CN202259441U

CN202259441U - Novel LED chip

Info

Publication number: CN202259441U
Application number: CN201120337341XU
Authority: CN
Inventors: 魏展生
Original assignee: Individual
Current assignee: Individual
Priority date: 2011-09-09
Filing date: 2011-09-09
Publication date: 2012-05-30
Anticipated expiration: 2021-09-09

Abstract

The utility model discloses a novel LED chip which comprises a circuit baseplate, and is characterized in that a through-hole is formed on the circuit baseplate; an LED wafer is arranged on the upper surface of a heat-conducting plate which is arranged in the through hole; the electrodes of the LED wafer are welded on the circuit baseplate through conducting wires; a rubber enclosing ring is also arranged on the circuit baseplate; and the LED wafer and an encapsulation rubber layer are arranged in the rubber enclosing ring. The novel LED chip aims to overcome the shortages of the prior art, has a simple structure and is convenient to manufacture.

Description

A kind of New LED chip

Technical field

The utility model relates to a kind of New LED chip.

Background technology

The welding of existing LED chip electrode metal wire generally is to adopt Plastic Package, and its electrode plastic packaging is on working of plastics, and the LED metal wire is welded on the electrode; Because plastic package process is complicated and be prone to split glue, heat conduction is not good, hinders the heat-sinking capability of LED, promptly uses quoit heat conduction; Its quoit is to be bonded on the heat-conducting plate, and cost is high, and after high-temperature soldering, the easy ageing distortion; Even come off, these all give LED with negative influence, especially influence high power or integrated LED the illumination universalness.

The utility model content

The purpose of the utility model is in order to overcome weak point of the prior art, to provide a kind of simple in structure, easy to make, practical New LED chip.

In order to achieve the above object, the utility model adopts following scheme:

A kind of New LED chip comprises circuit substrate, it is characterized in that: on described circuit substrate, be provided with through hole; In described through hole, be provided with heat-conducting plate; Its upper surface of heat-conducting plate in said through hole is provided with the LED wafer, and the electrode of said LED wafer, is provided with on described circuit substrate and encloses cushion rubber on described circuit substrate through wire bonds; Described LED wafer is arranged on described enclosing in the cushion rubber, is provided with the encapsulation glue-line in the cushion rubber described enclosing.

Aforesaid a kind of New LED chip; It is characterized in that described circuit substrate is the PCB double sided board; Described LED wafer passes through wire bonds on the upper surface circuit of PCB double sided board; On described PCB double sided board lower surface, be provided with the bottom surface circuit, described circuit substrate bottom surface is welded on the described heat-conducting plate.

Aforesaid a kind of New LED chip; It is characterized in that loop circuit layer in described circuit substrate upper surface is provided with; Middle circular layer and outer shroud circuit layer are provided with via outside via hole internal through-hole and the via hole on described circuit substrate, the outer via of described via hole internal through-hole and via hole is connected on the circuit of described bottom surface; On the circuit of described bottom surface, be provided with insulating oil; On described circuit substrate lower surface, be provided with circular layer circuit outside bottom surface inner circular layer circuit and the bottom surface, the circular layer circuit is welded on the described heat-conducting plate outside described bottom surface inner circular layer circuit and the bottom surface, and the described cushion rubber that encloses is welded on the described middle circular layer.

Aforesaid a kind of New LED chip; It is characterized in that loop circuit layer in described circuit substrate upper surface is provided with; Middle circular layer and outer shroud circuit layer, described middle circular layer is two semicircles, described interior loop circuit layer is connected through circuit with the outer shroud circuit layer; On described circuit, be provided with insulating oil, the described cushion rubber that encloses is welded on the described middle circular layer.

Aforesaid a kind of New LED chip is characterized in that described circuit substrate is a ceramic circuit board, and described ceramic circuit board bottom surface is fixedly connected on the described heat-conducting plate.

Aforesaid any New LED chip is characterized in that described circuit substrate includes fixed bed, on described fixed bed, is provided with insulating barrier, on described insulating barrier, is provided with the circuit electrode layer.

Aforesaid a kind of New LED chip is characterized in that described fixed bed is a metal level.

Aforesaid a kind of New LED chip is characterized in that described insulating barrier is a fibrage, resin bed, a kind of in glassy layer or the ceramic layer.

Aforesaid a kind of New LED chip is characterized in that described circuit electrode layer is the copper foil circuit electrode layer.

Aforesaid any New LED chip is characterized in that described circuit substrate includes insulating barrier, and described insulating barrier is a ceramic layer, on described insulating barrier, is provided with the circuit electrode layer, the sintering integrated moulding of described insulating barrier and heat-conducting plate.

In sum, the utility model with respect to its beneficial effect of prior art is:

On circuit substrate, be provided with through hole in the utility model, on described through hole, be provided with heat-conducting plate, on heat-conducting plate, be provided with wafer, be welded on the described circuit substrate through metal wire at the electrode on the said wafer.The utility model is simple in structure, and is easy to make, makes LED lamp electric heating separate.

Description of drawings

Fig. 1 is the generalized section of the utility model via hole PCB double sided board.

Fig. 2 is the generalized section of the utility model PCB double sided board.

Fig. 3 is the generalized section of the utility model ceramic wafer.

Fig. 4 is the generalized section of the utility model ceramic wafer and heat-conducting plate sintering.

Fig. 5 is the sketch map of the utility model via hole PCB double sided board upper surface.

Fig. 6 is the sketch map of the utility model via hole PCB double sided board lower surface.

Fig. 7 is the sketch map of the utility model PCB double sided board upper surface.

Fig. 8 is the sketch map of the utility model ceramic wafer upper surface.

Embodiment

Below in conjunction with description of drawings and embodiment the utility model is further described:

A kind of New LED chip shown in Fig. 1 to 8 comprises circuit substrate 1, on described circuit substrate 1, is provided with through hole 2; In described through hole 2, be provided with heat-conducting plate 3; Heat-conducting plate 3 its upper surfaces in said through hole 2 are provided with LED wafer 4, and the electrode of said LED wafer 4 is welded on the described circuit substrate 1 through lead 5, on described circuit substrate 1, are provided with and enclose cushion rubber 6; Described LED wafer 4 is arranged on described enclosing in the cushion rubber 6, is provided with encapsulation glue-line 7 in the cushion rubber 6 described enclosing.

First kind of execution mode of the circuit substrate 1 described in the utility model is the PCB double sided board; Described LED wafer 4 is welded on the upper surface circuit of PCB double sided board through lead 5; On described PCB double sided board lower surface, be provided with bottom surface circuit 8, described circuit substrate 1 bottom surface is welded on the described heat-conducting plate 3.

As illustrated in Figures 5 and 6; First kind of execution mode of the utility model PCB double sided board; Be provided with the interior loop circuit layer 11 that is spaced from each other and insulate at described circuit substrate 1 upper surface, middle circular layer 12 and outer shroud circuit layer 13 are provided with via 15 outside via hole internal through-hole 14 and the via hole on described circuit substrate 1; Via 15 is respectively equipped with copper-foil conducting electricity outside described via hole internal through-hole 14 and via hole; Described via hole internal through-hole 14 is connected on the described bottom surface circuit 8 with the outer via 15 of via hole, on described bottom surface circuit 8, is provided with insulating oil, on described circuit substrate 1 lower surface, is provided with circular layer circuit 17 outside bottom surface inner circular layer circuit 16 and the bottom surface; Circular layer circuit 17 is welded on the described heat-conducting plate 3 outside described bottom surface inner circular layer circuit 16 and the bottom surface, and the described cushion rubber 6 that encloses is welded on the described middle circular layer 12.

As shown in Figure 7; Second kind of execution mode of the utility model PCB double sided board, loop circuit layer 11 in described circuit substrate 1 upper surface is provided with, middle circular layer 12 and outer shroud circuit layer 13; Circular layer 12 is two semicircles in described; Loop circuit layer 11 is connected through circuit 18 with outer shroud circuit layer 12 in described, on described circuit 18, is provided with insulating oil, and the described cushion rubber 6 that encloses is welded on the described middle circular layer 12.

Second kind of execution mode of the circuit substrate 1 described in the utility model is ceramic circuit board, and described ceramic circuit board bottom surface is fixedly connected on the described heat-conducting plate 3.The described cushion rubber 6 of enclosing is insulator, and described insulator can be pottery, describedly encloses cushion rubber 6 and insulating barrier 102, the sintering integrated together moulding of circuit electrode layer 103 and heat-conducting plate 3.

Circuit substrate 1 shown in Fig. 2 to 4 described in the utility model includes fixed bed 101, on described fixed bed 101, is provided with insulating barrier 102, on described insulating barrier 102, is provided with circuit electrode layer 103.

Wherein said fixed bed 101 is a metal level.Described insulating barrier 102 is a fibrage, resin bed, a kind of in glassy layer or the ceramic layer.Described circuit electrode layer 103 is the copper foil circuit electrode layer.

The another kind of execution mode of the utility model circuit substrate 1; Described circuit substrate 1 includes insulating barrier 102; Described insulating barrier 102 is a ceramic layer, on described insulating barrier 102, is provided with circuit electrode layer 103, described insulating barrier 102 and heat-conducting plate 3 sintering integrated moulding.

As illustrated in Figures 5 and 6; Loop circuit layer 11 comprised semicircle circuit in left and right two in the utility model was described; Be spaced from each other insulation between the described left and right interior semicircle circuit; Be respectively equipped with via hole internal through-hole 14 on the semicircle circuit described in left and right, described outer shroud circuit layer 13 comprises left and right two outer semicircle circuit, is spaced from each other insulation between the described left and right outer semicircle circuit; Be respectively equipped with via hole outside via 15 on the semicircle circuit described outside left and right, described in circular layer 12 be an annular circuit layer.On described circuit substrate 1 bottom surface, be provided with two bottom surface circuit 8; The outer via 15 of via hole on the outer semicircle circuit of a via hole internal through-hole 14 in the described left side on the semicircle circuit and a left side is connected on the same bottom surface circuit 8, and via 15 is connected on the same bottom surface circuit 8 outside the via hole on via hole internal through-hole 14 in the in like manner described right side on the semicircle circuit and the right outer semicircle circuit.

The another kind of execution mode of the utility model; As shown in Figure 7; Loop circuit layer 11 comprises semicircle circuit in left and right two in described, is spaced from each other insulation between the described left and right interior semicircle circuit, and described outer shroud circuit layer 13 comprises left and right two outer semicircle circuit; Be spaced from each other insulation between the described left and right outer semicircle circuit; Circular layer 12 is upper and lower symmetrically arranged upper and lower semicircle metal level in described, and described upper and lower semicircle metal level is spaced from each other and insulate, and described circuit 18 is arranged between the described upper and lower semicircle metal level.

The third execution mode of the utility model, as shown in Figure 8, described circuit electrode layer 103 is symmetrical two semicircles, is spaced from each other insulation between described two semicircle circuit.

Shown in Fig. 3 and 4; Heat-conducting plate 3 described in the utility model comprises a cylindrical shell 31; On described cylindrical shell 31 1 ends, be provided with one and connect platform 32, on described connection platform 32, be provided with the male part 33 that can insert said through hole 2, described circuit substrate 1 bottom surface is connected on the described connection platform 32; Described LED wafer 4 is arranged on the described male part 33, on described cylindrical shell 31, is provided with the external screw thread 34 or the internal thread 35 that can screw in external radiator.

Claims

1. New LED chip; Comprise circuit substrate (1); It is characterized in that: on described circuit substrate (1), be provided with through hole (2), in described through hole (2), be provided with heat-conducting plate (3), its upper surface of heat-conducting plate (3) in said through hole (2) is provided with LED wafer (4); The electrode of said LED wafer (4) is welded on the described circuit substrate (1) through lead (5); On described circuit substrate (1), be provided with and enclose cushion rubber (6), described LED wafer (4) is arranged on described enclosing in the cushion rubber (6), is provided with encapsulation glue-line (7) in the cushion rubber (6) described enclosing.

2. a kind of New LED chip according to claim 1; It is characterized in that described circuit substrate (1) is the PCB double sided board; Described LED wafer (4) is welded on the upper surface circuit of PCB double sided board through lead (5); On described PCB double sided board lower surface, be provided with bottom surface circuit (8), described circuit substrate (1) bottom surface is welded on the described heat-conducting plate (3).

3. a kind of New LED chip according to claim 2; It is characterized in that loop circuit layer (11) in described circuit substrate (1) upper surface is provided with; Middle circular layer (12) and outer shroud circuit layer (13); On described circuit substrate (1), be provided with via (15) outside via hole internal through-hole (14) and the via hole; The outer via (15) of described via hole internal through-hole (14) and via hole is connected on the described bottom surface circuit (8), on described bottom surface circuit (8), is provided with insulating oil, on described circuit substrate (1) lower surface, is provided with circular layer circuit (17) outside bottom surface inner circular layer circuit (16) and the bottom surface; Circular layer circuit (17) is welded on the described heat-conducting plate (3) outside described bottom surface inner circular layer circuit (16) and the bottom surface, and the described cushion rubber (6) that encloses is welded on the described middle circular layer (12).

4. a kind of New LED chip according to claim 2; It is characterized in that loop circuit layer (11) in described circuit substrate (1) upper surface is provided with; Middle circular layer (12) and outer shroud circuit layer (13), described middle circular layer (12) is two semicircles, described interior loop circuit layer (11) is connected through circuit (18) with outer shroud circuit layer (12); On described circuit (18), be provided with insulating oil, the described cushion rubber (6) that encloses is welded on the described middle circular layer (12).

5. a kind of New LED chip according to claim 1 is characterized in that described circuit substrate (1) is a ceramic circuit board.

6. according to described any New LED chip of claim 1-5; It is characterized in that described circuit substrate (1) includes fixed bed (101); On described fixed bed (101), be provided with insulating barrier (102), on described insulating barrier (102), be provided with circuit electrode layer (103).

7. a kind of New LED chip according to claim 6 is characterized in that described fixed bed (101) is a metal level.

8. a kind of New LED chip according to claim 6 is characterized in that described insulating barrier (102) is a fibrage, resin bed, a kind of in glassy layer or the ceramic layer.

9. a kind of New LED chip according to claim 6 is characterized in that described circuit electrode layer (103) is the copper foil circuit electrode layer.

10. according to described any New LED chip of claim 1-5; It is characterized in that described circuit substrate (1) includes insulating barrier (102); Described insulating barrier (102) is a ceramic layer; On described insulating barrier (102), be provided with circuit electrode layer (103), described insulating barrier (102) and the sintering integrated moulding of heat-conducting plate (3).