer device 11.
Is carried into the extension device 35 and is placed on a mounting table (not shown).

Thereafter, the wafer W is transported by the transport body 5 to the loading / unloading table 38 adjacent to the exposure device 4, and the main transport device 11 transports the wafer W for a predetermined time E according to the transport program of the main control device 37. While moving on the rail 10, another wafer in each processing apparatus of the processing station 3 is transferred to each processing apparatus in which the next process is performed. Here, the predetermined time E is a time during which the main transfer device 11 can transfer another wafer, and the wafer W is sent from the exposure device 4 after the wafer W is placed on the extension device 35 as shown in FIG. This is a predetermined set time that is shorter than the time normally required until the operation is performed.

When the predetermined time E has elapsed, the main transfer device 11 moves to the standby position P where the extension device 36 can be accessed, and the wafer W transferred to the exposure device 4 is returned to the extension device 36. stand by. The predetermined time E is, for example, an exposure processing time T
Is set to the same time as that described above, so that the wafer W can be always waiting at the standby position P when the exposure processing is completed and the wafer W is mounted on the extension device 36.

On the other hand, the wafer W placed on the loading table 38 by the carrier 5 is carried into the exposure apparatus 4 from the carrier port 40 of the exposure apparatus 4 by a carrier means in the exposure apparatus 4 not shown. Hereinafter, the wafer W processing relating to the timer function is shown in the flowchart of FIG. At this time, the sensor 41 of the transfer port 40 detects the loading of the wafer W, and transmits a signal to the main controller 37. Then, the main control device 37 that has received the signal starts counting the timer function by using the signal as a trigger. In addition, the carrier 5
Moves to the standby position Q accessible to the carrying-out mounting table 39, and waits until the wafer W completes the exposure processing.

Thereafter, the wafer W is exposed to a predetermined pattern in the exposure device 4. While the exposure processing is being performed, the predetermined time E of the main transport device 11 has elapsed.
The main transfer device 11 moves to the standby position P and waits (see FIG. 4).
State). Usually, the exposure processing time T
After the lapse of time, the wafer W is sent out from the transfer port 40 of the exposure apparatus 4 and is placed on the carrying-out mounting table 39. At this time, the sensor 41 detects the unloading of the wafer W, transmits a signal to the main controller 37, and the timer function of the main controller 37 stops counting and is reset.

The wafer W mounted on the unloading mounting table 39 is
The wafer W is immediately transferred to the carrier 5 waiting at the standby position Q, and the carrier 5 transports the wafer W to the extension device 36. Then, the wafer W transferred to the extension device 36 is immediately transferred to the main transfer device 11 waiting at the standby position P, and transferred to the PEB device 32 or 33 by the main transfer device 11.

If some trouble occurs in the exposure apparatus 4 and the wafer W is not sent out from the exposure apparatus 4 even after the maximum standby time I or M has elapsed, the timer function is stopped, and the carrier 5 and The standby command of the main transport device 11 is released. Thereafter, the carrier 5 immediately stops its operation, for example, and the main carrier 11 moves to the processing station 3.
Other wafers W that have been properly subjected to the exposure processing remaining in the wafer W
Are transported along a predetermined process described later, and when the wafers W are unloaded from the processing station 3 to the cassette station 2, the operation is stopped.

The wafer W appropriately exposed and transported to the PEB device 32 or 33 is subjected to a heat treatment for accelerating the solubilization reaction of the resist film with respect to the developing solution. 30
Or it is conveyed to 31 and cooled to a predetermined temperature. Next, the wafer W is transported to the developing device 19 or 20, where the wafer W is subjected to a developing process.

The wafer W having undergone the developing process is transferred again to the main transfer device 11, transferred on the transfer rail 10 in the negative Y direction by the main transfer device 11, and transferred to the wafer transfer body 8 of the cassette station 2. Handed over. Then, the wafer is returned to the cassette C by the wafer carrier 8, and a series of photolithography steps is completed.

According to the above-described embodiment, the transfer body 5 and the main transfer device 11 are made to wait at the predetermined standby positions P and Q, respectively, for the arrival of the wafer W. Therefore, from the exposure processing to the PEB processing. The transfer of the wafer W can be performed quickly and in a fixed time. As a result, the PE
The time required until the B process becomes the same between the wafers, so that the solubilization reaction of the resist film with the developing solution is performed uniformly and the developing process is also performed uniformly. The formed line width becomes uniform between the wafers.

A timer function is provided in the main control device 37, and the maximum standby times I and M of the carrier 5 and the main carrier 11 are set.
When the wafer W is not sent out from the exposure processing for some reason, the transport of the carrier 5 is stopped for inspection of the exposure apparatus 4 and the appropriate exposure remaining in the processing station 3 is set. The other wafers W on which the process has been performed can be transferred by the main transfer device 11 and processed to the end.

In the above embodiment, both the main transfer device 11 and the transfer body 5 are set on standby. However, depending on the configuration of the coating and developing processing system 1 and the transfer algorithm of each transfer device, the wafers W may be placed between the wafers W. If there is no variation in the time required for receiving the transfer device, the transfer device having no variation may not be on standby, and the other transfer device may be on standby. That is, only the main transport device 11 may be made to stand by, or only the transport body 5 may be made to stand by. In this case as well, a timer function may be provided to prepare for a case where the exposure processing is not performed within a predetermined time.

Although the above-described embodiment relates to a method of applying and developing a wafer W in a photolithography step of a semiconductor wafer device manufacturing process, the present invention relates to a substrate other than a semiconductor wafer, such as an LCD.
The present invention can also be applied to a method of coating and developing a substrate.

[0047]

According to the first to eighth aspects of the present invention, the time from the end of the exposure processing of the substrate to the start of the heating processing before the development processing can be made constant, so that the exposure of the coating film can be performed. Is performed to a certain extent and the substrate is developed to a uniform extent, so that the line width of the pattern finally formed on the substrate becomes uniform between the substrates.

In particular, according to the second to eighth aspects, since the transfer device is made to stand by in advance and the substrate is received and transferred immediately, the time required from the end of the exposure process to the heating process before the development process is performed. It can also be shortened.

According to the third, fourth, sixth, and eighth aspects, since the maximum standby time of the transfer device is provided, it is possible to cope with the case where the exposure step is not properly performed.

[Brief description of the drawings]

FIG. 1 is a perspective view showing the appearance of a coating and developing system in which a coating and developing method according to an embodiment is performed.

FIG. 2 is a plan view schematically showing the coating and developing system of FIG.

FIG. 3 is an explanatory diagram showing an example of the arrangement of processing apparatuses in a processing apparatus group of the coating and developing processing system.

FIG. 4 is a state diagram of the coating and developing system showing a state in which a main transport device and a transport body are on standby.

FIG. 5 is an explanatory diagram showing a relationship between an exposure processing time and a maximum standby time.

FIG. 6 shows a flowchart of wafer processing relating to a timer function of the main control device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 coating / developing processing system 4 exposure apparatus 5 carrier 11 main carrier 33 PEB device 36 extension device 37 main controller P standby position Q standby position W wafer

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H096 AA25 CA12 FA01 GA21 GB00 JA03 5F031 CA02 FA01 FA07 FA12 FA15 GA47 GA48 GA49 JA01 JA14 JA21 JA51 MA02 MA03 MA13 MA24 MA26 PA03 5F046 AA28 CD05 KA00

Claims (8)

[Claims] 1. A coating and developing method comprising the steps of: exposing a substrate on which a coating film is formed; and transporting the exposed substrate to a heat treatment apparatus for performing a heating process before a developing process. The coating and developing method, wherein the transporting step is performed so that a time period after the exposure of the substrate is completed and the substrate is transported to the heat treatment apparatus is constant. 2. A step of exposing a substrate on which a coating film has been formed by an exposure apparatus, and thereafter, a first transport apparatus.
The exposed substrate is once transported to the transfer section, and then the second
Transporting the substrate in the transfer section to a heat treatment device in which a heat treatment before the development treatment is performed by the transfer device, wherein at least when the exposure of the substrate is completed, The first transfer device is waiting at a first position where the substrate can be received, and transfers the substrate to the transfer unit immediately after the exposure of the substrate is completed. When the substrate is transferred, the second transfer device is waiting at a second position where the substrate can be received, and immediately after the substrate is transferred into the transfer unit, the substrate is transferred to the heat treatment device. A coating and developing method. 3. When a predetermined time T is required for the substrate exposure step, even if the predetermined time T has elapsed without terminating the exposure step, the first transfer device may start the exposure step. 3. The coating and developing method according to claim 2, wherein the apparatus waits at the first position until a maximum standby time I which is longer than a predetermined time T has elapsed. 4. When the predetermined time T is required for the substrate exposure step, the second transfer device can start the exposure step even if the predetermined time T has elapsed without completing the exposure step. The coating according to any one of claims 2 and 3, wherein the application is in a standby state at the second position until a maximum standby time (M) longer than a predetermined time (T) elapses. Development processing method. 5. A step of exposing a substrate on which a coating film is formed in an exposure apparatus, and thereafter, a step of exposing the substrate by a first transfer device.
The exposed substrate is once transported to the transfer section, and then the second
Transporting the substrate in the transfer section to a heat treatment device in which a heat treatment before the development treatment is performed by the transfer device, wherein at least when the exposure of the substrate is completed, Wherein the first transfer device is waiting at a predetermined position where the substrate can be received, and transfers the substrate to the transfer section immediately after exposure of the substrate is completed. Method. 6. When the predetermined time T is required for the substrate exposure step, even if the predetermined time T has elapsed without the end of the exposure step, the first transfer device may start the exposure step. 6. The coating and developing method according to claim 5, wherein the apparatus waits at the predetermined position until a maximum standby time I longer than a predetermined time T elapses from the start. 7. A step of exposing a substrate on which a coating film is formed in an exposure apparatus, and thereafter, by a first transport apparatus,
The exposed substrate is once transported to the transfer section, and then the second
Transferring the substrate in the transfer section to a heat treatment apparatus in which a heat treatment before the development processing is performed by the transfer device, wherein at least the substrate is transferred to the transfer section. The second transfer device is waiting at a predetermined position capable of receiving the substrate, and transferring the substrate to the heat treatment device immediately after the substrate is transferred into the transfer unit. Characterized by a coating and developing method. 8. When the predetermined time T is required for the substrate exposure step, the second transfer device may start the exposure step even if the predetermined time T has elapsed without terminating the exposure step. 8. The coating and developing method according to claim 7, wherein the apparatus waits at the predetermined position until a maximum standby time M that is longer than a predetermined time T at a maximum has elapsed.