CN113097155A - Chip heat conduction module and preparation method thereof - Google Patents
Chip heat conduction module and preparation method thereof Download PDFInfo
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- CN113097155A CN113097155A CN202110330398.5A CN202110330398A CN113097155A CN 113097155 A CN113097155 A CN 113097155A CN 202110330398 A CN202110330398 A CN 202110330398A CN 113097155 A CN113097155 A CN 113097155A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 41
- 229910052802 copper Inorganic materials 0.000 claims abstract description 41
- 239000010949 copper Substances 0.000 claims abstract description 41
- 239000000919 ceramic Substances 0.000 claims description 33
- 230000017525 heat dissipation Effects 0.000 claims description 21
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 238000011084 recovery Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000004519 grease Substances 0.000 abstract description 21
- 229920001296 polysiloxane Polymers 0.000 abstract description 19
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a chip heat conduction module and a preparation method thereof, belonging to the technical field of new energy automobiles. According to the chip heat conduction module, a copper bottom plate is omitted, the cost is reduced, meanwhile, thermal resistance generated by the copper bottom plate is avoided, heat conduction silicone grease is not used, thermal resistance generated by the heat conduction silicone grease is eliminated, production processes related to the heat conduction silicone grease can be cancelled, the service life and the reliability of a system are greatly improved, a water channel does not need to be arranged on a shell of a motor controller, and the production cost and the difficulty of the shell of the motor controller are reduced.
Description
Technical Field
The invention relates to the technical field of new energy automobiles, in particular to a chip heat conduction module and a preparation method thereof.
Background
One of the cores of the new energy automobile is a power driving system thereof. The power driving system converts the battery voltage from direct current to three-phase alternating current through insulated Gate Bipolar transistors (igbts) to drive the motor. In this power drive system, 6 units of IGBTs are required. In the IGBT module, 2 or more IGBT units are integrated in one package. The performance of an IGBT module is generally determined by the chip (Fast Recovery Diode) inside and the external package structure. The packaging structure of the IGBT module requires lower thermal resistance and higher reliability.
In practical applications, the IGBT module is assembled in a motor controller. The operating current of the IGBT module is very high, which causes a high temperature rise. In order to control the temperature of the IGBT module within a safe range, an additional heat dissipation process is usually required for the IGBT module. Conventionally, a heat dissipation water channel is formed on a shell of a motor controller, and then an IGBT module is tightly attached to the heat dissipation water channel of the shell.
This method has several drawbacks:
(1) and a heat dissipation water channel needs to be processed on the shell, so that the processing technology is complex.
(2) And heat-conducting silicone grease is required to be coated between the IGBT module and the shell. When the copper bottom plate of the IGBT module is in contact with the shell for heat dissipation, air exists between the copper bottom plate and the shell because two surfaces are not completely flat. The thermal conductivity of air is very low, that is, the presence of air increases the thermal resistance between the IGBT module and the housing. In order to reduce the thermal resistance, the thermal grease needs to be coated on the two parts, and the gap is filled with the thermal grease. But the thermal conductivity of the thermally conductive silicone grease is also small. Even if the heat-conducting silicone grease is coated, the thermal resistance between the IGBT module and the case is still relatively large. Moreover, the coating of the heat-conducting silicone grease has higher requirements on the production process, and the coating cannot be too thick or too thin, so that the production difficulty is increased. In addition, the heat-conducting silicone grease has a limited service life, and becomes dry after a long time, and in addition, due to the extrusion phenomenon caused by expansion with heat and contraction with cold, the heat-conducting performance of the heat-conducting silicone grease is deteriorated after a long time, the heat resistance is increased rapidly, and the temperature of the IGBT module is increased during working, so that the IGBT module is possibly invalid finally. At present, the service life of a new energy automobile is required to be more than 10 years, which provides great challenges for the packaging structure of the IGBT module.
Disclosure of Invention
1. Technical problem to be solved
The invention aims to provide a chip heat conduction module and a preparation method thereof, the chip heat conduction module provided by the invention omits a copper base plate, reduces the cost, does not have thermal resistance generated by the copper base plate, does not use heat conduction silicone grease, does not have thermal resistance generated by the heat conduction silicone grease, can cancel the production flow related to the heat conduction silicone grease, greatly prolongs the service life and the reliability of a system, does not need to make a water channel on a shell of a motor controller, and reduces the production cost and the difficulty of the shell of the motor controller.
2. Technical scheme
In order to solve the problems, the invention adopts the following technical scheme:
the utility model provides a chip heat conduction module, includes chip module and two-sided copper-clad ceramic plate, be provided with first mounting between chip module and the two-sided copper-clad ceramic plate, the bottom of two-sided copper-clad ceramic plate is provided with the second mounting, the bottom of second mounting is provided with heat abstractor.
As a further scheme of the invention: the heat dissipation device also comprises a chip protection shell, wherein the chip protection shell is arranged at the top of the heat dissipation device
As a further scheme of the invention: the double-sided copper-clad ceramic plate comprises a connecting copper layer, a ceramic layer and a copper-clad layer, wherein the connecting copper layer is arranged at the top of the ceramic layer, and the copper-clad layer is arranged at the bottom of the ceramic layer.
As a further scheme of the invention: and a printed circuit is arranged in the connecting copper layer, and a bonding wire is connected between the connecting copper layer and the chip module.
As a further scheme of the invention: the chip module is one of an insulated gate bipolar transistor chip and a fast recovery diode chip.
As a further scheme of the invention: the heat dissipation device comprises an aluminum heat radiator with a water channel and a heat dissipation device copper layer, wherein the heat dissipation device copper layer is arranged at the top of the heat radiator.
As a further scheme of the invention: the thickness of the copper layer of the heat dissipation device is less than 1 mm.
As a further scheme of the invention: the first fixing piece and the second fixing piece are both soldering tin or silver paste.
A preparation method of a chip heat conduction module comprises the following steps:
s1, welding the chip module on one surface of the printed circuit of the double-sided copper-clad ceramic plate;
s2, welding the double-sided copper-clad ceramic plate on a copper layer of a heat dissipation device of the heat dissipation device;
s3, routing the chip module and the printed circuit connected with the copper layer;
and S4, performing shell packaging on the chip heat conduction module.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) the scheme does not use a copper bottom plate, saves the cost of the copper bottom plate, and simultaneously reduces the thermal resistance generated by the copper bottom plate.
(2) The scheme does not use the heat-conducting silicone grease, the thermal resistance generated by the heat-conducting silicone grease is not available, and the production flow related to the heat-conducting silicone grease can be cancelled, so that the service life and the reliability of the system are greatly improved.
(3) This scheme need not do the water course on motor controller's casing, has reduced motor controller casing's manufacturing cost and the degree of difficulty.
Drawings
Fig. 1 is a schematic structural diagram of a chip heat-conducting module according to an embodiment of the invention;
fig. 2 is a top view of a heat dissipation device of a chip thermal module according to an embodiment of the invention;
FIG. 3 illustrates a schematic structural diagram of a motor controller according to an embodiment of the present invention;
FIG. 4 illustrates a schematic structural diagram of a motor controller according to another embodiment of the present invention;
FIG. 5 is a flow chart illustrating a method of fabricating a chip thermal module according to an embodiment of the invention;
fig. 6 is a schematic diagram illustrating a comparison between a thermal resistance d of a chip heat conduction module in the prior art and a thermal resistance e of a chip heat conduction module provided by the present invention.
In the figure: 1. a chip module; 2. a bonding wire; 3. a double-sided copper-clad ceramic plate; 31. connecting the copper layer; 32. a ceramic layer; 33. coating a copper layer; 4. a heat sink; 41. a heat sink copper layer; 42. an aluminum heat sink; 5. a first fixing member; 6. a second fixing member; 7. and a chip protection shell.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other; the specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
fig. 1 is a schematic structural diagram of a chip heat conduction module according to an embodiment of the present invention, fig. 2 is a plan view of a heat dissipation apparatus of a chip heat conduction module according to an embodiment of the present invention, and referring to fig. 1-2, a chip heat conduction module includes a chip module 1 and a double-sided copper-clad ceramic plate 3, a first fixing member 5 is disposed between the chip module 1 and the double-sided copper-clad ceramic plate 3, a second fixing member 6 is disposed at a bottom of the double-sided copper-clad ceramic plate 3, and a heat dissipation apparatus 4 is disposed at a bottom of the second fixing member 6.
The double-sided copper-clad ceramic plate 3 comprises a connecting copper layer 31, a ceramic layer 32 and a copper-clad layer 33, wherein the connecting copper layer 31 is arranged at the top of the ceramic layer 32, the copper-clad layer 33 is arranged at the bottom of the ceramic layer 32, the ceramic layer 32 is made of aluminum oxide and aluminum nitride, the common materials of the ceramic layer 32 are used for realizing electrical insulation, and the copper-clad layer 33 covers the bottom of the ceramic layer 33.
A printed circuit is arranged in the connecting copper layer 31, and a bonding wire 2 is connected between the connecting copper layer 31 and the chip module 1 for electrically connecting the wafer and other devices.
The chip module 1 is an Insulated Gate Bipolar Transistor (IGBT) chip and integrates an electronic chip of a power device.
The heat sink 4 includes a heat sink 42 with a water channel and a heat sink copper layer 41, and the heat sink copper layer 41 is disposed on top of the heat sink 42.
The thickness of the heat sink copper layer 41 is less than 1mm so that the double-sided copper-clad ceramic plate 3 can be directly soldered to the heat sink 42.
The first fixing piece 5 and the second fixing piece 6 are both soldering tin or silver paste, and the first fixing piece 5 and the second fixing piece 6 can also use the silver paste besides the soldering tin and are connected through a silver firing process.
Fig. 5 shows an outflow diagram of a method for manufacturing a chip thermal conduction module according to an embodiment of the present invention, the method for manufacturing a chip thermal conduction module including the steps of:
firstly, a chip module 1 is arranged on one side of a printed circuit of a double-sided copper-clad ceramic plate 3.
And step two, welding the double-sided copper-clad ceramic plate 3 on the copper layer 41 of the heat dissipation device 4.
And step three, routing the chip module 1 and the printed circuit connected with the copper layer 31.
And step four, carrying out shell packaging on the chip heat conduction module.
Example 2:
referring to fig. 1-2, the chip thermal module and the manufacturing method thereof provided in this embodiment are substantially the same as those of embodiment 1, and the main differences are as follows: the chip module 1 is a Fast Recovery Diode (FRD) chip.
Example 3:
fig. 3 shows a schematic structural diagram of a motor controller according to an embodiment of the present invention. As shown in fig. 3, the motor controller includes a motor controller housing b and a chip heat conduction module a, the chip heat conduction module a is disposed in the motor controller housing b and contacts with an inner surface of the motor controller housing b, and the chip heat conduction module a is fixed on the inner surface of the motor controller housing b by a fastener such as a screw.
Fig. 4 shows a schematic structural diagram of a motor controller according to another embodiment of the present invention. As shown in fig. 4, the motor controller includes a motor controller case c and a chip heat conduction module a. Compared with the motor controller shown in fig. 3, the motor controller casing c in fig. 4 has an opening, and is not closed, and the chip heat conduction module a is fixed above the motor controller casing c, and the opening is sealed by a sealing ring.
The chip heat conducting module a provided by the invention is directly provided with a heat dissipation device 4. When the motor controller shell b is placed in the motor controller shell b, a heat dissipation water channel is not needed on the motor controller shell b. In the concrete implementation, the difficulty of making a heat radiation water channel on the motor controller shell b is far greater than that of directly placing a heat radiation device in the chip heat conduction module a, so that the production cost and the difficulty of the motor controller shell b are greatly reduced by the chip heat conduction module a and the motor controller provided by the invention.
Example 4:
fig. 6 is a schematic diagram illustrating a comparison between a thermal resistance d of a chip heat conduction module in the prior art and a thermal resistance e of a chip heat conduction module provided by the present invention. As shown in fig. 6, since the copper base plate and the heat-conducting silicone grease are reduced, compared with the prior art, the overall thermal resistance of the chip heat-conducting module provided by the invention is reduced by about 40%.
The chip heat conducting module provided by the invention omits a copper base plate, reduces the cost, does not have thermal resistance generated by the copper base plate, does not use heat conducting silicone grease, does not have thermal resistance generated by the heat conducting silicone grease, can cancel the production flow related to the heat conducting silicone grease, greatly improves the service life and reliability of the system, does not need to make a water channel on a shell of a motor controller, reduces the production cost and difficulty of the shell of the motor controller, and can be an MOSFET (metal-oxide semiconductor field effect transistor) except an IGBT (insulated gate bipolar transistor) and an FRD (field-fast diode).
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the equivalent replacement or change according to the technical solution and the modified concept of the present invention should be covered by the scope of the present invention.
Claims (9)
1. The utility model provides a chip heat conduction module, includes chip module and two-sided copper-clad ceramic plate, its characterized in that, be provided with first mounting between chip module and the two-sided copper-clad ceramic plate, the bottom of two-sided copper-clad ceramic plate is provided with the second mounting, the bottom of second mounting is provided with heat abstractor.
2. The chip thermal module of claim 1, further comprising a chip protection housing mounted on top of the heat sink.
3. The chip heat conduction module according to claim 1, wherein the double-sided copper-clad ceramic plate comprises a connection copper layer, a ceramic layer and a copper-clad layer, the connection copper layer is arranged on the top of the ceramic layer, and the copper-clad layer is arranged on the bottom of the ceramic layer.
4. The chip thermal module of claim 1, wherein a printed circuit is disposed in the copper connecting layer, and a metal bonding wire is connected between the copper connecting layer and the chip module.
5. The chip module of claim 1, wherein the chip module is one of an insulated gate bipolar transistor chip and a fast recovery diode chip.
6. The chip thermal module of claim 1, wherein said heat sink comprises a heat sink with water channels and a heat sink copper layer disposed on top of the heat sink.
7. The chip thermal module of claim 5, wherein said heat sink copper layer has a thickness of less than 1 mm.
8. The chip heat conduction module according to claim 1, wherein the first fixing member and the second fixing member are both solder or silver paste.
9. A preparation method of a chip heat conduction module is characterized by comprising the following steps:
s1, welding the chip module on one surface of the printed circuit of the double-sided copper-clad ceramic plate;
s2, welding the double-sided copper-clad ceramic plate on a copper layer of a heat dissipation device of the heat dissipation device;
s3, routing the chip module and the printed circuit connected with the copper layer;
and S4, performing shell packaging on the chip heat conduction module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110330398.5A CN113097155A (en) | 2021-03-30 | 2021-03-30 | Chip heat conduction module and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110330398.5A CN113097155A (en) | 2021-03-30 | 2021-03-30 | Chip heat conduction module and preparation method thereof |
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| Publication Number | Publication Date |
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| CN113097155A true CN113097155A (en) | 2021-07-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN202110330398.5A Pending CN113097155A (en) | 2021-03-30 | 2021-03-30 | Chip heat conduction module and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116721989A (en) * | 2023-08-10 | 2023-09-08 | 烟台台芯电子科技有限公司 | IGBT module and packaging technology |
| CN117877991A (en) * | 2024-03-11 | 2024-04-12 | 乐山希尔电子股份有限公司 | Manufacturing method of power module |
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|---|---|---|---|---|
| CN203850295U (en) * | 2014-03-27 | 2014-09-24 | 联合汽车电子有限公司 | IGBT module packaging structure of inverter |
| CN207009436U (en) * | 2017-05-12 | 2018-02-13 | 苏州汇川联合动力系统有限公司 | Power model and electric machine controller |
| CN209119076U (en) * | 2018-12-25 | 2019-07-16 | 重庆键合科技有限责任公司 | A kind of novel chip package module |
| CN110797318A (en) * | 2019-11-29 | 2020-02-14 | 上海睿驱微电子科技有限公司 | IGBT packaging structure with double-sided heat pipe cooling |
| CN111261599A (en) * | 2020-03-11 | 2020-06-09 | 黄山学院 | Structure and processing technology of high-power IPM (intelligent power module) based on graphene-based packaging lining plate |
-
2021
- 2021-03-30 CN CN202110330398.5A patent/CN113097155A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203850295U (en) * | 2014-03-27 | 2014-09-24 | 联合汽车电子有限公司 | IGBT module packaging structure of inverter |
| CN207009436U (en) * | 2017-05-12 | 2018-02-13 | 苏州汇川联合动力系统有限公司 | Power model and electric machine controller |
| CN209119076U (en) * | 2018-12-25 | 2019-07-16 | 重庆键合科技有限责任公司 | A kind of novel chip package module |
| CN110797318A (en) * | 2019-11-29 | 2020-02-14 | 上海睿驱微电子科技有限公司 | IGBT packaging structure with double-sided heat pipe cooling |
| CN111261599A (en) * | 2020-03-11 | 2020-06-09 | 黄山学院 | Structure and processing technology of high-power IPM (intelligent power module) based on graphene-based packaging lining plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116721989A (en) * | 2023-08-10 | 2023-09-08 | 烟台台芯电子科技有限公司 | IGBT module and packaging technology |
| CN117877991A (en) * | 2024-03-11 | 2024-04-12 | 乐山希尔电子股份有限公司 | Manufacturing method of power module |
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Application publication date: 20210709 |
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