CN220324478U - Luminous backboard - Google Patents
Luminous backboard Download PDFInfo
- Publication number
- CN220324478U CN220324478U CN202321925152.3U CN202321925152U CN220324478U CN 220324478 U CN220324478 U CN 220324478U CN 202321925152 U CN202321925152 U CN 202321925152U CN 220324478 U CN220324478 U CN 220324478U
- Authority
- CN
- China
- Prior art keywords
- led lamp
- metal
- bonding pad
- electrode bonding
- back plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 78
- 239000002184 metal Substances 0.000 claims abstract description 78
- 239000011324 bead Substances 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000010410 layer Substances 0.000 claims abstract description 25
- 239000012790 adhesive layer Substances 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 239000011247 coating layer Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000013316 zoning Methods 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model discloses a luminescent backboard, comprising: the LED lamp comprises a metal substrate and a plurality of LED lamp beads, wherein an insulating layer is coated on one side surface of the metal substrate, a plurality of metal wires are paved on the surface of the insulating layer, which is opposite to the surface of the metal substrate, the metal wires are connected with the insulating layer in an adhesive mode through an adhesive layer, and a positive electrode bonding pad and a negative electrode bonding pad of each LED lamp bead are electrically connected with the same metal wire. The luminous backboard of the utility model not only simplifies the processing technology, but also saves materials, and can greatly reduce the pollution to the environment.
Description
Technical Field
The utility model relates to the technical field of display, in particular to a luminous backboard.
Background
The existing LED light-emitting panel takes a circuit board, a glass substrate and the like as circuit carriers, a plurality of LED light-emitting lamp beads are welded on the circuit board or the glass substrate, the LED light-emitting lamp beads are electrically connected with circuit wires formed on the circuit board, the manufacturing process is complex, the cost is high, chemical procedures such as etching are involved in the production process of the circuit board, and the environment pollution is large and the manufacturing process is complex.
Disclosure of Invention
The utility model aims to provide the luminous backboard, which not only simplifies the processing technology, but also saves materials and greatly reduces the pollution to the environment.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a luminescent back plate comprising: the LED lamp comprises a metal substrate and a plurality of LED lamp beads, wherein an insulating layer is coated on one side surface of the metal substrate, a plurality of metal wires are paved on the surface of the insulating layer, which is opposite to the surface of the metal substrate, the metal wires are connected with the insulating layer in an adhesive mode through an adhesive layer, and a positive electrode bonding pad and a negative electrode bonding pad of each LED lamp bead are electrically connected with the same metal wire.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the metal wire is also provided with a plurality of connectors which are arranged at intervals, and the positive electrode end and the negative electrode end of each metal wire are correspondingly connected with 2 pins on the same connector.
2. In the scheme, the metal wires in the area right below the positive electrode bonding pad and the negative electrode bonding pad of the LED lamp bead are distributed in the shape of an arc.
3. In the scheme, the positive electrode bonding pad and the negative electrode bonding pad of the LED lamp bead are connected with the metal wire through soldering tin.
4. In the above scheme, the metal substrate is an aluminum substrate or a copper substrate.
5. In the scheme, the LED lamp beads are Mini-LED lamp beads or Micro-LED lamp beads.
6. In the above scheme, an insulating coating layer is arranged on the outer side of the metal wire.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:
according to the luminescent back plate, one side surface of the metal substrate is coated with the insulating layer, a plurality of metal wires are paved on the surface of the insulating layer opposite to the metal substrate, the metal wires are connected with the insulating layer in an adhesive mode, the positive electrode bonding pad and the negative electrode bonding pad of each LED lamp bead are electrically connected with the same metal wire, the paved metal wires replace metal wires obtained through etching, the processing technology is simplified, materials can be saved, pollution to the environment can be greatly reduced, and the luminescent back plate has good and stable conductive and heat dissipation performance, so that the stability of the overall performance of the luminescent back plate is guaranteed.
Drawings
FIG. 1 is a schematic diagram of a luminescent back plate according to the present utility model;
FIG. 2 is a schematic view of the structure of FIG. 1A in a partially enlarged form;
FIG. 3 is a partial cross-sectional view of a first embodiment of a luminescent back plate according to the present utility model;
FIG. 4 is a partial cross-sectional view of a second embodiment of a luminescent back plate according to the present utility model;
FIG. 5 is a partial cross-sectional view of a third embodiment of a luminescent back plate according to the present utility model;
fig. 6 is a partial sectional view of a light emitting back plate according to a fourth embodiment of the present utility model.
In the above figures: 1. a metal substrate; 2. LED lamp beads; 3. an insulating layer; 4. a metal wire; 5. an adhesive layer; 6. a connector; 61. pins; 7. a reflective coating; 8. an insulating coating layer.
Description of the embodiments
The present patent will be further understood by the specific examples given below, which are not intended to be limiting.
Example 1: a luminescent back plate, which can be used as a backlight module of a liquid crystal display, comprising: the LED lamp comprises a metal substrate 1 and a plurality of LED lamp beads 2, wherein an insulating layer 3 is coated on one side surface of the metal substrate 1, a plurality of metal wires 4 are paved on the surface of the insulating layer 3 opposite to the metal substrate 1, the metal wires 4 are connected with the insulating layer 3 in an adhesive mode through an adhesive layer 5, and a positive electrode bonding pad and a negative electrode bonding pad of each LED lamp bead 2 are electrically connected with the same metal wire 4.
The device is also provided with a plurality of connectors 6 which are arranged at intervals, and the positive electrode end and the negative electrode end of each metal wire 4 are correspondingly connected with 2 pins 61 on the same connector 6;
the metal wires 4 in the area right below the positive electrode bonding pad and the negative electrode bonding pad of the LED lamp bead 2 are distributed in an arc shape, so that the welding contact area between the lamp bead bonding pad and the metal wires can be increased, the conductivity and the structural stability of electric connection are improved, the contact resistance can be reduced, and the energy consumption is saved;
the positive electrode bonding pad and the negative electrode bonding pad of the LED lamp bead 2 are connected with the metal wire 4 through soldering tin;
the insulating layer 3 is opposite to the surface of the metal substrate 1 and is coated with a reflective coating 7 outside the metal wire 4;
the metal substrate 1 is an aluminum substrate;
the LED lamp beads 2 are Mini-LED lamp beads;
the LED lamp beads 2 are white LED lamp beads.
Example 2: a luminescent back plate comprising: the LED lamp comprises a metal substrate 1 and a plurality of LED lamp beads 2, wherein an insulating layer 3 is coated on one side surface of the metal substrate 1, a plurality of metal wires 4 are paved on the surface of the insulating layer 3 opposite to the metal substrate 1, the metal wires 4 are connected with the insulating layer 3 in an adhesive mode through an adhesive layer 5, and a positive electrode bonding pad and a negative electrode bonding pad of each LED lamp bead 2 are electrically connected with the same metal wire 4.
The LED lamp is characterized by further comprising a plurality of connectors 6 which are arranged at intervals, wherein the positive end and the negative end of each metal wire 4 are correspondingly connected with 2 pins 61 on the same connector 6, the plurality of metal wires are divided into a plurality of groups, each group is connected with the same connector, grouping control of lamp beads is realized through control of the connectors, and the LED lamp is convenient to overhaul;
the metal wires 4 in the area right below the positive electrode bonding pad and the negative electrode bonding pad of the LED lamp bead 2 are distributed in an arc shape;
the positive electrode bonding pad and the negative electrode bonding pad of the LED lamp bead 2 are connected with the metal wire 4 through soldering tin;
the metal substrate 1 is a copper substrate;
the LED lamp beads 2 are Micro-LED lamp beads;
the outer side of the metal wire 4 is provided with an insulating coating layer 8, so that the staggered stacking of the metal wires can be realized, the distribution space of the metal wires and the connection selection of the metal wires, the lamp beads and the connectors are enlarged, different connection and control modes of the lamp beads are convenient to realize, the expansion of the subsequent use scene is convenient, for example, the zoning, banding, color separation control or interval control of the lamp beads are realized;
the LED lamp beads 2 are RGB LED lamp beads.
In the processing process, firstly, insulating paint is sprayed on the surface of a metal substrate to form a high-temperature-resistant insulating layer, then, the metal wire is paved on the surface of the insulating layer through printing equipment of the metal wire according to a designed wiring mode, an adhesive for bonding the metal wire and the insulating layer can be sprayed on the surface of the metal layer in a pre-coating mode to form an adhesive layer, or the metal wire can pass through the adhesive before printing the metal wire so as to form the adhesive layer on the outer surface of the metal wire and then bond the adhesive layer with the insulating layer, and then, the LED lamp beads are welded on the wire one by one in an SMT mode;
besides good structural performance, the metal substrate has good heat dissipation performance, heat generated by the lamp beads can be discharged outwards in time, the stability of the performance of the display module is guaranteed, and metal wires are used for replacing wires which are required to be formed through copper paving on the whole surface and then etched, so that materials are saved, the processing process can be simplified, the flexibility of wire distribution is improved, pollution to the environment can be greatly reduced, and the requirements of current production are met.
When the luminous backboard is adopted, the metal wires obtained by etching are replaced by paved metal wires, so that the processing technology is simplified, the materials can be saved, the environmental pollution can be greatly reduced, and the luminous backboard has good and stable electric conduction and heat dissipation performance, so that the stability of the overall performance of the luminous backboard is ensured.
The above embodiments are provided to illustrate the technical concept and features of the present utility model and are intended to enable those skilled in the art to understand the content of the present utility model and implement the same, and are not intended to limit the scope of the present utility model. All equivalent changes or modifications made in accordance with the spirit of the present utility model should be construed to be included in the scope of the present utility model.
Claims (7)
1. A luminescent back plate comprising: metal substrate (1) and a plurality of LED lamp pearl (2), its characterized in that: an insulating layer (3) is coated on one side surface of the metal substrate (1), a plurality of metal wires (4) are paved on the surface of the insulating layer (3) opposite to the metal substrate (1), the metal wires (4) are connected with the insulating layer (3) in an adhesive mode through an adhesive layer (5), and a positive electrode bonding pad and a negative electrode bonding pad of each LED lamp bead (2) are electrically connected with the same metal wire (4).
2. A luminescent back plate according to claim 1, wherein: the device is also provided with a plurality of connectors (6) which are arranged at intervals, and the positive electrode end and the negative electrode end of each metal wire (4) are correspondingly connected with 2 pins (61) on the same connector (6).
3. A luminescent back plate according to claim 1, wherein: and the metal wires (4) in the area right below the positive electrode bonding pad and the negative electrode bonding pad of the LED lamp bead (2) are distributed in an arc shape.
4. A luminescent back plate according to claim 1, wherein: the positive electrode bonding pad and the negative electrode bonding pad of the LED lamp bead (2) are connected with the metal wire (4) through soldering tin.
5. A luminescent back plate according to claim 1, wherein: the metal substrate (1) is an aluminum substrate or a copper substrate.
6. A luminescent back plate according to claim 1, wherein: the LED lamp beads (2) are Mini-LED lamp beads or Micro-LED lamp beads.
7. A luminescent back plate according to claim 1, wherein: an insulating coating layer (8) is arranged on the outer side of the metal wire (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321925152.3U CN220324478U (en) | 2023-07-21 | 2023-07-21 | Luminous backboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321925152.3U CN220324478U (en) | 2023-07-21 | 2023-07-21 | Luminous backboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220324478U true CN220324478U (en) | 2024-01-09 |
Family
ID=89412189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321925152.3U Active CN220324478U (en) | 2023-07-21 | 2023-07-21 | Luminous backboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220324478U (en) |
-
2023
- 2023-07-21 CN CN202321925152.3U patent/CN220324478U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |