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EP1309994A2 - Composant electronique organique encapsule, son procede de production et son utilisation - Google Patents

Composant electronique organique encapsule, son procede de production et son utilisation

Info

Publication number
EP1309994A2
EP1309994A2 EP01962659A EP01962659A EP1309994A2 EP 1309994 A2 EP1309994 A2 EP 1309994A2 EP 01962659 A EP01962659 A EP 01962659A EP 01962659 A EP01962659 A EP 01962659A EP 1309994 A2 EP1309994 A2 EP 1309994A2
Authority
EP
European Patent Office
Prior art keywords
layer
electronic circuit
circuit according
barrier
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01962659A
Other languages
German (de)
English (en)
Inventor
Wolfgang Clemens
Adolf Bernds
Henning Rost
Walter Fix
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PolyIC GmbH and Co KG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10120685A external-priority patent/DE10120685C1/de
Priority claimed from DE10120687A external-priority patent/DE10120687A1/de
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP1309994A2 publication Critical patent/EP1309994A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/0773—Physical layout of the record carrier the record carrier comprising means to protect itself against external heat sources
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
    • H10K19/901—Assemblies of multiple devices comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates

Definitions

  • Encapsulated organic-electronic component process for its production and its use
  • the present invention relates to an electronic circuit made of organic material, in particular hermetically sealed against light and / or air and / or water, a method for its production and its use as a tag, sensor or the like.
  • Radio frequency ident tags are currently being built with metallic coils and a silicon chip. They are used, for example, for logistics purposes, access controls or the like.
  • a simple encapsulation of an organic field effect transistor is known from DE 100 40 442.1.
  • Tags should be as passive as possible, i.e. without battery, work. They derive their energy from a coil, which is triggered by a reader in resonance. In this case, a memory is activated in an electronic chip of the tag and, for example, stored information, such as the sender and addressee in logistics applications, is read out.
  • the range between the reader and the day is determined by the power of the radiation from the reader, these are certain frequency ranges, such as 125 kHz or
  • this range is typically less than 60 cm.
  • the structure of the coil depends strongly on the carrier frequency used, for example, a coil is wound at a frequency of 125 kHz
  • Organic electronic circuits can be manufactured very inexpensively. They are therefore suitable for building tags, which can therefore be used for the mass markets and as single-use products. One also thinks of electronic tickets, theft protection, baggage control or, for example, electronic stamps, electronic watermarks and much more.
  • Organic materials are very sensitive to environmental influences such as light, air and water and age relatively quickly under this influence.
  • antennas manufactured in polymer technology or at all in printing technology are significantly worse than metallic antennas. They have a higher electrical resistance and a lower quality. This means that such electronic components and tags based on organic materials have a short lifespan and are only suitable for a very short range.
  • OLEDs organic light-emitting diodes
  • Glass is currently used here as a substrate and a glass plate is also glued over the components, so that a fairly good hermetic encapsulation is guaranteed.
  • Conventional organic substrates are permeable to light, air and water and are therefore not suitable.
  • Metallized substrates such as those used for example in the food packaging sector or in the airtight packaging of sensitive materials, are obviously also out of the question, especially with RFID tags, since the metal layer in the S ubstrat prevents coupling of the coil to the reader. A Faraday cage or a metallic shield is created.
  • the electronic circuit should be simple and inexpensive to manufacture, so that tags made from it can be used for mass markets and as disposable products and in particular can be combined with coils and antennas without metallic shielding occurring.
  • the present invention relates to an electronic circuit comprising electronic components made in particular from organic material, the component (s) being / being arranged between at least two layers (2, 2 ') forming a barrier and of these against the influence of light and / or Air and / or a liquid such as water are protected.
  • This hermetic sealing or encapsulation is achieved by using materials that form the largest possible barrier against environmental influences such as light, air and water.
  • the circuit is arranged or built up on such a layer in a conventional manner, preferably using printing techniques.
  • Another identical or functionally similar layer is arranged over the circuit by gluing or lamination, so that the organic circuit is encapsulated in a similarly good manner as described above for the OLEDs. It is only necessary to ensure that electrical contact points are freely accessible from the circuit.
  • the barrier layer preferably comprises at least one layer of plastic film, for example organic polymer such as polymer lyvinylphenol, polymethyl methacrylate, polysulfone, polycarbonate, polyether ketone, polyethylene terephthalate, polyethylene, polyimide or any mixture of these polymers.
  • organic polymer such as polymer lyvinylphenol, polymethyl methacrylate, polysulfone, polycarbonate, polyether ketone, polyethylene terephthalate, polyethylene, polyimide or any mixture of these polymers.
  • the upper barrier layer forms a cover layer of an organic field-effect transistor (OFETs), which can also be a type of substrate or flexible film substrate, in one embodiment a gate electrode being located on this substrate or carrier is applied to the components with the barrier layer.
  • OFETs organic field-effect transistor
  • the gate electrode is applied to the upper substrate cover layer and preferably covered with an as yet uncrosslinked insulator.
  • a structure of substrate, drain and source electrode with a semiconducting layer and insulation layer is provided, in which the insulation layer is still not cross-linked.
  • Adjustment marks are again embedded in the two uncrosslinked insulation layers, so that the alignment marks allow simple and precise positioning of the superstructure (substrate with gate electrode and uncrosslinked isolator layer) on the substructure (substrate with source / drain electrode, semiconducting layer and uncrosslinked insulator layer) is possible.
  • the two superstructures are applied to one another, for example, by pressing on, pressing on, rolling on, etc.
  • the finished OFET is irradiated and / or annealed for a defined time.
  • Fixing rails, optical marks or crosses or the like are suitable as alignment marks.
  • a method for producing such an OFET comprises the following steps: at least one source and one drain electrode are formed on a carrier, which are coated with a semiconducting layer, on which a layer with an uncrosslinked insulator is applied; - On a second substrate, a gate electrode with an overlying layer of uncrosslinked insulator is applied and the two carriers are then brought together so that the two uncrosslinked insulator layers come to lie on one another and then the crosslinking of the insulator is initiated.
  • the above-mentioned plastic films can either serve themselves as a barrier layer, by appropriate doping or crosslinking, or can be provided with a barrier layer that forms a shield.
  • This separate barrier layer can be a metallic layer, for example, which is vapor-deposited or laminated onto the base film. Suitable metals are aluminum, copper or chrome.
  • the plastic film usually has a thickness between 10 and 100 ⁇ m, preferably 30-60 ⁇ m.
  • An applied metal layer is usually between 5 and 100 ⁇ m, preferably between 5 and 50 ⁇ m thick.
  • the barrier can also be formed by a non-metallic layer.
  • This non-metallic material should be selected so that it is light and / or water and / or traps or absorbs oxygen.
  • Suitable non-metallic coatings for forming a barrier against light, air and / or water are therefore, for example, layers of largely dense particles which are arranged to overlap as much as possible.
  • Suitable materials for this purpose form graphite or inorganic oxides with a platelet structure.
  • the barrier layer used for the encapsulation can comprise barrier layers of the same or different types.
  • the layer (s) forming the barrier can combine, for example, a metallic barrier coating and a non-metallic barrier coating.
  • the layer forming the barrier can therefore be a multi-layer system.
  • a suitable structure consists, for example, of a polyethylene terephthalate film which is coated with aluminum, a polyethylene terephthalate film being laminated onto the aluminum coating again.
  • the film substrate can be transparent but also completely opaque. An opaque film even has the advantage that harmful effects of light in organic electronics are prevented in an optimal way.
  • the electronic circuit designed in accordance with the invention can thus include all components that are essential for a circuit.
  • the active components are mainly encapsulated. These are primarily the integrated circuit, transistors, diodes and in particular rectifier diodes or similar active components.
  • the active components are preferably at least partially made of organic material.
  • organic material here encompasses all types of organic, organometallic and / or inorganic
  • Plastics that are called “plastics” in English. It deals with all types of fabrics Except for the semiconductors that form the classic diodes (germanium, silicon) and the typical metallic conductors. A restriction in the dogmatic sense to organic material as carbon-containing material is therefore not provided, but rather the widespread use of, for example, silicones , Furthermore, the term should not be subject to any restriction with regard to the molecular size, in particular to polymeric and / or oligomeric materials, but the use of "s all olecules" is also entirely possible.
  • the passive components such as resistors, capacitors, coils can also be included in the electronic circuit according to the invention. Only the sensitive components such as the organic integrated circuit itself can be contained just as well, and other parts, such as, for example, a rectifier diode, which can then still be produced using conventional silicon technology, can be located outside.
  • the electronic encapsulated circuit according to the invention can be used not only for tags but also wherever a metallized substrate is not an obstacle to use, for example also with sensors or other electronic components that can be implemented with organic electronics.
  • metal layers can also be integrated into the corresponding circuit, for example by means of suitable structuring as electrical conductors or as passive components such as capacitors, coils, resistors.
  • the invention accordingly also relates to a method for producing an electronic circuit, comprising electronic components made in particular from organic material, with the following steps: Building a layer forming a barrier, arranging electronic components to form an electronic circuit on the barrier layer,
  • At least one further barrier layer over at least partially the electronic components to seal them against light and / or air and / or water.
  • the electronic circuit can be as simple as
  • Tag or sensor can be formed and the inventive method can be used for this.
  • Fig. 1 shows an encapsulated electronic circuit according to the invention in section
  • Fig. 2 shows the electronic circuit shown in Fig. 1 in a schematic plan view
  • Fig. 4 is a preferred embodiment of the combination of an electronic circuit according to the invention with a coil
  • FIG. 1 shows an electronic circuit 1 according to the invention, which comprises electronic components 3.
  • These electronic components 3 can be constructed entirely or partially from organic materials, that is to say conductive, semiconducting or non-conductive polymeric plastics.
  • the electronic components 3 are arranged on a layer 2 forming a barrier, which in the embodiment shown is multi-layered. As such, the electronic components 3 or chips can be glued to the layer 2 or held stationary thereon in some other way. However, they can also be formed directly thereon by suitable printing processes.
  • the layer 2 itself is made up of three layers 4, 5 and 6 in the embodiment shown.
  • the lowermost layer 4 is a plastic film suitable for the purposes of use, such as polyethylene, polyethylene terephthalate, polyimide or the like, flexible materials.
  • the second layer 5 is designed as the actual barrier layer. This is preferably a metallic layer made of aluminum, copper or chromium, which is either laminated onto the layer 4 as a film or has been vapor-deposited thereon. As already mentioned, the barrier layer can also consist of a non-metallic substrate.
  • Another layer 6 in the form of a plastic film is glued or laminated over the barrier layer 5.
  • Electrical contacts 8 are formed or arranged on this layer 2 in addition to the electronic components 3. They serve to later connect the electronic circuit 1 to, for example, a coil or antenna, that is to say to set up, for example, an RFID tag.
  • the contacts 8 can consist of organic, conductive materials and can be applied, for example, to the film substrate in the printing process. the. Of course, metallic contacts, for example made of copper, can also be used. These contacts 8 are electrically conductively connected to predetermined ones of the electronic components 3 by lines 7.
  • a further barrier 2 ′ which has the same structure as the first layer 2, is hermetically sealed above the electronic components 3 and thus partly the lines 7.
  • it is again a multi-layer system consisting of two layers 4, 6 made of plastic film, between which a barrier layer 5 is arranged.
  • the materials for these layers can be selected from the same ones that can be used for the further layer 2.
  • glue or laminate on this second upper and covering or encapsulating barrier layer as such. It can be seen that the individual electronic components are completely enclosed by layers 2 and 2 'and are therefore optimally shielded from environmental influences.
  • FIG. 2 shows the structure of the electronic circuit 1 only in a top view, from which in particular the electrical connection to the contacts 8 lying outside the encapsulation is shown.
  • the electronics constructed in accordance with the invention are such that they can be attached as a kind of sticker with the exposed electrical contacts to a corresponding coil or antenna 9, 10.
  • the respective ends of the coil (Fig. 3a) and 3b)) or a rod-shaped antenna (Fig. 3c)) can be connected to the encapsulated electronics by simply sticking. The whole set-up results in a functioning day.
  • a further step in production is also saved which is generally necessary in the case of flat coils, namely the connection of the corresponding coil ends 14, 15 in a further plane. It is possible here to use antennas in the packaging industry, for example, by means of inexpensive printing processes, and in a final step the stickers corresponding to the electronics described above can be stuck on.
  • connection areas are quite large to allow easy adjustment. If the connections are standardized, the application can only take place at a later stage. In retail, every company could stick their own tags. With this construction, even a metallized surface of the entire electronics is not disruptive for the RF connection of the antenna, since this lies above the coil turns and not in the area enclosed by the coil.
  • the electronic circuit 1 according to the invention is equipped with an antenna 9, 10 in a particularly efficient and cost-saving manner combined.
  • An essential aspect here is that the “transponder circuit” is applied directly to the substrate of the antenna 9, 10.
  • a coil is generated on the metal layer 5 by a structuring method.
  • a metal layer is left, which then serves as a barrier or encapsulation. It is of course also conceivable to incorporate this metal layer directly into the circuit by appropriate structuring, for example as conductor tracks or as passive components. In this case, a multilayer system would be advantageous in which one layer can be used for encapsulation and one for use in the circuit.
  • the advantage of this structure is that the entire Ident Tag can be manufactured as an integrated system, which in particular reduces costs.
  • an antenna 9, 10 is formed on a barrier layer 2, which can be configured as described above, which antenna consists, for example, of a metal or a conductive polymer.
  • an electronic circuit 1 for example a silicon chip or a polymer chip, which is to be connected electronically at both ends 14, 15 of the antenna 9, 10.
  • the corner 13 of the layer 2 represented by a dotted line is folded over in such a way that the end 14 of the antenna comes to rest on the contact surface 12.
  • the electrical circuit 3 is connected to the antenna 9, 10 via the conductor tracks 7.
  • an insulation layer must be applied to the windings of the antenna 9, 10 before the folding.
  • This insulation layer can also be used as an adhesive serve to permanently fix the folded corner 13. This type of connection can save the previously usual method step, namely the additional application of a structured conductor track.
  • FIG. 5 there is an antenna 9, 10 on layer 2, as in FIG. 4.
  • An electronic circuit 3 is arranged outside the antenna 9, 10 in a corner 13 of layer 2. This corner 13 is then folded over so that the contact surface 8 comes to rest on the contacting surface 12 of the antenna 9, 10.
  • an insulation layer must be applied to the windings of the antenna 9, 10 before the folding. This insulation layer can also serve as an adhesive in order to permanently fix the folded corner 13.
  • the special feature of this embodiment is that the folding process on the one hand connects the electronic circuit 3 to the antenna 9, 10 and on the other hand encapsulates the electronic circuit 3, specifically by means of the substrate material, which must be suitably selected for this.
  • ITO indium tin oxide
  • the gate electrode 20 is embedded in a layer 21, for example of approximately 100 nm, of the uncrosslinked insulator material poly (4-hydroxystyrene) (PHS) with the crosslinker hexaethyloxyethylmelamine (HMMM).
  • the insulator material is still not crosslinked in this layer, but contains the components necessary for crosslinking (crosslinker, ie HMMM and a catalyst, eg camphorsulfonic acid (CSA).
  • the substructure 17 also has a substrate 19 with a structured layer 20 made of ITO, which forms the source and drain electrodes here.
  • the source / drain electrodes are embedded in a semiconducting layer 22, for example made of poly (3-octylthiophene) P30T, as the active semiconductor material.
  • An approximately 100 nm thick layer 21 of the insulator material PHS is likewise uncrosslinked on the semiconducting layer 22 and with the components necessary for crosslinking (crosslinker and catalyst).
  • the superstructure 16 and the substructure 17 are pressed onto one another (FIG. 7) in such a way that the two layers 21 come to lie on one another and connect to one another on the surface. Adjustment marks are used to adjust the source / drain and the gate electrode one above the other in the desired manner. In a final step, the entire assembly is annealed at 130 ° C for one hour and thus fixed.
  • the separate generation of the gate electrode on a second substrate, presented for the first time in this embodiment, and its adjustment on the substrate / source, drain electrode / semiconductor / insulator structure facilitates the construction of OFETs in that no structuring of the upper electrode (source / Drain or gate, depending on the structure) by photolithography, in which the lower organic layers are attacked and / or dissolved.
  • the OFET manufactured in this way is encapsulated and thus protected against mechanical damage and environmental influences.
  • the invention relates to an electronic circuit (1) comprising electronic components (3) made in particular of organic material, the component (s) being arranged between and against at least two layers (2, 2 *) forming a barrier the influence of light and / or air and / or water are protected.
  • Electronic circuits constructed in this way enable the generation of RFID ident tags in particular as mass articles.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Thin Film Transistor (AREA)

Abstract

L'invention concerne un circuit électronique (1) qui comprend des composants électroniques (3) constitués notamment d'une matière organique. Selon l'invention, les composants (3) sont placés entre au moins deux couches (2, 2') formant une barrière et sont protégés par ces couches de l'influence de la lumière, de l'air ou de l'eau. Les circuits électroniques ainsi conçus permettent la fabrication en série notamment de transpondeurs d'identification par fréquence radio (RFID).
EP01962659A 2000-08-18 2001-08-17 Composant electronique organique encapsule, son procede de production et son utilisation Withdrawn EP1309994A2 (fr)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
DE10040442 2000-08-18
DE10040442 2000-08-18
DE10120685A DE10120685C1 (de) 2001-04-27 2001-04-27 Anordnung eines organischen Feld-Effekt-Transistors mit Verkapselung und Verfahren zur Herstellung
DE10120687A DE10120687A1 (de) 2001-04-27 2001-04-27 Verkapseltes organisch-elektronisches Bauteil, Verfahren zu seiner Herstellung und seine Verwendung
DE10120685 2001-04-27
DE10120687 2001-04-27
PCT/DE2001/003164 WO2002015264A2 (fr) 2000-08-18 2001-08-17 Composant electronique organique encapsule, son procede de production et son utilisation

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EP1309994A2 true EP1309994A2 (fr) 2003-05-14

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US (1) US7875975B2 (fr)
EP (1) EP1309994A2 (fr)
JP (1) JP2004506985A (fr)
WO (1) WO2002015264A2 (fr)

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