CN104846410A - Method for electroplating nickel on brass and red copper alloy - Google Patents
Method for electroplating nickel on brass and red copper alloy Download PDFInfo
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- CN104846410A CN104846410A CN201510333599.5A CN201510333599A CN104846410A CN 104846410 A CN104846410 A CN 104846410A CN 201510333599 A CN201510333599 A CN 201510333599A CN 104846410 A CN104846410 A CN 104846410A
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Abstract
The invention discloses a method for electroplating nickel on a brass and red copper alloy. The method comprises the following steps: (1) performing pretreatment on a workpiece in a pre-processing solution for 8-15 s at room temperature, wherein the pre-processing solution comprises: 280-310 ml/L of nitric acid, 280-310ml/L of sulfuric acid, 4-7ml/L of hydrochloric acid and the balance of water; (2) washing the pre-processed workpiece in flowing cold water, and performing nickel plating on the workpiece in a nickel plating solution; (3) washing the nickel-plated workpiece in the flowing cold water for 1-2 min, washing for 1-2 min in the warm water at the temperature of 40-60 DEG C, and drying the surface of the workpiece with a nickel-plated layer. The method has the advantages of saving resources, reducing manpower and material resources, increasing production efficiency and facilitating production and management.
Description
Technical field
The present invention relates to chemical nickel plating field, be specifically related to a kind of method of electronickelling on brass, red copper alloy.
Background technology
Usually workpiece is carried out eleetrotinplate process before weldering in welding technique, to improve the weldability of workpiece.Electronickelling exists usually used as the transition layer of tin coating, for improving the bonding force of metallic matrix and tin coating.The electronickelling of copper alloy is widely used in every field already, and object is the weldability improving copper alloy workpiece, but plating pre-processing technique is loaded down with trivial details, through multiple operations such as pre-treatment, light process, activation treatment, just need can reach plating requirement.Each step process all needs to prepare special slot, and is equipped with corresponding cell body and the facility such as temperature, time controling, and to the strength of solution periodic analysis in each tank liquor, need increase production cost, make troubles to production management when producing.
Summary of the invention
The present invention is directed to the deficiencies in the prior art, provide a kind of method of electronickelling on brass, red copper alloy, the method is simple to operate, step is few, pre-treatment is required 1 slot only, and its corresponding auxiliary facility is few, can complete the pre-treatment of workpiece, this pre-treatment can not only improve workpiece surfactivity to be plated, its coating quality also meets the requirements completely, has saving resource, reduces manpower and materials, enhance productivity, facilitate the advantage of production management.
The technical solution used in the present invention is:
A method for electronickelling on brass, red copper alloy, comprises the steps,
1) workpiece is at room temperature placed in following pretreatment liquid 8s-15s and carries out pre-treatment, described pretreatment liquid is:
2), after the workpiece after pre-treatment being cleaned in flowing cool water, workpiece is placed in nickel plating solution and carries out nickel plating;
3) workpiece of nickel plating is carried out cleaning 1-2min in flowing cool water; After carrying out cleaning 1-2min again in the warm water of 40-60 DEG C, the workpiece surface with nickel coating is dried up.
The method of described a kind of electronickelling on brass, red copper alloy, described step 1) in pretreatment liquid be:
The method of described a kind of electronickelling on brass, red copper alloy, described step 2) in the solution formula of nickel plating and condition be specially:
Condition: pH value 5.0-5.5, temperature 16 DEG C-30 DEG C, current density 0.5A/dm
2-0.8A/dm
2.
The method of described a kind of electronickelling on brass, red copper alloy, in step 1) first workpiece is carried out without oily waste treatment before.
The method of described a kind of electronickelling on brass, red copper alloy, is describedly specially without oily waste treatment, workpiece is placed at the temperature of 75 DEG C-95 DEG C following without oily waste treatment solution until workpiece surface is without greasy dirt, describedly without oily waste treatment liquid be:
The method of described a kind of electronickelling on brass, red copper alloy, described step 1) pretreatment liquid adopts following steps to be configured:
A prepares the consumption of nitric acid, sulfuric acid and hydrochloric acid by the proportioning in formula;
B injects the water of formula about 1/2 in tank liquor pond;
C adds sulfuric acid while stirring;
Temperature for the treatment of d reduces by less than 50 DEG C, adds nitric acid while stirring;
E adds hydrochloric acid, stirs;
F adds water to the specified volume in formula.
The present invention has following beneficial effect:
This method is adopted to carry out treatment before plating to workpiece, instead of existing copper alloy workpiece plating front to processes (each treating processes all has corresponding effect to copper alloy workpiece surface) such as acid solution pre-treatment-chromic anhydride solution gloss finish-activation treatment that workpiece carries out, the present invention only adopts a kind of pretreatment solution that multiple tank liquor can be replaced to carry out treatment before plating, this pretreatment liquid possesses erosion simultaneously, light, the effects such as activation, not only can not have a negative impact to workpiece, as reduce roughness or erosion rate too fast etc., also simplify Production Flow Chart, shorten the production cycle, reduce production maintenance cost.
The pretreatment activating effect of the inventive method is not less than the quality of multipaths pre-treatment in the past, not only improve chemical nickel plating quality, and after workpiece nickel plating, coating crystallization is even, careful, and binding force of cladding material is good, without obscission.Workpiece once hands over inspection qualification rate to reach 100%.Hardness of Electroplated Nickel Coating presses GB/T9790 test, and coating Vickers' hardness is about about 800HV, and the preparation of this activated solution is simple, and long service life, facilitates production maintenance, and production and application has stability and operability.If workpiece to be plated has greasy dirt, can adopt and carry out pre-treatment without after oily waste treatment, improve pre-treatment quality and efficiency.
Embodiment
The method of embodiment one one kinds electronickelling on brass, red copper alloy
1) workpiece is at room temperature placed in following pretreatment liquid 10s-20s and carries out pre-treatment, pretreatment liquid is:
2), after the workpiece after pre-treatment being cleaned in flowing cool water, workpiece is placed in nickel plating solution and carries out nickel plating; Solution formula and the condition of nickel plating are specially:
Condition: pH value 5.0, temperature 20 DEG C, current density 0.5A/dm
2-0.8A/dm
2.
3) workpiece of nickel plating is carried out cleaning 1-2min in flowing cool water, then carry out cleaning 1-2min in the warm water of 40-60 DEG C after, the workpiece surface with nickel coating is dried up, finally complete plating work.
After pre-treatment, before plating to workpiece visual observation and the complete visual observation to workpiece surface coating of plating as shown in Table 1.
Plating is complete to be tested by rule cross-hatching, winding method, file method, bending method of GB/T 5270 workpiece binding force of cladding material, and its test result as shown in Table 2.
If this workpiece surface to be plated has greasy dirt, in step 1) first workpiece surface to be plated is carried out without oily waste treatment before.Be specially without oily waste treatment, workpiece is placed at the temperature of 75 DEG C-95 DEG C following without oily waste treatment solution until workpiece surface is without greasy dirt, describedly without oily waste treatment liquid be:
Step 1) in being formulated as of pretreatment liquid comprise the steps:
A prepares the consumption of nitric acid, sulfuric acid and hydrochloric acid by the proportioning in formula;
B injects the water of formula about 1/2 in tank liquor pond;
C adds sulfuric acid while stirring;
Temperature for the treatment of d reduces by less than 50 DEG C, adds nitric acid while stirring;
E adds hydrochloric acid, stirs;
F adds water to the specified volume in formula.
The method of embodiment 21 kinds electronickelling on brass, red copper alloy
1) workpiece is at room temperature placed in following pretreatment liquid 10s-20s and carries out pre-treatment, pretreatment liquid is:
Pretreatment liquid adopts the pretreatment liquid compound method in embodiment one to be configured.
Step 2) with embodiment one step 2).
Step 3) with embodiment one step 3).
After pre-treatment, before plating to workpiece visual observation and the complete visual observation to workpiece surface coating of plating as shown in Table 1.
Plating is complete to be tested by rule cross-hatching, winding method, file method, bending method of GB/T 5270 workpiece binding force of cladding material, and its test result as shown in Table 2.
The method of embodiment 31 kinds electronickelling on brass, red copper alloy
1) workpiece is at room temperature placed in following pretreatment liquid 10s-20s and carries out pre-treatment, pretreatment liquid is:
Pretreatment liquid adopts the pretreatment liquid compound method in embodiment one to be configured.
Step 2) with embodiment one step 2).
Step 3) with embodiment one step 3).
After pre-treatment, before plating to workpiece visual observation and the complete visual observation to workpiece surface coating of plating as shown in Table 1.
Plating is complete to be tested by rule cross-hatching, winding method, file method, bending method of GB/T 5270 workpiece binding force of cladding material, and its test result as shown in Table 2.
The method of comparative example one one kinds electronickelling on brass, red copper alloy
1) workpiece is at room temperature placed in following pretreatment liquid 30-40s and carries out pre-treatment, pretreatment liquid is:
Pretreatment liquid adopts the pretreatment liquid compound method in embodiment one to be configured.
Step 2) with embodiment one step 2).
Step 3) with embodiment one step 3).
After pre-treatment, before plating to workpiece visual observation and the complete visual observation to workpiece surface coating of plating as shown in Table 1.
Plating is complete to be tested by rule cross-hatching, winding method, file method, bending method of GB/T 5270 workpiece binding force of cladding material, and its test result as shown in Table 2.
The method of comparative example 21 kinds electronickelling on brass, red copper alloy
1) workpiece is at room temperature placed in following pretreatment liquid 10s-20s and carries out pre-treatment, pretreatment liquid is:
Sulfuric acid (H
2sO
4) 320ml/L
Hydrochloric acid (HCL) 10ml/L
Water surplus;
Step 2) with embodiment one step 2).
Step 3) with embodiment one step 3).
After pre-treatment, before plating to workpiece visual observation and the complete visual observation to workpiece surface coating of plating as shown in Table 1.
Plating is complete to be tested by rule cross-hatching, winding method, file method, bending method of GB/T 5270 workpiece binding force of cladding material, and its test result as shown in Table 2.
The method of comparative example 31 kinds electronickelling on brass, red copper alloy
1) workpiece is at room temperature placed in following pretreatment liquid 10s-20s and carries out pre-treatment, pretreatment liquid is:
Nitric acid (HNO
3) 310ml/L
Sulfuric acid (H
2sO
4) 320ml/L
Water surplus;
Step 2) with embodiment one step 2).
Step 3) with embodiment one step 3).
After pre-treatment, before plating to workpiece visual observation and the complete visual observation to workpiece surface coating of plating as shown in Table 1.
Plating is complete to be tested by rule cross-hatching, winding method, file method, bending method of GB/T 5270 workpiece binding force of cladding material, and its test result as shown in Table 2.
The method of comparative example 41 kinds electronickelling on brass, red copper alloy
1) workpiece is at room temperature placed in following pretreatment liquid 10s-20s and carries out pre-treatment, pretreatment liquid is:
Nitric acid (HNO
3) 420ml/L
Hydrochloric acid (HCL) 15ml/L
Water surplus;
Step 2) with embodiment one step 2).
Step 3) with embodiment one step 3).
After pre-treatment, before plating to workpiece visual observation and the complete visual observation to workpiece surface coating of plating as shown in Table 1.
Plating is complete to be tested by rule cross-hatching, winding method, file method, bending method of GB/T 5270 workpiece binding force of cladding material, and its test result as shown in Table 2.
Table one plates the visual observation of coating surface after front workpiece surface and plating
| Workpiece surface luminance brightness before plating | Workpiece surface roughness before plating | Deposit appearance | |
| Embodiment one | Light, have metalluster | Smooth surface, without coarse | Plated layer compact, evenly |
| Embodiment two | Light, have metalluster | Smooth surface, without coarse | Plated layer compact, evenly |
| Embodiment three | Light, slightly metalluster | Smooth surface, without coarse | Plated layer compact, evenly |
| Comparative example one | Luminance brightness is low, slightly metalluster | Surface is slightly coarse, rough | Coating covers not exclusively, coating local roughness |
| Comparative example two | Without light, there is no metalluster | Surface irregularity, rough | Part surface covers without coating |
| Comparative example three | Light is low, slightly metalluster | Surface is more coarse, rough | Coating covers not exclusively, coating local roughness |
| Comparative example four | Without light, there is no metalluster | Surface irregularity, rough | Part surface covers without coating |
Table two workpiece binding force of cladding material test result.
| Between coating and bell metal workpiece substrate | |
| Embodiment one | Be not separated, without coming off |
| Embodiment two | Be not separated, without coming off |
| Embodiment three | Be not separated, without coming off |
| Comparative example one | Be not separated, slightly come off |
| Comparative example two | Be separated, and come off |
| Comparative example three | Be not separated, slightly come off |
| Comparative example four | Be separated, and come off |
Claims (6)
1. a method for electronickelling on brass, red copper alloy, is characterized in that, comprise the steps,
1) workpiece is at room temperature placed in following pretreatment liquid 8s-15s and carries out pre-treatment, described pretreatment liquid is:
2), after the workpiece after pre-treatment being cleaned in flowing cool water, workpiece is placed in nickel plating solution and carries out nickel plating;
3) workpiece of nickel plating is carried out cleaning 1-2min in flowing cool water, then carry out cleaning 1-2min in the warm water of 40-60 DEG C after, the workpiece surface with nickel coating is dried up.
2. the method for a kind of electronickelling on brass, red copper alloy according to claim 1, is characterized in that, described step 1) in pretreatment liquid be:
3. the method for a kind of electronickelling on brass, red copper alloy according to claim 1, is characterized in that, described step 2) in the solution formula of nickel plating and condition be specially:
Condition: pH value 5.0-5.5, temperature 16 DEG C-30 DEG C, current density 0.5A/dm
2-0.8A/dm
2.
4. the method for a kind of electronickelling on brass, red copper alloy according to claim 1, is characterized in that, in step 1) first workpiece is carried out without oily waste treatment before.
5. the method for a kind of electronickelling on brass, red copper alloy according to claim 4, it is characterized in that, describedly to be specially without oily waste treatment, workpiece is placed at the temperature of 75 DEG C-95 DEG C following without oily waste treatment solution until workpiece surface is without greasy dirt, describedly without oily waste treatment liquid be:
6., according to the method for the arbitrary described a kind of electronickelling on brass, red copper alloy of claim 1-5, it is characterized in that, described step 1) pretreatment liquid adopts following steps to be configured:
A prepares the consumption of nitric acid, sulfuric acid and hydrochloric acid by the proportioning in formula;
B injects the water of formula about 1/2 in tank liquor pond;
C adds sulfuric acid while stirring;
Temperature for the treatment of d reduces by less than 50 DEG C, adds nitric acid while stirring;
E adds hydrochloric acid, stirs;
F adds water to the specified volume in formula.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510333599.5A CN104846410A (en) | 2015-06-16 | 2015-06-16 | Method for electroplating nickel on brass and red copper alloy |
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|---|---|---|---|
| CN201510333599.5A CN104846410A (en) | 2015-06-16 | 2015-06-16 | Method for electroplating nickel on brass and red copper alloy |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109267115A (en) * | 2018-10-29 | 2019-01-25 | 江西凤凰光学科技有限公司 | A kind of copper components nickel plating process |
| CN113463144A (en) * | 2021-06-29 | 2021-10-01 | 惠州市安泰普表面处理科技有限公司 | Method for plating nickel on surface of brass substrate |
| WO2023035790A1 (en) * | 2021-09-08 | 2023-03-16 | 盛美半导体设备(上海)股份有限公司 | Substrate treatment method |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57137498A (en) * | 1982-01-09 | 1982-08-25 | Mitsubishi Gas Chem Co Inc | Bright nickel plating method for copper or copper alloy |
| CN1249360A (en) * | 1997-01-29 | 2000-04-05 | 美克株式会社 | Micro etching agent of copper and copper alloy |
| CN101619476A (en) * | 2009-07-30 | 2010-01-06 | 核工业理化工程研究院华核新技术开发公司 | Treatment process before plating environment-friendly copper alloy |
| CN102254842A (en) * | 2010-05-20 | 2011-11-23 | 台湾积体电路制造股份有限公司 | Activation treatments in plating processes |
| CN102345145A (en) * | 2011-09-30 | 2012-02-08 | 成都四威高科技产业园有限公司 | Method for electroplating surface of molybdenum and copper alloy |
| CN103695976A (en) * | 2013-12-17 | 2014-04-02 | 扬州虹扬科技发展有限公司 | Treatment method for copper product before electronickelling |
| CN103806059A (en) * | 2012-11-08 | 2014-05-21 | 无锡新三洲特钢有限公司 | Method for electroplating silver on beryllium bronze part |
| CN103981551A (en) * | 2014-04-29 | 2014-08-13 | 扬州虹扬科技发展有限公司 | Processing method of brass product before electroplating nickel |
-
2015
- 2015-06-16 CN CN201510333599.5A patent/CN104846410A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57137498A (en) * | 1982-01-09 | 1982-08-25 | Mitsubishi Gas Chem Co Inc | Bright nickel plating method for copper or copper alloy |
| CN1249360A (en) * | 1997-01-29 | 2000-04-05 | 美克株式会社 | Micro etching agent of copper and copper alloy |
| CN101619476A (en) * | 2009-07-30 | 2010-01-06 | 核工业理化工程研究院华核新技术开发公司 | Treatment process before plating environment-friendly copper alloy |
| CN102254842A (en) * | 2010-05-20 | 2011-11-23 | 台湾积体电路制造股份有限公司 | Activation treatments in plating processes |
| CN102345145A (en) * | 2011-09-30 | 2012-02-08 | 成都四威高科技产业园有限公司 | Method for electroplating surface of molybdenum and copper alloy |
| CN103806059A (en) * | 2012-11-08 | 2014-05-21 | 无锡新三洲特钢有限公司 | Method for electroplating silver on beryllium bronze part |
| CN103695976A (en) * | 2013-12-17 | 2014-04-02 | 扬州虹扬科技发展有限公司 | Treatment method for copper product before electronickelling |
| CN103981551A (en) * | 2014-04-29 | 2014-08-13 | 扬州虹扬科技发展有限公司 | Processing method of brass product before electroplating nickel |
Non-Patent Citations (1)
| Title |
|---|
| 张允诚等: "《电镀手册（第4版》", 31 December 2011, 国防工业出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109267115A (en) * | 2018-10-29 | 2019-01-25 | 江西凤凰光学科技有限公司 | A kind of copper components nickel plating process |
| CN113463144A (en) * | 2021-06-29 | 2021-10-01 | 惠州市安泰普表面处理科技有限公司 | Method for plating nickel on surface of brass substrate |
| WO2023035790A1 (en) * | 2021-09-08 | 2023-03-16 | 盛美半导体设备(上海)股份有限公司 | Substrate treatment method |
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