CN208509363U

CN208509363U - A kind of pcb board of mobile phone

Info

Publication number: CN208509363U
Application number: CN201820589581.0U
Authority: CN
Inventors: 陈生虎; 杨波
Original assignee: Kunshan Hua Hang Electronics Co Ltd
Current assignee: Kunshan Hua Hang Electronics Co Ltd
Priority date: 2018-04-24
Filing date: 2018-04-24
Publication date: 2019-02-15
Anticipated expiration: 2028-04-24

Abstract

The utility model discloses a kind of pcb boards of mobile phone, including upper pressurized layer, upper plate layer, middle layer, lower plate layer and lower pressurized layer, five layers are fixed by sequence from top to bottom, several half slots are equipped among the lower plate layer, since middle layer is made of the material without flow prepreg, its poor fluidity, when pressing by the way of the direct contact steel plate pressing of pcb board, it is easy to flow filler deficiency and lead to plate face white spot defect, may making region due to compacting, there are high and low fall, the pressure of press is transmitted to plate face, the copper-clad plate of glass outer fibrous epoxy resin is at hanging place without support, necessarily lead to deformation.By several half slots being equipped among the copper-clad plate of additional glass fibrous epoxy resin, it is avoided that pcb board excessive glue, reducing region, there are high and low fall, reduce pcb board failure rate, improve its service life.

Description

A kind of pcb board of mobile phone

Technical field

The utility model relates to the technical fields of pcb board, and in particular to a kind of pcb board of mobile phone.

Background technique

PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed wiring board, is important Electronic component, be the supporter of electronic component, be electronic component electrical connection carrier.Since it is using electronic seal The production of brush art, therefore referred to as " print " circuit board.

At this stage, electronic system forward direction high speed and densification are developed by leaps and bounds.In the design process of electronic system, it is The volume of system is smaller and smaller, and IC pin (integrated circuit, integrated circuit) is more and more, therefore on pcb board Element and wiring are more and more intensive；At the same time, to enhance product performance, assembling product density, reduce small product size and weight Have become trend, the mode that pcb board generallys use prepreg groove milling windowing produces, this technique in windowing area there are height fall, After pressing, the easy generation recess of the plate face in the area that opens a window, general recess may be up to 110um or more.Pcb board face recess leads to resin The polishing of recess resin, which is not fallen, after consent, route production pad pasting is not in short supply falls into, these factors have resulted in the failure rate of pcb board Height influences its service life.

Utility model content

The purpose of this utility model is to provide a kind of pcb boards of mobile phone, cover copper by additional glass fibrous epoxy resin Several half slots being equipped among plate, the technical issues of solving the service life of pcb board and/or defect, and provide at least below The advantages of illustrating.

To achieve the above object, the utility model provides the following technical solutions:

A kind of pcb board of mobile phone, including upper pressurized layer, upper plate layer, middle layer, lower plate layer and lower pressurized layer, five layers It is fixed by sequence from top to bottom, several half slots is equipped among the lower plate layer, be avoided that pcb board excessive glue, reduced region and deposit In high and low fall, failure rate is reduced, is improved service life.

Further, half slot is rectangular channel, and the length and width of the rectangular channel are respectively 1 millimeter, 0.3 millimeter, 0.5 milli deeply Rice.

Further, the upper plate layer is made of the material of glass-epoxy copper-clad plate, and the lower plate layer is adopted It is made of the material of glass-epoxy copper-clad plate, substrate is made with glass fabric, is soaked with epoxy resin as main part The bonding sheet of semi-cured state is made in binder, heated drying, and single or double is covered with copper foil, made of heated pressurization.

Further, the middle layer is made of the material without flow prepreg, suitably to be postponed in bonding processes Upper high pressure, and mesohigh or high-pressure suitably reduce, in order to avoid gummosis is too fast, to occur, starved is aobvious to be knitted.

Further, the lower pressurized layer is made of the material that PE covers type film, and the barrier property of pcb board can be improved.

Further, the material of the upper pressurized layer can be selected from following one of which: steel plate, PE cover type film, Paper baseplate, adopt The safety and reliability of pcb board can be made to improve with this material.

Further, the upper plate layer and the lower pressurized layer are sandwiched using release film, avoid haftplatte.

Further, the material of the release film is selected from following one of which: dry film, band glue release film, compound release Film.

Compared with prior art, the utility model has the beneficial effects that:

The middle layer of the pcb board of the mobile phone is made of the material without flow prepreg, poor fluidity, when pressing such as Fruit is by the way of the direct contact steel plate pressing of PCB, it is easy to can flow filler deficiency and lead to plate face white spot defect, due to pressure Reason processed may make region there are high and low fall, and the pressure of press is transmitted to plate face, glass outer fibrous epoxy resin copper-clad plate At hanging place without support, necessarily lead to deformation.By be equipped among additional glass fibrous epoxy resin copper-clad plate several half Slot is avoided that pcb board excessive glue, and reducing region, there are high and low fall, reduces pcb board failure rate, improves its service life.

Detailed description of the invention

Fig. 1 is the structural schematic diagram of the pcb board of the mobile phone of the utility model.

1, upper pressurized layer；2, upper plate layer；3, middle layer；4, lower plate layer；41, half slot；5, lower pressurized layer；6, release film.

Specific embodiment

In the following, being described further in conjunction with attached drawing and specific embodiment to the utility model, it should be noted that Under the premise of not colliding, it can be formed in any combination between various embodiments described below or between each technical characteristic new Embodiment.

The pcb board that the utility model provides a kind of mobile phone as shown in Figure 1 includes upper pressurized layer 1, upper plate layer 2, middle layer 3, lower plate layer 4 and lower pressurized layer 5, five layers are fixed by sequence from top to bottom, several half slots 41 are equipped among lower plate layer 4, partly Slot 41 is rectangular channel, and the length and width of rectangular channel are respectively 1 millimeter, 0.3 millimeter, 0.5 millimeter and are avoided that pcb board excessive glue deeply, reduces area There are high and low fall in domain, reduce failure rate, improve service life.

As preferred embodiment, the material of upper pressurized layer 1 is selected from PE and covers type film, and PE need to use release when covering the use of type film Film 6 sandwiches, the material selection dry film of release film 6, in order to avoid haftplatte；Upper plate layer 2 uses the material of glass-epoxy copper-clad plate Matter is made, and lower plate layer 4 is made of the material of glass-epoxy copper-clad plate, can be covered with copper foil with single or double, adopt The safety and reliability of pcb board can be made to improve with this material；Middle layer 3 is made of the material without flow prepreg, High pressure is suitably postponed in bonding processes, starved is aobvious to knit in order to avoid gummosis is too fast to occur；Lower pressurized layer 5 covers type film using PE Material is made, and the barrier property of pcb board can be improved.

Since middle layer 3 is made of the material without flow prepreg, poor fluidity, if using PCB when pressing The mode of direct contact steel plate pressing, it is easy to filler deficiency can be flowed and lead to plate face white spot defect, it can due to compacting Region can be made there are high and low fall, the pressure of press is transmitted to plate face, and the copper-clad plate of glass outer fibrous epoxy resin is vacantly being located Without support, necessarily lead to deformation.By several half slots 41 being equipped among the copper-clad plate of additional glass fibrous epoxy resin, can keep away Exempt from pcb board excessive glue, reducing region, there are high and low fall, reduce pcb board failure rate, improve pcb board service life.

Above embodiment is only preferred embodiments of the present invention, cannot be protected with this to limit the utility model Range, the variation of any unsubstantiality that those skilled in the art is done on the basis of the utility model and replacement belong to In the utility model range claimed.

Claims

1. a kind of pcb board of mobile phone, it is characterised in that: described including upper pressurized layer, upper plate layer, middle layer, lower plate layer and lower pressurized layer Five layers fixed by sequence from top to bottom, several half slots are equipped among the lower plate layer, half slot is rectangular channel, institute The length and width for stating rectangular channel are respectively 1 millimeter, 0.3 millimeter, 0.5 millimeter deeply.

2. the pcb board of mobile phone as described in claim 1, it is characterised in that: the upper plate layer uses glass-epoxy The material of copper-clad plate is made, and the lower plate layer is made of the material of glass-epoxy copper-clad plate, and the middle layer is adopted It is made of the material of no flow prepreg, the lower pressurized layer is made of the material that PE covers type film.

3. the pcb board of mobile phone as described in claim 1, it is characterised in that: the material of the upper pressurized layer is selected from following wherein one Kind: steel plate, PE cover type film, Paper baseplate.

4. the pcb board of mobile phone as described in claim 1, it is characterised in that: the upper plate layer is sandwiched using release film.

5. the pcb board of mobile phone as claimed in claim 3, it is characterised in that: the upper plate layer is sandwiched using release film.

6. the pcb board of mobile phone as described in claim 1, it is characterised in that: the lower pressurized layer is sandwiched using release film.

7. the pcb board of mobile phone as claimed in claim 2, it is characterised in that: the lower pressurized layer is sandwiched using release film.

8. as the described in any item mobile phones of claim 4 to 7 pcb board, it is characterised in that: the material of the release film be selected from Lower one of which: dry film, band glue release film, compound release film.