CN103695976A - Treatment method for copper product before electronickelling - Google Patents
Treatment method for copper product before electronickelling Download PDFInfo
- Publication number
- CN103695976A CN103695976A CN201310695709.3A CN201310695709A CN103695976A CN 103695976 A CN103695976 A CN 103695976A CN 201310695709 A CN201310695709 A CN 201310695709A CN 103695976 A CN103695976 A CN 103695976A
- Authority
- CN
- China
- Prior art keywords
- polishing
- time
- electronickelling
- copper products
- treatment process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention relates to a treatment method for a copper product before electronickelling. The method comprises the following steps: firstly, polishing the copper product to be electroplated for the first time, and then washing; polishing for the second time, and then washing for three times; pickling, wherein a pickling solution for pickling is sulfuric acid of which the volume fraction is 30%; finally, activating to finish treatment, wherein the activating solution for activation is sulfuric acid of which the volume fraction is 3-5%. By adopting the treatment method, only oxide and greasy dirt on the surface of the copper product can be processed, and the copper layer is not corroded, so that the integrity of the product is greatly protected; meanwhile, the electroplated appearance is good in consistence, consistent in surface color and luster, and good in uniformity after electronickelling is carried out, and the brightness is improved.
Description
Technical field
The present invention relates to the treatment process before a kind of copper products electronickelling, belong to copper products electronickelling technology field.
Background technology
Fast-developing with electronic circuit, the importance of nickel plating technology obviously improves, and pre-treatment mostly in the market is directly carries out chemical corrosion (sulfuric acid and Sulfothiorine) to copper material, very easily injures copper products surface.In the composition of former chemical corrosion, contain a large amount of sulfuric acid, itself and nitric acid are strong oxidizer (oxidisability: the concentrated nitric acid > vitriol oil), with copper, vigorous oxidation all can occur reacts, main and the sulfuric acid reaction (during proportioning, sulfuric acid content is much larger than nitric acid) of copper when polishing, and reaction is violent, polishing time is short, easily causes the polishing of copper products regional area not thorough, causes jaundice or blackout during plating.
Summary of the invention
Technical problem to be solved by this invention is to provide the treatment process before a kind of copper products electronickelling, solves deficiency of the prior art, meets the simplicity of copper products electronickelling pre-treatment, guarantees the quality of copper products.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: the treatment process before a kind of copper products electronickelling, comprises the following steps:
(1) copper products of preparing electronickelling is first carried out to polishing for the first time, wash subsequently; Wherein, the polishing fluid I that described polishing for the first time adopts is grouped into by the one-tenth of following volume ratio: nitric acid: sulfuric acid: hydrochloric acid: water: degreasing agent=1:12:0.05:28:2.5;
(2) copper products after polishing for the first time and washing is carried out to polishing for the second time, carry out subsequently three road washings; The polishing fluid II that wherein said polishing for the second time adopts is grouped into by the one-tenth of following volume ratio: nitric acid: polishing fluid I: water: degreasing agent=1:1:7:1;
(3) copper products after polishing for the second time and washing is carried out to pickling, the pickle solution that described pickling adopts is that volume fraction is 30% sulfuric acid;
(4) copper products after overpickling is activated again, complete processing, the activation solution that described activation adopts is that volume fraction is 3～5% sulfuric acid.
Complete after above-mentioned processing copper products can directly carry out the step of electronickelling operation.
On the basis of technique scheme, the present invention can also do following improvement.
Further, in described step (1), the temperature of polishing is for the first time room temperature, and the time is 5～10 seconds.
Further, the washing concrete operations of described step (2) Zhong San road are washed for entering successively three washing baths, and the water wherein using in three road washings is deionized water.
Further, in described step (2), the temperature of polishing is for the second time room temperature, and the time is 2～3 minutes.
Further, in described step (3), the temperature of pickling is room temperature, and the time is 4～6 seconds.
Further, in described step (4), the temperature of activation is room temperature, and the time is 1～3 minute.
Above-mentioned room temperature refers to 15～25 ℃.
Further, in described step (1) and step (2), degreasing agent is the dimethylbenzene that adds scouring agent, and the amount that wherein scouring agent adds is 0.1L/kg.
Further, the main component of described scouring agent is poly--(oxo-1,2-second dimethylene)-ɑ-nonyl phenyl-ω-hydroxyl.
Sulfuric acid content die-off (a small amount of sulfuric acid be that old polishing fluid is brought into) in polishing fluid, copper and nitric acid and sulfuric acid all become diluted acid, oxidisability reduces immediately, main aobvious acid, be responsible for removing terminal surfaces cupric oxide and oil mark, during polishing reaction temperature and, polishing time lengthens, and can eliminate thorough phenomenon of pre-treatment.
Due to existing polishing fluid reaction temperature and (substantially not contacting internal layer copper), so plate out product surface, be vaporific, can before existing polishing, add according to demand former polishing flow process (approximately 5 seconds time) together, can guarantee that the copper products brightness plating out increases.
The invention has the beneficial effects as follows: the present invention only processes copper products oxide on surface and greasy dirt, does not corrode copper layer, has protected greatly the integrity of product; carry out after electronickelling, the outward appearance of electroplating out is unanimously better simultaneously, and surface color is consistent; good uniformity, and brightness is improved.
Embodiment
Below principle of the present invention and feature are described, example, only for explaining the present invention, is not intended to limit scope of the present invention.
Embodiment 1
(1) copper products of preparing electronickelling is first at room temperature carried out to polishing for the first time 5 seconds, wash subsequently; Wherein, the polishing fluid I that described polishing for the first time adopts is grouped into by the one-tenth of following volume ratio: nitric acid: sulfuric acid: hydrochloric acid: water: degreasing agent=1:12:0.05:28:2.5.
(2) copper products after polishing for the first time and washing is at room temperature carried out to polishing for the second time 2 minutes, enter respectively subsequently in three washing baths and utilize deionized water to wash; The polishing fluid II that wherein said polishing for the second time adopts is grouped into by the one-tenth of following volume ratio: nitric acid: polishing fluid I: water: degreasing agent=1:1:7:1.
In described step (1) and step (2), degreasing agent is the dimethylbenzene that adds scouring agent, and the amount that wherein scouring agent adds is 0.1L/kg, adopts and adds 1.5L scouring agent to make in 15 kilograms of dimethylbenzene.
(3) copper products after polishing for the second time and washing is at room temperature carried out to pickling, the pickle solution that described pickling adopts is that volume fraction is 30% sulfuric acid, pickling 4 seconds.
(4) copper products after overpickling is activated again, complete processing, the activation solution that described activation adopts is that volume fraction is 3% sulfuric acid, activates 1 minute.
Copper products surface color homogeneous after activation, good uniformity, presents the original yellow of copper.
Complete after above-mentioned processing copper products can directly carry out the step of electronickelling operation.
Copper products surface color is consistent after electronickelling, good uniformity, and brightness is improved, and presents glittering silver color.
Embodiment 2
(1) copper products of preparing electronickelling is first at room temperature carried out to polishing for the first time 8 seconds, wash subsequently; Wherein, the polishing fluid I that described polishing for the first time adopts is grouped into by the one-tenth of following volume ratio: nitric acid: sulfuric acid: hydrochloric acid: water: degreasing agent=1:12:0.05:28:2.5.
(2) copper products after polishing for the first time and washing is at room temperature carried out to polishing for the second time 2.5 minutes, enter respectively subsequently in three washing baths and utilize deionized water to wash; The polishing fluid II that wherein said polishing for the second time adopts is grouped into by the one-tenth of following volume ratio: nitric acid: polishing fluid I: water: degreasing agent=1:1:7:1.
In described step (1) and step (2), degreasing agent is the dimethylbenzene that adds scouring agent, and the amount that wherein scouring agent adds is 0.1L/kg, adopts and adds 1.5L scouring agent to make in 15 kilograms of dimethylbenzene.
(3) copper products after polishing for the second time and washing is at room temperature carried out to pickling, the pickle solution that described pickling adopts is that volume fraction is 30% sulfuric acid, pickling 5 seconds.
(4) copper products after overpickling is activated again, complete processing, the activation solution that described activation adopts is that volume fraction is 5% sulfuric acid, activates 2 minutes.
Copper products surface color homogeneous after activation, good uniformity, presents the original yellow of copper.
Complete after above-mentioned processing copper products can directly carry out the step of electronickelling operation.
Copper products surface color is consistent after electronickelling, good uniformity, and brightness is improved, and presents glittering silver color.
Embodiment 3
(1) copper products of preparing electronickelling is first at room temperature carried out to polishing for the first time 10 seconds, wash subsequently; Wherein, the polishing fluid I that described polishing for the first time adopts is grouped into by the one-tenth of following volume ratio: nitric acid: sulfuric acid: hydrochloric acid: water: degreasing agent=1:12:0.05:28:2.5.
(2) copper products after polishing for the first time and washing is at room temperature carried out to polishing for the second time 3 minutes, enter respectively subsequently in three washing baths and utilize deionized water to wash; The polishing fluid II that wherein said polishing for the second time adopts is grouped into by the one-tenth of following volume ratio: nitric acid: polishing fluid I: water: degreasing agent=1:1:7:1.
In described step (1) and step (2), degreasing agent is the dimethylbenzene that adds scouring agent, and the amount that wherein scouring agent adds is 0.1L/kg, adopts and adds 1.5L scouring agent to make in 15 kilograms of dimethylbenzene.
(3) copper products after polishing for the second time and washing is at room temperature carried out to pickling, the pickle solution that described pickling adopts is that volume fraction is 30% sulfuric acid, pickling 6 seconds.
(4) copper products after overpickling is activated again, complete processing, the activation solution that described activation adopts is that volume fraction is 5% sulfuric acid, activates 3 minutes.
Copper products surface color homogeneous after activation, good uniformity, presents the original yellow of copper.
Complete after above-mentioned processing copper products can directly carry out the step of electronickelling operation.
Copper products surface color is consistent after electronickelling, good uniformity, and brightness is improved, and presents glittering silver color.
Comparative example
The mode of a large amount of sulfuric acid in employing background technology and the chemical corrosion of nitric acid, carries out electronickelling pre-treatment to copper products, and the copper products surface obtaining exists aberration, lack of homogeneity, and surface brightness is not as above-described embodiment.
After electronickelling there is aberration in copper products surface, and lack of homogeneity, has the generation of white mist, and color and luster is not glittering.
This shows; embodiments of the invention are only processed copper products oxide on surface and greasy dirt; do not corrode copper layer; protected greatly the integrity of product, carried out after electronickelling simultaneously, the outward appearance of electroplating out is unanimously better; with respect to comparative example; surface color is consistent, good uniformity, and brightness is improved.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (8)
1. the treatment process before copper products electronickelling, is characterized in that, comprises the following steps:
(1) copper products of preparing electronickelling is first carried out to polishing for the first time, wash subsequently; Wherein, the polishing fluid I that described polishing for the first time adopts is comprised of the composition of following volume ratio: nitric acid: sulfuric acid: hydrochloric acid: water: degreasing agent=1:12:0.05:28:2.5;
(2) copper products after polishing for the first time and washing is carried out to polishing for the second time, carry out subsequently three road washings; The polishing fluid II that wherein said polishing for the second time adopts is comprised of the composition of following volume ratio: nitric acid: polishing fluid I: water: degreasing agent=1:1:7:1;
(3) copper products after polishing for the second time and washing is carried out to pickling, the pickle solution that described pickling adopts is that volume fraction is 30% sulfuric acid;
(4) copper products after overpickling is activated again, complete processing, the activation solution that described activation adopts is that volume fraction is 3～5% sulfuric acid.
2. the treatment process before copper products electronickelling according to claim 1, is characterized in that, in described step (1), the temperature of polishing is for the first time room temperature, and the time is 5～10 seconds.
3. the treatment process before copper products electronickelling according to claim 1, is characterized in that, the washing concrete operations of described step (2) Zhong San road are washed for entering successively three washing baths, and wherein in three roads washings, the water of use is deionized water.
4. the treatment process before copper products electronickelling according to claim 1, is characterized in that, in described step (2), the temperature of polishing is for the second time room temperature, and the time is 2～3 minutes.
5. the treatment process before copper products electronickelling according to claim 1, is characterized in that, in described step (3), the temperature of pickling is room temperature, and the time is 4～6 seconds.
6. the treatment process before copper products electronickelling according to claim 1, is characterized in that, in described step (4), the temperature of activation is room temperature, and the time is 1～3 minute.
7. according to the treatment process before copper products electronickelling described in claim 1 to 6 any one, it is characterized in that, in described step (1) and step (2), degreasing agent is the dimethylbenzene that adds scouring agent, and the amount that wherein scouring agent adds is 0.1L/kg.
8. the treatment process before copper products electronickelling according to claim 7, is characterized in that, the main component of described scouring agent is poly--(oxo-1,2-second dimethylene)-ɑ-nonyl phenyl-ω-hydroxyl.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310695709.3A CN103695976B (en) | 2013-12-17 | 2013-12-17 | A kind of processing method before copper products electronickelling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310695709.3A CN103695976B (en) | 2013-12-17 | 2013-12-17 | A kind of processing method before copper products electronickelling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103695976A true CN103695976A (en) | 2014-04-02 |
| CN103695976B CN103695976B (en) | 2016-08-17 |
Family
ID=50357634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310695709.3A Active CN103695976B (en) | 2013-12-17 | 2013-12-17 | A kind of processing method before copper products electronickelling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103695976B (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104046989A (en) * | 2014-06-06 | 2014-09-17 | 扬州虹扬科技发展有限公司 | Novel method for preprocessing electrotinned glue-filled product |
| CN104846410A (en) * | 2015-06-16 | 2015-08-19 | 沈阳飞机工业（集团）有限公司 | Method for electroplating nickel on brass and red copper alloy |
| CN105002537A (en) * | 2015-07-30 | 2015-10-28 | 柳州市旭平首饰有限公司 | Deoiling method adopted before silver plating of copper accessories |
| CN105803463A (en) * | 2016-05-03 | 2016-07-27 | 扬州虹扬科技发展有限公司 | Pre-treatment method of copper particles for electrosilvering |
| CN105908158A (en) * | 2016-05-03 | 2016-08-31 | 扬州虹扬科技发展有限公司 | Method for plating tin on thin copper particles |
| CN106245048A (en) * | 2016-08-05 | 2016-12-21 | 扬州虹扬科技发展有限公司 | Pyrite tube core acid washing method |
| CN106544479A (en) * | 2016-12-26 | 2017-03-29 | 广东长盈精密技术有限公司 | Plate and preparation method thereof in a kind of mobile phone |
| CN106702448A (en) * | 2017-03-16 | 2017-05-24 | 江苏金坤科技有限公司 | Pretreatment method of nickel material electrogilding |
| CN107119291A (en) * | 2017-05-24 | 2017-09-01 | 江苏金坤科技有限公司 | A kind of nickel-plating liquid and the efficient nickel plating technology based on the nickel-plating liquid |
| CN108728841A (en) * | 2018-05-04 | 2018-11-02 | 瑞声科技(新加坡)有限公司 | Roll copper darkening ring piece preparation method and calendering copper darkening ring piece |
| CN109267127A (en) * | 2018-08-30 | 2019-01-25 | 扬州虹扬科技发展有限公司 | A kind of Copper base material treatment fluid and pretreating process |
| CN109898114A (en) * | 2019-03-25 | 2019-06-18 | 扬州虹扬科技发展有限公司 | A kind of production technology of hang plating production line |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85102657A (en) * | 1985-04-01 | 1986-08-06 | 南京大学 | The electropolishing method on copper zinc alloy surface |
| SU1330209A1 (en) * | 1986-04-03 | 1987-08-15 | Институт Химии И Химической Технологии Ан Литсср | Composition for chemical polishing of copper and its alloys |
| KR20060018324A (en) * | 2004-08-24 | 2006-03-02 | 장기범 | Chemical polishing of aluminum |
| CN101285205A (en) * | 2007-04-11 | 2008-10-15 | 姜堰市德美化工有限公司 | Cold remover for metal surface treatment and preparation method thereof |
| CN102965697A (en) * | 2012-12-18 | 2013-03-13 | 南通广联实业有限公司 | Electroplating process for flexible nickel |
-
2013
- 2013-12-17 CN CN201310695709.3A patent/CN103695976B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85102657A (en) * | 1985-04-01 | 1986-08-06 | 南京大学 | The electropolishing method on copper zinc alloy surface |
| SU1330209A1 (en) * | 1986-04-03 | 1987-08-15 | Институт Химии И Химической Технологии Ан Литсср | Composition for chemical polishing of copper and its alloys |
| KR20060018324A (en) * | 2004-08-24 | 2006-03-02 | 장기범 | Chemical polishing of aluminum |
| CN101285205A (en) * | 2007-04-11 | 2008-10-15 | 姜堰市德美化工有限公司 | Cold remover for metal surface treatment and preparation method thereof |
| CN102965697A (en) * | 2012-12-18 | 2013-03-13 | 南通广联实业有限公司 | Electroplating process for flexible nickel |
Non-Patent Citations (1)
| Title |
|---|
| 程永红 : "铜合金直接镀银工艺", 《电镀与环保》 * |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104046989A (en) * | 2014-06-06 | 2014-09-17 | 扬州虹扬科技发展有限公司 | Novel method for preprocessing electrotinned glue-filled product |
| CN104846410A (en) * | 2015-06-16 | 2015-08-19 | 沈阳飞机工业（集团）有限公司 | Method for electroplating nickel on brass and red copper alloy |
| CN105002537A (en) * | 2015-07-30 | 2015-10-28 | 柳州市旭平首饰有限公司 | Deoiling method adopted before silver plating of copper accessories |
| CN105908158B (en) * | 2016-05-03 | 2019-01-25 | 扬州虹扬科技发展有限公司 | A method of it is tin plating on thin copper particle |
| CN105908158A (en) * | 2016-05-03 | 2016-08-31 | 扬州虹扬科技发展有限公司 | Method for plating tin on thin copper particles |
| CN105803463B (en) * | 2016-05-03 | 2019-01-04 | 扬州虹扬科技发展有限公司 | A kind of preprocess method of the copper particle for electrosilvering |
| CN105803463A (en) * | 2016-05-03 | 2016-07-27 | 扬州虹扬科技发展有限公司 | Pre-treatment method of copper particles for electrosilvering |
| CN106245048A (en) * | 2016-08-05 | 2016-12-21 | 扬州虹扬科技发展有限公司 | Pyrite tube core acid washing method |
| CN106245048B (en) * | 2016-08-05 | 2018-07-03 | 扬州虹扬科技发展有限公司 | Brass tube core acid washing method |
| CN106544479A (en) * | 2016-12-26 | 2017-03-29 | 广东长盈精密技术有限公司 | Plate and preparation method thereof in a kind of mobile phone |
| CN106702448A (en) * | 2017-03-16 | 2017-05-24 | 江苏金坤科技有限公司 | Pretreatment method of nickel material electrogilding |
| CN107119291A (en) * | 2017-05-24 | 2017-09-01 | 江苏金坤科技有限公司 | A kind of nickel-plating liquid and the efficient nickel plating technology based on the nickel-plating liquid |
| CN108728841A (en) * | 2018-05-04 | 2018-11-02 | 瑞声科技(新加坡)有限公司 | Roll copper darkening ring piece preparation method and calendering copper darkening ring piece |
| CN109267127A (en) * | 2018-08-30 | 2019-01-25 | 扬州虹扬科技发展有限公司 | A kind of Copper base material treatment fluid and pretreating process |
| CN109267127B (en) * | 2018-08-30 | 2023-09-05 | 扬州虹扬科技发展有限公司 | Copper substrate treatment fluid and pretreatment process |
| CN109898114A (en) * | 2019-03-25 | 2019-06-18 | 扬州虹扬科技发展有限公司 | A kind of production technology of hang plating production line |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103695976B (en) | 2016-08-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103695976A (en) | Treatment method for copper product before electronickelling | |
| JP6611380B2 (en) | COMPOSITE PLATING LAYER FORMED ON SURFACE OF Nd-Fe-B MAGNETIC MATERIAL AND METHOD FOR PRODUCING Nd-Fe-B MAGNETIC MATERIAL HAVING THE COMPOSITE PLATING LAYER | |
| CN103469267B (en) | A kind of processing method of surface-treated electro-deposited copper foil and the Copper Foil of process thereof | |
| CN102758228A (en) | Sulfonic acid type semi-bright pure tin electroplating solution | |
| CN102912329A (en) | Chemical nickel and palladium plating process used for circuit boards | |
| CN103924225A (en) | High tin bronze plating solution for chemical plating of surface of tempered bead wire, and its chemical dip plating method | |
| CN108588719B (en) | Deplating liquid for deplating copper-based palladium-nickel alloy plating layer | |
| CN103556194A (en) | Surface treatment process for aluminum alloy | |
| CN105951135B (en) | The electro-plating method of semiconductor packages | |
| CN107231753B (en) | A kind of heavy nickel gold method improving plating leakage | |
| CN112680761B (en) | Nickel-cerium alloy plating annealed copper wire production process | |
| CN104120462A (en) | Method for carrying out cyanide-free cuprous brass electroplating on steel cord and method for passivating brass coating | |
| CN110592623A (en) | Formula and method of nickel electroplating solution for improving uniform distribution of neodymium iron boron magnet coating | |
| CN104073845A (en) | Gold plating method for PCB | |
| CN102492967B (en) | Metal workpiece surface high-corrosion-resistance bright chromium plating technology | |
| CN102383116A (en) | Process method for treating zinc immersion before performing copper plating on surface of superfine aluminum wire | |
| CN103388135A (en) | Nylon material roughing solution and roughing method using same | |
| CN103668192A (en) | Four-element zinc-tin-nickel-iron soaking technique of aluminum alloy plate | |
| CN102517616A (en) | Plating solution formula for electroplating tin and bismuth on aluminum material and electroplating method thereof | |
| CN103993344A (en) | Method for manufacturing electroplating diamond grinding wheel | |
| CN104419921A (en) | Water soluble silver protective agent, preparation method thereof, chemical silvering method and surface silver plated workpiece | |
| CN106591898A (en) | Silver plating process for contactor plastic compression part | |
| CN101476140A (en) | Novel non-copperplating bright chrome plating process | |
| CN104514024A (en) | Brush plating technology of aluminium alloy | |
| CN104294243A (en) | Aluminum tube nickel plating method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |