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DE3777522D1 - Verfahren zum herstellen einer gemischten struktur fuer halbleiteranordnung. - Google Patents

Verfahren zum herstellen einer gemischten struktur fuer halbleiteranordnung.

Info

Publication number
DE3777522D1
DE3777522D1 DE8787115028T DE3777522T DE3777522D1 DE 3777522 D1 DE3777522 D1 DE 3777522D1 DE 8787115028 T DE8787115028 T DE 8787115028T DE 3777522 T DE3777522 T DE 3777522T DE 3777522 D1 DE3777522 D1 DE 3777522D1
Authority
DE
Germany
Prior art keywords
producing
mixed structure
semiconductor arrangement
semiconductor
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8787115028T
Other languages
English (en)
Inventor
Kenichi Mizuishi
Masahide Hitachi Koyasu Tokuda
Katuaki Chiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5652887A external-priority patent/JP2510557B2/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3777522D1 publication Critical patent/DE3777522D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
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    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE8787115028T 1986-10-17 1987-10-14 Verfahren zum herstellen einer gemischten struktur fuer halbleiteranordnung. Expired - Lifetime DE3777522D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24525286 1986-10-17
JP5652887A JP2510557B2 (ja) 1986-10-17 1987-03-13 複合構造体の製造方法

Publications (1)

Publication Number Publication Date
DE3777522D1 true DE3777522D1 (de) 1992-04-23

Family

ID=26397487

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787115028T Expired - Lifetime DE3777522D1 (de) 1986-10-17 1987-10-14 Verfahren zum herstellen einer gemischten struktur fuer halbleiteranordnung.

Country Status (3)

Country Link
US (1) US4819857A (de)
EP (1) EP0264122B1 (de)
DE (1) DE3777522D1 (de)

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US4927069A (en) * 1988-07-15 1990-05-22 Sanken Electric Co., Ltd. Soldering method capable of providing a joint of reduced thermal resistance
DE3914333A1 (de) * 1989-04-29 1990-10-31 Hoechst Ceram Tec Ag Pumpenkolben fuer axialkolbenpumpen
JPH0357230A (ja) * 1989-07-25 1991-03-12 Mitsubishi Electric Corp 半導体基板と支持板とのロウ付け方法
EP0460286A3 (en) * 1990-06-06 1992-02-26 Siemens Aktiengesellschaft Method and arrangement for bonding a semiconductor component to a substrate or for finishing a semiconductor/substrate connection by contactless pressing
US5906310A (en) * 1994-11-10 1999-05-25 Vlt Corporation Packaging electrical circuits
JP2732823B2 (ja) * 1995-02-02 1998-03-30 ヴィエルティー コーポレーション はんだ付け方法
CA2156941A1 (en) * 1995-08-21 1997-02-22 Jonathan H. Orchard-Webb Method of making electrical connections to integrated circuit
GB2316225A (en) * 1996-08-06 1998-02-18 Northern Telecom Ltd Semiconductor photodetector packaging
US6070321A (en) * 1997-07-09 2000-06-06 International Business Machines Corporation Solder disc connection
US6095400A (en) * 1997-12-04 2000-08-01 Ford Global Technologies, Inc. Reinforced solder preform
US6316737B1 (en) 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board
JP3946393B2 (ja) * 1999-10-19 2007-07-18 株式会社東芝 階層構造をもつ並列計算機
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EP0264122A3 (en) 1989-06-07
US4819857A (en) 1989-04-11
EP0264122A2 (de) 1988-04-20

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