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DE60311418D1 - Mehrphasige rotierende elektrische Wechselstrommaschine - Google Patents

Mehrphasige rotierende elektrische Wechselstrommaschine

Info

Publication number
DE60311418D1
DE60311418D1 DE60311418T DE60311418T DE60311418D1 DE 60311418 D1 DE60311418 D1 DE 60311418D1 DE 60311418 T DE60311418 T DE 60311418T DE 60311418 T DE60311418 T DE 60311418T DE 60311418 D1 DE60311418 D1 DE 60311418D1
Authority
DE
Germany
Prior art keywords
rotating electrical
phase rotating
electrical alternator
alternator
phase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60311418T
Other languages
English (en)
Other versions
DE60311418T2 (de
Inventor
Yoshimasa Takahashi
Hironori Kodama
Yutaka Kobayashi
Keiichi Mashino
Syouju Masumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE60311418D1 publication Critical patent/DE60311418D1/de
Publication of DE60311418T2 publication Critical patent/DE60311418T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/04—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for rectification
    • H02K11/049—Rectifiers associated with stationary parts, e.g. stator cores
    • H02K11/05—Rectifiers associated with casings, enclosures or brackets
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K9/00—Arrangements for cooling or ventilating
    • H02K9/02—Arrangements for cooling or ventilating by ambient air flowing through the machine
    • H02K9/04—Arrangements for cooling or ventilating by ambient air flowing through the machine having means for generating a flow of cooling medium
    • H02K9/06—Arrangements for cooling or ventilating by ambient air flowing through the machine having means for generating a flow of cooling medium with fans or impellers driven by the machine shaft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Motor Or Generator Cooling System (AREA)
  • Synchronous Machinery (AREA)
DE60311418T 2003-03-17 2003-08-18 Mehrphasige rotierende elektrische Wechselstrommaschine Expired - Lifetime DE60311418T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003071211 2003-03-17
JP2003071211A JP4147987B2 (ja) 2003-03-17 2003-03-17 多相式交流回転電機

Publications (2)

Publication Number Publication Date
DE60311418D1 true DE60311418D1 (de) 2007-03-15
DE60311418T2 DE60311418T2 (de) 2007-10-31

Family

ID=32821272

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60311418T Expired - Lifetime DE60311418T2 (de) 2003-03-17 2003-08-18 Mehrphasige rotierende elektrische Wechselstrommaschine

Country Status (4)

Country Link
US (1) US7075201B2 (de)
EP (1) EP1460749B1 (de)
JP (1) JP4147987B2 (de)
DE (1) DE60311418T2 (de)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3743433B2 (ja) * 2003-03-25 2006-02-08 日産自動車株式会社 電力変換装置
JP3975974B2 (ja) * 2003-06-18 2007-09-12 株式会社デンソー 車両用交流発電機
US7288839B2 (en) * 2004-02-27 2007-10-30 International Business Machines Corporation Apparatus and methods for cooling semiconductor integrated circuit package structures
JP2005328690A (ja) 2004-04-12 2005-11-24 Hitachi Ltd 車両用回転電機
TWI253047B (en) * 2004-06-16 2006-04-11 Chi Mei Optoelectronics Corp Method for controlling operations of a backlight unit of a liquid crystal display
JP4275614B2 (ja) * 2004-12-10 2009-06-10 三菱電機株式会社 車両用回転電機
JP2006174541A (ja) 2004-12-13 2006-06-29 Mitsubishi Electric Corp 回転電機
JP4583191B2 (ja) * 2005-01-28 2010-11-17 三菱電機株式会社 回転電機
US7166944B2 (en) * 2005-02-18 2007-01-23 Visteon Global Technologies, Inc. Cooling plate for alternator rectifier
JP2006271014A (ja) 2005-03-22 2006-10-05 Denso Corp 車両用交流発電機
JP2007037280A (ja) * 2005-07-27 2007-02-08 Mitsubishi Electric Corp インバータ一体型回転電機
JP4339832B2 (ja) 2005-08-11 2009-10-07 三菱電機株式会社 車両用回転電機
JP4278643B2 (ja) 2005-08-30 2009-06-17 三菱電機株式会社 車両用回転電機
JP2007124818A (ja) * 2005-10-28 2007-05-17 Asmo Co Ltd モータの制御回路装置及びモータの制御回路装置を備えたモータ
JP2007135372A (ja) * 2005-11-14 2007-05-31 Denso Corp 車両用交流発電機
JP2007189865A (ja) * 2006-01-16 2007-07-26 Mitsubishi Electric Corp 制御装置一体型回転電機
JP4229947B2 (ja) * 2006-01-16 2009-02-25 三菱電機株式会社 制御装置一体型回転電機およびその製造方法
JP4402057B2 (ja) * 2006-02-21 2010-01-20 三菱電機株式会社 制御装置一体型回転電機
JP2008140802A (ja) * 2006-11-30 2008-06-19 Fuji Electric Fa Components & Systems Co Ltd ヒートシンク
FR2911444B1 (fr) * 2006-12-22 2016-02-12 Valeo Equip Electr Moteur Dispositif de redressement de courant pour machine electrique tournante et machine electrique tournante comportant un tel dispositif
FR2911017B1 (fr) * 2006-12-22 2016-01-01 Valeo Equip Electr Moteur Agencement de redressement de courant et machine comportant un tel agencement
JP4861836B2 (ja) * 2007-01-09 2012-01-25 アスモ株式会社 ラジエータ冷却用の車両用電動ファン装置
US7957170B2 (en) 2007-06-21 2011-06-07 Denso Corporation Cooling-fin mounted rectifier for vehicular AC generators
US7939975B2 (en) * 2007-10-26 2011-05-10 E. I Du Pont De Nemours And Company Over-mold stator assembly and process for preparation thereof
US8208917B2 (en) * 2007-10-29 2012-06-26 Bose Corporation Wireless and dockable audio interposer device
JP4402712B2 (ja) * 2007-11-16 2010-01-20 三菱電機株式会社 制御装置一体形回転電機
US7960153B2 (en) * 2007-12-31 2011-06-14 Church & Dwight Co., Inc. Glucose conversion to ethanol via yeast cultures and bicarbonate ions
JP4493700B2 (ja) * 2008-05-19 2010-06-30 三菱電機株式会社 制御装置一体型回転電機
JP4907694B2 (ja) * 2009-05-13 2012-04-04 三菱電機株式会社 回転電機
JP4754009B2 (ja) * 2009-06-04 2011-08-24 三菱電機株式会社 車両用回転電機
JP5365872B2 (ja) * 2009-06-24 2013-12-11 株式会社デンソー 駆動装置
CN201918825U (zh) * 2010-12-31 2011-08-03 中山大洋电机股份有限公司 一种电机的散热结构
DE102011003189A1 (de) * 2011-01-26 2012-07-26 Robert Bosch Gmbh Generator mit Phasenanschlusskühlung
EP3536582B1 (de) * 2011-04-07 2022-08-10 Mitsubishi Electric Corporation Formmodul und elektrische servolenkvorrichtung
WO2012160623A1 (ja) * 2011-05-20 2012-11-29 三菱電機株式会社 駆動装置一体型回転電機
JP5502805B2 (ja) * 2011-06-08 2014-05-28 日立オートモティブシステムズ株式会社 パワーモジュールおよびそれを用いた電力変換装置
JP5566356B2 (ja) * 2011-09-15 2014-08-06 日立オートモティブシステムズ株式会社 モータ駆動装置
WO2013061404A1 (ja) * 2011-10-25 2013-05-02 三菱電機株式会社 回転電機
US9698646B2 (en) * 2011-11-09 2017-07-04 Mitusubishi Electric Corporation Rotating electrical machine
WO2014193341A1 (en) * 2013-05-28 2014-12-04 Otis Elevator Company Cooling of machine for elevator system
US9450477B2 (en) * 2014-01-22 2016-09-20 Remy Technologies, Llc B+ mounted integrated active rectifier electronics
DE102014205957A1 (de) * 2014-03-31 2015-10-01 Lemförder Electronic GmbH Treiberbaugruppe
WO2016113858A1 (ja) * 2015-01-14 2016-07-21 株式会社安川電機 モータ及びモータの製造方法
JP6021047B1 (ja) * 2015-01-14 2016-11-02 株式会社安川電機 モータ
US10701842B2 (en) 2015-05-27 2020-06-30 Hitachi, Ltd. Power converter having water passages for cooling power modules
DE102015225681A1 (de) * 2015-12-17 2017-06-22 Robert Bosch Gmbh Elektrische Vorrichtung mit einer Kühleinheit
JP6688458B2 (ja) * 2016-03-22 2020-04-28 株式会社デンソー 回転電機
US10415895B2 (en) * 2016-11-21 2019-09-17 Abl Ip Holding Llc Heatsink
JP6776923B2 (ja) * 2017-02-06 2020-10-28 株式会社デンソー 半導体装置
DE112017008067T5 (de) * 2017-11-08 2020-06-18 Mitsubishi Electric Corporation Transformator und Leistungswandlereinrichtung
JP2019122211A (ja) * 2018-01-11 2019-07-22 株式会社デンソー 回転電機
CN112930046B (zh) * 2019-12-05 2022-05-17 深圳市高科润电子有限公司 一种电动汽车电器控制器

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2228856C3 (de) * 1972-06-14 1978-11-30 Nautschno-Issledovatelskij I Eksperimentalnyj Institut Avtomobilnogo Elektrooborudovanija I Avtopriborov, Moskau Elektrischer Generator
DE2649418A1 (de) * 1976-10-29 1978-05-03 Bosch Gmbh Robert Gleichrichtereinheit
US4541004A (en) * 1982-11-24 1985-09-10 Burroughs Corporation Aerodynamically enhanced heat sink
JPS63305757A (ja) 1987-06-06 1988-12-13 Mitsuba Electric Mfg Co Ltd 車両用発電機の整流器構造
JP2959640B2 (ja) 1990-09-27 1999-10-06 本田技研工業株式会社 充電回路
JP2715752B2 (ja) * 1991-10-31 1998-02-18 住友金属工業株式会社 ヒートシンク放熱フィンとその製造方法
JP2633762B2 (ja) 1992-05-12 1997-07-23 株式会社日立製作所 全波整流装置
DE4422623A1 (de) * 1994-06-28 1996-01-04 Piller Gmbh Elektrische Maschine
JP3458531B2 (ja) 1995-06-02 2003-10-20 株式会社デンソー 交流発電機
US5818133A (en) * 1996-04-19 1998-10-06 Siemens Canada Ltd. Brushless motor with tubular bearing support
JPH10209357A (ja) * 1997-01-21 1998-08-07 Eisuke Ishida ヒートシンクの製造方法とヒートシンク
US5825107A (en) * 1997-06-13 1998-10-20 General Electric Company Drive package for a dynamoelectric machine
US6107711A (en) * 1998-08-21 2000-08-22 Emerson Electric Co. Brushless exciter for a rotating electromagnetic machine
JP3443363B2 (ja) * 1999-05-26 2003-09-02 三菱電機株式会社 車両用交流発電機
JP4002064B2 (ja) * 2000-12-18 2007-10-31 カルソニックカンセイ株式会社 ブラシレスモータ
DE10132455B4 (de) * 2001-07-04 2009-12-17 Robert Bosch Gmbh Elektrische Anordnung mit einem Kühlkörper und Verfahren zu deren Herstellung

Also Published As

Publication number Publication date
US20040183385A1 (en) 2004-09-23
EP1460749B1 (de) 2007-01-24
DE60311418T2 (de) 2007-10-31
US7075201B2 (en) 2006-07-11
JP2004282905A (ja) 2004-10-07
JP4147987B2 (ja) 2008-09-10
EP1460749A1 (de) 2004-09-22

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