CN1262589C - 激光标记使用的颜料和组合物 - Google Patents
激光标记使用的颜料和组合物 Download PDFInfo
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- CN1262589C CN1262589C CNB018221602A CN01822160A CN1262589C CN 1262589 C CN1262589 C CN 1262589C CN B018221602 A CNB018221602 A CN B018221602A CN 01822160 A CN01822160 A CN 01822160A CN 1262589 C CN1262589 C CN 1262589C
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- 239000000203 mixture Substances 0.000 title claims abstract description 118
- 239000000049 pigment Substances 0.000 title claims abstract description 107
- 239000004811 fluoropolymer Substances 0.000 claims abstract description 32
- 229920002313 fluoropolymer Polymers 0.000 claims abstract description 27
- 238000000197 pyrolysis Methods 0.000 claims abstract description 15
- 238000009413 insulation Methods 0.000 claims abstract description 10
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 83
- 238000002372 labelling Methods 0.000 claims description 18
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- 229920000642 polymer Polymers 0.000 claims description 15
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 12
- 230000005855 radiation Effects 0.000 claims description 9
- 239000006229 carbon black Substances 0.000 claims description 7
- 229920001577 copolymer Polymers 0.000 claims description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 7
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 7
- 235000010290 biphenyl Nutrition 0.000 claims description 6
- OVGRCEFMXPHEBL-UHFFFAOYSA-N 1-ethenoxypropane Chemical compound CCCOC=C OVGRCEFMXPHEBL-UHFFFAOYSA-N 0.000 claims description 3
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- QHSJIZLJUFMIFP-UHFFFAOYSA-N ethene;1,1,2,2-tetrafluoroethene Chemical compound C=C.FC(F)=C(F)F QHSJIZLJUFMIFP-UHFFFAOYSA-N 0.000 claims description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 3
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- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 33
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 31
- 239000011248 coating agent Substances 0.000 description 27
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- 239000010410 layer Substances 0.000 description 21
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 19
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- 102100039805 G patch domain-containing protein 2 Human genes 0.000 description 10
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- KBXJHRABGYYAFC-UHFFFAOYSA-N octaphenylsilsesquioxane Chemical compound O1[Si](O2)(C=3C=CC=CC=3)O[Si](O3)(C=4C=CC=CC=4)O[Si](O4)(C=5C=CC=CC=5)O[Si]1(C=1C=CC=CC=1)O[Si](O1)(C=5C=CC=CC=5)O[Si]2(C=2C=CC=CC=2)O[Si]3(C=2C=CC=CC=2)O[Si]41C1=CC=CC=C1 KBXJHRABGYYAFC-UHFFFAOYSA-N 0.000 description 8
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 7
- 229910052731 fluorine Inorganic materials 0.000 description 7
- 239000011737 fluorine Substances 0.000 description 7
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 7
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 101100407828 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) ptr-3 gene Proteins 0.000 description 5
- 101150013914 PFA3 gene Proteins 0.000 description 5
- 101100066561 Schizosaccharomyces pombe (strain 972 / ATCC 24843) fep1 gene Proteins 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
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- 239000000843 powder Substances 0.000 description 5
- 238000003878 thermal aging Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
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- 239000011159 matrix material Substances 0.000 description 4
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- 238000007669 thermal treatment Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 239000005083 Zinc sulfide Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
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- 238000004821 distillation Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 101100351735 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) ptr-4 gene Proteins 0.000 description 2
- 101150070307 PFA4 gene Proteins 0.000 description 2
- 101150019284 PFA5 gene Proteins 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
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- 229920000265 Polyparaphenylene Polymers 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- PARWUHTVGZSQPD-UHFFFAOYSA-N phenylsilane Chemical compound [SiH3]C1=CC=CC=C1 PARWUHTVGZSQPD-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
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- 239000002002 slurry Substances 0.000 description 2
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- 239000010936 titanium Substances 0.000 description 2
- GWTYBAOENKSFAY-UHFFFAOYSA-N 1,1,1,2,2-pentafluoro-2-(1,2,2-trifluoroethenoxy)ethane Chemical compound FC(F)=C(F)OC(F)(F)C(F)(F)F GWTYBAOENKSFAY-UHFFFAOYSA-N 0.000 description 1
- NPNPZTNLOVBDOC-UHFFFAOYSA-N 1,1-difluoroethane Chemical compound CC(F)F NPNPZTNLOVBDOC-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- 206010013786 Dry skin Diseases 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical class CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- 229920001774 Perfluoroether Polymers 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
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- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000003287 bathing Methods 0.000 description 1
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- 150000001721 carbon Chemical group 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000039 congener Substances 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000029087 digestion Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009503 electrostatic coating Methods 0.000 description 1
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- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
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- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000010902 jet-milling Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 238000010094 polymer processing Methods 0.000 description 1
- 239000013047 polymeric layer Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
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- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
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- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 239000012463 white pigment Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
- H01B3/445—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds from vinylfluorides or other fluoroethylenic compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/267—Marking of plastic artifacts, e.g. with laser
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/04—Compounds of zinc
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/04—Compounds of zinc
- C09C1/043—Zinc oxide
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/36—Compounds of titanium
- C09C1/3607—Titanium dioxide
- C09C1/3684—Treatment with organo-silicon compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/12—Treatment with organosilicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/305—Polyamides or polyesteramides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
- C01P2002/84—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by UV- or VIS- data
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/03—Particle morphology depicted by an image obtained by SEM
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/50—Agglomerated particles
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/54—Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/80—Particles consisting of a mixture of two or more inorganic phases
- C01P2004/82—Particles consisting of a mixture of two or more inorganic phases two phases having the same anion, e.g. both oxidic phases
- C01P2004/84—Particles consisting of a mixture of two or more inorganic phases two phases having the same anion, e.g. both oxidic phases one phase coated with the other
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
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Abstract
用于激光标记的颜料和组合物。颜料为无色的紫外吸收颜料,至少部分用协合剂涂覆,协合剂的化学式为[Rm(SiOn)]pR’q,其中:(a)m为1-3,n为1-3,p至少为1,q为0-3;(b)至少一个R或R’是在热解时产生适合于提供标记的黑色物质的取代基。这样的颜料用于电线和电缆的含氟聚合物绝缘材料。
Description
相关申请的交叉参考
本申请是根据35 USC 111(a)的申请,并根据35 USC 111(a)要求2000年11月21日提交的临时申请系列No.60/252,286的优先权。此临时申请的内容收集于此供参考。
发明背景
本发明涉及颜料和含有这类颜料的组合物,特别是含氟聚合物的组合物,以及它们在物体激光标记中的应用。
发明导言
诸如含氟聚合物之类的聚合物常用作物体(诸如电线和电缆)的绝缘材料。在这样的应用中,一般是将含氟聚合物包覆着中心的电线,或是提供一个管套包覆着一个或多个已经绝缘的电线。为了鉴别这些一根根的电线,常常必须在绝缘材料或管套材料上标以数字、字母或其它的标示。激光标记是优先选择的一种标记方法,因为它能在绝缘材料的表面上提供相对持久的高清晰度标记,而且对聚合物没有机械损伤或是不要求油墨对聚合物有好的粘合力。
激光标记常使用紫外线(紫外)激光器,诸如受激准分子激光器。因为含氟聚合物能透过紫外辐射,所以一般需要在含氟聚合物中加入吸收紫外光的化合物或颜料以便产生记号。一种常用的颜料添加剂是二氧化钛(TiO2),当激光指向含此添加剂的聚合物组合物时,激光诱发晶格中的Ti4+(无色)还原成Ti3+(蓝黑色),其结果使对光敏感的TiO2改变了颜色。在含氟聚合物中的TiO2应用公开于US 5,560,845(Birmingham等人)和US 5,789,466(Birmingham等人)中,文中对掺颜料的可熔融加工的含氟聚合物基体的激光标记提供了详情,使用的是用有机硅烷涂覆的二氧化钛颜料。在这些文献中是依赖有机硅烷去增加颜料的分散、减少TiO2附聚物数量以及增加标记的质量。在公开的组合物中,有机硅烷的用量为有机硅烷和颜料总量的约0.1-约5重量%。
发明概述
现已发现,如果颜料涂覆了协合剂或紧附着协合剂,这种协合剂含有取代基,取代基热解时产生黑色物质(碳)以提供标记,就能得到对比度有改进的激光标记。这样的颜料能够用于受激准分子激光辐射下的组合物,例如用于电线和电缆的绝缘材料。不同类型的协合剂可以用来适应不同加工和使用条件的聚合物。我们特别发现,用本发明的颜料和含这种颜料的组合物形成的激光标记在热陈化条件下仍然有好的对比度。
本发明的第一方面的问题是提供一种无色的紫外吸收颜料,这种颜料至少部分涂覆了下式的协合剂:
[Rm(SiOn)]pR’q,
式中:
(a)m为1-3,n为1-3,p至少为1,q为0-3;
(b)至少一个R或R’是在热解时产生适合于提供标记的黑色物质的取代物。
本发明的第二方面的问题是提供在受激准分子激光辐射下适合于激光标记的组合物,该组合物包括:
(1)加工温度为Tp的含氟聚合物;
(2)无色紫外吸收颜料,其量为组合物重量的0.1-25重量%;
(3)本发明第一方面的问题中提到的协合剂,该协合剂是:
(i)存在量为聚合物组合物中颜料的至少10重量%;
(ii)在温度至少为Tp时是稳定的;和
(iii)与颜料实际接近。
特别优先选择的组合物是其中协合剂和颜料用于聚四氟乙烯(PTFE)组合物。因此,本发明的第三方面的问题是提供在受激准分子激光辐射下适合于激光标记的组合物,该组合物包括:
(1)聚四氟乙烯;
(2)无色紫外吸收颜料,其量为组合物重量的0.1-50重量%;
(3)具有下式的协合剂:
[Rm(SiOn)]pR’q,
式中:
(a)m为1-3,n为1-3,p至少为1,q为0-3;
(b)至少一个R或R’是一取代基,该取代基在热解时产生适合于提供标记的黑色物质,
所说的协合剂是:
(i)存在量为聚合物组合物中颜料存在量的至少0.1重量%;
(ii)在温度至少为Tp时是稳定的;
(iii)与颜料的实际接近。
本发明的颜料和组合物对于绝缘材料是特别有用的。因此本发明的第四方面的问题是提供绝缘的导线,它包括:
(A)长的电线;
(B)包围着所说的电线的绝缘层,所说的绝缘层包括本发明第二方面的问题中所述的组合物。
发明详述
本发明的颜料吸收紫外辐射,即小于约400nm的辐射。它们最好是基本上无色的。说明书中的“白色”是指不存在颜色,所以白色颜料是无色的。适合的颜料包括二氧化钛(TiO2)、氧化锌(ZnO)和硫化锌(ZnS)。对其不透明性、高折射指数和对紫外辐射的反应来说,特别优选的是结晶TiO2。金红石和锐钛矿形式的TiO2都是可以使用的。优先选择的颜料的平均粒径小于1μm,最好是小于0.5μm,特别是小于0.4μm,更特别是小于0.3μm。
颜料至少部分用式(I)的协合剂(也称为涂料)涂覆或与协合剂接触:
[Rm(SiOn)]pR’q, (I)
式中:m为1-3,n为1-3,p至少为1,q为0-3;至少一个R或R’是在热解(例如紫外辐射引起的热解)时产生大量黑色物质(例如碳黑、碳化硅、碳氧化硅或它们的混合物)的取代基。如R多于一个,则各R可以相同或不相同;如R’多于一个,则各R’可以相同或不相同。取决于m,n和p的选择,R’可以不存在。例如,m=1,n=1.5,p非常大时,则R’基本上不存在。在式(I)的环状同类物中R’是不存在的。R和R’可以是相同或不相同的取代基。优先选择的R或R’是取代或未取代的芳基。协合剂最好是本身基本无色的,并且应该是热稳定(即不降解)和不挥发的,以在整个加工过程和其后的产品使用条件下保持相对不变。
热解需要的热量来源于颜料对受激准分子激光的吸收,因此协合剂直接与颜料接触或足够地近(一般是实际接近),这样才容易进行热的传递,这是很重要的。协合剂必须涂覆在颜料上或在聚合物加工中能够迁移至颜料的表面以形成涂层,使之在整个加工过程和产品使用条件下与颜料表面保持紧密接触。如果是涂覆在颜料上,协合剂可以是部分覆盖,例如覆盖颜料表面积的至少25%,或者是完全覆盖颜料的表面积。优选的协合剂是硅倍半氧烷和多面体低聚硅倍半氧烷(POSS)。POSS的通式结构为(RSiO1.5)n,其中R可以是有机残基,但优选苯基或萘基之类的芳香基团;n可以是8,10,12或更大。此外,各种结构为R-(SiO[R1,R2]2)n-R的低聚和聚合硅氧烷(式中R,R1和R2可以相同或不相同)都是适合的添加剂。优选的R,R1或R2取代基是苯基,它应该是作为重要的取代基而存在,一个典型的例子是含大量苯基(每个硅原子含一个或两个)的硅氧烷。适合的苯基-POSS化合物包括八苯基-POSS、十二苯基-POSS和多苯基-POSS(由HybridPlastics公司提供,牌号为Molecular SilicaTM,产品号分别为MS0380,MS0802和MS1270)。结构为[(C6H5)SiO1.5]12的十二苯基-POSS具有一鸟笼结构,热处理时(例如200℃加热1.5小时)将能除去制备十二苯基-POSS所用的任何笼形化的溶剂,这样的溶剂对于混合了协合剂的任何组合物的稳定可能起反作用。虽然苯基-POSS化合物作为激光标记添加剂或作为全氟聚合物的添加剂尚属未知,但它们的优点是:(1)加工温度大于或等于360℃时是稳定的,这个温度是加工某些聚合物(包括全氟聚合物)所需要的,(2)在可见光中是无色的。
适合用于本发明的还有苯基烷氧基硅烷,例如苯基三甲氧基硅烷,诸如Sivento Inc.以CP0330为名所提供的。苯基-POSS和苯基硅烷二者在高温下都是稳定的。
协合剂一般的存在量是协合剂和颜料总量的5重量%以上,优选至少是10重量%,特别是至少20重量%,更特别是至少30重量%,并且存在量可以是一很高的百分数,例如50%或更高。这些量特别适合于含有一苯基硅烷或硅氧烷的可熔融加工的聚合物。但是,对于包括硅倍半氧烷或POSS协合剂的可熔融加工的聚合物,或包括任何已指出的协合剂的非可熔融加工的聚合物,协合剂的存在量要低得多,例如至少是协合剂和颜料总量的0.1重量%,优选至少0.5重量%,特别是至少1重量%。
上述的颜料可以用来增强包括任何适合聚合物(包括聚烯烃,诸如聚乙烯和聚丙烯)组合物中的激光标记。但是,特别有性趣(特别是用于飞机机架电线)的是含氟聚合物。含氟聚合物包括诸如乙烯/四氟乙烯共聚物(ETFE)的可熔融加工的含氟聚合物和可熔融加工的全氟聚合物(其中与碳原子直接连接的每一个氢都被氟所取代)。适合的可熔融加工的全氟聚合物包括四氟乙烯/六氟丙烯共聚物(FEP)、四氟乙烯/丙基乙烯基醚共聚物(PFA)和四氟乙烯/甲基乙烯基醚共聚物(MFA)。这些聚合物可以用任何适合的设备(例如挤塑机)进行熔融加工。非熔融加工的聚四氟乙烯(PTFE)也是可以使用的。由PTFE组成的组合物可以用柱塞式挤出法进行加工,接着进行热压结。可熔融加工的聚合物或非可熔融加工的聚合物可以用下面两种技术之一种进行加工:例如静电涂敷或分散涂敷(组合物沉积在基体上,然后加热处理)。组合物中的聚合物的加工温度Tp定义为组合物在正常的加工中所能承受的最高温度。对于结晶性聚合物来说,Tp一般大于熔融温度Tm,Tm定义为示差扫描量热计(DSC)记录上的放热峰值。
高纯度全氟聚合物是特别优先选择的,因为它们在给定的颜料浓度和涂层下能提供最大的对比度。高纯度PFA是充分用氟封端的,每百万个碳原子的非氟封端端基少于六个。这样的聚合物公开于US4,743,658(Imbalzano等人)中,在此作为参考。
本发明的组合物包括一基本无色的紫外吸收颜料,例如TiO2,其量为总组合物量的0.1-70重量%,优选0.1-50重量%,更优选0.1-25重量%,特别是0.1-10重量%。本发明还包括一种如上所述的协合剂。选择的协合剂需要在至少为Tp的温度下是热稳定的。协合剂可以与颜料直接实际接触,例如在加热聚合物前与颜料交联,也可以在加工过程中迁移至足够接近颜料处,使之在紫外辐射时有充分的实际接触以进行热的转移。
现已发现,在熔融的聚合物中,协合剂和颜料的加入次序可以影响最终的对比度。一般说来,如协合剂在颜料之后加入,优先涂覆的是高表面能的颜料颗粒;然而,如果协合剂在颜料之后加入,它能均匀地分散在聚合物中,也不能给颜料提供涂层,其结果得到的是低对比度。再者混合温度也能影响最终组合物的对比度,低加工温度常常得到较好的对比度。全氟聚合物在很高的加工温度下可产生氢氟酸(HF),它可以对协合剂的结构起反作用。如果协合剂熔融,在该熔融范围以上的温度进行加工,则可使其与颜料有很好的接触。例如,DPOSS的熔融区域温度达375℃左右,因此在此温度以上进行加工可使协合剂熔融并涂覆颜料。
特别优选的与PTFE一起使用的是聚苯基硅倍半氧烷(PPSQ;Gelest公司以SST-3P01为名提供)。PPSQ具有梯形结构。我们发现,此材料可被交联,因此当它涂覆在颜料上时,就在颜料上形成一涂层,能耐受某些类型的制造PTFE带所用的溶剂。一种适合的交联方法叙述于下文的实施例15中。
本发明的组合物特别适合用于绝缘导线,其中细长元件(例如电线、电缆或电线束)至少部分被含组合物的绝缘层所包覆。组合物也能用来包覆如光缆的细长元件。如果组合物是基于可熔融加工的聚合物,则组合物可以围绕元件被挤出。另外,如果组合物包括非可熔融加工聚合物,例如PTFE,则可用柱塞式挤出,或用条带包裹元件。在电线(或电缆)和组合物之间可以有一个或多个厚度不同或相同的层和/或组合物。这样的层可包括云母带,诸如在美国专利申请No.09/587,229(Nyberg等人)和国际专利公布No.WO 00/74075(TycoElectronics公司等)中所公开,在此作为参考。一般说来,随着含颜料和协合剂的绝缘层的壁厚增加,对比度则加大。
导线可以包括不含颜料或协合剂的聚合物外层。这样的外层必须特别薄,例如小于0.1mm,以便激光辐射能够穿过,去识别内部的颜料层。外层可以改善导线的耐磨性,同时仍然可以给导线提供可接受的对比度。
对比度是标记的反射度和标记所处的背景之间的差,以百分数表示。使用本发明的颜料和组合物产生的对比度为至少70%,优选至少75%,特别是至少80%,甚至在高温下热陈化24小时或更长时间仍然保持着高水平。
通常,对于不熔的聚合物(例如PTFE),热固性前体或极性热塑性塑料(例如对聚苯二甲酸二乙醇酯、聚对苯二甲酸二丁醇酯、聚偏氯乙烯或聚氯乙烯),协合剂最好是(C6H5SiO1.5)n,涂覆在颜料上,并与之交联。对于极性较小的热塑性聚合物(例如PFA、FEP、聚丙烯或聚乙烯)协合剂基可以是(C6H5SiO1.5)n或是在热塑加工中能迁移至分散于聚合物基料中的颜料以在颜料上形成涂层的低分子量变体,在产品使用的过程中也保持其固有的位置。优选的化合物是十二[苯基硅倍半氧烷](C6H5SiO1.5)12。
本发明的组合物特别适用于飞机机架电线的绝缘。例如一种含有约4%TiO2的飞机电线用工业PTFE带,此带被308nm的受激准分子激光照射后能提供约60-70%的激光标记对比度。本发明的PTFE组合物的实施例呈现的对比度大于75%。
当本发明以基于硅的协合剂公开时,对其更全面的叙述如下:
协合剂的化学式是
[RsX]t, (II)
式中R如前所定义(即所选择的一种取代基,它能在热解时提供大量的黑体物质),X是包括一种或多种元素的结构单元,s是X的剩余价,t至少为1。协合剂(II)的实例是芳基取代的硅氧烷、硅烷、硅倍半氧烷、氧化膦、膦酸酯、膦氮烯以及它们的低聚物或聚合物。
本发明也包括在聚合物基体上提供标记的方法,该方法包括:(1)提供本发明的组合物;(2)将组合物暴露在受激准分子激光下以热解协合剂的取代基并产生黑色标记物质。
现以下面的实施例对本发明进行说明,其中的实施例20,23,31,32和33是比较实施例。
可熔融加工的组合物:
实施例1-30
使用表II(其中的“MFR”按制造厂商所定为熔体流动速度)、III和IV中所述的组分制备了表I中所述的配方并制成颗粒。其步骤如下面所述。表I列出了作为颜料量百分数的总的涂料%,用[涂料重量%/(涂料重量%+颜料重量%)]测定,以及存在于组合物中的颜料总量,以总组合物重量计。
实施例1:
将聚合物置于加热至约350℃的250毫升布雷本登混合杯(Brabender mxing bowl)中并熔融。在聚合物中加入DPOSS并混合,然后加入TiO2颜料并混合。将组合物从混合杯中取出,冷却,并造粒。然后将粒状的组合物在约375-385℃的温度下挤出,使用长/径比为24∶1的25.4毫米挤塑机,包裹20 A WG镀镍19号铜绞股线,得到的壁厚约为0.20毫米(0.008英寸)。然后将每一挤出的铜线进行激光标记。激光标记用Spectrum Technologies PLC(UK),使用Capris100 XeCl受激准分子激光器,波长308nm,能量密度800mJ/cm2。对比度的测量也用Spectrum,使用Capris CMS2系统。对比度是标记反射度与标记所在处的背景之间的差,以百分数表示。
实施例2:
按照实施例1的步骤(除了在聚合物熔融后),加入TiO2,接着加DPOSS。比较实施例1和2的对比度数据显示,在颜料之后加入涂料能产生较高的对比度。
实施例3:
将十二苯基POSS在385℃下加热1小时使其不熔化,但在甲苯中更可溶。然后将此原料溶于甲苯。将两份Kronos 2078 TiO2和一份DPOSS在DPOSS/甲苯溶液中混合并搅拌。加热至甲苯的沸点以上以去除甲苯。将得到的有涂层的TiO2研磨至200目筛号,加入熔融的聚合物,然后混合,冷却,并制粒。然后将组合物如实施例1进行挤塑。
实施例4:
按实施例3的步骤,以4份TiO2∶1份DPOSS的比例,制备DPOSS涂覆的TiO2。然后重复实施例1的步骤。
实施例5:
按实施例3的步骤,以8份TiO2∶1份DPOSS的比例,制备DPOSS涂覆的TiO2。然后重复实施例1的步骤。
实施例6:
按实施例3的步骤,以16份TiO2∶1份DPOSS的比例,制备DPOSS涂覆的TiO2。然后重复实施例1的步骤。
实施例7-12:按照实施例2的步骤,在熔融的聚合物中加入TiO2,接着加入DPOSS。然后,除了挤塑是在约400℃的温度下进行外,按照实施例1的步骤。
实施例13:使用100份Kronos 2078 TiO2和25份苯基三甲氧基硅烷(CP0330)。每摩尔硅烷加入3摩尔的水将苯基三甲氧基硅烷预水解。然后加入HCl至pH2。加入乙醇,同时剧烈搅拌混合物,直至成为单相。将混合物加盖搅拌3小时。制备TiO2的水浆液,加入预水解硅烷,使其很好混合。混合物在强制空气循环炉中于100℃下加热至干,然后进行干燥。将处理后的TiO2粉碎成小块,喷射研磨至平均粒径约8.5μm,然后低温研磨。在熔融的聚合物中加入1.75%的研磨颜料,混合(约370℃),制粒,按实施例1所述方法挤塑(约400℃)。
实施例14:按实施例13的方法制备苯基三甲氧基硅烷涂覆的TiO2,但干燥的处理过的颜料是研磨至通过200目筛孔。在360℃下混合磨细的颜料,然后按实施例1所述的方法制粒和挤塑(385℃)。
实施例15:
使用下述的方法用Gelest SST-3P01聚苯基硅倍半氧烷(PPSQ)涂覆Kronos 2078,其比例为TiO2∶PPSQ=4∶1。在一5升的三颈圆底烧瓶上安装一机械搅拌器、一滴液漏斗、两支温度计、一通过分液器的蒸馏装置和一电热套,将其置于升降台上。将反应体系用氮连续吹扫。在反应器中加入1200毫升去离子水,启动搅拌器,在室温下加入300克TiO2。将此悬浮体系在室温下搅拌2小时。另外将75克PPSQ溶于约175毫升甲苯,将此溶液通过滴液漏斗在20分钟内加入很好搅拌了的TiO2悬浮体系中,滴液漏斗中残留的PPSQ用约20毫升甲苯搅拌冲洗。将得到的悬浮液-乳液体系在室温下搅拌约2小时,然后将温度提高至约90℃以蒸馏甲苯/水(80/20,重量/重量)共沸物(公称沸点:85℃)。为最大限度减少泡沫的形成,反应器留有相对较大的未用空间,并在共沸蒸馏接近完成的时候加入约5毫升的水(在一定程度上抑制发泡)。再者,分液器也可以阻止泡沫进入蒸馏装置。在蒸馏后期增加氮气流并保持浴温在或低于90℃有助于残余甲苯的去除。然后加入1.75克浓氨(溶于约30毫升去离子水)以催化涂覆在二氧化钛颗粒上的PPSQ的交联,并最大限度减少随后产品干燥过程中的附聚现象。停止加热,同时继续搅拌,直至反应浆液冷却到室温。将液浆离心0.5小时,速度10,000rpm。从离心管倾出混浊的上清液,在100℃下干燥1小时以上,得到软的粉末。将此粉末在氮吹扫下分别在150℃和200℃干燥1小时(以完成交联),得到357克产品。扫描电子显微镜显示产品是均匀涂覆的粉末。粉末经喷射研磨成为更细的颗粒,加入熔融的聚合物,混合,制粒,如实施例1所述进行挤塑(385℃)。
实施例16:
将8.7克Kronos 2078和8.7克聚苯基POSS(Hybrid PlasticsPM 1270)溶于500毫升甲苯。加热除去甲苯,得到的物质在200℃的真空炉中干燥1小时。将干燥的物质用研钵和研杵研磨,得到相对粗的粉末,其TiO2/PPOSS比为1∶1。将PPOSS涂覆的TiO2加入熔融的聚合物,混合(365℃),制粒,如实施例1所述进行挤塑(375℃)。
实施例17:
按照实施例13的步骤用100份Kronos 2078 TiO2和10份苯基三甲氧基硅烷(CP0330)制备处理过的TiO2,将其研磨,通过200目筛。将1.1重量%的研磨颜料加入熔融的聚合物,混合(约350℃),制粒,如实施例1所述进行挤塑。
实施例18:
按照实施例13的步骤用100份Kronos 2078 TiO2和20份苯基三甲氧基硅烷(CP0330)制备处理过的TiO2,将其研磨,通过200目筛。将1.2重量%的研磨颜料加入熔融的聚合物,混合(约350℃),制粒,如实施例1所述进行挤塑(375℃。
实施例19:
按照实施例2的步骤将TiO2加入熔融的聚合物,接着加入DPOSS。然后按实施例1的步骤,但挤塑在约400℃下进行。
实施例20(对比实施例):
将25重量%的Kronos 2078 TiO2和75重量%的Dyneon PFA 8502UHP同时喂入一加热至380℃的27毫米共旋Leistritz双螺杆挤塑机,并混炼/制粒,形成母料(母料1)。将4重量%母料和96重量%Dyneon PFA 8502 UHP干混合,如实施例1所述在400℃进行挤塑。
实施例21:
将93.02重量%的实施例20的母料1和6.98重量%的DPOSS一起喂入Leistritz双螺杆挤塑机,并混炼/制粒,形成母料2。将4.3重量%母料2和95.7重量%Dyneon PFA 8502 UHP干混合,如实施例1所述在400℃进行挤塑。
实施例22:
按照实施例21中的相同步骤,但干混合材料在400℃对24 AWG镀镍的19号铜绞股线进行包覆挤塑,得到的壁厚约为0.20毫米(0.008英寸)。
实施例23(对比实施例):
将TiO2加入熔融的聚合物,混合(370℃),制粒,如实施例1所述进行挤塑。
实施例24-27:
在混炼前将DPOSS在200℃热处理1.5小时以除去溶剂。按照实施例2的步骤将TiO2加入熔融的聚合物,再加入热处理后的DPOSS。然后将此混合物混合,冷却,制粒,如实施例1所述进行挤塑。
实施例28:
按照实施例2的步骤,将TiO2加入熔融的聚合物,再加入DPOSS,然后加入0.75%Wilson FEP蓝色浓缩物。将此混合物混合,制粒,如实施例1所述进行挤塑。
实施例29和30:
按照实施例2的步骤,将TiO2加入熔融的聚合物,再加入DPOSS,将此混合物混合,制粒,如实施例1所述进行挤塑。使用标准纯度FEP而不是高纯度FEP,得到的是低对比度。
表I
实施例 | 聚合物 | 涂料 | 颜料 | 涂料% | 颜料% | 对比度 | |||
类型 | % | 类型 | % | 类型 | % | % | |||
1 | PFA1 | 98.0 | DPOSS1 | 1 | TiO21 | 1 | 50 | 1 | 81.4 |
2 | PFA1 | 98.0 | DPOSS1 | 1 | TiO21 | 1 | 50 | 1 | 87.7 |
3 | PFA1 | 98.5 | DPOSS1 | 0.5 | TiO22 | 1 | 33 | 1 | 89.5 |
4 | PFA1 | 98.8 | DPOSS1 | 0.24 | TiO23 | 0.96 | 20 | 0.96 | 87.2 |
5 | PFA1 | 98.87 | DPOSS1 | 0.13 | TiO24 | 1 | 11 | 1 | 82.3 |
6 | PFA1 | 98.94 | DPOSS1 | 0.06 | TiO25 | 1 | 5.9 | 1 | 81.5 |
7 | PFA2 | 98.3 | DPOSS1 | 0.2 | TiO21 | 1.5 | 11.8 | 1.5 | 83 |
8 | PFA2 | 98.2 | DPOSS1 | 0.3 | TiO21 | 1.5 | 16.7 | 1.5 | 85 |
9 | PFA2 | 98.1 | DPOSS1 | 0.4 | TiO21 | 1.5 | 21 | 1.5 | 86 |
10 | PFA2 | 97.7 | DPOSS1 | 0.3 | TiO21 | 2.0 | 13 | 2 | 82 |
11 | PFA2 | 98.2 | DPOSS1 | 0.3 | TiO26 | 1.5 | 16.7 | 1.5 | 84 |
12 | PFA2 | 98.2 | DPOSS1 | 0.3 | TiO27 | 1.5 | 16.7 | 1.5 | 75 |
13 | PFA3 | 98.25 | PhS | 0.35 | TiO28 | 1.4 | 20 | 1.4 | 76 |
14 | PFA4 | 98.8 | PhS | 0.24 | TiO28 | 0.96 | 20 | 0.96 | 71 |
15 | PFA2 | 98.33 | PPSQ | 0.33 | TiO29 | 1.34 | 20 | 1.34 | 77 |
16 | PFA1 | 98.0 | PPOSS | 1 | TiO210 | 1 | 50 | 1 | 79 |
17 | PFA1 | 98.9 | PhS | 0.1 | TiO211 | 1 | 9.1 | 1 | 78 |
18 | PFA1 | 98.8 | PhS | 0.2 | TiO212 | 1 | 16.7 | 1 | 80 |
19 | PFA5 | 98.3 | DPOSS1 | 0.5 | TiO21 | 1.2 | 29.4 | 1.2 | 88 |
20 | PFA3 | 99.0 | - | 0 | TiO21 | 1 | 0 | 1 | 53 |
21 | PFA3 | 98.7 | DPOSS1 | 0.3 | TiO21 | 1 | 23 | 1 | 76 |
22 | PFA3 | 98.7 | DPOSS1 | 0.3 | TiO21 | 1 | 23 | 1 | 74 |
23 | FEP1 | 99.0 | - | 0 | TiO21 | 1 | 0 | 1 | 56 |
24 | FEP2 | 98.0 | DPOSS2 | 1 | TiO21 | 1 | 50 | 1 | 89 |
25 | FEP3 | 98.0 | DPOSS2 | 1 | TiO21 | 1 | 50 | 1 | 81 |
26 | FEP1 | 98.0 | DPOSS2 | 1 | TiO21 | 1 | 50 | 1 | 82 |
27 | FEP1 | 98.4 | DPOSS2 | 0.6 | TiO21 | 1 | 37.5 | 1 | 77 |
28 | FEP1 | 97.25 | DPOSS2 | 1 | TiO21 | 1 | 50 | 1 | 80 |
29 | FEP4 | 98.4 | DPOSS2 | 0.6 | TiO21 | 1 | 37.5 | 1 | 63 |
30 | FEP4 | 97.4 | DPOSS2 | 0.6 | TiO21 | 2 | 23.1 | 2 | 62 |
表II
组分 | 标示 | 制造厂商 | 注释 |
全氟烷氧基树脂 | |||
PFA1 | PFA 440 HPB | DuPont | 高纯度,氟封端;MFR 14 |
PFA2 | PFA 445 HP | DuPont | 高纯度,氟封端;MFR 5 |
PFA3 | 8502 UHP | Dyneon | 高纯度,氟封端;MFR 2 |
PFA4 | PFA 340 | DuPont | 标准纯度;MFR 14 |
PFA5 | PFA 950 HP | DuPont | 高纯度,氟封端;PEVE共聚单体;MFR 1.7-3.0 |
氟化乙烯/丙烯共聚物 | |||
FEP1 | FEP 5100J | DuPont | 高纯度,封端的;MFR 22 |
FEP2 | FEP 100J | DuPont | 高纯度,封端的;MFR 6.6 |
FEP3 | FEP 100 | DuPont | 标准纯度;MFR 6.6 |
FEP4 | FEP 5100 | DuPont | 标准纯度;MFR 22 |
表III
组分 | 标志 | 制造厂商 | 注释 |
DPOSS1 | MS0802 | HybridPlastics | 十二苯基多面体低聚硅倍半氧烷;鸟笼结构;初始粒径~120μm;(C6H5SiO1.5)12 |
DPOSS2 | DPOSS1于200℃热处理1.5小时除溶剂 | ||
PhS | CP0330 | Sivento Inc. | 苯基三甲氧基硅烷 |
PPSQ | SST-3P01 | Gelest | 聚苯基硅倍半氧烷;梯形结构 |
PPOSS | PM1270 | HybridPlastics | 聚苯基多面体低聚物硅倍半氧烷;聚合物链鸟笼结构;初始粒径~40μm |
表IV
组分 | 标示 | 制造厂商 | 注释 |
TiO2 | |||
TiO21 | 2078 | Kronos | Rutile;无涂层;粒径~0.27μm |
TiO22 | 2∶1 | 2∶1 Kronos 2078:DPOSS1 | |
TiO23 | 4∶1 | 4∶1 Kronos 2078:DPOSS1 | |
TiO24 | 8∶1 | 8∶1 Kronos 2078:DPOSS1 | |
TiO25 | 16∶1 | 16∶1 Kronos 2078:DPOSS1 | |
TiO26 | AHR-F | Huntsman | Anatase;有些有机涂层,晶体粒径~0.13μm |
TiO27 | TiPure R103 | DuPont | Rutile;0.25%有机处理;3.2%矾土;粒径~0.23μm |
TiO28 | 4∶1 | 4∶1 Kronos 2078:PhS(CP0330) | |
TiO29 | 4∶1 | 4∶1 Kronos 2078:XLPPSQ | |
TiO210 | 1∶1 | 1∶1 Kronos 2078:苯基三甲氧基硅烷 | |
TiO211 | 10∶1 | 10∶1 Kronos 2078:PhS(CP0330) | |
TiO212 | 5∶1 | 5∶1 Kronos 2078:PhS(CP0330) | |
TiO213 | TiPure R100 | DuPont | Rutile;0.2%有机处理;1.7%矾土,粒径~0.32μm |
TiO214 | Tiona RCL-4 | MillenniumInorganicChemicals | Rutile;最低97% TiO2;矾土和有机涂层;粒径~0.27μm |
TiO215 | 2∶1 | 2∶1 Kronos 2078:XLPPSQ |
PTFE带包裹样品(实施例31-38)
用下面的方法制备未热压结的PTFE带:喷射研磨表V中所指定的TiO2颜料以降低其粒径,然后在低剪切混合过程中将其加入PTFE(613A,杜邦公司提供),接着用高剪切混合过程增强颜料的分散。于低剪切混合条件下在PTFE/颜料的混合物中加入一润滑剂,制备了加有润滑剂的PTFE/颜料的混合物预制体。接着陈化、柱塞挤塑成带状,压至所需厚度。在250℃以下进行热处理,以除去润滑剂,并将PTFE带切成所需宽度。
使用EJR包带机将一个或多个未热压结的PTFE带包裹在用云母包裹的镍-铜线上。云母带的制备如美国专利申请No.09/587,229(Nyberg等人)的实施例4和国际专利公开No.WO 00/74075(TycoElectronics Corporation等)中所述。其公开在此作为参考。将PTFE绝缘材料在380-400℃的温度下进行热压结约1分钟。整个导线的外径和对比度的测定叙述于实施例1,并示于表V中。表V中的涂料%和颜料号仅指导线的最外层(如果多于一层聚合物层)。
表V
实施例 | 涂料 | 颜料 | 电线 | 外径 | 对比度 | ||
类型 | % | 类型 | % | (AWG) | (mm) | % | |
31 | - | 0 | TiO213 | 4 | 20 | 1.42 | 69.6 |
32 | - | 0 | TiO214 | 4 | 20 | 1.45 | 60.2 |
33 | - | 0 | TiO214 | 4 | 24 | 1.22 | 66.0 |
34 | PPSQ | 0.33 | TiO215 | 1.34 | 24 | 1.24 | 86.0 |
35 | PPSQ | 0.33 | TiO215 | 1.34 | 24 | 1.23 | 86.0 |
36 | PPSQ | 0.24 | TiO29 | 0.96 | 24 | 1.23 | 76.0 |
37 | PPSQ | 0.33 | TiO215 | 1.34 | 20 | 1.33 | 77 |
38 | PPSQ | 0.33 | TiO215 | 1.34 | 20 | 1.47 | 81 |
实施例31(对比实施例):
包裹在电线上的云母带有50%重叠。两层0.051毫米(0.002英寸)厚的含4%TiPure R100 TiO2的工业PTFE带(Du Pont 613 A)重叠52%。
实施例32(对比实施例):
包裹在电线上的云母带有50%重叠。三层0.038毫米(0.0015英寸)厚的含4%RCL-4 TiO2的工业PTFE带(Du Pont 613 A)重叠52%。
实施例33(对比实施例):
包裹在电线上的云母带有50%重叠。两层0.076毫米(0.003英寸)厚的含4%RCL-4 TiO2的工业PTFE带(Du Pont 613 A)重叠52%。
实施例34:
使用实施例15的步骤,用Gelest SST-3P01聚苯基硅倍半氧烷(PPSQ)涂覆Kronos 2078,其比例为TiO2∶XLPPSQ=2∶1。按上述的方法用此涂覆的颜料制备未热压结的0.076毫米(0.003英寸)厚的含2重量%涂覆的颜料的PTFE带。导线的制备是用云母带包裹在电线上,50%重叠;第一层未热压结PTFE带重叠52%,第二层相同的未热压结PTFE带置于第一层PTFE带上,重叠52%。
实施例35:
用云母带包裹在电线上,50%重叠;第一层0.076毫米(0.003英寸)厚的含4重量%的RCL-TiO2的工业PTFE带重叠52%,覆盖于其上的是一层0.076毫米(0.003英寸)厚的含2重量%实施例34所述的涂覆颜料的PTFE带,重叠52%。
实施例36:
如实施例15所述,用Gelest SST-3P01聚苯基硅倍半氧烷(PPSQ)涂覆Kronos 2078,其比例为TiO2∶XLPPSQ=4∶1。并用1.25重量%涂覆颜料与PTFE混合,制备未热压结的0.076毫米(0.003英寸)厚的PTFE带。导线的制备是用云母带包裹在电线上,50%重叠;云母带上再覆盖第一层和第二层未热压结的0.076毫米(0.003英寸)厚的PTFE带,各重叠52%。
实施例37:
用云母带包裹在电线上,50%重叠;其上覆盖一层0.076毫米(0.003英寸)厚的含2重量%的实施例34所述的涂覆颜料的PTFE带,重叠52%。与实施例35比较,用一层PTFE带比用两层PTFE带的对比度低。
实施例38:
用云母带包裹在电线上,50%重叠;其上覆盖一层0.076毫米(0.003英寸)厚的含2重量%的实施例34所述的涂覆颜料的PTFE带,重叠69%。比较实施例37和38显示,壁厚的增加(增加重叠的结果)产生较高的对比度。
标记样品的热陈化
用表VI中所指示的温度和时间对激光标记的样品进行热陈化。以实施例31和32作为比较实施例,甚至在热陈化后本发明的组合物也显示高的对比度。
表VI
实施例 | 初始对比度(%) | 陈化温度(℃) | 陈化时间(小时) | 陈化对比度(%) |
11 | 83 | 310 | 24 | 82 |
12 | 75 | 310 | 24 | 72 |
13 | 76 | 310 | 24 | 68 |
19 | 88 | 310 | 3 | 90 |
310 | 6 | 89 | ||
310 | 12 | 86 | ||
310 | 24 | 83 | ||
31 | 70 | 290 | 168 | 65 |
290 | 336 | 65 | ||
260 | 677 | 65 | ||
32 | 60 | 290 | 168 | 40 |
290 | 678 | 37 | ||
260 | 678 | 37 | ||
35 | 86 | 310 | 24 | 73 |
37 | 77 | 310 | 24 | 69 |
38 | 81 | 310 | 24 | 75 |
总而言之,本发明涉及以下实施方案:
实施方案1.一种适合于在受激准分子激光辐射下激光标记的组合物,所说的组合物包括:
(1)加工温度为Tp的含氟聚合物;
(2)为所述组合物重量的0.1-10重量%的无色紫外吸收颜料;
(3)具有下式的协合剂,
[Rm(SiOn)]pR’q,
式中:(a)m为1-3,n为1-3,p至少为1,q为0-3;
(b)至少一个R或R’是在热解时产生适合于提供标记的黑色物质的取代基,所述黑色物质包括碳黑、碳化硅、氧碳化硅或它们的混合物,
所说的协合剂是(i)存在量为聚合物组合物中颜料和协合剂总量的5-50重量%,
(ii)温度至少为Tp时是热稳定的,以及
(iii)涂覆在颜料上。
实施方案2.实施方案1所述的组合物,其中含氟聚合物是可熔融加工的含氟聚合物。
实施方案3.实施方案2所述的组合物,其中含氟聚合物包括四氟乙烯/丙基乙烯基醚共聚物,四氟乙烯/甲基乙烯基醚共聚物,乙烯/四氟乙烯共聚物或四氟乙烯/六氟丙烯共聚物。
实施方案4.实施方案1所述的组合物,其中含氟聚合物包括聚四氟乙烯。
实施方案5.实施方案1所述的组合物,其中协合剂包括硅倍半氧烷或多面体低聚的硅倍半氧烷。
实施方案6.实施方案5所述的组合物,其中协合剂包括十二苯基硅倍半氧烷。
实施方案7.实施方案1所述的组合物,其中协合剂的存在量至少为颜料和协合剂总量的20重量%。
实施方案8.实施方案1所述的组合物,其中颜料包括TiO2,ZnO或ZnS。
实施方案9.一种适合于在受激准分子激光辐射下激光标记的组合物,所说的组合物包括:
(1)聚四氟乙烯;
(2)为组合物重量的0.1-10重量%的无色紫外吸收颜料;
(3)具有下式的协合剂,
[Rm(SiOn)]pR’q,
式中:(a)m为1-3,n为1-3,p至少为1,q为0-3;
(b)至少一个R或R’是在热解时产生适合于提供标记的黑色物质的取代基,所述黑色物质包括碳黑、碳化硅、氧碳化硅或它们的混合物,
所说的协合剂是(i)存在量为聚合物组合物中颜料和协合剂总量的0.1-20重量%,
(ii)温度至少为Tp时是热稳定的,以及
(iii)涂覆在颜料上。
实施方案10.一种绝缘的导线,该导线包括:
(A)电线;
(B)围绕着所说电线的绝缘层,该绝缘层包括一组合物,该组合物包括:
(1)加工温度为Tp的含氟聚合物;
(2)为组合物重量的0.1-10重量%的无色紫外吸收颜料;
(3)具有下式的协合剂,
[Rm(SiOn)]pR’q,
式中:(a)m为1-3,n为1-3,p至少为1,q为0-3;
(b)至少一个R或R’是在热解时产生适合于提供标记的黑色物质的取代基,所述黑色物质包括碳黑、碳化硅、氧碳化硅或它们的混合物,
所说的协合剂是(i)存在量为聚合物组合物中颜料和协合剂总量的5-50重量%,
(ii)温度至少为Tp时是热稳定的,以及
(iii)涂覆在颜料上。
实施方案11.实施方案10所述的导线,其中所述组合物包括全氟聚合物。
实施方案12.实施方案11所述的导线,其中所述组合物包括聚四氟乙烯。
实施方案13.实施方案12所述的导线,其中所述协合剂包括十二苯基硅倍半氧烷。
实施方案14.实施方案10所述的导线,该导线暴露在波长308nm和能量密度800mJ/cm2的受激准分子激光下,能产生对比度至少70%的标记。
Claims (14)
1.一种适合于在受激准分子激光辐射下激光标记的组合物,所说的组合物包括:
(1)加工温度为Tp的含氟聚合物;
(2)为所述组合物重量的0.1-10重量%的无色紫外吸收颜料;
(3)具有下式的协合剂,
[Rm(SiOn)]pR’q,
式中:(a)m为1-3,n为1-3,p至少为1,q为0-3;
(b)至少一个R或R’是在热解时产生适合于提供标记的黑色物质的取代基,所述黑色物质包括碳黑、碳化硅、氧碳化硅或它们的混合物,
所说的协合剂是(i)存在量为聚合物组合物中颜料和协合剂总量的5-50重量%,
(ii)温度至少为Tp时是热稳定的,以及
(iii)涂覆在颜料上。
2.权利要求1所述的组合物,其中含氟聚合物是可熔融加工的含氟聚合物。
3.权利要求2所述的组合物,其中含氟聚合物包括四氟乙烯/丙基乙烯基醚共聚物、四氟乙烯/甲基乙烯基醚共聚物、乙烯/四氟乙烯共聚物或四氟乙烯/六氟丙烯共聚物。
4.权利要求1所述的组合物,其中含氟聚合物包括聚四氟乙烯。
5.权利要求1所述的组合物,其中协合剂包括硅倍半氧烷或多面体低聚的硅倍半氧烷。
6.权利要求5所述的组合物,其中协合剂包括十二苯基硅倍半氧烷。
7.权利要求1所述的组合物,其中协合剂的存在量至少为颜料和协合剂总量的20重量%。
8.权利要求1所述的组合物,其中颜料包括TiO2、ZnO或ZnS。
9.一种适合于在受激准分子激光辐射下激光标记的组合物,所说的组合物包括:
(1)聚四氟乙烯;
(2)为组合物重量的0.1-10重量%的无色紫外吸收颜料;
(3)具有下式的协合剂,
[Rm(SiOn)]pR’q,
式中:(a)m为1-3,n为1-3,p至少为1,q为0-3;
(b)至少一个R或R’是在热解时产生适合于提供标记的黑色物质的取代基,所述黑色物质包括碳黑、碳化硅、氧碳化硅或它们的混合物,
所说的协合剂是(i)存在量为聚合物组合物中颜料和协合剂总量的0.1-20重量%,
(ii)温度至少为Tp时是热稳定的,以及
(iii)涂覆在颜料上。
10.一种绝缘的导线,该导线包括:
(A)电线;
(B)围绕着所说电线的绝缘层,该绝缘层包括一组合物,该组合物包括:
(1)加工温度为Tp的含氟聚合物;
(2)为组合物重量的0.1-10重量%的无色紫外吸收颜料;
(3)具有下式的协合剂,
[Rm(SiOn)]pR’q,
式中:(a)m为1-3,n为1-3,p至少为1,q为0-3;
(b)至少一个R或R’是在热解时产生适合于提供标记的黑色物质的取代基,所述黑色物质包括碳黑、碳化硅、氧碳化硅或它们的混合物,
所说的协合剂是(i)存在量为聚合物组合物中颜料和协合剂总量的5-50重量%,
(ii)温度至少为Tp时是热稳定的,以及
(iii)涂覆在颜料上。
11.权利要求10所述的导线,其中所述组合物包括全氟聚合物。
12.权利要求11所述的导线,其中所述组合物包括聚四氟乙烯。
13.权利要求12所述的导线,其中所述协合剂包括十二苯基硅倍半氧烷。
14.权利要求10所述的导线,该导线暴露在波长308nm和能量密度800mJ/cm2的受激准分子激光下,能产生对比度至少70%的标记。
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- 2001-11-21 KR KR1020037006787A patent/KR100766206B1/ko not_active IP Right Cessation
- 2001-11-21 CA CA2429596A patent/CA2429596C/en not_active Expired - Fee Related
- 2001-11-21 WO PCT/US2001/043435 patent/WO2002042371A2/en active Application Filing
- 2001-11-21 IL IL15580701A patent/IL155807A0/xx not_active IP Right Cessation
- 2001-11-21 EP EP01986460A patent/EP1339782B1/en not_active Expired - Lifetime
- 2001-11-21 MX MXPA03004474A patent/MXPA03004474A/es active IP Right Grant
- 2001-11-21 AU AU2002237656A patent/AU2002237656B2/en not_active Ceased
- 2001-11-21 AT AT01986460T patent/ATE508163T1/de not_active IP Right Cessation
- 2001-11-21 JP JP2002545083A patent/JP4267914B2/ja not_active Expired - Fee Related
- 2001-11-21 US US09/990,107 patent/US6825265B2/en not_active Expired - Lifetime
- 2001-11-21 DE DE60144572T patent/DE60144572D1/de not_active Expired - Lifetime
-
2003
- 2003-05-06 ZA ZA200303454A patent/ZA200303454B/en unknown
-
2004
- 2004-09-21 US US10/946,410 patent/US20050058939A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
IL155807A0 (en) | 2003-12-23 |
KR20040062868A (ko) | 2004-07-09 |
BR0115537A (pt) | 2006-05-02 |
US6825265B2 (en) | 2004-11-30 |
ATE508163T1 (de) | 2011-05-15 |
JP4267914B2 (ja) | 2009-05-27 |
UA74021C2 (en) | 2005-10-17 |
KR100766206B1 (ko) | 2007-10-10 |
AU3765602A (en) | 2002-06-03 |
JP2004538338A (ja) | 2004-12-24 |
ZA200303454B (en) | 2005-03-18 |
CA2429596C (en) | 2010-02-09 |
CA2429596A1 (en) | 2002-05-30 |
US20050058939A1 (en) | 2005-03-17 |
WO2002042371A3 (en) | 2003-01-09 |
WO2002042371A2 (en) | 2002-05-30 |
US20020155291A1 (en) | 2002-10-24 |
EP1339782A2 (en) | 2003-09-03 |
EP1339782B1 (en) | 2011-05-04 |
RU2268904C2 (ru) | 2006-01-27 |
MXPA03004474A (es) | 2004-05-17 |
CN1529734A (zh) | 2004-09-15 |
AU2002237656B2 (en) | 2007-01-04 |
DE60144572D1 (de) | 2011-06-16 |
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