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CN115241110A - Wafer motion control method and wafer motion control system - Google Patents

Wafer motion control method and wafer motion control system Download PDF

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Publication number
CN115241110A
CN115241110A CN202210975028.1A CN202210975028A CN115241110A CN 115241110 A CN115241110 A CN 115241110A CN 202210975028 A CN202210975028 A CN 202210975028A CN 115241110 A CN115241110 A CN 115241110A
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wafer
coordinate system
check
offset
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CN115241110B (en
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田东卫
温任华
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Meijie Photoelectric Technology Shanghai Co ltd
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Meijie Photoelectric Technology Shanghai Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
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Abstract

The invention mainly relates to a motion control method and a motion control system of a wafer. A motion platform for bearing a wafer is defined to have a machine coordinate system, a plurality of groups of check values are obtained by respective walking stepping values of the motion platform on a mechanical horizontal coordinate and a mechanical vertical coordinate of the motion platform, the machine coordinate system is converted into a check coordinate system for checking errors of the motion platform according to the check values, and the check coordinate system is converted into a user coordinate system for calibrating the position of the wafer when the wafer is moved by the motion platform.

Description

Wafer motion control method and wafer motion control system
Technical Field
The present invention relates generally to the field of semiconductor wafer manufacturing technology, and more particularly, to a method and a system for controlling wafer motion in the field of semiconductor integrated circuit technology.
Background
With the development of semiconductor processes, semiconductor structures and processes become more and more complex, and alignment measurement of semiconductor structures is a necessary link in the semiconductor manufacturing process to ensure the accuracy of each process. For example, CD-SEM measurements are a more common measurement technique, and alternative optical CD measurements may be used to detect not only CD of a pattern such as photoresist, but also the relative dimensions of the cross-sectional profile of the pattern. Alignment is involved in either optical critical dimension or scanning electron microscopy or other measurements that provide information on the dimensions of semiconductor wafers.
With the advent of the information age, industries such as electronic information, communication, semiconductor integrated circuits and the like have been rapidly developed, and semiconductor wafers have been widely used, and the demand is increasing. The motion control of the wafer is not only a necessary process for transition from wafer-level processing to chip-level processing, but also a more core critical process of chip packaging. The wafer preparation technology and process have higher and higher requirements on yield, working efficiency and the like in the batch production of wafers. The semiconductor manufacturing process essentially involves wafer manipulation control, for example, the edge searching of the wafer by the traditional equipment needs to be adjusted by human resources and auxiliary tools, certain errors exist, and the edge searching is automatically and directly performed by the system quickly, efficiently and accurately. The robot hand is required to avoid scratching and damaging the wafer surface during wafer transfer.
Taking wafer positioning as an example, in the prior art, most of the conventional mechanical positioning methods are adopted, and the concept of positioning support points, such as six-point rule, is generally used when analyzing the workpiece positioning scheme. When the workpiece is actually positioned in the fixture, the theoretical point is not contacted with a direct positioning reference surface of the workpiece, but the positioning support point is converted into a specific positioning element and the like, namely positioning is realized through various types of positioning elements, namely different positioning forms are selected according to the specific structural characteristics and the process machining precision requirement of the workpiece. Such as planar, cylindrical, circular, or profiled and composite surfaces. The wafer is provided with the notch, and the center positioning can be realized through the notch, and the traditional positioning mode has the advantages of low positioning precision, low efficiency and low speed, and can damage the wafer in the clamping and calibrating process.
It should be noted that the above background description is provided only for the sake of clarity and complete description of the technical solutions of the present application, and for the sake of understanding of those skilled in the art. The present application is not considered limited to this particular application scenario merely because these schemes are set forth in the background section of the present application.
Disclosure of Invention
The application discloses a motion control method of a wafer, wherein:
defining a motion platform for bearing a wafer, wherein the motion platform is provided with a machine coordinate system, obtaining a plurality of groups of check values by respective walking stepping values of the motion platform on a mechanical abscissa and a mechanical ordinate of the motion platform, converting the machine coordinate system into a check coordinate system for checking errors of the motion platform according to the check values, and converting the check coordinate system into a user coordinate system for calibrating the position of the wafer when the wafer is moved by using the motion platform.
The method described above, wherein: respectively walking n-1 steps on a mechanical horizontal coordinate and a mechanical vertical coordinate by the motion platform to obtain n x n groups of check values; the n x n sets of check values correspond to n x n check results for the motion platform at different positions and n is a positive integer.
The method described above, wherein: the multiple groups of check values correspond to multiple check results of the motion platform at different positions, and the matrix numbers of any mechanical abscissa xm0 and any mechanical ordinate ym0 corresponding to the check results are x _ idx and y _ idx:
x_idx＝(xm0+50)/25，y_idx＝(50-ym0)/25；
the result of the check on the abscissa is SX [ y _ idx ] [ x _ idx ] = xm0+50-x _ idx 25;
the result of the check on the ordinate is SY [ y _ idx ] [ x _ idx ] = y _ idx 25-50+ yym 0.
The method described above, wherein:
the conversion of xm0 and ym0 into the calibration coordinate system results in calibration coordinates Xc with respect to the abscissa:
Xc＝xm0-(dx2-dx1)*y_offset+dx1；
wherein x _ offset = (xm 0+ 50)/25-x _ idx, y _ offset = (50-ym 0)/25-y _ idx;
dx1＝(SX[y_idx][x_idx+1]-SX[y_idx][x_idx])*x_offset+SX[y_idx][x_idx]；
dx2＝(SX[y_idx+1][x_idx+1]-SX[y_idx+1][x_idx])*x_offset+SX[y_idx+1][x_idx]。
the method described above, wherein:
the conversion of xm0 and ym0 into the calibration coordinate system yields a calibration coordinate Yc with respect to the ordinate:
Yc＝ym0-(dy2-dy1)*x_offset+dy1；
wherein x _ offset = (xm 0+ 50)/25-x _ idx, y _ offset = (50-ym 0)/25-y _ idx;
dy1＝(SY[y_idx+1][x_idx]-SY[y_idx][x_idx])*y_offset+SY[y_idx][x_idx]；
dy2＝(SY[y_idx+1][x_idx+1]-SY[y_idx][x_idx+1])*y_offset+SY[y_idx][x_idx+1]。
the method described above, wherein:
the checking coordinate system has a checking coordinate Xc about an abscissa and a checking coordinate Yc about an ordinate, the user coordinate system has an origin represented by Xorg and Yorg and an angle represented by Ang in the user coordinate system, and the user abscissa Xu and the user ordinate Yu satisfy:
Xu＝(Xc–Xorg)*Cos(Ang)-(Yc-Yorg)*Sin(Angle)；
Yu＝(Xc–Xorg)*Sin(Ang)+(Yc-Yorg)*Cos(Angle)。
the method described above, wherein: and setting the moving platform to walk from the 0 position to the 100mm position on the mechanical abscissa and the mechanical ordinate respectively, obtaining 5-by-5 groups of verification values and obtaining verification results in a 5-by-5 matrix form at different positions, wherein the stepping value is set as 25mm.
The method described above, wherein: and moving the wafer to the view of a camera for shooting key sizes on the wafer by using the motion platform.
The method described above, wherein: the camera is a camera with a microscope.
The method described above, wherein: the user coordinate system is used to locate the position of the wafer and is thereby considered as the reference coordinate for controlling the movement of the wafer (controlling the movement of the wafer, for example, including moving, transporting, placing, grasping, etc.).
The method described above, wherein: the user coordinate system is used to guide the robot to position the wafer and to transport the wafer.
The present application also relates to a motion control system for a wafer, comprising:
the edge finder is used for carrying out edge finding and finishing on the wafers with different notch directions to ensure that the notch directions of the wafers are consistent;
the manipulator is used for carrying the wafer and positioning the position of the wafer;
the motion platform is used for bearing and moving the wafer, obtaining a plurality of groups of check values by the stepping values of the motion platform walking on the mechanical abscissa and the mechanical ordinate of the motion platform respectively, and converting the machine coordinate system into a check coordinate system for checking the error of the motion platform according to the check values;
the manipulator takes the wafer from the wafer box, puts the wafer into an edge finder for edge finding, and carries the wafer to a motion platform, and the checking coordinate system is converted into a user coordinate system so as to guide the manipulator to carry the wafer at the motion platform.
The motion control system of the wafer, wherein: the wafer is moved by the motion stage to the field of view of a camera used to capture critical dimensions on the wafer.
The motion control system of the wafer, wherein: the multiple groups of check values correspond to multiple check results of the motion platform at different positions, and the matrix numbers of the arbitrarily selected mechanical abscissa xm0 and the arbitrarily selected mechanical ordinate ym0 corresponding to the check results are x _ idx and y _ idx:
x_idx＝(xm0+50)/25，y_idx＝(50-ym0)/25；
the result of the check on the abscissa is SX [ y _ idx ] [ x _ idx ] = xm0+50-x _ idx 25;
the check result on the ordinate is SY [ y _ idx ] [ x _ idx ] = y _ idx 25-50+ ym0.
The motion control system of the wafer comprises: the conversion of xm0 and ym0 into the calibration coordinate system results in calibration coordinates Xc with respect to the abscissa:
Xc＝xm0-(dx2-dx1)*y_offset+dx1；
wherein x _ offset = (xm 0+ 50)/25-x _ idx, y _ offset = (50-ym 0)/25-y _ idx;
dx1＝(SX[y_idx][x_idx+1]-SX[y_idx][x_idx])*x_offset+SX[y_idx][x_idx]；
dx2＝(SX[y_idx+1][x_idx+1]-SX[y_idx+1][x_idx])*x_offset+SX[y_idx+1][x_idx]。
the motion control system of the wafer, wherein: the conversion of xm0 and ym0 into the calibration coordinate system yields a calibration coordinate Yc with respect to the ordinate:
Yc＝ym0-(dy2-dy1)*x_offset+dy1；
wherein x _ offset = (xm 0+ 50)/25-x _ idx, y _ offset = (50-ym 0)/25-y _ idx;
dy1＝(SY[y_idx+1][x_idx]-SY[y_idx][x_idx])*y_offset+SY[y_idx][x_idx]；
dy2＝(SY[y_idx+1][x_idx+1]-SY[y_idx][x_idx+1])*y_offset+SY[y_idx][x_idx+1]。
the motion control system of the wafer comprises: the checking coordinate system has a checking coordinate Xc about an abscissa and a checking coordinate Yc about an ordinate, the user coordinate system has an origin represented by Xorg and Yorg and an angle represented by Ang in the user coordinate system, and the user abscissa Xu and the user ordinate Yu satisfy:
Xu＝(Xc–Xorg)*Cos(Ang)-(Yc-Yorg)*Sin(Angle)；
Yu＝(Xc–Xorg)*Sin(Ang)+(Yc-Yorg)*Cos(Angle)。
the motion control system of the wafer, wherein: the motion platform walks from a 0 position to a 100mm position on a mechanical abscissa and a mechanical ordinate respectively, and the walking stepping value is 25mm, so that 5-by-5 groups of check values are obtained;
the 5 x 5 sets of verification values correspond to 5 x 5 verification results of the motion platform at different positions.
The present application further relates to a wafer motion control apparatus supporting critical dimension measurement, comprising:
the edge finder is used for carrying out edge finding and finishing on the wafers with different notch directions to ensure that the notch directions of the wafers are consistent;
the manipulator is used for carrying the wafer and positioning the position of the wafer;
the camera is used for shooting the critical dimension on the wafer;
the motion platform is used for bearing and moving the wafer, obtaining a plurality of groups of check values by the stepping values of the motion platform walking on the mechanical abscissa and the mechanical ordinate of the motion platform respectively, and converting the machine coordinate system into a check coordinate system for checking the error of the motion platform according to the check values; moving the wafer to the field of view of a camera by the motion platform;
the mechanical arm takes the wafer from the wafer box, puts the wafer into an edge finder for edge finding, and carries the wafer to the motion platform, and the checking coordinate system is converted into a user coordinate system so as to guide the mechanical arm to carry the wafer at the motion platform.
The above apparatus, wherein: the camera is a camera with a microscope, and the camera adjusts the objective lens multiple of the microscope and moves the camera and the microscope objective lens on the Z axis at the stage of shooting the critical dimension of the wafer so as to achieve the purpose of enabling the wafer to be in the focal plane of the camera. The advantages are that: when the wafer is placed on the measuring platform, the wafer needs to be positioned on the focal plane of the camera to enable the visual field of the camera to be clear and the resolution to be high, and the focal plane with the clearest visual field of the camera can be found by driving the camera and the lens to move up and down through the Z-axis movement module.
The application also relates to a motion control method of the wafer, wherein:
defining a motion platform for bearing a wafer, wherein the motion platform is provided with a machine coordinate system, obtaining a plurality of groups of check values by respective walking stepping values of the motion platform on a mechanical abscissa and a mechanical ordinate of the motion platform, converting the machine coordinate system into a check coordinate system for checking errors of the motion platform according to the check values, and converting the check coordinate system into a user coordinate system for calibrating the position of the wafer, wherein the user coordinate system is taken as a reference coordinate for controlling the motion of the wafer.
The traditional semiconductor equipment adjusts the edge searching of the wafer by means of manpower and tools thereof, has certain errors, and the automatic edge searching department directly carries out the edge searching adjustment rapidly, efficiently and accurately through the system. And the robot transmits the wafer, so that scratches and damages to the surface of the wafer are effectively avoided, and especially, the motion (transmission) control method of the wafer described above ensures the nondestructive wafer transmission of the wafer. And the measurement efficiency and accuracy can be greatly improved by matching with the CHUCK platform module.
Drawings
To make the above objects, features and advantages more comprehensible, embodiments accompanied with figures are described in detail below, and features and advantages of the present application will become apparent upon reading the following detailed description and upon reference to the following figures.
FIG. 1 is a schematic view of a motion stage loaded with a wafer and metrology equipment equipped with a microscope camera.
FIG. 2 is a diagram of an edge finder for finding edges of wafers with different notch directions and making the notch directions of the wafers consistent.
Fig. 3 is a schematic view of a wafer transfer robot for carrying or transporting and positioning a semiconductor wafer.
Fig. 4 shows the need for a transformation of the coordinate system, for example a transformation of the machine coordinate system with a calibration coordinate system.
Fig. 5 is a conversion of the machine coordinate system and the calibration coordinate system and a conversion of the user coordinate system and the calibration coordinate system.
Figure 6 is a flow chart of an edge finder operation involved in the overall wafer motion control system.
Figure 7 is a flow chart of one robot blade involved in the motion control system for the entire wafer.
Detailed Description
The present invention will be described more fully hereinafter with reference to the accompanying examples, which are intended to illustrate and not to limit the invention, but those skilled in the art, on the basis of which they may obtain without inventive faculty, without departing from the scope of the invention.
Referring to fig. 1, the necessary knowledge involved in the present application will be described. The semiconductor fabrication art wafer generally refers to the silicon wafer used to fabricate integrated circuits. A metrology stage or motion stage 11 of the cd metrology apparatus is used to carry the wafer 10. The microscope and camera CA cooperate or are assembled together to capture fine wafer detail images. The microscope has a high power lens and a low power lens and the magnification of the lenses can be switched manually or automatically in a series of lenses LN. Such as switching from high power to medium power or to low power, or performing the opposite lens switching operation, such as switching from low power to medium power or to high power. This multiple switching relationship for the lenses includes on-axis switching.
Referring to fig. 1, with respect to leveling of the wafer 10: if the wafer 10 is not angled when placed on the measurement platform or motion platform 11, i.e. there is an angle θ between the XY coordinate system of the wafer 10 and the XY coordinate system of the measurement platform of the measurement apparatus. Thus, the wafer 10 is moved in a tilted posture while moving the metrology stage or motion stage 11. Such as once the X-axis of motion stage 11 is moved, the row of wafers in the camera field of view changes but it is desirable that the row of wafers in the field of view does not change. In addition, the measured measurements including critical dimensions are naturally inaccurate if the wafer 10 angle is not adapted. The motion platform 11 or actuation platform.
Referring to fig. 1, wafer 10 leveling is, in an alternative embodiment, a step preferably performed prior to measurement. For example, the angle θ between the XY coordinate system of the wafer 10 and the XY coordinate system of the metrology stage is as small as possible, so that the wafer is in a relatively parallel relationship with the metrology stage or motion stage, preferably both in a horizontal position. Note that the operations of adjusting the position of the wafer mentioned in the present application include: the angle of the wafer with respect to the stage coordinate system may be determined and adjusted by θ, for example, such that the X coordinate system of the wafer coincides with or is parallel to the X coordinate system of the metrology stage and such that the Y coordinate system of the wafer coincides with or is parallel to the Y coordinate system of the metrology stage. Such as theta tends to approach zero. This is the wafer leveling process.
Referring to fig. 1, an alternative process for leveling a wafer 10: finding the left mark and the right mark on the same line on the wafer 10 and then manufacturing a leveling template, using the left mark on the wafer 10 as a template, and calculating the included angle of the wafer 10 relative to the measuring platform according to the stage coordinates of the left mark and the right mark and the pixel coordinates matched with the template. In an alternative embodiment the left and right marks on this line are designated as 10a and 10b, respectively, of the wafer (indicated in the figure).
Referring to fig. 1, the stage coordinates of the left marker 10a are (X1, Y1), while the pixel coordinates of the left marker 10a are (PX 1, PY 1). The pixel coordinates of the left mark 10a can be photographed by the camera CA through the microscope and its lens or objective lens and the so-called pixel coordinates can be extracted and recognized from the photographed image.
Referring to fig. 1, for example, the image position point of the left mark 10a is 10' a within the pixel coordinates, and the pixel coordinates of the left mark 10a are (PX 1, PY 1) at the corresponding coordinate positions of the image.
Referring to fig. 1, the stage platform coordinates of the right marker 10b are (X2, Y2), while the pixel coordinates of the right marker 10b are (PX 2, PY 2). The pixel coordinates of the left mark 10b can be photographed by the camera CA through the microscope and its lens and the so-called pixel coordinates can be extracted and recognized from the photographed image.
Referring to fig. 1, the image position point of the right mark 10b is, for example, 10' b in the pixel coordinates, and the pixel coordinates of the right mark 10b are (PX 2, PY 2) at the corresponding coordinate positions of the image. Note that a platform coordinate system defined for the critical dimension measurement is a predetermined coordinate system and the coordinates of the motion platform 11 are the coordinate positions to which the motion platform 11 moves, and it is noted that the difference between the platform coordinate system and the position coordinates of the motion platform 11 is distinguished. For example, assuming CD-MAC represents an industry critical dimension metrology tool, the stage coordinate system is a coordinate system previously designed for the metrology tool, within which the motion stage can be moved along the abscissa X and the ordinate Y as desired. The platform coordinate system may also be named in this application with a preset coordinate system or system coordinate system to avoid confusion.
Referring to fig. 1, θ = arctan { [ (Y1-Y2) + (PY 1-PY 2) × K1 ]/[ (X1-X2) + (PX 1-PX 2) × K1] }. From the parameter content of this angle, the angle θ is closely related to the stage platform coordinates (X1, Y1) of the left marker 10a, the pixel coordinates (PX 1, PY 1) of the left marker 10a, and the stage platform coordinates (X2, Y2) of the right marker 10b, the pixel coordinates (PX 2, PY 2) of the right marker 10 b. Therefore, it is important to set the left and right marks having obvious coordinate difference on the same line or the same straight line on the wafer, and the better left and right marks should be properly separated to ensure proper resolution to identify the angle, which is further used as the basis for judging whether the wafer is horizontal.
Referring to fig. 1, arctan in the angle θ relation is an arctan function.
Referring to fig. 1, the viewing field verification coefficient of the camera CA is K1. The coefficient K1 is a preset value. Therefore, the angle theta can be used for judging the angle of the wafer relative to the platform coordinate system and adjusting the angle of the wafer relative to the platform coordinate system. Manual adjustment of theta for the wafer relative to the platform coordinates is possible, but automatic adjustment of theta by the motion platform can improve efficiency and accuracy. It is noted that the calculation of the angle θ is unique to the present application, and after the calculation of θ, the improvement of the angle θ by adjusting the relative position between the motion stage and the wafer can be accomplished by the prior art. In other words, similar schemes how to adjust the relative positional relationship between the motion stage and the wafer have been described in the prior art. For example, by rotating the wafer in the plane of the wafer such that the angle θ is infinitely close to a predetermined value (e.g., zero), and then adjusting the line with the left and right markers 10a, 10b to be approximately coincident or parallel with the X-axis of the table coordinate system.
Referring to fig. 1, efficient and accurate measurement is a measurement ruler for the mass production line of semiconductors, which plays an important role in monitoring and preventing process variation. The following discussion is provided to explain the application of critical dimension measurement in LSI production and related problems.
Referring to fig. 1, in the integrated circuit manufacturing process, a photoresist is first coated on the surface of a wafer. The photoresist is then exposed through a photomask. And then post exposure baking is performed. For positive-working chemically amplified resists, this initiates a deprotection reaction that allows the developer to more readily dissolve the resist in the exposed areas, thereby allowing the resist in the exposed areas to be removed during subsequent development to produce the desired resist pattern. Subsequent post-development testing may follow. Post-development inspection includes, for example, electron microscopy or optical metrology of the critical dimensions of the photoresist pattern to determine whether it meets specifications. If the specification is met, an etching process is performed to transfer the photoresist pattern onto the wafer. Removing the glue, etching and detecting.
Referring to fig. 1, the lithography example described above shows that Critical Dimension (CD) measurement is crucial. The critical dimension is designed into a special line pattern reflecting the characteristic line width of the integrated circuit in order to evaluate and control the pattern processing precision of the process in the integrated circuit photomask manufacturing and photoetching process. This document aims to make high precision measurements of critical dimensions. The critical dimension reference terms referred to herein may also be replaced by critical dimension features or critical dimension marks.
Referring to fig. 1, the semiconductor manufacturing process is indispensable and involves wafer manipulation control, for example, the edge searching of the wafer by the conventional equipment is adjusted by human resources and auxiliary tools, and there is a certain error, and the automatic edge searching is directly performed by the system to perform edge searching adjustment rapidly, efficiently and accurately. The manipulator conveys and carries the wafer, so that scratches and damage to the surface of the wafer can be effectively avoided; and the cooperation of the bearing plate or the bearing platform or the bearing table (CHUCK) platform module can greatly improve the measuring efficiency and accuracy on the whole. The motion platform 11 belongs to the class of load-bearing tables. Some documents also refer to this type of carrier as a carrier or lift mechanism, wafer carrier or platform, carrier platform, and the like.
Referring to fig. 1, the critical dimension measuring apparatus of the semiconductor industry includes at least a motion stage 11 and a camera CA equipped with a microscope. The critical dimension measuring device may be a retrofit of a current critical dimension measuring device or a completely new critical dimension measuring device. In addition, in view of the critical dimension measurement apparatus already existing in the semiconductor industry, the present application does not describe the critical dimension measurement apparatus separately, and it should be noted that all or part of the technical features of the critical dimension measurement apparatus in the prior art can be applied to the measurement apparatus in the present application. This application defaults to the measurement of critical dimensions as it includes all or part of the prior art features.
Referring to fig. 1, at present, many wafer manufacturers have higher requirements on the degree of automation of equipment, higher requirements are provided for the feeding speed and the position accuracy of a wafer during feeding, and a part of wafer inclination correction and positioning work still needs a manual adjustment motor to complete the work of alignment and the like, and an automatic adjustment method with higher automation is also provided. The main doubts of the work of inclination correction, positioning and the like used at present are that the operation is complicated, the precision is not high and the error is easy to occur.
Referring to fig. 1, regarding Critical Dimension (CD): in the integrated circuit photomask manufacturing and photoetching process, a special line pattern reflecting the characteristic line width of the integrated circuit is specially designed for evaluating and controlling the pattern processing precision of the process.
Referring to fig. 1, for platform (CHUCK): the wafer adsorption and bearing tool is a special tool for adsorbing and bearing wafers in the production process of various semiconductor silicon wafers and is mainly used for bearing wafers (wafers).
Referring to fig. 1, the platform motion control module: the device consists of an X axis, a Y axis, a theta axis and a CHUCK, and before the measuring equipment measures the critical dimension of the wafer, the CHUCK is driven to move by a platform motion control module, so that the movement control of the wafer is realized. The theta axis can rotate, for example, the theta axis is rotated to drive the CHUCK to rotate, which is equivalent to adjusting the value of the angle theta by controlling the rotation of the motion platform.
Referring to fig. 1, the focusing Z-axis motion module of the camera CA: the wafer measuring device consists of a Z axis which can move up and down, when the wafer is placed on a measuring platform such as the platform 11, the wafer needs to be arranged at a focal plane of a camera if the visual field of the camera CA is clear and the resolution is high, and the Z axis movement module can drive the camera and a lens to move up and down so as to find the focal plane with the clearest visual field of the camera. I.e., finding the focal plane of the critical dimension structure on the wafer.
Referring to fig. 2, for a Wafer edge finder (Wafer Aligner): the wafer with different directions and different sides is arranged, the directions of different wafer gaps are consistent, the wafer gap is a notch formed on the wafer, and the position of the wafer or the silicon wafer is often determined through the gap (notch) in the semiconductor industry, so that the opposite sides of the wafer or the silicon wafer are realized. For details of the wafer edge finder, see published chinese patent documents such as CN202434487U, CN209496830U, CN110459488A, and CN 113707587A. Another name of the edge finder is a wafer edge finder positioning device.
Referring to fig. 2, the edge finder 15 includes an adsorption plate 18 capable of moving along the X-axis or the Y-axis, and if a robot or other handling tool places a wafer on the adsorption plate 18, the edge finder 15 performs adsorption on the wafer and then performs transverse or longitudinal movement along the X-axis or the Y-axis or rotational movement along the Theta rotation axis in the rotation direction, so as to arrange the wafers on different sides in different directions and make the notch directions (notch) consistent. Fig. 2 is a top view of the edge finder, which shows in detail the lateral movement, the longitudinal movement and the rotational movement of the edge finder along the X-axis, the Y-axis and the Theta-axis. The wafer edge finder or the wafer edge finding positioning device falls into the scope of the prior art in the present application, and therefore, the detailed description thereof is omitted.
Referring to fig. 3, regarding the sheet conveying robot: semiconductor robots are generally comprised of controllers, drivers, arms, and end effectors, and are mainly used in semiconductor front-end processes such as integrated circuit and chip manufacturing for handling, transporting, and positioning semiconductor wafers. The chip transfer refers to the transfer of chips or wafers. The traditional manipulator also belongs to the field of the prior art, for example, see the published chinese patent application documents such as CN106313053A, CN206524313U, CN102189542A, etc. or the related information. The wafer conveying manipulator refers to a manipulator used by semiconductor production equipment or a manipulator used by the semiconductor production equipment for grabbing, transporting and carrying wafers.
Referring to fig. 3, the top view of the figure is a top view of an alternative type of robot and the bottom view of the figure is a cross-sectional view of the same alternative type of robot. The manipulator 25 module realizes transverse motion, longitudinal motion, up-down motion and rotary motion by four axes of an X axis, a Y axis, a Z axis and a Theta axis respectively. The upper diagram of fig. 3 shows the robot rotating along Theta axis, such as the robot 25 grasping the wafer and rotating counterclockwise (+ CW) along Theta axis or rotating clockwise (-CCW) along Theta axis, which is free to rotate. The bottom view of fig. 3 shows a schematic view of the robot moving laterally along the X-axis, such as a lateral rightward (+ CW) movement along the X-axis after the robot 25 grabs a wafer or a lateral leftward (-CCW) movement along the X-axis in the opposite direction. The lower-figure robot 25 of fig. 3 is also movable along a longitudinal Y-axis perpendicular to the X-axis, see the coordinate example of fig. 1. The bottom view in fig. 3 shows a schematic of the robot moving up and down along the Z-axis, such as the robot 25 grasping the wafer and moving up (+ CW) or up and down along the Z-axis with the opposite downward (-CCW) motion. The wafer robot or the wafer transfer robot belongs to the field of the prior art in the present application, and therefore, the detailed description thereof is omitted. The Theta (i.e., TH) axis may be referred to as the TH axis.
Referring to fig. 1, the film transfer motion control module: the Wafer edge finder mainly comprises a Wafer edge finder (Aligner) and a manipulator, wherein the manipulator firstly takes a Wafer from a Wafer Cassette (Wafer Cassette), then puts the Wafer on the edge finder for edge finding, and then puts the taken Wafer on a CHUCK platform. The robot grips, picks, places, transports, and positions the semiconductor wafer according to the user coordinate system. The edge searching of the traditional equipment for the wafer is adjusted by means of manpower and tools, certain errors exist, but the edge searching is automatically carried out, and the edge searching adjustment is directly carried out rapidly, efficiently and accurately through a system; the transmission of the manipulator to the wafer can effectively avoid the scratch and the damage to the surface of the wafer; and the cooperation of the CHUCK platform module can greatly improve the measurement efficiency and accuracy on the whole. Fig. 1-3 may be combined together as functional modules of an apparatus, most typically a cd metrology apparatus generally including edge finders and robots, etc. the foregoing description may be considered as a part of the functionality or components of the cd metrology apparatus.
Referring to fig. 1, the platform motion control module: the motion of the CHUCK platform is realized by an X-axis, a Y-axis and a theta-axis, and it is noted that the mechanical coordinate of the X-axis can be represented by Xm and the mechanical coordinate of the Y-axis can be represented by Ym, which belong to a machine coordinate system. If applied to critical dimension measurement, the coordinate system may be transformed before measurement, such as transformation of the machine coordinate system and the verification coordinate system, transformation of the user coordinate system and the verification coordinate system. The machine coordinate system and the user coordinate system are the conventional definition of coordinates by the industry boundaries. As can be explained in connection with fig. 2-3.
Referring to FIG. 1, a platform motion control module is described below, as explained below:
the platform motion control module completes motion through an X axis, a Y axis and a theta axis.
The X-axis of the platform motion control module performs a horizontal motion, the Y-axis performs a vertical motion, and an interpolation motion can be performed.
The theta axis of the stage motion control module performs a rotational motion.
The chuck stage of the stage motion control module carries a wafer (wafer).
Referring to fig. 4, the principle: the machine coordinate system is represented by Xm and Ym, the user coordinate system is represented by Xu and Yu, and the verification coordinate system is represented by Xc and Yc. The establishment of the checking coordinate system needs to check an error value of the CHUCK platform, which is called a checking value hereinafter, and the checking value is represented by two-dimensional arrays StageErrorX [ ], stageErrorY [ ] [ ]. Note that in this application case may represent the same transaction, e.g. mechanical coordinates (xm, ym) and user coordinates (xu, xu) and the check coordinate system is denoted (xc, yc) without affecting their understanding.
Referring to fig. 4, in an alternative embodiment, the check value is obtained as follows:
the mechanical coordinates (Xm 0, ym 0) are obtained, and as already described above, the motion of the CHUCK stage is realized by the X-axis, the Y-axis and the so-called θ -axis, the mechanical coordinates of the X-axis are denoted by Xm and the mechanical coordinates of the Y-axis are denoted by Ym and they belong to the machine coordinate system. The CHUCK platform in fig. 4 can be seen in fig. 1.
The machine coordinates (xm 0, ym 0) can be converted into predetermined area coordinates (x _ val, y _ val). For example, the machine coordinates may be converted to an upper left zone coordinate. For ease of illustration, the XY-axis coordinates of the CHUCK stage are mapped in fig. 4 into one of the illustrated mechanical coordinate matrices (represented by matrix 21).
double x_val＝xm0+50。
double y_val＝50-ym0。
double is a type of computer language, i.e. double precision floating point type. The application may run on a computer or server or similar processing unit. Other alternatives on the processing unit: a field programmable gate array, a complex programmable logic device or a field programmable analog gate array, or a semi-custom ASIC or processor or microprocessor, or a digital signal processor or integrated circuit or a software firmware program stored in a memory, or the like. The Double notation indicates that the type of the calculated value is a Double-precision floating-point type, and the following includes int and other types.
The current matrix position number (x _ idx, y _ idx) is calculated. Usually, a plurality of groups of check values correspond to a plurality of check results (represented by a matrix 22) of the moving platform at different positions, and a mechanical abscissa xm0 and a mechanical ordinate ym0 correspond to matrix numbers x _ idx and y _ idx of the check results.
int x_idx＝(int)Math.Round(x_val/25)。
int y_idx＝(int)Math.Round(y_val/25)。
int is an identifier of a type of computer language, i.e. a variable defining an integer type. Round refers to first rounding floating point type data and then rounding.
Calculating a platform check value:
double x_error＝x_val-x_idx*25。
double y_error＝y_idx*25-y_val。
the check value then needs to be saved:
StageErrorX[y_idx][x_idx]＝x_error。
StageErrorY[y_idx][x_idx]＝y_error。
referring to fig. 4, the way and manner of obtaining the check value is given in an alternative embodiment. It is noted that for the sake of convenience of calculation, stageErrorX may be simplified to the abbreviation SX, stageErrorY may be simplified to the abbreviation SY. Therefore, when the error value of the CHUCK platform, which is called check value in the context, needs to be checked first, the check value can be directly represented by two-dimensional arrays StageErrorX [ ], stageErrorY [ ] [ ], or simplified SX [ ], SY [ ].
For example, stageErrorX [ y _ idx ] [ x _ idx ] = SX [ y _ idx ] [ x _ idx ].
And for example, stageErrorY [ y _ idx ] [ x _ idx ] = SY [ y _ idx ] [ x _ idx ].
Referring to FIG. 4, in an alternative embodiment, the machine coordinate system to check coordinate system scheme is as follows:
the machine coordinates (xm 0, ym 0) can be converted into predetermined area coordinates (x _ val, y _ val). For example, the machine coordinates may be converted to an upper left region coordinates, which is the same as the previous conversion.
double x_val＝xm0+50。
double y_val＝50-ym0。
Calculating the matrix position number x _ idx, y _ idx where the current position (see fig. 4 and matrix 21) is located:
int x_idx＝(int)(x_val/25)。
int y_idx＝(int)(y_val/25)。
using x _ offset, y _ offset as intermediate variables in the calculation phase:
double x _ offset = x _ val/25-x _ idx. Or x _ offset = (x _ val/25) -x _ idx.
double y _ offset = y _ val/25-y _ idx. Or y _ offset = (y _ val/25) -y _ idx.
Note that dx1, dx2, dx are the calculated intermediate variables:
double dx1＝(StageErrorX[y_idx][x_idx+1]-StageErrorX[y_idx][x_idx])*x_offset+StageErrorX[y_idx][x_idx]。
double dx2＝(StageErrorX[y_idx+1][x_idx+1]-StageErrorX[y_idx+1][x_idx])*x_offset+StageErrorX[y_idx+1][x_idx]。
double dx＝(dx2-dx1)*y_offset+dx1。
the verified Xc is calculated from the above values:
Xc＝xm0-dx。
referring to fig. 4, in an alternative embodiment, it is described above that the x m0 and ym0 obtain the check coordinates Xc with respect to the abscissa during the conversion to the check coordinate system, and it is described below that the x m0 and ym0 obtain the check coordinates Yc with respect to the ordinate during the conversion to the check coordinate system.
Note that dy1, dy2, dy are calculated intermediate variables:
double dy1＝(StageErrorY[y_idx+1][x_idx]-StageErrorY[y_idx][x_idx])*y_offset+StageErrorY[y_idx][x_idx]。
double dy2＝(StageErrorY[y_idx+1][x_idx+1]-StageErrorY[y_idx][x_idx+1])*y_offset+StageErrorY[y_idx][x_idx+1]。
double dy＝(dy2-dy1)*x_offset+dy1。
the Yc after verification is calculated from the above values:
Yc＝ym0-dy。
referring to fig. 4, the functional formula is marked with a plus sign "+" and a minus sign "-" and a multiplier sign "-" respectively.
Referring to fig. 4, it is necessary to convert the calibration coordinate system to the user coordinate system, and the establishment of the user coordinate system requires to set the origin of the coordinate system, which is expressed by Xorg and Yorg. Such as the origin of the user coordinate system.
Firstly, carrying out translation calculation to obtain x and y:
double x＝Xc-Xorg。
double y＝Yc-Yorg。
then, a rotation calculation is performed, angle (abbreviated as Ang) is the Angle of the user coordinate system:
Xu＝(double)(x*Math.Cos(Angle)-y*Math.Sin(Angle))。
Yu＝(double)(x*Math.Sin(Angle)+y*Math.Cos(Angle))。
wherein, math.Cos is a cosine value of the calculated angle, and Math.sin is a sine value of the calculated angle.
Referring to fig. 4, a desired user coordinate system is thereby established: the machine coordinate is expressed by (Xm, ym), the user coordinate system is (Xu, yu), the checking coordinate system is (Xc, yc), and the array StageErrorX [ ], stageErrorY [ ] indicates that the error value of the CHUCK platform needs to be checked first (called checking value or checking result).
Referring to fig. 4, in an alternative embodiment, the motion platform 11 (e.g., the CHUCK platform) travels n-1 steps on the machine abscissa and the motion platform 11 travels n-1 steps on the machine ordinate, and a set of calibration values representing the abscissa and the ordinate exist at any step including the origin, and are summed to obtain n sets of calibration values. The n × n groups of verification values correspond to n × n verification results of the motion platform 11 at different positions, and n is a positive integer.
Referring to fig. 4, in an alternative embodiment, 25mm is taken as a calibration unit, and the X-axis direction and the Y-axis direction are respectively moved from 0 to 100mm, so that 25 sets of calibration values of 5 × 5 can be obtained, which respectively correspond to the calibration values (SX [ ], SY [ ]) of different positions of the CHUCK platform, i.e. a matrix of 5 × 5. The check unit is the distance of each step of the moving platform (or called step value of walking), the step value of walking is equal to the check unit of 25mm, 5 × 5 groups of check values are obtained, and a check result in the form of 5 × 5 matrixes at different positions is obtained.
Referring to fig. 4, in an alternative embodiment, matrix 21 represents 25 sets of 5 × 5 verification values obtained from the motion platform at positions from 0 to 100mm along the X-axis and the Y-axis, respectively, and they correspond to the verification values or verification results at different positions of the CHUCK platform (also a 5 × 5 matrix 22). The error value of the CHUCK platform is alternatively referred to as a check value (this check value is represented by the two-dimensional array StageErrorX [ ] [ ], stageErrorY [ ] [ ]). The motion platform travels to each location where there is a corresponding machine coordinate (e.g., xm0, ym0; xm0, ym4; xm4, ym0; xm4, ym 4), and then each machine coordinate has its own corresponding user coordinate. For example, the machine coordinates xm0, ym0 have their own user coordinates Xc, yc in the present application as an example, whereas other machine coordinates xm4, ym4 naturally also have their own user coordinates (calculated analogously to xm0, ym 0).
Referring to fig. 4, in an alternative embodiment, one may consider: the matrix numbers of the check result corresponding to any mechanical coordinate (such as xm0, ym 0) are x _ idx and y _ idx. Therefore, any mechanical coordinate is acquired to a check value and converted to a check coordinate system, and the check coordinate system is further converted to a user coordinate system. This embodiment is directly exemplified in the foregoing by the mechanical abscissa xm0 and the mechanical ordinate ym0.
Referring to fig. 4, in an alternative embodiment, one may consider: the matrix numbers of the check result corresponding to any mechanical coordinate (such as xma, ymb) are x _ idx and y _ idx. Therefore, any mechanical coordinate is acquired to a check value and converted to a check coordinate system, and the check coordinate system is further converted to a user coordinate system. In this embodiment, it is necessary to replace xm0 in the verification result with xma and ym0 with ymb, replace xm0 in x _ idx and y _ idx with xma, and replace ym0 with ymb, and replace xm0 in Xc and Yc with xma and ym0 with ymb. Any reference to mechanical coordinates at this time may refer to any one of a series of mechanical coordinates (e.g., xm0, ym0; xm0, ym4; xm4, ym 4), such as xm0, ym0 or xm0, ym4 or xm4, ym 4.
Referring to fig. 4, in an alternative embodiment, with respect to the motion control method of the wafer: defining a motion platform 11 for carrying the wafer to have a machine coordinate system, obtaining a plurality of groups of check values by the step values of the motion platform 11 walking on the mechanical abscissa and the mechanical ordinate of the motion platform, converting the machine coordinate system into a check coordinate system for checking the error of the motion platform 11 according to the check values, and converting the check coordinate system into a user coordinate system for calibrating the position of the wafer when the motion platform 11 is used for moving the wafer. The motion control of the wafer after obtaining the user coordinate system has the following basis: for example, the robot arm may perform movements such as handling a wafer, transporting a wafer, placing a wafer, grabbing a wafer, etc. according to the user coordinate system, so the user coordinate system may be regarded as a reference coordinate for controlling the movement of the wafer.
Referring to fig. 4, in an alternative embodiment, n × n sets of calibration values are obtained by the motion platform 11 walking n-1 steps on the machine abscissa and the machine ordinate respectively; the n × n groups of verification values correspond to n × n verification results of the motion platform 11 at different positions. n is a positive integer.
Referring to fig. 4, in an alternative embodiment, the plurality of sets of verification values correspond to a plurality of verification results for the motion platform 11 at different locations. In an alternative embodiment, the mechanical abscissa xm0 and the mechanical ordinate ym0 correspond to the matrix numbers x _ idx and y _ idx of the verification result, and are denoted by stagererrx [ ], stagererry [ ] [ ]:
x_idx＝(xm0+50)/25，y_idx＝(50-ym0)/25；
the result of the check on the abscissa is SX [ y _ idx ] [ x _ idx ] = xm0+50-x _ idx 25.
The result of the check on the ordinate is SY [ y _ idx ] [ x _ idx ] = y _ idx 25-50+ yym 0.
Referring to fig. 4, in an alternative embodiment, the conversion of any selected xm0 and ym0 into the check coordinate system yields the check coordinates Xc with respect to the abscissa:
Xc＝xm0-(dx2-dx1)*y_offset+dx1。
wherein x _ offset = (xm 0+ 50)/25-x _ idx, y _ offset = (50-ym 0)/25-y _ idx.
dx1＝(SX[y_idx][x_idx+1]-SX[y_idx][x_idx])*x_offset+SX[y_idx][x_idx]。
dx2＝(SX[y_idx+1][x_idx+1]-SX[y_idx+1][x_idx])*x_offset+SX[y_idx+1][x_idx]。
Referring to fig. 4, in an alternative embodiment, the conversion of any selected xm0 and ym0 into the check coordinate system yields the check coordinate Yc with respect to the ordinate:
Yc＝ym0-(dy2-dy1)*x_offset+dy1。
wherein x _ offset = (xm 0+ 50)/25-x _ idx, y _ offset = (50-ym 0)/25-y _ idx.
dy1＝(SY[y_idx+1][x_idx]-SY[y_idx][x_idx])*y_offset+SY[y_idx][x_idx]。
dy2＝(SY[y_idx+1][x_idx+1]-SY[y_idx][x_idx+1])*y_offset+SY[y_idx][x_idx+1]。
Referring to fig. 4, in an alternative embodiment, the check coordinate system has a check coordinate Xc about an abscissa and a check coordinate Yc about an ordinate, the user coordinate system has an origin represented by Xorg and Yorg, the user coordinate system has an angle represented by Ang, and the user abscissa Xu and the user ordinate Yu satisfy:
Xu＝(Xc–Xorg)*Cos(Ang)-(Yc-Yorg)*Sin(Angle)。
Yu＝(Xc–Xorg)*Sin(Ang)+(Yc-Yorg)*Cos(Angle)。
referring to fig. 4, in an alternative embodiment, the motion stage 11 may be configured to travel from 0 to 100mm positions on the machine abscissa X and machine ordinate Y, respectively, to obtain 5X 5 sets of calibration values and to obtain calibration results in the form of a 5X 5 matrix of different positions, where the stepping value or calibration unit is 25mm. In an alternative embodiment, the wafer is moved using a motion stage to a camera field of view for capturing critical dimensions on the wafer. In an alternative embodiment, the robot is guided to position and transport the wafer using the user coordinate system.
In the prior art, a wafer vision detection control system based on machine vision positioning is also arranged, so that the wafer is controlled, such as wafer correction positioning and the like. The visual scheme relates to the wafer online automatic control integrating image acquisition, data processing, mechanical movement and information display, can greatly improve the running speed and the positioning accuracy, but has higher requirements on the working content. The image data acquired by the camera and the way it is processed should be reasonable to meet the requirements of speed of operation and positioning accuracy. Selection of the appropriate mode implementation is necessary for wafer motion control and operation.
Referring to fig. 5, in an alternative embodiment, the CHUCK stage motion is implemented by X, Y, and θ axes, the mechanical coordinates of the X axis are denoted by Xm, and the mechanical coordinates of the Y axis are denoted by Ym, which belong to a machine coordinate system. Taking the cd measuring apparatus as an example, before measurement, the coordinate system needs to be transformed, the machine coordinate system is transformed into the verification coordinate system, and the user coordinate system is transformed into the verification coordinate system, as shown in fig. 5.
Referring to fig. 5, in an alternative embodiment, the mechanical abscissa xm0 and the mechanical ordinate ym0 are conditioned to satisfy the angle θ = arctan { [ (Y1-Y2) + (PY 1-PY 2) × K1] ÷ [ (X1-X2) + (PX 1-PX 2) × K1] }. The value of the angle should then conform to the fact that θ infinitely approaches or equals the preset value, the matrix numbers x _ idx and y _ idx being more precise. The wafer is provided with left and right marks on the same line, and the angle between the platform coordinate system or the machine coordinate system and the wafer is theta.
The left marker table coordinates are (X1, Y1) and the camera takes its pixel coordinates through the microscope as (PX 1, PY 1).
The right marker table coordinates are (X2, Y2) and the camera takes its pixel coordinates through the microscope (PX 2, PY 2).
The angle of the wafer relative to a platform coordinate system or a machine coordinate system is judged and adjusted according to theta, and K1 is a preset view field check coefficient. Originally x _ idx = (xm 0+ 50)/25, y \uidx = (50-ym 0)/25: in other alternative examples after modification, x _ idx = (xm 0+ 50)/25-tan (θ × (xm 0)), y _ idx = (50-ym 0)/25-tan (θ × (ym 0)); the purpose is to map the angle error into the matrix number (the angle is θ), and the factors of checking the result error and checking the coordinate transformation error, which may otherwise be caused by the angle, can be corrected well in this alternative example. The reason is that the hidden state of the angle cannot guarantee that the check value is a real and effective value (and the caused deviation is hard to be perceived), and further, the mapping relation difference between the check result corresponding to the mechanical coordinate and the matrix number is thousands of miles. It should be noted that, if the application scenario is a micron or even nanometer critical dimension wafer, the slight error is enough to slightly distort the motion trajectory and posture of the wafer and bring a series of negative effects therewith: the wafer position which is not touched by the mechanical arm, the deviation of the wafer critical dimension structure from the visual field with the clearest camera and the highest resolution, and inaccurate measurement results of the critical dimension. And so on.
Referring to FIG. 6, in an alternative embodiment, the edge finder operational flow diagram includes steps ST1-ST10. Usually, the edge finder has a slightly different operation flow if the edge finder is designed in different types. The edge finder is suitable for the examples of fig. 1-4.
Referring to fig. 6, the edge finder is powered up immediately after the start, ST1, and the edge finder is powered up in step ST2, and the operator can set a specific type on the edge finder according to the type of wafer to be operated. Conventional silicon wafers based on silicon substrates are a common wafer type. For the third generation semiconductors represented by silicon carbide and gallium nitride, the 6 "and 4" wafer substrates are common due to the characteristics of the materials and the processing capability of the corresponding chips. Unlike silicon wafers, silicon carbide wafers are mostly transparent materials, and the transparent property of the materials also generates some special requirements for wafer carrying devices inside semiconductor equipment. For example, under certain process conditions, it is necessary to make the bottom of the transparent material hollow, that is, the lower surface of the material and the surface of the material adjacent to the carrying device need to maintain a certain spatial distance, so as to meet the requirement of the optical system inside the device. It is necessary to set the type of substrate on the edge finder according to the type of wafer to be worked, see step ST3.
Referring to fig. 6, the edge finder performs step ST4, i.e., the X-axis, Y-axis, theta-axis of the edge finder each return to zero or they return to their original positions. The zero position is used as the starting position of three axes of the edge finder.
Referring to fig. 6, setting the wafer size to the edge finder is step ST5, and the operator may set a specific size on the edge finder according to the size of the wafer to be operated. In the field of semiconductor wafer manufacturing, as the capability of chip manufacturing processes is improved and the sizes of wafers are continuously increased, the outer diameter sizes of wafer bare chips currently include 12 inches, 8 inches, 6 inches and 4 inches, and wafer substrates with different sizes are used for manufacturing different types of chips. For wafers with different outer diameter sizes, the wafer grabbing and bearing device of the semiconductor equipment has corresponding requirements and differences, and in consideration of various performances and economy of the equipment, the single equipment for semiconductor wafer production can achieve wafer size compatibility to a certain extent, for example, the equipment is generally accepted in the industry to be compatible with 12 inches, 8 inches, 6 inches, 4 inches and other wafer sizes.
Referring to fig. 6, step ST6 is to set the angle value of the wafer notch at the time of completing edge finding to the edge finder. Although the position and the direction of the notch of each wafer can be adjusted at the edge finder, the angle value of the notch can be reasonably adjusted according to actual requirements for convenience of operation. The operator can set the notch angle value according to actual requirements.
Referring to fig. 6, step ST7 is to move the wafer to the edge finding position. Referring to fig. 2, a robot or other handling tool, for example, places the wafer on the chuck 18 of the edge finder and moves the wafer to the edge finder position. After the edge finder 15 needs to absorb the wafer, step ST8 is to absorb the wafer, and then perform a lateral movement along the X axis or a longitudinal movement along the Y axis, or perform a rotational movement along the Theta rotation axis in the rotation direction, so as to arrange the wafers on different sides in different directions and make the notch directions (notch) of the wafers consistent. Namely, step ST9 performs edge seek adjustment. After the edge finder performs edge finding adjustment on the wafer, the edge finder releases the wafer and turns off the adsorption function, step ST10. At this point the wafer has completed its edge seek and is not held by the edge finder and can be removed by the robot.
Referring to fig. 6, if the previous batch of wafers completes the edge-finding task, the next batch of wafers waiting to perform the edge-finding task may continue to jump to step ST7 to be moved to the edge-finding position to continue to complete the steps of ST7-ST 10.
Referring to FIG. 7, in an alternative embodiment, the robot blade transfer flow diagram includes steps SP1-SP10. Generally, the operation flow of the manipulator is slightly different according to different design types of the manipulator. The robot is suitable for the examples of fig. 1 to 4.
Referring to fig. 7, step SP2 is performed by the robot performing MAP on the wafer cassette, which is mainly for acquiring the state of the wafer in the wafer cassette. The MAP, i.e., the layout, is used to detect the wafer state. Typically, for example, the number of wafers involved in a task and the wafer carrier layout MAP within a boat or cassette are obtained. Step SP1 is a start step.
Referring to fig. 7, step SP3 is a robot taking a wafer from the wafer cassette, where the wafer includes a wafer. The premise for the robot to successfully pick wafers from the wafer cassette or boat is that the wafer layout MAP is known.
Referring to fig. 7, step SP4 is the robot placing the wafer on the edge finder, which can be seen in fig. 2, and the consecutive actions after the robot has taken a wafer from the wafer cassette are placing the wafer on the edge finder. It should be apparent that the operation mode of the robot and the edge finder is reflected, and it should be noted that the robot and the edge finder can be combined with each other to serve as a sub-functional module of the cd measuring apparatus.
Referring to fig. 7, step SP5 is that the edge finder performs edge finding. The operation procedure of the SP5 for the edge finder to perform edge finding can be seen from the detailed description of steps ST7 to ST10 in fig. 6: the aim is to arrange the wafers with different sides in different directions and make the directions of the notches of the wafers consistent, thereby realizing the opposite sides of the wafers of the silicon wafers.
Referring to fig. 7, step SP6 is the CHUCK stage moving to the tab position. The motion stage 11 may be empty, i.e., not carrying any wafers, and the CHUCK stage is a special tool for suction and carrying and is used for carrying wafers in various semiconductor wafer production processes. Platform motion control module group: the device consists of an X axis, a Y axis, a theta axis and a CHUCK, and before the device measures the critical dimension of the wafer, the CHUCK is driven to move by the platform motion control module, so that the wafer is moved. Controlling the X and Y movement directions of the motion stage 11 moves it to the tab position. Note that the tab position is a parking position of the motion stage for receiving wafers from the robot, and the motion of the CHUCK stage to this parking position is the best position to meet and receive wafers from the robot.
Referring to fig. 7, step SP7 is that the robot takes the piece from the edge finder and places it on the CHUCK platform. At this time, the edge finder has completed the task of the opposite side of the wafer, and the CHUCK platform has completed moving to the splicing position (parking position), so that the robot can smoothly transfer and move the wafer at the edge finder onto the CHUCK platform.
Referring to fig. 7, in step SP8, the CHUCK stage carries the wafer and moves to the measurement position, the camera equipped with the microscope further includes a Z-axis capable of moving up and down, when the wafer is placed on the measurement stage, such as the stage 11, if the view field of the camera is clear and the resolution is high, the wafer needs to be located at the focal plane of the camera, and the Z-axis motion module can move the camera and the lens up and down to find the focal plane with the clearest view field of the camera. Before the camera and lens move up and down to find the focal plane (see fig. 1), the motion stage 11 moves the wafer to the field of view of the camera for capturing critical dimensions on the wafer, i.e., the CHUCK stage carries the wafer and moves to the metrology position.
Referring to fig. 7, step SP9 is to determine whether there are wafers to be tested in the wafer cassette, if so, the robot needs to continue to take the wafers from the wafer cassette and execute steps SP3 to SP9, otherwise, the robot returns to the standby position.
Referring to fig. 7, step SP9 determines that there is a wafer to be tested in the wafer cassette, and then the process jumps to step SP3, step SP9 determines that there is no wafer to be tested in the wafer cassette, and then the process jumps to step SP10, and step SP10 is that the robot returns to the standby position.
Referring to fig. 7, the conventional critical dimension measurement technique has the disadvantages of "slow measurement speed and complex process; the search for critical dimensions is not accurate; the method has the defects of damage to the wafer in different degrees and the like, and the edge searching adjustment is carried out through automatic edge searching directly through the system quickly, efficiently and accurately. The manipulator transmits the wafer, so that physical damage such as scratches and breakage on the surface of the wafer is effectively avoided. The cooperation with the CHUCK platform module can greatly improve the measurement efficiency and accuracy.
Referring to fig. 7 in conjunction with fig. 6, a motion control system for a wafer or a motion control apparatus for a wafer (typically, a cd metrology apparatus) disclosed herein includes:
the edge finder 15 is used for finding and arranging the edges of the wafers with different notch directions to ensure that the notch directions of the wafers are consistent;
a robot 25 for carrying the wafer and positioning the wafer;
the motion platform 11 is used for bearing and moving the wafer, obtaining a plurality of groups of check values by the walking stepping values of the motion platform on the mechanical abscissa and the mechanical ordinate of the motion platform respectively, and converting a machine coordinate system into a check coordinate system for checking the error of the motion platform according to the check values;
the robot 25 takes the wafer from the wafer cassette, puts the wafer into the edge finder for edge finding, and carries the wafer to the motion stage, and the calibration coordinate system is converted into the user coordinate system to guide the robot 25 to carry the wafer at the motion stage 11. Handling the wafer is, for example, transporting the wafer to or removing the wafer from the motion stage.
Referring to fig. 4, a plurality of groups of check values correspond to a plurality of check results of the motion platform CHUCK at different positions, and the mechanical abscissa and the mechanical ordinate xm0, ym0 correspond to matrix numbers x _ idx, y _ idx of the check results, where the matrix numbers are used to determine index addresses of the check results and further determine accurate values of the check results. The matrix number (index address) needs to fully consider the original mechanical vertical coordinate while searching for the check result. And the functional relations of x _ idx, y _ idx, SX and SY skillfully convert xm0, ym0, x _ idx and y _ idx into verification results SX and SY, and the conversion relation maps the stepped verification values to a verification result matrix, so that the accuracy and the rationality of the verification results are ensured if n x n groups of verification values correspond to n x n matrix verification results. Furthermore, it also makes the matrix number not the accurate calculation of itself. There is hardly any literature on how the index address and the check result should be efficiently mapped. The functional relation of converting the machine coordinate system into the checking coordinate system has the advantages that the functional relation is closely combined with the control of the wafer, the adaptability of the checking process to the wafer is further ensured, and the high-precision conversion accuracy of converting the machine coordinate system into the checking coordinate system is solved.
Referring to fig. 4, the calibration coordinates Xc with respect to the abscissa and the calibration coordinates Yc with respect to the ordinate are obtained during the conversion of the mechanical abscissas xm0 and ym0 into the calibration coordinate system, the functional relationship of the calibration coordinates Xc and Yc not only taking into account the target calibration results SX and SY themselves, but also taking into account the neighboring calibration results around them. The correlation is enough to ensure that the error of the motion platform is minimum, offset correction x _ offset and y _ offset are also inserted in the correlation, and the conversion from the machine coordinate system to the check coordinate system has enough accuracy and robustness (especially, the coordinate uncertainty caused by the drift of the parameters of the influence factors can be well responded in the aspect of facing a plurality of influence factors such as three axes). If the calibration coordinate system is accurate and robust, the user coordinate system transformed by the calibration coordinate system naturally has a better accurate positioning effect and can be regarded as an excellent reference for controlling the movement of the wafer. At the moment, when the wafer is accurately placed on the measuring platform, the Z-axis motion module can drive the camera and the lens to move up and down so as to find the focal plane with the clearest camera view, and therefore CD measurement is completed. Regarding the functional relationship of converting the calibration coordinate system into the user coordinate system, the advantage is that the calibration coordinate system contains information such as matrix numbers and calibration results, thereby ensuring that the calibration contents extend to the user coordinate system and ensuring that the wafer is high in precision in grabbing, placing, transferring and the like. The application scenario is a micron or even nanometer critical dimension wafer, and the conventional scheme can result in thousands of milli-centimeters of difference, so that the application can obviously overcome the defect of large error of the conventional scheme on critical dimension measurement to a greater extent. Especially, the calculation processes of the function of converting the machine coordinate system into the check coordinate system, the function of converting the check coordinate system into the user coordinate system and the like fully consider the proximity relation (dx 1, dx2, dy1, dy 2) of the single check result and the peripheral neighbor check result, and the proximity relation is embodied in the operation process of SX and SY with matrix numbers, so that the conversion result is robust and accurate. As the mainstream semiconductor process approaches a few nanometers, the high precision control scheme disclosed herein becomes increasingly critical.
While the above specification teaches the preferred embodiments with a certain degree of particularity, there is shown in the drawings and will herein be described in detail a presently preferred embodiment with the understanding that the present disclosure is to be considered as an exemplification of the principles of the invention and is not intended to limit the invention to the specific embodiment illustrated. Various alterations and modifications will no doubt become apparent to those skilled in the art after having read the above description. Therefore, the appended claims should be construed to cover all such variations and modifications as fall within the true spirit and scope of the invention. Any and all equivalent ranges and contents within the scope of the claims should be considered to be within the intent and scope of the present invention.

Claims (15)

1. A motion control method of a wafer is characterized in that:
defining a motion platform for bearing a wafer, wherein the motion platform is provided with a machine coordinate system, obtaining a plurality of groups of check values by respective walking stepping values of the motion platform on a mechanical abscissa and a mechanical ordinate of the motion platform, converting the machine coordinate system into a check coordinate system for checking errors of the motion platform according to the check values, and converting the check coordinate system into a user coordinate system for calibrating the position of the wafer when the wafer is moved by using the motion platform.
2. The method of claim 1, wherein:
respectively walking the motion platform on a mechanical horizontal coordinate and a mechanical vertical coordinate for n-1 steps to obtain n x n groups of check values;
the n x n groups of check values correspond to n x n check results of the moving platform at different positions, and n is a positive integer.
3. The method of claim 1, wherein:
the multiple groups of check values correspond to multiple check results of the motion platform at different positions, and the matrix numbers of the mechanical abscissa xm0 and the mechanical ordinate ym0 corresponding to the check results are x _ idx and y _ idx:
x_idx＝(xm0+50)/25，y_idx＝(50-ym0)/25；
the result of the check on the abscissa is SX [ y _ idx ] [ x _ idx ] = xm0+50-x _ idx 25;
the check result on the ordinate is SY [ y _ idx ] [ x _ idx ] = y _ idx 25-50+ ym0.
4. The method of claim 3, wherein:
the conversion of xm0 and ym0 into the calibration coordinate system results in calibration coordinates Xc with respect to the abscissa:
Xc＝xm0-(dx2-dx1)*y_offset+dx1；
wherein x _ offset = (xm 0+ 50)/25-x _ idx, y _ offset = (50-ym 0)/25-y _ idx;
dx1＝(SX[y_idx][x_idx+1]-SX[y_idx][x_idx])*x_offset+SX[y_idx][x_idx]；
dx2＝(SX[y_idx+1][x_idx+1]-SX[y_idx+1][x_idx])*x_offset+SX[y_idx+1][x_idx]。
5. the method of claim 3, wherein:
the conversion of xm0 and ym0 into the calibration coordinate system yields a calibration coordinate Yc with respect to the ordinate:
Yc＝ym0-(dy2-dy1)*x_offset+dy1；
wherein x _ offset = (xm 0+ 50)/25-x _ idx, y _ offset = (50-ym 0)/25-y _ idx;
dy1＝(SY[y_idx+1][x_idx]-SY[y_idx][x_idx])*y_offset+SY[y_idx][x_idx]；
dy2＝(SY[y_idx+1][x_idx+1]-SY[y_idx][x_idx+1])*y_offset+SY[y_idx][x_idx+1]。
6. the method of claim 1, wherein:
the checking coordinate system has a checking coordinate Xc about an abscissa and a checking coordinate Yc about an ordinate, the user coordinate system has an origin represented by Xorg and Yorg and an angle represented by Ang, and the user abscissa Xu and the user ordinate Yu satisfy:
Xu＝(Xc–Xorg)*Cos(Ang)-(Yc-Yorg)*Sin(Ang)；
Yu＝(Xc–Xorg)*Sin(Ang)+(Yc-Yorg)*Cos(Ang)。
7. the method of claim 2, wherein:
the motion platform is set to travel from a position 0 to a position 100mm on the mechanical abscissa and the mechanical ordinate, so that 5 x 5 groups of calibration values are obtained and calibration results in the form of a 5 x 5 matrix at different positions are obtained, with a step value of 25mm.
8. The method of claim 1, wherein:
and moving the wafer to the view of the camera for shooting the key size on the wafer by using the motion platform.
9. A system for controlling movement of a wafer, comprising:
the edge finder is used for carrying out edge finding and finishing on the wafers with different notch directions to ensure that the notch directions of the wafers are consistent;
the manipulator is used for carrying the wafer and positioning the position of the wafer;
the motion platform is used for bearing and moving the wafer, obtaining a plurality of groups of check values by the stepping values of the motion platform walking on the mechanical abscissa and the mechanical ordinate of the motion platform respectively, and converting the machine coordinate system into a check coordinate system for checking the error of the motion platform according to the check values;
the manipulator takes the wafer from the wafer box, puts the wafer into an edge finder for edge finding, and carries the wafer to a motion platform, and the checking coordinate system is converted into a user coordinate system so as to guide the manipulator to carry the wafer at the motion platform.
10. The wafer motion control system of claim 9, wherein:
the wafer is moved by the motion stage to the field of view of a camera used to capture critical dimensions on the wafer.
11. The wafer motion control system of claim 9, wherein:
the multiple groups of check values correspond to multiple check results of the motion platform at different positions, and the matrix numbers of the mechanical abscissa xm0 and the mechanical ordinate ym0 corresponding to the check results are x _ idx and y _ idx:
x_idx＝(xm0+50)/25，y_idx＝(50-ym0)/25；
the result of the check on the abscissa is SX [ y _ idx ] [ x _ idx ] = xm0+50-x _ idx 25;
the result of the check on the ordinate is SY [ y _ idx ] [ x _ idx ] = y _ idx 25-50+ yym 0.
12. The wafer motion control system of claim 11, wherein:
the conversion of xm0 and ym0 into the calibration coordinate system results in calibration coordinates Xc with respect to the abscissa:
Xc＝xm0-(dx2-dx1)*y_offset+dx1；
wherein x _ offset = (xm 0+ 50)/25-x _ idx, y _ offset = (50-ym 0)/25-y _ idx;
dx1＝(SX[y_idx][x_idx+1]-SX[y_idx][x_idx])*x_offset+SX[y_idx][x_idx]；
dx2＝(SX[y_idx+1][x_idx+1]-SX[y_idx+1][x_idx])*x_offset+SX[y_idx+1][x_idx]。
13. the wafer motion control system of claim 11, wherein:
the conversion of xm0 and ym0 into the calibration coordinate system yields a calibration coordinate Yc with respect to the ordinate:
Yc＝ym0-(dy2-dy1)*x_offset+dy1；
wherein x _ offset = (xm 0+ 50)/25-x _ idx, y _ offset = (50-ym 0)/25-y _ idx;
dy1＝(SY[y_idx+1][x_idx]-SY[y_idx][x_idx])*y_offset+SY[y_idx][x_idx]；
dy2＝(SY[y_idx+1][x_idx+1]-SY[y_idx][x_idx+1])*y_offset+SY[y_idx][x_idx+1]。
14. the wafer motion control system of claim 9, wherein:
the checking coordinate system has a checking coordinate Xc about an abscissa and a checking coordinate Yc about an ordinate, the user coordinate system has an origin represented by Xorg and Yorg and an angle represented by Ang, and the user abscissa Xu and the user ordinate Yu satisfy:
Xu＝(Xc–Xorg)*Cos(Ang)-(Yc-Yorg)*Sin(Ang)；
Yu＝(Xc–Xorg)*Sin(Ang)+(Yc-Yorg)*Cos(Ang)。
15. the wafer motion control system of claim 9, wherein:
the motion platform walks from a 0 position to a 100mm position on a mechanical abscissa and a mechanical ordinate respectively, and the walking stepping value is 25mm, so that 5-by-5 groups of check values are obtained;
the 5 x 5 groups of verification values correspond to 5 x 5 verification results of the motion platform at different positions.
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