JP2001053125A - Processing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing system, which makes valid use of a standby time of a processing body and is superior in processing efficiency than those of prior art. SOLUTION: A standby part 80 of a glass substrate is provided across a conveyance path 10, with respect to respective processors 40 to 70 which perform a prescribed processing, with respect to a glass substrate as a processing body, and also an inspection part 85 is provided adjacent to this standby part 80. The glass substrate standing by in the standby part 80 is conveyed to the processors 40 to 70 by a major conveyor 11 or is conveyed to the inspection part 85 by a sub-conveyor. Accordingly, a prescribed inspection can be completed during the standby of the processing body, and the processing time of the entire system is shortened including the inspection time, and processing efficiency can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing system for performing processing using a photolithography technique on a glass substrate which is an object to be used, for example, for a liquid crystal display (LCD).

[0002]

2. Description of the Related Art In a process of forming a TFT array on a glass substrate, a cleaning process before forming a thin film, a thin film forming process, a resist coating process, an exposing process, a developing process, an etching process, and a resist removing process are performed on a single glass substrate. Is repeated by the number of layers constituting the array, for example, about six times.

Conventionally, for example, the above-mentioned cleaning step is a cleaning apparatus, the resist stripping step is an ashing apparatus, the thin film forming step is a film forming apparatus, the etching step is an etching apparatus, the resist coating and developing steps are a coating and developing apparatus, and the exposure step. Is performed by an exposure apparatus, and the transfer of the glass substrate between these apparatuses has been performed by an AGV (self-propelled transport vehicle) or the like. Recently, however, a system in which all of these apparatuses are integrated, for example, a glass A processing system having a configuration in which a cleaning device, an ashing device, a film forming device, an etching device, a coating / developing device, an exposure device, an inspection device, and the like are arranged adjacent to a transport path on which a transport device that transports a substrate travels is proposed. ing.

[0004]

However, when various processing devices are integrated as described above, it is expected that processing devices having different specifications are mixed in the system. Therefore, there is a possibility that the glass substrate in the processing waiting state may stay in the system due to the difference in the tact time.

Therefore, it is conceivable, for example, to provide a standby unit in the system so that the glass substrate in a standby state is made to wait in the standby unit. Does nothing. Therefore, it is necessary to eliminate waste of the waiting time as much as possible.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a processing system that makes effective use of standby time and has higher processing efficiency than the conventional one.

[0007]

In order to solve the above-mentioned problems, a processing system according to the present invention is arranged such that a processing path is disposed adjacent to the transport path and performs a predetermined processing on an object to be processed. Unit, a standby unit disposed adjacent to the transport path, for holding the workpiece, a workpiece inspection unit provided adjacent to the standby unit, and traveling along the transport path. A main transport mechanism that is provided so as to be able to transfer the object to be processed at least between the processing unit and the standby unit, and a sub-transport mechanism that transfers the object to be processed between the standby unit and the inspection unit. It is characterized by having.

According to the present invention, the object to be processed, which has been subjected to the predetermined processing, is transported by the main transport mechanism to a standby section disposed at an appropriate position adjacent to the transport path before being transported to the processing section in the next step. . The sub-transport mechanism operates while the object is waiting, and conveys the object to the inspection unit. In the inspection unit, the object to be processed is subjected to a predetermined inspection, for example, a non-uniform resist coating based on an image of the object to be processed captured by a CCD camera,
Inspection of pattern accuracy or dust adhesion, static electricity inspection, etc. are performed. Then, as a result of the inspection, for example, an object to be processed that has reached the standard is made to wait again in the standby unit by the sub-transport mechanism, and an object that has not reached the standard is transported to a carrier dedicated to rejected products. Next, for example, in accordance with an instruction from the control unit, the inspected workpiece that has been on standby is transported to the processing unit in the next process by the main transport mechanism at a predetermined timing. Further, the subsequent processing procedure (processing time in each processing unit, etc.) is changed according to the inspection result. Therefore, according to the present invention, the predetermined inspection can be completed while the object to be processed is on standby, and the processing time of the entire system including the inspection time can be reduced, and the processing efficiency can be improved.

A processing system according to the present invention includes a transport path, a processing unit disposed adjacent to the transport path and performing a predetermined process on an object to be processed, a processing unit disposed adjacent to the transport path, A standby unit for holding the processing object on standby, a cleaning unit for the object to be processed provided adjacent to the standby unit, and provided so as to be able to travel along the transport path, and at least the processing unit and the standby unit A main transport mechanism for transferring the object to be processed between
The image processing apparatus further includes a sub-transport mechanism that transfers the object to be processed between the standby unit and the cleaning unit.

According to the present invention, the object to be processed, which has been subjected to the predetermined processing, is transported by the main transport mechanism to a standby section disposed at an appropriate position adjacent to the transport path before being transported to the processing section in the next step. . The sub-transport mechanism operates while the object is waiting, and conveys the object to the cleaning unit. In the cleaning unit, the object to be processed is cleaned, and then the standby unit is again put on standby by the sub-transport mechanism. Next, for example, in accordance with an instruction from the control unit, the inspected workpiece that has been on standby is transported to the processing unit in the next process by the main transport mechanism at a predetermined timing. Therefore, according to the present invention, the cleaning process, which is one of the processing steps, can be completed while the object to be processed is on standby, so that the processing time of the entire system can be reduced and the processing efficiency can be improved.

A processing system according to the present invention includes a transport path, a processing unit disposed adjacent to the transport path and performing a predetermined process on an object to be processed, a processing unit disposed adjacent to the transport path, A standby unit for holding a processing object, an inspection unit of the processing object provided adjacent to the standby unit, a cleaning unit of the processing object provided adjacent to the standby unit, and the transport path A main transport mechanism that is provided so as to be able to travel along, and that transfers the object to be processed between at least the processing unit and the standby unit;
The image forming apparatus further includes a sub-transport mechanism for transferring the object to be processed between the standby unit and the inspection unit and between the standby unit and the cleaning unit.

According to the present invention, before the object to be processed, which has been subjected to the predetermined processing, is conveyed to the processing section in the next step, the object is conveyed by the main conveyance mechanism to a standby section arranged at an appropriate position adjacent to the conveyance path. . The sub-transport mechanism operates while the object is waiting, and conveys the object to the inspection unit or conveys the object to the cleaning unit. When the object is transported to the inspection unit, a predetermined inspection is performed on the object, and when the object is transported to the cleaning unit, a cleaning process is performed. After inspection or cleaning,
The sub-transport mechanism waits in the standby section. Next, for example, according to an instruction from the control unit, at a predetermined timing, the object to be processed, which has been on standby, is transported by the sub-transport mechanism to an uninspected object to the inspection unit and an uncleaned object to the cleaning unit. Alternatively, the wafer is conveyed to the processing section in the next step by the main conveyance mechanism. Therefore, according to the present invention, the predetermined inspection can be completed while the object to be processed is on standby, and the cleaning process can be completed. Therefore, the processing time of the entire system can be shortened and the processing efficiency can be improved. it can.

The processing system according to the present invention is characterized in that the standby unit includes a multistage holding unit that can individually hold a plurality of objects to be processed. According to this configuration, since the plurality of objects to be processed can be individually held by the holding unit of the standby unit, it is suitable for individually conveying the objects to be processed by the main transport mechanism or the sub-transport mechanism.

[0014] The processing system of the present invention is characterized by further comprising means for forming a downflow of clean air in the standby section. According to such a configuration, it is possible to prevent dust (particles) from floating in the standby section, and prevent adhesion to the processing target.

The processing system according to the present invention is further characterized by further comprising a temperature adjusting means for maintaining the inside of the standby section at a predetermined temperature. According to this configuration, since the temperature adjustment unit is provided in the standby unit, the object to be processed can be maintained in a good state.

The processing system according to the present invention is characterized in that the main transport mechanism exchanges an object to be processed with the inspection section or the cleaning section. According to such a configuration,
It is not necessary to wait, but the object to be inspected and cleaned can be directly transferred to and from the inspection unit or the cleaning unit, and the transport efficiency can be improved.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows T according to an embodiment of the present invention.
FIG. 2 is a plan view of a processing system for forming an FT array.

As shown in FIG. 1, a transfer path 10 is provided substantially at the center of the processing system 1 in a straight line.
At one end of the transport path 10, a loading / unloading section 20 for loading and unloading the glass substrate G as the object to be processed into and out of the system is provided. An interface unit 30 for transferring the glass substrate G to the glass substrate G is provided. Further, on one side of the transport path 10, in order from one end of the transport path 10, a peeling / cleaning processing apparatus 40, a film forming processing apparatus 50, an etching processing apparatus 60, and a coating / developing processing apparatus 70
Are arranged.

The transfer path 10 is connected in series with, for example, four main transfer devices 11 as a main transfer mechanism for transferring the glass substrate G via a relay section 12 for temporarily holding the glass substrate G. . The relay section 12 between the transport paths 10 has, for example, a transfer section (not shown) of about two upper and lower stages, at least one of which is formed of, for example, a temperature control plate (cooling plate) for cooling the glass substrate G. Have been.

FIG. 2 is a perspective view showing an example of the main transport path device 11 described above. As shown in FIG.
The main body 13 is movable along the transport path 10, the base member 14 is vertically movable and pivotable with respect to the apparatus main body 13, and is independently movable along the horizontal direction on the base member 14. Two upper and lower substrate supporting members 15a, 15
5b. The central portion of the base member 14 and the apparatus main body 13 are connected by a connecting portion 16.
The connecting portion 1 is driven by a motor (not shown) built in the main body 13.
6 by moving the base member 1 up and down or rotating.
4 is moved up and down or turned. The vertical and pivotal movements of the base member 14 and the substrate support member 15
The glass substrate G is conveyed by the horizontal movement of a and 15b. Reference numerals 17a and 17b are guide rails for guiding the substrate support members 15a and 15b, respectively.

The carry-in / out section 20 is provided with a sub-transport path 21 substantially orthogonal to the transport path 10. On the opposite side of the transport path 10 across the sub-transport path 21, a glass substrate G
A cassette mounting table 23 is provided on which, for example, four cassettes C each containing 25 sheets are arranged and mounted in predetermined positions. Further, on the sub-transport path 21, each cassette C
Transfer device 2 that takes out the glass substrate G to be processed from the transfer path and transfers it to the transfer path 10, and returns the glass substrate G transferred from the transfer path 10 to each cassette C after the processing is completed
2 are movably arranged. The transfer device 22 has substantially the same configuration as the main transfer device 11 shown in FIG. 2, for example.

The peeling / cleaning processing apparatus 40 disposed on one side of the transport path 10 includes, for example, a plurality of scrubber units 41 as a processing section for brush cleaning the glass substrate G with water, and a glass substrate in a vacuum state. A plurality of ashing units 42 as processing units for performing ashing processing on G
Etc.

FIG. 3 is a horizontal sectional view showing an example of the ashing unit 42. As shown in FIG. 3, the ashing unit 42 includes a load lock chamber 43 provided on the side of the transfer path 10, a transfer chamber 44 provided behind the load lock chamber 43, and a transfer chamber 4.
4 and an ashing processing chamber 45 provided on both side surfaces. A gate valve V is provided between the load lock chamber 43 and the transfer chamber 44, and between the transfer chamber 44 and each of the processing chambers 45. Have been. A gate valve V is also provided at an opening communicating the load lock chamber 45 with the outside air atmosphere.

The ashing processing chamber 45 is provided with a stage 45a for mounting the glass substrate G therein, and the inside thereof can be evacuated. An ashing gas, for example, ozone can be introduced into the ashing processing chamber 45, and the resist after the etching process is removed by the ashing gas.

The transfer chamber 44 is also configured to be evacuated, and a substrate transfer member 46 is provided therein. The board transfer member 46 is an articulated arm type, and has a base 46a.
, An intermediate arm 46b, and a substrate support arm 46c provided at the distal end, and these connection portions are rotatable. The substrate transfer member 46 holds the glass substrate G between the load lock chamber 43 and the ashing processing chamber 45.
Is passed. On the opposite side of the base arm 46b of the base 46a of the substrate transport member 46, a buffer frame 46d configured to hold the glass substrate G is provided, and by temporarily holding the glass substrate G,
Improving throughput.

The load lock chamber 43 is also configured to be evacuated, and a rack 47 for placing the glass substrate G therein and a positioner 48 for aligning and aligning the glass substrate G.
Is provided. The positioner 48 moves along the direction of arrow A, thereby pressing two opposing corners of the glass substrate G with two rollers 49, respectively.
The glass substrate G is aligned on the rack 47. An optical sensor (not shown) is used to confirm the end of the alignment. When the glass substrate G is transferred to and from the transfer path 10, the load lock chamber 43 is set in the atmosphere, and the glass substrate G is transferred to the processing chamber 4.
When transporting to the 5 side, a vacuum atmosphere is set in the inside.

The processing apparatus 50 of the film forming system has a plurality of film forming units 51 as processing units arranged along one side of the transport path 10, for example. The film forming unit 51 is, for example, a film forming chamber for forming a predetermined film on a glass substrate G mounted on a stage in a vacuum atmosphere by CVD instead of the ashing processing chamber 45 in the ashing unit shown in FIG. Is provided.

The processing device 60 of the etching system is
For example, a plurality of etching units 61 as processing units are arranged and configured along one side of the zero. The etching unit 61 is, for example, a glass substrate G mounted on a stage in a vacuum atmosphere instead of the ashing processing chamber 45 in the ashing unit shown in FIG.
An etching chamber for performing an etching process is provided thereon. For example, a predetermined etching gas is introduced into the etching processing chamber, and a high-frequency electric field can be applied. Plasma is formed by these gases, and the predetermined film on the glass substrate G is developed by the plasma to form a development pattern. Etching corresponding to.

The processing device 70 of the coating / developing system
Along one side, for example, a cleaning unit 71, an edge remover 72 for removing the resist on the peripheral edge of the glass substrate G, a resist coating unit 73, a developing unit 7
4 are arranged and configured. Further, a heat treatment / cooling unit 75 in which a heat treatment unit and a cooling treatment unit are vertically stacked, a heat treatment unit 76 in which two heat treatment units are vertically laminated, and an adhesion treatment unit and a cooling unit which are vertically laminated. Adhesion processing
A cooling unit 77 is provided.

The interface unit 30 includes a glass substrate G
Is provided in a direction substantially perpendicular to the main transport path. The sub-transport path 31 is connected to the transport path 10 via the relay section 12 that temporarily holds the glass substrate G. On both sides of the relay section 12, buffer stages 32 on which buffer cassettes are arranged are provided. In addition, on the sub-transport path 31, a transport device 33 for loading and unloading the glass substrate G with the exposure apparatus 2 arranged adjacently is provided. The transport device 33 has substantially the same configuration as the main transport device 11 shown in FIG.

Further, for example, a processing apparatus 70 of a coating / developing system
On the opposite side of the transport path 10, a standby unit 80, a transport unit 82, and an inspection unit 85 are disposed adjacent to each other along the transport path 10.

FIG. 4 shows such a standby section 80 and a transport section 82.
5 is an enlarged plan view of the inspection unit 85, and FIG.

The standby units 80 are configured in multiple stages, and each standby unit 8
At 0, for example, four support pins 80a for holding the glass substrate G are provided upright. Thereby, each standby unit 80
In this configuration, the glass substrate G can be transferred to and from the main transfer device 11, and the glass substrate G can be transferred to and from the transfer unit 82.

An FFU (fan fan) for forming a downflow of clean air is provided above the standby section 80.
A filter unit 80b is provided. Thereby, it is possible to prevent dust (particles) from floating in the standby unit 80. In addition, a hot plate 80c as a temperature control unit is disposed in the standby unit 80.

The hot plate 80c is for controlling the temperature of, for example, the glass substrate G on standby to a processing temperature for processing in the next step. Thus, a unit for controlling the temperature of the glass substrate G can be eliminated, and a transport time for transporting the glass substrate G to such a unit can be eliminated.

A sub-transport device 83 is disposed in the transport section 82. The sub-transport device 83 has substantially the same structure as the main transport device 11 shown in FIG.

The inspection section 85 is provided with an inspection stage 86 capable of transferring the glass substrate G between the main transport device 11 and the sub-transport device 83. This inspection stage 86
Has, for example, a base portion 86a and lift pins 86b provided to be able to move up and down with respect to the base portion 86a, and when transferring the glass substrate G to and from the sub-transport device 83 and the like. The glass substrate G is raised and lowered as necessary for inspection, and holds the glass substrate G horizontally.

Around the inspection stage 86 in the inspection section 85, measuring instruments 87 required for various inspections, for example, an electrostatic sensor, a CCD camera, and the like are arranged. Outputs from these sensors and cameras are sent to inspection devices 88 and 89 provided outside the processing system system of the present embodiment, and are subjected to data processing. For example, in one inspection device 88, the sensing data processing unit 88a processes the output data from the sensor, and transmits the inspection result to the main controller that controls the entire processing system via the inspection processing controller 88b. When the inspection result is received by the main controller, a processing procedure determined in advance according to the inspection result (the speed at which the glass substrate G is unloaded from the loader, the operation of the main transfer device or the sub transfer device, or the The subsequent processing is controlled according to the processing time. Alternatively, the operator manually changes the processing program according to the inspection result, and performs subsequent processing.

The other inspection device 89 includes an image processing unit 89a
After the output from the CCD camera as the measuring instrument 87 is sent to the image processing unit 89a and processed,
The inspection result is transmitted to the main controller via the inspection processing controller 89b as described above. In addition, for example, for inspections based on images with a CCD camera, such as a resist unevenness inspection, a pattern accuracy inspection, a dust inspection, etc., a dedicated inspection processing controller may be used. As shown in FIG. 6, the image processing unit 89a can be shared, and by adopting such a configuration, the entire apparatus can be simplified.

The inspection results by the inspection devices 88 and 89 are fed back to the main controller as described above. More specifically, the inspection results are, for example, as shown in FIG. The processing change contents are stored corresponding to each of them, and the corresponding result numbers 1 to
n is transmitted to the main controller through the inspection processing controllers 88b and 89b. As shown in FIG. 8, the main controller instructs a processing unit corresponding to the sent inspection result, for example, a controller of the etching unit, to change the processing corresponding to the result number.
As a result, the subsequent processing is performed according to the changed processing procedure.

In FIG. 8, a command “PASS” is recorded in a column corresponding to one of the inspection devices 88 having the processing unit name “CVD”. This means that when the substrate G does not reach the reference (NG), the CVD process is not performed. In addition, what is described as "another carrier" in the column of "unloader" is an instruction to store the glass substrate G that does not reach the standard in a special carrier. The instruction “OP” recorded in the column corresponding to the other inspection device 89 with the processing unit name “CVD” means that the operator can select whether or not to perform CVD processing when the other inspection device 89 is NG.

The above instruction program is merely an example, and the present invention is not limited to these examples.

According to the present embodiment, the glass substrate G transferred from the cassette C of the loading / unloading section 20 to the transfer device 22.
Is transferred to the main transport device 11 of the transport path 10. The main transfer device 11 carries the glass substrate G into the scrubber unit 41 of the processing device 40 of the peeling / cleaning system. And
Cleaning before thin film formation is performed by the scrubber unit 41.

The cleaned glass substrate G is transferred via the relay section 12 to the film forming unit 51 of the transfer device 50 of the film forming system.
Carry in. Then, a thin film is formed by the film forming unit 51.

The glass substrate G on which the above-mentioned thin film has been formed is
The scrubber is cleaned by the cleaning unit 71 of the transfer device 70 of the coating / developing system via the relay unit 12, heated and dried by the heat processing unit of the heating / cooling processing unit 75, and then cooled by the cooling unit. Then, the glass substrate G
Is subjected to hydrophobic treatment (HMDS treatment) in an adhesion treatment unit in the upper stage of the adhesion treatment / cooling unit 77 in order to enhance the fixability of the resist, and after cooling in the cooling unit, the resist is applied in the resist coating unit 73; Excess resist on the periphery of the glass substrate G is removed by the edge remover 72. Then, the glass substrate G
Is prebaked in one of the heat treatment units 76, and is cooled by a cooling unit at the lower stage of any of the units.

The glass substrate G coated with the resist
Is transported by the main transport device 11 to the exposure device 2 via the interface unit 30, where a predetermined pattern is exposed. Then, the glass substrate G is returned to the interface unit 3 again.
0 to the main transfer device 11.

The exposed glass substrate G is transferred from the main transfer unit 11 via the relay unit 12 to the coating / developing processing unit 70.
The development processing is performed by one of the development processing units 74 to form a predetermined circuit pattern. After the developed glass substrate G is subjected to post-baking in one of the heat treatment units, it is cooled in the cooling unit.

The glass substrate G on which the development processing has been performed is
It is delivered to the main transport unit 11 via the relay unit 12. The main transfer device 11 carries the glass substrate G into the etching unit 61 of the etching processing device 60 via the relay unit 12. Then, an etching process is performed by the etching unit 61.

The glass substrate G that has been subjected to the etching process is transferred to the main transfer device 11 again. Main transfer device 1
1 is to peel off the glass substrate G via the relay section 12.
It is carried into the ashing unit 42 of the processing apparatus 40 of the cleaning system. Then, a peeling process is performed by the ashing unit 42.

The above processing is repeated by the number of layers constituting the TFT array. Thereafter, the glass substrate G is transferred from the main transfer device 11 to the loading / unloading section 20, and the cassette C
It is carried into.

The normal processing is performed as described above. In the inspection of the glass substrate G, conventionally, after the processing in each step is completed, the glass substrate G is transported to an inspection apparatus provided on another line. I was going. However, according to the present embodiment, when performing each of the above-described processes on the glass substrate G, the inspection unit is disposed adjacent to the standby unit 80 that is necessary to facilitate the progress of the processing of the glass substrate G that is sequentially sent out. 85 are provided. Therefore, in the present embodiment, for example, before the glass substrate G that has been subjected to the etching process in the etching unit 61 is transported to the ashing unit 42 of the processing device 40 of the peeling / cleaning system, the main transport device 11 is moved to the standby unit 80. And transport it once.

The transferred glass substrate G is transferred to the sub-transfer device 8.
3, and is conveyed onto the lift pins 86b of the inspection stage 86 of the inspection section 85. The lift pins 86b are lowered as necessary while holding the glass substrate G horizontally. Thereafter, the glass substrate G is inspected through various sensors as the measuring device 87 and the CCD camera, and the inspection device 8 is inspected.
The test results are transmitted to the main controller as described above by 8 and 89. In the main controller,
In accordance with the inspection result, for example, a command is transmitted to a controller attached to the etching unit 61 so as to extend the application time of the high-frequency electric field for forming plasma by several seconds. Thereby, in the etching unit 61,
The processing content for the glass substrate G conveyed thereafter is changed based on the above command.

When the inspection is completed, the inspected glass substrate G is taken out of the inspection section 85 by the sub-transport device 83 and stored in the standby section 80 again. The inspection unit 8
The main transport device 11 may directly receive the glass substrate G of No. 5.

The inspected glass substrate G stored in the standby section 80 is transferred to the main transfer device 11 and carried into the ashing unit 42 of the peeling / cleaning processing apparatus 40 as described above. A peeling process is performed by 42.

In other processing units, for example, the processing apparatus 40 of the peeling / cleaning system, the transport apparatus 50 of the film forming system, or the transport apparatus 70 of the coating / developing system, while the glass substrate G is on standby. It is of course possible to carry the glass substrate G into the standby unit 80 and perform a predetermined inspection in the inspection unit 85.

Here, in each of the standby units 80 arranged in multiple stages, the glass substrates G subjected to various treatments are carried in for standby, and further, the glass substrates G having been inspected and An uninspected glass substrate G is also accommodated. Therefore, as shown in FIG. 9, these standby units 80 are divided into several groups. For example, in the standby units 80 belonging to the first group, the glass substrates G which have been subjected to the etching process and are not inspected are placed in the second group. The standby unit 80 to which it belongs
In the waiting group 80 belonging to the third group, the untested glass substrate G subjected to the ashing process is placed in the standby unit 80 belonging to the third group, and the inspected glass substrate G is placed in the waiting unit 80 belonging to the fourth group. It can be used to accommodate G. Further, the number of the standby units 80 belonging to each group may not be allocated in advance, but may be appropriately used as needed. Further, the glass substrate G at an arbitrary processing stage can be accommodated in the empty standby unit 80 without grouping.

In any case, the access to the standby section 80 is made by the main transport apparatus 11 or the sub-transport apparatus 83, and which of these is to be accessed and which standby section 80 is to be accessed. Whether to accommodate the glass substrate G is determined based on an instruction from a control unit attached to the standby unit 80.

FIG. 10 is a diagram for explaining another embodiment of the present invention. In this embodiment, a cleaning section 97 is further provided adjacent to the transport section 82. Then, the glass substrate G accommodated in the standby unit 80 is transported to the cleaning unit 97 by the sub-transport device 83 as necessary, and the glass substrate G
Is subjected to a washing treatment. The cleaned glass substrate G is returned to the standby unit 80 by the sub-transport device 83.

Further, the glass substrate G accommodated in the standby section 80 is transported to the inspection section 85 before or after the cleaning processing, similarly to the above-described embodiment, and subjected to various inspections. Whether the glass substrate G accommodated in the standby unit 80 is transported to the inspection unit 85 by the sub-transport device 83, transported to the cleaning unit 97, or further transported to the next process by the main transport device 11. The control is performed by the control means attached to the standby unit 80 as described above.

According to the present embodiment, in addition to the inspection, the cleaning process can be performed while the glass substrate G is on standby in the standby unit 80. Therefore, the standby time can be effectively used, and the processing on the glass substrate G can be performed more efficiently.

In each of the above-described embodiments, the inspection unit 85 is attached to the standby unit 80, but the inspection unit 85 may be omitted and only the cleaning unit 97 may be provided. Even in this case, it is possible to improve the processing efficiency of the glass substrate G as compared with a standby unit having no processing unit.

The present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the technical concept.

For example, in the above-described embodiment, a processing system for a TFT array glass substrate has been described as an example. However, the present invention is naturally applicable to a system for processing other substrates such as a color filter and a semiconductor wafer.

[0064]

As described above, according to the present invention,
Predetermined inspection can be completed while the workpiece is waiting,
The processing time of the entire system including the inspection time can be reduced, and the processing efficiency can be improved. Further, according to the present invention, the cleaning process, which is one of the processing steps, can be completed while the object to be processed is on standby, so that the processing time of the entire system can be reduced and the processing efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a plan view of a processing system for forming a TFT array according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an example of a main transport device shown in FIG.

FIG. 3 is a horizontal sectional view showing an example of the ashing unit shown in FIG.

FIG. 4 is an enlarged plan view illustrating an appearance of an example of a standby unit, a transport unit, and an inspection unit illustrated in FIG.

FIG. 5 is a side view of a standby unit, a transport unit, and an inspection unit shown in FIG.

FIG. 6 is a diagram for explaining a configuration of an inspection apparatus when an image processing unit is shared.

FIG. 7 is a diagram illustrating an example of an output of an inspection result.

FIG. 8 is a diagram for explaining the contents of a command in a main controller according to an inspection result.

FIG. 9 is a diagram for explaining an application configuration of a standby unit.

FIG. 10 is a horizontal cross-sectional view illustrating a relationship among a standby unit, a transport unit, an inspection unit, and a cleaning unit for describing an embodiment in which a cleaning unit is provided.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Conveying path 11 Main conveying apparatus 40 Peeling / cleaning processing apparatus 50 Film forming processing apparatus 60 Etching processing apparatus 70 Coating / developing processing apparatus 80 Standby section 82 Transport section 83 Sub-transport apparatus 85 Inspection section 97 Cleaning section G Glass substrate

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Yoshiharu Ota Otsu-cho, Kikuchi-gun, Kumamoto Prefecture, 272, Takao-no-ji, 272, Tokyo Electron Kyushu Co., Ltd. Otsu Office (72) Inventor Tokuyuki Anai Otsu-cho, Kikuchi-gun, Kumamoto Prefecture Tokyo Electron Kyushu Co., Ltd., Otsu Office, Heisei 272, Tokyo Electron Kyushu Co., Ltd. (72) Inventor Haruo Iwazu Otsu-cho, Kikuchi-gun, Kumamoto Prefecture, Japan CA05 FA02 FA11 FA12 FA15 GA47 GA48 GA49 GA50 MA06 MA09 MA23 MA28 MA33 PA03 PA04

Claims (7)

[Claims] 1. A transport path, a processing unit disposed adjacent to the transport path and performing a predetermined process on an object to be processed, and a processing unit disposed adjacent to the transport path and waiting the object to be processed A standby unit to be stored, an inspection unit for an object to be processed provided adjacent to the standby unit, and a processing unit provided so as to be able to travel along the transport path and to be processed at least between the processing unit and the standby unit. A processing system, comprising: a main transport mechanism for delivering a body; and a sub-transport mechanism for delivering a workpiece between the standby unit and the inspection unit. 2. A transport path, a processing unit disposed adjacent to the transport path and performing a predetermined process on an object to be processed, and a processing unit disposed adjacent to the transport path and waiting the object to be processed. A standby unit to be disposed, a cleaning unit for the object to be processed provided adjacent to the standby unit, and a processing unit provided to be able to run along the transport path, and to be processed at least between the processing unit and the standby unit. A processing system, comprising: a main transport mechanism for delivering a body; and a sub-transport mechanism for delivering a workpiece between the standby unit and the cleaning unit. 3. A transport path, a processing unit disposed adjacent to the transport path and performing a predetermined process on an object to be processed, and a processing unit disposed adjacent to the transport path and waiting the object to be processed. A standby unit to be stored; an inspection unit for an object to be processed provided adjacent to the standby unit; a cleaning unit for the object to be processed provided adjacent to the standby unit; And a main transport mechanism that transfers the object to be processed at least between the processing unit and the standby unit, between the standby unit and the inspection unit, and between the standby unit and the cleaning unit. A processing system, comprising: a sub-transport mechanism for transferring a workpiece. 4. The processing system according to claim 1, wherein the standby unit includes a multi-stage holding unit that can individually hold a plurality of objects to be processed. Processing system. 5. The processing system according to claim 1, further comprising: means for forming a downflow of clean air in said standby section. . 6. The processing system according to claim 1, further comprising a temperature control unit for maintaining the inside of the standby unit at a predetermined temperature. . 7. The processing system according to claim 1, wherein the main transport mechanism exchanges the object with the inspection unit or the cleaning unit. Characteristic processing system.