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EP3578875B1 - Procédé de montage et d'ajustement d'une puce dmd dans un module lumineux pour un projecteur de véhicule automobile - Google Patents

Procédé de montage et d'ajustement d'une puce dmd dans un module lumineux pour un projecteur de véhicule automobile Download PDF

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Publication number
EP3578875B1
EP3578875B1 EP19177675.6A EP19177675A EP3578875B1 EP 3578875 B1 EP3578875 B1 EP 3578875B1 EP 19177675 A EP19177675 A EP 19177675A EP 3578875 B1 EP3578875 B1 EP 3578875B1
Authority
EP
European Patent Office
Prior art keywords
dmd chip
circuit board
printed circuit
carrier element
orientation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP19177675.6A
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German (de)
English (en)
Other versions
EP3578875A1 (fr
Inventor
Anton Jost
Ralf Chor
Uwe BREITENBACH
Tino Schlischo
Tobias Moeller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marelli Automotive Lighting Reutlingen Germany GmbH
Original Assignee
Automotive Lighting Reutlingen GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Automotive Lighting Reutlingen GmbH filed Critical Automotive Lighting Reutlingen GmbH
Publication of EP3578875A1 publication Critical patent/EP3578875A1/fr
Application granted granted Critical
Publication of EP3578875B1 publication Critical patent/EP3578875B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/60—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution
    • F21S41/67—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on reflectors
    • F21S41/675—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on reflectors by moving reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/39—Attachment thereof

Definitions

  • the present application relates to a method for mounting a circuit board carrying a DMD chip in a DMD light module (DMD: Digital Mirror Device) for a motor vehicle headlight according to the preamble of claim 1.
  • DMD Digital Mirror Device
  • Such a light module is known from WO 2017/143372 A1 known.
  • the light module emits a light bundle having a main emission direction.
  • the radiation takes place in a spatial area in front of the motor vehicle headlight, so that it is illuminated. If a front side is mentioned in the present application, this means in each case a side that faces this spatial area. A rear side is in each case a side facing away from this spatial area.
  • the known light module has a printed circuit board which has a front and a back and which carries a DMD chip on its front.
  • the DMD chip has a front side carrying micromirrors and a back side opposite its front side.
  • the well-known light module also has a central carrier element which has a front side and a rear side.
  • Available DMD chips can have a large number (greater than a million) of micromirrors.
  • Each individual micromirror is, for example, only 8 by 8 micrometers in size.
  • a position of each individual micromirror can be switched between two positions. In one position it reflects light incident from a light source via primary optics onto secondary optics of the light module, and in the other position it reflects the light onto an absorber, for example.
  • the secondary optics images the arrangement of the micromirrors in the area in front of the light module, which in the case of a motor vehicle headlight lies on the road, for example.
  • Micromirrors that reflect light onto the secondary optics appear as bright pixels in the light distribution resulting from the image, while the micromirrors that reflect light onto the absorber appear as dark pixels in the light distribution.
  • the shape of the light distribution can be controlled with a fineness specified by the number of pixels and thus by the number of micromirrors, which, for example, enables camera-controlled light distributions in which areas that would dazzle other road users can be specifically darkened and other areas, such as traffic signs or pedestrians, are specifically illuminated, so that they can be recognized by the driver.
  • a common method for mounting a printed circuit board carrying a DMD chip in a light module of a motor vehicle headlight provides for adjusting the installation position of the chip with a pin slot structure.
  • the chip and circuit board have form-fitting elements that are complementary to one another, such as pins and holes and elongated holes.
  • This type of alignment of a DMD chip on a light module circuit board is not accurate enough for use in automotive headlamps. For example, it can lead to the motor vehicle headlight producing undesirably tilted light distributions. For example, it can happen that instead of a light-dark line parallel to the horizon, an oblique light-dark line is generated.
  • the object of the invention is to provide an improved method of the type mentioned at the outset.
  • the contact pressure force acting in a clamping manner lies in a contact pressure force range defined by the deformation of the elastic element.
  • the effects of positional tolerances of the DMD chip on the contact pressure acting on it can be compensated.
  • the deformation of the elastic element and thus the contact pressure force generated by it changes only slightly.
  • the contact pressure is limited by the elastic element to its restoring forces, which reliably prevents damage caused by excessive contact forces, which can occur with other attachments, for example with less elastic screw connections.
  • the contact pressure is preferably between 40 N and 80 N.
  • a preferred embodiment is characterized in that the pressing force is generated by an elastic connecting element of the tensioning element assembly as a restoring force of an elastic deformation which the elastic connecting element undergoes during assembly of the light module.
  • the image processing takes place in such a way that the position and the course of at least one outer edge of the reflecting surface of the arrangement of the micromirrors are determined Adhesive connections are made.
  • a further preferred embodiment is characterized in that the printed circuit board is glued to the central carrier element in a floating manner in the aligned state.
  • recesses arranged in the printed circuit board 26, which receptacles of the central support element are opposite, are filled with a viscous adhesive, the adhesive also penetrating between the edges of the recesses and the receptacles.
  • the adhesive connections 36 are irradiated with ultraviolet light for a period of between 15 s and 30 s.
  • a further preferred embodiment is characterized in that the adhesive connections are fully cured at an elevated temperature after the exposure to ultraviolet light.
  • fixation takes place additionally by increasing the contact pressure with which the DMD chip is held in a clamped manner.
  • clamping force is increased by finally tightening screws with which the tensioning element assembly is fastened to screw domes of the central support element.
  • figure 1 shows in detail a sectional view of a motor vehicle headlight 10 with a housing 12 whose light exit opening is covered by a transparent cover plate 14 .
  • the sectional plane lies parallel to a plane that is spanned by a longitudinal axis and a vertical axis of the motor vehicle.
  • a light module 16 is arranged in the interior of the housing 12 .
  • the light module 16 has, among other things, a light source 18, primary optics 20, a DMD chip 22, a secondary optics 24 and an absorber 25 on.
  • the light module 16 also has a printed circuit board 26 , a central support element 28 and a clamping element assembly 30 .
  • the clamping element assembly 30 has a stamp 302 and an elastic connecting element 32 .
  • the chuck assembly may also include a heat sink 304 .
  • the printed circuit board 26 forms, together with the central support element 28, the DMD chip 22 and the clamping element assembly 30, a sub-module of the light module.
  • the circuit board 26 has a front 260, a back 262 and a circuit board window 264 and carries the DMD chip 22 on its front 260.
  • the DMD chip 22 has a front 224 carrying micromirrors 222 and a back 226 opposite its front 224.
  • the central support member 28 has a front face 282 , a back face 284 and a support member window 286 .
  • the printed circuit board 26 is arranged with its front side 260 facing the back side 284 of the central support element 28 such that the front side 224 of the DMD chip 22 covers the support element window 286, with the micromirrors 222 being arranged in the opening of the support element window 286.
  • An opening of the circuit board window 264 is completely or partially covered by the back side 226 of the DMD chip 22 .
  • the chuck assembly 30 includes a stamper 302 that bears against the backside 226 of the DMD chip 22 through the circuit board window 264 .
  • the clamping element assembly 30 is arranged on the back 262 of the printed circuit board 26.
  • the elastic connecting element 32 has at least one end 322 on the clamping element assembly side and at least one end 324 on the carrier element side.
  • the elastic connecting element 32 With its end 322 on the side of the clamping element assembly, the elastic connecting element 32 is rigidly connected to the remaining part of the clamping element assembly 30 which is arranged on the rear side 262 of the printed circuit board 26 and has a heat sink 304, for example.
  • the elastic connecting element 32 is rigidly connected to the central carrier element 28 with its carrier element-side end 324 .
  • the light source 18 is a semiconductor light source 182 which is arranged on a circuit board 35 and which emits light 34 in the direction of the primary optics 20 .
  • the primary optics 20 directs the light 34 coming from the semiconductor light source 182 onto the micromirrors 222 which are arranged on the front side 224 of the DMD chip 22 . How and with which optical elements of the primary optics 20 this happens in detail is not essential for the invention. In the case of figure 1 the primary optics 20 is a concave mirror reflector.
  • a pivoting position of the micromirrors 222 can be switched individually for each micromirror or at least for different groups (subsets) of the micromirrors 222 between a first pivoting position and a second pivoting position.
  • Each micromirror located in the first Is in the pivoted position deflects the light 34 incident on it from the primary optics 20 onto the secondary optics 24 .
  • Each micromirror that is in the second pivoted position deflects the light 34 incident on it from the primary optics 20 in such a way that this light 342 does not fall on the secondary optics 24 .
  • This light 342 is directed onto the absorber 25, for example, and is absorbed there, so that it cannot produce any disruptive light effects.
  • the secondary optics 24 directs the light 34 incident on them from the DMD chip 22 into the area in front of the light module 16. When the light module 16 is used as intended, the road ahead of the motor vehicle is illuminated with this light 34.
  • the secondary optics 24 has a secondary optics lens 242 made of transparent plastic or glass.
  • the secondary optics 24 can also have several lenses, for example an arrangement of an achromat and an imaging lens.
  • the DMD chip 22 has two broad sides in the form of the front 224 and the back 226, the front 224 and the back 226 being separated from one another by lateral narrow sides 228 lying between them.
  • the front side 224 of the DMD chip 22 has a central chip area in which the micromirrors 222 are arranged, and it has a flange area 229 which surrounds the central chip area in a closed curve and in which no micromirrors 222 are arranged.
  • the number of micromirrors is about 1.3 million, arranged in a matrix with 1152 columns and 1152 rows.
  • figure 2 also shows that the DMD chip 22 is in a socket 266 of the printed circuit board 26 is arranged and held.
  • the mechanical mounting of the DMD chip 22 in the socket 266 takes place via the lateral narrow sides 228 and, if necessary, also via parts of the rear side 226 of the DMD chip 22, and the electrical contacting also takes place via the lateral narrow sides 228 and/or via the Backside 226 of the DMD chip 22 from the circuit board 26 .
  • the circuit board 26 is firmly connected to the central support element 28 .
  • the connection is preferably made by in the figure 1 Adhesive connections shown 36.
  • the adhesive connections 36 lie between the printed circuit board 26 and receptacles 288 of the central support element 28.
  • the printed circuit board 26 does not exert any contact pressure acting perpendicular to the surface of the printed circuit board 26 and the front side 224 of the DMD chip 22 . However, the circuit board 26 retains the DMD chip 22 with its socket 266 in directions tangential to the front side 224 of the DMD chip 22 and the circuit board 26 .
  • Said pressing force is generated by the elastic element 32 as a restoring force of an elastic deformation which the elastic connection element 32 experiences when the light module 16 is assembled.
  • This pressing force is transmitted from the punch 302 to the back of the DMD chip 22 and presses the flange area 229 of the DMD chip 22 against the back of the central carrier element 28.
  • a leaf spring 326 serving as an elastic connecting element 32 is rigidly connected to the central carrier element 28 by its end 324 on the carrier element side.
  • the central support element 28 has screw bosses 289, which emerge from the back 284 of the central support member 28 protrude. On their ends facing away from the rear side 284 , the screw domes 289 have receptacles for the ends 324 of the leaf spring 326 on the carrier element side.
  • the leaf spring 326 With its clamping element assembly-side end 322, the leaf spring 326 is non-positively and/or positively connected to the remaining part of the clamping element assembly 30 on the rear side 262 of the printed circuit board 26, which can be a heat sink 304. In the figure 1 this connection is made by form-fitting elements 306 of the tensioning element assembly 30 which prevent the end 322 of the leaf spring 326 on the tensioning element assembly side from moving towards the printed circuit board 26 .
  • the contact pressure is adjusted in such a way that the printed circuit board 26 is initially movable in a floating manner relative to the receptacles 288 of the central support element 28 in the plane of the printed circuit board.
  • the printed circuit board 26 is aligned according to the invention with the aid of a camera- and image-processing-supported alignment device together with the DMD chip 22 firmly seated in the base 266 of the printed circuit board 26 such that the directions in which the micromirrors 222 are directed from the primary optics 20 reflect incident light 34 corresponds to the desired target directions.
  • the printed circuit board 26 is bonded to the receptacles 288 of the central carrier element 28 with the adhesive connections 36 without tension.
  • FIG 3 shows an alignment device 400 suitable for carrying out a method according to the invention.
  • the evaluation device 400 has a coherent and inherently rigid framework 402 which forms a reference system for the alignment of the printed circuit board with the DMD chip.
  • the central support element 28 is precisely manufactured in the alignment device by means of positive or negative form-fitting elements 404, such as corners, edges or pins or recesses of the central support element 28, which in each case negatively or positively complementary form-fitting elements 404' of the rigid framework or one with the rigid framework engage connected tool carrier, held in a precisely predetermined position and position within the reference system. This will be in the figure 3 represented by the pairs of lines connecting the central support member 28 to the rigid framework 402 .
  • the central carrier element 28 is inserted directly into a part of the framework 402 that is manufactured with appropriate precision and true to size.
  • the central carrier element 28 is received by a transportable tool carrier, with which the central carrier element 28 and further components of the light module mounted thereon are transported from processing station to processing station.
  • a transportable tool carrier is as such in relation to its accommodation by the framework 402 and in relation to its accommodation for the central support member made dimensionally accurate, that the central support element 28 is held in this embodiment in a precisely predetermined position and position within the reference system.
  • the alignment device 400 has a camera 406 .
  • the camera 406 captures images of the DMD chip 22 in the circuit board plane or a plane parallel thereto, and it simultaneously captures images of fiducial marks 405 of the tool carrier and/or the central support element 28.
  • a fiducial mark 405 can be, for example, an edge of the carrier element window 286 .
  • the camera 406 is preferably arranged to face the front side 282 of the central support member 28 and captures images of the front side 224 of the DMD chip 22 through the support member window 286 .
  • FIG. 12 also shows that the circuit board 26 has recesses 268 and that the central support member 28 has receptacles 288 in the form of flat areas at its locations adjacent to the recesses 268 of the circuit board 26.
  • FIG. These flat areas project beyond the recesses 268 parallel to the planes in which the recesses 268 lie.
  • the recesses 268 preferably have a clear width of between 5 mm and 10 mm. In the assembled state, there is preferably a narrow gap between the edges of the recesses 268 and the receptacles 288, the thickness of which is preferably less than or equal to 1 mm.
  • the recordings 288 touch the edges of Recesses 268 are therefore preferably not.
  • the alignment device 400 has a control unit 408 which is set up, in particular programmed, to evaluate the images captured by the camera 406 with the aid of an image processing program.
  • the evaluation is preferably carried out in such a way that the position and course of at least one outer edge 225 of the reflecting surface of the arrangement of micromirrors 222 (cf figure 2 ) are determined.
  • control device 408 determines quantitative values for the position and the angle of rotation of the DMD chip 22 in the reference system.
  • the alignment device 400 has a gripper 410 .
  • a base of gripper 410 is rigidly connected to at least one actuator 412, with which gripper 410 can be moved parallel to an x-y plane of the reference system of alignment device 400 and with which it can be rotated about an axis of rotation parallel to the z-direction and with which the Opening and closing of the gripper 410, i.e. gripping, is driven.
  • the actuator 412 is controlled by the control unit 408 as a function of the position information and/or rotational angle information that the control unit generates from the signals from the camera 406 .
  • figure 4 shows a flowchart as an exemplary embodiment of a method according to the invention for mounting a printed circuit board 26 carrying a DMD chip 22 in a DMD light module 16 for a motor vehicle headlight 10.
  • a first step 500 the printed circuit board 26, a central support element 28 and a clamping element assembly 30 having partial module of the light module 16, as in FIG figure 1 is shown manufactured.
  • the central support element 28 of this sub-module has a support element window 286 and is elastically connected to the clamping element assembly 30 .
  • the DMD chip 22 is frictionally clamped between a frame of the carrier element window 286 and the clamping element assembly 30 and is movably held in a plane parallel to the circuit board plane against the resistance of a frictional force resulting from the clamping force.
  • a reference system for the location and position of the DMD chip 22 relative to the central carrier element 28 is defined.
  • the setting is done by inserting the sub-module into an alignment device 400, as described with reference to FIG figure 3 has been explained, and which has a gripper 410 that can be movably controlled by an actuator 412, an image signal-generating camera 406, and a control unit 408 that processes image signals from the camera 406 into actuating signals for the actuator 412
  • a third step 504 the printed circuit board 26 is gripped with the gripper 410 of the alignment device 400 .
  • the position and location of the printed circuit board 26 with the DMD chip 22 are then known to the control unit 408 .
  • a fourth step 506 at least one image of at least one location feature and/or at least one position feature of DMD chip 22 in alignment device 400 is recorded by the Support element window 286 therethrough.
  • a fifth step 508 the location and position of the DMD chip 22 in the reference system of the alignment device 400 is calculated as a function of signals from the camera 406 and control signals are formed, with which the control unit 408 controls the gripper 410 in a sixth step.
  • the control signals are each formed in such a way that the gripper 410 adjusts the target location and target position of the printed circuit board 26 with the DMD chip 22 by the printed circuit board 26 being correspondingly rotated and translated by the gripper 410 .
  • the position of the gripper 410 is controlled as a function of a deviation in the location and position of the DMD chip 26 from a target position and target position in a sixth step 510 so that the DMD chip (26) has the target position and target position takes.
  • the clamped mounting of the DMD chip 22 between its system on the frame of the carrier element window 286 and the plunger 302 of the clamping element assembly 30 allows these movements and only opposes them with a frictional resistance that can be overcome by the drive of the gripper 410 .
  • a seventh step 512 the position and position of the DMD chip 22 in the central carrier element 28 is fixed further, i.e. beyond the already existing clamping mount, when the target position and target position is reached.
  • this is done both by adhesive connections 36 and by increasing the clamping force with which the DMD chip 22 is clamped.
  • the recesses 268 are filled with a viscous adhesive, the adhesive preferably also being allowed to penetrate between the edges of the recesses 268 and the receptacles 288.
  • the adhesive is preferably of a type that cures rapidly upon exposure to ultraviolet light.
  • the adhesive connections 36 are preferably irradiated with ultraviolet light for a period of between 15 s and 30 s.
  • the printed circuit board 26 is glued to the central support element 28 in a floating manner in the aligned state.
  • the printed circuit board 26 does not have to transmit any forces acting perpendicularly to the plane of the printed circuit board. This effectively prevents, for example, an undesired swinging open of the printed circuit board 26 during later operation, which advantageously improves the reliability and durability of the light module 16 during later operation of the light module 16 in the motor vehicle headlight 10 .
  • the clamping force is increased by finally tightening the screws with which the clamping element assembly 30 is fastened to the screw bosses 289 of the central support element 28 .

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Lighting Device Outwards From Vehicle And Optical Signal (AREA)
  • Projection Apparatus (AREA)

Claims (10)

  1. Procédé de montage d'une carte de circuits imprimés (26) portant une puce DMD (22) dans un module lumineux à DMD (16) pour un phare de véhicule automobile (10), comprenant les étapes suivantes:
    - fabrication (500) d'un module partiel du module lumineux (16) présentant la carte de circuits imprimés (26), un élément de support central (28) et un ensemble élément de serrage (30), l'élément de support central (28) présentant une fenêtre d'élément de support (286) et étant relié de manière élastique à l'ensemble élément de serrage (30) et la puce DMD (22) étant disposée et maintenue dans un socle (266) de la carte de circuits imprimés (26), la puce DMD (22) étant maintenue de manière à être serrée à force entre un cadre de la fenêtre d'élément de support (286) et l'ensemble élément de serrage (30) par une force de pression, caractérisé par les étapes suivantes: maintien mobile de la puce DMD (22) dans un plan parallèle au plan de carte de circuits imprimés à l'encontre de la résistance d'une force de frottement résultant de la force de pression qui serre,
    - définition (502) d'un référentiel pour l'emplacement et la position de la puce DMD (22) par rapport à l'élément de support central (28) en insérant le module partiel dans un dispositif d'alignement (400) qui présente une pince (410) pouvant être commandée de manière à être mobile par un actionneur (412), une caméra (406) produisant des signaux d'image et un appareil de commande (408) traitant des signaux d'image de la caméra (40&) en signaux de réglage pour l'actionneur (412),
    - saisie (504) de la carte de circuits imprimés (26) avec la pince (410),
    - réception (506) d'au moins une image d'au moins une caractéristique d'emplacement et/ou d'au moins une caractéristique de position de la puce DMD (22) dans le dispositif d'alignement (400) à travers la fenêtre d'élément de support (286),
    - calcul (508) de l'emplacement et de la position de la puce DMD (26) dans le référentiel du dispositif d'alignement (400) en fonction de signaux d'image de la caméra (406),
    - commande (510) de la position de la pince (410) en fonction d'un écart entre l'emplacement et la position de la puce DMD (26) et un emplacement de consigne et une position de consigne, de sorte que la puce DMD (26) occupe la position de consigne et l'emplacement de consigne, et
    - (512) fixation de la puce DMD (26) dans l'élément de support central (28) lorsque la position de consigne et l'emplacement de consigne sont atteints.
  2. Procédé selon la revendication 1, caractérisé en ce que la force de pression est générée par un élément de liaison élastique (32) de l'ensemble élément de serrage (30) en tant que force de rappel d'une déformation élastique que l'élément de liaison élastique (32) subit lors de l'assemblage du module lumineux (16).
  3. Procédé selon la revendication 1 ou 2, caractérisé en ce que le traitement d'image est effectué de sorte que l'emplacement et le tracé d'au moins un bord extérieur (225) d'une surface réfléchissante de l'agencement des micro-miroirs (222) sont déterminés.
  4. Procédé selon l'une des revendications précédentes, caractérisé en ce que la fixation est effectuée par des liaisons adhésives (36).
  5. Procédé selon la revendication 4, caractérisé en ce que la carte de circuits imprimés (26) est collée de manière flottante à l'élément de support central (28) à l'état aligné.
  6. Procédé selon la revendication 5, caractérisé en ce que des évidements (268) disposés dans la carte de circuits imprimés (26) et auxquels sont opposés des logements (288) de l'élément de support central (28) sont remplis d'un adhésif visqueux, l'adhésif pénétrant également entre les bords des évidements (268) et les logements (288) .
  7. Procédé selon la revendication 5 ou 6, caractérisé en ce que des liaisons adhésives (36) entre la carte de circuits imprimés (26) et l'élément de support central (28) sont irradiées par une lumière ultraviolette pendant une durée comprise entre 15 s et 30 s.
  8. Procédé selon la revendication 7, caractérisé en ce que les liaisons adhésives (36) sont durcies de manière ferme à température élevée chronologiquement après l'irradiation par une lumière ultraviolette.
  9. Procédé selon l'une des revendications 3 à 8, caractérisé en ce que la fixation est effectuée en complément par un renforcement de la force de pression avec laquelle la puce DMD (22) est maintenue de manière à être serrée.
  10. Procédé selon la revendication 9, caractérisé en ce que le renforcement de la force de serrage est effectué par serrage ferme de vis avec lesquelles l'ensemble élément de serrage (30) est fixé à des dômes pour vis (289) de l'élément de support central (28).
EP19177675.6A 2018-06-07 2019-05-31 Procédé de montage et d'ajustement d'une puce dmd dans un module lumineux pour un projecteur de véhicule automobile Active EP3578875B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102018113561.0A DE102018113561B4 (de) 2018-06-07 2018-06-07 Verfahren zum Montieren und Justieren eines DMD-Chips in einem Lichtmodul für einen Kraftfahrzeugscheinwerfer

Publications (2)

Publication Number Publication Date
EP3578875A1 EP3578875A1 (fr) 2019-12-11
EP3578875B1 true EP3578875B1 (fr) 2023-03-08

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DE102018113561B4 (de) 2023-08-10
EP3578875A1 (fr) 2019-12-11

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