CN117794096A - Mounting device and substrate manufacturing device - Google Patents

Abstract

The invention provides a mounting device and a substrate manufacturing device, which can correct the relative height positions of a supporting surface and a holding table according to a plurality of mounting parts even if the holding table is deformed, so as to press electronic parts to a substrate with good precision. The mounting device of the embodiment comprises: a crimping tool temporarily crimping the electronic component to the plurality of mounting portions of the substrate at a crimping position; a support tool having a support surface for supporting a substrate; a holding table for holding the substrate so that the mounting portion protrudes from the holding surface and moving the mounting portion so as to be positioned at the pressure bonding position; a lifting mechanism for relatively moving the height positions of the supporting surface and the holding surface; and a control device for controlling the lifting mechanism based on a correction table, wherein the correction table sets a difference between the height position of the holding surface and the height position of the supporting surface when the mounting portion is supported by the supporting surface for each position corresponding to the mounting portion.

Description

Mounting device and substrate manufacturing device

Technical Field

The present invention relates to a mounting apparatus and a substrate manufacturing apparatus.

Background

Electronic components such as tape carrier packages (Tape Carrier Package, TCP) are bonded to substrates such as display panels such as liquid crystal panels and organic Electroluminescence (EL) panels via anisotropic conductive members as adhesive materials. A plurality of mounting parts including electrodes are provided on the upper surface of the side part of the substrate, the anisotropic conductive member in a tape shape is stuck to each mounting part, and after the anisotropic conductive member is temporarily pressed against the electronic component, main pressing is performed.

The temporary press-bonding of the electronic component to the substrate is performed by holding with the holding table held by the holding surface facing the lower surface of the substrate in such a manner that the mounting portion protrudes from the holding surface, and supporting the lower surface of the mounting portion with the upper surface of the supporting tool while press-bonding the electronic component to the upper surface of the mounting portion with the press-bonding tool.

[ Prior Art literature ]

[ patent literature ]

Patent document 1 Japanese patent laid-open publication No. 2003-224165

Disclosure of Invention

[ problem to be solved by the invention ]

In the temporary press-bonding of electronic parts to a substrate, it is an important factor in improving the press-bonding accuracy to press-bond the electronic parts by a press-bonding tool in a state where the substrate is placed on the upper surface of a supporting tool in parallel without any gap without applying an excessive load to the substrate. When the electronic component is pressed by the pressing tool with a gap left between the lower surface of the substrate and the upper surface of the supporting tool, the electronic component is first pressed by the pressing tool, and the electronic component is directly pressed by the pressing tool, so that the entire surface of the substrate and the supporting tool is brought into contact with each other. That is, after the electronic component is brought into contact with the substrate, the substrate is deformed and brought into contact with the supporting tool, and therefore, the contact position, that is, the pressure contact position of the electronic component and the substrate is shifted in accordance with the deformation.

Such a gap is generated by: the holding surface of the holding table is deformed due to temperature change or insufficient adjustment of flatness. In particular, if the body temperature increases due to long-time operation or the like, the holding table is easily deformed. More specifically, the heat accumulation is different between the central portion and the peripheral portion of the holding table, and therefore the holding surface of the holding table is deformed to have different heights between the central portion and the peripheral portion. Since the substrate held on the holding table is held by vacuum suction, the substrate has a shape that approximates the shape of the holding table, and therefore the heights of the plurality of mounting portions of the substrate held on the holding table are different from each other, and when the mounting portions of the substrate are positioned on the support, respectively, uneven adhesion to the support occurs, and the accuracy of pressure bonding is impaired.

An object of an embodiment of the present invention is to provide a mounting device capable of accurately pressing an electronic component onto a substrate by correcting the relative height positions of a support surface and a holding table based on a plurality of mounting portions even if the holding table is deformed.

[ means of solving the problems ]

In order to achieve the above object, a mounting device according to an embodiment includes: a crimping tool for temporarily crimping the electronic component to the plurality of mounting portions of the substrate at crimping positions, respectively, via the adhesive material; a support tool having a support surface for supporting the substrate at the press-contact position; a holding table having a holding surface for holding the substrate, the holding table holding the substrate so that the mounting portion protrudes from the holding surface and moving so that the mounting portion of the substrate is positioned at the pressure-bonding position; a lifting mechanism for relatively moving the height positions of the supporting surface and the holding surface; and a control device that controls the lifting mechanism so that a height position of the holding surface is aligned with a height position of the supporting surface based on a correction table that sets a difference between the height position of the holding surface and the height position of the supporting surface when positioning is performed by supporting the mounting portion with the supporting surface at the pressure contact position for each of positions corresponding to the plurality of mounting portions.

[ Effect of the invention ]

In the embodiment of the invention, even if the holding table is deformed, the correction of the relative height position of the supporting surface and the holding table is performed according to the plurality of mounting portions, so that the electronic component is accurately pressed to the substrate.

Drawings

Fig. 1 is a side view showing an installation apparatus according to an embodiment, and a block diagram showing a control apparatus.

Fig. 2 is a plan view showing an electronic part temporarily crimped to a substrate.

Fig. 3 is an explanatory view showing a substrate manufacturing apparatus according to the embodiment.

Fig. 4 is a plan view showing a crimping tool and a supporting tool according to an embodiment.

Fig. 5 (a) to 5 (C) are explanatory views showing differences in the heights of the holding surface and the support surface due to deformation of the holding table.

Fig. 6 is a plan view showing an example of the first temporary crimping by the crimping tool.

Fig. 7 is a plan view showing an example of the second temporary crimping by the crimping tool.

Fig. 8 is a plan view showing an example of the third temporary crimping performed by the crimping tool.

Fig. 9 is a flowchart showing an installation procedure of the embodiment.

[ description of symbols ]

1: mounting device

2: substrate board

3: adhesive material

4: electronic component

21. 21a to 21e: mounting part

100: crimping part

110: bench frame

120. 120A, 120B: crimping tool

121: pressing surface

130: support part

140: cylinder

150. 150A, 150B: supporting tool

151: bearing surface

152: support body

152a: window

153: camera with camera body

200: positioning part

210: holding table

211: holding surface

220: positioning unit

221: x-shaped workbench

221a: x movable body

221b: x driving source

222: y-shaped workbench

222a: y movable body

222b: y driving source

223: lifting mechanism

223a: support body

223b: support part

223c: screw shaft

223d: guide shaft

223e: z-movable body

223f: driven gear

223g: driving gear

223h: z driving source

223i: driving shaft

224: fitting component

225a: θ driving source

225b: θ movable body

300: control device

301: positioning control part

302: crimping control part

303: storage unit

310: input device

320: display device

C: formal crimping device

d. d1 to d5: difference value

F: feeding device

M: substrate manufacturing apparatus

P, P1, P2: crimping position

S: sticking device

S101, S102, S103, S104, S105, S106, S107, S108, S109, S110, S111, S112: step (a)

X, Y, Z, θ: direction of

Detailed Description

An embodiment of the present invention (hereinafter, referred to as the present embodiment) will be specifically described with reference to the drawings. Further, the drawings are schematic, and dimensions, ratios, and the like of the respective portions include portions exaggerated for easy understanding. As shown in fig. 1 and 2, the mounting device 1 of the present embodiment presses the electronic component 4 to the substrate 2 via the adhesive 3.

The substrate 2 is a display panel having a display area of a liquid crystal display, an organic EL display, or the like. As shown in fig. 2, the substrate 2 has a plurality of mounting portions 21. Each mounting portion 21 is a portion where the electronic component 4 and the substrate 2 are bonded via the adhesive 3, and is disposed along the outer edge of the upper surface of the substrate 2. In the present embodiment, five mounting portions 21a to 21e are arranged at equal intervals along one side of the long side of the substrate 2. Hereinafter, the mounting portions 21 will be described without distinguishing the mounting portions 21a to 21e.

In the upstream process, the adhesive 3 is adhered to each mounting portion 21, and the electronic component 4 is pressed against each mounting portion 21. The crimp by the mounting device 1 is a temporary crimp before the final main crimp is performed. The mounting portion 21 is provided with a lead (electrode) connected to a circuit in the display area via a signal line, and the electrode of the electronic component 4 overlaps with the lead by temporary pressure bonding. In this embodiment, temporary press-fitting will be described as mounting.

The adhesive material 3 is an anisotropic conductive film (ACF: anisotropic Conductive Film) which secures conductivity by thermocompression bonding. The anisotropic conductive film is a tape-shaped member in which a plurality of conductive particles are added to a resin as a base material. As the resin of the base material, a thermosetting resin is used. Although omitted in fig. 2, the adhesive 3 is attached so as to cover the mounting portions 21.

The electronic component 4 is a component bonded to the substrate 2 via the adhesive 3. The electronic component 4 is, for example, an integrated circuit (Integrated Circuit, IC) Chip, TCP (Tape Carrier Package), chip On Film (COF), or the like.

As shown in fig. 3, the substrate 2 is carried into the mounting device 1 from the upstream joining device S for joining the adhesive 3 to the substrate 2 by a delivery mechanism, not shown, and the electronic components 4 are supplied from the upstream supply device F by the delivery mechanism, not shown. The board 2 temporarily pressed with the electronic component 4 in the mounting apparatus 1 is transferred to a main pressing apparatus C downstream by a transfer mechanism, not shown, and the electronic component 4 is main pressed to the board 2 in the main pressing apparatus C. The main press bonding is to collectively perform thermal press bonding on the plurality of electronic components 4 temporarily press-bonded to the substrate 2 via the adhesive 3. By the above-described positive pressure bonding, conductive particles of the anisotropic conductive film at the portion where the electrode and the lead are overlapped are crushed, and conduction between the electrode and the lead is ensured. The apparatus including such a bonding apparatus S, a supply apparatus F, a mounting apparatus 1, and a main pressing apparatus C can be understood as a substrate manufacturing apparatus M that manufactures a substrate 2 on which electronic components 4 are mounted.

The temporary pressure bonding performed by the mounting apparatus 1 of the present embodiment is performed by: first, the mounting portion 21 to be mounted next of the substrate 2 held on the holding table 210 is positioned at the press-contact position P at a height position where it is not in contact with the supporting tool 150; next, alignment of the mounting portion 21 and the electronic component 4 is performed; then, the substrate 2 is moved to a height position placed on the supporting tool 150, and is placed on the supporting tool 150 while being brought into contact with the supporting tool 150; in this state, the electronic component 4 is crimped to the mounting portion 21 by the crimping tool 120. At this time, the holding table 210 for placing the substrate 2 on the supporting tool 150 is moved to the height position based on a correction table described later.

With respect to the temporary crimping performed by the mounting apparatus 1 of the present embodiment, such crimping is performed alternately at the respective corresponding crimping positions P by the two crimping tools 120. Thereby, the electronic component 4 is supplied to one of the crimping tools 120 while the other crimping tool 120 is crimping. The structure of the mounting device 1 will be described in detail below.

Structure

As shown in fig. 1, the mounting device 1 includes a pressure bonding section 100, a positioning section 200, and a control device 300.

[ crimping portion ]

The pressure bonding portion 100 pressure bonds the electronic component 4 to the substrate 2. The crimping part 100 has a stage 110, a crimping tool 120, a support part 130, a cylinder 140, and a supporting tool 150. The stand 110 is a stand erected on a setting surface or a device bottom surface. The press bonding tool 120 temporarily presses the electronic component 4 to the plurality of mounting portions 21 of the substrate 2 via the adhesive material 3, respectively. The pressing tool 120 has a pressing surface 121 formed at a lower end thereof, and the electronic component 4 is sucked and held on the pressing surface 121 by a vacuum device, not shown. The support 130 is provided on the stand 110, and supports the crimping tool 120 to be liftable. The cylinder 140 is provided in the support 130, and drives the crimping tool 120 in the up-down direction (Z direction in the drawing).

As shown in fig. 4, the crimping tool 120 of the present embodiment is disposed in two horizontally (X direction in the drawing) at a left-right interval. In the drawing, the left side is the crimping tool 120A and the right side is the crimping tool 120B, but the description will be made only as the crimping tool 120 without distinguishing between them. The position to be crimped by the crimping tool 120 is defined as a crimping position P. The present embodiment has two positions, that is, a crimping position P1 of the crimping tool 120A and a crimping position P2 of the crimping tool 120B. The description will be given only as the pressure contact position P without distinguishing between them.

The support tool 150 supports the substrate 2 at the press-bonding position P. The support tool 150 is provided below the press tool 120, and a support surface 151 is provided at a position facing the pressing surface 121. The support tool 150 of the present embodiment is supported and fixed by a support body 152 provided upright on the stand 110, and the height position of the support surface 151 is fixed.

In the present embodiment, two support tools 150A, 150B are provided corresponding to the two pressure contact positions P1, P2. That is, the support tool 150A is provided corresponding to the crimping tool 120A, and the support tool 150B is provided corresponding to the crimping tool 120B. Note that, in the case where the two support tools 150A and 150B are not distinguished, only the support tool 150 will be described.

A pair of cameras 153 (see fig. 4) is disposed below the support tool 150. The pair of cameras 153 are provided so as to sandwich both ends of one mounting portion 21 in a direction in which the two supporting tools 150A, 150B are aligned in a plan view. The camera 153 is provided so as to be positioned with respect to the two support tools 150A and 150B by a not-shown moving mechanism. As will be described later, the camera 153 photographs the alignment mark of the substrate 2 and the alignment mark of the electronic component 4, which are not shown, through the window 152a, which is an opening formed in the support 152.

[ positioning portion ]

The positioning portion 200 positions the mounting portion 21 of the substrate 2 at the press-contact position P. The positioning unit 200 includes a holding table 210 and a positioning unit 220. The holding table 210 has a holding surface 211 that holds the substrate 2, holds the substrate 2 so that the mounting portion 21 protrudes from the holding surface 211, and moves to position the mounting portion 21 of the substrate 2 at the press-contact position P.

The holding table 210 is a rectangular plate body, and the holding surface 211 is a horizontal upper surface of the holding table 210. The holding surface 211 is formed with suction holes communicating with a suction pump, not shown, so that the substrate 2 to be supplied can be sucked and held. That is, the holding surface 211 holds the substrate 2 by suction.

The positioning unit 220 drives the substrate 2 in the horizontal direction (X direction, Y direction), the rotational direction (θ direction), and the up-down direction (Z direction). The positioning unit 220 includes an X stage 221, and an X movable body 221a is provided on the X stage 221. The X movable body 221a is driven in the X direction by an X driving source 221 b. The X direction is a direction parallel to the direction in which the mounting portions 21 are aligned.

A Y table 222 is integrally provided on the upper surface of the X movable body 221a. A Y movable body 222a is provided on the upper surface of the Y table 222. The Y movable body 222a is driven in the Y direction in the horizontal direction orthogonal to the X direction by a Y driving source 222 b.

In addition, the positioning unit 220 has a lifting mechanism 223. The elevating mechanism 223 includes a support body 223a, a support portion 223b, a screw shaft 223c, a guide shaft 223d, a Z movable body 223e, a driven gear 223f, a driving gear 223g, a Z driving source 223h, and a driving shaft 223i.

The support body 223a has a crank-like side surface shape and is erected on the Y movable body 222a. A screw shaft 223c and a guide shaft 223d are provided between a support portion 223b provided at the upper end of the support body 223a and the Y movable body 222a so that the shaft is along the Z direction. The screw shaft 223c is rotatably provided, and the guide shaft 223d is fixedly provided.

The Z movable body 223e is screwed to the screw shaft 223c, and the guide shaft 223d is slidably inserted into the Z movable body 223e. Therefore, when the screw shaft 223c is rotated, the Z-movable body 223e does not rotate but moves up and down along the guide shaft 223d.

The upper end portion of the screw shaft 223c protrudes from the upper surface of the support portion 223b, and the driven gear 223f is fitted to the protruding end thereof. The driving gear 223g is engaged with the driven gear 223f. The drive gear 223g is engaged with a drive shaft 223i of a Z drive source 223h provided on the support body 223 a. Therefore, when the Z drive source 223h is operated and the drive shaft 223i rotates, the screw shaft 223c rotates via the engaged pair of drive gears 223g and driven gears 223f, and thus the Z movable body 223e is driven in the Z direction.

One side of the L-shaped attachment member 224 is fixed to the Z movable body 223e. A θ movable body 225b rotationally driven by a θ driving source 225a centering on a vertical axis is provided on the upper surface of the other side of the fitting member 224. A holding table 210 is provided on the upper surface of the θ movable body 225b. The substrate 2 sucked and held by the holding surface 211 can be positioned in the X direction, the Y direction, the Z direction, and the θ direction by the movement of the holding table 210 by the positioning unit 220.

[ control device ]

The control device 300 controls the start, stop, speed, operation timing, and the like of the pressure bonding section 100 and the positioning section 200. In order to realize various functions of the mounting apparatus 1, the control apparatus 300 includes a processor that executes a program, a memory that stores various information such as a program and operation conditions, a driving circuit that drives each component, and the like. As shown in fig. 1, an input device 310 for inputting instructions and information required for control by an operator and a display device 320 for confirming the state of the device are connected to the control device 300. The input device 310 may use a switch, a touch screen, a keyboard, a mouse, etc. The display device 320 may use liquid crystal, organic EL, or the like.

The control device 300 of the present embodiment includes a positioning control unit 301, a pressure welding control unit 302, and a storage unit 303. The positioning control unit 301 controls the operations of the X drive source 221b, the Y drive source 222b, and the θ drive source 225a to move the holding table 210, thereby positioning the mounting units 21 of the substrate 2 held by the holding table 210 at the pressure bonding positions P. As will be described later, the positioning control unit 301 controls the operation of the Z drive source 223h of the elevating mechanism 223 based on the correction table, thereby aligning the height position of the holding surface 211 with the height position of the support surface 151. The alignment of the height positions means that the height positions are made uniform, and the displacement within a range that does not affect the temporary press-bonding is allowed. Further, the positioning control unit 301 controls the operations of the X drive source 221b, the Y drive source 222b, and the θ drive source 225a so that the positions of the substrate 2 and the electronic component 4 are aligned based on the positions of the alignment marks imaged by the camera 153, thereby moving the holding table 210.

The press-bonding control section 302 presses the electronic component 4 held by the press-bonding tool 120 to the mounting section 21 of the substrate 2 at the press-bonding position P by controlling the operation of the cylinder 140. The pair of press-bonding tools 120A and 120B receive the electronic component 4 from the supply device F and press-bond the mounting portions 21 of the substrates 2 on the support tools 150A and 150B, respectively. Wherein the crimping by the crimping tool 120A is performed alternately with the crimping by the crimping tool 120B. That is, while the electronic component 4 is being crimped by one of the crimping tools 120A, the other crimping tool 120B receives the electronic component 4, and while the electronic component 4 is being received by one of the crimping tools 120B, the other crimping tool 120A receives the electronic component 4.

The storage unit 303 is a storage device including various memories (Hard Disk Drive (HDD) or solid state Drive (Solid State Drive, SSD)) as storage media, and interfaces between the storage media and the outside. The storage unit 303 stores data and programs necessary for the operation of the mounting device 1. The data comprises a fix-up table. The correction table is information in which the position of the holding table 210 when the mounting portions 21 of the substrate 2 are positioned at the pressure contact position P and the difference d between the height position of the holding surface 211 and the height position of the supporting surface 151 at that time are set for each position corresponding to the plurality of mounting portions 21. In the present embodiment, two crimping positions P1, P2 are provided, and therefore, two correction tables are stored.

However, as described above, when the mounting portion 21 of the substrate 2 is positioned at the press-contact position P, the difference d should be zero if errors in the components or assembly are eliminated because the positioning is performed so that the height position of the holding surface 211 is aligned with the height position of the supporting surface 151 based on the information on the design. However, as will be described later, in the case where the holding table 210 is deformed, the difference d is not zero. Of course, the difference d contains errors in parts or assembly.

For example, fig. 5 (a) to 5 (C) show examples of the difference d1 to d5 between the height position of the holding surface 211 of the holding table 210 and the height position of the support surface 151 of the support tool 150A or 150B when the holding table 210 is deformed. Fig. 5 (a) to 5 (C) are simplified diagrams of the holding table 210, the supporting tool 150A, and the supporting tool 150B, as viewed from the direction of the white arrows in fig. 1. In fig. 5 (a) to 5 (C), deformation of the holding table 210 is exaggeratedly shown, and both ends of the holding table 210 in the X direction are deformed downward. Further, since the support tool 150A and the support tool 150B are fixedly disposed, the holding table 210 is moved and the mounting portions 21 are positioned.

Fig. 5 (a) shows a state in which the holding table 210 is positioned so that the mounting portions 21a and 21c are positioned at the pressure bonding positions P1 and P2, respectively, as shown in fig. 6 described later. The difference d at the crimping position P1 at this time is represented by a difference d1, and the difference d at the crimping position P2 is represented by a difference d 3. Fig. 5 (B) shows a state in which the holding table 210 is positioned so that the mounting portions 21B and 21d are positioned at the pressure bonding positions P1 and P2, respectively, as shown in fig. 7 described later. The difference d at the crimping position P1 at this time is represented by a difference d2, and the difference d at the crimping position P2 is represented by a difference d 4. Fig. 5 (C) shows a state in which the holding table 210 is positioned so that the mounting portion 21e is positioned at the pressure contact position P1 as shown in fig. 8 described later. The difference d at the crimping position P1 at this time is represented by a difference d5. The difference d is not shown in a state where the attachment portion 21 is not present at the pressure contact position P2.

Before the mounting device 1 is started and mounted, as shown in fig. 5 (a) to 5 (C), each time the holding table 210 is positioned, the operator measures the difference d1 to d5 by a tool such as a scale or a feeler gauge. Then, these measured values are set as correction values for aligning the height positions of the holding surface 211 with the height positions of the support surfaces 151 of the fixed support tools 150A and 150B when the mounting portions 21a to 21e are positioned in the Z direction, and are input via the input device 310. The storage unit 303 stores the inputted correction value as a correction table.

For example, as shown below, the correction table sets a distance in the height direction from the height position of the support surface 151 as a reference for each of the height positions of the holding surfaces 211 corresponding to the mounting portions 21a to 21e for each of the pressure contact positions P.

In the present embodiment, it is determined in advance at which pressure contact positions P1 and P2 the respective mounting portions 21a to 21e are pressure-contacted. That is, for example, the mounting portions 21a, 21b, 21e must be mounted at the pressure contact position P1, and the mounting portions 21c, 21d must be mounted at the pressure contact position P2. Therefore, the relationship between the height position of the holding surface 211 corresponding to each of the mounting portions 21a to 21e and the height position of the support surface 151 at each of the pressure contact positions P is determined one-to-one.

Action

The operation of the mounting device 1 according to the present embodiment as described above will be described with reference to the explanatory diagrams of fig. 6 to 8 and the flowchart of fig. 9, in addition to the above-described drawings. The substrate 2 to which the adhesive material 3 has been attached in the attaching device S is carried in and placed on the holding table 210 (step S101). The substrate 2 is sucked and held so that the mounting portion 21 protrudes from the holding surface 211. That is, one side of the arrangement mounting portion 21 is positioned so as to be parallel to the arrangement direction of the crimping tools 120A and 120B of the crimping portion 100, and to protrude from the holding surface 211 toward the crimping portion 100.

As shown in fig. 6, the holding table 210 holding the substrate 2 by suction is moved in the Y direction and the X direction by the positioning means 220, and the mounting portion 21a that is first pressed is positioned at the pressing position P1 (step S102). At this time, the camera 153 is positioned at the press-contact position P1. Then, the alignment mark of the mounting portion 21a of the substrate 2 held on the holding table 210 and the alignment mark of the electronic component 4 held on the press-bonding tool 120A are positioned at positions that can be photographed by the camera 153 through the window 152a (see fig. 4). Further, the position of the substrate 2 in the Z direction is positioned at a height not in contact with the support surface 151. By positioning the mounting portion 21a to the pressure contact position P1, the mounting portion 21c is necessarily positioned to the pressure contact position P2.

In the press-contact position P1, the alignment mark of the substrate 2 and the alignment mark of the electronic component 4 are photographed in the same field of view by the camera 153. Specifically, one of the pair of alignment marks of the substrate 2 and one of the pair of alignment marks of the electronic component 4 are photographed in the same field of view by one of the pair of cameras 153, and the other of the pair of alignment marks of the substrate 2 and the other of the pair of alignment marks of the electronic component 4 are photographed in the same field of view by the other of the pair of cameras 153. Based on the image captured by the imaging, the relative position of the alignment mark of one of the substrates 2 and the electronic component 4, the relative position of the alignment mark of the other substrate 2 and the electronic component 4, and the relative positions of one and the other alignment marks of the substrates 2 and the electronic component 4 are recognized. The holding table 210 is moved in the Y direction, the X direction, and the θ direction by the positioning unit 220 so that the positional displacement of the substrate 2 and the electronic component 4 in the X direction, the Y direction, and the θ direction calculated from these positional relationships is corrected above the supporting tool 150A (step S103).

The elevating mechanism 223 corrects the height position of the holding surface 211 to the height position aligned with the supporting surface 151 based on the correction value of the correction table of the pressure contact position P1 corresponding to the mounting portion 21a (step S104). That is, the substrate 2 is moved (lowered) to the corrected height position in contact with the supporting surface 151, and the substrate 2 is placed on the supporting surface 151. Then, the press-bonding tool 120A is lowered to press-bond the electronic component 4 to the mounting portion 21a (step S105). During this time, the electronic component 4 supplied from the supply device F is held by the pressing surface 121 of the press tool 120B. After the electronic component 4 is pressed against the mounting portion 21a, the pressing tool 120A is raised, and the next electronic component 4 is supplied to the pressing surface 121 and held. At the same time, the holding table 210 is raised, and the position of the substrate 2 in the Z direction is positioned at a height not to contact the support surface 151.

Then, when the mounting portion 21 to be crimped is present at the other crimp position P2 (YES in step S106), the crimping at the crimp position P2 is performed in the same manner as described above. That is, the holding table 210 is moved in the Y direction and the X direction by the positioning unit 220, so that the mounting portion 21c is positioned at the press-contact position P2 (step S107). At this time, the camera 153 is positioned at the press-contact position P2, and the alignment mark of the mounting portion 21c of the substrate 2 held by the holding table 210 and the alignment mark of the electronic component 4 held by the press-contact tool 120B are positioned at positions that can be photographed by the camera 153 via the window 152 a.

Further, as described above, by positioning the mounting portion 21a to the pressure contact position P1, the mounting portion 21c is necessarily positioned to the pressure contact position P2. That is, in the case where there are the mounting portions 21 corresponding to the two crimping positions P, respectively, by positioning one of the mounting portions 21 at the crimping position P, the corresponding other mounting portion 21 is positioned at the other crimping position P.

Therefore, if the alignment mark of the mounting portion 21 of the substrate 2 and the alignment mark of the electronic component 4 held by the press-bonding tool 120 can be captured by the camera 153, the step S107 of positioning the mounting portion 21c at the press-bonding position P2 is not necessary.

However, since the positional displacement between one of the mounting portions 21 and the electronic component 4 is corrected, the displacement between the other mounting portion 21 and the alignment mark of the electronic component 4 is increased, and there is a possibility that photographing may not be performed. Therefore, if there are many cases where shooting is impossible, step S107 is performed in which one of the misalignment correction states can be canceled.

In the pressure bonding position P2, the holding table 210 is moved in the Y direction, the X direction, and the θ direction by the positioning unit 220 in the same manner as in the pressure bonding position P1, so that the positional deviations in the X direction, the Y direction, and the θ direction calculated by photographing the alignment mark of the substrate 2 and the alignment mark of the electronic component 4 by the camera 153 are corrected above the supporting tool 150B (step S108).

The height position of the holding surface 211 is corrected to the height position aligned with the supporting surface 151 based on the correction value of the correction table of the pressure contact position P2 corresponding to the mounting portion 21c (step S109). That is, the substrate 2 is moved (lowered) to the corrected height position in contact with the supporting surface 151, and the substrate 2 is placed on the supporting surface 151. Then, the pressing tool 120B is lowered to press the electronic component 4 against the mounting portion 21c (step S110). After the press-bonding, the press-bonding tool 120B is raised, and the next electronic component 4 is supplied to the pressing surface 121 and held. At the same time, the holding table 210 is raised, and the position of the substrate 2 in the Z direction is positioned at a height not to contact the support surface 151.

Further, since there are mounting portions 21b, 21d, and 21e that are not mounted (yes in step S111), the holding table 210 is moved, and as shown in fig. 7, the mounting portion 21b is positioned at the pressure contact position P1 (step S102). Then, similarly to the above, the pressure bonding to the mounting portion 21b at the pressure bonding position P1 (step S103 to step S105) and the pressure bonding to the mounting portion 21d at the pressure bonding position P2 (step S106 to step S110) are performed.

Further, since there is an uninstalled attachment portion 21e (yes in step S111), the holding table 210 is moved, and as shown in fig. 8, the attachment portion 21e is positioned at the pressure contact position P1 (step S102). Then, as described above, the pressure bonding to the mounting portion 21e at the pressure bonding position P1 is performed (step S103 to step S105).

Then, since there is NO mounting portion 21 corresponding to the other pressure contact position P2 (NO in step S106) and there is NO mounting portion 21 not mounted (NO in step S111), the holding table 210 returns to the standby position, and the substrate 2 is removed by suction holding (step S112). The substrate 2 is carried into the main press-bonding apparatus C, and the main press-bonding apparatus C performs main press-bonding of the electronic component 4 to the substrate 2.

[ Effect ]

(1) The mounting device 1 of the present embodiment includes: a crimping tool 120 that temporarily crimps the electronic component 4 to the plurality of mounting portions 21 of the substrate 2 via the adhesive material 3 at the crimping positions P, respectively; a supporting tool 150 having a supporting surface 151 for supporting the substrate 2 at the press-contact position P; a holding table 210 having a holding surface 211 for holding the substrate 2, holding the substrate 2 so that the mounting portion 21 protrudes from the holding surface 211, and moving so as to position the mounting portion 21 of the substrate 2 at the pressure contact position P; a lifting mechanism 223 for relatively moving the height positions of the supporting surface 151 and the holding surface 211; and a control device 300 for controlling the elevating mechanism 223 so as to align the height position of the holding surface 211 with the height position of the supporting surface 151 based on a correction table that sets a difference d between the height position of the holding surface 211 and the height position of the supporting surface 151 when the mounting portion 21 is positioned by the supporting surface 151 at the pressure contact position P for each position corresponding to the plurality of mounting portions 21.

The substrate manufacturing apparatus M of the present embodiment includes: an adhering device S for adhering the adhesive 3 to the substrate 2; a mounting device 1; and a main crimping device C for performing main crimping on the electronic component 4 temporarily crimped to the substrate 2 in the mounting device 1.

Therefore, even if the holding table 210 is deformed due to a temperature change or insufficient adjustment of flatness, and the heights of the holding surface 211 and the support surface 151 are different, the height positions of the holding surface 211 and the support surface 151 can be aligned by correction. In particular, when the bonding device S bonds the thermal adhesive 3 to the substrate 2 and the main press-bonding device C performs main press-bonding by heat, the peripheral portion of the holding surface 211 of the holding table 210 is easily deformed by the influence of heat from the adjacent bonding device S and main press-bonding device C, but the difference in height caused by this can be corrected. In addition, for example, in the case where the holding table 210 is made of aluminum for weight reduction, the holding table is a material that is particularly easily deformed by heat, and thus, a difference in height is likely to occur, but the difference can be corrected. Therefore, when the mounting portions 21 of the substrate 2 are positioned on the support surfaces 151, the contact with the support surfaces 151 becomes uniform, and the pressure bonding can be performed stably and accurately.

Further, for example, it is also conceivable to measure the height position of the substrate 2 with a sensor or the like at each press-contact time so that the height position of the holding surface 211 and the supporting surface 151 is aligned, but the takt time (takt time) becomes longer. If the number of the mounting portions 21 is large, it is necessary to measure each mounting portion 21, which requires a longer time, and the number of sensors increases, resulting in a high cost. In order to cope with this, it is also considered to measure only a specific portion of the substrate 2, but since the height varies depending on the position of the mounting portion 21, there is a case where the pressure-bonding is not properly performed at a portion distant from the measurement portion.

In the present embodiment, since the height positions of the holding surface 211 and the supporting surface 151 are aligned based on the correction table set in advance, the tact time is suppressed to be short, and even in the case where the plurality of mounting portions 21 are continuously pressed, an increase in the processing time can be suppressed. If the substrate 2 is shared by the arrangement of the mounting portions 21 and the like, the pressure bonding can be continuously performed for a long time based on the shared correction table. The correction table may be updated every time the type of the substrate 2 is changed.

In the case of detecting the height position of the substrate 2 by the sensor, the sensor output may change with a long-time operation, or foreign matter may adhere to the bottom surface of the substrate 2, which may cause erroneous detection. Further, since a sensor is not required, the cost can be suppressed.

(2) The crimping tool 120 and the supporting tool 150 are provided in plural sets, and for each set of the crimping tool 120 and the supporting tool 150, a difference d between the height position of the holding surface 211 and the height position of the supporting surface 151 in the correction table is set for each position corresponding to the plurality of mounting portions 21 in the holding surface 211.

Therefore, compared with the case where the height position of the substrate 2 is measured for each of the plurality of press tools 120 and the support tool 150 by a sensor or the like every time of press, the tact time can be suppressed and productivity can be improved.

(3) The lifting mechanism 223 lifts the holding table 210, and the height position of the supporting surface 151 of the supporting tool 150 is fixed. In this way, since the height position of the support surface 151 is fixed and the height position as a reference is stable, the accuracy of correction by the correction table can be maintained for a long period of time.

Modification example

The present invention is not limited to the embodiments described above. The following modifications having the same basic configuration as the above-described embodiment can also be applied.

(1) In the embodiment, the height position of the support surface 151 is fixed. The temporary crimping may be performed by relatively moving the crimping tool 120 and the supporting tool 150. Therefore, the holding table 210 may be fixed in the height direction, and temporarily pressure-bonded so that the support tool 150 is lifted and lowered to support the mounting portion 21 of the substrate 2. For example, the elevating mechanism 223 may be a mechanism for elevating the support tool 150, and fix the height position of the holding surface 211 of the holding table 210. That is, the height of the table 210 may be fixed and maintained, and the Z mechanism may be added to the support tool 150 side and lifted. In this case, the support tool 150 is retracted, and the holding table 210 is moved horizontally to the press-contact positions P1 and P2 to position the mounting portion 21. After the positioning is completed, the supporting tool 150 is lifted up, and is brought into contact with the lower surface of the substrate 2 to be supported. The actions thereafter are the same as described. The height position as a reference is set as a holding surface 211 for holding the table 210. The measurement of the difference d and the setting of the correction table may be the same as described above.

By fixing the height position of the holding surface 211 in this manner, it is not necessary to drive the relatively heavy holding table 210 up and down, that is, in the Z direction. In the case where the substrate 2 is a large-sized substrate, the holding table 210 is also enlarged and heavier. When the large and heavy holding table 210 is moved in the Z direction, vibrations of the holding table 210 itself, the substrate 2, and other parts become large. Therefore, product damage or a decrease in alignment accuracy may occur. Therefore, by fixing the height position of the holding surface 211, damage due to vibration prevention can be suppressed, and alignment accuracy can be improved. Further, if the holding table 210 becomes large and heavy, the load of the elevating mechanism 223 becomes large, and thus the driving section needs to be large. Further, the speed of the substrate 2 is slowed down, and the movement accuracy is lowered. Therefore, the height position of the holding surface 211 is fixed, and the driving portion in the Z direction is eliminated from the holding table 210, so that simplification and weight saving can be achieved. Further, the substrate 2 can be moved at a high speed, and the movement accuracy can be improved.

(2) The number of the groups of the crimping tool 120 and the supporting tool 150 may be one or three or more. That is, the number of the press-fit positions P may be one or three or more. The number of the mounting portions 21 in the substrate 2 is not limited to the number exemplified in the above embodiment, as long as the number is plural. The mounting portion 21 may be arranged at a position along two or more sides, not one side of the substrate 2.

(3) The holding of the substrate 2 by the holding table 210 is not limited to a vacuum chuck. For example, electrostatic chucks or mechanical chucks are also possible.

(4) The adhesive material 3 is not limited to an anisotropic conductive member, and may be a simple double-sided tape, a solution-like adhesive, or the like, in a case where the substrate 2 and the electronic component 4 do not need to be electrically connected.

Other embodiments

The present invention is not limited to the above-described embodiments, and constituent elements may be modified and embodied in an implementation stage within a range not departing from the gist thereof. Further, various inventions can be formed by appropriate combinations of the plurality of constituent elements disclosed in the above-described embodiments. For example, several constituent elements may be deleted from all the constituent elements shown in the embodiment. Further, constituent elements in different embodiments may be appropriately combined.

Claims (5)

1. A mounting device, characterized by comprising:

a crimping tool for temporarily crimping the electronic component to the plurality of mounting portions of the substrate at crimping positions, respectively, via the adhesive material;

a support tool having a support surface for supporting the substrate at the press-contact position;

a holding table having a holding surface for holding the substrate, the holding table holding the substrate so that the mounting portion protrudes from the holding surface and moving so that the mounting portion of the substrate is positioned at the pressure-bonding position;

a lifting mechanism for relatively moving the height positions of the supporting surface and the holding surface; and

and a control device that controls the lifting mechanism so that the height position of the holding surface is aligned with the height position of the supporting surface based on a correction table that sets a difference between the height position of the holding surface and the height position of the supporting surface when the mounting portion is positioned with the supporting surface at the pressure contact position for each of the positions corresponding to the plurality of mounting portions.

2. The mounting device according to claim 1, wherein the crimping tool and the supporting tool are provided with a plurality of sets,

for each set of the crimping tool and the supporting tool, a difference between a height position of the holding surface and a height position of the supporting surface in the correction table is set for each position of the holding surface corresponding to the plurality of mounting portions.

3. The mounting apparatus according to claim 1, wherein the elevating mechanism is a mechanism for elevating and lowering the holding table,

the height position of the bearing surface of the bearing tool is fixed.

4. The mounting device of claim 1, wherein the lifting mechanism is a mechanism for lifting and lowering the support tool,

the height position of the holding surface of the holding table is fixed.

5. A substrate manufacturing apparatus includes:

an adhering device for adhering the adhesive material to the substrate;

a mounting device as claimed in any one of claims 1 to 4; and

and a main crimping device for performing main crimping on the electronic component temporarily crimped to the substrate in the mounting device.