CN214411163U - FC encapsulation chip glue sealing device - Google Patents
FC encapsulation chip glue sealing device Download PDFInfo
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- CN214411163U CN214411163U CN202120504158.8U CN202120504158U CN214411163U CN 214411163 U CN214411163 U CN 214411163U CN 202120504158 U CN202120504158 U CN 202120504158U CN 214411163 U CN214411163 U CN 214411163U
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Abstract
The utility model relates to a FC encapsulation chip molding equipment, include: a base; the bracket is fixed on the base and comprises a support column, a first fixing piece and a second fixing piece, the first fixing piece is used for installing a glue sealing needle, the second fixing piece is used for installing a magnifier, the first fixing piece is positioned below the second fixing piece, and the installed glue sealing needle is opposite to the installed magnifier; the lifting column is fixed on the base and opposite to the supporting column in position, and an object stage for placing the black glue and the chip is fixed at the top end of the lifting column in a horizontally movable mode. The utility model discloses simple structure, convenient operation is quick, has improved operation precision and work efficiency, has reduced working cost.
Description
Technical Field
The utility model relates to a chip seals the glue field, in particular to FC encapsulation chip molding equipment.
Background
Flip Chip (FC for short) is a packaging form of Chip, its volume is very small, in order to repair the circuit, it is usually necessary to open a fine groove on the back of the FC packaged Chip, and the groove can only be seen clearly with a magnifying glass. Therefore, when the FC package chip is sealed, a sealing machine cannot be used for sealing, because the dosage of the sealing machine is large, and manual operation can only be performed manually.
The traditional manual operation method is as follows: dipping a small amount of black glue on a ground metal needle head, and manually moving the metal needle head dipped with the black glue to the position above the groove to allow the black glue to slowly permeate into the groove.
The above-described operating method has a number of drawbacks:
1. the metal needle head is hard in material and narrow in operation space, manual operation is not easy to control, the metal needle head is easy to collide with the surface of the chip, and wiring inside the chip is further damaged to cause chip failure;
2. the width of the metal needle head is difficult to be extremely small, so that the quantity of the black glue which is stained is difficult to control, the black glue is easy to overflow above two sides of the groove due to excessive amount of the black glue, and the subsequent cleaning is needed;
3. in the operation process, operators need to pay high attention, and if misoperation occurs, black glue is left on the surface of a chip, so that subsequent cleaning is more troublesome;
4. the requirement on operators is high, the labor cost is increased, the operation efficiency is low, and the working cost is increased.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a FC encapsulation chip molding equipment, simple structure, convenient operation is quick, has improved operation precision and work efficiency, has reduced working cost.
The utility model discloses a following scheme realizes: an FC packaging chip glue sealing device comprises:
a base;
the bracket is fixed on the base and comprises a support column, a first fixing piece and a second fixing piece, the first fixing piece is used for installing a glue sealing needle, the second fixing piece is used for installing a magnifier, the first fixing piece is positioned below the second fixing piece, and the installed glue sealing needle is opposite to the installed magnifier;
the lifting column is fixed on the base and opposite to the supporting column in position, and an object stage for placing the black glue and the chip is fixed at the top end of the lifting column in a horizontally movable mode.
The utility model discloses a support is fixed magnifying glass and is sealed the rubber needle, cooperation lift post and objective table realize bearing and removing of glue and chip, easy operation, convenience have improved the accuracy and the work efficiency who seals the glue, and the cost is reduced has avoided traditional manual operation not easily to control, has required higher, the operating efficiency is low, increase cost scheduling problem to operating personnel.
The utility model discloses FC encapsulation chip molding equipment's further improvement lies in, seal the gluey needle and make by soft material.
The utility model discloses FC encapsulation chip molding equipment's further improvement lies in, the syringe needle width of sealing the plastic pin does not exceed the width of minimum recess on the chip.
The utility model discloses FC encapsulation chip molding equipment's further improvement lies in, seal gluey needle detachably install in on the first mounting.
The utility model discloses FC encapsulation chip molding equipment's further improvement lies in, molding equipment is still including being used for striking off the frictioning needle that remains the ebonite on the chip pin, frictioning needle detachably install in on the first mounting.
The utility model discloses FC encapsulation chip molding equipment's further improvement lies in, first mounting includes:
the first fixing part is vertically arranged on the supporting column, one side of the first fixing part, which is close to the lifting column, is provided with a first jack and a first fastener which can penetrate into the first jack along the radial direction of the first jack;
the first end of the needle rod is inserted into the first insertion hole and is abutted and fixed through the first fastener, and the second end of the needle rod is used for installing the sealing glue needle and points to the objective table.
The utility model discloses FC encapsulation chip molding equipment's further improvement lies in, the second mounting install perpendicularly in on the support column, the second mounting is close to the confession has been seted up to one side of lift post the handle of magnifying glass is inserted the second jack of establishing and is equipped with and follows the second jack radially penetrates and support extremely the second fastener of handle.
The utility model discloses FC encapsulation chip molding equipment's further improvement lies in, the objective table is including making the X knob that the objective table removed along the X direction and can make the Y knob that the objective table removed along the Y direction.
Drawings
Fig. 1 shows the overall structure of the sealing device of the present invention.
Fig. 2 shows an enlarged view at a in fig. 1.
Fig. 3 shows a state diagram of the chip during the encapsulation process.
Detailed Description
In order to solve the artifical manual drawback that seals the operation and exist of gluing to FC encapsulation chip of tradition, the utility model provides a FC encapsulation chip adhesive sealing device, simple structure, convenient operation is quick, has improved operation precision and work efficiency, has reduced working cost.
The following describes the FC package chip molding apparatus with reference to the drawings.
Referring to fig. 1 and 2, fig. 1 shows a schematic view of the overall structure of the glue sealing device of the present invention, and fig. 2 shows an enlarged view of a position a in fig. 1.
An FC packaging chip glue sealing device comprises:
a base 1;
the support is fixed on the base 1 and comprises a support column 2, a first fixing piece 3 for installing a glue sealing needle 5 and a second fixing piece 4 for installing a magnifier 6, wherein the first fixing piece 3 is positioned below the second fixing piece 4, and the glue sealing needle 5 after being installed is opposite to the magnifier 6 after being installed;
a lifting column 7 fixed on the base 1 and opposite to the supporting column 2, wherein the top end of the lifting column 7 is fixed with a stage 8 for placing black glue 9 and a chip 10 in a horizontally movable way.
Specifically, the base 1 is a rectangular base, the supporting pillar 2 is cylindrical and is disposed on the right side of the base 1, the lifting pillar 7 is disposed on the left side of the base 1, the first fixing member 3 is preferably disposed in the middle of the supporting pillar 2, and the second fixing member 4 is preferably disposed on the upper portion of the supporting pillar 2.
As a preferred embodiment, the first fixing member 3 includes:
the first fixing portion 31 is vertically installed on the supporting pillar 2, and a first insertion hole is formed on one side of the first fixing portion 31 close to the lifting pillar 7 and a first fastening member 32 capable of radially penetrating into the first insertion hole along the first insertion hole is installed.
A needle bar 33, a first end of the needle bar 33 is inserted into the first insertion hole and is abutted and fixed by the first fastener 32, and a second end of the needle bar 33 is used for installing the molding needle 5 and points to the objective table 8.
Through the arrangement, the angle of the needle rod 33 can be freely adjusted, and the needle rod is locked by the first fastener 32 after being adjusted in position, so that the glue sealing needle 5 has the optimal angle to contact the black glue 9 and the chip 10.
As a preferred embodiment, the second fixing member 4 is vertically installed on the supporting pillar 2, and one side of the second fixing member 4 close to the lifting pillar 7 is provided with a second insertion hole for the handle of the magnifying glass 6 to be inserted into, and is provided with a second fastening member 41 which can radially penetrate along the second insertion hole and abut against the handle.
Through the arrangement, the angle of the window of the magnifier 6 can be freely adjusted, and the magnifier 6 can be locked by the second fastener 41 after being adjusted in position, so that the magnifier 6 has the best observation angle.
As a preferred embodiment, as shown in fig. 2, the stage 8 includes an X knob 81 for moving the stage 8 in the X direction and a Y knob 82 for moving the stage 8 in the Y direction.
Specifically, the adjustment of the stage 8 by the lifting column 7 in the height direction and the adjustment of the stage 8 by the X knob 81 and the Y knob 82 in the horizontal direction can be achieved by conventional mechanisms, and this embodiment is preferably achieved by a simple gear structure. Through the arrangement of the lifting column 7, the X knob 81 and the Y knob 82, the three-dimensional movement of the object stage 8 can be realized, so that the purpose of randomly adjusting the position of the object stage 8 is achieved, and the precision of the glue sealing operation is further improved.
When the glue sealing device is used for sealing the chip 10, the chip 10 and the black glue 9 are fixed and placed on the objective table 8, the position of the black glue 9 and the position of the chip 10 are alternately positioned at the glue sealing needle 5 by adjusting the lifting height of the lifting column 7 and the horizontal position of the objective table 8, and the glue sealing operation is repeatedly realized. Specifically, referring to fig. 2 in conjunction with fig. 3, fig. 3 shows a state diagram of the chip during the molding process.
1. The uncapped state of the chip 10 is shown as S1 in fig. 3.
2. The chip 10 is uncapped as shown in S2 in fig. 3, and the uncapped chip leaks out of the groove 101 to be sealed. The black paste 9 and the uncapped chip are placed and fixed on the stage 8, as shown in fig. 2.
3. Adjusting the position of the object stage 8 to locate the black glue 9 at the position of the glue sealing needle 5, so that a certain amount of the black glue 9 is adhered to the glue sealing needle 5, adjusting the position of the object stage 8 again to locate the chip 10 at the position of the glue sealing needle 5, so that the glue sealing needle 5 extends into the groove 101, and at this time, the state of the chip is shown as S3 in fig. 3. The black glue 9 on the molding needles 5 is automatically filled into the groove 101, and the process is repeated for a plurality of times until the groove 101 is filled, and the state of the chip is shown as S4 or S6 in fig. 3.
In a preferred embodiment, the molding needles 5 are made of a soft material. The sealing glue needle 5 is made of a soft material, a thinner needle head is easily polished, and the width of the needle head of the sealing glue needle 5 is not more than the width of the minimum groove 101 on the chip 10, in this embodiment, the specification of the conventional chip 10 is combined, and the width of the needle head is preferably 0.1 mm. Because the glue sealing needle 5 is extremely fine and soft: on one hand, the dosage of the black adhesive can be more accurately controlled, so that the adhesive sealing needle 5 can take the dipped black adhesive to jointly extend into the fine groove 101, as shown in a chip state S3 in fig. 3, the purpose of accurately controlling the filling of the groove 101 is achieved, and the adhesive sealing efficiency and the adhesive sealing quality are improved; on the other hand, even if the sealing needle 5 touches the chip 10 carelessly, the chip 10 will not be damaged, the risk of damaging the internal circuit of the chip 10 is reduced, and the sealing quality is improved to the maximum extent.
As a preferred embodiment, the molding needle 5 is detachably mounted on the first fixing member 3. Through the detachable installation form of the glue sealing needle 5, the replacement of the glue sealing needle 5 is convenient, and the use of the glue sealing device is more flexible.
As a preferred embodiment, the molding device further includes a glue scraping needle 5 'for scraping off residual black glue on the leads of the chip 10, wherein the glue scraping needle 5' is detachably mounted on the first fixing member 3.
Specifically, the head of the squeegee needle 5 'is preferably an enlarged stainless steel blade, as shown in a chip state S5 in fig. 3, so as to rapidly scrape off the protruding black glue on the surface of the chip 10, and further, the tin on the surface of the lead can be scraped bright, because the chip 10 is usually unsealed by a chemical method, which easily causes the surface of the chip 10 to be oxidized and is not beneficial to the contact of the solder joint, in this embodiment, the squeegee needle 5' is used to scrape off the residual black glue on the surface on the one hand and scrape off the surface of the lead on the other hand, so as to achieve the purpose of good contact of the solder joint.
The scraping operation using the doctor pin 5' includes the steps of: when the black glue 9 is filled into the groove 101 repeatedly, the black glue 9 is lifted up through the adjustment of the magnifier 6 and the lifting column 7, the depth of field of the sealant position is observed, the filling condition of the black glue 9 is judged, when the glue of the black glue 9 protrudes out of the surface of the chip 10 (as shown in the chip state S4 in fig. 3), and when the filled black glue 9 is solidified to a certain hardness (about 30% solidification or hardness like wax), the sealant needle 5 is detached and replaced by the sealant scraping needle 5 ', the position of the objective table 8 is finely adjusted, so that the sealant needle 5' scrapes the protruding black glue 9, and the scraping operation is stopped after the tin on the surface of the pin is scraped (as shown in the chip states S5 and S6 in fig. 3).
The utility model discloses a support is fixed magnifying glass 6 and is sealed gluey needle 5, cooperation lift post 7 and objective table 8 realize bearing and removing of glue 9 and chip 10 to the black, easy operation, convenience have improved the accuracy and the work efficiency who seals the glue, and the cost is reduced has avoided traditional manual operation not easily to control, has required higher, the operating efficiency low, the increase cost scheduling problem to operating personnel.
The present invention has been described in detail with reference to the embodiments shown in the drawings, and those skilled in the art can make various modifications to the present invention based on the above description. Therefore, certain details of the embodiments should not be construed as limitations of the invention, which are intended to be covered by the following claims.
Claims (8)
1. An FC packaging chip glue sealing device comprises:
a base;
the bracket is fixed on the base and comprises a support column, a first fixing piece and a second fixing piece, the first fixing piece is used for installing a glue sealing needle, the second fixing piece is used for installing a magnifier, the first fixing piece is positioned below the second fixing piece, and the installed glue sealing needle is opposite to the installed magnifier;
the lifting column is fixed on the base and opposite to the supporting column in position, and an object stage for placing the black glue and the chip is fixed at the top end of the lifting column in a horizontally movable mode.
2. The FC package chip encapsulating apparatus of claim 1, wherein the encapsulating needle is made of a flexible material.
3. The FC package chip encapsulating apparatus of claim 1, wherein a tip width of the encapsulating needle does not exceed a width of a minimum groove on the chip.
4. The FC package chip molding apparatus of claim 1, wherein the molding pin is detachably mounted on the first fixing member.
5. The FC package chip sealing apparatus of claim 4, further comprising a squeegee for scraping residual black glue on the chip pins, wherein the squeegee is detachably mounted on the first fixing member.
6. The FC package chip encapsulating apparatus of claim 1, wherein the first securing member comprises:
the first fixing part is vertically arranged on the supporting column, one side of the first fixing part, which is close to the lifting column, is provided with a first jack and a first fastener which can penetrate into the first jack along the radial direction of the first jack;
the first end of the needle rod is inserted into the first insertion hole and is abutted and fixed through the first fastener, and the second end of the needle rod is used for installing the sealing glue needle and points to the objective table.
7. The FC package chip encapsulating apparatus as claimed in claim 1, wherein the second fixing member is vertically mounted on the supporting pillar, and a side of the second fixing member close to the lifting pillar is provided with a second insertion hole for inserting the handle of the magnifier, and a second fastening member capable of radially penetrating along the second insertion hole and abutting against the handle.
8. The FC package chip molding apparatus of claim 1, wherein the stage comprises an X-knob to move the stage in an X-direction and a Y-knob to move the stage in a Y-direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120504158.8U CN214411163U (en) | 2021-03-10 | 2021-03-10 | FC encapsulation chip glue sealing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120504158.8U CN214411163U (en) | 2021-03-10 | 2021-03-10 | FC encapsulation chip glue sealing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214411163U true CN214411163U (en) | 2021-10-15 |
Family
ID=78028828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120504158.8U Active CN214411163U (en) | 2021-03-10 | 2021-03-10 | FC encapsulation chip glue sealing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214411163U (en) |
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2021
- 2021-03-10 CN CN202120504158.8U patent/CN214411163U/en active Active
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Address after: Room C101, building 8, 1618 Yishan Road, Minhang District, Shanghai 201100 Patentee after: Su shiyite (Shanghai) Testing Technology Co.,Ltd. Address before: 201103 room C101, building 8, 1618 Yishan Road, Minhang District, Shanghai Patentee before: Suzhou Yite (Shanghai) Testing Technology Co.,Ltd. |