JP2001144496A - Part placing method and system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and a system of placing parts by which placement of parts with narrow space between them can be performed without interference between parts already placed and parts held by a chuck nozzle. SOLUTION: A parts placing system for taking parts 1 supplied from a parts supplier 2 by a chuck nozzle 5 of a placing head 6 and placing them on a substrate 3 is provided with a control part 7 which has information about the parts 1 to be placed and moves the position of the chuck nozzle 5, the placing head 6 and the substrate 3 in such a way that the parts 1 are placed in order of height starting from the lowest part according to the information.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method and apparatus for picking up a component supplied from a component supply unit by a suction nozzle of a mounting head and mounting the component on a substrate.

[0002]

2. Description of the Related Art In general, a component mounting apparatus transports a printed circuit board to be mounted by a transport belt, moves and positions it in two directions, XY, in a component mounting unit, and processes components supplied from a component supply unit. It is configured to be taken out by the suction nozzle of the mounting head and mounted on the positioned printed circuit board.

When mounting components on a printed circuit board,
Depending on the size and weight of the supplied parts and the mounting position of the parts,
The electronic components to be mounted are divided into a plurality of component groups, and the mounting order is optimized before mounting. This is because when the component to be mounted is sucked and held by the suction nozzle and moved to the mounting position of the printed circuit board, if the component is large or heavy, it may fall from the suction nozzle.

[0004]

In recent years, due to the miniaturization and weight reduction of electronic devices such as mobile phones and small digital video cameras, parts having a size of less than 1 mm on a side have been reduced to 0 mm. It is becoming necessary to mount the components at a narrow interval between 0.3 mm and 0.1 mm.

[0005] However, as shown in FIG. 13 (a), when the component interval α is small, the component mounting is performed in the vicinity of the arrow C with the mounted component 1 a and the suction nozzle 5 or the component held by the suction nozzle 5. 1b interferes with each other, resulting in a defective mounting of the component 1b.

In order to solve such a problem, a method of mounting components by reducing the diameter of the suction nozzle 5 as shown in FIG. 13 (b) has been proposed. In No. 5, there is a problem that the strength of the nozzle cannot be maintained or the suction nozzle 5 is damaged.
Therefore, the diameter of the suction nozzle 5 is required to be 4 mm or more in terms of strength.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems, and even when mounting a component having a narrow component interval, mounting of the component without causing interference between the mounted component and the component held by the suction nozzle or the suction nozzle. It is an object of the present invention to provide a component mounting method and apparatus capable of performing the above.

[0008]

According to the present invention, there is provided a component mounting apparatus provided with a control unit for driving the positions of a suction nozzle, a mounting head, and a substrate so as to mount components in ascending order of component height. Features.

According to the present invention, even when a component having a small component interval is mounted, mounting of the component on the substrate does not cause interference between the component that has been mounted and the component held by the suction nozzle or the suction nozzle. Can be realized.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A component mounting apparatus according to the present invention takes out a component supplied from a component supply unit with a suction nozzle of a mounting head and prevents the components from interfering with each other or between a component and a nozzle. This device can be mounted on a board by performing mounting order from the information of the mounted component in ascending order of component height. Therefore, a control unit is provided that moves the position of the suction nozzle and at least one of the mounting head and the substrate so as to perform component mounting in ascending order of the height of the component to be mounted based on information on the component to be mounted.

Further, the component mounting apparatus of the present invention provides a component supply unit, a mounting head having a suction nozzle, a component mounting unit for positioning and fixing a substrate, and a control for controlling operations of the suction nozzle, the mounting head, and the component mounting unit. And a data section having component information, and drives the positions of the suction nozzle, the mounting head, and the board so that the mounting order is performed in ascending order of the component height based on the component height data provided from the data section. To control.

Further, the component mounting apparatus of the present invention controls a component supply unit, a mounting head having a suction nozzle, a component mounting unit for positioning and fixing a substrate, and controls a vertical movement of the mounting head and a horizontal movement of the mounting head. And a data section having component information, and drives the movement of the suction nozzle and the mounting head so that the mounting sequence is performed in ascending order of component height based on the component height data provided from the data portion. To control.

According to the component mounting method of the present invention, when a component supplied from a component supply unit is taken out by a suction nozzle of a mounting head and mounted on a substrate, mounting of the mounted component is performed based on information of the mounted component provided in advance. In this method, the components are mounted on the substrate by driving the positions of the suction nozzle, the mounting head, and the substrate so that the components are arranged in ascending order.

According to the present invention, even when a component having a narrow component interval is mounted, the component having a low height after mounting and the component having a suction nozzle or the next higher component which is suction-held by the suction nozzle are high. Because there is no interference in terms of
Mounting of components on a substrate can be realized without any trouble.

Further, according to the component mounting method of the present invention, when the intervals between the mounted components are different, components smaller than a predetermined value are divided into a plurality of groups so as to form one group. This is a method in which parts are arranged in ascending order of height.

According to this configuration, the interference between the parts does not occur, and the mounting order does not extend unnecessarily between groups, so that the moving distance of the mounted parts is made longer than necessary. , And the entire installation can be completed in a shorter time.

Further, according to the component mounting method of the present invention, if the interval between adjacent components is small, it is planned to check if there is a component with a low height to be mounted first, and if there is a component to be mounted, Is a method of checking whether the component is actually mounted and mounting the component on the board.

According to this configuration, even when the mounting fails, the component can be mounted without interference between the mounted component and the suction nozzle or the component suction-held by the suction nozzle. .

Hereinafter, embodiments of the present invention will be described with reference to FIGS. Components similar to those in FIG. 13 showing the above-described conventional example are denoted by the same reference numerals.

(Embodiment 1) FIGS. 1 to 4 show (Embodiment 1) of the present invention. As shown in FIG. 1, the component mounting apparatus of the present invention takes out an electronic component 1 supplied from a component supply unit 2 by a suction nozzle 5 of a mounting head 6, and positions the printed circuit board positioned by the component mounting unit 4. 3.

A plurality of suction nozzles 5 are attached to the mounting head 6 in a ring shape, and the plurality of suction nozzles 5 are driven to rotate in the direction of arrow A. Component supply unit 2, the component supply cassettes 8 which houses various electronic components 1 are more disposed, the component supply cassettes 8 accommodated required parts, component supply position of the mounting head 6 [in Figure 2 P ₁ [Position].

The printed circuit board 3 on which the electronic component 1 is mounted is conveyed in the direction of arrow B, and is positioned at a predetermined mounting position by the component mounting section 4 movable in two directions of XY. Specifically, as shown in FIG. 2, at the stop positions of the suction nozzles indicated by P _{1 to} P ₁₀ , for example, _one of the component supply cassettes 8 is positioned at the component suction position A indicated by P ₁ , and An electronic component 1 is supplied.

The printed circuit board 3 is positioned at the component mounting position B by the component mounting section 4. Suction nozzle 5 sucking the electronic component 1 extends from the mounting head 6 at P ₁ component suction position A, and sequentially moving the stop position P ₁ to P _10, which is positioned at the CC mounting position B of the P ₆ Prints The electronic component 1 is mounted at a predetermined position by moving down to the substrate 3 side.

The component mounting apparatus configured as described above includes a data section 9 for internally storing information on the height and mounting position of the component relating to the component to be mounted in advance,
A control unit 7 for moving the positions of the suction nozzle 5, the mounting head 6, and the substrate 3 based on data provided from the data unit 9 is provided.

Table 1 shows an example of data held in the data section 9.
Shown in

[0026]

[Table 1] The above table includes data of dimensions of the electronic components 1 to be mounted, mounting positions and mounting postures with respect to the substrate 3. That is, A, B, C, D, and the like represent the electronic component 1 to be mounted, a, b, and h represent the width, length, and height of each electronic component 1 shown in FIG. Y is FIG.
As shown in (b), the X coordinate and the Y coordinate of the mounting position of each electronic component 1 are represented, and θ represents the mounting posture by the angle formed by the longitudinal direction of the component 1 with the X axis as shown in FIG. The distance W and the gap w between arbitrary parts can be calculated from the position data (X, Y), posture data (θ) and dimension data (a, b, h) of the parts in the above table. The calculation can be performed by the control unit 7 each time. However, in FIG. 3B and FIG. 3C, for example, the distance W between the component center points between the component A and the component B and the gap w between the component A and the component B are calculated in advance. Alternatively, the data may be stored in the data unit 9 as data.

When the electronic component 1 is mounted on the printed circuit board 3, the control unit 7 uses the information held by the data unit 9.
Reads the component height and the mounting position, and the control unit 7 determines the mounting order so that the components are mounted in ascending order of height,
The electronic component 1 is mounted on the printed circuit board 3 by controlling and driving the suction nozzle 5, the mounting head 6, the component mounting section 4, and the like.

More specifically, as shown in FIG. 4, when mounting the electronic components 1a to 1d at the component intervals of t1 to t3, the control unit 7 firstly sets the data unit 9 relating to the electronic component 1 to the data unit 9.
The height of each electronic component 1 is read from the information of FIG.
As shown in (1), mounting is started from the electronic component 1a having the lowest height.

Next, as shown in FIGS. 4B and 4C, the components 1b and 1c having the second and third lowest heights are sequentially mounted. Then, the electronic component 1d having the highest height is mounted in FIG. 4D, and the mounting of the electronic components 1a to 1d on the printed circuit board 3 is completed.

In the above description, the case where the component intervals t1 to t4 are the same has been described. However, if the interval between target electronic components is smaller than a predetermined value, the adjacent components are set to the same group. Judgment is made, and components with lower heights in this group are mounted first.

Specifically, as shown in FIG. 5, when mounting the four electronic components 1e to 1h at the component intervals of t4 to t6, first, the electronic components 1e to 1h to be mounted are mounted.
The mounting order is determined based on the mounting position of the information on the components and the height of the parts.

At this time, with respect to parts whose intervals from other parts are smaller than a predetermined value, adjacent parts are grouped, and the order is set so that a part having a lower height in the group is mounted first. Decide.

Here, assuming that the component intervals t4 and t6 are smaller than a predetermined value and the component interval t5 is wider than a predetermined value,
Adjacent electronic components 1e and 1f are grouped into 1g and 1h, and mounting is performed from components having a lower height in each group.

Accordingly, the mounting order is determined by the electronic components 1e, 1
f, 1g, 1h or electronic components 1g, 1
h, 1e, and 1f. For example, the electronic components 1e,
In the case of the mounting order of 1f, 1g, and 1h, as shown in FIG. 5A, mounting is started from the electronic component 1e having a lower height, and then the component 1f having a higher height is mounted. Electronic component 1g
When mounting the electronic component 1f and the electronic component 1g, as shown in FIG. 5B, there is a sufficient space t5 between the electronic component 1f and the electronic component 1g. The electronic component 1g can be mounted without causing interference with the nozzle 5 or the electronic component 1g.

As described above, the mounting order is determined so that the parts having a smaller height than the predetermined value are mounted first on the parts having a smaller distance from other parts, so that the heights of all the parts are lower. Since the moving amount of the mounted component can be reduced as compared with the case where the order is determined so that the components are mounted first, the mounting can be performed in a short time.

Also, since there is no interference between the previously mounted component and the suction nozzle or the component held by the suction nozzle, it is possible to mount a minute component on a narrowly adjacent substrate, and further reduce the diameter of the suction nozzle. Since it is not necessary to reduce the size, the strength of the suction nozzle can be maintained, or the strength can be further improved by increasing the diameter.

(Embodiment 2) In the component mounting apparatus described in (Embodiment 1), the mounting nozzle 6 on which the plurality of suction nozzles 5 are mounted is rotated intermittently around the central axis of the mounting head 6 to thereby move the suction nozzle 5. Using a device for moving the printed board 3 up and down and moving the printed board 3 horizontally, the positions of the suction nozzle 5, the mounting head 6 and the printed board 3 are controlled to perform the component mounting order in the order of component height. Was. On the other hand, in the present embodiment, the XY robot 115 equipped with the plurality of suction nozzles 108 moves the suction nozzles 108 up and down while moving horizontally on the XY plane. This is a case where a component mounting apparatus that performs the horizontal movement operation of FIG. A component mounting apparatus that does not include the substrate moving device 140 but operates only the XY robot 115 and the suction nozzle 108 to perform component mounting in ascending order of component height will be described.

First, as shown in FIG. 6, the component mounting apparatus 101 according to the present embodiment can be connected to the board transport apparatus 103 for loading and unloading the printed circuit board 3, and can be connected to the board transport apparatus 103. In this case, a substrate movable device 140 that holds the substrate 3 and moves it in the X and Y directions and a reel-type electronic component supply device 104-1, 104-2, 105 containing the electronic component 1 mounted on the substrate 3. And a tray-type electronic component supply device 106 and a nozzle 108 serving as a component holding portion for holding electronic components from the electronic component supply device, for example, by a suction operation. The mounting head 107 mounted on the mounting head 107, the XY robot 115 for moving the mounting head 107 in the X and Y directions, and the holding posture of the electronic component held by the mounting head 107 are photographed. A recognition device 120, 121 to be measured,
At least the XY robot 115 and the substrate moving device 14
The control device 130 controls the movement operation of the component 0 and performs a process of recognizing an image supplied from the recognition devices 120 and 121 to correct a deviation between the holding posture and the mounting posture of the component on the printed circuit board 3. And

In the present embodiment, the mounting head 107 includes four nozzles 108 and a board recognition camera 109 for recognizing a board position detection mark provided on the board 3. In the present embodiment, after all four nozzles 108 hold components, the held components are sequentially mounted on the substrate 3. The board recognition camera 109 is used to obtain information for correcting the movement amount of the mounting head 107 when mounting components.
The geometrical substrate position detection mark formed on the substrate 3 is imaged so as to accurately detect the position of the substrate 3 moved by the substrate moving device 140 after the movement.

The substrate moving device 140 includes an X table 141 and a Y table 142 as shown in FIG.
The X table 141 has a holding mechanism 145 for holding and holding the substrate 3 between the fixed-side holding plate 143 and the movable-side holding plate 144, and operates the motor 146 to operate the ball screw 14.
7 can be moved in the X direction. Y table 142
Is mounted with the above-mentioned X table 141 and is movable in the Y direction via a ball screw 149 by the operation of a motor 148. The fixed side holding plate 143 and the movable side holding plate 144
Is connected to the substrate transport device 103, and the substrate transport device 103
The substrate 3 conveyed through the nip is held between the fixed-side holding plate 143 and the movable-side holding plate 144. As described above, the substrate is moved by X and Y by the substrate moving device 140 when the components are mounted.
It can move in any direction.

The component mounting apparatus 101 thus configured
The operation of is described below. First, the control device 130
Mounting position data, supply position data, and board mark detection data are supplied.

On the other hand, the substrate 3 is carried into the component mounting device 101 by the substrate transfer device 103, and the substrate movable device 14
It is kept at 0. In such a state, in the present embodiment, the board mark detecting operation for mounting the component is performed by the recognition device 12 that captures the holding posture of the mounted component.
0, 121, the control device 130 first moves the board movable device 140 to a position closest to the component supply point such as the component supply device 104 that supplies the component to be mounted. To move. Next, at the time of component mounting, the component held by the mounting head 107 is disposed above the recognition device 120 or the recognition device 121 for component recognition processing. In order to minimize the moving distance of the mounting head 107 from the position to the component mounting position on the substrate 3, the component mounting position is most likely to be recognized by the recognition device 120 or the recognition device 121 on the component supply device 104 side that supplies the component to be mounted. As approaching, the control device 130 controls the substrate moving device 140
To move.

After the substrate moving device 140 is moved by the control device 130 in this way, the XY robot 115 and the nozzle 108 are operated to operate the component supply devices 104 and 10.
A predetermined component is sucked from 5, 106, and further, the XY robot 115 and the nozzle 108 are operated to mount the component at a predetermined position on the substrate 3. As described in the first embodiment, the mounting order is similarly determined in consideration of the height of the components and the distance between the components.

Although the case where the substrate movable device 140 is provided has been described above, the substrate movable device 1 (not shown) is used.
There is also a component mounting apparatus 101 having a simple structure without the 40, and in this case, the XY robot 115 and the nozzle 108 are operated and fixed immediately after the board 3 is carried into the component mounting apparatus 101 by the board transfer apparatus 103. A predetermined component is mounted at a predetermined position on the substrate. The mounting order at this time is the same as that of the first embodiment.

(Embodiment 3) FIGS. 8 and 9 show (Embodiment 3) of the present invention. The flowchart of FIG. 9 will be described based on the specific example shown in FIG.

As shown in FIG. 8A, electronic components 1a, 1c, 1e having a high height and electronic components 1b, 1 having a low height are provided.
When mounting the electronic component 1 on the printed circuit board 3,
The mounting order of a to 1e is determined.

As shown in FIG. 9, in step S1, information on the shape and mounting position is read from the information on the electronic components 1a to 1e. In step S2, the mounted component intervals t1 to t4 are calculated from the read information.

In step S3, it is determined whether or not each of the component intervals t1 to t4 is wider than a predetermined value. If it is determined that the component interval is smaller than the predetermined value, components having a narrow component interval are classified into the same group in step S4. Here, since the component intervals t1 and t3 are smaller than a predetermined value, as shown in FIG. 8B, the electronic components 1a and 1b
Are classified into a first group, electronic components 1c and 1d are classified into a second group, and components having a narrow component interval are classified into a group.

If it is determined that the component interval is wider than the predetermined value, another group is created in step S5.
Here, since the component intervals t2 and t4 are wider than a predetermined value, a third group including only the electronic component 1e is created.

In step S6, it is checked whether all groupings have been completed. If completed, in step S7, the mounting order is determined so that the component having the lower height in each group comes first. Here, FIG.
As shown in (c), in the first group, the electronic component 1
b, 1a, and in the second group, the electronic components 1d, 1c.
The mounting order is determined in this order.

Since the distance t2 between the first group and the second group is wider than the distance t4 between the first group and the third group, the distance t2 after the mounting of the first group is completed. The component mounting of the third group is performed, and then the component mounting of the second group is performed.

Therefore, as shown in FIG. 8C, the mounting order of the electronic components 1a to 1e is as follows.
The order is 1d, 1c. The mounting of the components is started according to the mounting order.

If the grouping has not been completed in step S6, the process returns to step S1, and the above operation is repeated for other parts. With this configuration, it is possible to prevent the moving distance of the mounted component from being unnecessarily increased, and to complete the entire mounting in a shorter time.

(Embodiment 4) FIGS. 10 and 11 show (Embodiment 4) of the present invention. The flowchart of FIG. 11 will be described based on the specific example shown in FIG.

As shown in FIG. 10A, electronic components 1a, 1c, and 1e having a high height and electronic components 1b and 1b having a low height are provided.
When mounting 1d on the printed circuit board 3, first, the mounting order of the electronic components 1a to 1e is determined.

As shown in FIG. 11, in step S1,
The mounting order of the electronic components 1a to 1e to be mounted is determined by a conventional method such as a method of minimizing time depending on the mounting position.
Here, as shown in FIG. 10B, the mounting order is the order of the electronic components 1a, 1b, 1c, 1d, and 1e.

In step S2, information on the dimensions and mounting position is read from the information on the electronic components 1a to 1e. In step S3, component intervals t1 and t2 in the mounted state are calculated from the read information.

In step S4, it is determined whether the component intervals t1 and t2 are each wider than a predetermined value. If it is determined that the component interval is smaller than the predetermined value, the components having the smaller component interval are rearranged in order of decreasing height in step S5. Here, since the component intervals t1 and t2 are smaller than the predetermined value, the components are rearranged so that the mounting order is the electronic components 1b, 1a, 1d, 1c and 1e as shown in FIG.

If it is determined in step S4 that the component interval is wider than the predetermined value, no rearrangement is performed. In step S6, it is confirmed whether or not the operation for all the components has been completed. If the operation has been completed, component mounting is started in accordance with the mounting order determined above. If the processing has not been completed, the process returns to step S2, and the above operation is repeated for other parts.

With such a configuration, the same effect as the above (Embodiment 3) can be obtained. (Embodiment 5) When starting the mounting of the electronic component 1 on the printed circuit board 3 in accordance with the mounting order determined in the above (Embodiment 3) and (Embodiment 4), this (Embodiment 5) Then, after confirming that the mounting of the lower component has been completed, the mounting of the higher component is started.

FIG. 12 shows (Embodiment 5) of the present invention. At the time of starting the mounting of the electronic component, in a step S1, it is determined whether or not an interval with another component is smaller than a predetermined value.

If it is determined that it is narrow, in step S2,
Determine if there are any parts that are low and must be installed first. If there is a component to be mounted first, it is determined in step 3 whether the mounting of the component having a lower height has been completed.

If it is determined that the processing has been completed, step S4
After the mounting is completed, mounting of the next component is started. If it is determined in step S3 that the mounting of the low-height component has not been completed, that is, if the component has not been mounted due to a trouble such as a suction error, the component to be mounted so as to mount the non-mounted component. And returns to the beginning of the flowchart.

If it is determined in step S1 that the space between adjacent components is large, or if the height is low in step S2 and there is no component to be mounted first, that is, if there is no component in the vicinity, If the component to be mounted has the lowest height, it is mounted in step S4.

These procedures are, for example, as shown in FIG.
When mounting the electronic component 1f, this corresponds to a case where the mounting of the electronic component 1e has not been performed due to a suction error or the like. First, the electronic component 1e is first mounted again, and then the electronic component 1f is mounted.
Is performed.

In each of the above embodiments, an example has been described in which an electronic component is mounted at a predetermined position on a printed circuit board to manufacture an electronic circuit board. However, the present invention is not limited to this. The present invention can be generally applied to various component mounting apparatuses for mounting various components on various mounting objects.

[0067]

As described above, according to the component mounting method of the present invention, when the component supplied from the component supply unit is taken out by the suction nozzle of the mounting head and mounted on the board, the component provided beforehand is mounted inside. By driving the position of the suction nozzle, the mounting head, and the board to mount the parts on the board so that the mounting order of the parts to be mounted is performed in the order of the height of the parts from the information of the parts, The component can be mounted without interference with the suction nozzle or the component held by the suction nozzle.

Also, by taking the interval between components into consideration in the mounting order, it is possible to prevent the moving distance of the mounted components from being unnecessarily increased, and to finish the entire mounting in a shorter time.

Also, by confirming the completion of mounting for each group and starting mounting for the next group, even when mounting fails, the mounted components and the suction nozzles or the suction nozzles are held by suction. The components can be mounted without causing interference with the components.

According to the component mounting apparatus of the present invention, the component mounting apparatus which takes out the component supplied from the component supply unit with the suction nozzle of the mounting head and mounts the component on the board has information on the component to be mounted. By providing a control unit that drives the positions of the suction nozzle, the mounting head, and the board so that the mounting order of the components to be mounted is performed in ascending order of component height,
The component mounting method of the present invention can be easily realized.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a schematic view of a mounting head according to the embodiment.

FIG. 3 is a perspective view of the electronic component, a schematic diagram illustrating a mounting position and a mounting posture of the electronic component, and a schematic diagram illustrating a gap between arbitrary components according to the embodiment.

FIG. 4 is a process diagram of component mounting in the embodiment.

FIG. 5 is a process diagram of component mounting different from FIG.

FIG. 6 is a configuration diagram of a component mounting apparatus according to a second embodiment of the present invention.

FIG. 7 is an enlarged perspective view illustrating a main part of FIG. 6;

FIG. 8 is a process chart for determining a mounting order in (Embodiment 3) of the present invention.

FIG. 9 is a flowchart of a component mounting method according to the embodiment;

FIG. 10 is a process chart for determining a mounting order in (Embodiment 4) of the present invention.

FIG. 11 is a flowchart of a component mounting method according to the embodiment.

FIG. 12 is a flowchart of a component mounting method according to a fifth embodiment of the present invention.

FIG. 13 is a schematic view of a conventional component mounting process.

[Explanation of symbols]

 1a to 1e Electronic component 2 Component supply unit 3 Printed circuit board 4 Component mounting unit 5 Suction nozzle 6 Mounting head 7 Control unit 8 Component supply cassette 9 Data unit

Continued on the front page (72) Inventor Seiichi Mogi 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. Reference) 5E313 AA01 AA11 CD02 CD06 DD15 EE02 EE03 EE24 FF24 FF28 FF29 FF32

Claims (10)

[Claims] 1. A component mounting apparatus which takes out a component supplied from a component supply unit by a suction nozzle of a mounting head and mounts the component on a substrate. The component mounting device has information on a component to be mounted and a mounting order of the component to be mounted based on the information. Component mounting apparatus provided with a control unit that moves the position of the suction nozzle and at least one of the mounting head and the substrate so as to perform the steps in ascending order of component height. 2. A component supply unit for supplying a component, a mounting head having a suction nozzle for taking out the component from the component supply unit and mounting the component on a substrate, a component mounting unit for positioning and fixing the substrate, the suction nozzle, A mounting head, a control unit for controlling the operation of the component mounting unit, and a data unit having information on the component to be mounted, and a mounting order based on height data of the component to be mounted provided from the data unit. A component mounting device that drives and controls the positions of the suction nozzle, the mounting head, and the substrate in the order from the lowest to the highest. 3. A component supply unit for supplying components, a mounting head having a plurality of annular suction nozzles for taking out components from the component supply unit and mounting the components on a substrate, and a component mounting unit for positioning and fixing the substrate. A control unit for controlling the vertical movement of the suction nozzle, the intermittent rotational movement of the mounting head, and the horizontal movement of the component mounting unit, and a data unit having information on the component to be mounted, provided by the data unit. A component mounting apparatus that drives and controls the movement of a suction nozzle, a mounting head, and a substrate so that mounting is performed in ascending order of component height based on height data of a component to be mounted. 4. A component supply unit for supplying a component, a mounting head having a suction nozzle for taking out the component from the component supply unit and mounting the component on a substrate, a component mounting unit for positioning and fixing the substrate, A control unit for controlling the vertical movement and the horizontal movement of the mounting head, and a data unit having information on a component to be mounted, and the mounting order is determined based on height data of the component to be mounted provided from the data unit. A component mounting device that drives and controls the movement of the suction nozzle and the mounting head so that they are performed in ascending order of height. 5. A suction nozzle for controlling a horizontal movement of a component mounting unit and performing a mounting order in ascending order of component height based on height data of a component to be mounted provided from a data unit. 4. The component mounting apparatus according to claim 3, wherein the movement of the mounting head and the component mounting unit is drive-controlled. 6. When a component supplied from a component supply unit is taken out by a suction nozzle of a mounting head and mounted on a substrate, the mounting order of the component to be mounted is determined based on information of the component to be mounted provided in advance. A component mounting method in which components are mounted on a substrate by driving the positions of a suction nozzle, a mounting head, and a substrate so that the components are mounted in ascending order of height. 7. The component mounting method according to claim 6, wherein components in which the interval between target mounted components is smaller than a predetermined value are determined to be in the same group, and components having lower heights are mounted first in said group. . 8. The data of the shape and the mounting position of the component to be mounted is read, the interval between the mounted components is calculated from the data, and the components whose calculated interval is smaller than a predetermined value are classified into the same group. 7. The component according to claim 6, wherein when the calculated interval is wider than a predetermined value, another group is formed, and the mounting order is determined such that the component having a lower height comes first in the group. Mounting method. 9. A mounting order is determined by dividing the component into a plurality of component groups according to a mounting position of the component, data of a shape dimension and a mounting position of the component to be mounted is read, and an interval of the mounting component is calculated from the read data. If the interval between the components is smaller than a predetermined value, the components having a smaller component interval are rearranged so that the components are arranged in ascending order of height, and it is confirmed whether or not the operations on all the components have been completed. The component mounting method according to claim 6, wherein the component is mounted according to the following. 10. When the distance between adjacent parts is small,
10. Checking whether there is a component to be mounted first at a low height, and if there is a component to be mounted, confirming completion of mounting of the component to be mounted first and mounting the component on the substrate. The described component mounting method.