CN109844165B

CN109844165B - Resin film forming method and mask

Info

Publication number: CN109844165B
Application number: CN201880003976.0A
Authority: CN
Inventors: 青代信; 清健介; 高桥明久
Original assignee: Ulvac Inc
Current assignee: Ulvac Inc
Priority date: 2017-02-21
Filing date: 2018-02-20
Publication date: 2021-11-12
Anticipated expiration: 2038-02-20
Also published as: KR20190049834A; JPWO2018155440A1; CN109844165A; KR102235066B1; JP6853873B2; WO2018155440A1

Abstract

The method for forming a resin film according to the present invention is a method for forming a patterned resin film on a substrate, and includes, in order, at least: a first step of providing a mask having a structure in which a mask body has a flexible supporting portion and an adhesive portion, so that the adhesive portion is in contact with the substrate, by using the mask; a second step of supplying the vaporized resin material to the substrate through an opening provided in the mask body to condense the resin material on the substrate, and irradiating the resin material film and the mask with UV light after forming the liquid resin material film on the substrate; and a third step of peeling the mask from the substrate.

Description

Resin film forming method and mask

Technical Field

The present invention relates to a method for forming a resin film, which can realize cost reduction and operation simplification, and a mask having an effective structure in forming the resin film.

The present application claims priority based on patent application No. 2017-030320 filed in japan at 21.2.2017, the contents of which are incorporated herein by reference.

Background

As a method for producing a resin film made of a polymer organic substance, a vapor deposition polymerization method and an ultraviolet curing method are widely used. Both of these methods are methods of introducing a low-molecular organic gas into a processing tank after pressure reduction to cause a polymerization reaction of a resin material supplied onto an object to be processed, thereby forming a polymer resin film on the surface of the object, and both methods have a characteristic that the coverage (coating rate) of the resin film with respect to the surface of the object is good. Patent document 1 discloses a film deposition apparatus suitable for these production methods.

Fig. 7 shows a process of forming a resin film using a metal mask. An acrylic resin film is exemplified as a representative example of the resin film.

First, after a pretreatment such as formation of an inorganic protective film is performed on the substrate S, the substrate S is moved into a film forming chamber (SX1, SX 2).

In the film formation chamber (reduced pressure atmosphere), as shown in fig. 8 to 10, the metal mask MX having the desired opening is disposed on the film formation surface of the substrate S (SX 3). Accordingly, as shown in fig. 10, the film formation surface of the substrate S located at the opening is exposed.

Next, as shown in fig. 11, an acrylic material film f is formed on the substrate S through the metal mask MX (SX 4). The acrylic material film f is composed of a portion f1 covering the substrate S and a portion f2 connected to the portion f1 and covering the metal mask MX [ fig. 11B ].

Next, ultraviolet rays (UV) are irradiated to the acrylic material film F, the acrylic material film F is cured, and the acrylic resin film F is formed, and then, as shown in fig. 12, the metal mask MX is moved in the direction of the arrow, whereby the metal mask MX is peeled off from the substrate S (SX5, SX 6). The metal mask MX is cleaned and reused after one film formation or after the substrate is replaced to be used a plurality of times (film formation is performed a plurality of times).

In such an apparatus, a device for cleaning the metal mask MX is required. Further, an alignment mechanism for aligning the metal mask MX with the substrate in vacuum is required.

Patent document 1: japanese patent No. 4112702

Disclosure of Invention

The present invention has been made in view of the above circumstances, and an object thereof is to provide a method for forming a resin film, which can achieve cost reduction and simplification of work in forming a resin film using a mask.

A method for forming a resin film according to a first aspect of the present invention is a method for forming a patterned resin film on a substrate, the method including, in order, at least: a first step (step a) of providing a mask having a structure in which a mask body has a flexible (film-like) supporting portion and an adhesive portion superimposed on each other, so that the adhesive portion is in contact with the substrate (film formation surface); a second step (step β) of supplying the vaporized resin material to the substrate (film formation surface) through an opening provided in the mask body, condensing the resin material on the substrate, and irradiating the resin material film and the mask with UV light after forming a liquid resin material film on the substrate; and a third step (step γ) of peeling the mask from the substrate.

In the method for forming a resin film according to the first aspect of the present invention, a member whose adhesiveness to the substrate is reduced by irradiation with UV light is used as the adhesive portion.

In the resin film forming method according to the first aspect of the present invention, the thickness of the resin material film is controlled so as not to exceed the thickness of the bonded portion.

In the method for forming a resin film according to the first aspect of the present invention, the first step and the third step are performed in an atmospheric pressure atmosphere, and the second step is performed in a reduced pressure atmosphere.

A mask according to a second aspect of the present invention is a mask for forming a resin film on a substrate by polymerizing a liquid resin material film after the resin material film is formed on the substrate through an opening provided in a mask body having a structure in which an adhesive portion, which is a member whose adhesiveness to the substrate is lowered by irradiation of UV light, is superimposed on a flexible (film-like) supporting portion.

In the mask according to the second aspect of the present invention, the thickness of the bonding portion is larger than the thickness of the resin material film formed on the substrate.

The method for forming a resin film according to the aspect of the present invention can perform the operation of disposing the mask on the substrate before forming the resin film and the operation of peeling the mask from the substrate after forming the resin in the atmospheric pressure atmosphere. Accordingly, the arrangement and the peeling operation of the mask with respect to the substrate under the reduced pressure atmosphere, which are necessary in the conventional manufacturing method, become unnecessary in the aspect of the present invention.

Therefore, the embodiment of the present invention provides a method for forming a resin film, which can realize cost reduction and operation simplification in forming a resin film using a mask.

The mask body of the mask according to the aspect of the present invention has a structure in which a flexible (film-like) support portion is overlapped with an adhesion portion, and the adhesion portion is formed of a member whose adhesiveness to a substrate is reduced by irradiation of UV light. Accordingly, the work of removing the mask from the substrate after the resin film is formed becomes easy. Moreover, a phenomenon (occurrence of a steep protrusion as shown in fig. 12B) in which the thickness of the resin film locally increases in a portion (also referred to as a mask end) adjacent to the mask, which is generated when the mask is removed, is suppressed.

Therefore, according to the aspect of the present invention, a resin film having a uniform thickness with a small film thickness unevenness is realized. As a use of such a resin film, for example, an encapsulating film suitable for a flexible display is exemplified.

Drawings

Fig. 1 is a diagram showing a flow of manufacturing an acrylic resin film according to an embodiment of the present invention.

Fig. 2 is a cross-sectional view of the adhesive film mask before it is disposed on the substrate.

Fig. 3 is a plan view of an adhesive film mask.

Fig. 4A is a cross-sectional view showing a state where an adhesive film mask is disposed on a substrate and UV-irradiated.

Fig. 4B is a cross-sectional view showing a state where the adhesive film mask is disposed on the substrate and UV-irradiated.

Fig. 5A is a cross-sectional view showing a state in which an acrylic material film is formed on a substrate via an adhesive film mask.

Fig. 5B is a cross-sectional view showing a state in which an acrylic material film is formed on a substrate via an adhesive film mask.

Fig. 6A is a cross-sectional view showing a state where the adhesive film mask is peeled off from the substrate after UV irradiation.

Fig. 6B is a cross-sectional view showing a state where the adhesive film mask is peeled off from the substrate after UV irradiation.

Fig. 7 is a diagram showing a conventional flow of manufacturing an acrylic resin film.

Fig. 8 is a cross-sectional view of a conventional mask made of metal before it is placed on a substrate.

Fig. 9 is a plan view of a conventional mask.

Fig. 10A is a cross-sectional view showing a state after a conventional mask is disposed on a substrate.

Fig. 10B is a cross-sectional view showing a state after a conventional mask is disposed on a substrate.

Fig. 11A is a cross-sectional view showing a state where an acrylic resin film is formed on a substrate on which a conventional mask is disposed.

Fig. 11B is a cross-sectional view showing a state where an acrylic resin film is formed on a substrate on which a conventional mask is disposed.

Fig. 12A is a cross-sectional view showing a state where a conventional mask is peeled off from a substrate after UV irradiation.

Fig. 12B is a cross-sectional view showing a state where a conventional mask is peeled off from a substrate after UV irradiation.

Fig. 13 is a schematic diagram showing an example of an apparatus for producing an acrylic film according to the embodiment of the present invention.

Detailed Description

A method for forming a resin film according to an embodiment of the present invention and a mask having an effective structure for forming the resin film will be described below with reference to the drawings. An acrylic resin film is exemplified as an example of the resin film.

< method for Forming acrylic resin film >

Fig. 1 is a flowchart illustrating a process for producing an acrylic resin film according to an embodiment of the present invention, and a method for forming an acrylic resin film includes seven steps SA1 to SA 7.

Steps SA2 to SA3 are steps (operations) of disposing a mask on a substrate before forming an acrylic resin film, and steps SA6 to SA7 are steps (operations) of peeling the mask from the substrate after forming an acrylic resin. These operations can be performed outside the film forming chamber (in an atmospheric pressure atmosphere) by using an adhesive film mask described later. Steps SA4 to SA5 located between these two steps are steps (steps) of forming an acrylic resin film on a substrate, and only these steps are performed in a film forming chamber (reduced pressure atmosphere). Accordingly, according to the embodiment of the present invention, the arrangement and the peeling operation of the mask with respect to the substrate under the reduced pressure atmosphere, which are necessary in the conventional manufacturing method, become unnecessary. Therefore, in the formation of the acrylic resin film using the mask, cost reduction and simplification of the work can be achieved.

The respective steps (steps SA1 to SA7) shown in the flowchart of fig. 1 will be described in detail below with reference to fig. 2 to 6.

Fig. 2 is a cross-sectional view of the adhesive film mask used in the embodiment of the present invention before it is disposed on the substrate. Fig. 3 is a plan view of an adhesive film mask. Fig. 4A and 4B are cross-sectional views showing a state where an adhesive film mask is disposed on a substrate.

The adhesive film mask MA is a mask for supplying an acrylic material onto the substrate S through an opening provided in the mask main body MA1 to form a liquid acrylic material film on the substrate S. Before the adhesive film mask MA is disposed, a light emitting portion, an inorganic sealing film, and the like are formed on the substrate S (step SA 1).

As shown in fig. 2 and 3, the adhesive film mask MA has an opening having a predetermined shape with respect to the substrate S. As shown in fig. 4B, the adhesive film mask MA has a mask body MA1 including a flexible (film-like) support portion, and has a structure in which an adhesive portion MA2 is overlapped with the mask body MA 1. The adhesive portion MA2 is formed of a member whose adhesiveness to the substrate S is reduced by UV light irradiation.

The mask MA having a structure in which the adhesive portion MA2 overlaps the mask body MA1 formed of a flexible (film-like) support portion is disposed so that the adhesive portion MA2 is in contact with the film formation surface (upper surface in fig. 4A and 4B) of the substrate S (step SA 2). The mask MA is bonded and fixed to the substrate S by the bonding portion MA 2. The substrate S with the adhesive film mask MA attached thereto is transported into the film forming chamber (step SA 3). Step SA2 and step SA3 are referred to as step α.

Next, the vaporized acrylic material is supplied to the film formation surface of the substrate S through the opening provided in the mask main body MA 1. Since the substrate is cooled, the acrylic material in the gas condenses, and as shown in fig. 5A and 5B, a liquid acrylic material film f is formed on the substrate S (step SA 4). Here, reference numeral f1 denotes an acrylic material film to be deposited on the film formation surface of the substrate S, and reference numeral f2 denotes an acrylic material film to be deposited on the mask body MA1 composed of a flexible (thin-film-like) support portion.

Then, the acrylic material film f is irradiated with UV light (step SA 5). Accordingly, the acrylic resin film F is cured to become the acrylic resin film F. Further, the bonding portion MA2 located between the mask main body MA1 and the substrate S is weakened in adhesion to the substrate S by the influence of the UV light irradiation. Step SA4 and step SA5 are referred to as step β. In this state, the substrate S is conveyed to the outside of the film deposition apparatus (step SA 6).

Next, as shown in fig. 6A and 6B, the mask MA is peeled off from the substrate S (step SA 7). Step SA7 is referred to as step γ.

Since the adhesion of the adhesion portion MA is weakened or lost, the mask MA can be easily peeled off from the substrate S. The stripped mask is discarded. Since the thin film mask is cheaper than the metal mask, it can be used once. Furthermore, since there is no need to clean the thin film mask, it is advantageous over the metal mask in terms of environmental load, cost, and the like.

The arrows in fig. 6A indicate the direction in which the mask MA is peeled off from the substrate. Fig. 6B is an enlarged view of the region of reference character E. The symbol ea denotes an end of a portion F1 of the acrylic resin film to be coated on the surface of the substrate S to be coated. The end of the portion F1 of the acrylic resin film is the end formed when the mask MA is peeled off from the substrate.

In the acrylic resin film thus produced, the generation of a steep protrusion as shown in fig. 12B was not observed.

That is, it is clear that the embodiment of the present invention can significantly suppress the formation of a steep projection in a portion (also referred to as a mask end) adjacent to a mask, which occurs when the mask is removed in the conventional manufacturing method.

Therefore, the embodiment of the present invention provides a method for forming a mask pattern suitable for use in an encapsulating film, which is required to have a uniform film thickness with a small unevenness of film thickness and good visibility.

< adhesive film mask >

As shown in fig. 4B, the adhesive film mask MA according to the embodiment of the present invention has a structure in which the adhesive portion MA2 overlaps the mask body MA1 formed of a flexible (film-like) support portion. The adhesive portion MA2 is formed of a member whose adhesiveness to the substrate is reduced by UV light irradiation. Accordingly, as described in the first embodiment, the operation of removing the adhesive film mask MA from the substrate S after the acrylic resin film F is formed becomes easy.

In addition, since there is a member (bonding portion MA2) whose adhesiveness to the substrate S is lowered, when the acrylic material film f in liquid is formed on the substrate S, an increase in the film thickness of the acrylic material film in a portion in contact with the mask due to surface tension is suppressed. This is considered to be significant in cases such as when the contact angle of the acrylic material film in liquid with respect to the adhesive portion MA2 is large, when curing of the acrylic material film occurs simultaneously with the decrease in adhesiveness of the adhesive portion MA2, and the like. Therefore, the adhesive film mask MA according to the embodiment of the present invention causes the separation of the portion F1 and the portion F2 of the acrylic resin film, which is generated when the adhesive film mask MA is removed. As a result, the occurrence of a phenomenon in which the film thickness of the resin film locally increases in a portion (also referred to as a mask end) adjacent to the mask (the occurrence of a steep protrusion) is eliminated.

Therefore, the embodiment of the present invention realizes an acrylic resin film having a uniform thickness with a small thickness unevenness and ensuring good visibility. As an application of such an acrylic resin film, for example, it is suitable for an encapsulating film of an organic EL display or a flexible display.

The adhesive film mask MA includes a mask main body MA1 and an adhesive portion MA2, the mask main body MA1 is made of Polyamide (PI) or polyethylene terephthalate (PET) resin, and the adhesive portion MA2 is made of an adhesive material whose adhesiveness is reduced by irradiation of UV light. The mask body MA1 is formed of a flexible (film-like) support portion.

The thickness of the adhesive ME2 contacting the substrate S may be set to be larger than the thickness of the formed acrylic resin film. This is preferable because the occurrence of the "steep convex portion" state is further reduced. For example, in the range where the thickness of the adhesive ME2 is larger than the thickness of the acrylic resin film, when the thickness of the acrylic resin film is 50nm to 20 μm, the thickness of the adhesive portion MA2 is 10 μm to 50 μm.

< apparatus for producing acrylic resin film >

Fig. 13 shows an example of a configuration of a manufacturing apparatus 100, in which the manufacturing apparatus 100 uses the adhesive film mask MA according to the above-described embodiment of the present invention to form a liquid resin material film on a substrate by supplying a resin material onto the substrate, and to polymerize the resin material film to form a resin film. Next, a case of forming an acrylic film as an example of the resin material film will be described in detail.

The film forming apparatus 100 includes a chamber 110 whose internal space can be depressurized, and a vaporizer 300 that supplies a vaporized resin material to the chamber 110 (process chamber).

As described later, the inner space of the chamber 110 is constituted by the upper space 107 and the lower space 108.

The chamber 110 is connected to a vacuum exhaust apparatus (vacuum exhaust means, vacuum pump, or the like) not shown, and the vacuum exhaust apparatus is configured to be capable of exhausting gas in the internal space so that the internal space of the chamber 110 becomes a vacuum atmosphere.

As shown in fig. 13, the shower plate 105 is disposed in the internal space of the chamber 110, and the upper side of the shower plate 105 constitutes an upper space 107 in the chamber 110. A ceiling plate 120 made of a member that transmits ultraviolet light is provided at the uppermost part of the chamber 110, and an ultraviolet light irradiation device 122(UV irradiation device) is disposed above the ceiling plate 120. Here, since the shower plate 105 is also formed of a member that transmits ultraviolet light, the ultraviolet light introduced from the irradiation device 122 into the upper space 107 through the top plate 120 can further travel through the shower plate 105 toward the lower space 108 located below the shower plate 105. Accordingly, it is possible to form an acrylic resin film (resin film) by irradiating ultraviolet light after film formation to cure the acrylic material film (resin material film) on an acrylic material film formed on a substrate S described later.

A heating device not shown is disposed in the chamber 110. The temperature of the inner wall surface of the chamber 110 constituting the upper space 107 and the lower space 108 may be set to a dew point temperature of the resin material or higher, preferably about 40 to 250 ℃, and controlled by a heating device.

In the chamber 110, a stage 102 (substrate holding portion) is disposed in a lower space 108 located below the shower plate 105, and the substrate S on which the acrylic resin film is formed is placed on the stage 102.

The position where the substrate is to be arranged is predetermined on the surface of the stage 102. The table 102 is disposed in the chamber 110 with its surface exposed. Reference symbol S denotes a substrate arranged at a predetermined position on the surface of the substrate table 102. A substrate cooling device 102a for cooling the substrate S is provided at the stage 102.

The substrate cooling device 102a supplies a coolant to the inside of the table 102 to cool the substrate S on the upper surface of the table 102. Specifically, the temperature of the substrate S is controlled by a cooling device 102a built in a stage 102 (substrate holding section) on which the substrate S is placed, and is controlled to be not higher than the vaporization temperature of the resin material, preferably not higher than zero (0 ℃), for example, about-30 ℃ to 0 ℃.

A shower plate 105 is provided on the upper side of the table 102 with respect to the entire surface of the table 102. The shower plate 105 is formed of a plate-shaped member made of an ultraviolet transmitting material such as quartz having a plurality of through holes, and divides the internal space of the chamber 110 into an upper space and a lower space.

The upper space 107 of the chamber 110 communicates with the vaporizer 300 via a pipe 112 (resin material supply pipe) and a valve 112V. The vaporized resin material can be supplied to the upper space 107 of the chamber 110 via this resin material supply pipe 112.

One end of a resin material bypass pipe 113 (second pipe) having a valve 113V is connected to the vaporizer 300 at a position closer to the valve 112V of the resin material supply pipe 112 (first pipe). The other end of the resin material bypass pipe 113 (second pipe) is connected to the outside via an exhaust pipe 114, and the gas can be discharged through the resin material bypass pipe 113.

The opening and closing drive of the

valves

112V and 113V is controlled by the control unit 400. The control unit 400 can control a film formation state in which the vaporized resin material from the vaporizer 300 is supplied into the chamber 110, and a non-film formation state in which the vaporized resin material from the vaporizer 300 is discharged to the outside without being supplied into the chamber 110, so as to be switchable.

The

valves

112V, 113V, and the control section 400 constitute a switching section having a selection function of supplying the resin material to the inside of the chamber 110 or discharging the resin material to the outside of the chamber 110.

The vaporizer 300 may supply the vaporized resin material to the chamber 110. As shown in fig. 13, the vaporizer 300 has a vaporization tank 130, a discharge portion 132, and a resin material raw material container 150.

As shown in fig. 13, the vaporization tank 130 includes an internal space for vaporizing the liquid resin material, and a discharge portion 132 for spraying the liquid resin material is disposed above the internal space. The vaporization tank 130 is formed in a substantially cylindrical shape, but may be formed in other cross-sectional shapes. In the vaporization tank 130, the inner surface thereof may be composed of, for example, SUS, aluminum, or the like.

One end of a resin material liquid supply pipe 140 connected to the resin material raw material container 150 via a valve 140V and a carrier gas supply pipe 130G for supplying a carrier gas such as nitrogen gas are connected to the discharge portion 132. The other end of the resin material liquid supply pipe 140 is connected to the resin material raw material container 150, and is positioned inside the liquid resin material stored in the resin material raw material container 150.

A pressurized gas supply pipe 150G for supplying a material liquid such as nitrogen gas is connected to the resin material raw material container 150, and the pressurized liquid resin material can be supplied to the resin material liquid supply pipe 140 by raising the internal pressure of the resin material raw material container 150.

The discharge section 132 is configured to spray the carrier gas into the internal space of the vaporization tank 130 together with the liquid resin material supplied from the resin material liquid supply pipe 140. The spitting part 132 is provided at a substantially central position of the top of the vaporization tank 130.

In the vaporization tank 130, as shown in fig. 13, a warming section 135 is provided at a lower position of the vaporization tank 130.

The heating unit 135 is configured to divide the internal space into an upper space and a lower space, and a vaporization space is formed above the heating unit 135 and a storage unit is formed below the heating unit.

The heating unit 135 is provided below the discharge unit 132, and heats and vaporizes the liquid resin material sprayed from the discharge unit 132.

The internal pressure of the resin material container 150 is increased, and the carrier gas is sprayed from the discharge portion 132 into the internal space of the vaporization tank 130 together with the liquid resin material supplied from the resin material liquid supply pipe 140. At this time, the resin material and the carrier gas supplied to the discharge portion 132 may be further heated.

The resin material sprayed from the discharge portion 132 into the internal space of the vaporization tank 130 together with the carrier gas is vaporized inside the vaporization tank 130 after being heated.

In the process of stably vaporizing the resin material, the control unit 400 opens the valve 112V to allow gas to flow into the chamber 110, and closes the valve 113V. Accordingly, the resin material bypass pipe 113 (second pipe) is kept in a state where gas cannot flow therein. Thereby, the vaporized resin material can be supplied to the chamber 110 to perform the film formation process.

By driving the switching unit, that is, by merely switching the open/close states of the

valves

112V and 113V by the control unit 400, it is possible to select the supply of the resin material to the chamber 110 and the supply of the resin material to the resin material bypass pipe 113 (second pipe). Therefore, since the supply amount of the vaporized resin material supplied to the chamber 110 can be stabilized, it is possible to prevent the film formation rate from varying, and to stably form a resin material film having excellent film formation properties. Further, when the substrate S in the chamber 110 is replaced, since the vaporization of the resin material can be continued without introducing the resin material into the chamber 110, the stop/start of the vapor generation is not repeated, and the vapor generation rate can be substantially fixed.

The film forming apparatus 100 is configured to be capable of forming a film of a resin material having a vaporization temperature of about 40 to 250 ℃ and formed of an ultraviolet-curable acrylic resin and of irradiating ultraviolet rays for curing the resin material after the film formation, for example, in the same chamber 110. Accordingly, any process can be performed by the same apparatus configuration, and productivity can be improved.

The present invention is widely applicable to a method for forming a resin film and a mask having an effective structure for forming a resin film. The present invention is applicable to, for example, a case where a resin film is produced as an encapsulating film for an organic EL display or a flexible display.

Description of the reference numerals

An F resin material film, an MA mask, an MA1 mask main body, an MA2 bonding portion, an S substrate, an F (F1, F2) acrylic material film, and an F (F1, F2) acrylic resin film.

Claims

1. A method for forming a resin film, which is a method for forming a patterned resin film on a film-formation surface of a substrate, comprises at least, in this order:

a first step of providing a mask having a structure in which a flexible supporting portion is overlapped with an adhesion portion, the adhesion of which to the film formation surface of the substrate is lowered by irradiation of UV light, by using the mask, so that the adhesion portion is in contact with the film formation surface of the substrate;

a second step of supplying a vaporized resin material to the substrate through an opening provided in the mask body and condensing the vaporized resin material on the film formation surface of the substrate, and after forming a liquid resin material film on the film formation surface of the substrate, irradiating the resin material film and the mask with UV light to cure the resin material film, thereby reducing the adhesive force of the adhesive portion with respect to the substrate; and

a third step of peeling the mask from the substrate,

the thickness of the resin material film is controlled so as not to exceed the thickness of the bonded portion.

2. The resin film forming method according to claim 1, wherein,

the first step and the third step are performed in an atmospheric pressure atmosphere, and the second step is performed in a reduced pressure atmosphere.

3. A mask used in the method for forming a resin film according to claim 1, which is used for forming a resin film on a substrate by polymerizing a resin material film after the resin material film is formed in a liquid state on a film-formed surface of the substrate through an opening provided in a mask main body,

the mask body has a structure that the bonding part is overlapped on the flexible supporting part,

the adhesive portion is a member whose adhesiveness to the substrate is reduced by irradiation of UV light,

the thickness of the bonding portion is larger than the thickness of a resin material film formed on the substrate.