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CN1306658C - 矮外形接插件 - Google Patents

矮外形接插件 Download PDF

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CN1306658C
CN1306658C CNB2004100385443A CN200410038544A CN1306658C CN 1306658 C CN1306658 C CN 1306658C CN B2004100385443 A CNB2004100385443 A CN B2004100385443A CN 200410038544 A CN200410038544 A CN 200410038544A CN 1306658 C CN1306658 C CN 1306658C
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lug plate
contact
projection
connector
passage
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CN1551416A (zh
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蒂莫西·A·莱姆基
蒂莫西·W·霍特兹
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H01R13/41—Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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  • Manufacturing & Machinery (AREA)
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Abstract

矮的板对板成形接插件系统。在各自的配对的接插件中利用了保持区，以接纳相对的配对的触点接线片的一部分。利用居中的保持结构可允许最佳地放置下凹区，以接纳配对的触点接线片的末端部分。居中的保持结构还可使触点臂长度在可用的有限空间中为最大，以便得到有利的接触特性。触点插入/保持特色为触点臂位于中间位置，以便加强触点保持和改善臂的性能。接线片触点可以用与孔接合的突起保持在通道中，该孔在触点接线片的保持部分上形成。

Description

矮外形接插件
本申请为下列专利的一部分的继续：美国专利申请系列No.08/778806，1996年12月31日登记，题目为“耐应力的接插件和减少其在安放时的应力的方法”；美国专利申请系列No.08/728194，1996年10月10日登记，题目为“高密度接插件”。
此申请要求下列专利的优先权：美国专利临时专利申请系列No.60/027611，1996年10月10日登记，题目为“矮成形阵列接插件”。
此申请还涉及：美国专利申请系列No.08/777579，题目为“高密度接插件”；系列No.08/778380，题目为“制造高密度接插件的方法”；美国专利申请系列No.08/778398，题目为“用在电接插件中的触点”，所有专利都是在1996年12月31日登记的。上述经过鉴定的申请的公开内容此处均已包括，以作为参考。
技术领域
本发明涉及电接插件，更具体一些，涉及高输入/输出密度接插件，它具有矮的搭配高度。
背景技术
减少电子设备特别是个人手提装置的尺寸的驱动力，以及对这类设备增加附加的功能的驱动力已经产生一个正在进行的要求所有元件特别是电接插件微型化的运动。使接插件微型化的努力包括在单排或双排线性接插件中减少接线片之间的行距，以便数量比较大的输入/输出或其它线路可以用接插件相互连接，该接插件装在用于接纳接插件的电路基体上的紧密地限定的区域内。用于微型化的驱动力还伴有转向偏爱表面安装技术(SMT)，将元件装在电路板上。SMT的使用的不断增加的潮流和线性接插件的小行距的要求导致用于大容量、低成本运行的SMT的极限的研究。减少接线片的行距增加了在焊料膏软熔时跨接相邻的焊料垫或接线片的危险性。
为了满足加大的输入/输出密度的需要，曾经提出阵列接插件。这种接插件有安装在绝缘的基体上的二维终端阵列并可提供加大的密度。不过，这些接插件用SMT技术装在电路基体上有一定的困难，这是因为，多数即使不是全部终端的表面安装引线必须在接插件体的下面。因此，所用的安装技术必须高度可靠，这是因为，难于用肉眼检查焊料接头或在出现故障时修理它们。
在集成电路(IC)在塑料或陶瓷基体上的安装中，球网格阵列(BGA)和类似的其它封装已成为普遍的。在BGA封装中，附在IC封装上的球形焊料球放置在电路基体的电触点接头上，在该电路基体上通常用网板或掩模施加一层焊料膏。以后将此单元加热至某一温度，在此温度下，焊料膏和至少一部分或全部焊料球熔化并融合在电路基体上形成的下面的导电垫上。由此，IC就连至基体上，而不需要有IC上的外部导线。
在将一IC连至一基体上时，虽然BGA或类似的系统的应用有很多优点，但是希望有一种相应的措施，将一电接插件或类似的元件装至印刷线路板(PWB)或其它基体上。对于多数情况，重要的是，焊料球的与基体接合的表面是共面的并形成一基本平坦的安装表面，以便在最后应用时，这些球将软熔并平整地钎焊至平面印刷电路板基体上，在给定的基体上的焊料共面性的任何显著的差异都会在接插件被软熔至印刷电路板上时产生不良的钎焊性能。为了得到高的钎焊可靠性，使用者规定非常严格的共面性要求，通常大约为0.004至0.008英寸(或0.1016mm至0.2032mm)。焊料球的共面性受到焊料球的大小和它在接插件上的配置的影响。球的最终尺寸取决于最初同时用在焊料膏和焊料球中的焊料的总体积。在将焊料球放在接插件触点上时，这一考虑提出特殊的挑战，因为被接纳在焊料块内的接插件触点体积的变化影响焊料块尺寸的可能变化，从而影响焊料球在接插件上沿安装表面的共面性。
在将接插件钎焊至基体上时所出现的另一问题为接插件常常有具有形状比较复杂的绝缘壳体，例如一个里面有许多穴。在这种热塑性塑料壳体中，可产生来自模制过程的残余应力，来自由于触点插入而形成应力的残余应力，或来自两者的组合的残余应力。这些壳体或是在一开始就翘曲或扭曲，或是在加热至SMT过程所需要的温度例如软熔焊料球所需要的温度时就翘曲或扭曲。壳体的这种翘曲或扭曲可在接插件组件和PWB之间产生尺寸上的失配，产生不可靠的钎焊，这是因为，表面安装元件如焊料球在钎焊之前不能充分与焊料膏接触或与PWB靠近。以前发现的原有的和有关的应用旨在解决这些设计挑战。减少的接插件尺寸的驱动力不仅涉及占地面积大小、而且还涉及配对的接插件的高度。当电气设备缩小尺寸时，产生将电路板更紧密地堆叠在一起的需要。本发明涉及高密度接插件，具体一些为用于减少被堆叠的电路板之间的间距的矮成形接插件，更具体一些为利用球网格阵列安装技术的接插件。
发明内容
按照本发明的电接插件具备高的输入/输出密度和减小的堆叠高度。
配对的接插件高度通过利用一个接插件体的配对接口的下凹区而减少，该接插件体用于接纳与配对的接插件相连的接线片的末端部分。减少的配对的接插件高度还可通过提供一接插件体的非接触区，以允许触点接线片的触点臂的下段弯曲而达到。
触点总长度可通过延长的悬臂的插座触点臂，使其朝插销触点超过接线片的高度而达到，该插销触点具有比较短的保持脚。插销和插座触点接线片都被接纳在一通道中，它具有居中地接合触点接线片的保持特色，从而使臂的长度最大并可得到可接受的运行特性。触点接线片保持特色可以位于沿一个或更多的触点臂的长度的一个中间位置上。
在触点接线片的保持段上可以放置一热隔断。该隔断控制沿接线片从安装表面上的焊料抽吸，在该安装表面上，在接线片上形成一易融材料体。
触点接线片也可用接线片保持通道中的一个或几个突起保持在接触件体中，该通道与接线片的保持段或在接线片的保持段上形成的孔接合。此接线片安装结构使接插件体中的应力积累为最小，从而减少了模制的接插件体的弯曲或翘曲的趋势。
附图说明
下面将参考附图进一步描述本发明的方法和接插件，在附图中：
图1是实施本发明的插销式接插件的俯视图；
图2是图1所示的插销的A区的放大图；
图3是图2所示的区沿线3-3的剖视图；
图4是图1～3所示的与插座配对的插销元件的局部切去的剖视图；
图5是图4所示的插座与插销沿垂直于图4所示的方向并装在堆叠的电路基体之间的局部切去的剖视图；
图6是图4和5所示的插座式触点接线片的立面图；
图7是图6所示的插座式触点接线片的侧视图；
图8是图6和7所示的插座式触点接线片的俯视图；
图9是插座式触点接线片的第二实施例的立面图；
图10是保持在通道中的触点接线片的保持段沿图9的C-C线的局部切去的剖视图。
具体实施方式
图1示出了具有接插件体或壳的插销式接插件20，它包括一基本为平面的基体22和一围绕的周边壁24。在每个端部的壁上有极化/找正翼板26，它们从壁24上直立，以保证插销式接插件20如后面所说的与其成对的插座式接插件相配。接插件体最好通过模制绝缘的聚合物作为整个的一件体形成。聚合物最好是能耐SMT(表面安装技术)软熔温度的那种，例如液晶聚合物。
插销式接插件20包括一插销触点接线片阵列28，它们按所要求的图形例如二维的矩阵保持在接插件体上。为了图面简单起见，只示出了几个接线片位置。
参看图3，每个插销接线片28包括平面的触点接线片，它具有与后面所说的插座式触点接线片72配合的配对段30。插销接线片28还包括一用于以后面要描述的方式被保持在接插件体22中的保持段32。保持段32包括一对相对的肩部34，在其上作用插入工具，以将接线片28插入在接插件体22上形成的接线片通道38中。在肩部34上还可形成毛刺或倒刺，以协助接线片在通道38中的保持。一焊料翼板36穿过通道38的底部的槽形开口56以保持段32伸出并用于将易熔的基体触点块或体如焊料球35融合在其上。焊料翼板的导缘最好在接线片的一侧或两侧例如用倒角或斜面37朝其端部倾斜。焊料球35用原先的申请系列No.08/778806和08/728194中所描述的技术融合在插销接线片28和插座接线片72(以后再描述)上。
如图3所示，触点接线片28保持在接插件体22中形成的接线片通道38中。通道38从配对接口或表面40朝安装表面42延伸。一个像井或袋一样的凹座50在安装表面42上形成并与穿过槽形开口53的每个通道38对齐并连通。配对的触点段30从配对的接口40伸出，而焊料翼板36则伸入袋50中。接线片28则定位成基本与通道38的中间平面MP(图2)对齐。
触点式接线片28以这样一种方式固定在体22中，即在插入接线片时避免在模制塑料体中诱发应力。在优选的实施例中，此目的通过利用相对的突起48而达到。在每个突起48的顶部形成一导入面49。突起48的末端部分之间的距离小于金属接线片28的厚度，从而建立一压配合。这样，每个突起48的末端部分在接线片28被插入通道38和槽53中时被触点接线片变形。突起48的末端位置最好与中间平面MP等距离，以使每个突起在插入接线片时有基本相等的变形量。因此，作用在接线片保持段32上的法向力基本平衡，从而有助于沿中间平面MP对齐。触点接线片用通过变形的突起作用在触点接线片上的法向力牢牢地夹持在通道38和槽53中。导入面49和倾斜的端部37减少了突起48在插入时的刮削可能性，从而使材料从突起48上的去除为最小。除去被限制的那一个，每个突起的末端部分变形并产生一保持力，因而可以避免应力在壳体中的积累。提供一对相对的、基本相同的、与中间平面MP等距离的突起48有助于触点接线片28沿中间平面MP按紧的公差定位。
图3中所示的并在上面提到的原来的申请中公开的接线片保持结构的优点之一被认为是以这样一种情况产生的，即在用软熔将焊料球35附在接线片28上以上以后，接线片以一种锁住的状态在接近“零间隙”的条件下被固定在壳体22中。这是由下列情况产生的。接线片28是通过将接线片插入，直至底肩33与通道底面39接合而被在通道38中“到达底部”的。这样就相对于图3的视图沿垂直向下的位置定位接线片28。在用例如在原来的申请系列号08/728194和08/778806中所描述的技术用软熔将焊料块35附在翼片36上以后，放在袋50中的焊料球和/或焊料膏形成一个填充并与袋50的形状共形的块体。因此，焊料块50与井50的底部51接合。这样，软熔的焊料块35用于防止接线片28向上移出通道38(按图3的方向)。
接线片28通过保持段32的侧缘43的在通道38的横向侧壁41上的接合而在左右方向定位。侧壁41和侧缘43最好如图所示有配对的斜面，以有助于接线片28的真实定位。回过去看图2，接线片28通过相对的突起48居中地保持定位在通道38中(沿图2的从左至右的方向)。这样就造成接线片28在壳体22中在这样一种公差条件下定位，即它接近在夹物模制时所达到的公差。改进的可达到的总体公差水平是由公差的极小化产生的，而这种公差极小化在金属接线片后插入塑料壳体中时是通常都存在的。也就是说，定位公差减小了，留下配合公差(配对的接插件之间的公差)作为各部分所适用的主要公差。接线片的间距在插入时保持成好像接线片仍然安装在载体片上一样。在接线片冲压工序中得到的紧密的间距公差通过使用上面所公开的触点保持系统在接线片插入后基本得以保持。
虽然图2和3所示的突起48的横截面形状是优选的，但是也可以使用形状和尺寸多少有些不同的突起或肋。此保持系统的机理的说明已在专利申请系列No.08/728194和08/778806中作了描述。突起48的通过接线片28的变形产生在软熔焊料球35之前足以保持接线片在壳体中的位置的摩擦力。
与每个通道38相邻的是一个或更多的端部接纳凹座44、46，它们用于接纳配对的插座式触点接线片72的末端部分。如图所示，凹座44、46做成以其一侧与通道38邻接。在图2和3所示的实施例中，凹座在中间平面MP的两相对侧。这些凹座还沿横向彼此错开，也就是，它们在与中间平面MP垂直的中心平面C的两个相反侧。图4和5示出被接纳在凹座44、46中的插座式触点接线片72的触点臂的末端部分。
参看图4和5，它们示出了用于与插销式接插件20配对的插座式接插件52。插座式接插件52包括一个本体54，它最好用与插销式接插件20相同的绝缘的模制聚合物形成。包围本体54的是一周边壁56，它包括用于接纳插销式接插件的极化/定位翼板26的切去区(未示出)。基体或本体构件54包括用于接纳插座接线片72的插座通道62。当采用图6、7和8所示的这类插座接线片时，通道62最好包括相对的倒角区64，用于容纳成形的触点臂78a、78b(图4和5)中的插销接线片28的接收物。此倒角区64最好与延伸并包括突起68的顶部的导入面65一起形成。通道62还包括侧壁66。相对的接线片保持突起68从侧壁66朝插座接线片72的脚段76(图6和7)延伸。突起68在插座接线片72插入时以与上面所描述的相同的方式相对于插销式接插件20中的突起48变形。末端88的倒角87和导入面65有助于完成变形而不是像前面联系图3所描述的那样去掉突起68的末端部分。
每个插座通道62从本体54的配对表面58延伸至在安装接口或表面60上形成的井或袋70。如图4所示，袋70用于接纳基体触点块如焊料球74，该球融合在接线片72上并基本填充并与袋70的形状共形。这样，插座接线片就以基本与插销接线片28相同的方式被保持并定位。
如图5所示，插销和接插件体22和54的构形以及插销触点接线片28与插座触点接线片72的构形可使配对的接插件的高度极小化。这样又使堆叠的电路基体5之间的堆叠高度T在焊料球35a和74a的第二次软熔之后成为最小。
现在翻至图6～8，更详细地描述插座接线片72的优选形式。每个插座触点接线片包括一脚部76和一对悬臂的弹性触点臂78a、78b。如图7所示，脚部76基本为平面形并可被看作规定触点的沿纵向延伸的中心平面P。如图7所示，每个触点臂78a、78b在触点臂的中间区相反地从平面P扩张，在其间形成一弯曲79，该弯曲与位于两个触点臂之间的间隙的底部86隔开一段距离。
臂78a、78b的末端以后朝平面P收缩，形成一用于与插销接线片接合的触点段80。在臂78a、78b的端部形成导入部分82，以有助于与插销触点28配合。在每个臂78a，78b的端部的中间形成一急转的肩部84。急转的肩部起着倒刺的作用，以有助于接线片保持在通道62内。此肩部和插销28的肩部34一样，都用工具接合，将金属触点插入各自的塑料体中。急转的角有助于将接线片保持在各自的通道中。
采用横向错开的触点臂78a、78b提供无数的优点，包括使接线片的前面至后面的尺寸为最小，即使在由于插销触点28进入两个臂78a和78b之间而弯曲至图7所示的点划线的位置。此外，采用如图4和5所示的接线片保持突起68，可使触点臂78a、78b的长度为最大，从而允许产生适当的弯曲量，以产生合适的触点法向力和足够的触点摩擦闭合。
如图6所示，一焊料翼板88从脚段76延伸。在一优选的形状中，焊料翼板88适于有一个焊料球融合在其上。如同前面联系插销接线片28所讨论那样，接线片72的导缘上做有合适的导入结构，例如倒角的表面87。脚段可以做有热隔断结构，以使来自袋70的至接线片上的焊料抽吸为最少。如图6所示，接线片隔断结构可以包括一对孔89。此结构可以与在脚段76上形成钝化表面或施加其它的抗焊料抽吸涂层如本技术中已知的有机氟聚合物联合使用。不管有还是没有钝化和/或抗抽吸涂层，当袋70中的焊料膏被软熔，将焊料球74固定在焊料翼板88上时，热隔断都阻止了焊料沿触点的流动。插销接线片28也可以包括这种抗焊料抽吸添加物，以作为热隔断。钝化涂层或其组合。参看图9和10，其示出了用于保持接线片例如在接插件壳体中的插座接线片触点的另一种结构。在此实施例中，形成通道91，以接纳接线片90。在每个通道91内，形成从通道的侧壁伸出的一个或更多的突起94。每个接线片有一个孔96，它的尺寸和形状做成能接纳至少一部分一个或两个突起94。理想的是，孔96的形状对应于突起94的形状，以使接线片能被突起约束，不能侧向和纵向移动，同样不能从前面至后面移动。突起94的两个末端部分隔开一段距离并最好与中间平面MP等距离，该相隔的距离小于形成接线片所用的材料的厚度。
在接线片90插入通道91中时，突起94被接线片端部或焊料翼板98变形或略有展开。斜的或倒角的表面95减少了焊料翼板98刮削突起94的末端的趋势。当接线片处于完全插入的位置时，突起94与孔96对齐，同时其末端部分进入孔96中。因此，任何作用在接插件体上的应力只局限在突起94的末端区内。由于在突起94进入孔96中时卸去相当大一部分应力，故可以避免形成一个能够使接插件体翘曲或弯曲的应力。保持段92的纵向横截面最好基本相对于中心纵向平面对称，以便在脚92插入通道91中时，有一个作用在触点接线片90上的自对中作用。孔96还可具有热隔断的功能，用于阻止焊料抽吸，其方式与图6的实施例中的孔89相同。接线片90也可包括钝化或抗抽吸涂层，以防止焊料朝触点段流动。
虽然本发明是联系各种形状的优选实施例描述的，但是应当理解，可以采用其它类似的实施例，或对所述的实施例进行改进或增加，以实现本发明的同样功能而不与其违背。此外，所述结构可以用于接插件以外的零件，它们包括用绝缘材料做的壳体，壳体载有被融合在PWB或其它电气基体上的元件。
因此，本发明不应只限于单独的实施例，而是在广度与范围上要按照所附权利要求书的叙述进行解释。

Claims (5)

1.一电接插件，它包括：
一接插件体，它具有一配对接口和一安装接口；
一触点接线片，它可插入上述体中并有一配对部分和一保持部分；
一在接插件体中的通道，它用于接纳触点接线片，该通道从配对接口朝安装接口延伸并包括用于接纳触点接线片的保持部分的保持段；
一带斜坡的第一保持突起，它至少在插入上述触点接线片之前伸入通道中；以及
一突起接纳结构，它在触点接线片上形成，以用于接纳至少一部分第一保持突起。
2.如权利要求1的电接插件，其特征为，第一保持突起沿基本平行于通道的纵向轴线的方向是长的。
3.如权利要求1的电接插件，其特征为，突起接纳结构包括一穿过触点接线片的保持部分延伸的孔。
4.如权利要求3的电接插件，其特征为，通道包括一第二保持突起，它向通道内沿与第一保持突起相对的方向延伸，并放置成从与第一突起从其进入孔的一侧相反的一侧，进入触点接线片的保持部分的孔中。
5.如权利要求4的电接插件，其特征为，所述第一和第二保持突起是彼此相对并彼此隔开的。
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