CN101919159B - 微机械谐振器 - Google Patents
微机械谐振器 Download PDFInfo
- Publication number
- CN101919159B CN101919159B CN200980102639.8A CN200980102639A CN101919159B CN 101919159 B CN101919159 B CN 101919159B CN 200980102639 A CN200980102639 A CN 200980102639A CN 101919159 B CN101919159 B CN 101919159B
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- micromechanical resonator
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- 230000008859 change Effects 0.000 claims abstract description 58
- 230000035945 sensitivity Effects 0.000 claims abstract description 12
- 230000000694 effects Effects 0.000 claims description 16
- 230000005284 excitation Effects 0.000 claims description 6
- 230000003068 static effect Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000013459 approach Methods 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 230000008520 organization Effects 0.000 description 3
- 238000009966 trimming Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2447—Beam resonators
- H03H9/2463—Clamped-clamped beam resonators
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
- H02N1/002—Electrostatic motors
- H02N1/006—Electrostatic motors of the gap-closing type
- H02N1/008—Laterally driven motors, e.g. of the comb-drive type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
- H03H3/0076—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks for obtaining desired frequency or temperature coefficients
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02259—Driving or detection means
- H03H9/02275—Comb electrodes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02338—Suspension means
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2468—Tuning fork resonators
- H03H9/2478—Single-Ended Tuning Fork resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2468—Tuning fork resonators
- H03H9/2478—Single-Ended Tuning Fork resonators
- H03H9/2484—Single-Ended Tuning Fork resonators with two fork tines, e.g. Y-beam cantilever
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02283—Vibrating means
- H03H2009/02291—Beams
- H03H2009/02299—Comb-like, i.e. the beam comprising a plurality of fingers or protrusions along its length
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
参数 | 尺寸(μm) |
弹簧元件长度 | 265 |
弹簧元件宽度 | 12.6 |
电极指长度 | 200 |
电极指宽度 | 3 |
电极指数量 | 14 |
电极间隙 | 3 |
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US2341408P | 2008-01-24 | 2008-01-24 | |
US61/023,414 | 2008-01-24 | ||
PCT/FI2009/000020 WO2009092846A1 (en) | 2008-01-24 | 2009-01-23 | A micromechanical resonator |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101919159A CN101919159A (zh) | 2010-12-15 |
CN101919159B true CN101919159B (zh) | 2014-01-08 |
Family
ID=40898492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200980102639.8A Active CN101919159B (zh) | 2008-01-24 | 2009-01-23 | 微机械谐振器 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8102224B2 (zh) |
EP (1) | EP2245738B1 (zh) |
JP (1) | JP5662160B2 (zh) |
KR (1) | KR101694133B1 (zh) |
CN (1) | CN101919159B (zh) |
WO (1) | WO2009092846A1 (zh) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7859365B2 (en) * | 2006-12-13 | 2010-12-28 | Georgia Tech Research Corporation | Low frequency process-variation-insensitive temperature-stable micromechanical resonators |
JP4538503B2 (ja) * | 2008-01-18 | 2010-09-08 | Okiセミコンダクタ株式会社 | 共振器 |
WO2009092846A1 (en) * | 2008-01-24 | 2009-07-30 | Vti Technologies, Oy | A micromechanical resonator |
US8040207B2 (en) * | 2009-01-15 | 2011-10-18 | Infineon Technologies Ag | MEMS resonator devices with a plurality of mass elements formed thereon |
FI124103B (fi) * | 2010-02-22 | 2014-03-14 | Murata Electronics Oy | Parannettu mikromekaaninen resonaattori |
JP6117467B2 (ja) * | 2011-11-04 | 2017-04-19 | セイコーエプソン株式会社 | ジャイロセンサーの製造方法 |
KR101856060B1 (ko) | 2011-12-01 | 2018-05-10 | 삼성전자주식회사 | 체적 음향 공진기 |
US8739096B2 (en) * | 2011-12-15 | 2014-05-27 | International Business Machines Corporation | Micro-electro-mechanical structure (MEMS) capacitor devices, capacitor trimming thereof and design structures |
DE102012103938A1 (de) | 2012-05-04 | 2013-11-07 | Reinhausen Plasma Gmbh | Plasmamodul für eine Plasmaerzeugungsvorrichtung und Plasmaerzeugungsvorrichtung |
JP6339669B2 (ja) | 2013-07-08 | 2018-06-06 | モーション・エンジン・インコーポレーテッド | Memsデバイスおよび製造する方法 |
US10273147B2 (en) | 2013-07-08 | 2019-04-30 | Motion Engine Inc. | MEMS components and method of wafer-level manufacturing thereof |
WO2015013828A1 (en) | 2013-08-02 | 2015-02-05 | Motion Engine Inc. | Mems motion sensor and method of manufacturing |
TWI508913B (zh) * | 2013-10-03 | 2015-11-21 | Pixart Imaging Inc | 微機電元件與微機電應力補償結構 |
JP6590812B2 (ja) | 2014-01-09 | 2019-10-16 | モーション・エンジン・インコーポレーテッド | 集積memsシステム |
TWI580632B (zh) | 2014-03-14 | 2017-05-01 | 財團法人工業技術研究院 | 具用於旋轉元件之摺疊彈簧的微機電裝置 |
US20170030788A1 (en) | 2014-04-10 | 2017-02-02 | Motion Engine Inc. | Mems pressure sensor |
US11674803B2 (en) | 2014-06-02 | 2023-06-13 | Motion Engine, Inc. | Multi-mass MEMS motion sensor |
JP6627209B2 (ja) | 2014-09-09 | 2020-01-08 | セイコーエプソン株式会社 | 振動素子、振動子、発振器、電子機器および移動体 |
US11287486B2 (en) | 2014-12-09 | 2022-03-29 | Motion Engine, Inc. | 3D MEMS magnetometer and associated methods |
WO2016112463A1 (en) | 2015-01-15 | 2016-07-21 | Motion Engine Inc. | 3d mems device with hermetic cavity |
JP7037144B2 (ja) * | 2017-08-09 | 2022-03-16 | 国立大学法人静岡大学 | Mems振動素子の製造方法およびmems振動素子 |
CN109188021B (zh) * | 2018-08-30 | 2020-06-16 | 太原理工大学 | 低频微加速度传感器的多孔弹簧悬臂敏感结构 |
KR102692565B1 (ko) | 2018-11-20 | 2024-08-07 | 삼성전자주식회사 | 공진기, 이를 포함하는 공진기 시스템 및 공진기 제조 방법 |
KR20210050323A (ko) * | 2019-10-28 | 2021-05-07 | 삼성전자주식회사 | 미소 기계식 공진기 및 이를 포함하는 공진기 시스템 |
WO2022053165A1 (de) | 2020-09-14 | 2022-03-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mems-bauelement, hearable, mems-pumpe, lautsprecher und verfahren zum ansteuern eines mems-bauelements |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5914553A (en) * | 1997-06-16 | 1999-06-22 | Cornell Research Foundation, Inc. | Multistable tunable micromechanical resonators |
CN1768475A (zh) * | 2003-04-16 | 2006-05-03 | 罗伯特·博世有限公司 | 硅微型机电系统谐振器的温度补偿 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3230359B2 (ja) * | 1993-12-16 | 2001-11-19 | 株式会社村田製作所 | 共振型振動素子 |
US6000280A (en) * | 1995-07-20 | 1999-12-14 | Cornell Research Foundation, Inc. | Drive electrodes for microfabricated torsional cantilevers |
US6628177B2 (en) * | 2000-08-24 | 2003-09-30 | The Regents Of The University Of Michigan | Micromechanical resonator device and micromechanical device utilizing same |
EP1217735B1 (en) * | 2000-12-21 | 2007-11-14 | ETA SA Manufacture Horlogère Suisse | Time base comprising an integrated micromechanical tuning fork resonator |
US6744174B2 (en) * | 2001-04-03 | 2004-06-01 | The Regents Of The University Of California | Frequency sensitivity analysis and optimum design for MEMS resonator |
US20050073078A1 (en) * | 2003-10-03 | 2005-04-07 | Markus Lutz | Frequency compensated oscillator design for process tolerances |
US7279761B2 (en) * | 2004-09-15 | 2007-10-09 | The Regents Of The University Of California | Post-release capacitance enhancement in micromachined devices and a method of performing the same |
JP2006121653A (ja) * | 2004-09-27 | 2006-05-11 | Seiko Epson Corp | Mems振動子の周波数調整方法およびmems振動子 |
US7749446B2 (en) * | 2004-10-02 | 2010-07-06 | Peterman Jr John William | Optimized gas cell |
US7511870B2 (en) * | 2004-10-18 | 2009-03-31 | Georgia Tech Research Corp. | Highly tunable low-impedance capacitive micromechanical resonators, oscillators, and processes relating thereto |
JP4645227B2 (ja) * | 2005-02-28 | 2011-03-09 | セイコーエプソン株式会社 | 振動子構造体及びその製造方法 |
US7258010B2 (en) * | 2005-03-09 | 2007-08-21 | Honeywell International Inc. | MEMS device with thinned comb fingers |
US7213458B2 (en) * | 2005-03-22 | 2007-05-08 | Honeywell International Inc. | Quadrature reduction in MEMS gyro devices using quad steering voltages |
JP4694380B2 (ja) * | 2006-02-06 | 2011-06-08 | 株式会社日立製作所 | 薄膜音叉型屈曲振動子及び電気信号処理素子 |
US7859365B2 (en) * | 2006-12-13 | 2010-12-28 | Georgia Tech Research Corporation | Low frequency process-variation-insensitive temperature-stable micromechanical resonators |
WO2009092846A1 (en) * | 2008-01-24 | 2009-07-30 | Vti Technologies, Oy | A micromechanical resonator |
-
2009
- 2009-01-23 WO PCT/FI2009/000020 patent/WO2009092846A1/en active Application Filing
- 2009-01-23 US US12/320,347 patent/US8102224B2/en active Active
- 2009-01-23 KR KR1020107018410A patent/KR101694133B1/ko active IP Right Grant
- 2009-01-23 EP EP09703126.4A patent/EP2245738B1/en active Active
- 2009-01-23 CN CN200980102639.8A patent/CN101919159B/zh active Active
- 2009-01-23 JP JP2010543534A patent/JP5662160B2/ja active Active
-
2011
- 2011-10-28 US US13/284,196 patent/US8334736B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5914553A (en) * | 1997-06-16 | 1999-06-22 | Cornell Research Foundation, Inc. | Multistable tunable micromechanical resonators |
CN1768475A (zh) * | 2003-04-16 | 2006-05-03 | 罗伯特·博世有限公司 | 硅微型机电系统谐振器的温度补偿 |
Also Published As
Publication number | Publication date |
---|---|
EP2245738B1 (en) | 2015-06-17 |
EP2245738A4 (en) | 2014-03-12 |
KR101694133B1 (ko) | 2017-01-09 |
US20090189481A1 (en) | 2009-07-30 |
CN101919159A (zh) | 2010-12-15 |
JP2011510577A (ja) | 2011-03-31 |
US8102224B2 (en) | 2012-01-24 |
WO2009092846A8 (en) | 2009-09-17 |
WO2009092846A1 (en) | 2009-07-30 |
JP5662160B2 (ja) | 2015-01-28 |
US20120091854A1 (en) | 2012-04-19 |
KR20100111724A (ko) | 2010-10-15 |
EP2245738A1 (en) | 2010-11-03 |
US8334736B2 (en) | 2012-12-18 |
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Address after: Finland Vantaa Applicant after: Vti Technologies OY Address before: Finland Vantaa Applicant before: VTI Technologies OY |
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Effective date of registration: 20210401 Address after: Kyoto Japan Patentee after: Murata Manufacturing Co.,Ltd. Address before: Wanta, Finland Patentee before: MURATA ELECTRONICS OY |
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