DE60101756D1 - Leiterplatte mit körnigem magnetischem Film - Google Patents

Leiterplatte mit körnigem magnetischem Film

Info

Publication number: DE60101756D1
Authority: DE; Germany
Prior art keywords: circuit board; printed circuit; magnetic film; granular magnetic; granular
Prior art date: 2000-04-04
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE60101756T

Other languages

English (en)

Other versions

DE60101756T2 (de

Inventor

Yoshio Awakura

Shinya Watanabe

Satoshi Shiratori

Hiroshi Ono

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Tokin Corp

Original Assignee

NEC Tokin Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-04-04

Filing date

2001-04-04

Publication date

2004-02-19

2000-04-04 Priority claimed from JP2000101765A external-priority patent/JP4417521B2/ja

2000-04-04 Priority claimed from JP2000101756A external-priority patent/JP2001284755A/ja

2001-04-04 Application filed by NEC Tokin Corp filed Critical NEC Tokin Corp

2004-02-19 Application granted granted Critical

2004-02-19 Publication of DE60101756D1 publication Critical patent/DE60101756D1/de

2004-12-02 Publication of DE60101756T2 publication Critical patent/DE60101756T2/de

2021-04-05 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Physics & Mathematics (AREA)
Electromagnetism (AREA)
Thin Magnetic Films (AREA)
Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Parts Printed On Printed Circuit Boards (AREA)
Hard Magnetic Materials (AREA)

DE60101756T 2000-04-04 2001-04-04 Leiterplatte mit körnigem magnetischem Film Expired - Lifetime DE60101756T2 (de)

Applications Claiming Priority (4)

Application Number	Priority Date	Filing Date	Title
JP2000101765		2000-04-04
JP2000101765A JP4417521B2 (ja)	2000-04-04	2000-04-04	配線基板
JP2000101756A JP2001284755A (ja)	2000-04-04	2000-04-04	配線基板
JP2000101756		2000-04-04

Publications (2)

Publication Number	Publication Date
DE60101756D1 true DE60101756D1 (de)	2004-02-19
DE60101756T2 DE60101756T2 (de)	2004-12-02

Family

ID=26589399

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60101756T Expired - Lifetime DE60101756T2 (de)	2000-04-04	2001-04-04	Leiterplatte mit körnigem magnetischem Film

Country Status (9)

Country	Link
US (4)	US6653573B2 (de)
EP (1)	EP1143774B1 (de)
KR (1)	KR100882388B1 (de)
CN (1)	CN100336423C (de)
DE (1)	DE60101756T2 (de)
MY (1)	MY126823A (de)
NO (1)	NO20011707L (de)
SG (1)	SG100666A1 (de)
TW (1)	TWI268125B (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR100844612B1 (ko) *	2000-04-04	2008-07-07	엔이씨 도낀 가부시끼가이샤	반도체 소자와 전자기 노이즈 억제체
JP2002064189A (ja) *	2000-08-21	2002-02-28	Tokin Corp	マグネティック・ランダム・アクセス・メモリ
US7371471B2 (en) *	2004-03-08	2008-05-13	Nec Tokin Corporation	Electromagnetic noise suppressing thin film
JP4701942B2 (ja) *	2005-09-14	2011-06-15	Ｔｄｋ株式会社	半導体ｉｃ内蔵モジュール
US8134084B2 (en)	2006-06-30	2012-03-13	Shin-Etsu Polymer Co., Ltd.	Noise-suppressing wiring-member and printed wiring board
JP5139750B2 (ja) *	2006-11-22	2013-02-06	Ｎｅｃトーキン株式会社	多層プリント配線基板
DE102007055291A1 (de) *	2006-11-22	2008-06-26	Nec Tokin Corp., Sendai	Mehrschichtige gedruckte Leiterplatte
TWI382645B (zh) *	2006-12-29	2013-01-11	Hon Hai Prec Ind Co Ltd	電源裝置
JP5082060B2 (ja) *	2008-05-22	2012-11-28	学校法人明星学苑	低特性インピーダンス電源・グランドペア線路構造
JP6079425B2 (ja) *	2012-05-16	2017-02-15	日立化成株式会社	導電粒子、異方性導電接着剤フィルム及び接続構造体
US9307631B2 (en) *	2013-01-25	2016-04-05	Laird Technologies, Inc.	Cavity resonance reduction and/or shielding structures including frequency selective surfaces
US20160029477A1 (en) *	2013-02-27	2016-01-28	Nec Corporation	Wiring substrate, semiconductor device, printed board, and method for producing wiring substrate
CN108289369B (zh) *	2017-01-09	2020-12-25	莱尔德技术股份有限公司	具有介电间隔件的吸收器组件以及相应的组装方法
CN110035603B (zh) *	2019-04-25	2021-08-03	电子科技大学	一种印制电路埋嵌电感的制备方法
US12101873B2 (en)	2022-04-25	2024-09-24	Microsoft Technology Licensing, Llc	Flexible printed circuit cable assembly with electromagnetic shielding

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS531468B2 (de) *	1972-08-30	1978-01-19
JPH01151297A (ja)	1987-12-08	1989-06-14	Nec Corp	複合回路基板
JPH01235662A (ja) *	1988-03-16	1989-09-20	Hitachi Ltd	記録電極及びその製造法
JP2799465B2 (ja) *	1989-10-04	1998-09-17	イビデン株式会社	磁性合金層被覆回路基板
EP0422760A1 (de)	1989-10-12	1991-04-17	Mitsubishi Rayon Co., Ltd	Amorphe legierung und Verfahren zu ihrer Herstellung
JPH04196285A (ja) *	1990-11-27	1992-07-16	Ibiden Co Ltd	金属層被覆回路基板
JPH05183291A (ja)	1991-12-27	1993-07-23	Japan Metals & Chem Co Ltd	Ｅｍｉシールドプリント配線板の製造方法
JPH06275927A (ja)	1993-03-19	1994-09-30	Cmk Corp	磁界・電磁波シールド層を有するプリント配線板とその製造方法
JPH0758485A (ja)	1993-08-20	1995-03-03	Cmk Corp	磁界・電磁波シールド層を有するプリント配線板とその製造方法
JP2665134B2 (ja) *	1993-09-03	1997-10-22	日本黒鉛工業株式会社	フレキシブル回路基板及びその製造方法
US5639989A (en) *	1994-04-19	1997-06-17	Motorola Inc.	Shielded electronic component assembly and method for making the same
US5738931A (en) *	1994-09-16	1998-04-14	Kabushiki Kaisha Toshiba	Electronic device and magnetic device
JPH08250858A (ja)	1995-03-07	1996-09-27	Ngk Spark Plug Co Ltd	回路基板
US5698131A (en) *	1995-05-15	1997-12-16	Matsushita Electric Industrial Co., Ltd.	Paste for manufacturing ferrite and ferrite
JP3327375B2 (ja) *	1996-04-26	2002-09-24	富士通株式会社	磁気抵抗効果型トランスデューサ、その製造方法及び磁気記録装置
JP3151155B2 (ja) *	1996-09-10	2001-04-03	アルプス電気株式会社	薄膜磁気ヘッド
JPH10105961A (ja) *	1996-09-26	1998-04-24	Mitsubishi Chem Corp	磁気記録媒体およびその記録再生方法ならびに磁気記録装置
JP3184465B2 (ja) *	1996-11-19	2001-07-09	アルプス電気株式会社	薄膜磁気ヘッドおよびその製造方法
JP2867985B2 (ja) *	1996-12-20	1999-03-10	日本電気株式会社	プリント回路基板
JPH1196520A (ja) *	1997-09-17	1999-04-09	Fujitsu Ltd	磁気ヘッド及びその製造方法並びに該磁気ヘッドを備えた磁気記録装置
JPH11233909A (ja)	1998-02-18	1999-08-27	Kyocera Corp	配線基板
US5998048A (en) *	1998-03-02	1999-12-07	Lucent Technologies Inc.	Article comprising anisotropic Co-Fe-Cr-N soft magnetic thin films
JPH11274362A (ja)	1998-03-25	1999-10-08	Kyocera Corp	配線基板
JP3769120B2 (ja) *	1998-05-08	2006-04-19	株式会社東芝	半導体素子
JP3474455B2 (ja) *	1998-09-10	2003-12-08	Ｔｄｋ株式会社	薄膜磁気ヘッドおよびその製造方法
US6021050A (en) *	1998-12-02	2000-02-01	Bourns, Inc.	Printed circuit boards with integrated passive components and method for making same
US6462630B1 (en) *	2000-07-03	2002-10-08	Oki Electric Cable Co., Ltd.	Wideband noise reducing device

2001
- 2001-04-03 US US09/825,418 patent/US6653573B2/en not_active Expired - Lifetime
- 2001-04-03 SG SG200101997A patent/SG100666A1/en unknown
- 2001-04-04 TW TW090108093A patent/TWI268125B/zh not_active IP Right Cessation
- 2001-04-04 NO NO20011707A patent/NO20011707L/no not_active Application Discontinuation
- 2001-04-04 MY MYPI20011611A patent/MY126823A/en unknown
- 2001-04-04 KR KR1020010017971A patent/KR100882388B1/ko not_active IP Right Cessation
- 2001-04-04 CN CNB011124776A patent/CN100336423C/zh not_active Expired - Fee Related
- 2001-04-04 EP EP01108515A patent/EP1143774B1/de not_active Expired - Lifetime
- 2001-04-04 DE DE60101756T patent/DE60101756T2/de not_active Expired - Lifetime
2003
- 2003-09-05 US US10/656,619 patent/US6953899B1/en not_active Expired - Fee Related
- 2003-09-05 US US10/655,823 patent/US6919772B2/en not_active Expired - Lifetime
- 2003-09-05 US US10/656,512 patent/US6956173B2/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
US20040124941A1 (en)	2004-07-01
CN1321059A (zh)	2001-11-07
CN100336423C (zh)	2007-09-05
MY126823A (en)	2006-10-31
US20010037897A1 (en)	2001-11-08
US20040124005A1 (en)	2004-07-01
EP1143774A2 (de)	2001-10-10
EP1143774A3 (de)	2002-02-27
SG100666A1 (en)	2003-12-26
US6919772B2 (en)	2005-07-19
DE60101756T2 (de)	2004-12-02
EP1143774B1 (de)	2004-01-14
NO20011707L (no)	2001-10-05
US6956173B2 (en)	2005-10-18
TWI268125B (en)	2006-12-01
NO20011707D0 (no)	2001-04-04
US6653573B2 (en)	2003-11-25
KR100882388B1 (ko)	2009-02-05
US6953899B1 (en)	2005-10-11
KR20010095320A (ko)	2001-11-03

Publication	Publication Date	Title
DE60045566D1 (de)	2011-03-03	Mehrschicht-Leiterplatte
DE69812179D1 (de)	2003-04-17	Gedruckte schaltungsplatine mit integrierter schmelzsicherung
DE69943290D1 (de)	2011-04-28	Gedruckte Leiterplatte
DE69936892D1 (de)	2007-09-27	Mehrschichtige Leiterplatte mit gefüllten Kontaktlöchern
DE69942711D1 (de)	2010-10-07	Mehrschichtige gedruckte Leiterplatte
DE60232473D1 (de)	2009-07-09	Mehrschichtige Leiterplatte
FI20022140A0 (fi)	2002-12-04	Joustava painettu piirilevy
DE69842069D1 (de)	2011-02-03	Mehrschichtige gedruckte Leiterplatte
DE59813841D1 (de)	2007-01-25	Mehrlagen-Leiterplatte
DE69812221D1 (de)	2003-04-24	Gedruckte Leiterplatte
AU2002224832A1 (en)	2002-05-27	Positive type photosensitive epoxy resin composition and printed circuit board using the same
DE60101756D1 (de)	2004-02-19	Leiterplatte mit körnigem magnetischem Film
DE60039569D1 (de)	2008-09-04	Gedruckte Leiterplatte
GB2366917B (en)	2002-12-04	Flexible printed circuit film
DE60143235D1 (de)	2010-11-25	Mehrschichtige Leiterplatte
GB2363257B (en)	2002-05-22	Printed circuit board
DE60131485D1 (de)	2008-01-03	Leiterplatte
DE69837520D1 (de)	2007-05-24	Gedruckte Leiterplatte
DE60119194D1 (de)	2006-06-08	Leiterplattenanordnung
IL151278A0 (en)	2003-04-10	Printed circuit board assembly
GB0001573D0 (en)	2000-03-15	Printed circuit board with fuse
DE69700216D1 (de)	1999-06-17	Leiterplatte mit verbesserten Positionierungsmitteln
DE60137310D1 (de)	2009-02-26	Leiterplatte
DE69939157D1 (de)	2008-09-04	Gedruckte Leiterplatte
DE69938982D1 (de)	2008-08-07	Mehrlagen Gedruckteschaltungsplatte

Legal Events

Date	Code	Title	Description
2005-02-10	8364	No opposition during term of opposition