CN220006306U

CN220006306U - Tin-dispensing assembly and tin-dispensing equipment

Info

Publication number: CN220006306U
Application number: CN202321074710.XU
Authority: CN
Inventors: 李长浩; 白绳武; 欧文涛; 李阳
Original assignee: Xian Novastar Electronic Technology Co Ltd
Current assignee: Xian Novastar Electronic Technology Co Ltd
Priority date: 2023-04-28
Filing date: 2023-04-28
Publication date: 2023-11-14
Anticipated expiration: 2033-04-28

Abstract

The utility model provides a tin-plating assembly and tin-plating equipment, the tin-plating assembly comprises: a solder paste feeding tray (102) for holding solder paste; a tin-dropping needle (101) for dipping tin paste from the tin paste feeding tray (102) and dropping the dipped tin paste on a bonding pad; a flexible wiper (114) for inserting the spot tin needle (101) to wipe and remove the tin paste attached to the outer wall of the spot tin needle (101); a driving mechanism for driving the spot tin needle (101) and/or the flexible wiper (114) so that the spot tin needle (101) is inserted into the flexible wiper (114). According to the utility model, the wiping object is arranged to wipe and remove the solder paste remained on the outer wall of the spot tin needle, so that the uniformity and the moderate quantity of the solder paste adhered to the spot tin needle each time can be ensured, the spot tin assembly can still have good spot tin effect after long-time working, and a good foundation is laid for the subsequent steps of welding and the like.

Description

Tin-dispensing assembly and tin-dispensing equipment

Technical Field

The utility model relates to the technical field of semiconductor equipment, in particular to a tin-plating assembly and tin-plating equipment.

Background

In many processes, it is necessary to spot solder paste on the pads. For example, after a light-emitting diode (LED) panel is turned on, there may be abnormal problems such as dead lamp, dark lamp, bright lamp, string light, color cast, etc. of the lamp bead display, so that the LED panel with the defective lamp bead needs to be repaired. The repair of the LED lamp panel generally includes a plurality of steps such as removing, soldering, attaching, and die bonding, and each of the steps may be performed by different components of the lamp panel repair apparatus. After the defective lamp beads are removed from the circuit board by the removing assembly, the bonding pads corresponding to the defective lamp beads are exposed, and at the moment, solder paste can be printed on the bonding pads through the spot tin assembly, so that new lamp beads can be welded conveniently.

In the working process of the tin-plating assembly, a certain amount of tin paste is firstly stuck from the tin paste tray by tin-plating pins, and then the tin paste is stuck on the bonding pads of the circuit board in a point printing mode. In the related art, after the tin spot assembly works for a long time, the tin paste amount printed on the bonding pad is not uniform and controllable, so that the subsequent welding effect of the good lamp beads is not ideal, and the LED lamp panel welded with the good lamp beads still has the problem of abnormal display.

Disclosure of Invention

The embodiment of the utility model provides a tin-dispensing component and tin-dispensing equipment, which can ensure that the quantity of tin paste adhered to a tin-dispensing needle each time is uniform and moderate by wiping and removing the tin paste remained on the outer wall of the tin-dispensing needle through arranging a wiper, ensure that the tin-dispensing component still has good tin-dispensing effect after long-time working, and lay a good foundation for the subsequent steps of welding and the like.

In a first aspect, there is provided a spot tin assembly comprising: the solder paste feeding disc is used for bearing solder paste; the tin-dropping needle is used for dipping tin paste from the tin paste feeding tray and dropping the dipped tin paste on the bonding pad; the flexible wiper is used for the insertion of the spot tin needle to wipe and remove the tin paste attached to the outer wall of the spot tin needle; a driving mechanism for driving the spot tin needle and/or the flexible wiper to insert the spot tin needle into the flexible wiper.

The tin spot assembly provided by the embodiment of the utility model is provided with the flexible wiping object and the driving mechanism, under the driving action of the driving mechanism, the tin spot needle can be inserted into the flexible wiping object and separated from the flexible wiping object, and in the process of inserting the tin spot needle into the flexible wiping object and separating from the flexible wiping object, the flexible wiping object can scrape and clean the tin paste attached to the outer wall of the tin spot needle, so that the tin paste can be separated from the outer wall of the tin spot needle. Namely, the residual solder paste on the surface of the spot tin needle can be cleaned, and the next solder paste quantity is ensured. The tin-plating needle can not cause adverse effect on the dipped tin paste amount in the subsequent tin-plating process, ensures that the dipped tin paste amount can be uniform and moderate every time, ensures that the tin-plating assembly still has good tin-plating effect after long-time work, lays a good foundation for subsequent welding and other operations, and improves the repair effect of the lamp panel.

In one possible design, the spot tin assembly further comprises a control mechanism, specifically for: and under the condition that the working times or the working time of the tin spot needle reach a preset threshold value, controlling the driving mechanism to drive the tin spot needle and/or the flexible wiper so as to enable the tin spot needle to be inserted into the flexible wiper.

Through the arrangement, under the condition that the working times or the working time of the spot tin needle reaches the preset threshold value, the situation that the solder paste at an angle possibly accumulated on the outer wall of the spot tin needle is explained, at the moment, the control mechanism can automatically control the driving mechanism to drive the spot tin needle and/or the flexible wiper to move so as to realize automatic cleaning of the spot tin needle, the control efficiency is high, the manpower is saved, and the implementation mode is simple and easy to realize.

In one possible design, the drive mechanism includes: and the telescopic arm is connected with the flexible wiping object and used for driving the flexible wiping object to be close to or far away from the tin spot needle.

The flexible wiper can conveniently extend or retract through the telescopic arm, so that the wiping and cleaning of the tin needle are facilitated, and the normal tin needle operation is not hindered. The telescopic arm can be any mechanical arm with a telescopic function, has a simple structure, is easy to realize, is beneficial to reducing the implementation cost of equipment, and has higher operation reliability.

In one possible design, the front end of the telescopic arm is provided with a cleaning tray with an opening facing upwards, the flexible wipe being housed in the cleaning tray, the drive mechanism further comprising: and the Z-axis lifting module is used for driving the tin-pointing needle to move downwards so as to be inserted into the flexible wiping object.

The flexible wiping object is contained by the cleaning disc with the upward opening, so that the flexible wiping object can be well limited, the insertion of the tin needle can be facilitated, and the flexible wiping object is not easy to deform and lose efficacy after the tin needle is inserted for many times. After the flexible wiping object is moved to the lower part of the tin needle, the Z-axis lifting module can drive the tin needle to lift so as to complete cleaning work. The Z-axis lifting module can be a driving module for driving the tin needle to lift so as to carry out tin spot, namely, the lifting module which can reuse the original tin needle is arranged above, thereby being beneficial to simplifying the driving structure of the whole tin spot assembly and reducing the implementation cost.

In one possible design, the telescopic arm comprises a first sliding table cylinder, a bending connecting plate and a second sliding table cylinder which are sequentially connected, and one end of the second sliding table cylinder, which is away from the bending connecting plate, is connected with the cleaning disc.

Through the arrangement, the telescopic function of the telescopic boom can be realized at lower cost, and the telescopic boom is simple in structure and high in operation reliability.

In one possible design, the spot tin assembly further comprises: the tray connecting arm, the solder paste material loading tray rotatable set up in on the tray connecting arm.

In one possible design, the spot tin assembly further comprises: the tray rotating motor is arranged on the tray connecting arm and is used for driving the solder paste feeding tray to rotate; and the scraper is arranged on the tray connecting arm and is used for carrying out scraping operation on the solder paste in the solder paste feeding tray which rotates.

In one possible design, the spot tin assembly further comprises: a triaxial manual micro-motion platform; and the CCD camera is fixedly arranged on the triaxial manual micro-motion platform and is used for photographing a circuit board to be subjected to tin-plating operation.

In one possible design, the flexible wipe is an alcohol sponge.

The sponge has stronger shape recovery capability, deformation failure is not easy to occur even if the tin needle is inserted for a plurality of times, and the adsorbed alcohol can promote the solder paste to separate from the outer wall of the tin needle, so that the cleaning effect can be improved.

In a second aspect, there is provided a spot tin apparatus comprising a spot tin assembly as provided by any one of the preceding first aspects.

In one possible design, the tin spot-plating device is a lamp panel repair device, and may be any device that needs tin spot-plating, such as a circuit board repair device, a lamp panel assembly device, a circuit board assembly device, a chip mounting device, a glue dispenser, and a soldering machine.

The tin-dispensing device adopts the tin-dispensing assembly provided by the embodiment, so that the tin-dispensing device also has the technical effects corresponding to the tin-dispensing assembly, and the description thereof is omitted.

Drawings

Fig. 1 is a schematic diagram of a tin plating assembly in an operating state according to an embodiment of the present utility model.

Fig. 2 is a schematic structural diagram of a tin-plating assembly according to an embodiment of the present utility model.

Fig. 3 is a schematic structural view of the telescopic arm.

Fig. 4 is a schematic diagram of the mounting structure of the solder needle and the solder paste feeding tray.

Fig. 5 is a partial enlarged view of the spot tin needle and the solder paste loading tray.

Fig. 6 is a schematic view of the mounting structure of the solder paste loading tray.

Fig. 7 is a schematic structural diagram of a lamp panel repairing apparatus according to an embodiment of the present utility model.

Reference numerals:

100. a tin plating assembly; 101. a tin needle is clicked; 102. solder paste feeding tray; 103. a telescoping arm; 1031. a sliding table cylinder I; 1032. bending the connecting plate; 1033. a sliding table cylinder II; 1034. a cleaning disc connection arm; 1035. cleaning a tray; 104. a CCD camera; 105. a light source; 106. an X-axis movement module; 107. a Z-axis lifting module; 108. a triaxial manual micro-motion platform; 109. a tin needle connecting arm; 110. the material tray connecting arm; 111. a material disc rotating motor; 112. a scraper; 113. a mounting base; 114. a flexible wipe;

200. a lamp panel;

300. repairing the platform assembly;

400. a portal frame;

500. and (5) installing a platform.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present utility model and are not to be construed as limiting the present utility model.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted", "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected or integrally connected; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present utility model, it should be understood that the terms "upper," "lower," "side," "front," "rear," and the like indicate an orientation or a positional relationship based on installation, and are merely for convenience of description and simplification of the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

It should be further noted that, in the embodiments of the present utility model, the same reference numerals denote the same components or the same parts, and for the same parts in the embodiments of the present utility model, reference numerals may be given to only one of the parts or the parts in the drawings, and it should be understood that, for other same parts or parts, the reference numerals are equally applicable.

In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise. In the description of the present utility model, it should be noted that the term "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone.

In many processes, such as lamp panel assembly and lamp panel repair, solder paste is dispensed onto the bonding pads. For example, after the LED lamp panel is powered on and turned on, there may be abnormal problems in displaying the lamp beads such as dead lamp, dark lamp, bright lamp, string light, color cast, etc., so that the LED lamp panel with the defective lamp beads needs to be repaired. The lamp panel repair generally comprises a plurality of steps of removing, tin plating, pasting, die bonding and the like, and each step can be completed by different components of the lamp panel repair equipment. After the defective lamp beads are removed from the circuit board by the removing assembly, the bonding pads corresponding to the defective lamp beads are exposed, and at the moment, solder paste can be printed on the bonding pads through the spot tin assembly, so that new lamp beads can be welded conveniently.

In the working process of the tin-plating assembly, a certain amount of tin paste is firstly stuck from the tin paste tray by tin-plating pins, and then the tin paste is stuck on the bonding pads of the circuit board in a point printing mode. In order to ensure the repairing effect of the lamp panel, the tin adhering amount of the tin-point needle needs to be ensured to be moderate, and the tin paste amount of the tin-point needle adhered to the bonding pad every time needs to be ensured to be uniform as much as possible. In practice, the inventor of the utility model finds that after the tin needle is operated for a long time, a certain amount of tin paste is easy to remain on the outer wall of the tin needle, so that the tin paste amount adhered on the bonding pad by the tin needle in the subsequent operation process is influenced, and after too much or too little tin paste amount is adhered on the bonding pad, the subsequent welding of good lamp beads is influenced, the problem that the LED lamp panel welded with the good lamp beads still has abnormal display can still occur, and finally the repairing effect of the lamp panel is not ideal.

In order to solve the problems, the embodiment of the utility model firstly provides the spot tin assembly, and the wiping object is arranged to wipe and remove the residual tin paste on the outer wall of the spot tin needle, so that the quantity of the tin paste adhered by the spot tin needle each time is uniform and moderate, the spot tin assembly is ensured to have good spot tin effect after long-time working, a good foundation is laid for subsequent welding and other operations, and the repairing effect of the lamp panel is improved.

The tin spot assembly provided by the embodiment of the utility model can be applied to the lamp panel repairing equipment, and can be also applied to any equipment needing tin paste spot printing, such as circuit board repairing equipment, lamp panel assembling equipment, circuit board assembling equipment, surface mounting equipment, a glue dispenser, a welding machine and the like.

The embodiment of the utility model firstly provides a tin spot assembly 100, and fig. 1 is a schematic diagram of the tin spot assembly 100 in a working state according to the embodiment of the utility model. Fig. 2 is a schematic structural diagram of a tin spot assembly 100 according to an embodiment of the present utility model. As shown in fig. 1 and 2, the spot tin assembly 100 includes a spot tin needle 101, a paste feed tray 102, a flexible wiper 114, and a drive mechanism.

The solder paste feeding tray 102 has an open tray-like structure for holding solder paste for dipping the solder pins 101.

The dispensing pins 101, also commonly referred to as a dispensing head, are used to deposit solder paste from the solder paste feed tray 102 and to dispense the deposited solder paste onto the pads. The bonding pad may be a bonding pad on a lamp board, or a bonding pad on any circuit board, which is not limited in the present utility model according to the specific application scenario of the tin component 100. For example, the pad may be a pad on a sub-millimeter light-emitting diode (MiniLED) lamp board.

The flexible wiper 114 is used for inserting the solder pins 101 to wipe away solder paste attached to the outer walls of the solder pins 101. The flexible wiper 114 is made of a flexible material, and when the solder needle 101 is inserted into the flexible wiper 114 and removed from the flexible wiper 114, the flexible wiper 114 can scrape and clean the solder paste attached to the outer wall of the solder needle 101, so that the solder paste can be removed from the outer wall of the solder needle 101.

Alternatively, the flexible wiper 114 may be made of any flexible material that can be inserted into the tin needle 101 and that can wipe the outer wall of the tin needle 101 during the insertion and withdrawal of the tin needle 101, such as cloth (e.g., hemp cloth), wire, flexible rubber, leather, foam, or sponge.

Alternatively, the flexible wiper 114 may be an alcohol sponge, that is, the flexible wiper 114 is a sponge material with alcohol adsorbed thereon, the sponge has a strong shape recovery capability, deformation failure is not easy to occur even if the tin needle 101 is inserted for a plurality of times, and the adsorbed alcohol can promote the solder paste to separate from the outer wall of the tin needle 101, so as to improve the cleaning effect.

The driving mechanism is in transmission connection with the spot tin needle 101 and/or the flexible wiper 114 for driving the spot tin needle 101 and/or the flexible wiper 114 to insert the spot tin needle 101 into the flexible wiper 114. The driving mechanism may include any power source such as a motor and a cylinder, and any transmission mechanism such as a gear, a cam, a belt or a mechanical arm, which is not limited in the present utility model.

Optionally, a driving mechanism is drivingly connected to the spot tin needle 101 for driving the spot tin needle 101 to be inserted into the flexible wiper 114 and for driving the spot tin needle 101 to be withdrawn (withdrawn) from the flexible wiper 114.

Optionally, a driving mechanism is in driving connection with the flexible wiper 114 for driving the flexible wiper 114 towards the spot tin needle 101 to insert the spot tin needle 101 into the flexible wiper 114 and for driving the flexible wiper 114 away from the spot tin needle 101 to release the spot tin needle 101 from the flexible wiper 114.

Optionally, a driving mechanism is in driving connection with the spot tin needle 101 and in driving connection with the flexible wiper 114, for driving the spot tin needle 101 and the flexible wiper 114 to move in a direction approaching each other to insert the spot tin needle 101 into the flexible wiper 114, and for driving the spot tin needle 101 and the flexible wiper 114 to move in a direction moving away from each other to release the spot tin needle 101 from the flexible wiper 114.

Optionally, the driving mechanism is further used for driving the solder pins 101 to dip solder paste from the solder paste feeding tray 102 and to print the dipped solder paste on the pads.

The tin spot assembly 100 provided by the embodiment of the utility model is provided with the flexible wiping object 114 and the driving mechanism, under the driving action of the driving mechanism, the tin spot needle 101 can be inserted into the flexible wiping object 114 and separated from the flexible wiping object 114, and in the process of inserting the tin spot needle 101 into the flexible wiping object 114 and separating from the flexible wiping object 114, the flexible wiping object 114 can scrape and clean the tin paste attached to the outer wall of the tin spot needle 101, so that the tin paste can be separated from the outer wall of the tin spot needle 101. Namely, the residual solder paste on the surface of the spot tin needle 101 can be cleaned, and the next solder paste amount is ensured. The tin-plating needle 101 can not cause adverse effect to the dipped tin paste amount in the subsequent tin-plating process, ensures that the dipped tin paste amount can be uniform and moderate every time, ensures that the tin-plating assembly 100 still has good tin-plating effect after long-time work, lays a good foundation for subsequent welding and other operations, and improves the repair effect of the lamp panel.

Further, the tin dispensing assembly 100 provided in the embodiment of the present utility model further includes a control mechanism, which may be, for example, a programmable logic controller (Programmable Logic Controller, PLC), a micro control unit (Microcontroller Unit, MCU), or other various types of controllers or processors, and the control mechanism is specifically configured to:

in the case where it is determined that the number of times of operation or the operation time period of the spot tin needle 101 reaches a preset threshold value, the driving mechanism is controlled to drive the spot tin needle 101 and/or the flexible wiper 114 to move so that the spot tin needle 101 is inserted into the flexible wiper 114.

Through the above arrangement, under the condition that the working times or the working time length of the spot tin needle 101 reaches the preset threshold value, the condition that the solder paste with the angle possibly accumulated on the outer wall of the spot tin needle 101 is explained, at this time, the control mechanism can automatically control the driving mechanism to drive the spot tin needle 101 and/or the flexible wiper 114 to move, so that the automatic cleaning of the spot tin needle 101 is realized, the control efficiency is high, the manpower is saved, and the implementation mode is simple and easy to realize.

Alternatively, in the case where it is determined that the number of times of operation of the spot tin needle 101 (i.e., the number of times of spot tin) reaches a preset threshold, the driving mechanism is controlled to drive the spot tin needle 101 and/or the flexible wiper 114 to move so that the spot tin needle 101 is inserted into the flexible wiper 114. The preset threshold value here may be, for example, 50 times, 100 times, 200 times, 400 times, or the like, that is, the automatic cleaning of the solder needle 101 is performed once every the above-described number of works.

Optionally, in the case that the operating time of the spot tin needle 101 is determined to reach the preset threshold, the driving mechanism is controlled to drive the spot tin needle 101 and/or the flexible wiper 114 to move so that the spot tin needle 101 is inserted into the flexible wiper 114. The preset threshold value here may be, for example, 30 minutes, 100 minutes, 3 hours, 5 hours, etc., i.e., the spot tin needle 101 is automatically cleaned once every the above-mentioned time period.

As shown in fig. 2, in an embodiment of the present utility model, the drive mechanism includes a telescoping arm 103, the telescoping arm 103 being coupled to a flexible wiper 114 for driving the flexible wiper 114 toward or away from the tin needle 101.

Specifically, the telescopic arm 103 has a telescopic function, and can perform an extension or retraction motion. The telescopic arm 103 is an arbitrary mechanical arm having a telescopic function, and the specific configuration thereof is not limited in the present utility model. When the tin needle 101 needs to be wiped and cleaned, the control mechanism can control the telescopic arm 103 to extend to enter the extending state, and the flexible wiper 114 is close to the tin needle 101 and is driven to a specified position, so that the tin needle 101 is conveniently inserted into the flexible wiper 114. When cleaning is complete, the control mechanism can control the telescopic arm 103 to retract into a retracted state, wherein the flexible wiper 114 is away from the tinning needle 101, so that normal tinning operation of the tinning needle 101 is facilitated.

The flexible wiper 114 can be conveniently extended or retracted by arranging the telescopic arm 103, so that the wiping and cleaning of the tin needle 101 are facilitated, and the normal tin-plating operation of the tin needle 101 is not hindered. The telescopic arm 103 can be any mechanical arm with telescopic function, has a simple structure, is easy to realize, is beneficial to reducing the implementation cost of equipment, and has higher operation reliability.

Fig. 3 is a schematic structural view of the telescopic arm 103. As shown in fig. 2 and 3, the front end of the telescopic arm 103 is provided with a cleaning disc 1035 with an upward opening, the flexible wiper 114 is accommodated in the cleaning disc 1035, and the driving mechanism further comprises a Z-axis lifting module 107, and the Z-axis lifting module 107 is used for driving the tin needle 101 to move downwards to insert into the flexible wiper 114. The Z-axis lift module 107 may be, for example, a KK module.

Specifically, when the flexible wiper 114 is required to wipe and clean the tin needle 101, the control mechanism controls the telescopic arm 103 to extend to enable the flexible wiper 114 to be close to the tin needle 101 and be located below the tin needle 101, at this time, the control mechanism can continuously control the Z-axis lifting module 107 to drive the tin needle 101 to move downwards so as to enable the tin needle 101 to be inserted into the flexible wiper 114, and after the tin needle 101 is inserted to a certain depth, the control mechanism controls the Z-axis lifting module 107 to drive the tin needle 101 to move downwards so as to enable the tin needle 101 to be separated from the flexible wiper 114, so that cleaning of the tin needle 101 is completed.

By providing the cleaning tray 1035 with the opening facing upwards to accommodate the flexible wiper 114, not only can the flexible wiper 114 be well limited, but also the insertion of the tin needle 101 can be facilitated, and the flexible wiper 114 is not easy to deform and fail after the tin needle 101 is inserted for a plurality of times for cleaning. After the flexible wiper 114 is moved below the tin needle 101 by the telescopic arm 103, the tin needle 101 can be driven to lift by the Z-axis lifting module 107, so as to complete cleaning work. The Z-axis lifting module 107 can be a driving module for driving the tin needle 101 to lift for tin spot, i.e. the lifting module can reuse the original tin needle 101 through the above arrangement, thereby being beneficial to simplifying the driving structure of the whole tin spot assembly 100 and reducing the implementation cost.

As shown in fig. 1 and 3, the telescopic arm 103 includes a first sliding table cylinder 1031, a bending connection plate 1032, and a second sliding table cylinder 1033, which are sequentially connected, and one end of the second sliding table cylinder 1033, which is away from the bending connection plate 1032, is connected with a cleaning disc 1035.

Specifically, the fixed end of the first sliding table cylinder 1031 may be fixedly connected to the mounting structure such as the portal frame 400, and the sliding end capable of performing telescopic sliding relative to the fixed end is connected to one end of the bending connection plate 1032, the bending connection plate 1032 is bent to adjust and control the telescopic direction of the telescopic arm 103, the other end of the bending connection plate 1032 is connected to the fixed end of the second sliding table cylinder 1033, and the sliding end of the second sliding table cylinder 1033 is connected to the cleaning disc 1035 through the cleaning disc connection arm 1034. The sliding end of the sliding table cylinder is controlled to perform telescopic motion relative to the fixed end, so that the whole telescopic arm 103 can stretch out and draw back, and further the flexible wiping objects 114 in the cleaning disc 1035 can be driven to move. Through the above setting, the flexible function of the flexible arm 103 can be realized with lower cost, and simple structure, operational reliability is higher.

Fig. 4 is a schematic diagram of the mounting structure of the solder bumps 101 and the solder paste loading tray 102. Fig. 5 is a partial enlarged view of the spot tin needle 101 and the solder paste feeding tray 102. Fig. 6 is a schematic diagram of the mounting structure of the solder paste loading tray 102. As shown in fig. 1, 2, and 4-6, the tin plating assembly 100 according to the embodiment of the present utility model further includes a tray connecting arm 110, one end of the tray connecting arm 110 is fixedly connected to a mounting structure such as a gantry 400, and the solder paste feeding tray 102 is rotatably connected to the other end of the tray connecting arm 110. When the tin dispensing assembly 100 is in a normal working state, the tin paste feeding tray 102 rotates so that the tin dispensing needle 101 can be used for sticking and taking the pastes at different positions in the tray.

Further, the tin plating assembly 100 further includes a turntable motor 111 and a scraper 112. The tray rotating motor 111 is disposed on the tray connecting arm 110 and is used for driving the solder paste feeding tray 102 to rotate; the scraper 112 is fixedly disposed on the tray connecting arm 110, and is used for scraping solder paste in the solder paste feeding tray 102 that is rotating.

The tray rotating motor 111 drives the solder paste feeding tray 102 to rotate, and in the process, the scraper 112 is static relative to the tray connecting arm 110, and the bottom of the scraper 112 is in contact with the solder paste, so that the solder paste in the solder paste feeding tray 102 can be scraped to ensure that the liquid level of the solder paste stuck by the solder needle 101 is consistent every time, and the amount of the solder paste stuck by the solder needle 101 can be well controlled.

As shown in fig. 2, the tin-plating assembly further includes a three-axis (XYZ-axis) manual micro-motion stage 108 and a Charge-coupled Device (CCD) camera 104, wherein the CCD camera 104 is fixedly disposed on the three-axis manual micro-motion stage 108, and the three-axis manual micro-motion stage 108 is connected to the gantry 400. The circuit board (e.g., the lamp panel 200 in fig. 1) to be subjected to the tin-plating operation can be photographed and positioned by the CCD camera 104.

Specifically, as shown in fig. 1 and 2, the lamp panel 200 to be repaired can be clamped by the repair platform assembly 300, the lamp panel 200 is moved to a specified position, the CCD camera 104 performs Mark point positioning, more accurate identification is performed on the position of the lamp panel 200, the identification is fed back to the transportation and control, and the lamp panel 200 is accurately moved to a predetermined position (i.e., a spot tin position) of the spot tin needle 101 by driving the repair platform assembly 300.

It should be noted that, before this process, the CCD camera 104 needs to take the tin-plating needle 101 as a reference, so that the tin-plating position of the tin-plating needle 101 is coaxial with the shooting focus of the CCD camera 104, because the CCD camera 104 shoots and recognizes the tin-plating effect on the lamp panel 200 in addition to Mark point positioning. The position of the CCD camera 104 can be adjusted by a three-axis manual jog stage 108 connected thereto.

After the lamp panel 200 moves to a preset position, the spot tin needle 101 is connected to the Z-axis lifting module 107 through the spot tin needle connecting arm 109, the Z-axis lifting module 107 is connected to the mounting seat 113 through the X-axis moving module 106, and the mounting seat 113 is fixedly arranged on the portal frame 400. The tin needle 101 is coordinated with the Z-axis lifting module 107 through the X-axis movement module 106 (e.g. KK module) connected with the tin needle 101, a certain amount of tin paste is adhered to the tin needle 101 from the tin paste feeding tray 102, and the scraper 112 continuously scrapes the tin paste in the tin paste feeding tray 102 in the rotating process, so that the tin paste amount adhered to the tin needle 101 each time is ensured to be uniform. And then, the solder paste is adhered to the bonding pad of the lamp panel through the coordinated movement of the X-axis movement module 106 and the Z-axis lifting module 107, so that the tin coating process of the bonding pad is accurately completed.

Optionally, the tin spot needle 101 is elastically telescopic and connected to the tin spot needle connecting arm 109, so that the tin spot needle 101 can elastically stretch and retract to a certain extent relative to the lamp panel 200 in the tin spot process, hard contact is avoided, and a certain protection effect is provided for the lamp panel 200.

Optionally, a light source 105 is further fixedly disposed on the triaxial manual micro-motion platform 108, the light source 105 is disposed corresponding to the CCD camera 104, and the light source 105 is configured to provide a light source for a photographing area of the CCD camera 104, so as to ensure that the CCD camera 104 can obtain a clear image. The light source 105 may have a circular ring structure, and the CCD camera 104 is disposed in the circular ring structure.

On the other hand, the embodiment of the utility model also provides a tin-plating device, and fig. 7 is a schematic structural diagram of the lamp panel repairing device provided by the embodiment of the utility model. As shown in fig. 7, the tin plating apparatus according to the embodiment of the present utility model includes the tin plating assembly 100 according to the foregoing embodiment.

The tin spot plating device provided in the embodiment of the present utility model is any production and processing device or repair device capable of being used for the tin spot plating assembly 100, including, but not limited to, a lamp panel repair device, a circuit board repair device, a lamp panel assembly device, a circuit board assembly device, a patch device, a glue dispenser, a soldering machine, and other devices requiring tin paste spot printing. In this embodiment, a tin plating apparatus is taken as an example of a lamp panel repair apparatus.

As shown in fig. 7, the spot tin apparatus includes a mounting platform 500 upon which the spot tin assembly 100 is mounted by a gantry 400. In addition, the tin plating apparatus further includes the aforementioned repair platform assembly 300, and the structures of the rejection assembly, the chip assembly, the die bonding assembly, and the like.

Since the tin-plating device adopts the tin-plating assembly 100 provided in the above embodiment, the tin-plating device also has the technical effects corresponding to the tin-plating assembly 100, and will not be described herein.

The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims

1. A tin dispensing assembly, comprising:

a solder paste feeding tray (102) for holding solder paste;

a tin-dropping needle (101) for dipping tin paste from the tin paste feeding tray (102) and dropping the dipped tin paste on a bonding pad;

a flexible wiper (114) for inserting the spot tin needle (101) to wipe and remove the tin paste attached to the outer wall of the spot tin needle (101);

a driving mechanism for driving the spot tin needle (101) and/or the flexible wiper (114) so that the spot tin needle (101) is inserted into the flexible wiper (114).

2. The spot tin assembly of claim 1 further comprising a control mechanism, the control mechanism being specifically configured to:

and controlling the driving mechanism to drive the tin spot needle (101) and/or the flexible wiper (114) so as to enable the tin spot needle (101) to be inserted into the flexible wiper (114) under the condition that the working times or the working time of the tin spot needle (101) reach a preset threshold value.

3. The spot tin assembly of claim 1 wherein the drive mechanism comprises:

a telescopic arm (103) is connected with the flexible wiper (114) and is used for driving the flexible wiper (114) to be close to or far away from the tin spot needle (101).

4. A tin spot assembly according to claim 3, wherein the front end of the telescopic arm (103) is provided with an upwardly opening cleaning disc (1035), the flexible wiper (114) being housed within the cleaning disc (1035), the drive mechanism further comprising:

and the Z-axis lifting module (107) is used for driving the tin-pointing needle (101) to move downwards so as to be inserted into the flexible wiper (114).

5. The tin spot assembly of claim 4, wherein the telescopic arm (103) comprises a first sliding table cylinder (1031), a bending connection plate (1032) and a second sliding table cylinder (1033) which are sequentially connected, and one end of the second sliding table cylinder (1033) away from the bending connection plate (1032) is connected with the cleaning disc (1035).

6. The spot tin assembly of any of claims 1 to 5, further comprising:

the solder paste feeding tray (102) is rotatably arranged on the tray connecting arm (110).

7. The spot tin assembly of claim 6 further comprising:

a tray rotating motor (111) which is arranged on the tray connecting arm (110) and is used for driving the solder paste feeding tray (102) to rotate;

and the scraper (112) is arranged on the tray connecting arm (110) and is used for carrying out scraping operation on the solder paste in the solder paste feeding tray (102) which is rotating.

8. The spot tin assembly of any of claims 1 to 5, further comprising:

a three-axis manual jog platform (108);

and the CCD camera (104) is fixedly arranged on the triaxial manual micro-motion platform (108) and is used for photographing a circuit board to be subjected to tin-plating operation.

9. The spot tin assembly of any of claims 1-5 wherein the flexible wiper (114) is an alcohol sponge.

10. A tin spot device characterized in that it comprises a tin spot assembly according to any one of claims 1-9.