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EP3578875A1 - Procédé de montage et d'ajustement d'une puce dmd dans un module lumineux pour un projecteur de véhicule automobile - Google Patents

Procédé de montage et d'ajustement d'une puce dmd dans un module lumineux pour un projecteur de véhicule automobile Download PDF

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Publication number
EP3578875A1
EP3578875A1 EP19177675.6A EP19177675A EP3578875A1 EP 3578875 A1 EP3578875 A1 EP 3578875A1 EP 19177675 A EP19177675 A EP 19177675A EP 3578875 A1 EP3578875 A1 EP 3578875A1
Authority
EP
European Patent Office
Prior art keywords
dmd chip
circuit board
dmd
carrier element
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19177675.6A
Other languages
German (de)
English (en)
Other versions
EP3578875B1 (fr
Inventor
Anton Jost
Ralf Chor
Uwe BREITENBACH
Tino Schlischo
Tobias Moeller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marelli Automotive Lighting Reutlingen Germany GmbH
Original Assignee
Automotive Lighting Reutlingen GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Automotive Lighting Reutlingen GmbH filed Critical Automotive Lighting Reutlingen GmbH
Publication of EP3578875A1 publication Critical patent/EP3578875A1/fr
Application granted granted Critical
Publication of EP3578875B1 publication Critical patent/EP3578875B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/60—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution
    • F21S41/67—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on reflectors
    • F21S41/675—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on reflectors by moving reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/39—Attachment thereof

Definitions

  • the present application relates to a method for mounting a DMD chip-carrying printed circuit board in a DMD (Digital Mirror Device) light module for a motor vehicle headlight.
  • a DMD Digital Mirror Device
  • Such a light module is from the DE 198 22 142 C2 known.
  • the light module emits a light beam having a main emission direction.
  • the radiation takes place in a lying in front of the motor vehicle headlight area so that it is illuminated.
  • a front side refers to a side facing this room area.
  • a back side is in each case a side facing away from this room area.
  • the known light module has a printed circuit board, the has a front and a back and carries on its front a DMD chip.
  • the DMD chip has a micromirror-bearing front side and a rear side opposite its front side.
  • the known light module furthermore has a central carrier element which has a front side and a rear side.
  • Available DMD chips can have a large number (greater than one million) of micromirrors.
  • Each individual micromirror is, for example, only 8 by 8 microns in size.
  • One position of each individual micromirror can be switched between two positions. In one position, it reflects incident light from a light source via a primary optic to a secondary optic of the light module, and in the other position reflects the light, for example, onto an absorber.
  • the secondary optics form the arrangement of the micromirrors in the apron of the light module, which is in the case of a motor vehicle headlight, for example, on the roadway from.
  • Micro mirrors that reflect light onto the secondary optics appear as bright pixels in the light distribution resulting from the image, whereas the micromirrors that reflect light onto the absorber appear as dark pixels in the light distribution.
  • the shape of the light distribution with a predetermined by the number of pixels and thus by the number of micromirrors fineness is controllable, which allows, for example, camera-controlled light distributions in which areas that would dazzle other road users, can be specifically darkened and Other areas, such as traffic signs or pedestrians, are specifically illuminated so that they are recognized by the driver.
  • a common method for mounting a DMD chip-carrying circuit board in a light module of a motor vehicle headlight provides an adjustment of the mounting position of the chip with a pin slot structure.
  • chip and board have mutually complementary form-fitting elements such as pins and, holes and slots.
  • This type of alignment of a DMD chip on a printed circuit board of a light module is not accurate enough for use in automotive headlamps. It may, for example, cause the motor vehicle headlight to produce undesired tilted light distributions. For example, it may happen that an oblique light-dark boundary is generated instead of a light-dark boundary parallel to the horizon.
  • the object of the invention is to provide an improved method of the type mentioned.
  • the clamping force acting in this case lies in a defined by the deformation of the elastic element Anpresskraft Scotland Symposium.
  • the contact pressure in the assembled state is preferably between 40 N and 80 N.
  • a preferred embodiment is characterized in that the pressing force is generated by an elastic connecting element of the clamping element assembly as a restoring force of an elastic deformation, which experiences the elastic connecting element during assembly of the light module.
  • the image processing takes place in such a way that the position and the course of at least one outer edge of the reflecting surface of the arrangement of the micromirrors are determined
  • fixation is effected by adhesive bonds.
  • a further preferred embodiment is characterized in that the printed circuit board is glued floating in the aligned state with the central carrier element.
  • circuit board 26 arranged recesses, which are opposite receptacles of the central support member, filled with a viscous adhesive, wherein the adhesive also penetrates between the edges of the recesses and the receptacles.
  • the adhesive bonds 36 be irradiated with ultraviolet light for a period between 15 seconds and 30 seconds.
  • a further preferred embodiment is characterized in that the adhesive bonds are cured end-time after the irradiation with ultraviolet light at elevated temperature.
  • fixation is complementarily by an increase in the contact pressure with which the DMD chip is held clamped.
  • the reinforcement of the clamping force takes place by tightening screws with which the clamping element assembly is fastened to screw domes of the central carrier element.
  • FIG. 1 shows in detail a sectional view of a motor vehicle headlight 10 with a housing 12, the light exit opening is covered by a transparent cover 14.
  • the cutting plane is at a proper use of the motor vehicle headlight 10 in a motor vehicle parallel to a plane which is spanned by a longitudinal axis and a vertical axis of the motor vehicle.
  • a light module 16 In the interior of the housing 12, a light module 16 is arranged.
  • the light module 16 has, among other things Light source 18, a primary optics 20, a DMD chip 22, a secondary optics 24 and an absorber 25 on.
  • the light module 16 furthermore has a printed circuit board 26, a central carrier element 28 and a clamping element assembly 30.
  • the clamping element assembly 30 has a punch 302 and an elastic connecting element 32.
  • the tensioner assembly may also include a heat sink 304.
  • the printed circuit board 26, together with the central carrier element 28, the DMD chip 22 and the clamping element assembly 30 forms a partial module of the light module.
  • the printed circuit board 26 has a front side 260, a back side 262 and a printed circuit board window 264 and carries on its front side 260 the DMD chip 22.
  • the DMD chip 22 has a micromirror 222-bearing front side 224 and a rear side 226 opposite its front side 226.
  • the central carrier element 28 has a front side 282, a rear side 284 and a carrier element window 286.
  • the printed circuit board 26 is arranged with its front side 260 facing the rear side 284 of the central carrier element 28 such that the front side 224 of the DMD chip 22 covers the carrier element window 286, wherein the micromirrors 222 are arranged in the opening of the carrier element window 286.
  • An opening of the circuit board window 264 is completely or partially covered by the rear side 226 of the DMD chip 22.
  • the clamping element assembly 30 has a punch 302, which is supported by the PCB window 264 on the back 226 of the DMD chip 22. Incidentally, that is, with the heat sink 304 of the clamping element assembly 30, which is not projecting through the printed circuit board window 264 between the printed circuit board 26 and the central support element 28, the clamping element assembly 30 is disposed on the back 262 of the printed circuit board 26.
  • the elastic connecting element 32 has at least one clamping element assembly-side end 322 and at least one carrier element-side end 324.
  • the elastic connecting element 32 With its clamping element assembly side end 322, the elastic connecting element 32 is rigidly connected to the arranged on the back 262 of the circuit board 26 remaining part of the clamping element assembly 30 having, for example, a heat sink 304.
  • the elastic connecting element 32 With its carrier element-side end 324, the elastic connecting element 32 is rigidly connected to the central support element 28.
  • the light source 18 is a semiconductor light source 182 which is arranged on a circuit board 35 and which emits light 34 in the direction of the primary optics 20.
  • the primary optic 20 directs the light 34 incident from the semiconductor light source 182 onto the micromirrors 222 arranged on the front side 224 of the DMD chip 22. How and with which optical elements of the primary optics 20 this is done in detail is not essential to the invention. In the case of FIG. 1 the primary optics 20 is a concave mirror reflector.
  • a pivotal position of the micromirrors 222 is individual for each micromirror or at least for different groups (subsets) of the micromirrors 222 between a first pivotal position and a second pivotal position switchable.
  • Each micromirror which is in the first pivot position, deflects the light 34 incident on it from the primary optics 20 to the secondary optics 24.
  • Each micromirror which is located in the second pivot position, deflects the light 34 incident on it from the primary optics 20 so that this light 342 does not fall on the secondary optics 24. For example, this light 342 is directed to the absorber 25 and absorbed there, so that it can not produce any disturbing light effects.
  • the secondary optics 24 directs the light 34 incident on them from the DMD chip 22 into the apron of the light module 16. When the light module 16 is used as intended, this light 34 illuminates the road ahead of the motor vehicle.
  • the secondary optics 24 has a secondary optic lens 242 of transparent plastic or glass.
  • the secondary optics 24 may also have a plurality of lenses, for example an arrangement of an achromatic lens and an imaging lens.
  • the DMD chip 22 has two broad sides in the form of the front side 224 and the rear side 226, the front side 224 and the rear side 226 being separated from one another by lateral narrow sides 228 lying between them.
  • the front side 224 of the DMD chip 22 has a central chip area, in which the micromirrors 222 are arranged, and has a flange area 229, which circumscribes the central chip area in a closed curve, in which no micromirrors 222 are arranged.
  • the number of micromirrors is about 1.3 million, arranged in a matrix of 1152 columns and 1152 rows.
  • FIG. 2 also shows that the DMD chip 22 is disposed in a socket 266 of the circuit board 26 and held.
  • the mechanical support of the DMD chip 22 in the base 266 via the lateral narrow sides 228 and possibly additionally on parts of the back 226 of the DMD chip 22, and the electrical contacting is also via the lateral narrow sides 228 and / or on the Rear side 226 of the DMD chip 22 from the circuit board 26 from.
  • the printed circuit board 26 is fixedly connected to the central support element 28.
  • the compound is preferably carried out in the FIG. 1 illustrated adhesive connections 36.
  • the circuit board 26 exerts no perpendicular to the surface of the circuit board 26 and the front side 224 of the DMD chip 22 acting contact force. However, the circuit board 26 holds the DMD chip 22 with its socket 266 in tangential to the front side 224 of the DMD chip 22 and the circuit board 26 lying directions.
  • Said pressing force is generated by the elastic member 32 as a restoring force of elastic deformation which the elastic connecting member 32 undergoes during assembly of the light module 16.
  • This contact force is transmitted from the punch 302 to the back of the DMD chip 22 and presses the flange portion 229 of the DMD chip 22 against the back of the central support member 28th
  • a leaf spring 326 serving as an elastic connecting element 32 is rigidly connected with its carrier element-side end 324 to the central carrier element 28.
  • the central support element 28 has screw domes 289, which protrude from the back 284 of the central support member 28. On their ends remote from the rear side 284, the screw domes 289 have receptacles for the carrier element-side ends 324 of the leaf spring 326.
  • the leaf spring 326 With its clamping element assembly-side end 322, the leaf spring 326 is non-positively and / or positively connected to the lying on the back 262 of the circuit board 26 remaining part of the clamping element assembly 30, which may be a heat sink 304. In the FIG. 1 this connection is made by interlocking elements 306 of the clamping element assembly 30, which prevent the clamping element assembly-side end 322 of the leaf spring 326 from moving toward the printed circuit board 26.
  • the elastic connecting element 32 is first deformed to a first extent, in which it generates the certain contact force.
  • the pressing force is adjusted so that the circuit board 26 is initially floating relative to the receptacles 288 of the central support member 28 in the circuit board plane.
  • the circuit board 26 according to the invention with the aid of a camera and image processing-based alignment device together with the fixed in the base 266 of the PCB 26 DMD chip 22 aligned so that the directions in which the micromirrors 222 from the primary optics 20 ago reflect incident light 34 corresponds to the desired desired directions.
  • the circuit board 26 is glued with the adhesive bonds 36 with the receptacles 288 of the central support member 28 stress-free. Only then are the screw, with which the leaf spring 326 with the screw domes 289th is screwed, finally tightened.
  • the elastic connecting member 32 is deformed in total to a second extent, which is larger than the first extent. Therefore, the restoring force and thus the contact pressure at endfest tightened screws is greater than before.
  • FIG. 3 shows an appropriate for carrying out a method according to the invention alignment device 400.
  • the evaluation device 400 has a continuous and rigid frame 402, which forms a reference frame for the alignment of the circuit board with the DMD chip.
  • the central support element 28 is in the alignment by accurately produced positive or negative positive locking elements 404 such as corners, edges or pins or recesses of the central support member 28, which in each case negatively or positively complementary positive locking elements 404 'of the rigid framework or one with the rigid framework dimensionally accurate engage associated tool carrier, held in a precisely defined within the frame reference position and location. This is in the FIG. 3 by representing the pair of lines connecting the central support member 28 to the rigid framework 402.
  • the central carrier element 28 is inserted directly into a correspondingly precise and accurately manufactured part of the framework 402.
  • the central support member 28 is received by a portable tool carrier, with which the central support member 28 and mounted thereon further components of the light module are transported from processing station to processing station.
  • a tool carrier is with respect to its inclusion by the framework 402 and in With respect to its receptacle for the central support element manufactured so dimensionally accurate that the central support member 28 is held in this embodiment in a precisely predetermined position and position within the reference frame.
  • position refers to a translational coordinate in said reference frame.
  • posture refers to a rotational angle in said reference frame.
  • the alignment device 400 has a camera 406.
  • the camera 406 captures images of the DMD chip 22 in the board plane or a plane parallel thereto, and simultaneously captures images of fiducial marks 405 of the tool carrier and / or the central support member 28.
  • fiducial 405 may be, for example, an edge of the support member window 286 .
  • the camera 406 is preferably arranged to face the front side 282 of the central support member 28 and to receive images of the front side 224 of the DMD chip 22 through the support member window 286.
  • FIG. 3 also shows that the printed circuit board 26 has recesses 268, and that the central support element 28 has receptacles 288 in the form of flat regions at its locations adjacent to the recesses 268 of the printed circuit board 26. These flat areas project beyond the recesses 268 parallel to the planes in which the recesses 268 lie.
  • the recesses 268 preferably have a clear width, which is between 5 mm and 10 mm. Between the edges of the recesses 268 and the receptacles 288 in the assembled state is preferably a narrow gap whose thickness is preferably smaller or equal to 1 mm.
  • the receptacles 288 therefore preferably do not touch the edges of the recesses 268. These structures serve to produce the adhesive bonds 36 (cf. Figure. 1 ).
  • the alignment device 400 has a control unit 408, which is set up, in particular programmed to evaluate the images captured by the camera 406 with the aid of an image processing program.
  • the evaluation is preferably carried out such that the position and the course of at least one outer edge 225 of the reflecting surface of the arrangement of the micromirrors 222 (cf. FIG. 2 ).
  • the controller 408 thus determines quantitative values for the position and angle of rotation of the DMD chip 22 in the reference system.
  • the alignment device 400 has a gripper 410.
  • a base of the gripper 410 is rigidly connected to at least one actuator 412, with which the gripper 410 is movable parallel to an xy plane of the reference system of the alignment device 400 and with which it is rotatable about a rotation axis parallel to the z-direction and with the Opening and closing the gripper 410, ie the gripping is driven.
  • the actuator 412 is controlled by the controller 408 in response to the position information and / or rotational angle information that the controller generates from the signals of the camera 406.
  • FIG. 4 shows a flowchart as an embodiment of a method according to the invention for mounting a DMD chip 22-bearing circuit board 26 in a DMD light module 16 for a motor vehicle headlight 10.
  • a partial module of the light module 16 having the printed circuit board 26, a central carrier element 28 and a clamping element assembly 30, as shown in FIG FIG. 1 is shown prepared.
  • the central carrier element 28 of this sub-module has a carrier element window 286 and is elastically connected to the clamping element assembly 30.
  • the DMD chip 22 between a frame of the carrier element window 286 and the clamping element assembly 30 is frictionally clamped and thereby held movable in a plane parallel to the circuit board plane against the resistance of a force resulting from the clamping force frictional force.
  • a reference system for the position and position of the DMD chip 22 relative to the central support element 28 is determined.
  • the setting is made by inserting the sub-module in an alignment device 400, as described with reference to the FIG. 3 and comprising a gripper 410 movably controllable by an actuator 412, a video signal generating camera 406, and an image signal of the camera 406 to control signals to the actuator 412 processing control unit 408
  • a third step 504 the circuit board 26 is gripped with the gripper 410 of the alignment device 400.
  • the position and position of the circuit board 26 with the DMD chip 22 are the controller 408 then known.
  • a fourth step 506 at least one image of at least one position feature and / or at least one position feature of the DMD chip 22 is recorded in the alignment device 400 through the carrier element window 286 therethrough.
  • a fifth step 508 the position and position of the DMD chip 22 are calculated in the reference system of the alignment device 400 in response to signals from the camera 406 and a formation of drive signals with which the controller 408 controls the gripper 410 in a sixth step.
  • the control signals are each formed so that the gripper 410 sets the desired position and desired position of the circuit board 26 with the DMD chip 22 by the circuit board 26 is rotated by the gripper 410 and moved in translation accordingly.
  • the control of the position of the gripper 410 in response to a deviation of the position and position of the DMD chip 26 from a desired position and desired position takes place in a sixth step 510 such that the DMD chip (26) the desired position and desired position occupies.
  • the clamping support of the DMD chip 22 between its abutment against the frame of the carrier element window 286 and the punch 302 of the clamping element assembly 30 allows these movements and sets them only one by the drive of the gripper 410 overcome frictional resistance.
  • a seventh step 512 the position and location of the DMD chip 22 in the central support member 28 is further propagated, i. over the already existing clamping bracket out, fixed when the target position and target position is reached.
  • this is done both by adhesive bonds 36 as well as by an amplification of the clamping force with which the DMD chip 22 is clamped.
  • the adhesive bonds 36 are the Recesses 268 filled with a viscous adhesive, the adhesive may preferably between the edges of the recesses 268 and the receptacles 288 may penetrate.
  • the adhesive is preferably of a variety that cures rapidly upon exposure to ultraviolet light.
  • the adhesive bonds 36 are preferably irradiated with ultraviolet light for a period between 15 seconds and 30 seconds.
  • the circuit board 26 is glued floating in the aligned state with the central support member 28.
  • the printed circuit board 26 does not have to transmit any forces acting perpendicular to the printed circuit board plane. As a result, for example, an undesired swinging up of the printed circuit board 26 during subsequent operation is effectively avoided, which advantageously improves the reliability and the durability of the light module 16 during later operation of the light module 16 in the motor vehicle headlight 10.
  • the reinforcement of the clamping force is carried out by endfestes tightening the screws with which the clamping element assembly 30 is attached to the screw domes 289 of the central support member 28.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Lighting Device Outwards From Vehicle And Optical Signal (AREA)
  • Projection Apparatus (AREA)
EP19177675.6A 2018-06-07 2019-05-31 Procédé de montage et d'ajustement d'une puce dmd dans un module lumineux pour un projecteur de véhicule automobile Active EP3578875B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102018113561.0A DE102018113561B4 (de) 2018-06-07 2018-06-07 Verfahren zum Montieren und Justieren eines DMD-Chips in einem Lichtmodul für einen Kraftfahrzeugscheinwerfer

Publications (2)

Publication Number Publication Date
EP3578875A1 true EP3578875A1 (fr) 2019-12-11
EP3578875B1 EP3578875B1 (fr) 2023-03-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP19177675.6A Active EP3578875B1 (fr) 2018-06-07 2019-05-31 Procédé de montage et d'ajustement d'une puce dmd dans un module lumineux pour un projecteur de véhicule automobile

Country Status (2)

Country Link
EP (1) EP3578875B1 (fr)
DE (1) DE102018113561B4 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114061909A (zh) * 2021-10-29 2022-02-18 歌尔光学科技有限公司 用于测试光机模组的连接装置和光机模组的测试系统

Citations (9)

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Publication number Priority date Publication date Assignee Title
DE19822142C2 (de) 1998-05-16 2000-08-17 Bosch Gmbh Robert Verfahren und Vorrichtung zum Erzeugen eines vor einem Kraftfahrzeug auf die Fahrbahn auftreffenden Lichtbündels
CN102809879A (zh) * 2011-05-31 2012-12-05 中强光电股份有限公司 投影装置
EP2693108A1 (fr) * 2012-08-03 2014-02-05 Automotive Lighting Reutlingen GmbH Module d'éclairage et procédé de fabrication d'un module d'éclairage
DE102014217714A1 (de) * 2014-09-04 2016-03-10 Osram Gmbh Bestrahlungsvorrichtung mit optoelektronischer Strahlungseinheit
JP2016091976A (ja) * 2014-11-11 2016-05-23 株式会社小糸製作所 車両用灯具
WO2016094913A1 (fr) * 2014-12-17 2016-06-23 A.B. Mikroelektronik Gesellschaft Mit Beschränkter Haftung Procédé de fabrication d'un support de circuit et support de circuit
DE102015207709A1 (de) * 2015-04-27 2016-10-27 Automotive Lighting Reutlingen Gmbh Verfahren und Vorrichtung zur Anordnung eines Schaltungsträgers mit einer Halbleiterlichtquelle in einer bestimmten Lage relativ zu einem optischen System einer Beleuchtungseinrichtung
WO2017143372A1 (fr) * 2016-02-24 2017-08-31 Zkw Group Gmbh Dispositif de support d'un composant électrique
US20170255006A1 (en) * 2016-10-31 2017-09-07 Hisense Co., Ltd. Dmd assembly, dlp optical engine and dlp projection device

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Publication number Priority date Publication date Assignee Title
AT513362B1 (de) 2012-08-23 2014-06-15 Zizala Lichtsysteme Gmbh Verfahren zum Positionieren eines Licht formenden Körpers
AT518344B1 (de) 2016-03-03 2019-02-15 Zkw Group Gmbh Bauteilgehäuse eines Fahrzeugscheinwerfers
DE102016108260A1 (de) 2016-05-04 2017-11-09 Automotive Lighting Reutlingen Gmbh Verfahren zur Anordnung eines Schaltungsträgers und Vorrichtung zur Anordnung eines Schaltungsträgers

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19822142C2 (de) 1998-05-16 2000-08-17 Bosch Gmbh Robert Verfahren und Vorrichtung zum Erzeugen eines vor einem Kraftfahrzeug auf die Fahrbahn auftreffenden Lichtbündels
CN102809879A (zh) * 2011-05-31 2012-12-05 中强光电股份有限公司 投影装置
EP2693108A1 (fr) * 2012-08-03 2014-02-05 Automotive Lighting Reutlingen GmbH Module d'éclairage et procédé de fabrication d'un module d'éclairage
DE102014217714A1 (de) * 2014-09-04 2016-03-10 Osram Gmbh Bestrahlungsvorrichtung mit optoelektronischer Strahlungseinheit
JP2016091976A (ja) * 2014-11-11 2016-05-23 株式会社小糸製作所 車両用灯具
WO2016094913A1 (fr) * 2014-12-17 2016-06-23 A.B. Mikroelektronik Gesellschaft Mit Beschränkter Haftung Procédé de fabrication d'un support de circuit et support de circuit
DE102015207709A1 (de) * 2015-04-27 2016-10-27 Automotive Lighting Reutlingen Gmbh Verfahren und Vorrichtung zur Anordnung eines Schaltungsträgers mit einer Halbleiterlichtquelle in einer bestimmten Lage relativ zu einem optischen System einer Beleuchtungseinrichtung
WO2017143372A1 (fr) * 2016-02-24 2017-08-31 Zkw Group Gmbh Dispositif de support d'un composant électrique
US20170255006A1 (en) * 2016-10-31 2017-09-07 Hisense Co., Ltd. Dmd assembly, dlp optical engine and dlp projection device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114061909A (zh) * 2021-10-29 2022-02-18 歌尔光学科技有限公司 用于测试光机模组的连接装置和光机模组的测试系统

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Publication number Publication date
EP3578875B1 (fr) 2023-03-08
DE102018113561A1 (de) 2019-12-12
DE102018113561B4 (de) 2023-08-10

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