CN103270816A - Method for forming deposition film, and method for producing display device - Google Patents
Method for forming deposition film, and method for producing display device Download PDFInfo
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- CN103270816A CN103270816A CN2011800628481A CN201180062848A CN103270816A CN 103270816 A CN103270816 A CN 103270816A CN 2011800628481 A CN2011800628481 A CN 2011800628481A CN 201180062848 A CN201180062848 A CN 201180062848A CN 103270816 A CN103270816 A CN 103270816A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
A masking film (13) is formed so as to have an opening in a display region (R1) (light-emitting region) and a sealing region. Subsequently, light-emitting layers (8R, 8G, 8B) having a strap-shaped pattern are formed. Then, the masking film (13) is peeled off, thereby forming light-emitting layers (8R, 8G, 8B) with high-definition patterns.
Description
Technical field
The present invention relates to by pattern form the regulation shape vapor-deposited film the formation method and possess the manufacture method of the display unit of the above-mentioned vapor-deposited film that is formed the regulation shape by pattern.
Background technology
In recent years, the flat plate panel display is applied in extensive stock and field, and requires more maximization, high image qualityization, the low consumption electrification of flat plate panel display.
Under such situation, the organic EL display that possesses the organic EL of the electroluminescence (Electroluminescence: following note is made " EL ") that utilizes organic material is shown great attention to as fully solid and at the flat plate panel display of aspect excellences such as low voltage drive, high-speed response, self-luminosity, wide view angle characteristic.
Organic EL display for example has following structure: by being provided with the TFT(thin-film transistor) the substrate that constitutes such as glass substrate on, be provided with the organic EL that is electrically connected with TFT.
For example, organic EL display in full color, generally speaking, on substrate, be formed with the organic EL of possess redness (R), green (G), blue (B) versicolor luminescent layer as arrangement of subpixels, by use TFT make these organic ELs selectively by the expected the luminous coloured image that carries out of brightness show.
Therefore, in order to make organic EL display, need be by each organic EL, pattern forms the luminescent layer that comprises the luminous organic material that sends versicolor light in accordance with regulations.
Form the method for such luminescent layer as pattern in accordance with regulations, for example known have vacuum vapour deposition, ink-jet method, a laser transfer method etc.And, for example at low molecule-type organic EL display (OLED), use vacuum vapour deposition more.
In vacuum vapour deposition, use the mask (being also referred to as shadow mask) of the opening be formed with predetermined pattern, make the relative with vapor deposition source by the evaporation face of substrate that mask is closely fixedly arranged.
Then, by making from the evaporation particle (filmogen) of the vapor deposition source opening evaporation by mask by the evaporation face, form the film of predetermined pattern.Evaporation is undertaken by every kind of color of luminescent layer, this is called " branch is coated with evaporation ".
Record in patent documentation 1 and patent documentation 2 and make mask little by little mobile with respect to substrate, the branch that carries out versicolor luminescent layer is coated with the method for evaporation.
Be coated with in the vapour deposition method at so existing branch, use the mask with the identical size of substrate, when evaporation, mask is fixed in the mode by the evaporation face of covered substrate.
Therefore, be coated with in the vapour deposition method at existing branch, the more big mask of substrate also just needs to maximize thereupon.
But, if mask is strengthened, then because the deadweight of mask is crooked or elongation and produce the gap easily between substrate and mask, and the size in this gap according to substrate by the difference of the position of evaporation face and difference.
Therefore, use existing branch to be coated with vapour deposition method, exist to be difficult to carry out pattern with high precision formation, the deviation that produces the evaporation position and the problem of colour mixture.
In addition, be coated with in the vapour deposition method at existing branch, if mask is strengthened, then keep the framework etc. of mask etc. also to become huge, its weight also increases, and therefore might cause being difficult to handle, produce aspect productivity and fail safe the problem of inconvenience.
And, being coated with in the vapour deposition method at existing branch, evaporation coating device and/or subsidiary device be gigantism, complicated too, and therefore, the device design difficulty that becomes arranges cost and also uprises valency.
As mentioned above, be coated with in the vapour deposition method at existing branch, present situation is: be difficult to form the vapor-deposited film that high meticulous map case forms to large substrate, for example can not realize dividing to the large substrate that uses the mask that surpasses 60 inches with the level of volume production being coated with evaporation.
The prior art document
Patent documentation
Patent documentation 1: Japanese Laid-Open Patent communique " spy opens flat 8-227276 communique (on September 3rd, 1996 is open) "
Patent documentation 2: Japanese Laid-Open Patent communique " spy opens 2000-188179 communique (on July 4th, 2000 is open) "
Summary of the invention
Invent problem to be solved
Therefore, motion is just like Figure 14 with use the branch of the shadow mask 102 littler than substrate 101 to be coated with vapour deposition method as shown in Figure 15.
Be coated with in the vapour deposition method at this branch, use the shadow mask 102 with peristome 102a, the nozzle 103 with the 103a of nozzle opening portion to form as a whole mask unit 105 with the deposition material supply source that is connected with nozzle 103.
And, as shown in figure 14, make substrate 101 by evaporation face 101a and shadow mask 102 relative configurations, and will be remained by the clearance G of evaporation face 101a and shadow mask 102 certain in, on the left and right directions in the drawings substrate 101 is scanned and the mask unit 105 that is fixed is carried out evaporation, thus, can be at the vapor-deposited film that is formed the pattern with strip by evaporation face 101a of substrate 101.
On the other hand, be coated with in the vapour deposition method at above-mentioned branch, as shown in figure 15, make substrate 101 fixing, on the left and right directions in the drawings mask unit 105 is scanned and the substrate 101 that is fixed is carried out evaporation, thus, can be at the vapor-deposited film that is formed the pattern with strip by evaporation face 101a of substrate 101.
Branch in such scan mode is coated with in the vapour deposition method, does not need to use as existing branch is coated with vapour deposition method the mask with the identical size of substrate, therefore can improve because mask size becomes big and issuable problem as described above.
But, be coated with in the vapour deposition method at the branch of the scan mode of such use shadow mask 102 littler than substrate 101, produce following such new problem.
Figure 16 be expression substrate 101 by the figure of evaporation face 101a, at large-scale substrate 101, exist respectively at each organic EL display: needs form the regional R1 of evaporation of vapor-deposited film (for example, luminescent layer etc.); With become the portion of terminal that do not need to form vapor-deposited film (for example, luminescent layer etc.) etc. do not need evaporation zone R2.
Originally, do not needing evaporation zone R2, do not need (for example to form vapor-deposited film, luminescent layer etc.), but the branch in Figure 14 and scan mode shown in Figure 15 is coated with vapour deposition method, as shown in figure 16, not only at evaporation zone R1 but also do not needing evaporation zone R2 also to form the vapor-deposited film 106 of the pattern with strip.
Below, according to Figure 17, to describing in the reason that does not need evaporation zone R2 also to form the vapor-deposited film 106 of the pattern with strip.
As shown in figure 17, branch in scan mode is coated with in the vapour deposition method, in order not need evaporation zone R2 to form vapor-deposited film 106, consideration arrives evaporations at shadow mask 102 and stops (OFF) line, is the right front ends of shadow mask 102 when arriving the left front end that does not need evaporation zone R2, and the evaporation particle that makes the nozzle opening portion of the nozzle that possesses from mask unit penetrate or not.
But, if like this, though then can not need evaporation zone R2 not form vapor-deposited film 106,, at evaporation zone R1, the evaporation amount that the zone of still leaving shadow mask 102 becomes in fact that the evaporation time shortens, the thickness of vapor-deposited film descends reduces the zone.
Therefore, branch in such scan mode is coated with in the vapour deposition method, in order to form the vapor-deposited film 106 with uniform thickness at evaporation zone R1, as shown in figure 16, can only be not only at evaporation zone R1 but also do not needing evaporation zone R2 also to form the vapor-deposited film 106 of the pattern with strip.
Figure 18 is for explanation because at the vapor-deposited film 106 that does not need evaporation zone R2 to form and the figure of issuable problem.
(a) of Figure 18 is the figure of the schematic configuration of branch that expression possesses the scan mode utilized as the luminescent layer organic EL display 113 that is coated with the vapor-deposited film 106 that vapour deposition method forms.
(b) of Figure 18 is the plane graph of the portion of terminal a of expression organic EL display 113.
The substrate 101 that possesses at the organic EL display 113 shown in Figure 18 (a) is not only at evaporation zone R1 but also do not needing evaporation zone R2 also to be formed with the vapor-deposited film 106 of the pattern with strip.
That is, shown in Figure 18 (b), also be formed with vapor-deposited film 106 at the portion of terminal 107a as the distribution 107 that does not need evaporation zone R2.
And, external circuit and be electrically connected through anisotropic conductive film (ACF:Anisotropic Conductive Film) 111 and flexible lead 112 etc. at the portion of terminal 107a of the distribution 107 that does not need evaporation zone R2 to form, but shown in Figure 18 (a), when when portion of terminal 107a forms vapor-deposited film 106, become and cause and conduct reason bad or that electric current leaks.
That is, as organic vapor deposition films such as luminescent layer, be under the situation of high-resistance film at vapor-deposited film 106, conduct badly, on the other hand, be under the situation of low-resistance film as metal film at vapor-deposited film 106, produce electric current and leak.
In addition, the end, 4 limit of evaporation zone R1 do not need evaporation zone R2, be the frame shape and be formed with sealing resin 109, by sealing resin 109, substrate 101 is fitted with hermetic sealing substrate 110.
Therefore, can make lamination anode (not shown), hole injection layer successively hold concurrently hole transporting layer (not shown), the vapor-deposited film 106 as luminescent layer, electron supplying layer (not shown), electron injecting layer (not shown) and negative electrode 108 and the organic EL that obtains not because the moisture in the atmosphere and oxygen and deterioration.
But when having vapor-deposited film 106 between sealing resin 109 and substrate 101, sealing resin 109 descends with the close property of substrate 101, forms emptying aperture etc.
Therefore, exist moisture and/or oxygen the low position of close property and/or produce the position of emptying aperture or by the film of vapor-deposited film 106 in enter from the outside and to be the sealing resin inside that the frame shape forms, organic EL is because moisture and/or oxygen and the problem of deterioration.
In order to solve such problem, consideration is before adhesive substrates 101 and hermetic sealing substrate 110, wiping with an organic solvent (wiping is got) is at the vapor-deposited film 106 that does not need evaporation zone R2 to form, but because organic EL is because of the moisture in organic solvent or the atmosphere and/or oxygen deterioration, so, generally after substrate 101 and hermetic sealing substrate 111 are fitted, and after substrate 101 was divided in the mode that becomes each organic EL display 113, wiping with an organic solvent was at the vapor-deposited film 106 that does not need evaporation zone R2 to form.
But even after adhesive substrates 101 and hermetic sealing substrate 111 are fitted, wiping with an organic solvent also produces following such problem under the situation of the vapor-deposited film 106 that does not need evaporation zone R2 to form.
In above-mentioned wiping operation, there is the insufficient and residual residue of easy wiping and when wiping, produces easily new foreign matter thereon, therefore be easy to generate the problem with the bad connection of external circuit.
In addition, under the situation of the applying of carrying out substrate 101 and hermetic sealing substrate 110 by sealing resin 109, also exist organic solvent that sealing resin 109 is produced infringement, at sealing resin 109, the problem that the moisture in the atmosphere and/or oxygen soak into from the position that sustains damage owing to above-mentioned organic solvent.
Therefore, for example utilization comprises that the rate of finished products of the organic EL display that the manufacture method of such wiping operation is made is low, is difficult to guarantee reliability.
The present invention finishes in view of the above problems, and its purpose is to provide the manufacture method of the display unit that the formation method that can carry out the vapor-deposited film that high meticulous pattern forms and rate of finished products and reliability be improved.
For the mode of dealing with problems
In order to solve the problems of the technologies described above, the formation method of vapor-deposited film of the present invention is characterised in that: be the formation method that forms the vapor-deposited film of vapor-deposited film at substrate, it has: the operation of the shielding film that can peel off in the regulation zone formation of aforesaid substrate; Form the operation of vapor-deposited film across above-mentioned shielding film at aforesaid substrate; With by peeling off the operation that above-mentioned shielding film forms above-mentioned vapor-deposited film the regulation shape.
According to said method, after the shielding film that the regulation zone formation of aforesaid substrate can be peeled off, on aforesaid substrate, across above-mentioned shielding film, form high meticulous vapor-deposited film with comparalive ease, by peeling off above-mentioned shielding film, above-mentioned vapor-deposited film can be formed the high meticulous pattern of regulation shape.
Therefore, according to said method, can carry out high meticulous pattern and form.
In addition, because after substrate forms vapor-deposited film, peeling off shielding film across shielding film, so can prevent from forming vapor-deposited film in the zone that is formed with shielding film.
In order to address the above problem, the manufacture method of display unit of the present invention has: the operation that forms a plurality of active elements at substrate; Form the operation of first electrode, above-mentioned first electrode is electrically connected with above-mentioned each active element and the viewing area on aforesaid substrate is rectangular formation; Form the operation of the organic layer that comprises luminescent layer at least at above-mentioned first electrode; At least form the operation of second electrode with polarity opposite with above-mentioned first electrode at above-mentioned organic layer, in the operation of the above-mentioned at least luminescent layer in forming above-mentioned organic layer, form the shielding film that to peel off in the mode that does not cover above-mentioned viewing area and cover as at least a portion of the non-display area of the neighboring area of above-mentioned viewing area, on aforesaid substrate, across above-mentioned shielding film, along the line direction of above-mentioned first electrode that is rectangular formation or the above-mentioned at least luminescent layer that column direction forms a plurality of linearities that have predetermined distance mutually, after the operation of the above-mentioned at least luminescent layer in forming above-mentioned organic layer or after forming the operation of above-mentioned second electrode, peel off above-mentioned shielding film, thus above-mentioned at least luminescent layer is formed the regulation shape.
According to said method, can realize the manufacture method of the display unit that rate of finished products and reliability are improved.
The effect of invention
As mentioned above, the formation method of vapor-deposited film of the present invention has: the operation of the shielding film that can peel off in the zone formation of the regulation of aforesaid substrate; At aforesaid substrate, across above-mentioned shielding film, form the operation of the vapor-deposited film of the linearity that has predetermined distance mutually along prescribed direction; With by peeling off above-mentioned shielding film, above-mentioned vapor-deposited film is formed the operation of regulation shape.
In addition, as mentioned above, the manufacture method of display unit of the present invention is following manufacture method: the operation of the above-mentioned at least luminescent layer in forming above-mentioned organic layer, form the shielding film that to peel off in the mode that does not cover above-mentioned viewing area and cover as at least a portion of the non-display area of the neighboring area of above-mentioned viewing area, on aforesaid substrate, across above-mentioned shielding film, along the line direction of above-mentioned first electrode that is rectangular formation or the above-mentioned at least luminescent layer that column direction forms a plurality of linearities that have predetermined distance mutually, after the operation of the above-mentioned at least luminescent layer in forming above-mentioned organic layer or after forming the operation of above-mentioned second electrode, peel off above-mentioned shielding film, thus above-mentioned at least luminescent layer is formed the regulation shape.
Therefore, can realize to carry out the manufacture method of the display unit that the formation method of the vapor-deposited film that high meticulous pattern forms and rate of finished products and reliability be improved.
Description of drawings
Fig. 1 is the figure that is formed on the appearance on the substrate in the manufacture method of organic EL display of expression embodiments of the present invention 1, with the screened film pattern.
Fig. 2 is in the manufacture method of organic EL display of expression embodiments of the present invention 1, peel off the figure of the substrate behind the screened film.
Fig. 3 is the figure of each operation of manufacture method of the organic EL display of expression embodiments of the present invention 1.
Fig. 4 is the figure of manufacturing process of the summary of the branch of the existing use scan mode of the expression organic EL display that is coated with vapour deposition method.
The figure of an example of the pattern form of the screened film that Fig. 5 is in the manufacture method of organic EL display of expression embodiments of the present invention 1, can use.
Fig. 6 is in the manufacture method of organic EL display of explanation embodiments of the present invention 1, do not use open mask to form the figure of an example of the method for hole injection layer and hole transporting layer, electron supplying layer, electron injecting layer (open mask).
The pattern form of the screened film that Fig. 7 is in the manufacture method of organic EL display of expression embodiments of the present invention 2, form at substrate and the figure of luminescent layer.
Fig. 8 is in the manufacture method of organic EL display of expression embodiments of the present invention 2, proceed to the figure of the substrate after the sealing process of the operation of peeling off screened film and sealing area.
Fig. 9 is the figure of each operation of manufacture method of the organic EL display of expression embodiments of the present invention 2.
The pattern form of the screened film that Figure 10 is in the manufacture method of organic EL display of expression embodiments of the present invention 3, form at substrate and the figure of luminescent layer.
Figure 11 is in the manufacture method of organic EL display of expression embodiments of the present invention 3, proceed to the evaporation of the operation of peeling off screened film and second electrode and the figure of the sealing process substrate afterwards of sealing area.
Figure 12 is the figure of each operation of manufacture method of the organic EL display of expression embodiments of the present invention 3.
Figure 13 is the figure that expression utilizes the schematic configuration of the organic EL display that the manufacture method of the organic EL display of embodiments of the present invention 3 makes.
Figure 14 is the figure of an example of the expression evaporation coating device that can use in the manufacture method of the organic EL display of embodiments of the present invention 3.
Figure 15 is the figure of an example of the expression evaporation coating device that can use in the manufacture method of the organic EL display of embodiments of the present invention 3.
Figure 16 is the figure that expression utilizes the appearance of the vapor-deposited film that Figure 14 or evaporation coating device shown in Figure 15 form at substrate.
Figure 17 is the figure that describes in the reason that does not need the evaporation zone also to form the vapor-deposited film of the pattern with strip.
Figure 18 is for explanation because at the vapor-deposited film that does not need the evaporation zone to form and the figure of issuable problem.
Figure 19 is the figure that is formed on the appearance on the substrate in the manufacture method of organic EL display of expression embodiments of the present invention 4, with the screened film pattern.
Figure 20 is the figure of each operation of the manufacture method of expression embodiments of the present invention 4 and 5 organic EL display.
The figure of an example of the pattern form of the screened film that Figure 21 is in the manufacture method of organic EL display of expression embodiments of the present invention 4, can use.
The figure of another example of the pattern form of the screened film that Figure 22 is in the manufacture method of organic EL display of expression embodiments of the present invention 4, can use.
Figure 23 is the figure that is formed on the appearance on the substrate in the manufacture method of organic EL display of expression embodiments of the present invention 5, with the screened film pattern.
Embodiment
Below, with reference to the accompanying drawings embodiments of the present invention are elaborated.But, the size of the component parts of putting down in writing in this execution mode, material, shape, its relative configuration etc. are an execution mode only, should not be interpreted as scope of the present invention and be limited by them.
In addition, in the following embodiments, an example as the formation method of using the vapor-deposited film that can carry out the meticulous pattern formation of height, the manufacture method of enumerating organic EL display describes, but be not limited thereto, the formation method of vapor-deposited film of the present invention can be applied to require all spectra of the vapor-deposited film that high meticulous map case forms.
In addition, in the following embodiments, the manufacture method of enumerating organic EL display as an example describes, therefore, using the vapor-deposited film of the formation method formation of vapor-deposited film of the present invention is organic film, but be not limited thereto, the formation method of vapor-deposited film of the present invention also can be applied to the formation of inoranic membrane certainly.
[execution mode 1]
Figure 13 is the figure of schematic configuration of expression organic EL display 1, and Figure 13 (a) is the figure in cross section of the organic EL 10 of the expression viewing area that constitutes organic EL display 1.
Be formed with below the thin-film transistor 2(, note is made " TFT ") substrate 3 on, be formed with interlayer dielectric 4, first electrode 5 and edges cover thing 6.
As substrate 3, for example can use alkali-free glass and plastics etc., but in the present embodiment, use the alkali-free glass of thickness of slab 0.7mm.
And, as interlayer dielectric 4 and edges cover thing 6, can use known photoresist, as above-mentioned photoresist, for example can enumerate acrylic resin and polyimide resin etc.
In addition, in the present embodiment, as interlayer dielectric 4 and edges cover thing 6, use the photonasty acrylic resin.
In addition, first electrode 5 utilizes the pattern formation accordingly of photoetching technique and etching and each pixel utilizing after sputtering method etc. forms electrode material.
As first electrode 5, can use various conductive materials, but under the situation of the radiative bottom-emission type of substrate one side organic EL, need be for transparent or semitransparent.On the other hand, under the situation of the radiative top emission type organic EL of an opposite side with substrate, it is transparent or semitransparent needing second electrode 9.
In addition, TFT2 makes by known method, in the present embodiment, the manufacturing of the organic EL display of the active array type that is formed with TFT2 in each pixel is described, but be not limited thereto, the present invention also can be applied to not have the organic EL display of the passive matrix of TFT2.
In order to prevent organic EL layer in the end attenuation of first electrode 5 and second electrode 9 between short circuit, be formed with edges cover thing 6 in the mode of the end that covers first electrode 5, and in the part that does not have edges cover thing 6 electrode 5 of winning exposed.This exposed portions serve becomes the illuminating part of each pixel.
As shown in the figure, form each organic EL layer at first electrode 5.As organic EL layer, for example can enumerate hole injection layer and hole transporting layer 7, luminescent layer 8R, 8G, 8B, though not shown, can also enumerate electron supplying layer and electron injecting layer etc.
And, though not shown, also can insert the carrier barrier layer that flows of charge carriers such as block electrons as required.
In addition, both can have a plurality of functions by a layer, for example also can form a layer that as hole injection layer and hole transporting layer 7, has hole injection layer and hole transporting layer concurrently.
In the present embodiment, make first electrode 5 be anode, from first electrode, 5 one sides lamination hole injection layer successively and hole transporting layer 7, luminescent layer 8R, 8G, 8B, electron supplying layer (not shown), electron injecting layer (not shown), make second electrode 9 be negative electrode then.
In addition, making first electrode 5 under the situation of negative electrode, above-mentioned laminated layer sequence is put upside down.
In addition, in the present embodiment, be bottom-emission type organic EL, therefore, as first electrode 5, use the ITO(indium tin oxide).
And each material as organic EL layer can use known material, as luminescent layer 8R, 8G, 8B, can use homogenous material, or uses the mixed type of as material of main part other material being sneaked into as guest materials or doping with certain material.
Below, the concrete example that expression can be used as the material of each organic EL layer.
As the material of hole injection layer and hole transporting layer 7, for example can use the hetero ring type of anthracene, nitrogen benzophenanthrene, Fluorenone, hydrazone, stilbene, benzophenanthrene, benzyne (benzyne), styrylamine, triphenylamine, porphyrin, triazole, imidazoles, oxadiazole, oxazole, poly-aralkyl hydrocarbon, phenylenediamine, arylamine and their derivative, thiophenes, polysilanes compound, vinylcarbazole compounds, amino benzenes compounds etc. or monomer, oligomer or the condensate etc. of chain formula conjugate class.
And, as the material of luminescent layer 8R, 8G, 8B, use the high materials of luminous efficiency such as low molecular fluorescence pigment, metal complex.For example can enumerate anthracene, naphthalene, indenes, phenanthrene, pyrene, aphthacene, benzophenanthrene, perylene, picene, fluoranthene, the luxuriant and rich with fragrance alkene of vinegar, pentaphene, pentacene, coronene, butadiene, cumarin, acridine, stilbene and their derivative, three (oxine) aluminium complex, two (benzo oxyquinoline) beryllium complex, three (dibenzoyl ylmethyl) phenanthroline europium complex, xylyl Ethenylbenzene, hydroxyl base benzene oxazole, hydroxy benzenes thiazole etc.
As the material of electron supplying layer and electron injecting layer, for example can use three (oxine) aluminium complex, oxadiazole derivative, triazole derivative, phenyl quinazoline evil quinoline derivant, thiophene to cough up derivative etc.
And Figure 13 (b) is the figure that expression possesses the sealed appearance of the organic EL 10 of first electrode 5, hole injection layer and hole transporting layer 7, luminescent layer 8R, 8G, 8B, electron supplying layer, electron injecting layer, second electrode 9.
As shown in the figure, so that organic EL 10 is not because the moisture in the atmosphere and/or oxygen and the mode of deterioration, end, 4 limit in the viewing area of the organic EL display 1 that is provided with a plurality of organic ELs 10, be the frame shape and form sealing resin 11, by sealing resin 11 adhesive substrates 3 and hermetic sealing substrate 12.
In addition, in the present embodiment, as hermetic sealing substrate 12, use glass substrate, the sealing resin 11 of the frame shape by having cementability, adhesive substrates 3 and hermetic sealing substrate 12, carry out the sealing of organic EL 10 thus, but the encapsulating method of organic EL 10 is not limited thereto, for example also can be at the upper surface of organic EL 10, and utilize the CVD method to form the diaphragm seal of the densification that moisture and oxygen is difficult for seeing through, side at organic EL 10, fit with hermetic sealing substrate at whole adhesive-applying, or be frame shape formation porous glass (powder glass) etc., carry out the sealing of organic EL 10.
Further, also can use above-mentioned encapsulating method as required simultaneously.
Fig. 3 is the figure of manufacturing process of the summary of expression organic EL display 1.
At first, utilize known method, make the substrate 3(S1 of first electrode that possesses TFT and be electrically connected with above-mentioned TFT).
Then, to cover the mode that does not need evaporation zone R2 that is formed with portion of terminal etc. on the substrate 3, form the shielding film that (namely bonding) screened film 13(can peel off) (S2).
Fig. 1 is illustrated in the figure that pattern on the substrate 3 is formed with the appearance of screened film 13.
As shown in the figure, screened film 13 does not form in the inboard of the sealing resin 11 that is the formation of frame shape, and only forms in the outside of the sealing resin 11 that is the formation of frame shape.
That is, only form screened film 13 outside the sealing area of each organic EL panel on substrate 3, at viewing area R1(light-emitting zone) and sealing area in, do not form screened film 13.
In the present embodiment, use can after operation in the screened film 13 peeled off.For example, use has cementability or adhesive general screened film 13.In the present embodiment, this screened film 13 is arranged to allow overlapping mode by a plurality of rectangular-shaped films (membrane element), forms pattern as shown in Figure 1.Particularly, for example, screened film 13 for example is in a plurality of (for example six) that go up a plurality of (for example three) that extend long rectangular film 13a with the direction of substrate scanning direction quadrature (after, be called the scanning orthogonal direction) and for example extend in the substrate scanning direction short rectangular film 13b arrangement and constitute.
The rectangular film 13a that each is long, in upstream extremity and downstream and the zone between each adjacent on substrate scanning direction viewing area R of the substrate scanning direction of substrate 3, the mode of extending with end to the end along the scanning orthogonal direction from substrate 3 forms respectively.The rectangular film 13b that each is short in each zone adjacent with the both sides of the scanning orthogonal direction of each viewing area R1, forms in the mode of extending along the substrate scanning direction respectively.In addition, also adjacent six short rectangular film on the substrate scanning direction can be replaced with along the substrate scanning direction from substrate the long rectangular film that extend 3 end to end.In this case, this long rectangular film is intersected with each the long rectangular film 3a that extends at the scanning orthogonal direction.In addition, also can replace using a plurality of rectangular film to form screened film 13 like this, and be formed by a film.
If water absorption is many, then exist in the production process of organic EL, the film that constitutes organic EL is caused the problem of damage from the moisture of screened film 13 disengagings.
In addition, in the production process of organic EL, in order to clean the surface of first electrode, generally before formation comprises the organic layer of luminescent layer, first electrode surface is carried out plasma treatment at least or UV handles.
Therefore, in these are handled, screened film 13 deteriorations, the preferred screened film 13 that these processing are had high patience that uses is not so that the analyte that produces exerts an influence to organic EL.In addition, preferably handle the bonding screened film 13 in back at these.In addition, if when peeling off, have the possibility that makes the TFT substrate damage because bonding force is strong, so preferably suitably adjust bonding force in order to peel off.Further, preferably use the few screened film of cull 13, so that bonding agent is not residual as residue.For example, as the screened film consistent with them 13, can use general little bonding stripping film again.In addition, in the present embodiment, as can after operation in the pattern film peeled off, use can be bonding and the screened film 13 peeled off again, but be not limited thereto, for example also can use formation such as silk screen print method can after operation in the pattern film peeled off.
In addition, can in screened film 13 bonding, use general lamination device.The such semiconductor processing device that uses in the TFT production process needs mechanism controls, store keeping and the temperature treatment etc. of height, and equipment cost is very high.Relative therewith, so long as the lamination device, just do not need the control of height like this, to compare equipment price cheap with semiconductor processing device.Equally, compare also cheapness with the manufacturing installation of organic EL display.
Then, the shadow mask that will have a regulation shaped aperture portion closely is fixed on the screened film 13 on the substrate 3, utilizes existing vacuum vapour deposition to form hole injection layer and hole transporting layer (S3) at whole.
In the present embodiment, use shadow mask to form hole injection layer and hole transporting layer, but also can use screened film 13 to form hole injection layer and hole transporting layer simultaneously.That is, at Fig. 1, the second electrode connecting portion R3 is included in the peristome of screened film 13, and therefore, if only form hole injection layer and hole transporting layer with screened film 13 as mask, then the layer of each in these layers also forms on the second electrode connecting portion R3.In this case, owing between the second electrode connecting portion R3 and second electrode, have organic film, there is the bad problem that comes in contact.Therefore, cover the shadow mask of the part of the second electrode connecting portion R3 by use, other parts are mask with screened film 13, thereby can form hole injection layer and the hole transporting layer of regulation shape.In addition, because hole injection layer and hole transporting layer get final product at the whole face of a plurality of organic ELs evaporation in the lump, form so do not need to carry out pattern with high precision, use viewing area R1 gets final product at the open mask (open mask) of whole opening.So long as open mask just do not need to make to keep the framework of mask too big, thereby weight is little, therefore also can use in the evaporation of large substrate.Further, by using screened film 13 simultaneously, only become the second electrode connecting portion R3 by the MIN zone of open masked, and do not need to consider covering of other parts.Therefore, therefore the machining accuracy of opening of height and the necessity step-down of aligning accuracy, can realize the reduction of the equipment costs such as contraposition mechanism of the manufacturing cost of open mask and mask.
Then, the narrow shadow mask 102 of width on the scanning direction is compared in use with substrate 101 as shown in Figure 14, and mask unit 105 is carried out evaporation scanning substrate 101 time on the left and right directions in the drawings, form luminescent layer 8R, 8G, the 8B(S4 of the pattern with upwardly extending strip of right and left in the drawings as shown in Figure 1), wherein, this mask unit 105 has the shadow mask 102 of peristome 102a, the nozzle 103 with the 103a of nozzle opening portion, the deposition material supply source 104 that is connected with nozzle 103 and is formed one and obtains.
In the present embodiment, only with R of all kinds, G, the length than on the length direction (length direction) with shadow mask 102 of all kinds of the part opening of the sub-pixel correspondence of B is set to the length on the above-below direction of viewing area R1 shown in Figure 1, when the viewing area R1 in the upper end of Fig. 1 forms luminescent layer 8R, 8G, during 8B, substrate 3 is scanned with respect to mask unit 105 right in the figure, and, when the viewing area R1 in the lower end of Fig. 1 forms luminescent layer 8R, 8G, during 8B, substrate 3 is gone up direction in the figure with respect to mask unit 105 and is moved, after aiming at adjustment, become in the figure left to scanning.
In addition, the shape of shadow mask 102 is not limited thereto, so long as do not produce the degree that the deadweight of shadow mask 102 is crooked and extend, just can suitably set.In addition, also can carry out evaporation in the lump to the viewing area R1 of the top and bottom of Fig. 1.
Then, when carrying out the evaporation of luminescent layer 8R, penetrate the R(redness from deposition material supply source 104) the evaporation particle, only utilize that the shadow mask 102 of the part opening corresponding with the R sub-pixel carries out evaporation by above-mentioned scanning, form luminescent layer 8R at each R sub-pixel thus.
That is, in the present embodiment, utilize the branch of scan mode to be coated with vapour deposition method formation luminescent layer 8R, 8G, 8B.
Therefore, as shown in Figure 1, do not forming the viewing area R1(light-emitting zone of screened film 13) and sealing area in, form luminescent layer 8R, 8G, the 8B of the pattern with strip at hole injection layer and hole transporting layer, on the other hand, do not need evaporation zone R2 what be formed with screened film 13, be formed at luminescent layer 8R, 8G, the 8B that hole injection layer on the screened film 13 and hole transporting layer form the pattern with strip.
In the present embodiment, scan with respect to 105 pairs of substrates 101 of mask unit as shown in Figure 14 and carry out evaporation, but also can scan with respect to 101 pairs of mask unit 105 of substrate as shown in Figure 15 and carry out evaporation.
In addition, in the present embodiment, as shown in Figure 14, the clearance G by evaporation face 101a and shadow mask 102 that makes substrate 101 is that predetermined distance ground is at luminescent layer 8R, the 8G, the 8B that are formed the pattern with strip by evaporation face 101a of substrate 101, but also can form luminescent layer 8R, 8G, the 8B of the pattern with strip so that the state of being close to by evaporation face 101a and shadow mask 102 of substrate 101 scans.
And, in the present embodiment, in order to form luminescent layer 8R, 8G, the 8B of the pattern with strip, use evaporation coating device as shown in Figure 14, as long as but can form the pattern of uniform film thickness and meticulous strip, the kind of employed evaporation coating device just is not particularly limited.
Afterwards, the shadow mask with regulation shaped aperture portion closely is fixed on the screened film 13 on the substrate 3, utilizes existing vacuum vapour deposition to form electron supplying layer, electron injecting layer (S5, S6) successively at whole face.
Afterwards, be mask with the screened film 13 on the substrate 3, utilize existing vacuum vapour deposition to form second electrode (S7) successively at whole face.
Then, as shown in Figure 1, in the sealing area that comprises viewing area R1 and be formed with in above-mentioned second electrode of whole formation in zone of screened film 13, divide the part that forms in the upper and lower end parts of viewing area R1, be connected with wired electric on the substrate 3 by the connecting portion R3 of second electrode that forms at substrate 3.
In the present embodiment, use shadow mask to form electron supplying layer, electron injecting layer, still, as described when the formation of hole injection layer and hole transporting layer, can also use screened film 13 simultaneously.In addition, as long as the connecting portion R3 of second electrode is not influenced with being electrically connected of second electrode, electron injecting layer just can utilize the method formation same with second electrode.That is, electron injecting layer can be that mask forms with screened film 13 only also.
As mentioned above, to the substrate 3 of finishing evaporation, comprise the sealing of the sealing area of viewing area R1, so that the organic EL that possesses first electrode, hole injection layer and hole transporting layer, luminescent layer 8R, 8G, 8B, electron supplying layer, electron injecting layer, second electrode is not because the moisture in the atmosphere and oxygen and deterioration (S8).
As shown in Figure 1, the end, 4 limit at the sealing area that comprises viewing area R1 is the frame shape and is formed with sealing resin 11, and by sealing resin 11, substrate 3 is fitted with hermetic sealing substrate (not shown).
Then, carry out peel off (S9) of screened film 13.By peeling off screened film 13, the stack membrane (hole injection layer and hole transporting layer, luminescent layer 8R, 8G, 8B, electron supplying layer, electron injecting layer, second electrode) that is stacked in the surface of screened film 13 also can be peeled off simultaneously.In addition, screened film 13 can mechanically be peeled off with the state of film.In addition, in the stripping off device of peeling off screened film 13, so long as the device of simple mechanical ground stripping film gets final product, therefore, be similarly low cost equipment with the lamination device of the bonding usefulness of above-mentioned screened film 13.
Fig. 2 is the figure that the substrate 3 behind the screened film 13 is peeled off in expression.
As shown in the figure, do not needing evaporation zone R2, not lamination hole injection layer and hole transporting layer, luminescent layer 8R, 8G, 8B, electron supplying layer, electron injecting layer, second electrode only have hole injection layer and hole transporting layer, luminescent layer 8R, 8G, 8B, electron supplying layer, electron injecting layer, second electrode at the sealing area lamination that comprises the viewing area R1 that is formed with first electrode.
Afterwards, substrate 3 is cut apart (S10) by each organic EL panel, use in the portion of terminal that does not need evaporation zone R2 to form and carry out be connected (S11) with external circuit (drive circuit), finish organic EL display 1.
By above such operation, make organic EL display 1, make it luminous from the drive circuit that externally forms to the organic EL streaming current that possesses by each sub-pixel, thus, can carry out desired demonstration.
Below, to do not possess can after operation in when the screened film 13 peeled off and the manufacturing process that uses the branch of existing scan mode to be coated with the organic EL display of vapour deposition method compare, to since possess can after operation in the screened film 13 peeled off and the benefit that can exist is elaborated.
Fig. 4 be represent not possess can after operation in the pattern film peeled off and use the branch of existing scan mode to be coated with the figure of manufacturing process of summary of the organic EL display of vapour deposition method.
As shown in the figure, at first, utilize known method, make TFT and the substrate (S101) of first electrode that is electrically connected with above-mentioned TFT.
Then, owing to do not possess screened film 13, use common open mask, on substrate, utilize vacuum vapour deposition to form hole injection layer and hole transporting layer (S102) at whole.
Be coated with in the manufacturing process of organic EL display of vapour deposition method at the branch of the existing scan mode of use shown in Figure 4, owing to do not possess screened film 13, screened film 13 can not be used simultaneously as mask, need only utilize common open mask to carry out evaporation.
Therefore, in the manufacturing process of organic EL display 1 of the present invention, the reduction of the set-up time that can realize the simplification of deposition mask (open mask) and accompany therewith and the device productive temp (tact that produces, the reduction of the raising of time rhythm) (productive raising) and equipment cost can realize the reduction of the manufacturing cost of organic EL display.
Further; in the manufacturing process of organic EL display of the present invention 1 shown in Figure 3; because screened film 13 can be used simultaneously as mask; so can be by the reduction of being close to area of open mask; realize the reduction of the damage of the pattern on the substrate that the contact owing to open mask produces; and; since screened film 13 cover be formed with portion of terminal do not need evaporation zone R2; also bring into play the effect as the diaphragm of portion of terminal; can avoid open mask to contact with the direct of portion of terminal; therefore, can prevent to the damage that portion of terminal causes, can realizing the raising of the rate of finished products of organic EL display owing to above-mentioned open mask.
Further because screened film 13 cover be formed with portion of terminal do not need evaporation zone R2, so can prevent from being stained with foreign matter etc. in portion of terminal, can improve the reliability of organic EL display.In addition, by the adherence of screened film 13, the foreign matter that just adheres to before the bonding screened film 13 can be removed, the rate of finished products of organic EL display can be improved.
Then, use evaporation coating device as shown in Figure 14, similarly form the luminescent layer (S103) of the pattern with strip with the manufacturing process of organic EL display 1 of the present invention.
But, be coated with in the manufacturing process of organic EL display of vapour deposition method at the branch of the existing scan mode of use shown in Figure 4, owing to be provided with the screened film 13 that covering does not need evaporation zone R2, luminescent layer with pattern of strip is not also being needed evaporation zone R2 by evaporation, and the result becomes bonding evaporation luminescent layer on portion of terminal.
Therefore, therefore the wiping operation (S109) at the luminescent layer that does not need evaporation zone R2 to form that needs to utilize organic solvent to carry out in addition causes the production line of organic EL display and the decline of rate of finished products, details aftermentioned.
Then, owing to do not possess screened film 13, only use common open mask, utilize existing vacuum vapour deposition to form electron supplying layer, electron injecting layer and second electrode (S104, S105, S106) successively at whole face at substrate.
In the formation operation of above-mentioned electron supplying layer and electron injecting layer, owing to do not possess screened film 13, screened film 13 can not be used simultaneously as mask, be created in the problem of utilizing vacuum vapour deposition when forming the operation (S102) of hole injection layer and hole transporting layer for whole, to illustrate on the substrate equally.Further, in the formation operation of second electrode, screened film 13 can not be used as mask, need to use common open mask.Therefore, not only produce the problem identical with the formation of above-mentioned electron supplying layer and electron injecting layer, and need the required equipment of use of open mask.
Then, same with the manufacturing process of organic EL display of the present invention 1 shown in Figure 3, carry out the sealing process (S107) of organic EL and the operation of substrate being cut apart by each organic EL panel (S108).
Then, the operation (S109) in the wiping of the luminescent layer that does not need evaporation zone R2 to form of utilizing that organic solvent carries out.
In the manufacturing process of organic EL display of the present invention 1 shown in Figure 3, because can only easily be removed by mechanically peeling off screened film 13, so do not need such wiping operation, but be coated with in the manufacturing process of organic EL display of vapour deposition method at the branch of the existing scan mode of use shown in Figure 4, this wiping operation is necessary operation, in this operation, exist cause following such problem may.
At first, in above-mentioned wiping operation, must be with an organic solvent directly never need evaporation zone R2 to wipe by the luminescent layer of evaporation, but and be not easy and will be fully removed by the luminescent layer of evaporation, and have the problem of easy residual residue.
In addition, in above-mentioned wiping operation, produce easily new foreign matter thereon, if having these foreign matters at the evaporation zone R2 that do not need that is formed with portion of terminal etc., can cause when portion of terminal is connected with external circuit that then electricity is bad, cause the decline of the rate of finished products of organic EL display.
And, using under the sealing resin situation that hermetic sealing substrate and baseplate-laminating is such, also exist above-mentioned organic solvent to make sealing resin produce the problem of damaging, making the reliability decrease of organic EL display.
Then, use the portion of terminal carry out after the wiping to carry out be connected (S110) with external circuit (drive circuit), finish organic EL display.
Below, according to Fig. 5, other a example of pattern of the screened film 13 that can use in the manufacturing process of organic EL display 1 of the present invention is described.
Fig. 5 is that 3 kind sub-pixels with organic EL of possess redness (R), green (G), blue (B) versicolor luminescent layer dispose in the drawings the adjacent mode of above-below direction and form the situation of 1 pixel of organic EL display, be represent at least be formed with luminescent layer 8R, the 8G that does not need evaporation zone R2, the zone of 8B forms the figure of an example of screened film 13.
As shown in the figure, do not need evaporation zone R2 about the luminescent layer 8R, the 8G that do not form the pattern with strip, 8B, the necessity that covers with screened film 13 not therefore also can be with screened film 13 as forming in the drawings the upwardly extending strip of upper and lower or form island as Fig. 5 (b) Fig. 5 (a).
Exist as shown in Figure 5 under the situation that does not need evaporation zone R2 that conductively-closed film 13 does not cover, for example, the zone of during with the evaporation that has organic film that can not be beyond luminescent layer 8R, 8G, 8B screened film 13 being used as mask etc., when the situation that screened film 13 is set to pattern is as shown in Figure 1 compared, resulting effect is less, but for luminescent layer 8R, 8G, the 8B of the pattern with strip, can carry out high meticulous pattern and form.
And, because can be by the pattern of screened film 13 being formed to reduce as shown in Figure 5 the use amount of screened film 13, so can realize the reduction of fee of material, and can reduce the amount of the degassing body of screened film 13, also can reduce more the harmful effect of organic EL.
In addition, the pattern form of screened film 13 shown in Figure 5 is examples, considers number, its configuration, style and its size etc. of the organic EL panel in the real estate, suitably determines the pattern form of screened film 13 to get final product.
In addition, in the present embodiment, as shown in figure 14, remain necessarily by the clearance G by evaporation face 101a and shadow mask 102 with substrate 101, and when substrate 101 left and right directions is in the drawings scanned, the mask unit 105 that is fixed is carried out evaporation, thereby luminescent layer 8R, the 8G, the 8B that are formed the pattern with strip by evaporation face 101a at substrate 101, but be not limited thereto, also can make substrate 101 carry out evaporation slidably with in being close to by evaporation face 101a and shadow mask 102 of substrate 101.
And, under these circumstances, can utilize screened film 13 to prevent since substrate 101 by evaporation face 101a and being close to of shadow mask 102 and issuable substrate 101 by the damage of evaporation face 101a.
In addition, in the present embodiment, use open mask evaporation hole injection layer and hole transporting layer, electron supplying layer, electron injecting layer, but also can as above-mentioned luminescent layer, use the such evaporation coating method of Figure 14 to form.In this case, replace being the mask that strip pattern forms, use the mask of whole the opening of viewing area R1 to get final product.
In addition, in the present embodiment, use open mask evaporation hole injection layer and hole transporting layer, electron supplying layer, electron injecting layer, but so long as second electrode is connected other mechanism of the distribution of substrate 3, just can use open mask and similarly form each layer of these layers with second electrode.For example as shown in Figure 6, use edges cover thing 6 grades to form protuberance 251 at substrate 3, form hole injection layer and hole transporting layer 7, electron supplying layer (not shown), electron injecting layer (not shown) and second electrode 9 thereon.Be formed with the second electrode connecting portion R3 at hermetic sealing substrate 12, the second electrode connecting portion R3 contacts with second electrode 9.The second electrode connecting portion R3 draws sealing area by the distribution 254 on the hermetic sealing substrate 12, is connected with the distribution 253 of substrate 3 by conductivity paste thing 252.By above such structure, second electrode 9 can be connected to external circuit.Under the situation that adopts such structure, in the organic layer beyond luminescent layer and the formation of second electrode 9, can form the regulation shape maskless.Thus, not only can prevent the damage of the pattern on the substrate 12 that the contact owing to deposition mask causes, and can be with screened film 13 as deposition mask, therefore can realize the reduction of set-up time of deposition mask and the raising of implement device productive temp, the reduction of equipment cost, the result can realize the cost cutting of organic EL display 1.And if keep as shown in Figure 14 forming luminescent layer in the clearance G between substrate 101 and deposition mask 102, then in the manufacturing process of organic EL, deposition mask once can not contact yet.Therefore, there is not the problem of the damage of the pattern on the substrate that the contact owing to deposition mask causes fully, can improves the rate of finished products of organic EL 1 more.
[execution mode 2]
Then, based on Fig. 7 to Fig. 9 second execution mode of the present invention is described.In the present embodiment, after the formation operation of the organic layer that comprises luminescent layer 8R, 8G, 8B, be mask with screened film 13, form diaphragm seal, afterwards, after carrying out the peeling off of screened film 13, use hermetic sealing substrate, carry out the sealing of organic EL, different with execution mode 1 in this respect, about other structure, with in execution mode 1 explanation identical.For convenience of explanation, to having and parts at the parts identical function shown in the drawings of execution mode 1, mark identical Reference numeral, omit its explanation.
Fig. 9 is the figure of manufacturing process of the summary of expression organic EL display 1a.
The operation from S1 to S7 of Fig. 9 is identical with the operation from S1 to S7 that has illustrated among Fig. 3 of execution mode 1, therefore omits its explanation.
Fig. 7 is the figure that is illustrated in the pattern form of the screened film 13 that the substrate 3a that possesses organic EL display 1a forms and luminescent layer 8R, 8G, 8B.
Then, be mask with as shown in Figure 7 screened film 13, on second electrode as the upper surface of organic EL, utilize formation moisture such as CVD method and oxygen not to allow the diaphragm seal (not shown) of meable densification, side at organic EL, be the frame shape and form sealing resin or porous glass (powder glass), carry out the sealing (S8) of organic EL.
In addition, in the present embodiment, screened film 13 is carried out the formation of luminescent layer 8R, 8G, 8B, second electrode and the formation of diaphragm seal as mask, but be not limited thereto, can also be as explanation in the execution mode 1, for the organic layer beyond the luminescent layer, also only use screened film 13 or use screened film 13 simultaneously and the formation of open mask.
Then, peel off screened film 13(S9).In addition, at this moment, protection such as sealed film of organic EL as described above, so organic EL can not be damaged in stripping process.
Afterwards, to finishing the substrate 3a of evaporation, comprise the sealing of the sealing area of viewing area R1, so that the organic EL that possesses first electrode, hole injection layer and hole transporting layer, luminescent layer 8R, 8G, 8B, electron supplying layer, electron injecting layer, second electrode is not because the moisture in the atmosphere and oxygen and deterioration (S10).
As shown in Figure 8, the end, 4 limit at the sealing area that comprises viewing area R1 is the frame shape and is formed with sealing resin 11, and by sealing resin 11, substrate 3a and hermetic sealing substrate (not shown) are fitted.
Then, substrate 3a is cut apart (S11) by each organic EL panel, use in the portion of terminal that does not need evaporation zone R2 to form and carry out be connected (S12) with external circuit (drive circuit), finish organic EL display 1a.
At the organic EL display 1a that makes as described above, do not needing evaporation zone R2 not form vapor-deposited film.Therefore, with execution mode 1 the same the solution easily to not needing evaporation zone R2 to form the problem of vapor-deposited film.
] further, because can be with screened film 13 as deposition mask, so can realize the reduction of set-up time of deposition mask and the raising of the device productive temp that produces, the reduction of equipment cost, the result can realize the reduction of the manufacturing cost of organic EL display 1a.
Simultaneously, by being affixed to the reduction of being close to number of times of substrate 3a, the damage to the surface of organic EL panel can be reduced, the raising of the rate of finished products of organic EL display 1a can be realized thus.
In addition, in the present embodiment, the formation of second electrode and diaphragm seal utilizes vapour deposition method to form, but is not limited thereto, and can also utilize other one-tenth embrane method such as sputtering method.
In addition, if can only just in the stripping process of screened film 13, protect organic EL not by deterioration by the formation of second electrode, also can omit the formation operation of diaphragm seal.
In addition, at Fig. 8, being also contained in as the outer rim of the sealing area of sealed resin 11 area surrounded does not need evaporation zone R2,13 protections (with reference to Fig. 7) of conductively-closed film.
Therefore, utilizing sealing resin 11 or porous glass (powder glass) to be under the situation of frame shape sealing organic el element and utilizing under the situation that sealing resin 11 seals hermetic sealing substrate and TFT baseplate-laminating, be not present between (being sandwiched in) substrate at the outer rim vapor-deposited film of sealing area.
Thus, can prevent that the close property of sealing resin 11 or porous glass from descending and emptying aperture, can bring into play sealing property fully, therefore can improve the reliability of organic EL display 1a.
[execution mode 3]
Then, based on Figure 10 to Figure 12 the 3rd execution mode of the present invention is described.In the present embodiment, behind the stripping process of screened film 13, form second electrode, different with execution mode 1 in this respect.In addition, about the organic layer beyond the luminescent layer also not using deposition mask with screened film 13 for different with execution mode 1 aspect the mask formation.In addition, screened film 13 cover to the frame shape zone that applies sealing resin, only viewing area R1 opening aspect different with execution mode 1.About other structure, with in execution mode 1 explanation identical.For convenience of explanation, to having and parts at the parts identical function shown in the drawings of execution mode 1, mark identical Reference numeral, omit its explanation.
Figure 12 is the figure of manufacturing process of the summary of expression organic EL display 1b.
In the operation till S1, S2 and the S4 of Figure 12, identical with operation till the S1 that in Fig. 3 of execution mode 1, has illustrated, S2 and the S4, therefore omit its explanation.In the operation of S3, S5 and S6, be similar to the operation of S7 of Fig. 3 of execution mode 1.That is be that mask forms hole injection layer and hole transporting layer, electron supplying layer and electron injecting layer with the screened film 13 of viewing area R1 opening only.Because this screened film 13 covers the second electrode connecting portion R3, does not form above-mentioned organic layer thereon.
Figure 10 is the figure that is illustrated in the pattern form of the screened film 13 that substrate 3b forms and luminescent layer 8R, 8G, 8B.
As shown in the figure, screened film 13 forms in the mode that has peristome at viewing area R1.
Therefore, handle by this, to the not damage of vapor-deposited film that constitutes organic EL.
Then, in the manufacturing process of the organic EL display 1b of present embodiment, as shown in Figure 12, before forming second electrode, peel off screened film 13(S7).
Then, in order to peel off screened film 13, use common open mask, evaporation second electrode (S8).
As described above, to finishing the substrate 3b of evaporation, comprise the sealing of the sealing area of viewing area R1, so that the organic EL that possesses first electrode, hole injection layer and hole transporting layer, luminescent layer 8R, 8G, 8B, electron supplying layer, electron injecting layer, second electrode is not because the moisture in the atmosphere and oxygen and deterioration (S9).
Figure 11 is the figure of the substrate 3b after till expression proceeds to the evaporation of the peeling off of screened film 13, second electrode and comprises the sealing of sealing area of viewing area R1.
As shown in the figure, the end, 4 limit at the sealing area that comprises viewing area R1 is the frame shape and is formed with sealing resin 11, and by sealing resin 11, substrate 3b and hermetic sealing substrate (not shown) are fitted.
Then, substrate 3b is cut apart (S10) by each organic EL panel, use in the portion of terminal that does not need evaporation zone R2 to form and carry out be connected (S11) with external circuit (drive circuit), finish organic EL display 1b.
At the organic EL display 1b that makes as described above, do not needing evaporation zone R2 not form vapor-deposited film.Therefore, solve equally easily to not needing evaporation zone R2 to form the problem of vapor-deposited film with execution mode 1 and 2.
] in addition, because can be with the deposition mask of screened film 13 as the organic film that comprises luminescent layer 8R, 8G, 8B, the raising of the device productive temp that produces so can realize the reduction of set-up time of deposition mask, cut down the reduction of the equipment cost that realizes by the mask number, the result can realize the cost cutting of organic EL display 1b.
Simultaneously, by being close to the reduction of number of times, the damage to the surface of organic EL panel can be reduced, the raising of the rate of finished products of organic EL display 1b can be realized.
Further, be also contained in as the outer rim (forming the frame shape zone of sealing resin) of the sealing area of sealed resin 11 area surrounded and do not need evaporation zone R2,13 protections (with reference to Figure 10 and Figure 11) of conductively-closed film.
Therefore, utilizing sealing resin 11 or porous glass (powder glass) to be under the situation of frame shape sealing organic el element and utilizing under the situation that sealing resin 11 seals hermetic sealing substrate and TFT baseplate-laminating, be not present between (being sandwiched in) substrate at the outer rim vapor-deposited film of sealing area.
Thus, can prevent that the close property of sealing resin 11 or porous glass from descending and emptying aperture, can bring into play sealing property fully, therefore can improve the reliability of organic EL display 1b.
[execution mode 4]
Present embodiment is the execution mode that changes in execution mode 1 behind the formation pattern of screened film 13.In the present embodiment, as shown in figure 19, be present in covering the luminescent layer 8R, the 8G that are formed with strip on the substrate 3,8B the zone do not need evaporation zone (portion of terminal zone R2 and the sealing area (area inside of Reference numeral 11 of both sides that namely is present in the substrate scanning direction of viewing area R1, after, be called sealing area 11 for convenience of explanation) the outer rim of both sides of substrate scanning direction) mode, form banded screened film 13 at substrate 3.
More specifically, the screened film 13 of present embodiment, so that each viewing area R1 exposes and covers the above-mentioned mode that does not need the evaporation zone of the both sides of the substrate scanning direction that is present in each viewing area R1, upstream extremity and downstream and the zone between each adjacent on substrate scanning direction viewing area R1 in the substrate scanning direction of substrate 3, with along and the direction (being called the scanning orthogonal direction later on) of the substrate scanning direction quadrature mode of extending from end to the end of substrate 3 form.
In addition, at Figure 19, only to viewing area R1 diagram portion of terminal zone R2, the second terminal connecting portion R3 and sealing area 11 upper left among the figure, but other viewing area R1 is set portion of terminal zone R2, the second terminal connecting portion R3 and sealing area 11 too.
In the present embodiment, make organic EL display 1c as shown in Figure 20.
At first, with the execution mode 1 same substrate 3c that possesses TFT and first electrode that makes, at this substrate 3c, as shown in figure 19 (namely as described above) be present in the mode that does not need evaporation zone (outer rim of both sides of substrate scanning direction of portion of terminal zone R2, sealing area 11 of both sides that namely is present in the substrate scanning direction of viewing area R1) of the luminescent layer 8R, the 8G that are formed with strip on the substrate 3c, 8B with covering, form banded screened film 13(T1).
At this state, make organic EL (T2) at substrate 3.Namely for example carry out evaporation by substrate scanning with execution mode 1 same mask and the screened film 13 of using, form each organic layer (hole injection layer, hole transporting layer, luminescent layer, electron supplying layer and electron injecting layer).
Thus, as shown in figure 19, on the viewing area of substrate 3c R1 and screened film 13, be formed on luminescent layer 8R, 8G, the 8B of the strip that extends on the substrate scanning direction.In addition, at Figure 19, only put down in writing luminescent layer 8R, the 8G, the 8B that pass through from two viewing area R1 of epimere, but equally also be formed with luminescent layer 8R, 8G, the 8B that passes through from two viewing area R1 of hypomere.In addition, at the regional R10(that need not form luminescent layer 8R, 8G, 8B namely, in the both sides of the scanning orthogonal direction of each viewing area R1, the zone of extending from end to the end of substrate 3c along the substrate scanning direction), do not form luminescent layer 8R, 8G, 8B.And in the formation of second electrode, also use open mask and screened film 13 to carry out evaporation, carry out being connected of signal wiring of second electrode and substrate 3 by the second electrode connecting portion R3.
Then, after second electrode forms, peel off screened film 13(T3).Thus, the organic EL beyond each viewing area R1 is stripped from screened film 13.In addition, can not peel off and make the organic EL damage that is formed on the R1 of viewing area owing to this.Then, same with execution mode 1, utilize hermetic sealing substrate sealing organic el element (T4), divide cutting board 3c by each organic EL then, carry out be electrically connected (T5) of portion of terminal zone R2 and external circuit afterwards, finish organic EL display.
In addition, as the pattern of the screened film 13 that can use in the present embodiment, beyond pattern shown in Figure 19, can enumerate Figure 21 and pattern shown in Figure 22.
At Figure 21, do not need evaporation zone R10 about luminescent layer (vapor-deposited film) 8R that do not form strip, 8G, 8B, there is not the necessity that forms screened film 13, therefore, do not needing evaporation zone R10 to form screened film 13, and screened film 13 is defined in each viewing area R1 the substrate scanning direction both sides and be the portion of terminal zone R2 of the both sides that cover the substrate scanning direction that is present in each viewing area R1 and the island of the outer rim of the both sides of the substrate scanning direction of sealing area 11 forms.
In addition, at Figure 22, even in Figure 19 the both sides of the scanning orthogonal direction of each viewing area R1 do not need evaporation zone R10, also with the protection on the surface of substrate 3c and to adhere to removing of foreign matter be purpose, further form screened film 13u.
In addition, according to number, configuration, style and the size of the organic EL panel that forms at substrate 3, the pattern of screened film 13 becomes various patterns, therefore, suitably gets final product with its pattern that as one man changes screened film 13.
As mentioned above, according to present embodiment, do not needing evaporation zone R2 not form vapor-deposited film (organic layers such as luminescent layer 8R, 8G, 8B).Therefore, solve equally easily to not needing evaporation zone R2 to form the problem of vapor-deposited film with execution mode 1.
[execution mode 5]
Present embodiment is the execution mode that forms screened film 13 in execution mode 1 in the mode with the identical peristome of the deposition mask used with second electrode.Thus, screened film 13 becomes the substitute of the deposition mask that second electrode uses.
More specifically, as shown in figure 23, screened film 13 has corresponding with each viewing area R1 respectively a plurality of peristome 13s, with only each peristome 13s make with peristome 13s corresponding display R1 and be present in the direction of the substrate scanning direction quadrature of this viewing area R1 (after, the scanning orthogonal direction) the second electrode connecting portion R3 of both sides exposes and covers the mode in the zone (periphery edge of portion of terminal zone R2 and sealing area 11 etc.) beyond this, in substrate 3 formation.
In addition, screened film 13 and execution mode 1 are similarly a plurality of long rectangular film 13a that extends at the scanning orthogonal direction and a plurality of short rectangular film 13b that extend in the substrate scanning direction and arrange and constitute.
In the present embodiment, make organic EL display 1d as shown in Figure 20.
At first, with the same substrate 3d that possesses TFT and first electrode that makes of execution mode 1, at this substrate 3d, as shown in figure 23 (namely as described above) form the screened film 13(T1 with the identical peristome 13s of the deposition mask used with second electrode).
At this state, make organic EL (T2) at substrate 3d.Namely the same with execution mode 1, for example carry out evaporation by substrate scanning, as shown in figure 23, on the viewing area of substrate 3d R1 and screened film 13, be formed on luminescent layer 8R, 8G, the 8B of the strip that extends on the substrate scanning direction.In addition, at Figure 22, for the convenience of charting only illustrates luminescent layer 8R, 8G, the 8B that passes through from two viewing area R1 of epimere, but equally also be formed with luminescent layer 8R, 8G, the 8B that passes through from two viewing area R1 of hypomere.In addition, in the front and back of the formation of this luminescent layer 8R, 8G, 8B, use open mask and screened film to form hole injection layer, hole transporting layer, electron supplying layer and electron injecting layer whole of substrate 3d by evaporation simultaneously.In the present embodiment, because the mask that screened film 13 is used as second electrode plays a role, so the formation of second electrode forms by maskless evaporation.By the formation of this second electrode, utilize the second electrode connecting portion R3 to connect the signal wiring of second electrode and substrate 3.
Then, after second electrode forms, peel off screened film 13(T3).Thus, the organic EL beyond each viewing area R1 is stripped from, and second electrode that (i.e. zone beyond the second electrode connecting portion R3 and the viewing area R1) forms in unwanted zone is stripped from screened film 13.In addition, can not peel off and make the organic EL damage that is formed on the R1 of viewing area owing to this.Then, same with execution mode 1, utilize hermetic sealing substrate sealing organic el element (T4), divide cutting board 3d by each organic EL then, carry out be electrically connected (T5) of portion of terminal zone R2 and external circuit afterwards, finish organic EL display.
As mentioned above, according to present embodiment, do not needing evaporation zone R2 not form vapor-deposited film.Therefore, solution never needs the formation problem of the vapor-deposited film of evaporation zone R2 easily.
In addition, because the deposition mask that screened film 13 double as second electrode is used, so the raising of the reduction implement device productive temp of set-up time that can be by deposition mask, realize the reduction of equipment cost by the reduction of mask number, the result can realize the cost cutting of organic EL display.Simultaneously, be close to the minimizing of number of times by mask, can reduce the damage to the surface of organic EL panel, can improve the rate of finished products of organic EL display.In addition, the formation of second electrode not only can be used evaporation and can use sputtering method etc. that other becomes embrane method.
In addition, in the present embodiment, the mask that screened film 13 is not only used as second electrode but also can be also used as the mask that diaphragm seal is used.In this case, diaphragm seal and second electrode form identical shaped.
In addition, the outer rim of sealing area 11 is also contained in does not need the evaporation zone, by screened film 13 protections.Therefore, utilize sealing resin or porous glass to be under the situation of frame shape sealing organic el element and utilizing under the situation that resin seals hermetic sealing substrate and TFT baseplate-laminating, be not present in 3 of (being sandwiched in) substrates at the outer rim vapor-deposited film of sealing area R4.Therefore, can prevent that the close property of sealing resin or porous glass from descending and emptying aperture, can bring into play sealing property fully, therefore can improve the reliability of organic EL display.
[variation]
At execution mode 1～5, with screened film 13 have cementability or adherence, the situation that is bonded in substrate 3,3a, 3b, 3c, 3d, 3e by this cementability or adherence is that example is illustrated, but is not limited thereto.For example, as screened film 13, also can use the resin film that does not comprise the face with cementability, use utilize laser etc. make the resin film welding at substrate, afterwards mechanically or the method that peels by (heat treatments) such as laser irradiations.In this case, as long as the non-area of the pattern on substrate in the welding of several places, just can not cause damage to the pattern on the substrate.In addition, also can constitute screened film 13 by heat bonding film etc.
In addition, the present invention not only can be applied to the manufacturing of organic EL display, so long as carry out evaporation by scanning, also can use in the manufacturing outside this.
In addition, in above-mentioned execution mode 1～5, to being that the situation that mask forms organic layer (particularly luminescent layer) is illustrated with screened film 13, can be metal levels such as mask formation distribution with screened film 13 also.In addition, also can use inorganic layer to replace organic layer, in this case, can be that mask forms inorganic layer with screened film 13 also.
[will put summary]
As mentioned above, in order to address the above problem, the formation method of the vapor-deposited film of embodiments of the present invention is the formation methods that form the vapor-deposited film of vapor-deposited film at substrate, and it has: the operation of the shielding film that can peel off in the regulation zone formation of aforesaid substrate; Form the operation of vapor-deposited film across above-mentioned shielding film at aforesaid substrate; With by peeling off the operation that above-mentioned shielding film forms above-mentioned vapor-deposited film the regulation shape.
According to said method, after the shielding film that the regulation zone formation of aforesaid substrate can be peeled off, on aforesaid substrate, across above-mentioned shielding film, form high meticulous vapor-deposited film with comparalive ease, by peeling off the high meticulous pattern that above-mentioned shielding film can form above-mentioned vapor-deposited film the regulation shape.
Therefore, according to said method, can carry out high meticulous pattern and form.
In addition, because after substrate forms vapor-deposited film, peeling off shielding film across shielding film, can prevent from forming in the zone that is formed with shielding film the situation of vapor-deposited film.
The formation method of the vapor-deposited film of embodiments of the present invention is preferably as follows mode: above-mentioned shielding film constitutes to allow overlapping mode to arrange by a plurality of membrane elements.
According to said method, above-mentioned shielding film constitutes to allow overlapping mode to arrange by a plurality of membrane elements, therefore, easily substrate is formed shielding film, and makes the pattern of shielding film corresponding with various patterns easily.
The formation method of the vapor-deposited film of embodiments of the present invention is preferably as follows mode: above-mentioned shielding film comprises having cementability or adhesive.
According to said method, above-mentioned shielding film comprises having cementability or adhesive, therefore, only just can form shielding film at substrate by this face is sticked on substrate.In addition, peeling off also of shielding film can easily be carried out.Then, carrying out this when peeling off, can remove with the dust that will before shielding film forms, be attached to substrate of peeling off of shielding film.
The formation method of the vapor-deposited film of embodiments of the present invention is preferably as follows mode: above-mentioned shielding film is formed by the resin film that does not comprise the face with cementability, is adhered to aforesaid substrate by thermal welding.
According to said method, form shielding film by thermal welding at substrate, therefore can will not comprise that the resin film of the face with cementability is as shielding film.In addition, because do not possess cementability, so when peeling off shielding film, can prevent that bonding agent from staying substrate as residue and residual.
The formation method of the vapor-deposited film of embodiments of the present invention is preferably as follows mode: above-mentioned shielding film is peeled off from aforesaid substrate by heat treatment.
According to said method, peel off shielding film by heat treatment, therefore can peel off shielding film simply.
The formation method of the vapor-deposited film of embodiments of the present invention is preferably as follows mode: above-mentioned shielding film forms in the mode that covers the portion of terminal zone that is connected with external circuit at aforesaid substrate.
According to said method, above-mentioned shielding film forms in the mode that covers the portion of terminal zone that is connected with external circuit at aforesaid substrate, therefore, can prevent from forming vapor-deposited film in the portion of terminal zone.Electric connection terminal portion and external circuit well thus.
The formation method of the vapor-deposited film of embodiments of the present invention is preferably as follows mode: above-mentioned vapor-deposited film forms along prescribed direction for having a plurality of linearities of predetermined distance mutually.
According to said method, above-mentioned vapor-deposited film is to have a plurality of linearities of predetermined distance mutually and along prescribed direction formation, therefore above-mentioned vapor-deposited film can be formed the high meticulous pattern of regulation shape.
The formation method of the vapor-deposited film of embodiments of the present invention is preferably as follows mode: before the operation that above-mentioned vapor-deposited film is formed on the aforesaid substrate, after this operation or the front and back of this operation, comprise that with above-mentioned shielding film be the operation that mask forms first film different with above-mentioned vapor-deposited film, peeling off after the operation that forms above-mentioned first film of above-mentioned shielding film carried out.
According to said method, can in the operation after the formation of above-mentioned shielding film above-mentioned shielding film be used as deposition mask, therefore can carry out evaporation in maskless ground, can pass through the raising, the reduction of equipment cost of reduction implement device productive temp of the set-up time of deposition mask.
Simultaneously, the reduction of being close to number of times by deposition mask can reduce the damage to the surface of aforesaid substrate.
The formation method of the vapor-deposited film of embodiments of the present invention is preferably as follows mode: before the operation that above-mentioned vapor-deposited film is formed at aforesaid substrate, after this operation or the front and back of this operation, comprise the operation of using the mask with through hole to form second film different with above-mentioned vapor-deposited film, peeling off after the operation that forms above-mentioned second film of above-mentioned shielding film carried out.
According to said method, mask and substrate with through hole are close to across above-mentioned shielding film, therefore can make above-mentioned shielding film bring into play the effect of the diaphragm of substrate, can reduce the damage to the surface of aforesaid substrate.
The formation method of the vapor-deposited film of embodiments of the present invention is preferably as follows mode: above-mentioned vapor-deposited film is being formed in the operation of aforesaid substrate, deposition mask and aforesaid substrate in the mask unit are maintained fixed range, and the aforementioned mask unit comprises: have through hole and the area above-mentioned deposition mask littler than aforesaid substrate; The exit wound of bullet that penetrates to the face that is formed with above-mentioned shielding film of aforesaid substrate across above-mentioned deposition mask with the evaporation particle that will supply with from the deposition material supply source, and the fixed relative position of above-mentioned deposition mask and above-mentioned exit wound of bullet, in aforementioned mask unit and the aforesaid substrate any one scans with respect to another at least, thereby form above-mentioned vapor-deposited film.
According to said method, can high efficiency, the high above-mentioned vapor-deposited film that forms a plurality of linearities that have predetermined distance mutually meticulously.
In the formation method of the vapor-deposited film of embodiments of the present invention, above-mentioned deposition mask and aforesaid substrate in the aforementioned mask unit also can be close to.
According to said method, aforesaid substrate and above-mentioned deposition mask are close to across above-mentioned shielding film, therefore can prevent that above-mentioned deposition mask is to the damage of aforesaid substrate by above-mentioned shielding film.
In order to address the above problem, the manufacture method of the display unit of embodiments of the present invention has: the operation that forms a plurality of active elements at substrate; Form the operation of first electrode, above-mentioned first electrode is electrically connected with above-mentioned each active element and the viewing area on aforesaid substrate is rectangular formation; Form the operation of the organic layer that comprises luminescent layer at least at above-mentioned first electrode; At least form the operation of second electrode with polarity opposite with above-mentioned first electrode at above-mentioned organic layer, in the operation of the above-mentioned at least luminescent layer in forming above-mentioned organic layer, form the shielding film that to peel off in the mode that does not cover above-mentioned viewing area and cover as at least a portion of the non-display area of the neighboring area of above-mentioned viewing area, on aforesaid substrate, across above-mentioned shielding film, along the line direction of above-mentioned first electrode that is rectangular formation or the above-mentioned at least luminescent layer that column direction forms a plurality of linearities that have predetermined distance mutually, after the operation of the above-mentioned at least luminescent layer in forming above-mentioned organic layer or after forming the operation of above-mentioned second electrode, peel off above-mentioned shielding film, thus above-mentioned at least luminescent layer is formed the regulation shape.
According to said method, can realize the manufacture method of the display unit that rate of finished products and reliability are improved.
The manufacture method of the display unit of embodiments of the present invention is preferably as follows mode: in the operation that forms the above-mentioned organic layer that comprises luminescent layer at least, comprising with above-mentioned shielding film is mask, forms layer beyond the above-mentioned luminescent layer in the above-mentioned organic layer or the operation of metal level or inorganic layer.
According to said method, can the operation after the formation of above-mentioned shielding film above-mentioned shielding film be used as deposition mask, therefore can carry out evaporation in maskless ground, can pass through the raising, the reduction of equipment cost of reduction implement device productive temp of the set-up time of deposition mask.
Simultaneously, the reduction of being close to number of times by deposition mask can reduce the damage to the surface of aforesaid substrate.
Therefore, according to said method, can realize the raising of rate of finished products and reliability, and can suppress manufacturing cost.
The manufacture method of the display unit of embodiments of the present invention is preferably as follows mode: in the operation that forms the above-mentioned organic layer that comprises luminescent layer at least, comprise and use the mask with through hole, form layer beyond the above-mentioned luminescent layer in the above-mentioned organic layer or the operation of metal level or inorganic layer.
According to said method; mask and substrate with through hole are close to across above-mentioned shielding film; the effect of the diaphragm of therefore above-mentioned shielding film performance substrate can reduce the damage to the surface of aforesaid substrate, therefore can realize the manufacture method of the display unit that rate of finished products and reliability are improved.
In the manufacture method of the display unit of embodiments of the present invention, be preferably as follows mode: peeling off after the operation that forms above-mentioned second electrode of above-mentioned shielding film carried out, in the operation that forms above-mentioned second electrode, be that mask forms above-mentioned second electrode with above-mentioned shielding film.
According to said method, above-mentioned shielding film can be used as mask in the operation that forms above-mentioned second electrode, therefore the operation that can maskless ground forms above-mentioned second electrode can be passed through the reduction of raising equipment cost of reduction implement device productive temp of the set-up time of mask.
Simultaneously, can reduce the damage to the surface of aforesaid substrate by the reduction of being close to number of times of deposition mask.
The manufacture method of the display unit of embodiments of the present invention is preferably as follows mode: in the operation that forms above-mentioned second electrode, use the mask with through hole to form above-mentioned second electrode.
In the manufacture method of the display unit of embodiments of the present invention, be preferably as follows mode: be stripped from after the operation of the above-mentioned at least luminescent layer of above-mentioned shielding film in forming above-mentioned organic layer and before the operation that forms above-mentioned second electrode.
According to said method, can after the operation that forms above-mentioned at least luminescent layer, peel off above-mentioned shielding film.
The manufacture method of the display unit of embodiments of the present invention is preferably as follows mode: have the operation of utilizing seal member to seal above-mentioned first electrode, above-mentioned organic layer and above-mentioned second electrode in above-mentioned viewing area, above-mentionedly utilize operation that seal member seals carrying out before above-mentioned at least luminescent layer is formed the regulation shape by peeling off above-mentioned shielding film.
According to said method, peel off above-mentioned shielding film with the state that utilizes seal member to seal above-mentioned first electrode, above-mentioned organic layer and above-mentioned second electrode, therefore can suppress the influence that produces owing to peeling off of above-mentioned shielding film.
The manufacture method of the display unit of embodiments of the present invention is preferably as follows mode: it is mask that the manufacture method of above-mentioned display unit has with above-mentioned shielding film, form above-mentioned first electrode of sealing in above-mentioned viewing area, the operation of the diaphragm seal of above-mentioned organic layer and above-mentioned second electrode, the operation of above-mentioned formation diaphragm seal is being carried out before above-mentioned at least luminescent layer is formed the regulation shape by peeling off above-mentioned shielding film, by peeling off after above-mentioned shielding film forms the regulation shape with above-mentioned at least luminescent layer, carry out utilizing seal member to seal above-mentioned first electrode in above-mentioned viewing area, above-mentioned organic layer, the operation of above-mentioned second electrode and above-mentioned diaphragm seal.
According to said method, peel off above-mentioned shielding film with the state that utilizes diaphragm seal to seal above-mentioned first electrode, above-mentioned organic layer and above-mentioned second electrode, therefore can suppress the influence that produces owing to peeling off of above-mentioned shielding film.
In addition, owing to also utilize seal member and above-mentioned diaphragm seal to seal respectively, can improve reliability.
The manufacture method of the display unit of embodiments of the present invention is preferably as follows mode: have in above-mentioned viewing area and utilize seal member to seal the operation of above-mentioned first electrode, above-mentioned organic layer and above-mentioned second electrode, the above-mentioned operation of utilizing seal member to seal is carried out after the operation that forms above-mentioned second electrode.
In the manufacture method of the display unit of embodiments of the present invention, when on aforesaid substrate, when forming the above-mentioned luminescent layer at least of a plurality of linearities that have predetermined distance mutually along the line direction of above-mentioned first electrode that is rectangular formation or column direction, deposition mask and aforesaid substrate in the mask unit are maintained fixed range, and the aforementioned mask unit comprises: have through hole and the area above-mentioned deposition mask littler than aforesaid substrate; The exit wound of bullet that penetrates to the face that is formed with above-mentioned shielding film of aforesaid substrate across above-mentioned deposition mask with the evaporation particle that will supply with from the deposition material supply source, and the fixed relative position of above-mentioned deposition mask and above-mentioned exit wound of bullet, in aforementioned mask unit and the aforesaid substrate any one scans with respect to another at least, thereby form above-mentioned at least luminescent layer.
According to said method, can realize the manufacture method of the display unit that rate of finished products and reliability are improved expeditiously.
In the formation method of the vapor-deposited film of embodiments of the present invention, above-mentioned deposition mask and the aforesaid substrate of aforementioned mask unit also can be close to.
According to said method, aforesaid substrate and above-mentioned deposition mask are close to across above-mentioned shielding film, therefore can prevent that above-mentioned deposition mask is to the damage of aforesaid substrate by above-mentioned shielding film.
The present invention is not limited to the respective embodiments described above, can in the scope shown in the technical scheme, carry out various changes, will be in different execution modes respectively disclosed technical method suitably make up and the execution mode that obtains is also contained in the technical scope of the present invention.
Utilizability on the industry
The present invention for example can be preferably applied to the manufacturing process of organic EL display etc.
The explanation of Reference numeral
1,1a, 1b, 1c, 1d organic EL display (display unit)
2 TFT(active elements)
3,3a, 3b, 3c, 3d substrate
5 first electrodes
7 hole injection layers and hole transporting layer (organic layer)
8R, 8G, 8B luminescent layer
9 second electrodes
10 organic ELs
11 sealing resins (seal member)
12 hermetic sealing substrates (seal member)
13 screened films (shielding film)
The R1 viewing area
R2 does not need evaporation zone (portion of terminal zone) (non-display area)
R3 second electrode connecting portion
Claims (22)
1. the formation method of a vapor-deposited film, it is the formation method that forms the vapor-deposited film of vapor-deposited film at substrate, it is characterized in that having:
The operation of the shielding film that can peel off in the zone formation of the regulation of described substrate;
Form the operation of vapor-deposited film across described shielding film at described substrate; With
By peeling off the operation that described shielding film forms described vapor-deposited film the regulation shape.
2. the formation method of vapor-deposited film as claimed in claim 1 is characterized in that:
Described shielding film constitutes to allow overlapping mode to arrange by a plurality of membrane elements.
3. the formation method of vapor-deposited film as claimed in claim 1 or 2 is characterized in that:
Described shielding film comprises having cementability or adhesive.
4. the formation method of vapor-deposited film as claimed in claim 1 or 2 is characterized in that:
Described shielding film is formed by the resin film that does not comprise the face with cementability, is adhered to described substrate by thermal welding.
5. the formation method of vapor-deposited film as claimed in claim 4 is characterized in that:
Described shielding film by heat treatment from described strippable substrate.
6. as the formation method of each described vapor-deposited film in the claim 1 to 5, it is characterized in that:
Described shielding film forms in the mode that covers the portion of terminal zone that is connected with external circuit at described substrate.
7. as the formation method of each described vapor-deposited film in the claim 1 to 6, it is characterized in that:
Described vapor-deposited film forms along prescribed direction for having a plurality of linearities of predetermined distance mutually.
8. as the formation method of each described vapor-deposited film in the claim 1 to 6, it is characterized in that:
Before the operation that described vapor-deposited film is formed on the described substrate, after this operation or the front and back of this operation, comprise that with described shielding film be the operation that mask forms first film different with described vapor-deposited film,
Peeling off after the operation that forms described first film of described shielding film carried out.
9. as the formation method of each described vapor-deposited film in the claim 1 to 6, it is characterized in that:
Before the operation that described vapor-deposited film is formed at described substrate, after this operation or the front and back of this operation, comprise the operation of using the mask with through hole to form second film different with described vapor-deposited film,
Peeling off after the operation that forms described second film of described shielding film carried out.
10. as the formation method of each described vapor-deposited film in the claim 1 to 9, it is characterized in that:
Described vapor-deposited film is being formed in the operation of described substrate,
Deposition mask in the mask unit and described substrate are maintained fixed range, and described mask unit comprises: have through hole and the area described deposition mask littler than described substrate; The exit wound of bullet that penetrates to the face that is formed with described shielding film of described substrate across described deposition mask with the evaporation particle that will supply with from the deposition material supply source, and the fixed relative position of described deposition mask and described exit wound of bullet,
In described mask unit and the described substrate any one scans with respect to another at least, thereby form described vapor-deposited film.
11. the formation method of vapor-deposited film as claimed in claim 10 is characterized in that:
Described deposition mask and described substrate in the described mask unit are close to.
12. the manufacture method of a display unit, it has: the operation that forms a plurality of active elements at substrate; Form the operation of first electrode, described first electrode is electrically connected with described each active element and the viewing area on described substrate is rectangular formation; Form the operation of the organic layer that comprises luminescent layer at least at described first electrode; At least form the operation of second electrode with polarity opposite with described first electrode at described organic layer, the manufacture method of this display unit is characterised in that:
In the operation of the described at least luminescent layer in forming described organic layer,
Form the shielding film that can peel off in the mode that does not cover described viewing area and cover as at least a portion of the non-display area of the neighboring area of described viewing area,
On described substrate, across described shielding film, along the line direction of described first electrode that is rectangular formation or the described at least luminescent layer that column direction forms a plurality of linearities that have predetermined distance mutually,
After the operation of the described at least luminescent layer in forming described organic layer or after forming the operation of described second electrode, peel off described shielding film, thus described at least luminescent layer is formed the regulation shape.
13. the manufacture method as the display unit of claim 12 is characterized in that:
In the operation that forms the described organic layer that comprises luminescent layer at least, comprising with described shielding film is mask, forms layer beyond the described luminescent layer in the described organic layer or the operation of metal level or inorganic layer.
14. the manufacture method as claim 12 or 13 described display unit is characterized in that:
In the operation that forms the described organic layer that comprises luminescent layer at least, comprise and use the mask with through hole, form layer beyond the described luminescent layer in the described organic layer or the operation of metal level or inorganic layer.
15. the manufacture method as each described display unit in the claim 12 to 14 is characterized in that:
Peeling off after the operation that forms described second electrode of described shielding film carried out,
In the operation that forms described second electrode, be that mask forms described second electrode with described shielding film.
16. the manufacture method as each described display unit in the claim 12 to 14 is characterized in that:
In the operation that forms described second electrode, use the mask with through hole to form described second electrode.
17. the manufacture method of display unit as claimed in claim 16 is characterized in that:
Be stripped from after the operation of the described at least luminescent layer of described shielding film in forming described organic layer and before the operation that forms described second electrode.
18. the manufacture method as each described display unit in the claim 12 to 16 is characterized in that:
Have the operation of utilizing seal member to seal described first electrode, described organic layer and described second electrode in described viewing area,
Utilize operation that described seal member seals carrying out before described at least luminescent layer is formed the regulation shape by peeling off described shielding film.
19. the manufacture method as each described display unit in the claim 12 to 16 is characterized in that:
Having with described shielding film is mask, forms the operation of the diaphragm seal of sealing described first electrode, described organic layer and described second electrode in described viewing area,
The operation that forms described diaphragm seal is being carried out before described at least luminescent layer is formed the regulation shape by peeling off described shielding film,
By peeling off after described shielding film forms the regulation shape with described at least luminescent layer, carry out utilizing seal member to seal the operation of described first electrode, described organic layer, described second electrode and described diaphragm seal in described viewing area.
20. the manufacture method of display unit as claimed in claim 17 is characterized in that:
Have the operation of utilizing seal member to seal described first electrode, described organic layer and described second electrode in described viewing area,
The operation of utilizing described seal member to seal is carried out after the operation that forms described second electrode.
21. the manufacture method as each described display unit in the claim 12 to 20 is characterized in that:
When on described substrate, when forming the described luminescent layer at least of a plurality of linearities that have predetermined distance mutually along the line direction of described first electrode that is rectangular formation or column direction,
Deposition mask in the mask unit and described substrate are maintained fixed range, and described mask unit comprises: have through hole and the area described deposition mask littler than described substrate; The exit wound of bullet that penetrates to the face that is formed with described shielding film of described substrate across described deposition mask with the evaporation particle that will supply with from the deposition material supply source, and the fixed relative position of described deposition mask and described exit wound of bullet,
In described mask unit and the described substrate any one scans with respect to another at least, thereby form described at least luminescent layer.
22. the manufacture method of display unit as claimed in claim 21 is characterized in that:
Described deposition mask and the described substrate of described mask unit are close to.
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| JP2010-291202 | 2010-12-27 | ||
| JP2010291202 | 2010-12-27 | ||
| PCT/JP2011/079439 WO2012090770A1 (en) | 2010-12-27 | 2011-12-20 | Method for forming deposition film, and method for producing display device |
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| CN103270816A true CN103270816A (en) | 2013-08-28 |
| CN103270816B CN103270816B (en) | 2016-05-18 |
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| CN201180062848.1A Expired - Fee Related CN103270816B (en) | 2010-12-27 | 2011-12-20 | The formation method of vapor-deposited film and the manufacture method of display unit |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9076989B2 (en) |
| JP (1) | JP5384751B2 (en) |
| CN (1) | CN103270816B (en) |
| WO (1) | WO2012090770A1 (en) |
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| WO2016165274A1 (en) * | 2015-04-13 | 2016-10-20 | 京东方科技集团股份有限公司 | Manufacturing method for display substrate, display substrate, and display device |
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| CN110234783A (en) * | 2017-01-31 | 2019-09-13 | 堺显示器制品株式会社 | Manufacturing method, the manufacturing method of deposition mask and organic semiconductor device of deposition mask |
| CN110234783B (en) * | 2017-01-31 | 2021-09-21 | 堺显示器制品株式会社 | Vapor deposition mask, and method for manufacturing organic semiconductor element |
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| CN110997969A (en) * | 2017-08-31 | 2020-04-10 | 堺显示器制品株式会社 | Method for manufacturing film formation mask |
| CN114276025A (en) * | 2021-11-26 | 2022-04-05 | 深圳市信濠光电科技股份有限公司 | Method for producing glass product with PVD (physical vapor deposition) conductive layer by film pasting shielding |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103270816B (en) | 2016-05-18 |
| US9076989B2 (en) | 2015-07-07 |
| JPWO2012090770A1 (en) | 2014-06-05 |
| WO2012090770A1 (en) | 2012-07-05 |
| US20130295705A1 (en) | 2013-11-07 |
| JP5384751B2 (en) | 2014-01-08 |
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