CN114030239A - 一种车载电子设备防凝露结构 - Google Patents
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Abstract
本发明涉及车载电子设备辅助结构技术领域，尤其涉及一种车载电子设备防凝露结构，包括用于装设PCB板的壳体；在所述壳体的内侧面和/或外侧面覆盖有导热层。本发明的发明目的在于提供一种车载电子设备防凝露结构，采用本发明提供的技术方案解决了目前主动散热技术容易在电子设备外发生凝露现象的技术问题。
Description
技术领域
本发明涉及车载电子设备辅助结构技术领域，尤其涉及一种车载电子设备防凝露结构。
技术背景
随着时代发展，车载用电设备的功耗日益增大，传统的被动散热技术已经不能满足车载用电设备的散热需求。主动散热技术开始被普遍用于车载用电设备，解决车载用电设备的散热问题。主动散热技术的散热能力强大，可以大幅降低车载用电设备外壳的温度，进而降低芯片的温度，保证车载用电设备的正常运行。
随之而来的问题是车载用电设备上发生凝露现象，造成车载用电设备损毁，不能工作。车载用电设备在使用过程中，当车载用电设备的外壳温度低于比当前空气的露点温度时，空气接触到车载用电设备外壳，空气中的水分析出，在外壳上凝结成水珠，水珠滴落到车载用电设备内部，造成车载用电设备损坏，不能工作。
发明内容
本发明的发明目的在于提供一种车载电子设备防凝露结构，采用本发明提供的技术方案解决了目前主动散热技术容易在电子设备外发生凝露现象的技术问题。
为了解决上述技术问题，本发明提供一种车载电子设备防凝露结构，包括用于装设PCB板的壳体；在所述壳体的内侧面和/或外侧面覆盖有导热层。
优选的，所述导热层的导热系数为0.001W/mK～1000W/mK。
优选的，所述导热层与壳体之间通过粘接、焊接、铆接、注塑或喷涂。
优选的，所述导热层的制作材质为泡棉、塑料或复合涂料。
由上可知，应用本发明提供的技术方案，具备以下有益效果：将空气与车载用电设备的结构外壳隔离，避免空气与温度低的车载用电设备外壳直接接触，空气中的水分在车载用电设备的外壳中析出，凝结成水珠，防止车载用电设备因凝露产生的水滴导致烧毁等。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对本发明实施例或现有技术的描述中所需要使用的附图作简单地介绍。显而易见地，下面描述中的附图仅仅是本发明的一部分实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例防凝露结构剖视图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
车载用电设备在使用过程中，当车载用电设备的外壳温度低于比当前空气的露点温度时，空气接触到车载用电设备外壳，空气中的水分析出，在外壳上凝结成水珠，水珠滴落到车载用电设备内部，造成车载用电设备损坏，不能工作。
请参见图1，为了解决上述技术问题，本实施例提供一种车载电子设备防凝露结构，关键在于将空气与车载用电设备的结构外壳隔离，避免空气与温度低的车载用电设备外壳直接接触，空气中的水分在车载用电设备的外壳中析出，凝结成水珠，防止车载用电设备因凝露产生的水滴导致烧毁等。
实际原理为：在车载用电设备的结构外壳表面附着导热系数低的材料，当外壳的温度比空气的露点低时，因为材料的导热系数低，热阻大的特点，外壳与该材料间热传递困难，外壳的低温难以降低该材料的温度，使材料的温度比空气的露点高，避免了凝露现象发生。
具体的，本实施例包括用于装设PCB板的壳体10；在壳体10的内侧面和/或外侧面覆盖有导热层20。
为了实现防结露效果，上述导热层20采用的材料导热系数低的材料，导热层20的制作材质可以为单一物质组成的纯物质，也可以使有多种物质组成的复合材料，包含但不限于导热系数为0.001W/mK～1000W/mK的泡棉、塑料、复合涂料等。
导热层20在安装位置中，可以只覆盖车载用电设备的内表面，或者只覆盖车载用电设备的外表面，或者同时覆盖车载用电设备的内、外表面。并且其与壳体10之间的连接方式包括但不限于通过粘接、焊接、铆接、注塑或喷涂。
采用本实施例提供的技术方案避免车载用电设备在使用过程中发生凝露现象，保证车载用电设备的不因凝露现象产生的水珠发生损坏。
以上所述的实施方式，并不构成对该技术方案保护范围的限定。任何在上述实施方式的精神和原则之内所作的修改、等同替换和改进等，均应包含在该技术方案的保护范围之内。
Claims (4)
1.一种车载电子设备防凝露结构，其特征在于：包括用于装设PCB板的壳体；在所述壳体的内侧面和/或外侧面覆盖有导热层。
2.根据权利要求1所述的车载电子设备防凝露结构，其特征在于：所述导热层的导热系数为0.001W/mK～1000W/mK。
3.根据权利要求2所述的车载电子设备防凝露结构，其特征在于：所述导热层与壳体之间通过粘接、焊接、铆接、注塑或喷涂。
4.根据权利要求3所述的车载电子设备防凝露结构，其特征在于：所述导热层的制作材质为泡棉、塑料或复合涂料。
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003335186A (ja) * | 2002-05-17 | 2003-11-25 | Denso Corp | 車載用電子機器の筐体構造及び組合せ構造 |
| CN210579772U (zh) * | 2019-04-28 | 2020-05-19 | 珠海格力电器股份有限公司 | 一种隔热结构及液冷板 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003335186A (ja) * | 2002-05-17 | 2003-11-25 | Denso Corp | 車載用電子機器の筐体構造及び組合せ構造 |
| CN210579772U (zh) * | 2019-04-28 | 2020-05-19 | 珠海格力电器股份有限公司 | 一种隔热结构及液冷板 |
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