JP2000261198A - Apparatus for mounting surface mount component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To optimize rotation of a rotary index nozzle for positioning the nozzle. SOLUTION: Rotary index nozzle control means 114 moves a nozzle having a specified index number to a specified index position, then compares the index number of the nozzle currently located at the index position with that of a nozzle to be next located at the index position, further compares the difference between the current index number and the next index number with the intermediate value of the total number of nozzles, computes the rotation quantity, controls the rotating direction of the nozzle 110 through rotating means 1 (112) and, to hold the nozzle angle, controls the rotating direction of rotating means 2 (112) according to the rotating direction and the rotation deviation at indexing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount component mounting apparatus, and more particularly to a surface mount component mounting apparatus for mounting components using a rotary index type nozzle.

[0002]

2. Description of the Related Art Conventionally, a process of mounting a component at a predetermined position on a circuit board by a surface mounting component mounting apparatus has been performed. Such a surface mount component mounting apparatus will be described. FIG. 5 is a configuration diagram of the surface mount component mounting apparatus.

[0003] A surface mount component mounting apparatus 100 is a rotary index type nozzle 11 in which a nozzle to be mounted on a circuit board and mounted at a predetermined position is arranged on a circumference.
0, an XY robot 120 for moving the rotary index type nozzle 110 to a predetermined position, a circuit board installation unit 130 for installing a circuit board on which components are mounted, a CCD camera 160a for performing image processing, and control for controlling these. Unit (not shown). The rotary index type nozzle 110 includes a plurality of nozzles managed by sequentially assigned index numbers.
It is suspended by the robot 120. The circuit board installation unit 130 includes a component supply unit 131 that supplies components and a conveyor 13 that positions the circuit board 140 at a predetermined position.
And 2. In the component supply section 131, at least the required number of required component types are prepared and set at predetermined positions.

[0004] The surface mounting component mounting apparatus 1 having such a configuration.
The operation of 00 will be described. The components are filled in a section provided on a belt-like tape formed of paper or the like, and supplied in a state of being wound up on a reel. Parts feeder 1
50 mounts the reels and supplies the reels one by one to the surface mounting component mounting apparatus 100. The parts feeder 150
Usually, it is a device for supplying one type of component, and is installed in a necessary number in the component supply unit 131 of the circuit board installation unit 130. The circuit board 140 is positioned at a predetermined position in the apparatus by the conveyor 132. An XY robot 120 is disposed between the component supply unit 131 and the conveyor 132, and the rotary index type nozzle 110 suspended by the XY robot 120
The required number of components are sucked from zero. Thereafter, the XY robot 120 moves to a position where the component is mounted, and after the nozzle positioning is completed, mounts the component on the circuit board 140. Also,
Image processing for component recognition is performed by the CCD camera 160a, and the correction amount of the nozzle angle is calculated.

[0005] The positioning of the nozzle will be described. FIG.
FIG. 3 is a view of the XY robot and the rotary index type nozzle of the surface mount component mounting apparatus as viewed from below. FIG.
The same components as those described above are denoted by the same reference numerals, and description thereof is omitted.

[0006] Rotary index type nozzle 110
Is suspended by the XY robot 120 and moves along the ball screw 122. Motor 1 moves in Y direction
The movement in the X direction is performed by the motor 121b by the motor 21b. Rotary index nozzle 110
Is moved by the XY robot 120 to a position where components are sucked and mounted.

In the rotary index type nozzle 110, nozzles to which index numbers are assigned are evenly arranged on the circumference. For example, when the nozzle is moved to a position where component suction is performed, the rotary index type nozzle 110 is rotated by a motor and moved.
The rotation for arranging the nozzles of a predetermined index number at predetermined positions is called an index. Conventionally, the index position has been treated as an absolute position of a motor encoder, which is an operation amount of a motor. For this reason, the direction of rotation for disposing the nozzle at a predetermined position is determined in one direction. For example, if there are nozzles numbered sequentially from 1 to 12, when the nozzles are indexed from 1 to 12, they can only be rotated in the directions 1, 2, ..., 12.

After the rotation to the index position, a process of rotating the nozzle itself by a motor is performed in order to return the amount of rotation deviation of the nozzle itself which occurs when indexing is further performed. Since the rotation of the nozzle itself is treated as an absolute position of the motor encoder, similarly to the rotation to the index position, the rotation direction is determined in one direction.

Further, apart from the process of returning the amount of rotation shift, a rotation process of the rotation correction amount calculated by the image processing has been performed.

[0010]

However, the conventional surface mount component mounting apparatus has a problem that the time required for disposing the nozzle at a predetermined position cannot be minimized.

In the conventional control of the rotary index type nozzle, since the index position of the nozzle can be handled only as the absolute position of the motor encoder, the rotation is determined in one direction. For this reason, it was not possible to make the index in a direction in which the amount of rotation is small, symmetrically with respect to the rotation center. That is, relative movement could not be performed.

Further, the process of returning the amount of rotation deviation of the nozzle itself caused when performing the index has been performed after the end of the index. Therefore, in order to position the nozzle, it is necessary to perform a two-step process of an index process and a process of returning the rotational displacement amount, and the time for positioning the nozzle cannot be reduced. The rotation of the nozzle itself was also determined in one direction, and it was not possible to rotate the nozzle in a direction with a small amount of rotation symmetrically about the center of rotation. That is, relative movement could not be performed.

Further, the amount of rotation correction obtained by image processing or the like is also calculated in the same manner as in the above-described process of returning the amount of rotation deviation of the nozzle itself.
This was performed after the index processing was completed. For this reason,
The time for nozzle positioning could not be reduced.

The present invention has been made in view of the above points, and has as its object to provide a surface mount component mounting apparatus that optimizes rotation during nozzle positioning.

[0015]

According to the present invention, there is provided a surface mount component mounting apparatus for mounting components using a rotary index type nozzle provided with a nozzle for sucking and mounting components. A rotary index type nozzle in which the nozzles are assigned on a circumference, first rotating means for rotating the rotary index type nozzle in order to arrange the nozzle at a predetermined position, and the first rotating means A second rotating means for rotating the nozzle so as to correct a rotational displacement caused by the rotation of the nozzle, and moving the nozzle to a predetermined position at a position symmetrical with respect to a rotation center so as to move in a direction with a small amount of rotation. A rotary index type nozzle control means for controlling the first rotation means and the second rotation means. Surface mount component mounting apparatus according to symptoms,
Is provided.

In the surface mounting component mounting apparatus having such a configuration, the rotary index type nozzle control means calculates the rotation direction in which the movement becomes the shortest when the nozzle is arranged at a predetermined position. The nozzle is moved to a predetermined position by controlling the first rotating means and the second rotating means according to the calculation result.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram of a rotary index type nozzle unit of a surface mount component mounting apparatus according to an embodiment of the present invention.

The rotary index type nozzle section of the surface mount component mounting apparatus according to the present invention rotates the rotary index type nozzle 110 in which nozzles sequentially assigned with index numbers are arranged on the circumference, and the rotary index type nozzle. Rotating means 1 (112);
A rotating means 2 (113) for rotating the nozzle, and a rotary index type nozzle control means 114 for controlling the rotating means 1 (112) and the rotating means 2 (113);
An image processing unit 160 is provided in the vicinity.

The details of the rotary index type nozzle will be described with reference to FIG. FIG. 2 is a perspective view of a rotary index type nozzle of the surface mount component mounting apparatus according to one embodiment of the present invention. The rotary index type nozzle 110 is provided with a plurality of nozzles 111 on the circumference of the tip. The rotating means 1 (112) is connected to the motor 1 (112).
a) and the timing belt 1 (112b), and the power of the motor 1 (112a) is transmitted to the timing belt 1 (112b) to rotate the rotary index type nozzle 110. As with the conventional surface mount component mounting apparatus, the rotation is performed by the rotating means 1 (112).
Moving a nozzle having a predetermined index number to a predetermined position is defined as an index. Rotating means 2 (113)
Are the motor 2 (113a) and the timing belt 2 (11
3b) and the motor 2 (113a)
Is transmitted to the timing belt 2 (113b) to rotate the nozzle 111.

Returning to FIG. The rotary index type nozzle control means 114 controls the rotation means 1 (11
2) and the rotation direction and the rotation amount of the rotation means 2 (113) are controlled, and the nozzle is set at a predetermined position and angle. The rotation by the rotation means 1 (112) is performed by comparing the difference between the index number of the nozzle currently located at the predetermined position with the index number of the nozzle moving to the next predetermined position and the intermediate value of the total number of nozzles, The control is performed according to the magnitude relationship between the index number of the nozzle and the index number of the next nozzle. The rotation by the rotation means 2 (113)
The amount of rotational displacement of the nozzle is calculated according to the direction of rotation and the amount of rotation by the first rotating means, and the rotational direction is controlled according to the amount of rotational displacement and the direction of rotation of the rotating means 1 (112). This rotating means 1 (112) and rotating means 2 (1
13) can be controlled simultaneously. Further, based on the image information sent from the image processing means 160,
A rotation correction angle and an XY correction value are calculated. These correction amounts are added to the rotational deviation amount, and the correction of the nozzle position is controlled. The image processing means 160, for example, uses a CCD camera or the like to recognize the component adsorbed by the nozzle, performs image processing, and outputs the processed image to the rotary index type nozzle control means 114.

The operation of the rotary index type nozzle having such a configuration will be described. The rotary index type nozzle control means 114 moves a nozzle having a predetermined index number to a predetermined index position. At this time, the index number of the nozzle at the current index position is compared with the index number of the nozzle arranged at the next index position. Further, the rotation direction and the rotation amount are calculated by comparing the difference between the current index number and the next index number with the intermediate value of the total number of nozzles. If the rotation direction in which the index numbers advance in order is the forward direction, and the rotation in which the index numbers advance in the reverse order is the reverse direction, if the next index number is greater than the current index number, that is, if the index number advances, the difference between the index numbers Is smaller than the median value of the nozzles, the rotation means 1 (112) is controlled in the forward direction, and if larger than the middle value of the nozzles, it is controlled in the reverse direction. When the next index number is smaller than the current index number, the rotation unit 1 (112) is controlled in the reverse direction when the difference between the index numbers is smaller than the intermediate value of the nozzle, and in the forward direction when the difference is larger. In this way, to determine the direction that can be moved in the shortest time and rotate it,
When positioning the nozzle, the rotation of the rotary index type nozzle 110 can be minimized.

Rotary index type nozzle 110
However, if indexing is performed in the above procedure, the nozzle angle will rotate in the same direction as the indexing direction.
Rotating means 2 (112) to maintain the angle of the nozzle
Control. If you rotate forward when indexing,
When the rotational misalignment angle of the nozzle is 180 degrees or less, the rotation unit 2 (113) is controlled so that the nozzle rotates in the reverse direction when the nozzle misalignment angle is greater than 180 degrees. Also, when rotating in the reverse direction at the time of indexing, the rotation means 2 rotates the nozzle in the forward direction when the rotational misalignment angle of the nozzle is 180 degrees or less, and in the reverse direction when the rotational misalignment angle is more than 180 degrees.
(113) is controlled. As described above, since the rotation is determined and determined in the direction in which the rotational misalignment angle is corrected, the time required for the rotation of the nozzle can be minimized.

Further, the nozzle rotation processing is performed by adding the rotation correction amount calculated by the image processing means 160 to the rotation shift correction amount for correcting the rotation shift angle. For this reason,
Both corrections can be performed in one process, and the nozzle positioning time can be shortened.

The above-described index processing for controlling the rotation means 1 (112) and the nozzle rotation processing for controlling the rotation means 2 (113) can be performed simultaneously.
Thereby, the nozzle positioning time can be further reduced.

Next, the positioning of the rotary index type nozzle of the surface mounting component mounting apparatus according to the present invention will be described with a specific example. FIG. 3 is a diagram showing rotation during positioning of a rotary index type nozzle of the surface mount component mounting apparatus according to one embodiment of the present invention. Here, there are 12 nozzles, and index numbers are assigned in order from 1 to 12. The forward rotation is referred to as a rotation direction A, and the reverse rotation is referred to as a rotation direction B. Also,
The rotation that rotates the nozzle 111a in the same direction as the rotation direction A is defined as a rotation direction C, and the rotation that rotates the nozzle 111a in the same direction as the rotation direction B is defined as a rotation direction D.

Normally, the nozzle 111a differs depending on the kind of the component to be sucked. For this reason, depending on the position of the parts feeder arranged in the parts supply unit 131 and the order of sucking and mounting the parts, the parts are not always sucked and mounted in the order of the index numbers, that is, from 1 to 12. Therefore, when indexing the nozzle to the suction mounting index position, the rotation direction is controlled according to the following procedure. (1) If the current index number <the next index number and the difference between the next index number and the current index number is larger than 6, the rotation control is performed in the rotation direction B (reverse direction). (2) If the current index number <the next index number and the difference between the next index number and the current index number is 6 or less, rotation control is performed in the rotation direction A (forward direction). (3) If the current index number> the next index number and the difference between the next index number and the current index number is greater than 6, the rotation control is performed in the rotation direction A (forward). (4) If current index number> next index number and the difference between the next index number and the current index number is 6 or less, rotation control is performed in the rotation direction B (reverse direction).

In the above description, the suction mounting index position is used, but the component recognition index position may be used. Next, a process of correcting the rotational displacement caused by the index is performed. The rotation direction of the nozzle is controlled according to the following procedure. (1) At the time of index, it rotates in the rotation direction A (forward direction), and the rotation deviation angle Θ

[0028]

In the case of 0 ° ≦ Θ ≦ 180 ° (1), rotation control is performed in the rotation direction D (reverse direction). (2) At the time of index, it rotates in the rotation direction A (forward direction), and the rotation deviation angle Θ

[0029]

In the case of 180 ° <Θ <360 ° (2), rotation control is performed in the rotation direction D (reverse direction). (3) It rotates in the rotation direction B (reverse direction) at the time of index, and the rotation deviation angle Θ

[0030]

In the case of 0 ° ≦ Θ ≦ 180 ° (3), rotation control is performed in the rotation direction C (forward direction). (4) Rotation in the rotation direction B (reverse direction) at the time of index, and the rotation deviation angle Θ

[0031]

In the case of 180 ° <Θ <360 ° (4), rotation control is performed in the rotation direction D (reverse direction).

As described above, the rotation can be optimized by controlling the rotation direction at the time of indexing and the rotation direction at the time of correcting the rotational deviation angle. Further, the CCD camera 160a can recognize the component sucked by the nozzle located at the component recognition index position, perform image processing, and calculate the rotation correction amount. At the time of nozzle rotation control, the nozzle rotation control is performed by adding the rotation correction amount to the nozzle rotation deviation amount.

The component sucking and mounting process in the surface mount component mounting apparatus equipped with the rotary index type nozzle described above will be described. FIG. 4 is a flowchart of a component sucking and mounting process of the surface mount component mounting apparatus according to the embodiment of the present invention.

When the process is started (S401), the nozzle of the designated index number is moved to the suction mounting index position (S402). At this time, the rotation direction at the time of indexing is controlled as described above. After moving to the index position, the components are sucked by the vacuum negative pressure (S
403). It is checked whether or not there is a nozzle that is located in the opposite direction symmetrically with respect to the suction mounting index position and the rotation center and has a component at the component recognition index position where the CCD camera is installed (S404). The performed correction value is stored (S405). If not, the component recognition processing (S405) is not performed.
The component suction process from the index process (S402) is repeatedly performed until the component suction is completed for all nozzles to which components are sucked and mounted.

When the component suction is completed, a component mounting process is started. The designated index number is moved to the suction mounting index position (S406). At this time, the rotation direction at the time of indexing is controlled as described above. Correction is performed by adding the correction amount calculated in the component recognition process (S405) to the rotation shift amount at the time of indexing, and the component is mounted on the circuit board (S407). During this correction, the rotation direction of the nozzle is controlled as described above. The surface mount mounting apparatus according to an embodiment of the present invention has 12 nozzles, and the component recognition is at a position symmetric to the suction mounting index position.
Component recognition has been completed for only six components. Therefore, component recognition is also performed in the component mounting process. As in the case of the component suction processing, it is checked whether or not there is a nozzle that has picked up the component at the component recognition index position (S
408), if present, component recognition is performed and the correction value is stored (S409). If not, the component recognition process (S
408) is not performed. The component mounting process from the index process (S406) is repeatedly performed until the component mounting is completed for all the nozzles that suck and mount the component.
When the component mounting process is completed, the component suction mounting process ends (S410).

The above processing functions can be realized by a computer. In this case, the processing content of the function that the surface mount component mounting apparatus should have is described in a program recorded on a computer-readable recording medium. Then, by executing this program on a computer, the above processing is realized on the computer. As a computer-readable recording medium,
There are a magnetic recording device and a semiconductor memory. When distributing in the market, CD-ROM (Compact Disc ReadOnly Mem
or a portable recording medium such as a floppy disk or a floppy disk, or the program may be stored in a storage device of a computer connected via a network and transferred to another computer via the network. When executing the program on a computer, store the program on a hard disk device in the computer,
Load into main memory and execute.

[0037]

As described above, according to the present invention, when the rotary index type nozzle is moved to a predetermined position by rotating the nozzle, the movement for the index for arranging the predetermined index number at the predetermined position is not performed. The rotation direction is controlled so as to be the shortest, and the rotation of the nozzle is controlled in the rotation direction in which the rotation for correcting the rotational displacement caused by the index is minimized. As described above, by moving the nozzle to the predetermined position while rotating the nozzle in the rotation direction close to the current position, the time required for the nozzle index can be minimized. Also, by rotating the nozzle in a direction closer to the current position, the time required for the nozzle rotation can be minimized.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a rotary index type nozzle section of a surface mount component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a rotary index type nozzle of the surface mount component mounting apparatus according to one embodiment of the present invention.

FIG. 3 is a diagram showing rotation during positioning of a rotary index type nozzle of the surface mount component mounting apparatus according to one embodiment of the present invention.

FIG. 4 is a flowchart of a component sucking and mounting process of the surface mount component mounting apparatus according to the embodiment of the present invention;

FIG. 5 is a configuration diagram of a surface mount component mounting apparatus.

FIG. 6 is a view of the XY robot and the rotary index type nozzle of the surface mounting component mounting apparatus as viewed from below.

[Explanation of symbols]

110 ... Rotary index type nozzle, 111 ... Nozzle, 112 ... Rotating means 1, 112a ... Motor 1, 11
2b: timing belt 1, 113: rotating means 2, 11
3a: Motor 2, 113b: Timing belt, 114
... Rotary index nozzle control means, 160 ...
Image processing means

Claims (5)

[Claims] 1. A surface mount component mounting apparatus for mounting components using a rotary index type nozzle having a nozzle for sucking and mounting components, wherein a rotary index type nozzle in which index numbers are sequentially assigned is arranged on a circumference. A nozzle, first rotating means for rotating the rotary index type nozzle for disposing the nozzle at a predetermined position, and rotating the nozzle so as to correct a rotational displacement caused by rotation by the first rotating means. A second rotating means for controlling the first rotating means and the second rotating means so as to be symmetrical with respect to the center of rotation and move in a direction with a small amount of rotation when the nozzle is moved to a predetermined position. And a rotary index type nozzle control means. 2. The method according to claim 1, wherein said rotary index type nozzle control means compares a difference between an index number of a nozzle currently located at a predetermined position with an index number of a nozzle moving to a next predetermined position and an intermediate value of the total number of nozzles. 2. The surface mount component mounting apparatus according to claim 1, wherein a rotation direction of said first rotation means is controlled in accordance with a magnitude relationship between an index number of the current nozzle and an index number of a next nozzle. . 3. The rotary index type nozzle control means calculates a rotational shift amount of the nozzle according to a rotation direction and a rotation amount by the first rotating means, and calculates the rotational shift amount and the first rotating means. 3. The surface mounting component mounting apparatus according to claim 2, wherein a rotation direction of the second rotation unit is controlled according to the rotation direction of the surface mounting component. 4. The rotary index type nozzle control means starts rotation of the nozzle by the second rotation means before the end of rotation of the rotary index type nozzle by the first rotation means. Item 4. The surface mounting component mounting device according to Item 1. 5. The surface mount component mounting device further comprises:
An image processing means for recognizing a component adsorbed by the nozzle, wherein the rotary index type nozzle control means adds a rotation correction amount obtained by the image processing means to the rotation deviation amount. 2. The surface mounting component mounting apparatus according to claim 1.