Nothing Special   »   [go: up one dir, main page]

EP0009266A1 - Alliage à mémoire se prêtant au brasage et procédé de brasage de cet alliage à mémoire - Google Patents

Alliage à mémoire se prêtant au brasage et procédé de brasage de cet alliage à mémoire Download PDF

Info

Publication number
EP0009266A1
EP0009266A1 EP79200332A EP79200332A EP0009266A1 EP 0009266 A1 EP0009266 A1 EP 0009266A1 EP 79200332 A EP79200332 A EP 79200332A EP 79200332 A EP79200332 A EP 79200332A EP 0009266 A1 EP0009266 A1 EP 0009266A1
Authority
EP
European Patent Office
Prior art keywords
memory alloy
weight
aluminum
temperature
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP79200332A
Other languages
German (de)
English (en)
Inventor
Keith Dr. Melton
Olivier Dr. Mercier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
Original Assignee
BBC Brown Boveri AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland filed Critical BBC Brown Boveri AG Switzerland
Publication of EP0009266A1 publication Critical patent/EP0009266A1/fr
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/006—Resulting in heat recoverable alloys with a memory effect

Definitions

  • the invention relates to a solderable shape memory alloy according to the preamble of claim 1 and a method for brazing according to claim 4.
  • Shape memory alloys of the special brass type (Cu / Zn / Al system) are known (for example DE-OS 2 711 576; DE-OS 2 055 755; AT-PS 333 522).
  • alloys of this type are annealed between 600 ° C and 950 ° C in order to obtain the highest possible proportion of ⁇ -phase. They are then quenched to a critical temperature M S to obtain a metastable martensitic phase.
  • M S can be above or below room temperature.
  • the invention has for its object to provide a solderable shape memory alloy and an associated soldering process, wherein the memory effect on the finished assembled component can be fully utilized while avoiding complex process steps and devices.
  • the invention is intended, in particular, to avoid the grain growth of the memory alloy occurring with any heating and to effectively reduce its susceptibility to cracking.
  • the basic guiding principle of the invention is to use a braze, the flow temperature of which is sufficiently high above the annealing temperature of the memory alloy in order to meet the minimum requirements for dimensional stability and strength of the solder joint at the annealing temperature required ensure, and at the same time suppress their grain growth at high temperatures by choosing the appropriate composition of the memory alloy.
  • the cast ingot produced in this way was then rolled out at a temperature of 850 ° C. into a heavy plate of 5 mm thickness.
  • a disk with a diameter of 27 mm was cut out of this sheet.
  • the alloy of the above composition has a martensitic transition temperature M S of +60 o C.
  • a cylindrical body of 15 mm axial length was separated from a copper rod of 15 mm in diameter.
  • the parts to be soldered coaxially, the disk made of memory alloy and the copper cylinders were coated with the flux "Tenacity 5" (trade name of the British company Johnson Matthey) on one of their end faces. Then the copper cylinder was put on the disc and placed both parts by means of a propane flame to a ca.
  • a memory alloy of the following composition was melted in an induction furnace using the method given in Example I and then rolled out to form a sheet:
  • This alloy has a temperature M S of martensitic transformation of -50 o C.
  • a part was made from copper and memory alloy and soldered together on the face side using the means mentioned. Instead of cooling from the soldering temperature of 850 ° C to room temperature, the propane flame was adjusted in such a way that the workpiece was only cooled to dark red heat (700 ° C), after which it was kept at this temperature for a few minutes and then quenched in water. The test on the longitudinally divided workpiece showed a perfect solder connection.
  • the figure shows the grain size d in mm as a function of the nickel content for a series of memory alloys of the Cu / Zn / Al / Ni type.
  • the alloys investigated were subjected to solution annealing at 950 C for 5 min in order to completely convert their structure into the ⁇ phase, and then quenched in water. Their composition varied within the limits:
  • the total copper and nickel content was therefore always 70%.
  • the diagram shows the grain-refining effect of the addition of nickel. While the average diameter of the crystallites for the nickel-free Cu / Zn / Al alloy was still approx. 1.9 mm, an addition of nickel of just 1% almost brought a reduction a third of that value. With a nickel content of 4%, the grain size had dropped to a little more than 0.2 mm, almost a tenth of the original size of conventional memory alloys of this type. In contrast, nickel additions of more than 4% no longer proved sensible.
  • the invention is in no way limited to the alloys and process steps given in the examples.
  • all Cu / Zn / Al / Ni alloys with 0.5 to 4% nickel, predominantly having the ⁇ phase can be used.
  • alloys with the following composition meet this requirement:
  • the flow temperature of the braze solder is sufficiently high above the solution annealing temperature of the memory alloy, which must at least be observed in order to achieve one to convert a high proportion (ideally 100%) of their structure into the ⁇ phase.
  • the flux used in soldering should prevent the aluminum from being oxidized and the formation of a high-alumina slag layer.
  • the new memory alloy according to the invention creates the possibility of producing crack-free and tight solder connections on the basis of a hard solder between components made of memory alloy and another metallic material, without any memory properties of the finished workpiece being adversely affected by the soldering process.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Coating With Molten Metal (AREA)
  • Conductive Materials (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
EP79200332A 1978-08-10 1979-06-25 Alliage à mémoire se prêtant au brasage et procédé de brasage de cet alliage à mémoire Withdrawn EP0009266A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH850878 1978-08-10
CH8508/78 1978-08-10

Publications (1)

Publication Number Publication Date
EP0009266A1 true EP0009266A1 (fr) 1980-04-02

Family

ID=4341343

Family Applications (1)

Application Number Title Priority Date Filing Date
EP79200332A Withdrawn EP0009266A1 (fr) 1978-08-10 1979-06-25 Alliage à mémoire se prêtant au brasage et procédé de brasage de cet alliage à mémoire

Country Status (3)

Country Link
US (1) US4274872A (fr)
EP (1) EP0009266A1 (fr)
DE (1) DE2837339A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3326890A1 (de) * 1982-07-26 1984-01-26 Mitsubishi Kinzoku K.K., Tokyo Kupferlegierung mit formgedaechtnis
FR2769185A1 (fr) * 1997-10-02 1999-04-09 Memometal Ind Accessoire permettant la retenue d'objets pourvus d'un orifice

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5935419B2 (ja) * 1981-03-25 1984-08-28 住友特殊金属株式会社 形状記憶合金
NL8103612A (nl) * 1981-07-30 1983-02-16 Leuven Res & Dev Vzw Beta-legeringen met verbeterde eigenschappen.
US5238004A (en) * 1990-04-10 1993-08-24 Boston Scientific Corporation High elongation linear elastic guidewire
US6440849B1 (en) * 1999-10-18 2002-08-27 Agere Systems Guardian Corp. Microstructure control of copper interconnects
US6977017B2 (en) * 2001-10-25 2005-12-20 Council Of Scientific & Industrial Research Cu-ZN-A1(6%) shape memory alloy with low martensitic temperature and a process for its manufacture

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB572472A (en) * 1941-07-11 1945-10-10 Mond Nickel Co Ltd Improvements in alloys for the manufacture of parts resistant to erosion
DE1558817A1 (de) * 1966-09-14 1970-04-23 Ver Deutsche Metallwerke Ag Verfahren zur Herstellung von Halbzeugen oder Halbfabrikaten aus Kupferlegierungen mit beta- und alpha-Gefuege
FR2301604A1 (fr) * 1975-02-18 1976-09-17 Raychem Corp Preconditionnement thermique d'alliage metallique
DE2711576A1 (de) * 1976-03-18 1977-09-22 Raychem Corp Neue legierungen

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB578873A (en) 1941-10-17 1946-07-16 Maurice Cook Improvements in or relating to copper base alloys
SE344419B (fr) 1965-05-25 1972-04-17 Olin Corp
GB1346047A (en) 1969-11-12 1974-02-06 Fulmer Res Inst Ltd Treatment of alloys
BE758862A (fr) 1969-11-12 1971-04-16 Fulmer Res Inst Ltd Perfectionnements relatifs au traitement d'alliages
US3816187A (en) * 1971-02-16 1974-06-11 R Smith Processing copper base alloys
US4036669A (en) 1975-02-18 1977-07-19 Raychem Corporation Mechanical preconditioning method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB572472A (en) * 1941-07-11 1945-10-10 Mond Nickel Co Ltd Improvements in alloys for the manufacture of parts resistant to erosion
DE1558817A1 (de) * 1966-09-14 1970-04-23 Ver Deutsche Metallwerke Ag Verfahren zur Herstellung von Halbzeugen oder Halbfabrikaten aus Kupferlegierungen mit beta- und alpha-Gefuege
FR2301604A1 (fr) * 1975-02-18 1976-09-17 Raychem Corp Preconditionnement thermique d'alliage metallique
DE2711576A1 (de) * 1976-03-18 1977-09-22 Raychem Corp Neue legierungen

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3326890A1 (de) * 1982-07-26 1984-01-26 Mitsubishi Kinzoku K.K., Tokyo Kupferlegierung mit formgedaechtnis
GB2124653A (en) * 1982-07-26 1984-02-22 Mitsubishi Metal Corp Copper-base shape-memory alloys
FR2769185A1 (fr) * 1997-10-02 1999-04-09 Memometal Ind Accessoire permettant la retenue d'objets pourvus d'un orifice

Also Published As

Publication number Publication date
US4274872A (en) 1981-06-23
DE2837339A1 (de) 1980-02-21

Similar Documents

Publication Publication Date Title
DE60021619T2 (de) Hartlötblech
DE2944755C2 (de) Zahnärztliche Legierung zum Aufbrennen von Porzellan
DE19729545A1 (de) Lotlegierung
EP1888798A1 (fr) Alliage d'aluminium pour paliers lisses
DE2500084C3 (de) Verfahren zur Herstellung von Aluminium-Halbzeug
DE2526954C2 (de) Permanentmagnetanordnung und Verfahren zur Herstellung einer solchen Permanentmagnetanordnung
WO2009037263A1 (fr) Revêtement anti-corrosion
EP0009266A1 (fr) Alliage à mémoire se prêtant au brasage et procédé de brasage de cet alliage à mémoire
DE3490606C2 (fr)
DE112017001622T5 (de) Aluminiumlegierung-lötblech
DE2126639B2 (de) Lot zum loeten von aluminium
DE4121994A1 (de) Kupfer-nickel-zinn-legierung, verfahren zu ihrer behandlung sowie ihre verwendung
DE3525168A1 (de) Aluminium-hartlote und ihre verwendung in aluminium-waermeaustauschern
DE1164206B (de) Hart- oder Schweisslot
DE3043833C2 (fr)
EP0030261B1 (fr) Utilisation d'alliages de brasage pour fixer directement pour brasage des éléments de contact à base d'argent contenant des oxydes sur des supports de contact
DE2641924A1 (de) Zaehe, korrosionsbestaendige, austenitische legierung
DE4029185C2 (de) Glühkerze
DE910309C (de) Eisen- und Stahllegierungen mit guter Bearbeitbarkeit durch Schneidwerkzeuge
DE686321C (de) Lagermetall
DE3417273C2 (de) Kupfer-Nickel-Legierung für elektrisch leitendes Material für integrierte Schaltkreise
DE69738545T2 (de) Verfahren zur Herstellung von Wärmetauscher
DE19629376C2 (de) Hartlot zum Löten von unter Verformungsspannungen stehenden Stahlrohren (II)
AT247098B (de) Messinghartlot
AT205828B (de) Hart- oder Schweißlot

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Designated state(s): BE FR GB IT

17P Request for examination filed
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 19811115

RIN1 Information on inventor provided before grant (corrected)

Inventor name: MELTON, KEITH, DR.

Inventor name: MERCIER, OLIVIER, DR.