CN107231753B - A kind of heavy nickel gold method improving plating leakage - Google Patents
A kind of heavy nickel gold method improving plating leakage Download PDFInfo
- Publication number
- CN107231753B CN107231753B CN201710485686.1A CN201710485686A CN107231753B CN 107231753 B CN107231753 B CN 107231753B CN 201710485686 A CN201710485686 A CN 201710485686A CN 107231753 B CN107231753 B CN 107231753B
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- Prior art keywords
- heavy nickel
- consent
- nickel gold
- plating leakage
- layer board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to plating of printed circuit board nickel golden collar domains, specially a kind of heavy nickel gold method for improving plating leakage, since consent generally uses solder mask consent, this method after processing before heavy nickel gold by carrying out multi-layer board to take off film process, so that NaOH solution is chemically reacted with residual micro-corrosion liquid in consent hole, cooperate the mode of spray again, NaOH solution can be made to smoothly enter the consent that radius-thickness ratio is greater than 8:1, eliminate the remaining micro-corrosion liquid in consent hole, greatly improve the problem of consent hole built-in potential difference, it gets ready for subsequent heavy nickel processing, the heavy nickel golden plate plating leakage fraction defective of solder mask consent is set to drop to 2% from 95% before, manufacturing scrap is greatly reduced, reduce production cost.
Description
Technical field
The present invention relates to plating of printed circuit board nickel golden collar domain more particularly to a kind of heavy nickel gold methods for improving plating leakage.
Background technique
Heavy nickel gold is a kind of technique in PCB naked copper surface coating solderability coating, and principle is in naked copper face
Nickel plating is learned, then carries out chemistry leaching gold again.Heavy nickel gold process had not only been able to satisfy the requirement of increasingly complicated PCB assembly, welding, but also ratio
The cost of electronickelling gold is low, while the side of conducting wire can also be effectively protected, and prevents from generating in use bad
Phenomenon, therefore be widely adopted in the manufacturing of PCB.
But usually occurring the case where heavy nickel golden plate plating leakage in actual production process, the origin cause of formation of plating leakage is nickel cylinder
Activity is not able to satisfy the reaction potential energy of PAD (pad) position, leads to heavy nickel chemical reaction midway stopping or basic non-deposited metal
Nickel.Such as: the heavy nickel golden plate of welding resistance consent, welding resistance consent is not full or development, afterwards bake it is bad etc. due to frequently result in hole
Welding resistance cannot be filled up entirely, cause to form slit or cavity in hole, it, will be residual in consent hole then after microetch nog plate process
Part micro-corrosion liquid is stayed, it is poor to thereby result in hole built-in potential, prevent from going up palladium when activation, and then cannot sink nickel gold, but also meeting
Lead to all PAD and Kong Douhui plating leakages being connected with plating leakage position.
Currently, general improve the heavy nickel golden plate leakage of welding resistance consent using microetch cylinder is skipped plus the method for extending activation time
The problem of plating, this method process are as follows: pre-treatment (microetch, brushing and sandblasting) → acid deoiling agent → bis- washings → preimpregnation (sulphur
Acid) → activation (extend activation time 1-2 minutes) → pure water washes → and pickling (sulfuric acid) → pure water washes → chemical nickel (Ni/P) → pure
Washing → chemistry gold → recycling washing → pure water is washed → post-processes.This method for improving the heavy nickel golden plate plating leakage of welding resistance consent, changes
It has been apt to the plating leakage problem of the lesser heavy nickel golden plate of aspect ratio, but the heavy nickel gold of the multilayer welding resistance consent for radius-thickness ratio greater than 8:1
Plate, this method do not have the effect for preventing plating leakage but, still cause a large amount of rejected product, cause to be scrapped in large quantities, production
Cost increases suddenly.
Summary of the invention
The present invention provides a kind of pass through and handles before heavy nickel gold aiming at the problem that radius-thickness ratio sinks the plating leakage of nickel golden plate greater than 8:1
Increase that take off film process big and have the heavy nickel gold method of the immersion gold plate plating leakage of welding resistance consent to solve aspect ratio afterwards.
To achieve the above object, the invention adopts the following technical scheme:
A kind of heavy nickel gold method improving plating leakage, including the multi-layer board after completion welding resistance technique is carried out the heavy preceding place of nickel gold
Manage, be used to form the Catalytic Layer of heavy nickel reactant activation processing, in multi-layer board plate face deposited nickel layer heavy nickel processing with
And the leaching gold of deposition thereof is handled on the nickel layer, the multi-layer board is equipped at least one piece naked copper surface for being used to sink nickel gold
And at least one consent clogged by solder mask carries out multi-layer board to take off film process before heavy nickel gold after processing, it is described to take off
Film process, which is such that, uses volume ratio to carry out spray process to multi-layer board for 3~5% NaOH solution.
Further, described to take off in film process, so that the mode of the aperture of consent upward is placed multi-layer board.
Further, wherein the time of spray process is 1~2 minute.
Further, wherein the temperature of NaOH solution is 50 ± 2 DEG C.
Further, after carrying out taking off film process, ultrasonic cleaning is carried out to multi-layer board using ultrasonic cleaning apparatus.
Further, wherein ultrasonic cleaning is such that the aperture of consent mode directed downwardly is made to place multi-layer board, will
The power setting of ultrasonic cleaning apparatus is the 20~60% of the maximum power value of ultrasonic cleaning apparatus.
Further, the scavenging period of ultrasonic cleaning is 1~2 minute.
Further, which before activation must be without for being roughened on multi-layer board at the microetch on naked copper surface
Manage cylinder.
Further, the time of the activation processing is 3~4 minutes.
Compared with prior art, the beneficial effects of the present invention are: this improve plating leakage heavy nickel gold method, since consent is general
Using solder mask consent, by carrying out taking off film process to multi-layer board after processing before heavy nickel gold, so that NaOH solution and consent
Micro-corrosion liquid is remained in hole to be chemically reacted, then cooperates the mode of spray, NaOH solution can be made to smoothly enter radius-thickness ratio big
In the consent of 8:1, the residual micro-corrosion liquid in consent hole is eliminated, greatly improves asking for solder mask consent hole built-in potential difference
Topic gets ready for subsequent heavy nickel processing, makes the heavy nickel golden plate plating leakage fraction defective of solder mask consent under 95% before
It is down to 2%, manufacturing scrap is greatly reduced, reduces production cost.
Specific embodiment
In order to more fully understand technology contents of the invention, combined with specific embodiments below to technical solution of the present invention
It is described further and illustrates.
Embodiment
The present invention provides a kind of heavy nickel gold method for improving plating leakage, and using this method, on multiple-plate naked copper surface, coating can
Weldering property coating, the multi-layer board be equipped at least one piece for sink nickel gold naked copper surface and at least one filled out by solder mask
The consent of plug, the specific procedure of processing for coating solderability coating are as follows:
S1, heavy nickel gold pre-treatment
Heavy nickel gold pre-treatment is such that into plate (multi-layer board) → microetch (using NaS2O8And H2SO4Solution carries out
Microetch) → overflow washing twice → nog plate (carrying out nog plate processing using the soft brush of 1000 mesh) → sandblasting (uses 280-320 mesh Buddha's warrior attendant
Sand carries out blasting treatment) → dirt removal water → overflow washing → ultrasonic wave embathes → water column type rinses → and waves high-pressure washing → DI water
It washes → drying → and cools down → ejecting plate
S2, take off film process: the mode of the aperture of consent upward being made to place multi-layer board, use volume ratio for 3~5% NaOH
Solution carries out spray process to multi-layer board, and wherein the temperature of NaOH solution is 50 ± 2 DEG C, and the time of spray process is 1~2 point
Clock.
S3, ultrasonic cleaning: the aperture of consent mode directed downwardly is made to place multi-layer board, using ultrasonic cleaning apparatus to more
Laminate carries out ultrasonic cleaning.By the 20 of the maximum power value that the power setting of ultrasonic cleaning apparatus is ultrasonic cleaning apparatus
~60%, the scavenging period of ultrasonic cleaning is 1~2 minute.
S4, heavy nickel gold
Heavy nickel gold is such that upper plate → exchange groove → acid deoiling (50 ± 5 DEG C of temperature, impregnate 4 minutes) → heat
(27 ± 3 DEG C of temperature, impregnate 3~4 points for washing → one-stage water wash → second level washing → pre- pickling (room temperature is impregnated 60 seconds) → activation
Clock) → activation after leaching → one-stage water wash → second level washing → chemical sinking nickel (82 ± 3 DEG C of temperature, impregnate 22 minutes, nickel thickness 3-5um)
→ one-stage water wash → second level washing → chemistry turmeric (85 ± 5 DEG C of temperature, impregnate 10 minutes, golden thickness >=0.05um) → recycling washing
→ one-stage water wash → second level washing → lower plate, wherein the microetch processing cylinder for being roughened naked copper surface on multi-layer board is eliminated, and
The time of activation processing was increased to 3~4 minutes by original 2 minutes.
S5, heavy nickel gold post-processing
Heavy nickel gold post-processing is such that into plate → pickling (room temperature is impregnated 60 seconds) → washing → ultrasonic cleaning
→ drying → ejecting plate.
S6, quality testing is carried out to heavy nickel golden plate.
This improves the heavy nickel gold method of plating leakage, by carrying out taking off film process to multi-layer board after processing before heavy nickel gold, so that
NaOH solution is chemically reacted with residual micro-corrosion liquid in consent hole, then cooperates the mode of spray, and NaOH solution can be made smooth
Ground enters the consent that radius-thickness ratio is greater than 8:1, eliminates the residual micro-corrosion liquid in consent hole, greatly improves electricity in welding resistance consent hole
The problem of potential difference, gets ready for subsequent heavy nickel processing, makes the heavy nickel golden plate plating leakage fraction defective of solder mask consent from before
95% drop to 2%, manufacturing scrap is greatly reduced, reduces production cost.
It is described above that technology contents of the invention are only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (9)
1. a kind of heavy nickel gold method for improving plating leakage, including will complete the multi-layer board after welding resistance technique carry out heavy nickel gold pre-treatment,
Be used to form the Catalytic Layer of heavy nickel reactant activation processing, in multi-layer board plate face deposited nickel layer heavy nickel processing and
The leaching gold processing of deposition thereof on the nickel layer, the multi-layer board are equipped at least one piece for sinking the naked copper surface and extremely of nickel gold
A few consent clogged by solder mask, it is characterised in that:
Between processing before heavy nickel gold and being activated, first multi-layer board is carried out to take off film process, it is described to take off film process are as follows: to use body
Product carries out spray process to multi-layer board than the NaOH solution for 3~5%, and NaOH solution is made to enter the consent that radius-thickness ratio is greater than 8:1
In.
2. the heavy nickel gold method according to claim 1 for improving plating leakage, it is characterised in that: it is described to take off in film process, make to fill in
The mode of the aperture in hole upward places multi-layer board.
3. the heavy nickel gold method according to claim 2 for improving plating leakage, it is characterised in that: wherein the time of spray process is
1~2 minute.
4. the heavy nickel gold method according to claim 3 for improving plating leakage, it is characterised in that: wherein the temperature of NaOH solution is
50±2℃。
5. the heavy nickel gold method as claimed in any of claims 1 to 4 for improving plating leakage, it is characterised in that: carrying out
After taking off film process, ultrasonic cleaning is carried out to multi-layer board using ultrasonic cleaning apparatus.
6. the heavy nickel gold method according to claim 5 for improving plating leakage, it is characterised in that: wherein ultrasonic cleaning is in this way
It carries out: the power setting ultrasonic cleaning for making the aperture of consent mode directed downwardly place multi-layer board for ultrasonic cleaning apparatus
The 20~60% of the maximum power value of equipment.
7. the heavy nickel gold method according to claim 6 for improving plating leakage, it is characterised in that: the scavenging period of ultrasonic cleaning
It is 1~2 minute.
8. the heavy nickel gold method as claimed in any of claims 1 to 4 for improving plating leakage, it is characterised in that: the heavy nickel
Golden method must handle cylinder without the microetch for being roughened naked copper surface on multi-layer board before activation processing.
9. the heavy nickel gold method as claimed in any of claims 1 to 4 for improving plating leakage, it is characterised in that: the work
The time for changing processing is 3~4 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710485686.1A CN107231753B (en) | 2017-06-23 | 2017-06-23 | A kind of heavy nickel gold method improving plating leakage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710485686.1A CN107231753B (en) | 2017-06-23 | 2017-06-23 | A kind of heavy nickel gold method improving plating leakage |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107231753A CN107231753A (en) | 2017-10-03 |
| CN107231753B true CN107231753B (en) | 2019-08-16 |
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ID=59936495
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710485686.1A Active CN107231753B (en) | 2017-06-23 | 2017-06-23 | A kind of heavy nickel gold method improving plating leakage |
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| Country | Link |
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| CN (1) | CN107231753B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107815669B (en) * | 2017-11-02 | 2019-12-20 | 广东天承科技有限公司 | Method for electroless nickel and gold plating of PCB |
| CN114630496A (en) * | 2020-12-02 | 2022-06-14 | 黄信翔 | Electroless nickel-gold process capable of reducing chemical treatment steps and system thereof |
| CN113645770B (en) * | 2021-08-17 | 2022-09-06 | 江西景旺精密电路有限公司 | Method for solving OSP and gold immersion potential difference plating leakage |
| CN117646200B (en) * | 2023-12-08 | 2024-09-17 | 江西景旺精密电路有限公司 | Method for improving potential difference nickel corrosion of deposited nickel-gold |
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|---|---|---|---|---|
| CN103763869A (en) * | 2013-12-20 | 2014-04-30 | 广州兴森快捷电路科技有限公司 | Method for preparing immersion gold printed circuit board |
| CN103997860A (en) * | 2014-04-23 | 2014-08-20 | 奥士康精密电路（惠州）有限公司 | Selective surface treatment process method |
| CN104470236A (en) * | 2013-09-16 | 2015-03-25 | 深圳市兴经纬科技开发有限公司 | Post-immersing liquid of circuit board electroless nickel immersion gold and post-immersing method |
| CN105163509A (en) * | 2015-08-26 | 2015-12-16 | 江门崇达电路技术有限公司 | Surface processing method for nickel-gold deposition on whole printed circuit board (PCB) |
| CN105208797A (en) * | 2015-08-11 | 2015-12-30 | 深圳崇达多层线路板有限公司 | Manufacture method of semi-plugged nickel and gold immersion |
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2017
- 2017-06-23 CN CN201710485686.1A patent/CN107231753B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470236A (en) * | 2013-09-16 | 2015-03-25 | 深圳市兴经纬科技开发有限公司 | Post-immersing liquid of circuit board electroless nickel immersion gold and post-immersing method |
| CN103763869A (en) * | 2013-12-20 | 2014-04-30 | 广州兴森快捷电路科技有限公司 | Method for preparing immersion gold printed circuit board |
| CN103997860A (en) * | 2014-04-23 | 2014-08-20 | 奥士康精密电路（惠州）有限公司 | Selective surface treatment process method |
| CN105208797A (en) * | 2015-08-11 | 2015-12-30 | 深圳崇达多层线路板有限公司 | Manufacture method of semi-plugged nickel and gold immersion |
| CN105163509A (en) * | 2015-08-26 | 2015-12-16 | 江门崇达电路技术有限公司 | Surface processing method for nickel-gold deposition on whole printed circuit board (PCB) |
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| CN107231753A (en) | 2017-10-03 |
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