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HK1058216A1 - Copper foil surface treatment agent - Google Patents

Copper foil surface treatment agent

Info

Publication number
HK1058216A1
HK1058216A1 HK04100958A HK04100958A HK1058216A1 HK 1058216 A1 HK1058216 A1 HK 1058216A1 HK 04100958 A HK04100958 A HK 04100958A HK 04100958 A HK04100958 A HK 04100958A HK 1058216 A1 HK1058216 A1 HK 1058216A1
Authority
HK
Hong Kong
Prior art keywords
surface treatment
copper foil
treatment agent
foil surface
agent
Prior art date
Application number
HK04100958A
Other languages
English (en)
Inventor
Katsuyuki Tsuchida
Masashi Kumagai
Fumiaki Akase
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Publication of HK1058216A1 publication Critical patent/HK1058216A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/68—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous solutions with pH between 6 and 8
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Paints Or Removers (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
HK04100958A 2001-10-18 2004-02-12 Copper foil surface treatment agent HK1058216A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001320394A JP4298943B2 (ja) 2001-10-18 2001-10-18 銅箔表面処理剤
PCT/JP2002/007256 WO2003035930A1 (fr) 2001-10-18 2002-07-17 Traitement de surface de feuille de cuivre

Publications (1)

Publication Number Publication Date
HK1058216A1 true HK1058216A1 (en) 2004-05-07

Family

ID=19137794

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04100958A HK1058216A1 (en) 2001-10-18 2004-02-12 Copper foil surface treatment agent

Country Status (9)

Country Link
US (1) US6835241B2 (zh)
EP (1) EP1462545A4 (zh)
JP (1) JP4298943B2 (zh)
KR (1) KR20030063349A (zh)
CN (1) CN1265023C (zh)
HK (1) HK1058216A1 (zh)
MY (1) MY130918A (zh)
TW (1) TW574417B (zh)
WO (1) WO2003035930A1 (zh)

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US7413791B2 (en) * 2003-01-28 2008-08-19 Matsushita Electric Works, Ltd. Poly (phenylene ether) resin composition, prepreg, and laminated sheet
DE602005016432D1 (de) * 2004-08-10 2009-10-15 Nippon Mining Co Barrierefilm für flexbilbes kupfersubstrat und sputtertarget zur bildung eines barrierefilms
EP1884807A1 (en) * 2005-05-26 2008-02-06 Sony Chemical & Information Device Corporation Method for producing optically anisotropic material
WO2006137240A1 (ja) * 2005-06-23 2006-12-28 Nippon Mining & Metals Co., Ltd. プリント配線板用銅箔
US20070004587A1 (en) * 2005-06-30 2007-01-04 Intel Corporation Method of forming metal on a substrate using a Ruthenium-based catalyst
JP4890546B2 (ja) * 2006-06-12 2012-03-07 Ｊｘ日鉱日石金属株式会社 粗化処理面を備えた圧延銅又は銅合金箔及び圧延銅又は銅合金箔の粗化方法
CN101541528B (zh) * 2006-11-29 2012-12-12 Jx日矿日石金属株式会社 双层覆铜层压板
WO2008114539A1 (ja) * 2007-03-20 2008-09-25 Nippon Mining & Metals Co., Ltd. 無接着剤フレキシブルラミネート及びその製造方法
KR101108911B1 (ko) * 2007-04-20 2012-01-31 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 리튬 2차 전지용 전해 구리박 및 그 구리박의 제조 방법
US8642893B2 (en) * 2007-09-28 2014-02-04 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit and copper-clad laminate
WO2009050970A1 (ja) 2007-10-18 2009-04-23 Nippon Mining & Metals Co., Ltd. 金属被覆ポリイミド複合体、同複合体の製造方法及び同複合体の製造装置
WO2009050971A1 (ja) * 2007-10-18 2009-04-23 Nippon Mining & Metals Co., Ltd. 金属被覆ポリイミド複合体及び同複合体の製造方法並びに電子回路基板の製造方法
CN101909877B (zh) * 2007-12-27 2013-03-06 Jx日矿日石金属株式会社 双层覆铜层压板的制造方法及双层覆铜层压板
WO2009098832A1 (ja) * 2008-02-04 2009-08-13 Nippon Mining & Metals Co., Ltd. 無接着剤フレキシブルラミネート
JP5663739B2 (ja) * 2008-04-04 2015-02-04 日本ペイント株式会社 銅の表面調整組成物および表面処理方法
KR101359391B1 (ko) 2008-05-21 2014-02-07 삼성테크윈 주식회사 절연기판의 제조방법
JP4938130B2 (ja) * 2008-06-17 2012-05-23 Ｊｘ日鉱日石金属株式会社 印刷回路基板用銅箔及び印刷回路基板用銅張積層板
CN102224281B (zh) 2008-11-25 2014-03-26 吉坤日矿日石金属株式会社 印刷电路用铜箔
EP2366469A1 (en) * 2008-11-25 2011-09-21 JX Nippon Mining & Metals Corporation Method of winding up copper foil or copper-clad laminate
JP2009143234A (ja) 2008-12-24 2009-07-02 Nippon Mining & Metals Co Ltd キャリア付金属箔
JP5346040B2 (ja) 2008-12-26 2013-11-20 Ｊｘ日鉱日石金属株式会社 フレキシブルラミネート及び該ラミネートを用いて形成したフレキシブル電子回路基板
WO2010140540A1 (ja) * 2009-06-05 2010-12-09 Jx日鉱日石金属株式会社 半導体パッケージ基板用銅箔及び半導体パッケージ用基板
JP5463117B2 (ja) * 2009-10-20 2014-04-09 株式会社日立製作所 低損失配線板，多層配線板、それに用いる銅箔及び積層板
CN106028638B (zh) 2010-09-27 2019-09-03 吉坤日矿日石金属株式会社 印刷电路板用铜箔、其制造方法以及印刷电路板
JPWO2012132576A1 (ja) 2011-03-25 2014-07-24 Jx日鉱日石金属株式会社 粗化処理面を備えた圧延銅又は銅合金箔
CN102408869B (zh) * 2011-08-04 2013-07-24 绵阳惠利电子材料有限公司 无卤阻燃电子电器用加成型有机硅灌封胶
JP5362921B1 (ja) * 2012-11-09 2013-12-11 Ｊｘ日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板
CN103774131A (zh) * 2012-10-25 2014-05-07 深圳富泰宏精密工业有限公司 壳体的制备方法及由该方法制得的壳体
KR101929844B1 (ko) * 2015-01-22 2018-12-17 미쓰이금속광업주식회사 캐리어 부착 극박 동박 및 그 제조 방법
US10596782B2 (en) * 2015-06-04 2020-03-24 Sumitomo Electric Industries, Ltd. Substrate for printed circuit board and printed circuit board

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Also Published As

Publication number Publication date
WO2003035930A1 (fr) 2003-05-01
EP1462545A4 (en) 2008-05-21
CN1265023C (zh) 2006-07-19
JP4298943B2 (ja) 2009-07-22
CN1464919A (zh) 2003-12-31
US20040149167A1 (en) 2004-08-05
KR20030063349A (ko) 2003-07-28
JP2003128923A (ja) 2003-05-08
MY130918A (en) 2007-07-31
TW574417B (en) 2004-02-01
US6835241B2 (en) 2004-12-28
EP1462545A1 (en) 2004-09-29

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Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20220716