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DE3788678D1 - Vorrichtung und Verfahren zur Herstellung einer Schicht auf einem Substrat. - Google Patents

Vorrichtung und Verfahren zur Herstellung einer Schicht auf einem Substrat.

Info

Publication number
DE3788678D1
DE3788678D1 DE87302981T DE3788678T DE3788678D1 DE 3788678 D1 DE3788678 D1 DE 3788678D1 DE 87302981 T DE87302981 T DE 87302981T DE 3788678 T DE3788678 T DE 3788678T DE 3788678 D1 DE3788678 D1 DE 3788678D1
Authority
DE
Germany
Prior art keywords
producing
substrate
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE87302981T
Other languages
English (en)
Other versions
DE3788678T2 (de
Inventor
Takashi Kaito
Tatsuya Adachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Science Corp
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Publication of DE3788678D1 publication Critical patent/DE3788678D1/de
Application granted granted Critical
Publication of DE3788678T2 publication Critical patent/DE3788678T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/16—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metal carbonyl compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
    • C23C16/486—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using ion beam radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/32051—Deposition of metallic or metal-silicide layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Chemical Vapour Deposition (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE87302981T 1986-05-29 1987-04-06 Vorrichtung und Verfahren zur Herstellung einer Schicht auf einem Substrat. Expired - Lifetime DE3788678T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61124146A JPS62281349A (ja) 1986-05-29 1986-05-29 金属パタ−ン膜の形成方法及びその装置

Publications (2)

Publication Number Publication Date
DE3788678D1 true DE3788678D1 (de) 1994-02-17
DE3788678T2 DE3788678T2 (de) 1994-04-28

Family

ID=14878070

Family Applications (1)

Application Number Title Priority Date Filing Date
DE87302981T Expired - Lifetime DE3788678T2 (de) 1986-05-29 1987-04-06 Vorrichtung und Verfahren zur Herstellung einer Schicht auf einem Substrat.

Country Status (4)

Country Link
US (1) US4876112A (de)
EP (1) EP0247714B1 (de)
JP (1) JPS62281349A (de)
DE (1) DE3788678T2 (de)

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JPH0664338B2 (ja) * 1988-02-02 1994-08-22 三菱電機株式会社 薄膜パターンの修正方法およびその方法によって修正された露光用マスク
JP2733244B2 (ja) * 1988-04-07 1998-03-30 株式会社日立製作所 配線形成方法
US4908226A (en) * 1988-05-23 1990-03-13 Hughes Aircraft Company Selective area nucleation and growth method for metal chemical vapor deposition using focused ion beams
JPH0262039A (ja) * 1988-08-29 1990-03-01 Hitachi Ltd 多層素子の微細加工方法およびその装置
US5106764A (en) * 1989-04-10 1992-04-21 At&T Bell Laboratories Device fabrication
US5262341A (en) * 1989-05-19 1993-11-16 Fujitsu Limited Blanking aperture array and charged particle beam exposure method
EP0420589B1 (de) * 1989-09-26 1996-02-07 Canon Kabushiki Kaisha Verfahren zum Herstellen einer abgeschiedenen Schicht und Verfahren zum Herstellen einer Halbleitervorrichtung
JPH03124463U (de) * 1990-03-28 1991-12-17
US5104684A (en) * 1990-05-25 1992-04-14 Massachusetts Institute Of Technology Ion beam induced deposition of metals
DE69132474T2 (de) * 1990-05-31 2001-05-03 Canon K.K., Tokio/Tokyo Verfahren zur Verdrahtung eines Halbleiterbauelementes
FR2664294B1 (fr) * 1990-07-06 1992-10-23 Plasmametal Procede de metallisation d'une surface.
US5140164A (en) * 1991-01-14 1992-08-18 Schlumberger Technologies, Inc. Ic modification with focused ion beam system
US5331172A (en) * 1991-02-11 1994-07-19 Microelectronics And Computer Technology Corporation Ionized metal cluster beam systems and methods
US5244538A (en) * 1991-07-26 1993-09-14 Microelectronics And Computer Technology Corporation Method of patterning metal on a substrate using direct-write deposition of a mask
US5382315A (en) * 1991-02-11 1995-01-17 Microelectronics And Computer Technology Corporation Method of forming etch mask using particle beam deposition
US5156997A (en) * 1991-02-11 1992-10-20 Microelectronics And Computer Technology Corporation Method of making semiconductor bonding bumps using metal cluster ion deposition
WO1994013010A1 (en) * 1991-04-15 1994-06-09 Fei Company Process of shaping features of semiconductor devices
US5188705A (en) * 1991-04-15 1993-02-23 Fei Company Method of semiconductor device manufacture
US5314727A (en) * 1992-07-28 1994-05-24 Minnesota Mining & Mfg. Co./Regents Of The University Of Minnesota Chemical vapor deposition of iron, ruthenium, and osmium
JP3212755B2 (ja) * 1993-05-19 2001-09-25 株式会社東芝 針状物質の製造方法およびマイクロエミッタアレイの製造方法
US5792270A (en) * 1993-10-21 1998-08-11 Saxena; Arjun Apparatus for forming a pattern of nucleation sites
JP3041565B2 (ja) * 1993-11-30 2000-05-15 セイコーインスツルメンツ株式会社 試料加工方法
US5429989A (en) * 1994-02-03 1995-07-04 Motorola, Inc. Process for fabricating a metallization structure in a semiconductor device
JP2771472B2 (ja) * 1994-05-16 1998-07-02 松下電器産業株式会社 半導体装置の製造方法
AU2914095A (en) * 1994-06-28 1996-01-25 Fei Company Charged particle deposition of electrically insulating films
US5674409A (en) * 1995-03-16 1997-10-07 International Business Machines Corporation Nanolithographic method of forming fine lines
US5958799A (en) * 1995-04-13 1999-09-28 North Carolina State University Method for water vapor enhanced charged-particle-beam machining
US5534311A (en) * 1995-05-31 1996-07-09 The United States Of America As Represented By The Secretary Of The Navy Production of structures by electrostatically-focused deposition
US5908947A (en) * 1996-02-09 1999-06-01 Micron Technology, Inc. Difunctional amino precursors for the deposition of films comprising metals
US5659057A (en) * 1996-02-09 1997-08-19 Micron Technology, Inc. Five- and six-coordinate precursors for titanium nitride deposition
US5607722A (en) * 1996-02-09 1997-03-04 Micron Technology, Inc. Process for titanium nitride deposition using five-and six-coordinate titanium complexes
US5976976A (en) 1997-08-21 1999-11-02 Micron Technology, Inc. Method of forming titanium silicide and titanium by chemical vapor deposition
US6143362A (en) * 1998-02-25 2000-11-07 Micron Technology, Inc. Chemical vapor deposition of titanium
US6284316B1 (en) 1998-02-25 2001-09-04 Micron Technology, Inc. Chemical vapor deposition of titanium
US6261850B1 (en) 1998-09-03 2001-07-17 Micron Technology, Inc. Direct writing of low carbon conductive material
US6071808A (en) * 1999-06-23 2000-06-06 Lucent Technologies Inc. Method of passivating copper interconnects in a semiconductor
EP1210723B1 (de) 2000-01-21 2009-03-18 Fei Company Fokussierte ionenstrahlen mit vorgegebener form und geringer dichte
US6727500B1 (en) * 2000-02-25 2004-04-27 Fei Company System for imaging a cross-section of a substrate
US7258901B1 (en) * 2000-09-08 2007-08-21 Fei Company Directed growth of nanotubes on a catalyst
US20060051508A1 (en) * 2000-12-28 2006-03-09 Ilan Gavish Focused ion beam deposition
US6492261B2 (en) * 2000-12-30 2002-12-10 Intel Corporation Focused ion beam metal deposition
US6638580B2 (en) * 2000-12-29 2003-10-28 Intel Corporation Apparatus and a method for forming an alloy layer over a substrate using an ion beam
US6977386B2 (en) * 2001-01-19 2005-12-20 Fei Company Angular aperture shaped beam system and method
US6838380B2 (en) 2001-01-26 2005-01-04 Fei Company Fabrication of high resistivity structures using focused ion beams
JP4688400B2 (ja) * 2001-12-04 2011-05-25 エスアイアイ・ナノテクノロジー株式会社 走査型プローブ顕微鏡用探針
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US7160475B2 (en) * 2002-11-21 2007-01-09 Fei Company Fabrication of three dimensional structures
US7674706B2 (en) 2004-04-13 2010-03-09 Fei Company System for modifying small structures using localized charge transfer mechanism to remove or deposit material
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US8617668B2 (en) * 2009-09-23 2013-12-31 Fei Company Method of using nitrogen based compounds to reduce contamination in beam-induced thin film deposition
US9255339B2 (en) 2011-09-19 2016-02-09 Fei Company Localized, in-vacuum modification of small structures
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JP6385899B2 (ja) 2014-07-21 2018-09-05 エフ・イ−・アイ・カンパニー Ｔｅｍ試料取付け構造
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US4615904A (en) * 1982-06-01 1986-10-07 Massachusetts Institute Of Technology Maskless growth of patterned films
US4451503A (en) * 1982-06-30 1984-05-29 International Business Machines Corporation Photo deposition of metals with far UV radiation
JPS59168652A (ja) * 1983-03-16 1984-09-22 Hitachi Ltd 素子修正方法及びその装置
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JPS6094728A (ja) * 1983-10-27 1985-05-27 Seiko Instr & Electronics Ltd 荷電粒子ビームを用いた加工方法およびその装置
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JPS60245227A (ja) * 1984-05-21 1985-12-05 Seiko Instr & Electronics Ltd パタ−ン膜の形成方法
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Also Published As

Publication number Publication date
EP0247714B1 (de) 1994-01-05
EP0247714A3 (en) 1990-12-05
US4876112A (en) 1989-10-24
JPS62281349A (ja) 1987-12-07
DE3788678T2 (de) 1994-04-28
EP0247714A2 (de) 1987-12-02

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Legal Events

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8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8327 Change in the person/name/address of the patent owner

Owner name: SII NANO TECHNOLOGY INC., CHIBA, JP