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CN102124560A - 用于制造电子组件的方法 - Google Patents

用于制造电子组件的方法 Download PDF

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CN102124560A
CN102124560A CN2009801322141A CN200980132214A CN102124560A CN 102124560 A CN102124560 A CN 102124560A CN 2009801322141 A CN2009801322141 A CN 2009801322141A CN 200980132214 A CN200980132214 A CN 200980132214A CN 102124560 A CN102124560 A CN 102124560A
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film
electronics
conducting power
structural detail
layer
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CN102124560B (zh
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U·沙夫
A·库格勒
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Robert Bosch GmbH
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Robert Bosch GmbH
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Abstract

本发明涉及一种用于制造电子组件的方法，所述电子组件包括至少一个电子的结构元件（9）以及印制导线结构（7），所述至少一个电子的结构元件（9）与所述印制导线结构相接触。对于该方法来说，在第一步骤中使有传导能力的薄膜（1）结构化以用于构成印制导线结构（7）。在第二步骤中，给所述印制导线结构（7）装备所述至少一个电子的结构元件（9）。在终结的步骤中在一面上将另外的薄膜层压到所述用至少一个电子的结构元件（9）装备的有传导能力的薄膜（1）上，在这一面上所述有传导能力的薄膜（1）用所述至少一个电子的结构元件（9）来装备。

Description

用于制造电子组件的方法
技术领域
本发明涉及一种用于制造电子组件的方法，所述电子组件包括至少一个电子的结构元件以及印制导线结构，所述至少一个电子的结构元件与所述印制导线结构相接触。
背景技术
用于制造电子组件的电子的结构元件比如是集成的开关电路（IC）。这些开关电路比如为了将其封装起来并且增加电子的线路载体上的表面利用率而接纳在基片中。由此可以保护电子的结构元件。比如从US-B 6,512,182中知道，将固定座铣入到印刷电路板基片中，将电子的结构元件放到所述固定座中。在放入电子的结构元件之后，将所述固定座填满，随后对其进行平整和覆盖层压（überlaminieren）。通过电子的结构元件的埋入，可以获得电子组件的光滑的表面。
这种组件的缺点是，首先要将固定座铣入到印刷电路板基片中，然后将电子的结构元件装到所述固定座中。通过这种方式很难对电子的结构元件进行精确的定位。
一种用于制造具有以机械方式通过填料彼此相连接的电气的结构元件的电气线路的方法从DE-A 10 2005 003 125中得到公开。在填料的至少一面上设置了至少一层将结构元件彼此间以电气方式连接起来的印制导线。为制造线路，将结构元件施加在载体薄膜上并且随后用填料来包封。接着移走载体薄膜并且在结构元件与载体薄膜相连接的一面上施加一层或多层将结构元件彼此间以电气方式连接起来的印制导线。但是，为了获得电气线路的有功能能力的布线，在这种情况下有必要的是，必须无残余地移除载体薄膜。
从现有技术中已知的电子组件的其它缺点是其由于所装入的印刷电路板基片引起的较大的厚度。此外，根据现有技术制造的电子组件是刚性的并且不能变形。如果比如要将电子组件用在服饰中，比如用作发射器，用于找到被雪崩掩没的人员或者也用作防盗装置，那就期望使用柔性的能够与服饰的运动相匹配的电子组件。
发明内容
按本发明的方法用于制造电子组件，所述电子组件包括至少一个电子的结构元件以及印制导线结构，所述至少一个电子的结构元件与所述印制导线结构相接触，所述方法包括以下步骤：
（a）使有传导能力的薄膜结构化以用于构成印制导线结构，
（b）给所述印制导线结构装备至少一个电子的结构元件，
（c）在一面上将另外的薄膜层压到所述用至少一个电子的结构元件装备的有传导能力的薄膜上，在这一面上所述有传导能力的薄膜用所述至少一个电子的结构元件来装备。
在一面上有传导能力的薄膜用所述至少一个电子的结构元件来装备，在这一面上将薄膜层压到所述用至少一个电子组件来装备的有传导能力的薄膜上，通过这种方式来对结构元件进行完全的封装。由此可以获得尤其敏感的结构元件的较高的可靠性。
印制导线结构用结构元件来装备，所述结构元件比如是集成的开关电路（IC）、电池、太阳能模块或者其它为本领域的技术人员所熟悉的通常用于制造电子组件的电子构件。通过用至少一个电子的结构元件来装备的有传导能力的薄膜的结构化以及另外的薄膜的随后的层压，来获得柔性的复合结构。此外，在使用比如由热塑性的材料制成的薄膜时可以制造能够变形的组件。所述热塑性的薄膜在此比如是层压到有传导能力的薄膜上的另外的薄膜或者将能够变形的比如热塑性的薄膜用作与有传导能力的薄膜相连接的载体薄膜。
在一种实施方式中，所述另外的层压到所述用至少一个电子的结构元件来装备的有传导能力的薄膜上的薄膜同样是用至少一个电子的构件来装备的有传导能力的薄膜。在此优选如此进行层压，使得两个薄膜的电子的构件朝向彼此，从而所述有传导能力的薄膜处于层复合结构的外侧面上。通过这种方式可以明显提高表面利用率。为了避免因另外的薄膜层压到所述有传导能力的薄膜上而产生不受欢迎的电气连接，在此优选在两个有传导能力的薄膜之间加入由电介质的材料制成的层。优选所述加入到两个有传导能力的薄膜之间的层是塑料层。作为塑料，比如使用热塑性塑料。但是也可以使用每种任意其它的塑料。加入到两个有传导能力的薄膜之间的层优选用于固定构件并且保证接触。
为了将塑料层加入到两个有传导能力的薄膜之间，比如可以在用至少一个电子的结构元件装备之前将塑料覆层施加到有传导能力的薄膜上。所述塑料覆层在此可以在使薄膜结构化以构成印制导线结构之前或者之后来施加，在有传导能力的薄膜结构化之前来施加塑料覆层，这样做的优点是，通过所述塑料层来得到连续的衬底，在所述衬底上来构造金属层。由此不会通过比如不小心的操作使各根印制导线移动或折弯。与此不同的是，在有传导能力的薄膜未设有塑料层时有必要将有传导能力的薄膜保持在基座上，其中而后应该如此小心地操作所述结构化的薄膜，使得所述结构的各根印制导线不会移动或者折弯。
但是，作为替代方案比如也可以在给有传导能力的薄膜进行装备之后才在一面上将塑料层施加到薄膜上，所述至少一个电子的构件定位在这一面上。此外也可以在给有传导能力的薄膜进行装备之后将另外的塑料层施加到薄膜上。在这种情况下在给有传导能力的薄膜进行装备之前施加的塑料覆层可以布置在所述薄膜已经用电子的结构元件来装备的一面上，或者说布置在薄膜的背向所述构件的一面上。
如果另外的层压到用至少一个电子的结构元件来装备的有传导能力的薄膜上的薄膜同样是有传导能力的薄膜，那么在一种实施方式中为了连接由传导能力的薄膜构造的印制导线结构可以加入金属化通孔。所述金属化通孔的加入比如可以通过以下方式来进行，即构造一些孔并且随后使这些孔金属化。作为替代方案，也可以比如通过深冲过程来制造金属化通孔，在所述深冲过程中将有传导能力的薄膜的上面的层通过芯棒挤压穿过电介质，直到其与下面的有传导能力的薄膜相接触。
为了避免在有传导能力的薄膜上出现比如会导致电子组件的功能故障的不受欢迎的触点，在此优选的是，在电子组件的至少一个向外指向的面上施加绝缘层。所述绝缘层通常由电介质的材料制成。特别优选塑料适合用作绝缘层。尤其如果要使电子组件变形，那么有利的是，所述绝缘层由热塑性的材料制成。
除了热塑性的塑料或者热固性的塑料的使用之外，作为替代方案也比如可以使用用于电介质的弹性体或者能够伸缩的硅酮并且必要时使用至少一个绝缘层。通过弹性体或者能够伸缩的硅酮的使用，可以结合合适地设计的印制导线结构来制造朝所有的空间方向均为柔性结构的电子线路。尤其这样的电子组件比如也可以伸缩。对于能够塑性变形的材料来说，为进行伸缩或者弯曲通常应该使用变形力并且必要时对电子组件进行加热。
在本发明的一种实施方式中，将至少两个电子组件彼此连接成层复合结构（Schichtverbund）。通过所述层复合结构也可以将两个以上的由用电子的结构元件来装备的印制导线结构构成的层彼此连接起来。各个层在此可以通过金属化通孔彼此进行电气接触。
如果一个层复合结构要由两个以上的层制成，那么可以给有导电能力的薄膜在其上侧面上并且在其下侧面上分别装备至少一个电子的结构元件。在这种情况下，不仅在有导电能力的薄膜的上侧面上而且在其下侧面上都层压另外的薄膜。
此外，比如也可以将多个在两侧分别用至少一个电子的结构元件来装备的薄膜彼此连接成层复合结构。在这种情况下，分别在两个薄膜之间加入电介质。所述电介质如此前已经提到的一样比如是塑料或者硅酮。
为了得到所述电子的结构元件的得到改进的封装效果，优选的是，额外地用造型材料将电子的结构元件包围。通过用造型材料来包围结构元件这种方式，比如可以获得电子的结构元件以及接触结构的额外的稳定效果，使得电子的结构元件比如在电子组件弯曲时不会折断。
在一种实施方式中，在终结的步骤中将电子组件变形为成形件。变形过程比如可以通过深冲或者其它变形方法来进行。尤其作为电介质使用能够变形的材料时可以进行变形。为了避免用来给薄膜进行装备的电子的结构元件在变形过程中受到损坏，一方面可以如此设计所述装备过程，从而在成形件的弯曲部位或者折弯部位上未施加任何电子的结构元件。但是作为替代方案比如也可以使用柔性的比如能够弯曲的构件。
通过所述按本发明的方法，可以以低廉的成本通过在多个模块上处理过程的同时使用并且通过卷对卷制作（Reel-to-Reel-Fertigung）来实现成本低廉的布线和封装。此外，可以对电子组件比如作为标准构件继续进行加工。在按本发明的方法中电子的结构元件的接触与安装同时进行。这使得所必需的过程步骤少于从现有技术中已知的方法。
另一个优点是，也将成本低廉的塑料用作电介质。这样的塑料为比如RFID领域的技术人员所熟知。这些塑料尤其可以用在较低的温度范围内的应用方案中。
尤其通过柔性的电子装置的使用，可以通过按本发明的方法来制造完全柔性的并且能够变形的线路。如果使用能够塑性变形的线路载体，那么比如也可以将在终结的步骤中变形为成形件的电子组件用作外壳件。所述外壳件比如可以通过粘接或者冲压与真正的外壳相连接并且在需要时与真正的外壳相接触。
附图说明
本发明的实施例在附图中示出并且在下面的描述中进行详细解释。其中：
图1到7示出用于制造电子组件的方法的步骤，
图8示出按本发明制造的电子组件。
具体实施方式
在图1到7中示出了用于制造按本发明构成的电子的构件的各个方法步骤。
在图1所示的第一步骤中，使有导电能力的薄膜1结构化以用于构成印制导线结构。所述结构化在此仅仅在所述有导电能力的薄膜1的有导电能力的层3上进行。在这里所示出的实施方式中，所述有导电能力的层3施加在无导电能力的层5上。所述无导电能力的层5在此用作载体层并且未结构化。所述无导电能力的层5比如是塑料层。尤其金属比如铜或银适合用作有导电能力的层3。此外，金、钯或者层复合结构比如NiPdAu也适合用作有导电能力的层3。所述无导电能力的层5比如可以通过层压或者刮涂（Rakeln）施加到有导电能力的层3上。所述无导电能力的层5的施加要么可以在所述有导电能力的层3的结构化之后进行要么可以在所述有导电能力的层3的结构化之前进行。
作为替代方案，也比如可以使用仅仅具有一层有导电能力的层3的有导电能力的薄膜1。但是在这种情况下有必要的是，将所述仅仅具有有导电能力的层3的有导电能力的薄膜1铺在载体材料上，用于避免在印制导线结构7结构化之后出现各根印制导线的移动情况。
在由有导电能力的薄膜1的有导电能力的层3构造印制导线结构之后，用电子的结构元件9来装备所述有导电能力的薄膜1。所述有导电能力的薄膜1的装备比如用倒装芯片工艺（Flip-Chip-Technologie）来进行。为此将接触点11（凸块（Bumps））安置在电子的结构元件9上。将所述接触点11挤压穿过无导电能力的层，使得这些接触点11接触到由具有导电能力的层3构造的印制导线结构7。所述无导电能力的层5在此可以同时用作连接介质。为此比如作为无导电能力的层5可以使用胶粘剂覆层。
所述接触点11与印制导线8之间的连接比如通过温度及压力过程比如所谓的热封（Heatsealen）来进行。此外NCA过程（Non conductive adhesive非导电胶）也是合适的。作为替代方案，比如也可以通过钎焊过程来使电子的结构元件9接触到印制导线结构7。在此比如包含在无导电能力的层5中的酸可以用作用于钎焊过程的焊剂。在这种情况下，比如环氧树脂也可以适合用作用于无导电能力的层5的材料。
如果所述有导电能力的薄膜1仅仅由有导电能力的层3构成并且未设置无导电能力的层5，那么可以将电子的结构元件9首先以接触点11焊接到印制导线结构7上并且随后用胶粘剂给电子的结构元件9进行底部填充。作为替代方案，也可以使用所谓的ICA粘接（isotropic conductive adhesive各向异性传导粘合剂）。
比如也可选以和在图1和2中示出的相同的方式来制造第二载体带13。所述第二载体带13同样包括具有有导电能力的层3以及无导电能力的层5的有导电能力的薄膜1，印制导线结构7由所述有导电能力的层3来构造。在另一种结构中在所述无导电能力的层5上施加了至少一个设有接触点11的电子的结构元件9。将所述接触点11挤压穿过无导电能力的层5并且使所述电子的结构元件9与印制导线结构7相接触。如此制造的第一载体带12和第二载体带13后来可以彼此连接为层复合结构。在此通常所述第一载体带12和第二载体带13的印制导线的装备及结构彼此有别。因此，比如也可以这样安排，即所述两个载体带12、13仅仅其中之一装备着至少一个电子的结构元件9并且另一个载体带13、12则未装备电子的结构元件9。
所述电子的结构元件9的额外的稳定比如可以通过以下方式来实现，即这些电子的结构元件9如在图4中示出的一样被造型材料15所包围。但是只有在电子的结构元件9非常敏感时或者也只有在要弯曲所述载体带而在此不弯曲电子的结构元件时才需要用造型材料15将电子的结构元件9包围。在这种情况下，所述造型材料15用作额外的机械的稳定结构。
在图5中示出了与第一载体带12相连接的第二载体带13。在此所述第一载体带12与第二载体带13彼此如此相连接，使得所述两个载体带12、13的有导电能力的层3相应地处于外侧面上。所述第一载体带12和第二载体带13的无导电能力的层5形成电介质，通过所述电介质来避免所述构成印制导线结构7的有导电能力的层3在不受欢迎的位置上彼此相接触。为了获得均匀的层厚度，可以作为已经涂覆到有导电能力的层3上的无导电能力的层5的补充来加入额外的也将电子的结构元件9包围的电介质。通过普通的为本领域的技术人员所熟知的层压法来连接所述载体带12、13。
如果要将两个有导电能力的但相应地不具有有导电能力的层5的薄膜1彼此连接起来，那么在将第二载体带13层压到第一载体带12上之前在所述两个载体带12、13的至少其中之一上施加电介质。在这种情况下，比如塑料薄膜适合用作电介质。在这种情况下所述两个载体带12、13与处于其之间的塑料薄膜层压在一起。
作为将第二载体带13层压到第一载体带12上的方法的替代方案，也可以比如将电介质层压到第一载体带12上并且仅仅设置一层有传导能力的层。此外也可以在所述有导电能力的层3的外侧面上设置电介质。并且层压另一层有导电能力的层。在此比如也可以在所述有导电能力的层3的上侧面和下侧面上分别布置至少一个电子元件9。在这种情况下，此外优选的是，所述有导电能力的层3在构造为印制导线结构7之后也在第二面上设有无导电能力的层。
在将第二载体带13层压到第一载体带12上之后，所述由有导电能力的层3构造的印制导线结构7与金属化通孔17彼此相连接。所述金属化通孔17比如可以通过将孔加入到线路载体中并且随后使孔金属化这种方式来产生。作为替代方案，例如也可以比如通过芯棒将所述两个载体带12、13之一的有导电能力的层3挤压穿过由无导电能力的层5构成的电介质，直至所述有导电能力的层3与有导电能力的第二层3相接触。
在将第一载体带12与第二载体带13连接起来之后，优选在外侧面上施加绝缘层19。通过所述绝缘层19来避免有导电能力的部件向外裸露。作为绝缘层19，比如可以将塑料薄膜施加到由第一载体带12和第二载体带13构成的层复合结构上。作为替代方案也可以通过任意其它的方法将塑料层施加到层复合结构上。
如果仅仅包括一层有导电能力的层3，那么在向外指向的有导电能力的层3上施加绝缘层19就已足够。
所述施加在层复合结构的外侧面上的绝缘层19可选构造用于比如能够安置插塞连接器或者电缆。由此可以接触到电子组件。
此外，在施加绝缘层19之后可以施加其它的分别包括与电子的结构元件9相接触的有导电能力的层3的载体带。此外也可以将多个在图7中示出的电子组件比如通过层压彼此连接起来。
在制造层复合结构之后，可以将其冲压成任意的形状。作为替代方案，比如可以制造柔性的薄膜状的线路。这在图8中示出。在此在有导电能力的构造为印制导线结构7的薄膜上施加了电子的结构元件9，所述电子的结构元件9被造型材料15所包围，用于防止其受到损坏。随后将电介质21施加到所述层上，用于获得均匀的层厚度并且获得电子的结构元件9的进一步的封装效果。作为用于电介质21的材料，在此选择一种柔性的并且能够允许层复合结构变形的材料。这样的柔性的薄膜状的线路比如可以用在服饰中。这样的集成在服饰中的电子装置比如适合用在滑雪装备或者登山装备中，用于比如找到这样的服饰的可能被雪崩掩没的配戴者。作为替代方案，所述电子装置比如可以用作防盗装置。比如也可以在相应的线路上保存产品信息。
如果不将所述线路用作柔性的薄膜状的线路，那么比如也可以将所述层复合结构变形为成形件。这比如通过如在图7中示出的一样的层复合结构的冲压来进行。由此比如可以制造具有集成的电子装置的外壳。

Claims (13)

1.用于制造电子组件的方法，所述电子组件包括至少一个电子的结构元件（9）以及印制导线结构（7），所述至少一个电子的结构元件（9）与所述印制导线结构（7）相接触，所述方法包括以下步骤：
（a）使有传导能力的薄膜（1）的有导电能力的层（3）结构化以用于构成所述印制导线结构（7），
（b）用所述至少一个电子的结构元件（9）来装备所述印制导线结构（7），
（c）在一面上将另外的薄膜层压到所述用至少一个电子的结构元件（9）装备的有传导能力的薄膜（1）上，在这一面上所述有传导能力的薄膜（1）用所述至少一个电子的结构元件（9）来装备。
2.按权利要求1所述的方法，其特征在于，所述另外的薄膜同样是有传导能力的薄膜（1），该薄膜（1）用至少一个电子的构件（9）来装备。
3.按权利要求1或2所述的方法，其特征在于，在这两个有传导能力的薄膜（1）之间加入了电介质。
4.按权利要求3所述的方法，其特征在于，在用所述至少一个电子的结构元件（9）装备之前在所述有传导能力的薄膜（1）上施加由电介质构成的覆层，其中所述由电介质构成的覆层可以在使所述有传导能力的薄膜（1）的有传导能力的层（3）结构化以构成印制导线结构（7）之前或之后来施加。
5.按权利要求3或4所述的方法，其特征在于，所述电介质在对所述有传导能力的薄膜（1）进行装备之前在一面上施加到所述有传导能力的薄膜（1）上，所述至少一个电子的构件（9）定位在这一面上。
6.按权利要求3到5中任一项所述的方法，其特征在于，所述电介质是塑料层。
7.按权利要求2到6中任一项所述的方法，其特征在于，为了连接由所述有传导能力的薄膜（1）的有传导能力的层（3）构造的印制导线结构（7）而加入了金属化通孔（17）。
8.按权利要求1到7中任一项所述的方法，其特征在于，在所述电子组件的至少一个向外指向的面上施加绝缘层（19）。
9.按权利要求1到8中任一项所述的方法，其特征在于，至少两个电子组件彼此连接成一个层复合结构。
10.按权利要求1到9中任一项所述的方法，其特征在于，所述有导电能力的薄膜（1）在其上侧面上并且在其下侧面上分别用至少一个电子的结构元件（9）来装备。
11.按权利要求10所述的方法，其特征在于，多个在两侧分别用至少一个电子的结构元件（9）来装备的有传导能力的薄膜（1）彼此连接成一个层复合结构，其中相应地在两个有传导能力的薄膜（1）之间加入电介质。
12.按权利要求1到11中任一项所述的方法，其特征在于，至少一个电子的结构元件（9）被造型材料（15）所包围，所述有传导能力的薄膜（1）用所述至少一个电子的结构元件（9）来装备。
13.按权利要求1到12中任一项所述的方法，其特征在于，所述电子组件在终结的步骤中变形为成形件。
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