CN103366645A - Light emitting display device - Google Patents
Light emitting display device Download PDFInfo
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- CN103366645A CN103366645A CN2013100945904A CN201310094590A CN103366645A CN 103366645 A CN103366645 A CN 103366645A CN 2013100945904 A CN2013100945904 A CN 2013100945904A CN 201310094590 A CN201310094590 A CN 201310094590A CN 103366645 A CN103366645 A CN 103366645A
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- pcb board
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- box body
- led
- display unit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45139—Silver (Ag) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- Illuminated Signs And Luminous Advertising (AREA)
- Led Device Packages (AREA)
Abstract
The invention belongs to the field of electric products, in particular to a light emitting display device with a compact structure. The light emitting display device provided by an embodiment of the invention comprises a box body provided with location columns, and a first PCB (printed circuit board) arranged in the box body, wherein location holes correspondingly connected with the location columns, a printed circuit and an LED (light-emitting diode) wafer are arranged on the first PCB; an anode and a cathode of the LED wafer are electrically connected with the corresponding printed circuit by fine wires respectively; and the LED wafer and the fine wires are packaged by a sealant. The light emitting display device is simple and efficient in package structure, a light emitting point is very small in size and is protected by the insulating sealant, so that the LED wafer on the first PCB can operate stably, and the technical effects of compact structure, good display effect, low cost and stability are achieved.
Description
Technical field
The invention belongs to field of electronics, relate in particular to a kind of luminous display unit of compact conformation.
Background technology
Nowadays, a display device can be set all generally on family expenses or the worker's electrical appliance, obtain the information such as the mode of operation of electrical equipment and use state for the user.Take air conditioner as example, at the indoor set of air conditioner a display device is set, is used for showing that current duty and the control situation of air conditioner is the mode that each air-conditioning manufacturer generally adopts.
In order to satisfy the user for the requirement of display device sharpness, the element that illuminates that display device is built-in also has been transformed into the LED lamp gradually from common lamp.But, because the LED lamp that existing LED lamp holder generally is bonded LED lamp or long pin just causes having occurred some problems.Particularly, for bonded LED lamp, need to paster be installed at circuit board, and the size of paster is generally larger, such as the common 1*5mm that is of a size of, when a lot of adopting surface mounted LEDs were put together, the space that needs was larger, and price is also higher; And for the LED lamp of long pin, its space that takies is larger than adopting surface mounted LED, and needs the pin that extra mechanism could fixed L ED.So it is limited and the display device sharpness required the again requirement of high air conditioner room unit that these two kinds of lamps all can not satisfy structure space.How under compact structure, to realize display requirement, become the technical matters that needs to be resolved hurrily.
Summary of the invention
In view of above-mentioned technical matters, purpose of the present invention namely is to provide a kind of luminous display unit, be intended to solve the technical matters that existing display device space structure is large, cost is higher, with the technique effect that implementation structure is compact, display effect is good and with low cost and stable.
To achieve these goals, the technical solution adopted in the present invention is:
A kind of luminous display unit comprises the box body that carries reference column and is arranged on the first pcb board in the box body, is provided with the pilot hole that join corresponding to described reference column and P.e.c. on described the first pcb board, as improvement:
Also be provided with the luminous wafer of LED on described the first pcb board, the both positive and negative polarity of the luminous wafer of described LED is realized being electrically connected by fine wire and corresponding P.e.c. respectively, and the luminous wafer of described LED and described fine wire are encapsulated by fluid sealant.
Particularly, described fine wire comprises that diameter is spun gold, filamentary silver, copper wire or the aluminium wire of 0.01～0.2mm.
Further, described fine wire all is connected by ultrasound wave with the tie point of the luminous wafer of described LED and P.e.c..
Particularly, described fluid sealant is the insulating gel material.
Further, the luminous wafer of described LED is arranged on the side towards the box body display direction on described the first pcb board, and the pin of described the first pcb board extends to a dorsad side of box body display direction of described the first pcb board.
Further, be provided with first between the inside surface of described box body display direction and described the first pcb board and fill glue, described the first a pcb board dorsad side of box body display direction is provided with the second filling glue, and the pin of described the first pcb board extends to outside described the second filling glue.
Further, be provided with on the inside surface of described box body display direction or the outside surface and the corresponding patterns membrane of displaying contents; And described patterns membrane comprises printing opacity place and light tight place, and described printing opacity place is corresponding with the position of the luminous wafer of described LED.
Further, the pin of described the first pcb board be arranged on described box body in the second pcb board on led drive circuit link to each other; Perhaps, the pin of described the first pcb board is electrically connected on the demonstration position that is arranged in the described box body.
Luminous display unit provided by the invention owing to directly adopting the luminous wafer of LED as luminescence unit or luminous point, be there will be no the so complicated encapsulating structure of paster LED, so the size of luminous point is very little on pcb board; In time protect by fluid sealant, and filling glue is set in box body, so that the work that the luminous wafer of LED can be stable, with the technique effect that implementation structure is compact, display effect is good and with low cost and stable.
Description of drawings
Fig. 1 is the cut-open view of the luminous display unit that provides of the embodiment of the invention;
Fig. 2 is the schematic perspective view of the luminous display unit that provides of the embodiment of the invention;
Fig. 3 is the enlarged diagram at A place among Fig. 2;
Fig. 4 is the schematic diagram of the patterns membrane that provides of the embodiment of the invention.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
Fig. 1 and Fig. 2 are respectively cut-open view and the schematic perspective views of the luminous display unit that provides of the embodiment of the invention; Fig. 3 is the local enlarged diagram of Fig. 2.For convenience of explanation, only show the part relevant with the present embodiment.Referring to Fig. 1 to Fig. 3:
A kind of luminous display unit comprises box body 1 and is arranged on the first pcb board 2 in the box body 1, is provided with reference column 11 on the box body 1, and this reference column 11 is corresponding with pilot hole 21 on the first pcb board 2 respectively, and is located by connecting; Be provided with P.e.c. 22 and the luminous wafer 23 of LED at the first pcb board 2, the both positive and negative polarity of the luminous wafer 23 of LED is realized being electrically connected with corresponding P.e.c. 22 by fine wire 24 respectively, and the luminous wafer 23 of LED is encapsulated by fluid sealant 25 with fine wire 24.
Send light after luminous wafer 23 energisings of LED between P.e.c. 22 both positive and negative polarities, because the fine wire 24 of the luminous wafer 23 of LED and electrical connection has fluid sealant 25 to encapsulate, so can't shorten the life-span because of air oxidation.Therefore, adopt that invention the present embodiment provides the luminous display unit structure, can be at an easy rate at printed circuit board (PCB) (i.e. the first pcb board 2) realization LED luminous point.
In specific implementation process, lametta 24 can be as required and the requirement of design, adopts one or more of gold, silver, copper or aluminium wire, and as preferred embodiment, the diameter restrictions of this fine wire 24 is 0.01～0.2mm; And, fine wire 24 is connected by ultrasound wave with the tie point of the luminous wafer 23 of LED, fine wire 24 also is connected by ultrasound wave with the tie point of P.e.c. 22, just can on very little yardstick, realize the electrical connection between printed circuit board (PCB) (i.e. the first pcb board 2) and the luminous wafer 23.On the other hand, the glue that the luminous wafer 23 of sealing LED reaches the fine wire 24 that is electrically connected with it is the insulation inorganic glue, therefore can realize reliably the isolated of the luminous wafer 23 of LED and fine wire 24 and outside air, simultaneously, resists the impact of higher temperature.
As shown in the figure, the luminous wafer 23 of LED all is arranged on the same side towards box body 1 display direction on the first pcb board 2, and namely the light emission side of the first pcb board 2 is to the display direction of box body 1, so that externally luminous; The pin 26 of the first pcb board 2 then extends to a dorsad side of box body 1 display direction of the first pcb board 2, so that from being arranged on the second pcb board 5 in the box body or showing that the position obtains driving and/or power supply (the second pcb board 5 or demonstration position all do not show) on figure.
As preferred embodiment, be provided with on the inside surface of box body 1 display direction or the outside surface and the corresponding patterns membrane 3 of displaying contents.As shown in Figure 4, patterns membrane 3 comprises printing opacity place 31 and light tight place 32, and printing opacity place 31 is corresponding with the position of the luminous wafer 23 of LED, so that the light that the luminous wafer 23 of LED is sent appears, demonstrates concrete displaying contents.
On the other hand, be provided with first between the inside surface of box body 1 display direction and the first pcb board 2 and fill glue 41, the first pcb board 2 a dorsad side of box body 1 display direction is provided with the second filling glue 42, and the pin 26 of the first pcb board 2 extends to second and fills outside the glue 42.Because first, second is filled glue and is insulating gel, therefore this insulating gel and reference column 11 just can be fixed on the display surface of the first pcb board 2 on the box body 1.And the pin 26 by the first pcb board 2 extends to the second mode of filling outside the glue 42, from being arranged on equally the second pcb board 5 in the box body or showing that the position obtains driving and/or power supply, drives and/or power supply so that luminous wafer 23 normal luminous the providing of LED to be provided.
The luminous display unit that provides according to the embodiment of the invention; compare as the display device of luminescence unit with the LED of direct employing adopting surface mounted LED or long pin; encapsulating structure is simply efficient; so the size of luminous point is very little; further by the fluid sealant of insulation luminous point is protected; and in box body, fill insulating gel, so that the work that the luminous wafer of the LED on the first pcb board can be stable, to reach compact conformation, technique effect that display effect is good, with low cost and stable.
The above only is preferred embodiment of the present invention, not in order to limit the present invention, although with reference to previous embodiment the present invention has been carried out more detailed explanation, for a person skilled in the art, it still can be made amendment or part technical characterictic wherein is equal to replacement the technical scheme that aforementioned each embodiment puts down in writing.All any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. luminous display unit, comprise the box body (1) that carries reference column (11) and be arranged on interior the first pcb board (2) of box body (1), be provided with on described the first pcb board (2) and the corresponding pilot hole that joins of described reference column (11) (21) and P.e.c. (22), it is characterized in that:
Also be provided with the luminous wafer of LED (23) on described the first pcb board (2), the both positive and negative polarity of the luminous wafer of described LED (23) is realized being electrically connected with corresponding P.e.c. (22) by fine wire (24) respectively, and the luminous wafer of described LED (23) is encapsulated by fluid sealant (25) with described fine wire (24).
2. luminous display unit as claimed in claim 1 is characterized in that, described fine wire (24) comprises that diameter is spun gold, filamentary silver, copper wire or the aluminium wire of 0.01～0.2mm.
3. luminous display unit as claimed in claim 1 is characterized in that, described fine wire (24) all is connected by ultrasound wave with the tie point of the luminous wafer of described LED (23) and P.e.c. (22).
4. luminous display unit as claimed in claim 1 is characterized in that, described fluid sealant (25) is the insulating gel material.
5. luminous display unit as claimed in claim 1, it is characterized in that, the luminous wafer of described LED (23) is arranged on the side towards box body (1) display direction on described the first pcb board (2), and the pin (26) of described the first pcb board (2) extends to a dorsad side of box body (1) display direction of described the first pcb board (2).
6. luminous display unit as claimed in claim 5, it is characterized in that, be provided with first between the inside surface of described box body (1) display direction and described the first pcb board (2) and fill glue (41), described the first pcb board (a 2) dorsad side of box body (1) display direction is provided with the second filling glue (42), and the pin (26) of described the first pcb board (2) extends to outside described the second filling glue (42).
7. such as each described luminous display unit of claim 1-6, it is characterized in that, be provided with and the corresponding patterns membrane of displaying contents (3) on the inside surface of described box body (1) display direction or the outside surface.
8. luminous display unit as claimed in claim 7 is characterized in that, described patterns membrane (3) comprises printing opacity place (31) and light tight place (32), and described printing opacity place 31 is corresponding with the position of the luminous wafer of described LED (23).
9. luminous display unit as claimed in claim 8 is characterized in that, the pin (26) of described the first pcb board (2) links to each other with led drive circuit on the second pcb board (4) that is arranged in the described box body (1).
10. luminous display unit as claimed in claim 8 is characterized in that, the pin (26) of described the first pcb board (2) is electrically connected on the demonstration position that is arranged in the described box body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100945904A CN103366645A (en) | 2013-03-22 | 2013-03-22 | Light emitting display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100945904A CN103366645A (en) | 2013-03-22 | 2013-03-22 | Light emitting display device |
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| CN103366645A true CN103366645A (en) | 2013-10-23 |
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|---|---|---|---|
| CN2013100945904A Pending CN103366645A (en) | 2013-03-22 | 2013-03-22 | Light emitting display device |
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Citations (12)
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| JP2005317820A (en) * | 2004-04-30 | 2005-11-10 | Korai Kagi Kofun Yugenkoshi | Light emitting diode package structure |
| CN201112415Y (en) * | 2007-09-17 | 2008-09-10 | 孙茂桐 | Pin type high power LED device |
| US20080237624A1 (en) * | 2007-03-30 | 2008-10-02 | Seoul Semiconductor Co., Ltd. | Led package with metal pcb |
| CN201359209Y (en) * | 2008-11-25 | 2009-12-09 | 董丽霞 | Flat-plate type lens integrated LED light source |
| CN101752275A (en) * | 2009-10-23 | 2010-06-23 | 中外合资江苏稳润光电有限公司 | Packaging method and packaging structure of light emitting diode (LED) module |
| CN201803228U (en) * | 2010-07-07 | 2011-04-20 | 杨东佐 | LED integrated structure |
| CN201936912U (en) * | 2010-06-25 | 2011-08-17 | 绍兴光彩显示技术有限公司 | Empty encapsulation patch white light digital tube |
| CN201936915U (en) * | 2010-12-22 | 2011-08-17 | 盐城六方体光电科技有限公司 | LED (light-emitting diode) encapsulating structure and LED module thereof |
| CN202025793U (en) * | 2010-11-30 | 2011-11-02 | 浙江彩虹光电有限公司 | Cyan LED (light emitting diode) lamp bead |
| CN202150488U (en) * | 2011-07-17 | 2012-02-22 | 吴发模 | Mounting structure used for LED wafers |
| CN202585527U (en) * | 2012-04-16 | 2012-12-05 | 苏州君耀光电有限公司 | Packaging structure of novel green light LED |
| CN203165376U (en) * | 2013-03-22 | 2013-08-28 | 美的集团武汉制冷设备有限公司 | Light-emitting display device |
-
2013
- 2013-03-22 CN CN2013100945904A patent/CN103366645A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005317820A (en) * | 2004-04-30 | 2005-11-10 | Korai Kagi Kofun Yugenkoshi | Light emitting diode package structure |
| US20080237624A1 (en) * | 2007-03-30 | 2008-10-02 | Seoul Semiconductor Co., Ltd. | Led package with metal pcb |
| CN201112415Y (en) * | 2007-09-17 | 2008-09-10 | 孙茂桐 | Pin type high power LED device |
| CN201359209Y (en) * | 2008-11-25 | 2009-12-09 | 董丽霞 | Flat-plate type lens integrated LED light source |
| CN101752275A (en) * | 2009-10-23 | 2010-06-23 | 中外合资江苏稳润光电有限公司 | Packaging method and packaging structure of light emitting diode (LED) module |
| CN201936912U (en) * | 2010-06-25 | 2011-08-17 | 绍兴光彩显示技术有限公司 | Empty encapsulation patch white light digital tube |
| CN201803228U (en) * | 2010-07-07 | 2011-04-20 | 杨东佐 | LED integrated structure |
| CN202025793U (en) * | 2010-11-30 | 2011-11-02 | 浙江彩虹光电有限公司 | Cyan LED (light emitting diode) lamp bead |
| CN201936915U (en) * | 2010-12-22 | 2011-08-17 | 盐城六方体光电科技有限公司 | LED (light-emitting diode) encapsulating structure and LED module thereof |
| CN202150488U (en) * | 2011-07-17 | 2012-02-22 | 吴发模 | Mounting structure used for LED wafers |
| CN202585527U (en) * | 2012-04-16 | 2012-12-05 | 苏州君耀光电有限公司 | Packaging structure of novel green light LED |
| CN203165376U (en) * | 2013-03-22 | 2013-08-28 | 美的集团武汉制冷设备有限公司 | Light-emitting display device |
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Application publication date: 20131023 |