CN113950205B - Circuit board processing method, copper-clad plate processing method and circuit board - Google Patents
Circuit board processing method, copper-clad plate processing method and circuit board Download PDFInfo
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- CN113950205B CN113950205B CN202010688419.6A CN202010688419A CN113950205B CN 113950205 B CN113950205 B CN 113950205B CN 202010688419 A CN202010688419 A CN 202010688419A CN 113950205 B CN113950205 B CN 113950205B
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- target copper
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- 238000003672 processing method Methods 0.000 title claims abstract description 23
- 239000000853 adhesive Substances 0.000 claims abstract description 86
- 230000001070 adhesive effect Effects 0.000 claims abstract description 86
- 238000010030 laminating Methods 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 28
- 238000003801 milling Methods 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims description 54
- 238000003475 lamination Methods 0.000 claims description 27
- 238000004519 manufacturing process Methods 0.000 claims description 21
- 238000000059 patterning Methods 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 5
- 238000003701 mechanical milling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The application discloses a processing method of a circuit board, a processing method of a copper-clad plate and the circuit board, wherein the processing method of the circuit board comprises the following steps: forming a cavity groove at a preset position of the target copper-clad plate, and forming a gummosis groove at a position which is a preset distance away from the cavity groove; milling out partial structures of the pre-laminated layers at positions where two semi-cured adhesives arranged on two sides of the target copper-clad plate are opposite to the cavity grooves on the target copper-clad plate; respectively laminating two semi-cured adhesives of the milled part structure on two sides of a target copper-clad plate, and respectively laminating at least two copper-clad plates and other semi-cured adhesives at intervals; laminating the at least two copper-clad plates, the target copper-clad plate and the at least two semi-cured adhesives which are arranged in a laminated manner to obtain the circuit board. By means of the method, the gummosis possibly existing in the laminating process of the circuit board can be conducted away, and therefore the closed vacuum cavity can be effectively processed in the inner layer of the circuit board.
Description
Technical Field
The application relates to the technical field of circuit board processing technology, in particular to a processing method of a circuit board, a processing method of a copper-clad plate and a circuit board.
Background
Nowadays, with the increasing demands in industry for low cost and high quality of PCBs (Printed Circuit Board, printed circuit boards), the choice of PCB materials is often focused on the PCB process cost, as it is the main component affecting the PCB process cost. However, the low cost board is difficult to meet the requirements of high quality and high performance of the PCB, so that innovation in design is also required.
The vacuum cavity structure is manufactured in the inner layer of the PCB, and a layer of vacuum is formed in the inner layer of the circuit board, so that the corresponding loss is guaranteed to be very close to air, and the requirements of high quality and high performance of the PCB are met. However, this feature is very detrimental to the processing of the vacuum chamber due to the very good flowability of the low cost sheet.
Disclosure of Invention
The application provides a processing method of a circuit board, a processing method of a copper-clad plate and the circuit board, which are used for solving the problem that the processing of a vacuum cavity is not facilitated due to good fluidity of corresponding plates when the circuit board in the prior art is manufactured into the cavity.
In order to solve the technical problems, one technical scheme adopted by the application is as follows: the processing method of the circuit board comprises the following steps: providing at least two copper-clad plates, a target copper-clad plate for preparing a cavity and at least two semi-cured adhesives, and preparing a cavity groove at a preset position of the target copper-clad plate; manufacturing a glue flowing groove at a position which is a preset distance away from the cavity groove on the target copper-clad plate; milling out partial structures of the pre-laminated layers arranged on two sides of the target copper-clad plate, wherein two semi-cured adhesives face to the positions of the cavity grooves on the target copper-clad plate; respectively laminating two semi-cured adhesives of the milled partial structure on two sides of the target copper-clad plate, and further respectively laminating at least two copper-clad plates and other semi-cured adhesives at intervals; laminating the at least two copper-clad plates, the target copper-clad plate and the at least two semi-cured adhesives which are arranged in a laminated manner to obtain the circuit board.
The step of manufacturing and forming the gummosis groove at the position, which is a preset distance away from the cavity groove, on the target copper-clad plate comprises the following steps: and manufacturing and forming a glue flowing groove at a position which is a preset distance away from the cavity groove on the target copper-clad plate, and enabling the depth of the glue flowing groove to be equal to or smaller than the thickness of the target copper-clad plate.
The step of manufacturing and forming the gummosis groove at the position, which is a preset distance away from the cavity groove, on the target copper-clad plate comprises the following steps: and manufacturing a glue flowing groove at a position, which is more than 0.5mm away from the cavity groove, on the target copper-clad plate.
The step of milling off part of structures of the two semi-cured adhesives arranged on two sides of the target copper-clad plate and opposite to the position of the cavity groove on the target copper-clad plate comprises the following steps: and milling part of structures of the pre-laminated layers arranged on two sides of the target copper-clad plate, wherein two semi-cured adhesives face to the position of the cavity groove on the target copper-clad plate, and further expanding and milling part of structures of the two semi-cured adhesives so that the width of the partial structures is larger than the width of the cavity groove by 0.1mm.
The method comprises the steps of providing at least two copper-clad plates, a target copper-clad plate for prefabricating a cavity and at least two semi-cured adhesives, and after the step of manufacturing a cavity groove at the preset position of the target copper-clad plate, before the step of manufacturing a glue flowing groove at the position of the target copper-clad plate, which is at the preset distance from the cavity groove, further comprises the following steps: and carrying out patterning treatment on each copper-clad plate and the target copper-clad plate.
Wherein, after the step of respectively laminating two semi-cured adhesives on two sides of the target copper-clad plate and further respectively spacing and laminating at least two copper-clad plates and other semi-cured adhesives, laminating the at least two copper-clad plates, the target copper-clad plates and the at least two semi-cured adhesives which are laminated to obtain the circuit board, the method further comprises the following steps: and heating the at least two copper-clad plates, the target copper-clad plates and the at least two semi-cured adhesives which are arranged in the lamination manner to a preset temperature so as to pre-attach the at least two copper-clad plates, the target copper-clad plates and the at least two semi-cured adhesives which are arranged in the lamination manner.
Wherein, after the step of respectively laminating two semi-cured adhesives on two sides of the target copper-clad plate and further respectively spacing and laminating at least two copper-clad plates and other semi-cured adhesives, laminating the at least two copper-clad plates, the target copper-clad plates and the at least two semi-cured adhesives which are laminated to obtain the circuit board, the method further comprises the following steps: and vacuumizing the cavity groove.
The step of laminating the at least two copper-clad plates, the target copper-clad plates and the at least two semi-cured adhesives which are arranged in a lamination manner to obtain the circuit board comprises the following steps of: laminating the at least two copper-clad plates, the target copper-clad plate and the at least two semi-cured adhesives which are arranged in a laminated manner, and further drilling through holes and/or shielding holes at preset positions which are more than 0.4mm away from the cavity grooves to obtain the circuit board.
In order to solve the technical problem, another technical scheme adopted by the application is as follows: the processing method of the copper-clad plate comprises the following steps: forming a cavity groove at a preset position of the target copper-clad plate; and manufacturing and forming a gummosis groove at a position, which is a preset distance away from the cavity groove, on the target copper-clad plate so as to obtain the copper-clad plate.
In order to solve the technical problem, another technical scheme adopted by the application is as follows: there is provided a circuit board obtained by the method for processing a circuit board according to any one of the above.
The beneficial effects of this application are: in the processing method of the circuit board, after a cavity groove is formed at the preset position of the target copper-clad plate and a glue flowing groove is formed at the position of the target copper-clad plate, which is at the preset distance from the cavity groove, part of structures, which are arranged on two sides of the target copper-clad plate and are opposite to the position of the cavity groove, of the two semi-cured glue are milled, the two semi-cured glue are respectively arranged on two sides of the target copper-clad plate in a lamination mode, and after at least two copper-clad plates and other semi-cured glue are further respectively arranged at intervals in a lamination mode, the at least two copper-clad plates, the target copper-clad plate and the at least two semi-cured glue which are arranged in a lamination mode are laminated, so that glue flowing possibly existing at the position, which is close to the cavity groove, of the circuit board in the lamination process can be guided away through the glue flowing formed by the manufactured glue flowing groove, and therefore the effect of processing of a closed vacuum cavity in the inner layer of the circuit board is ensured.
Drawings
For a clearer description of the technical solutions in the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art, wherein:
FIG. 1 is a schematic flow chart of a first embodiment of a method for processing a circuit board according to the present application;
FIG. 2 is a schematic flow chart of a second embodiment of a method for processing a circuit board according to the present application;
fig. 3 a-3 c are schematic structural views of a first implementation corresponding to the second embodiment described in fig. 2;
fig. 4 a-4 b are schematic structural views of a second implementation corresponding to the second embodiment described in fig. 2;
fig. 5 is a schematic flow chart of an embodiment of a processing method of the copper clad laminate of the present application.
Detailed Description
In order to make the technical problems solved, the technical scheme adopted and the technical effects achieved by the application clearer, the technical scheme of the embodiment of the application will be described in further detail below with reference to the accompanying drawings.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
Referring to fig. 1, fig. 1 is a flow chart of a first embodiment of a method for processing a circuit board according to the present application. The embodiment comprises the following steps:
s11: providing at least two copper-clad plates, a target copper-clad plate for preparing a cavity and at least two semi-cured adhesives, and preparing a cavity groove at a preset position of the target copper-clad plate.
Specifically, in order to ensure that a closed vacuum cavity can be effectively formed in the inner layer of the finally manufactured circuit board, in this embodiment, after at least two copper-clad plates and at least two semi-cured adhesives are obtained, a copper-clad plate subjected to cavity manufacturing in advance is further obtained so as to determine the copper-clad plate as a target, and a cavity groove is formed in a preset position of the target copper-clad plate. The method specifically may be to slot the middle position of the target copper-clad plate by a mechanical milling machine and mill through the target copper-clad plate, that is, the depth of the finally milled cavity slot is equal to the thickness of the target copper-clad plate, and in other embodiments, the depth of the cavity slot may be smaller than the thickness of the target copper-clad plate, which is not limited in this application.
S12: and manufacturing a gumming groove at a position which is a preset distance away from the cavity groove on the target copper-clad plate.
Specifically, after a cavity groove is formed at a preset position of the target copper-clad plate, a glue flowing groove is further formed at a position on the target copper-clad plate, which is a set distance away from the cavity groove formed by the current manufacture, for example, at any reasonable position which is greater than 0.5mm, such as 0.6mm, 0.65mm or 0.7mm, away from the cavity groove. The first glue flowing groove and the second glue flowing groove are symmetrically arranged according to the center of the cavity groove.
S13: and milling out partial structures of the pre-laminated layers, which are arranged on two sides of the target copper-clad plate, wherein two semi-cured adhesives are opposite to the positions of the cavity grooves on the target copper-clad plate.
Specifically, after a gumming groove is manufactured at a position, which is a preset distance away from the cavity groove, on the target copper-clad plate, two semi-cured adhesives which are arranged on two sides of the target copper-clad plate in a pre-lamination mode are selected, and when the semi-cured adhesives are arranged on two sides of the target copper-clad plate in a lamination mode, partial structures, which are opposite to the position, of the cavity groove on the target copper-clad plate, are milled, namely, when the two semi-cured adhesive laminates are arranged on two sides of the target copper-clad plate, the fact that the semi-cured adhesives are not arranged on two sides of the cavity groove of the target copper-clad plate is guaranteed.
S14: and respectively laminating two semi-cured adhesives of the milled part structure on two sides of the target copper-clad plate, and further respectively laminating at least two copper-clad plates and other semi-cured adhesives at intervals.
Further, two of the semi-cured adhesive laminates of the milled partial structure are arranged on two sides of the target copper-clad plate, and two copper-clad plates are further selected to be arranged on the outermost sides of the two semi-cured adhesives and the target copper-clad plate of the laminate arrangement, so that the rest copper-clad plates and other semi-cured adhesives are respectively arranged at intervals in sequence, namely, the two sides of each semi-cured adhesive are ensured to be the copper-clad plate or the target copper-clad plate, and the at least two copper-clad plates, the target copper-clad plate and the outermost sides of the at least two semi-cured adhesives which are arranged in a laminate arrangement are ensured to be the two copper-clad plates.
S15: laminating the at least two copper-clad plates, the target copper-clad plate and the at least two semi-cured adhesives which are arranged in a laminated manner to obtain the circuit board.
After at least two copper-clad plates, a target copper-clad plate and at least two semi-cured adhesives are laminated, the copper-clad plates, the target copper-clad plates and the at least two semi-cured adhesives are further laminated, and then a finished circuit board is obtained.
It can be understood that when laminating at least two copper-clad plates, a target copper-clad plate and at least two semi-cured adhesives which are arranged in a lamination manner, and the semi-cured adhesives on two sides of the target copper-clad plate are heated and converted into gummosis, gummosis grooves are formed on the target copper-clad plate, and semi-cured adhesives are not present on two sides of the cavity groove position, so that gummosis generated at this time can be guided into the gummosis grooves, and a closed vacuum cavity can be effectively processed in the inner layer of the circuit board.
In the processing method of the circuit board, after a cavity groove is formed at the preset position of the target copper-clad plate and a glue flowing groove is formed at the position of the target copper-clad plate, which is at the preset distance from the cavity groove, part of structures, which are arranged on two sides of the target copper-clad plate and are opposite to the position of the cavity groove, of the two semi-cured glue are milled, the two semi-cured glue are respectively arranged on two sides of the target copper-clad plate in a lamination mode, and after at least two copper-clad plates and other semi-cured glue are further respectively arranged at intervals in a lamination mode, the at least two copper-clad plates, the target copper-clad plate and the at least two semi-cured glue which are arranged in a lamination mode are laminated, so that glue flowing possibly existing at the position, which is close to the cavity groove, of the circuit board in the lamination process can be guided away through the glue flowing formed by the manufactured glue flowing groove, and therefore the effect of processing of a closed vacuum cavity in the inner layer of the circuit board is ensured.
Referring to fig. 2, fig. 3 a-3 c, and fig. 4 a-3 b, fig. 2 is a schematic flow chart of a second example of a processing method of a circuit board according to the present application, fig. 3 a-3 c are schematic structural diagrams of a first embodiment corresponding to the second example shown in fig. 2, and fig. 4 a-3 b are schematic structural diagrams of a second embodiment corresponding to the second example shown in fig. 2. The embodiment comprises the following steps:
s21: providing at least two copper-clad plates, a target copper-clad plate for preparing a cavity and at least two semi-cured adhesives, and preparing a cavity groove at a preset position of the target copper-clad plate.
Specifically, as shown in fig. 3a (wherein fig. 3a is a cross-sectional view of an embodiment of a target copper-clad laminate), in order to ensure that a closed vacuum cavity can be effectively formed in an inner layer of a finally manufactured circuit board, in this embodiment, after at least two copper-clad laminates and at least two semi-cured adhesives are obtained, a copper-clad laminate subjected to cavity manufacturing is further obtained to determine the target copper-clad laminate 10, and a cavity groove 110 is formed at a preset position of the target copper-clad laminate 10. The method specifically includes slotting at the middle position of the target copper-clad plate 10 by a mechanical milling machine, and milling through the target copper-clad plate 10, that is, ensuring that the depth of the finally milled cavity slot 110 is equal to the thickness of the target copper-clad plate 10.
S22: and carrying out patterning treatment on each copper-clad plate and the target copper-clad plate.
Specifically, after a cavity groove 110 is formed at a preset position of the target copper-clad plate 10, patterning is further performed on each copper-clad plate and the target copper-clad plate 10 to etch a preset logic circuit pattern.
S23: and manufacturing a glue flowing groove at a position, which is more than 0.5mm away from the cavity groove, on the target copper-clad plate.
Further, a glue flowing groove 120 is formed on the target copper-clad plate 10 at a position with a preset distance from the cavity groove 110 formed in the present process, for example, at any reasonable position greater than 0.5mm, such as 0.6mm, 0.65mm or 0.7mm, from the position where the cavity groove 110 is located. The depth of the glue flow groove 120 is equal to the thickness of the target copper-clad plate 10, that is, the target copper-clad plate 10 is milled through when the glue flow groove 120 is formed.
In another embodiment, as shown in fig. 4a (where fig. 4a is a cross-sectional view of another embodiment of the target copper-clad laminate), after patterning each copper-clad laminate and the target copper-clad laminate 10, a glue-flowing groove 120 with a depth smaller than the thickness of the target copper-clad laminate 10 may be formed at a position on the target copper-clad laminate 10 at a preset distance from the cavity groove 110, that is, when the glue-flowing groove 120 is formed, the target copper-clad laminate 10 is not milled through.
S24: and milling part of structures of the pre-laminated layers arranged on two sides of the target copper-clad plate, wherein two semi-cured adhesives face to the position of the cavity groove on the target copper-clad plate, and further expanding and milling part of structures of the two semi-cured adhesives so that the width of the partial structures is larger than the width of the cavity groove by 0.1mm.
Specifically, as shown in fig. 3b and fig. 4b (wherein fig. 3b is a cross-sectional view of an embodiment of a laminated circuit board, and fig. 4b is a cross-sectional view of another embodiment of a laminated circuit board), after the glue flowing groove 120 is formed on the target copper-clad plate 10 at a position spaced apart from the cavity groove 110 by a preset distance, two prepreg glue 20 of which two preset layers are arranged on two sides of the target copper-clad plate 10 are selected, and when the layers are arranged on two sides of the target copper-clad plate 10, the two prepreg glue 20 are milled, and when the layers are arranged on two sides of the target copper-clad plate 10, the two prepreg glue 20 are opposite to the partial structures on the position of the cavity groove 110 on the target copper-clad plate 10, and the partial structures of the two prepreg glue 20 are further enlarged and milled so that the width of the two prepreg glue is greater than 0.1mm of the width of the cavity groove 110. The milled partial structures of the two semi-cured adhesives 20 may be arranged in a central symmetry manner according to the cavity groove 110 of the target copper-clad plate 10, so as to effectively ensure that when the two semi-cured adhesives 20 are laminated on two sides of the target copper-clad plate 10, the semi-cured adhesives 20 are not positioned on two sides of the cavity groove 110 on the target copper-clad plate 10, and a margin is left, so that the adhesive flow possibly generated during the subsequent lamination of the circuit board 1 is prevented from entering the cavity groove 110.
S25: and respectively laminating two semi-cured adhesives of the milled part structure on two sides of the target copper-clad plate, and further respectively laminating at least two copper-clad plates and other semi-cured adhesives at intervals.
Further, two of the semi-cured adhesives 20 of the milled partial structure are laminated on two sides of the target copper-clad plate 10, two copper-clad plates 11 are further selected to be arranged on the outermost sides of the two semi-cured adhesives 20 and the target copper-clad plate 10 which are laminated, and the rest copper-clad plates 11 and other semi-cured adhesives 20 are sequentially arranged at intervals respectively, namely, the two sides of each semi-cured adhesive 20 are ensured to be the copper-clad plate 11 or the target copper-clad plate 10, and the at least two copper-clad plates 11, the target copper-clad plate 10 and the outermost sides of the at least two semi-cured adhesives 20 which are laminated are ensured to be the two copper-clad plates 11.
S26: and vacuumizing the cavity groove.
Specifically, the vacuum pumping treatment is performed on the cavity grooves 110 in the at least two copper-clad plates 11, the target copper-clad plate 10 and the at least two semi-cured adhesives 20 which are arranged in a laminated manner, so as to ensure that the finally formed cavity grooves 110 are vacuum cavities.
S27: and heating the at least two copper-clad plates, the target copper-clad plates and the at least two semi-cured adhesives which are arranged in the lamination manner to a preset temperature so as to pre-attach the at least two copper-clad plates, the target copper-clad plates and the at least two semi-cured adhesives which are arranged in the lamination manner.
Specifically, the at least two copper-clad plates 11, the target copper-clad plates 10 and the at least two semi-cured adhesives 20 which are arranged in a stacked manner are further heated to a preset temperature, for example, the at least two copper-clad plates 11, the target copper-clad plates 10 and the at least two semi-cured adhesives 20 which are arranged in a stacked manner are heated to any reasonable temperature in the range of 100-120 ℃, so that the at least two copper-clad plates 11, the target copper-clad plates 10 and the at least two semi-cured adhesives 20 which are arranged in a stacked manner can be pre-bonded in an environment with the preset temperature, and therefore a certain viscosity and bonding property are achieved between each two copper-clad plates 11, 11 and 10 or each two copper-clad plate 10 which are arranged in a stacked manner, so that when the at least two copper-clad plates 11, the target copper-clad plates 10 and the at least two semi-cured adhesives 20 are laminated, relative displacement between each two copper-clad plates 11 and 10 is not easy to occur, and air is not easy to enter, and good lamination effect is ensured.
S28: laminating the at least two copper-clad plates, the target copper-clad plate and the at least two semi-cured adhesives which are arranged in a laminated manner, and further drilling through holes and/or shielding holes at preset positions which are more than 0.4mm away from the cavity grooves to obtain the circuit board.
Specifically, as shown in fig. 3c, after at least two copper-clad plates 11, a target copper-clad plate 10 and at least two semi-cured adhesives 20 are laminated, the lamination is further performed, and through holes and/or shielding holes are further drilled at preset positions, which are more than 0.4mm away from the cavity grooves 110, so as to prevent the vacuum sealing of the cavity grooves 110 from being affected when the through holes and/or the shielding holes are drilled, and further obtain a finished circuit board 1, and the inner layer of the circuit board 1 comprises the cavity grooves 110 in a vacuum state.
It can be understood that when laminating at least two copper-clad plates, the target copper-clad plate 10 and at least two semi-cured adhesives which are arranged in a lamination manner, and the semi-cured adhesives 20 on two sides of the target copper-clad plate 10 are heated and converted into gummosis, the gummosis groove 120 is formed on the target copper-clad plate 10, and the semi-cured adhesives 20 are not present on two sides of the cavity groove 110, so that gummosis generated in the lamination process can be led into the gummosis groove 120, and a closed vacuum cavity can be effectively processed in the inner layer of the circuit board.
Based on the general inventive concept, the present application further provides a processing method of the copper-clad plate, please refer to fig. 5, and fig. 5 is a schematic flow chart of an embodiment of the processing method of the copper-clad plate of the present application. The embodiment comprises the following steps:
s51: and manufacturing a cavity groove at a preset position of the target copper-clad plate.
Specifically, as shown in fig. 3a, in this embodiment, a copper-clad plate is first obtained to determine a target copper-clad plate 10, and a cavity groove 110 is formed at a preset position of the target copper-clad plate 10. The method specifically may be to slot the middle position of the target copper-clad plate 10 by a mechanical milling machine, and mill through the target copper-clad plate 10, that is, make the depth of the finally milled cavity slot 110 equal to the thickness of the target copper-clad plate 10, and in other embodiments, the depth of the cavity slot 110 may also be smaller than the thickness of the target copper-clad plate 10, which is not limited in this application.
S52: and manufacturing and forming a gummosis groove at a position, which is a preset distance away from the cavity groove, on the target copper-clad plate so as to obtain the copper-clad plate.
Further, a glue flowing groove 120 is formed at a position on the target copper-clad plate 10, which is a preset distance away from the cavity groove 110 formed by manufacturing, for example, at any reasonable position larger than 0.5mm, such as 0.6mm, 0.65mm or 0.7mm, from the position where the cavity groove 110 is located, so as to obtain the finished copper-clad plate. The depth of the glue flow groove 120 is equal to the thickness of the target copper-clad plate 10, that is, the target copper-clad plate 10 is milled through when the glue flow groove 120 is formed.
In another embodiment, as shown in fig. 4a, a glue flow groove 120 with a depth smaller than the thickness of the target copper-clad plate 10 may be formed on the target copper-clad plate 10 at a position spaced apart from the cavity groove 110 by a preset distance, that is, the target copper-clad laminate 10 is not milled through when the glue flowing groove 120 is formed, so as to obtain the finished copper-clad laminate.
Based on the general inventive concept, the present application also provides a circuit board, wherein the circuit board is obtained by the processing method of the circuit board as described in any one of the above.
In the processing method of the circuit board, after a cavity groove is formed at the preset position of the target copper-clad plate and a glue flowing groove is formed at the position of the target copper-clad plate, which is at the preset distance from the cavity groove, part of structures, which are arranged on two sides of the target copper-clad plate and are opposite to the position of the cavity groove, of the two semi-cured glue are milled, the two semi-cured glue are respectively arranged on two sides of the target copper-clad plate in a lamination mode, and after at least two copper-clad plates and other semi-cured glue are further respectively arranged at intervals in a lamination mode, the at least two copper-clad plates, the target copper-clad plate and the at least two semi-cured glue which are arranged in a lamination mode are laminated, so that glue flowing possibly existing at the position, which is close to the cavity groove, of the circuit board in the lamination process can be guided away through the glue flowing formed by the manufactured glue flowing groove, and therefore the effect of processing of a closed vacuum cavity in the inner layer of the circuit board is ensured.
The foregoing description is only exemplary embodiments of the present application and is not intended to limit the scope of the present application, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present application, or direct or indirect application in other related technical fields are included in the scope of the present application.
Claims (9)
1. The processing method of the circuit board is characterized by comprising the following steps of:
providing at least two copper-clad plates, a target copper-clad plate for preparing a cavity and at least two semi-cured adhesives, and preparing a cavity groove at a preset position of the target copper-clad plate;
forming a glue flowing groove at a position which is a preset distance away from the cavity groove on the target copper-clad plate; the depth of the gumming groove is equal to the thickness of the target copper-clad plate;
milling out partial structures of the preset lamination layers arranged on two sides of the target copper-clad plate, wherein two of the semi-cured adhesives are opposite to the positions of the cavity grooves on the target copper-clad plate;
respectively laminating two of the semi-cured adhesives of the milled partial structure on two sides of the target copper-clad plate, and further respectively laminating at least two copper-clad plates and other semi-cured adhesives at intervals;
vacuumizing the cavity groove;
laminating at least two copper-clad plates, the target copper-clad plates and at least two semi-cured adhesives which are arranged in a lamination manner to obtain the circuit board.
2. The method according to claim 1, wherein the step of forming a glue flow groove at a position on the target copper-clad plate at a predetermined distance from the cavity groove comprises:
and manufacturing a glue flowing groove at a position which is a preset distance away from the cavity groove on the target copper-clad plate, and enabling the depth of the glue flowing groove to be equal to or smaller than the thickness of the target copper-clad plate.
3. The method according to claim 1, wherein the step of forming a glue flow groove at a position on the target copper-clad plate at a predetermined distance from the cavity groove comprises:
and manufacturing a glue flowing groove at a position, which is more than 0.5mm away from the cavity groove, on the target copper-clad plate.
4. The method according to claim 1, wherein the step of milling off a part of the structure of the two semi-cured adhesives on the two sides of the target copper-clad plate, the part being opposite to the position of the cavity groove on the target copper-clad plate, comprises:
and milling part of structures of the two semi-cured adhesives, which are arranged on two sides of the target copper-clad plate and opposite to the position of the cavity groove, of the target copper-clad plate, and further enlarging and milling part of structures of the two semi-cured adhesives so that the width of the partial structures is larger than the width of the cavity groove by 0.1mm.
5. The method according to claim 1, wherein after the step of providing at least two copper-clad plates, a target copper-clad plate for pre-manufacturing a cavity, and at least two semi-cured adhesives, and manufacturing a cavity groove at a preset position of the target copper-clad plate, before the step of manufacturing a glue-flowing groove at a position of the target copper-clad plate, which is a preset distance from the cavity groove, the method further comprises:
and carrying out patterning treatment on each copper-clad plate and each target copper-clad plate.
6. The method according to claim 1, wherein after the step of laminating two of the semi-cured adhesives of the milled part structure on two sides of the target copper-clad plate, and further laminating at least two of the copper-clad plates and other semi-cured adhesives at intervals, the step of laminating the at least two of the copper-clad plates, the target copper-clad plates and the at least two of the semi-cured adhesives to obtain the circuit board, further comprises:
and heating the at least two copper-clad plates, the target copper-clad plates and the at least two semi-curing adhesives which are arranged in a laminated manner to a preset temperature so as to pre-attach the at least two copper-clad plates, the target copper-clad plates and the at least two semi-curing adhesives which are arranged in the laminated manner.
7. The method according to claim 1, wherein the step of laminating the at least two copper-clad plates, the target copper-clad plate, and the at least two semi-cured adhesives, which are stacked, to obtain the circuit board comprises:
laminating at least two copper-clad plates, the target copper-clad plates and at least two semi-curing adhesives which are arranged in a laminated manner, and further drilling through holes and/or shielding holes at preset positions which are more than 0.4mm away from the cavity grooves so as to obtain the circuit board.
8. The processing method of the copper-clad plate is characterized by comprising the following steps of:
forming a cavity groove at a preset position of the target copper-clad plate;
forming a glue flowing groove on the target copper-clad plate at a position which is a preset distance away from the cavity groove so as to obtain the copper-clad plate; the depth of the gumming groove is equal to the thickness of the target copper-clad plate.
9. A circuit board, characterized in that it is obtained by the method for processing a circuit board according to any one of claims 1-7.
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| CN202010688419.6A CN113950205B (en) | 2020-07-16 | 2020-07-16 | Circuit board processing method, copper-clad plate processing method and circuit board |
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| CN202010688419.6A CN113950205B (en) | 2020-07-16 | 2020-07-16 | Circuit board processing method, copper-clad plate processing method and circuit board |
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