CN218730937U - Double-color COB light source - Google Patents
Double-color COB light source Download PDFInfo
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- CN218730937U CN218730937U CN202222446512.3U CN202222446512U CN218730937U CN 218730937 U CN218730937 U CN 218730937U CN 202222446512 U CN202222446512 U CN 202222446512U CN 218730937 U CN218730937 U CN 218730937U
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Abstract
The application discloses a double-color COB light source which comprises a metal substrate, a first-color LED chip set, a second-color LED chip set, a first power supply positive bonding pad, a first power supply negative bonding pad, a second power supply positive bonding pad and a second power supply negative bonding pad; the first color LED chip groups are arranged in the middle of the metal substrate in a circular manner; the second color LED chip group is arranged on the metal substrate at the periphery of the first color LED chip group according to a circular ring shape; the first color LED chip set is electrically connected with the first power supply positive electrode bonding pad and the first power supply negative electrode bonding pad; the second color LED chip set is electrically connected with the second power supply positive electrode bonding pad and the second power supply negative electrode bonding pad, so that a flexibly-controlled double-color light-emitting effect is achieved.
Description
Technical Field
The application relates to the technical field of lighting, especially, relate to a double-colored COB light source.
Background
The illumination is a topic that the modern society can not leave, and the current illumination modes are various. The Chip-On-Board light source is also called as a COB (Chip On Board) light source, and the COB light source is a high-power integrated surface light source, is stable in electrical property and uniform in light emission. Lighting devices using COB light sources as light-emitting bodies have been widely used in various industries.
In the process of realizing the prior art, the inventor finds that:
the conventional COB light source has single color and double colors, although the double-color COB light source realizes the synthesis of cold light and warm light, the cold light and warm light are simultaneously controlled in a unified power supply mode, the control mode is single, and the double-color light emitting effect is poor.
Therefore, it is necessary to provide a related technical scheme that the two light emitters in the two-color COB light source can be flexibly powered, the control mode is flexible, and the light emitting effect is better.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides one kind can be for the nimble power supply of two kinds of luminous bodies in the double-colored COB light source, control mode is nimble, the better relevant technical scheme of luminous effect for solve the simultaneous control of current double-colored COB light source through the mode realization cold light of unified power supply and warm light, control mode is single, the not good technical problem of double-colored luminous effect.
The application provides a double-color COB light source which comprises a metal substrate, a first-color LED chip set, a second-color LED chip set, a first power supply positive bonding pad, a first power supply negative bonding pad, a second power supply positive bonding pad and a second power supply negative bonding pad;
the first color LED chip groups are arranged in the middle of the metal substrate in a circular manner;
the second color LED chip group is arranged on the metal substrate at the periphery of the first color LED chip group according to a circular ring shape;
the first color LED chip set is electrically connected with the first power supply positive electrode bonding pad and the first power supply negative electrode bonding pad;
and the second color LED chip group is electrically connected with the second power supply positive electrode bonding pad and the second power supply negative electrode bonding pad.
Furthermore, the first color LED chip group comprises a plurality of first color LED chips which are electrically connected in sequence through gold wires;
the second-color LED chip group comprises a plurality of second-color LED chips which are electrically connected in sequence through gold wires.
Furthermore, two circular white colloids are arranged on the inner periphery and the outer periphery of the ring formed by the second color LED chip groups.
Furthermore, the positions of the first color LED chip group and the second color LED chip group are coated with fluorescent powder.
Furthermore, the metal substrate comprises a bottom metal, an insulating layer and a copper foil circuit layer;
the insulating layer covers the upper surface of the bottom metal;
the copper foil circuit layer is arranged on the surface of the insulating layer.
Furthermore, the copper foil circuit layer is a gold-plated copper foil circuit layer.
Further, the first color LED chip set includes a first positive electrode and a first negative electrode which are connected to the outside;
the second color LED chip set comprises a second positive electrode and a second negative electrode which are externally connected;
the first positive electrode is connected with the first power supply positive electrode bonding pad through the copper foil circuit layer;
the first negative electrode is connected with the first power supply negative electrode bonding pad through the copper foil circuit layer;
the second positive electrode is connected with the second power supply positive electrode bonding pad through the copper foil circuit layer;
the second negative electrode is connected with the second power supply negative electrode bonding pad through the copper foil circuit layer.
Further, the metal substrate is a square substrate;
the square substrate comprises a first diagonal line and a second diagonal line;
two corners where the first diagonal line of the square substrate is located are respectively provided with a first through hole and a second through hole;
the first through hole and the second through hole are symmetrically arranged on two sides of the second diagonal line.
Further, the first power supply positive electrode bonding pad and the second power supply positive electrode bonding pad are arranged at one corner of the square substrate where the second diagonal line is located;
the first power supply negative electrode bonding pad and the second power supply negative electrode bonding pad are arranged at the other corner of the square substrate where the second diagonal line is located.
Further, the display device also comprises a first main power supply pad and a second main power supply pad;
the first main power supply bonding pad and the second main power supply bonding pad are arranged at one corner where the first diagonal line is located;
the first main power supply bonding pad and the second main power supply bonding pad are symmetrically arranged on two sides of the first diagonal line.
The embodiment provided by the application has at least the following beneficial effects:
through setting up first color LED chip group in the positive centre of metal substrate according to circular arrangement, second color LED chip group according to the ring shape in first color LED chip group periphery set up in on the metal substrate, the circular luminous zone of the first colour based on first color LED chip group and the ring shape of the second colour based on second color LED chip group have been formed and have been sent out the light zone, through with first color LED chip group electric connection between first power anodal pad and first power negative pole pad, with second color LED chip group electric connection between second power anodal pad and second power negative pole pad, can send out light zone independent control to inside circular luminous zone and outside ring shape, realize supplying power for two kinds of luminous bodies in the double-colored COB light source in a flexible way, the control mode is nimble, the better technological effect of luminous effect.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic structural diagram of a two-color COB light source provided in an embodiment of the present application.
11. A metal substrate; 12. a first color LED chip set; 13. a second color LED chip set; 14. a first power supply positive electrode pad; 15. a first power supply negative electrode pad; 16. a second power supply positive electrode bonding pad; 17. a second power supply cathode pad; 18. a circular ring-shaped white colloid; 19. a first through hole; 20. a second through hole; 21. a first main power supply pad; 22. a second main power supply pad; 100. two-color COB light source.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, a two-color COB light source 100 provided in the present application includes a metal substrate 11, a first color LED chip set 12, a second color LED chip set 13, a first power positive pad 14, a first power negative pad 15, a second power positive pad 16, and a second power negative pad 17;
the first color LED chip sets 12 are arranged in a circle in the middle of the metal substrate 11;
the second color LED chip set 13 is arranged on the metal substrate 11 at the periphery of the first color LED chip set 12 in an annular shape;
the first color LED chip set 12 is electrically connected to the first power supply positive electrode bonding pad 14 and the first power supply negative electrode bonding pad 15;
the second color LED chip set 13 is electrically connected to the second power supply positive electrode bonding pad 16 and the second power supply negative electrode bonding pad 17.
In the two-color COB light source 100 of the present application, the bottom portion is a metal substrate 11 with high thermal conductivity. The first color LED chip group 12 and the second color LED chip group 13 are fixed on the metal substrate 11 by using solder paste according to the circuit design. In the two-color COB light source 100 of the present application, the position of the first color LED chip set 12 and the position of the second color LED chip set 13 are divided into two light emitting regions, i.e., an inner light emitting region and an outer light emitting region. The inner circle is the position of the first color LED chip group 12, the color of the inner circle is preferably high color rendering high TLCI white light, and the color temperature range of the inner circle is 3000-9000k. The outer ring is where the second color LED chip set 13 is located, preferably amber in color. The inner and outer ring regions form a tight circular ring. In the present application, the control circuits where the two light emitting areas of the inner ring and the outer ring are located are two separate control circuits, that is, the first color LED chip set 12 in the inner ring is a separate control circuit, and the second color LED chip set 13 in the outer ring is another separate control circuit. The first power positive pad 14 and the first power negative pad 15 individually supply power to the first color LED chip set 12. Second power positive pad 16 and second power negative pad 17 provide power solely to second color LED chip set 13. In fig. 1, the first power supply positive electrode pad 14 is denoted by 1+, the first power supply negative electrode pad 15 is denoted by 1-, the second power supply positive electrode pad 16 is denoted by 2+, and the second power supply negative electrode pad 17 is denoted by 2-. The double-colored COB light source 100 in this application can realize the gorgeous color effect of high color rendering and color matching through inside and outside independent control.
Further, the first color LED chip set 12 includes a plurality of first color LED chips electrically connected in sequence through gold wires;
the second color LED chip set 13 includes a plurality of second color LED chips electrically connected in sequence through gold wires.
It should be noted that the gold wire is a high-purity gold wire, and a bonding gold wire is preferable. The first color LED chip is preferably an amber LED chip. The first color LED chips in the first color LED chip set 12 are preferably connected in series by gold wires. The second color LED chip is preferably a high color rendering high TLCI white LED chip. The second color LED chips inside the second color LED chip group 13 are preferably connected in series by gold wires. The electrodes of the LED chips in the first color LED chip set 12 and the second color LED chip set 13 are electrically connected through gold wires, so that the electrical conductivity and the thermal compression performance can be effectively improved.
Furthermore, two circular white colloids 18 are arranged on the inner and outer peripheries of the ring formed by the second color LED chip sets 13.
It should be noted that, in the two-color COB light source 100 of the present application, the white colloid is used to divide the position of the first color LED chip set 12 and the position of the second color LED chip set 13 into an inner light emitting area and an outer light emitting area, both the two areas are independently controlled, and the inner area and the outer area form a tight ring. The position of the first color LED chip set 12 and the position of the second color LED chip set 13 are divided into two regions by the two annular white colloids 18, so that crosstalk of light at the boundary of the light emitting region can be effectively prevented, and the light emitting effect is not affected.
Further, the positions of the first color LED chip set 12 and the second color LED chip set 13 are coated with fluorescent powder.
It is understood that the luminous efficiency can be improved by coating the fluorescent powder, and the light color can be more soft or bright.
Further, the metal substrate 11 includes a bottom metal, an insulating layer, and a copper foil circuit layer;
the insulating layer covers the upper surface of the bottom metal;
the copper foil circuit layer is arranged on the surface of the insulating layer.
It should be noted that the metal substrate 11 in the present application is composed of a bottom metal, an insulating layer, and a copper foil wiring layer. The base metal includes, but is not limited to, metals such as copper or aluminum. The bottom metal is covered with an insulating layer, and an etched copper foil circuit layer is arranged on the insulating layer. The copper foil circuit layer is electrically connected with the first color LED chip group 12 and the second color LED chip group 13, and the first color LED chip group 12 and the second color LED chip group 13 are electrically connected with the first power positive electrode bonding pad 14, the first power negative electrode bonding pad 15, the second power positive electrode bonding pad 16 and the second power negative electrode bonding pad 17 through the copper foil circuit layer. Finally, the first color LED chip set 12 and the second color LED chip set 13 can be powered through the first power supply positive electrode pad 14, the first power supply negative electrode pad 15, the second power supply positive electrode pad 16 and the second power supply negative electrode pad 17.
Furthermore, the copper foil circuit layer is a gold-plated copper foil circuit layer.
As can be appreciated, gold plating has many advantages such as low contact resistance, good electrical conductivity, ease of soldering, corrosion resistance, etc. This application can effectively reduce the power loss for the transmission line of first look LED chip group 12, the power supply of second look LED chip group 13 through adopting gold-plated copper foil circuit layer.
Further, the first color LED chip set 12 includes a first positive electrode and a first negative electrode connected to the outside;
the second color LED chip set 13 includes a second positive electrode and a second negative electrode connected to the outside;
the first positive electrode is connected with the first power supply positive electrode bonding pad 14 through the copper foil circuit layer;
the first negative electrode is connected with the first power supply negative electrode bonding pad 15 through the copper foil circuit layer;
the second positive electrode is connected with the second power supply positive electrode bonding pad 16 through the copper foil circuit layer;
the second negative electrode is connected with the second power supply negative electrode bonding pad 17 through the copper foil circuit layer.
It is noted that the first color LED chip set 12 and the second color LED chip set 13 in the present application are powered and controlled by separate lines, respectively. The first power supply positive electrode bonding pad 14 and the first power supply negative electrode bonding pad 15 provide power for the first color LED chip group 12 through the first positive electrode and the first negative electrode to be controlled independently. The second power supply positive electrode bonding pad 16 and the second power supply negative electrode bonding pad 17 provide power for the second color LED chip group 13 through a second positive electrode and a second negative electrode in an independent control mode.
Further, the metal substrate 11 is a square substrate;
the square substrate comprises a first diagonal line and a second diagonal line;
two corners where the first diagonal line of the square substrate is located are respectively provided with a first through hole 19 and a second through hole 20;
the first through hole 19 and the second through hole 20 are symmetrically arranged on two sides of the second diagonal line.
It will be appreciated that the two-color COB light source 100 requires a secure mounting for a particular use. This application sets up first through-hole 19, second through-hole 20 respectively through two minutes at the first diagonal place of square base plate, for the user has prepared the fixed orifices in advance, the fixed operation of being convenient for.
Further, the first power supply positive electrode bonding pad 14 and the second power supply positive electrode bonding pad 16 are arranged at one corner of the square substrate where the second diagonal line is located;
the first power supply cathode bonding pad 15 and the second power supply cathode bonding pad 17 are arranged at the other corner of the square substrate where the second diagonal line is located.
It should be noted that the first power supply positive electrode pad 14 and the second power supply positive electrode pad 16 are disposed at one corner of the square substrate where the second diagonal line is located, the first power supply negative electrode pad 15 and the second power supply negative electrode pad 17 are disposed at the other corner of the square substrate where the second diagonal line is located, and the positive electrode pad and the negative electrode pad are respectively disposed at diagonal positions, so that the situation that the polarities are connected in a wrong manner during installation can be effectively avoided.
Further, a first main power supply pad 21, a second main power supply pad 22;
the first main power supply pad 21 and the second main power supply pad 22 are arranged at one corner where the first diagonal line is located;
the first main power supply pad 21 and the second main power supply pad 22 are symmetrically disposed on both sides of the first diagonal line.
It can be understood that when an external power supply is introduced, external interfaces need to be reduced as much as possible, and safety is improved. This application can provide unified external power supply for two-tone COB light source 100 through setting up first main power supply pad 21, second main power supply pad 22. The external power supply can be respectively connected with the first power supply positive electrode bonding pad 14, the first power supply negative electrode bonding pad 15, the second power supply positive electrode bonding pad 16 and the second power supply negative electrode bonding pad 17 through corresponding controllers. The first color LED chip group 12 connected to the first power supply positive electrode pad 14 and the first power supply negative electrode pad 15 can be controlled individually by the controller, and the second color LED chip group 13 connected to the second power supply positive electrode pad 16 and the second power supply negative electrode pad 17 can be controlled individually by the controller. The number of the controllers can be one or two, and the controllers are specifically selected according to the functions of the controllers.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of other like elements in a process, method, article, or apparatus comprising the element.
As will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. A double-color COB light source is characterized by comprising a metal substrate, a first color LED chip set, a second color LED chip set, a first power supply positive bonding pad, a first power supply negative bonding pad, a second power supply positive bonding pad and a second power supply negative bonding pad;
the first color LED chip groups are arranged in the middle of the metal substrate in a circular manner;
the second color LED chip group is arranged on the metal substrate at the periphery of the first color LED chip group in a circular shape;
the first color LED chip set is electrically connected with the first power supply positive electrode bonding pad and the first power supply negative electrode bonding pad;
and the second color LED chip group is electrically connected with the second power supply positive electrode bonding pad and the second power supply negative electrode bonding pad.
2. The bi-color COB light source of claim 1, wherein the first color LED chip set includes a plurality of first color LED chips electrically connected in sequence by gold wires;
the second-color LED chip group comprises a plurality of second-color LED chips which are electrically connected in sequence through gold wires.
3. The dual-color COB light source of claim 1 wherein a total of two annular white colloids are disposed within and about the annulus formed by the second color LED chip set.
4. The bi-color COB light source of claim 1, wherein the first color LED chip set and the second color LED chip set are coated with phosphor.
5. The bi-color COB light source of claim 1 wherein the metal substrate includes an underlying metal, an insulating layer, a copper foil circuit layer;
the insulating layer covers the upper surface of the bottom metal;
the copper foil circuit layer is arranged on the surface of the insulating layer.
6. A two-color COB light source according to claim 5, wherein said copper foil circuit layer is a gold-plated copper foil circuit layer.
7. The bi-color COB light source of claim 5, wherein the first color LED chip set includes a first positive electrode and a first negative electrode connected externally;
the second color LED chip set comprises a second positive electrode and a second negative electrode which are externally connected;
the first positive electrode is connected with the first power supply positive electrode bonding pad through the copper foil circuit layer;
the first negative electrode is connected with the first power supply negative electrode bonding pad through the copper foil circuit layer;
the second positive electrode is connected with the second power supply positive electrode bonding pad through the copper foil circuit layer;
the second negative electrode is connected with the second power supply negative electrode bonding pad through the copper foil circuit layer.
8. The bi-color COB light source of claim 1, wherein the metal substrate is a square substrate;
the square substrate comprises a first diagonal line and a second diagonal line;
two corners where the first diagonal line of the square substrate is located are respectively provided with a first through hole and a second through hole;
the first through hole and the second through hole are symmetrically arranged on two sides of the second diagonal line.
9. The bi-color COB light source of claim 8, wherein the first positive power pad and the second positive power pad are disposed at one corner of the square substrate at which the second diagonal lies;
the first power supply negative electrode bonding pad and the second power supply negative electrode bonding pad are arranged at the other corner of the square substrate where the second diagonal line is located.
10. The two-color COB light source of claim 8 further comprising a first main power supply pad, a second main power supply pad;
the first main power supply bonding pad and the second main power supply bonding pad are arranged at one corner where the first diagonal line is located;
the first main power supply bonding pad and the second main power supply bonding pad are symmetrically arranged on two sides of the first diagonal line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222446512.3U CN218730937U (en) | 2022-09-13 | 2022-09-13 | Double-color COB light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222446512.3U CN218730937U (en) | 2022-09-13 | 2022-09-13 | Double-color COB light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218730937U true CN218730937U (en) | 2023-03-24 |
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ID=85634565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222446512.3U Active CN218730937U (en) | 2022-09-13 | 2022-09-13 | Double-color COB light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218730937U (en) |
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2022
- 2022-09-13 CN CN202222446512.3U patent/CN218730937U/en active Active
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