CN107735715A - Pattern plotter device and pattern plotter method - Google Patents
Pattern plotter device and pattern plotter method Download PDFInfo
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- CN107735715A CN107735715A CN201680035608.5A CN201680035608A CN107735715A CN 107735715 A CN107735715 A CN 107735715A CN 201680035608 A CN201680035608 A CN 201680035608A CN 107735715 A CN107735715 A CN 107735715A
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 231
- 230000003287 optical effect Effects 0.000 claims abstract description 167
- 230000008859 change Effects 0.000 claims description 41
- 238000002347 injection Methods 0.000 claims description 28
- 239000007924 injection Substances 0.000 claims description 28
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 239000003973 paint Substances 0.000 claims description 5
- 239000005022 packaging material Substances 0.000 description 134
- 210000000887 face Anatomy 0.000 description 60
- 238000005286 illumination Methods 0.000 description 60
- 238000012545 processing Methods 0.000 description 30
- 239000000203 mixture Substances 0.000 description 26
- 238000002310 reflectometry Methods 0.000 description 23
- 239000010410 layer Substances 0.000 description 17
- 101100038180 Caenorhabditis briggsae rpb-1 gene Proteins 0.000 description 13
- 230000006870 function Effects 0.000 description 13
- 238000009826 distribution Methods 0.000 description 12
- 239000010408 film Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 101100520660 Drosophila melanogaster Poc1 gene Proteins 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000010287 polarization Effects 0.000 description 8
- 230000001419 dependent effect Effects 0.000 description 7
- 239000002346 layers by function Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 230000032258 transport Effects 0.000 description 7
- 238000011144 upstream manufacturing Methods 0.000 description 7
- 230000009471 action Effects 0.000 description 6
- 230000005484 gravity Effects 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 6
- 238000011084 recovery Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000009738 saturating Methods 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- 101000622878 Geobacillus stearothermophilus 30S ribosomal protein S2 Proteins 0.000 description 5
- 230000004075 alteration Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000007935 neutral effect Effects 0.000 description 4
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 4
- 239000011112 polyethylene naphthalate Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 230000007723 transport mechanism Effects 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- -1 Polyethylene terephthalate Polymers 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 101150096886 sft-1 gene Proteins 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010408 sweeping Methods 0.000 description 2
- 230000005428 wave function Effects 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 241000743339 Agrostis Species 0.000 description 1
- NBGBEUITCPENLJ-UHFFFAOYSA-N Bunazosin hydrochloride Chemical compound Cl.C1CN(C(=O)CCC)CCCN1C1=NC(N)=C(C=C(OC)C(OC)=C2)C2=N1 NBGBEUITCPENLJ-UHFFFAOYSA-N 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- 238000006124 Pilkington process Methods 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000000637 aluminium metallisation Methods 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000007648 laser printing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000005055 memory storage Effects 0.000 description 1
- 238000001883 metal evaporation Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 108091008695 photoreceptors Proteins 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- GOLXNESZZPUPJE-UHFFFAOYSA-N spiromesifen Chemical compound CC1=CC(C)=CC(C)=C1C(C(O1)=O)=C(OC(=O)CC(C)(C)C)C11CCCC1 GOLXNESZZPUPJE-UHFFFAOYSA-N 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/12—Scanning systems using multifaceted mirrors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/04—Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa
- H04N1/113—Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa using oscillating or rotating mirrors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Laser Beam Printer (AREA)
- Mechanical Optical Scanning Systems (AREA)
- Facsimile Scanning Arrangements (AREA)
Abstract
The pattern plotter device and pattern plotter method of the present invention, stably maintain to describe the configuration precision or optical property of the scan line needed for super detailed pattern.Pattern plotter device (EX), the luminous point (SP) of institute's optically focused on substrate (P) is set to carry out main scanning along line (SL) is described, and substrate (P) is set to carry out subscan, thereby in describing predetermined pattern on substrate (P)；The pattern plotter device (EX) makes the 1st light beam (LBa) optically focused by polygonal mirror (PM) reflection and is projected to as luminous point (SPa) on the 1st description line (SLa), and makes the 2nd light beam (LBb) optically focused by polygonal mirror (PM) reflection and be projected to as luminous point (SPb) on the 2nd description line (SLb).Above-mentioned two are described line (SLa, SLb) in the same position being located on substrate (P) on sub-scanning direction, and in staggering on main scanning direction.
Description
Technical field
The present invention is filled on a kind of luminous point for scanning the light beam exposed on irradiated body with the pattern plotter of depicting pattern
Put and pattern plotter method.
Background technology
As disclosed in Japanese Unexamined Patent Publication 2004-117865 publications, it is known to following technology：In the scanning by laser beam
And in the laser scanning device (color laser printing machine) of depiction picture on photoreceptor, swash using a multiaspect scarnning mirror is a plurality of
The each of light light beam, along multi-strip scanning line depiction picture.
In Japanese Unexamined Patent Publication 2004-117865 publications, announcement has following series type laser scanning device, the series type laser
Scanning means is separatedly configured in parallel scan line on sub-scanning direction in the moving direction of irradiated body, and the scan line is by utilizing
The each of the different reflectings surface of one polygonal mirror and be inclined to scanning multi-stripe laser light beam generation.For Japanese Unexamined Patent Publication 2004-
For laser scanning device disclosed in No. 117865 publications, the image that can be depicted on irradiated body (photosensitive drums etc.) is swept
Line direction (main scanning direction) full-size is retouched, is determined by the length of a scan line.Therefore, in order to increase what can be depicted
The main scanning direction size of image increases the scanning optics after polygonal mirror, it is necessary in a manner of making scan line become longer
(lens or face mirror etc.).On the other hand, the electricity that minimum feature is several μm~20 μm or so is described for the scanning using luminous point
The fine pattern of sub-circuit and make its expose exposure device for, it is necessary to which the size (diameter) for making luminous point is minimum feature
Several points one (1/2~1/4) left and right, and need and high accuracy synchronous with the launching position of the luminous point in scan line and high speed
Ground controls the intensity modulation of the luminous point corresponding with the data of depicting pattern.If however, make by inclined by the light beam of polygonal mirror
To scanning, a scan line generating is elongated, then with the maximization of the scanning optics after polygonal mirror etc., it is difficult to steady
Surely maintain to describe the configuration precision or optical property of scan line required during fine pattern.
The content of the invention
The 1st aspect of the present invention is a kind of pattern plotter device, the light beam from light supply apparatus is concentrated in point-like
On irradiated body, the luminous point after optically focused is carried out main scanning along set scan line, and above-mentioned irradiated body is carried out secondary
Scanning, thereby describes predetermined pattern, it possesses on above-mentioned irradiated body：Polygonal rotating mirror, for above-mentioned main scanning around rotation
Rotating shaft rotates；1st guide-lighting optical system, the 1st light from above-mentioned light supply apparatus is projected from the 1st direction towards above-mentioned polygonal rotating mirror
Beam；2nd guide-lighting optical system, above-mentioned light is come from from 2nd direction different from above-mentioned 1st direction towards the projection of above-mentioned polygonal rotating mirror
2nd light beam of source device；1st projection optics system, make above-mentioned 1st beam condenser and the conduct reflected by above-mentioned polygonal rotating mirror
1st luminous point and be projected in the 1st scan line；And the 2nd projection optics system, make above-mentioned reflected by above-mentioned polygonal rotating mirror
2 beam condensers are simultaneously projected in the 2nd scan line as the 2nd luminous point；So that above-mentioned 1st scan line and above-mentioned 2nd scan line in
It is located at the same position on above-mentioned sub-scanning direction and the mode to stagger on above-mentioned main scanning direction on above-mentioned irradiated body, matches somebody with somebody
Put above-mentioned 1st projection optics system and above-mentioned 2nd projection optics system.
The 2nd aspect of the present invention is a kind of pattern plotter device, while being shone the sheet material substrate of the strip of pliability
Beam carries out subscan, while making to be shone along in above-mentioned based on the luminous point for describing data and intensity modulation along long side direction
The scan line of the orthogonal width extension of the long side direction of beam carries out main scanning, thereby describe on above-mentioned irradiated body with
The corresponding pattern of above-mentioned description data, it possesses：Polygonal rotating mirror, rotated for above-mentioned main scanning around rotary shaft；1st leads
Light optical system, the 1st light beam is projected from the 1st direction towards above-mentioned polygonal rotating mirror；2nd guide-lighting optical system, from above-mentioned 1st side
The 2nd light beam is projected to the 2nd different directions towards above-mentioned polygonal rotating mirror；1st projection optics system, make by above-mentioned polygonal rotating mirror
Above-mentioned 1st beam condenser of reflection is simultaneously projected in the 1st scan line as the 1st luminous point；And the 2nd projection optics system, make
Above-mentioned 2nd beam condenser that is reflected by above-mentioned polygonal rotating mirror is simultaneously projected in the 2nd scan line as the 2nd luminous point；With will be upper
Each sweep length for stating the 1st scan line and above-mentioned 2nd scan line is set to identical, and in above-mentioned main scanning direction with above-mentioned scanning
The mode of be spaced apart above-mentioned 1st scan line of setting and above-mentioned 2nd scan line below length, configures above-mentioned 1st projection optics
System and above-mentioned 2nd projection optics system.
The 3rd aspect of the present invention is a kind of pattern plotter method, the light beam from light supply apparatus is concentrated in point-like
On irradiated body, the luminous point after optically focused is carried out main scanning along set scan line, and above-mentioned irradiated body is carried out secondary
Scanning, thereby describes predetermined pattern, it is comprised the following steps on above-mentioned irradiated body：By the 1st from above-mentioned light supply apparatus
Light beam projects from the 1st direction towards polygonal rotating mirror；By the 2nd light beam from above-mentioned light supply apparatus from different from above-mentioned 1st direction
The 2nd direction projected towards above-mentioned polygonal rotating mirror；By the rotation of above-mentioned polygonal rotating mirror, to being incident upon above-mentioned polygonal rotating mirror
Different reflectings surface and above-mentioned 1st light beam reflected and above-mentioned 2nd light beam carry out deviation scanning；Make anti-by above-mentioned polygonal rotating mirror
Above-mentioned 1st beam condenser penetrated simultaneously is projected in the 1st scan line as the 1st luminous point；And make anti-by above-mentioned polygonal rotating mirror
Above-mentioned 2nd beam condenser penetrated simultaneously is projected in the 2nd scan line as the 2nd luminous point；Above-mentioned 1st scan line is swept with the above-mentioned 2nd
Line is retouched in the same position being located on above-mentioned irradiated body on above-mentioned sub-scanning direction, and is staggered on above-mentioned main scanning direction.
The 4th aspect of the present invention is a kind of pattern plotter method, while being shone the sheet material substrate of the strip of pliability
Beam carries out subscan, while making to be shone along in above-mentioned based on the luminous point for describing data and intensity modulation along long side direction
The scan line of the orthogonal width extension of the long side direction of beam carries out main scanning, thereby describe on above-mentioned irradiated body with
The corresponding pattern of above-mentioned description data, it is comprised the following steps：1st light beam is projected from the 1st direction towards polygonal rotating mirror；Will
2nd light beam projects from the 2nd direction different from above-mentioned 1st direction towards above-mentioned polygonal rotating mirror；Pass through above-mentioned polygonal rotating mirror
Rotation, to be incident upon the different reflectings surface of above-mentioned polygonal rotating mirror and above-mentioned 1st light beam reflected and above-mentioned 2nd light beam carry out it is inclined
To scanning；Make above-mentioned 1st beam condenser that is reflected by above-mentioned polygonal rotating mirror and be projected to the 1st scan line as the 1st luminous point
On；And make above-mentioned 2nd beam condenser that is reflected by above-mentioned polygonal rotating mirror and be projected to the 2nd scan line as the 2nd luminous point
On；Each sweep length of above-mentioned 1st scan line and above-mentioned 2nd scan line is set to identical, and in above-mentioned main scanning direction with
Be spaced apart above-mentioned 1st scan line of setting and above-mentioned 2nd scan line below above-mentioned sweep length.
The 5th aspect of the present invention is a kind of pattern plotter device, while transporting irradiated body, one side along sub-scanning direction
The light beam from light supply apparatus is concentrated in point-like on above-mentioned irradiated body, the luminous point after optically focused is swept along with above-mentioned pair
Retouch the orthogonal scan line in direction and carry out main scanning, thereby describe predetermined pattern on above-mentioned irradiated body, it possesses：Rotating multisurface
Mirror, rotated around set rotary shaft；1st guide-lighting optical system, above-mentioned light is come from from the 1st direction towards the projection of above-mentioned polygonal rotating mirror
1st light beam of source device；2nd guide-lighting optical system, from 2nd direction different from above-mentioned 1st direction towards above-mentioned polygonal rotating mirror
Project the 2nd light beam from above-mentioned light supply apparatus；1st projection optics system, make the above-mentioned 1st reflected by above-mentioned polygonal rotating mirror
Beam condenser is simultaneously projected in the 1st scan line as the 1st luminous point；And the 2nd projection optics system, make by above-mentioned rotating multisurface
Above-mentioned 2nd beam condenser of mirror reflection is simultaneously projected in the 2nd scan line as the 2nd luminous point；And possess delineation unit, the description
Unit is with parallel along at least one direction in above-mentioned main scanning direction and above-mentioned sub-scanning direction on above-mentioned irradiated body
Ground is in staggered configuration the mode of above-mentioned 1st scan line and above-mentioned 2nd scan line, integratedly keeps above-mentioned polygonal rotating mirror, the above-mentioned 1st
Guide-lighting optical system, above-mentioned 2nd guide-lighting optical system, above-mentioned 1st projection optics system and above-mentioned 2nd projection optics system and can
Turn；The rotation center axle of above-mentioned delineation unit, it is set to relative to above-mentioned irradiated body vertically through above-mentioned 1st scan line
Midpoint and above-mentioned 2nd scan line midpoint between.
The 6th aspect of the present invention is a kind of pattern plotter method, while transporting irradiated body, one side along sub-scanning direction
Make the light beam from light supply apparatus in point-like be concentrated on above-mentioned irradiated body, make the luminous point after optically focused along in above-mentioned pair
The scan line of the orthogonal direction extension in scanning direction carries out main scanning, thereby describes predetermined pattern on above-mentioned irradiated body, its
Comprise the following steps：The 1st light beam from above-mentioned light supply apparatus is projected from the 1st direction towards polygonal rotating mirror；It will come from above-mentioned
2nd light beam of light supply apparatus projects from the 2nd direction different from above-mentioned 1st direction towards above-mentioned polygonal rotating mirror；Pass through above-mentioned rotation
Turn the rotation of polygonal mirror, to be incident upon the different reflectings surface of above-mentioned polygonal rotating mirror and above-mentioned 1st light beam reflected and the above-mentioned 2nd
Light beam carries out deviation scanning；Make above-mentioned 1st beam condenser that is reflected by above-mentioned polygonal rotating mirror and be projected to as the 1st luminous point
In 1st scan line；Make above-mentioned 2nd beam condenser that is reflected by above-mentioned polygonal rotating mirror and be projected to the 2nd as the 2nd luminous point and sweep
Retouch on line；And centered on rotation center axle, make above-mentioned 1st scan line and above-mentioned 2nd scan line turn, above-mentioned rotation center
Axle is vertical relative to above-mentioned irradiated body, and be set in the midpoint of above-mentioned 1st scan line and above-mentioned 2nd scan line midpoint it
Between.
The 7th aspect of the present invention is a kind of pattern plotter device, makes the light beam from light supply apparatus enterprising in irradiated body
Row main scanning, and above-mentioned irradiated body is relatively carried out pair along the direction intersected with above-mentioned main scanning with above-mentioned light beam and sweep
Retouch, thereby the depicting pattern on above-mentioned irradiated body, it possesses：Light is inclined to component, changes reflecting surface for above-mentioned main scanning
Angle；1st projection optics system, projection the 1st light beam as on above-mentioned irradiated body along main scanning direction scanning light beam,
Above-mentioned 1st light beam is after being projected to above-mentioned light deviation component from the 1st direction and being inclined to the reflective surface of component by above-mentioned light
Light beam；And the 2nd projection optics system, the 2nd light beam of projection as on above-mentioned irradiated body along the light of main scanning direction scanning
Beam, above-mentioned 2nd light beam are to be projected to above-mentioned light from 2nd direction different from the 1st direction to be inclined to component and by above-mentioned light deviation structure
Light beam after the reflective surface of part；So that by the main scanning of above-mentioned 1st light beam and formed the 1st scan line, with by upper
The mode that the 2nd scan line stated the main scanning of the 2nd light beam and formed staggers on above-mentioned main scanning direction, configuration the above-mentioned 1st are thrown
Penetrate optical system and above-mentioned 2nd projection optics system.
Brief description of the drawings
Fig. 1 is the device manufacturing system for including the exposure device for implementing exposure-processed to substrate for showing the 1st embodiment
Schematic configuration figure.
Fig. 2 is to show the configuration relation of multiple delineation units shown in Fig. 1 and be arranged at each on the plane of illumination of substrate
The figure of the configuration relation of the description line of delineation unit.
Fig. 3 is to show the description for making each delineation unit when the end of the adjacent description line of main scanning direction is consistent with each other
The figure of the configuration relation of line.
Fig. 4 is to show each description list made in end each overlapping regular length each other of the adjacent description line in scanning direction
The figure of the configuration relation of the description line of member.
Fig. 5 is the pie graph of the delineation unit shown in Fig. 1 from-Yt (- Y) direction side.
Fig. 6 is the pie graph of the delineation unit shown in Fig. 5 from the side of+Zt directions.
Fig. 7 is the light beam for being incident upon speculum by the optical element shown in Fig. 5 and collimation lens from the side of+Zt directions
Light path figure.
Fig. 8 is the figure of the light path of the light beam for the speculum for being incident upon delineation unit from speculum from the side of+Xt directions.
Fig. 9 is saturating in the speculum as reflecting member in the delineation unit observed in XtZt faces shown in Fig. 5 and optically focused
The figure of the configuration relation of mirror.
Figure 10 be in XtYt faces observe Fig. 9 shown in as the speculum of reflecting member and the configuration relation of collector lens
Figure.
Figure 11 A are to work as to make the delineation unit shown in Fig. 5 overall around the set angle of rotation center axle turn from the side of+Zt directions
When spending, the figure for the appearance that the reflection direction of the light beam of the speculum as reflecting member changes, Figure 11 B are abreast incident upon
It is as reflecting member when making the delineation unit entirety turn first retainer shown in Fig. 5 from the direction of advance side of light beam
The figure of the change in location of light beam in speculum.
Figure 12 is the optical beam scanning system using polygonal mirror in the variation 1 of the 1st embodiment from the side of+Zt directions
When figure.
Figure when Figure 13 is Figure 12 optical beam scanning system from the side of+Xt directions.
Figure 14 is to be incident upon polygonal mirror and the light beam reflected in the variation 2 of the 1st embodiment from the side of+Zt directions
Light path when figure.
Figure when Figure 15 is Figure 14 optical beam scanning system from the side of+Xt directions.
Figure 16 A are that the light beam using polygonal mirror from the side of+Zt directions in the variation 4 of the 1st embodiment scans system
Figure during system, figure when Figure 16 B are Figure 16 A optical beam scanning systems from the side of-Xt directions.
Figure 17 is the figure of the composition for the part for showing the delineation unit in the 2nd embodiment.
Figure 18 is the delineation unit Ub of the 3rd embodiment from-Yt (- Y) direction side pie graph.
Figure 19 is from polygonal mirror towards the composition of+Zt sides in the delineation unit from the side of+Xt directions shown in Figure 18
Figure.
Figure 20 is the structure from polygonal mirror towards-Zt directions side in the delineation unit from the side of+Zt directions shown in Figure 18
Into figure.
Figure 21 is display will be formed as electronic component forming region along Y (Yt) directions exposure area on substrate
One point is six, describes lines to one of the situation of each depicting pattern of multiple cut zone of banding by 6.
Figure 22 is the figure of the example of the arrangement angles for the speculum after f θ lens for showing the 3rd embodiment.
Figure 23 is to show 4 distributed to two light beams for being provided the light supply apparatus 14 shown in Fig. 1 into Fig. 2
The figure of the composition of one of the light beam distribution system of each of delineation unit.
Figure 24 is the deviation shape of the light beam between the polygonal mirror of the delineation unit to the 4th embodiment and follow-up speculum
The figure that state illustrates.
Figure 25 is the spy of one of the incident angle-dependent for showing the reflectivity in polygonal mirror or speculum based on Figure 24
The curve map of property.
Figure 26 be show for the incident angle-dependent because of the reflectivity of speculum and caused by beam intensity change into
The figure of the composition of the control system of the acousto-optic varying element (AOM) of row adjustment.
Figure 27 is the waveform for the signal for showing each several part in Figure 26 control system or the timing diagram of one of sequential.
Embodiment
Hereinafter, disclose preferable embodiment and with reference to alterations, the pattern plotter of the aspect of the present invention is filled in detail
Put and pattern plotter method illustrates.In addition, the aspect of the present invention is not limited to such embodiment, also includes and be added with
Numerous variations or the form of improvement.That is, the composition that can be easy to imagine that comprising dealer in described inscape below will
Plain, substantially the same inscape, below described inscape can be combined as.Also, can be in not departing from this hair
In the range of bright objective, various omissions are carried out to inscape, replaces or changes.
[the 1st embodiment]
Fig. 1 is the exposure device EX included to substrate (irradiated body) P implementation exposure-processeds for showing the 1st embodiment
The figure of the schematic configuration of device manufacturing system 10.In addition, in following explanation, XYZ using gravity direction as Z-direction is being set just
Coordinate system is handed over, as long as no special instructions, then X-direction, Y-direction and Z-direction are illustrated according to the arrow of diagram.
Device manufacturing system 10 is the manufacture system for being built with manufacturing line, and the manufacturing line is for example manufactured as electronic component
Flexible display (flexible display), membranaceous contact panel, liquid crystal display panel membranaceous colored filter or
Pliability distribution piece of welding electronic part etc..Hereinafter, electronic component is illustrated premised on flexible display.Make
For flexible display, such as organic EL (Electroluminescence, electroluminescent) display, liquid crystal display be present
Deng.Device manufacturing system 10 has the construction of so-called volume to volume (Roll To Roll) mode, i.e. from by the sheet of pliability
(membranaceous) substrate (sheet material substrate) P is wound as the supply roll (not shown) that web-like forms and sends out substrate P, continuously to being sent out
After substrate P implements various processing, the substrate P after various processing is batched using recovery (not shown).Substrate P has substrate P
Moving direction turn into long side direction (strip), and width turns into the shape of the banding of short side direction (billet).From above-mentioned
The substrate P that supply roll conveying comes, sequentially by processing unit PR1, exposure device (pattern plotter device, light-beam scanner) EX and
Processing unit PR2 etc. implements various processing, and is batched by above-mentioned recovery.
In addition, X-direction be in horizontal plane from processing unit PR1 via exposure device EX towards processing unit PR2 side
To (conveyance direction).Y-direction is in direction orthogonal with X-direction in horizontal plane, and is the width of substrate P.Z-direction be with
X-direction and the orthogonal direction of Y-direction (upper direction), and it is parallel with Action of Gravity Field direction.
Paper tinsel (foil) that substrate P is formed such as usable resin film or the metal or alloy by stainless steel etc..As tree
The material of adipose membrane, it also can be used and for example include polyvinyl resin, acrylic resin, polyester resin, ethylene-vinyl alcohol copolymer
Resin, Corvic, celluosic resin, polyamide, polyimide resin, polycarbonate resin, polystyrene tree
At least one of fat and vinyl acetate resin above person.Also, thickness or the rigidity (Young's modulus) of substrate P are as long as in such as
Lower scope, the scope refer to when by exposure device EX transport path, and substrate P will not be made to produce as caused by press-bending
The scope of folding line or irreversible gauffer.As the mother metal of substrate P, thickness is 25 μm~200 μm or so of PET
(Polyethylene terephthalate, PET) or PEN (Polyethylene
Naphthalate, PEN) etc. film be preferable sheet material substrate typical case.
Substrate P have sometimes in each processing implemented by processing unit PR1, exposure device EX and processing unit PR2 by
The situation of heat, it is therefore advantageous to select the substrate P of the obvious little material of thermal coefficient of expansion.For example, can be by being filled out inorganic
Material is mixed in resin film and suppresses thermal coefficient of expansion.Inorganic filler for example also can be titanium oxide, zinc oxide, aluminum oxide or silica
Deng.Also, substrate P can be the individual layers for the very thin glass that the thickness produced using float method etc. is 100 μm or so, also can be will
Above-mentioned resin film, paper tinsel etc. fit in the laminate that the very thin glass forms.
Moreover, the pliability (flexibility) of substrate P is even if refer to apply substrate P deadweight (weight of itself) journey
The power of degree, also it will not be made to fracture or be broken and the property of the substrate P can be bent.Also, the property bent by the power for degree of conducting oneself with dignity
Matter is also contained in pliability.Also, the degree of pliability can be according to the layer formed in the material of substrate P, size, thickness, substrate P
The environment such as construction, temperature, humidity and change.In a word, as long as substrate P to be correctly wound in the element of this 1st embodiment
When set various conveyances are with the component of the conveyance direction conversion such as roller, rotating cylinder in transport path in manufacture system 10,
Substrate P can swimmingly be transported to produce folding line without being bent or cause damaged (split or scratch), then be to be in
The scope of pliability.
Step process before processing unit PR1 is carried out to the substrate P that processing is exposed by exposure device EX.Processing unit
The substrate P of step process before PR1 has been carried out toward exposure device EX conveyings.By the preceding step process, toward exposure device EX conveyings
Substrate P be substrate (sensitive substrate) P of surface formed with photonasty functional layer (photoinduction layer, photosensitive layer).
The photonasty functional layer, is coated in substrate P as solution, and turns into layer (film) by being dried.Allusion quotation
The photonasty functional layer of type is photoresist, but as the material without development treatment, be there are the portion after being irradiated by ultraviolet
The photonasty silane coupling agent (SAM) of the Lyophilic/lyophobic modification divided makes the part after being irradiated with manifest plating
Apply also photonasty reducing agent of former base etc..When situation of the photonasty silane coupling agent as photonasty functional layer is used, substrate P
On by the pattern part after ultraviolet exposure from lyophobicity modification be lyophily.Therefore, selection (contains containing electric conductivity ink
The ink of silver or the conductive nanometer particle such as copper) or semi-conducting material liquid etc. and be coated on the portion for turning into lyophily
On point, the electrode for forming thin film transistor (TFT) (TFT) etc., semiconductor, insulation or the distribution of connection can be thereby formed into
Patterned layer.When situation of the photonasty reducing agent as photonasty functional layer is used, after in substrate P with ultraviolet exposure
Pattern part manifests plating also former base.Therefore, after exposure, immediately by substrate P in the plating solution comprising palladium ion etc.
The set time is impregnated, thereby forms the patterned layer of (precipitation) palladium.Such a plating processing is additional (additive) technique, in addition,
When situation using premised on as the etching processing for eliminating (subtractive) technique, toward the substrate P of exposure device EX conveying
Also it can be such as infrabasal plate, mother metal is set to PET or PEN, in its surface entirely or selectively AM aluminum metallization (A1) or copper (Cu) etc.
Metallic diaphragm, further in upper lamination (stacking) photoresist layer of the metallic diaphragm and winner.
In this 1st embodiment, exposure device EX is the straight exposure device for retouching mode without using light shield, i.e., so-called
The exposure device of raster scanning (raster scan) mode.Exposure device EX from processing unit PR1 to supplying the substrate P come
Plane of illumination (photosurface) irradiates the light pattern corresponding with the predetermined pattern such as the circuit of display or distribution.Though in general below
It is described in detail, but exposure device EX toward +X direction (sub-scanning direction) while transport substrate P, while in (base in substrate P
On plate P plane of illumination) (main scanning) exposure light beam LB luminous point is one-dimensionally scanned along set scanning direction (Y-direction)
SP, and modulation (ON/OFF) is carried out to luminous point SP intensity according to pattern data (description data) at high speed.Thereby, in
The corresponding light pattern of the predetermined patterns such as the plane of illumination exposure plotting of substrate P and the circuit of display or distribution.It is,
Using subscan and the luminous point SP of substrate P main scanning, in relatively two-dimensional scan luminous point SP on the plane of illumination of substrate P, from
And in substrate P exposure plotting predetermined pattern.Also, exposure device EX substrate P is repeated the pattern exposure of electronic component, and
Substrate P is transported along conveyance direction (+X direction), therefore, is set with separating predetermined distance along the strip direction of substrate P more
The individual exposure area W (reference picture 2) by exposure device EX exposing patterns.Due to forming electronic component in exposure area W, because
This exposure area W is also electronic component forming region.In addition, electronic component is overlapping by multiple patterned layers (forming figuratum layer)
And form, therefore the pattern of corresponding each layer is exposed by exposure device EX.
Processing unit PR2 to by exposure device EX be exposed processing substrate P carry out after step process (such as plating
Processing or development, etching processing etc.).By the rear step process, in the patterned layer that element is formed in substrate P.
As described above, electronic component is made up of overlapping multiple patterned layers, therefore via device manufacturing system 10 extremely
Few each processing, generates a patterned layer.Therefore, in order to generate electronic component, it is necessary at least twice by element as shown in Figure 1
Each processing of manufacture system 10.Therefore, by the way that the recovery for batching substrate P is rolled up as supply roll to be installed on other elements system
System 10 is made, being capable of lamination patterned layer.Repeatedly acted as described above, to form electronic component.Therefore, after processing
Substrate P is in multiple electronic components and separates predetermined distance and the state being connected along the strip direction of substrate P.It is, substrate P
As the substrate of more chamferings.
The recovery that the substrate P recovery formed in the state of being connected in electronic component forms is rolled up, and is also mountable to not shown
Cutter device.The cutter device of recovery volume is installed, each electronic component is split to the substrate P after processing to (cutting
(singulation) multiple electronic components as monolithic), are thereby formed.It is (short on the size of substrate P, such as width
Bar direction) size for 10cm~2m or so, the size of length direction (strip direction) is more than 10m.In addition, the chi of substrate P
It is very little to be not limited to above-mentioned size.
Secondly, exposure device EX is illustrated in detail.Exposure device EX is stored in temperature controlled compartment ECV.The temperature controlled compartment
ECV by inside by being held in determined temperature, set humidity, shape of the substrate P for suppressing internally to transport caused by temperature
Change, and it is set as considering the hygroscopicity of substrate P or the humidity of caused electrostatic etc. with adjoint conveyance.Temperature controlled compartment
ECV is configured at the setting face E of manufacturing plant by Anti-vibration unit SU1, SU2 being passively or actively.Anti-vibration unit SU1, SU2 subtracts
Few vibration from setting face E.Setting face E can be the face being specially layed on the setting pedestal (pedestal) on the ground of workshop,
Also can be ground.Exposure device EX at least possess substrate transport mechanism 12, light supply apparatus 14, photohead 16, control device 18 and
Aligming microscope AMa (AMa1~AMa4), AMb (AMb1~AMb4).
Substrate transport mechanism 12, the substrate P moved from processing unit PR1 is transported to processing unit with set speed
PR2.The transport path of the substrate P transported in exposure device EX is specified in by the substrate transport mechanism 12.Substrate transport mechanism
12 from the upstream side of the conveyance direction of substrate P (-X direction side), sequentially with marginal position controller EPC, driven roller R1, tension force
Adjust roller RT1, rotating cylinder (cylinder roller bench) DR1, tension adjustment roller RT2, rotating cylinder (cylinder roller bench) DR2, tension adjustment
Roller RT3 and driven roller R2.
Marginal position controller EPC adjusts width (the Y-direction i.e. substrate from the processing unit PR1 substrate Ps moved
P billet direction) position.It is, marginal position controller EPC is so that the base transported in the state of set tension force is applied with
The scope that the position of plate P width end (edge) is in ± ten several μm~tens of μm or so relative to target location (permits
Perhaps scope) mode, substrate P is moved in width, adjust the width position of substrate P.Marginal position controller
EPC, have and hang the roller of substrate P and to the width end (edge) of substrate P to be applied with the state of set tension force
The edge sensor (not shown) (end test section) that position is detected.Marginal position controller EPC, based on above-mentioned edge sense
The detection signal detected by device is surveyed, marginal position controller EPC above-mentioned roller is moved in Y-direction, adjusts the width of substrate P
Direction position.Driven roller (roll) R1, while keeping from the table back of the body two sides of the marginal position controller EPC substrate Ps moved, one
While being rotated, substrate P is transported towards rotating cylinder DR1.Marginal position controller EPC, so as to transport the base toward rotating cylinder DR1
The plate P strip direction mode orthogonal with rotating cylinder DR1 central shaft AXo1, is adjusted to the width position of substrate P.
After the substrate P moved from driven roller R1 is hung on into tension adjustment roller RT1, rotating cylinder DR1 is directed to.
Rotating cylinder (the 1st rotating cylinder) DR1, have along Y-direction and extend and along the direction intersected with Action of Gravity Field direction
Central shaft (the 1st central shaft) AXo1 of extension and the cylindric outer peripheral face with central shaft AXo1 at a distance of radii fixus.Rotation
Cylinder DR1 makes a part for substrate P imitate (imitation) its outer peripheral face (periphery) and be bent along strip direction in cylinder planar
And support, and so that central shaft AXo1 is pivoted about and transports substrate P toward +X direction.Rotating cylinder DR1 makees in gravity
With the opposite side (+Z direction side) of direction side, face (back side) side bearing substrate P from the opposite side in the face formed with photosurface.Rotation
Rotating cylinder DR1 utilizes its periphery, light beam of the supporting for each of delineation unit U1, U2, U5, U6 from photohead 16 described later
Luminous point projection substrate P on region (part).It is provided with the both sides of rotating cylinder DR1 Y-direction with rotating cylinder DR1 around center
The axle Sft1 that the mode of axle AXo1 rotations is supported by the bearing of ring-type.Axle Sft1 is controlled by applying from controlled device 18
Rotary driving source (not shown) (such as motor or reducing gear etc.) torque and around central shaft AXo1 rotate.In addition, it is side
Just for the sake of, median plane Poc1 will be referred to as comprising central shaft AXo1 and the plane parallel with YZ planes.
The substrate P taken out of from rotating cylinder DR1, after tension adjustment roller RT2 is hung on, it is led to and is arranged on relatively rotation
The rotating cylinder DR2 of cylinder DR1 further downstreams (+X direction side).Rotating cylinder (the 2nd rotating cylinder) DR2 has and rotating cylinder DR1 identicals
Form.It is, during rotating cylinder DR2 has along Y-direction extension and extended along the direction intersected with Action of Gravity Field direction
Mandrel (the 2nd central shaft) AXo2 and the cylindric outer peripheral face with central shaft AXo2 at a distance of radii fixus.Rotating cylinder DR2, makes
A part for substrate P imitates its outer peripheral face (periphery) and bends and support in cylinder planar in strip direction, and in
Rotated centered on mandrel AXo2 so that substrate P to be transported toward +X direction.Rotating cylinder DR2 in the opposite side of Action of Gravity Field direction side (+
Z-direction side), from rear side supporting substrates P.Rotating cylinder DR2 utilizes its periphery, and supporting supplies retouching from photohead 16 described later
Paint the region (part) in the substrate P of the luminous point projection of the light beam of the description of unit U3, U4 each.In rotating cylinder DR2 also
It is provided with axle Sft2.Axle Sft2 by apply from controlled device 18 control rotary driving source (not shown) (such as electricity
Machine or reducing gear etc.) torque and around central shaft AXo2 rotate.In rotating cylinder DR1 central shaft AXo1 and rotating cylinder DR2
Mandrel AXo2 is in parastate.In addition, for convenience, it will be referred to as comprising central shaft AXo2 and the plane parallel with YZ planes
Median plane Poc2.
The substrate P taken out of from rotating cylinder DR2, after tension adjustment roller RT2 is hung on, it is led to driven roller R2.Drive
Dynamic roller (roll) R2 keeps the table of substrate P to carry on the back two sides, while being rotated, by the past place of substrate P in the same manner as driven roller R1
Manage device PR2 conveyances.Tension adjustment roller RT1~tension adjustment roller RT3, suppressed toward -Z direction, along strip direction to winding branch
The substrate P held in rotating cylinder DR1, DR2 applies set tension force.Thereby, make to assign the substrate P for hanging on rotating cylinder DR1, DR2
Strip direction tension stability in given area.In addition, control device 18 by rotary driving source (not shown) (such as
Motor or reducing gear etc.) it is controlled, rotate driven roller R1, R2.
Light supply apparatus 14 has light source (light-pulse generator), and projects pulse type to delineation unit U1~delineation unit U6 each
Light beam (pulsed light, laser) LB.Light beam LB is the ultraviolet light for having in below 370nm wavelength band peak wavelength, will
Light beam LB glow frequency is set to Fs.Light supply apparatus 14 projects light according to the control of control device 18 so that glow frequency Fs is luminous
Beam LB.
Photohead 16 possesses multiple delineation unit U (U1~U6) that the light beam LB from light supply apparatus 14 is injected respectively.
Photohead 16 is by multiple delineation unit U (U1~U6), to one of the substrate P of the circumference surface bearing by rotating cylinder DR1, DR2
Divide depicting pattern.Photohead 16 is by with the multiple delineation unit U (U1~U6) of identical are formed, and turning into so-called multiple beam
Type photohead.Delineation unit U1, U5, U2, U6 are arranged at rotating cylinder DR1 top, and delineation unit U3, U4 are arranged at rotating cylinder
DR2 top.Delineation unit U1, U5 are configured at the upstream side (-X direction of the conveyance direction of substrate P relative to median plane Poc1
Side), and configured with separating predetermined distance along Y-direction.Delineation unit U2, U6 are configured at removing for substrate P relative to median plane Poc1
The downstream (+X direction side) in direction is sent, and is configured with separating predetermined distance along Y-direction.Also, delineation unit U3 is relative to center
Face Poc2 is configured at the upstream side (-X direction side) of the conveyance direction of substrate P.Delineation unit U4 configures relative to median plane Poc2
In the downstream of the conveyance direction of substrate P (+X direction side).Delineation unit U1, U5 and delineation unit U2, U6 are relative to median plane
Poc1 is symmetrically arranged, and delineation unit U3 and delineation unit U4 is symmetrically arranged relative to median plane Poc2.
Each delineation unit U (U1~U6), make two light beam LB from light supply apparatus 14 respectively at the plane of illumination of substrate P
It is upper to restrain and be projeced into the plane of illumination (photosurface) of substrate P, and describe line (scan line) SLa, SLb mono- along set two
The scanning of dimension ground is in convergent two luminous point SP on the plane of illumination of substrate P.Though it will be described in detail delineation unit U in following
Composition, but for this 1st embodiment, a polygonal rotating mirror is provided with a delineation unit U, and (light beam is inclined to
Device, light deviation component) and two f θ lens combinations (scanning optics), a delineation unit U (U1~U6) is in substrate P
Scan line caused by luminous point SP is formed at different two respectively.Therefore, two light beam LB are transported to from light supply apparatus 14 respectively retouches
Paint unit U each.In addition, the light beam LB from light supply apparatus 14, a plurality of light beam LB is branched off into by light beam distribution system,
The each of each delineation unit U (U1~U6) is incident upon as two light beam LB, above-mentioned light beam distribution system passes through (not shown)
Speculum and beam splitter etc. are formed.
Each delineation unit U (U1~U6), in XZ planes, so that central shafts of two light beam LB towards rotating cylinder DR1
The mode that AXo1 or rotating cylinder DR2 central shaft AXo2 advances, irradiate two light beam LB towards substrate P.Thereby, list is described from each
First U (U1~U6) describes the light path (beam center axle) for two light beam LB that line SLa, SLb advance towards two in substrate P,
In XZ planes, the normal parallel with the plane of illumination of substrate P.In this 1st embodiment, from delineation unit U1, U5 direction
The light path (beam center axle) for the light beam LB that rotating cylinder DR1 advances, so as to turn into-θ 1 side relative to median plane Poc1 angle
Formula is set.The light beam LB to advance from delineation unit U2, U6 towards rotating cylinder DR2 light path (beam center axle), so that relative to
Median plane Poc1 angle sets as+θ 1 mode.Also, the light beam LB to advance from delineation unit U3 towards rotating cylinder DR2
Light path (beam center axle), set in a manner of the angle relative to median plane Poc2 is turned into-θ 1.From delineation unit U4 directions
The light path (beam center axle) for the light beam LB that rotating cylinder DR2 advances, so as to turn into+θ 1 side relative to median plane Poc2 angle
Formula is set.Also, each delineation unit U (U1~U6), puts down so as to be irradiated in two light beam LB for describing line SLa, SLb with YZ planes
Relative to the mode that the plane of illumination of substrate P is vertical in capable face, towards substrate P illumination beam LB.That is, on plane of illumination
Luminous point SP main scanning direction on, be projeced into the light beam LB of substrate P with telecentricity (telecentric) status scan.
As shown in Fig. 2 multiple delineation unit U (U1~U6) are configured with set configuration relation.Each delineation unit U (U1~
U6) two describe line SLa, SLb along main scanning direction be Y-direction extension, in being in subscan on the plane of illumination of substrate P
Same position on direction (X-direction), and configured with staggering in main scanning direction (Y-direction).It is, each delineation unit U (U1
~U6) description line SLa, SLb, only separatedly configured on main scanning direction (Y-direction) with parastate.Also, describe line
SLa, SLb sweep length (length) are set to equal length, and describe line SLa and be set to describing line SLb in master
Separated on scanning direction with the interval below sweep length.
Multiple delineation unit U (U1~U6), it is configured to description line SLa, SLb such as Fig. 2 of multiple delineation unit U (U1~U6)
It is shown, connect in the Y direction on (width, the main scanning direction of substrate P) without separating each other.Each delineation unit U (U1~
U6) can be around rotation center axle AXr, such as in the range of ± 1.5 degree, the small turn with μ rad resolution, with to XY faces
Interior description line (scan line) SLa, SLb gradient is adjusted.Rotation center axle AXr is vertically led to relative to substrate P
Cross connection describe line (the 1st scan line) SLa midpoint with describe line (the 2nd scan line) SLb midpoint line segment central point (in
Point) axle.The extended line of the axle, handed over the central shaft AXo1 or rotating cylinder DR2 of the rotating cylinder DR1 in Fig. 1 central shaft AXo2
Fork.In addition, in the 1st embodiment, the description line SLa of each delineation unit U (U1~U6) is with describing line SLb, in subscan side
It is upwards same position, and in being separated on main scanning direction, therefore, rotation center axle AXr is configured at by describing line
On SLa, SLb straight line, and it is configured at the central point for describing gaps of the line SLa with describing line SLb.
If delineation unit U (U1~U6) is around rotation center axle AXr somewhat turns (rotation), scanning light beam LB luminous point SP
Description line SLa, SLb also can the correspondingly turn (rotation) centered on rotation center axle AXr.Thereby, if delineation unit U
(U1~U6) turn fixed angle, then describing line SLa, SLb also can be correspondingly centered on rotation center axle AXr, relative to Y side
Fixed angle is tilted to (Y-axis).Above-mentioned each delineation unit U (U1~U6) is under the control of control device 18, by including actuating
The high drive mechanism of the response (not shown) of device and around rotation center axle AXr turns.
In addition, two that represent delineation unit U1 sometimes with SL1a, SL1b are described line SLa, SLb, similarly, with
SL2a, SL2b~SL6a, SL6b represent that two of delineation unit U2~U6 describe line SLa, SLb.Also, line will be described sometimes
SLa, SLb referred to collectively merely as describe line SL.
As shown in Fig. 2 so that exposure area W whole width is completely covered in multiple delineation unit U (U1~U6)
Mode, scanning area is shared by each delineation unit U (U1~U6).Thereby, each delineation unit U (U1~U6) can be by along substrate P
Multiple region description patterns for being split to form of width.If for example, the sweep length (length) for describing line SL is set to
20mm~40mm or so, then by amounting to 6 delineation unit U along Y-direction configuration, make the Y-direction width expansion that can describe extremely
About 240mm~480mm or so.Each length (sweep length) for describing line SL (SL1a, SL1b~SL6a, SL6b) phase in principle
Together.It is, the light beam LB scanned along each of a plurality of description line SL (SL1a, SL1b~SL6a, SL6b) luminous point SP
Scanning distance is identical in principle.In addition, when the situation of exposure area W to be expanded width, line SL can be described by extending
Delineation unit U of (the SLa, SLb) length or increase of itself along Y-direction configuration quantity is tackled.
Describe line SL1a, SL1b, SL2a, SL2b, SL5a, SL5b, SL6a, SL6b, positioned at the base supported by rotating cylinder DR1
On plate P plane of illumination.Describe line SL1a, SL1b, SL2a, SL2b, SL5a, SL5b, SL6a, SL6b, clip median plane Poc1
And configured along rotating cylinder DR1 circumferencial direction in 2 rows.Describe line SL1a, SL1b, SL5a, SL5b, relative to median plane Poc1
On the plane of illumination of the substrate P of the upstream side of the conveyance direction of substrate P (-X direction side).Description line SL2a, SL2b,
SL6a, SL6b, the substrate P that the downstream (+X direction side) of the conveyance direction of substrate P is located at relative to median plane Poc1 are shone
Penetrate on face.
Describe line SL3a, SL3b, SL4a, SL4b, on the plane of illumination of the substrate P supported by rotating cylinder DR2.Describe
Line SL3a, SL3b, SL4a, SL4b, clip median plane Poc2 and configured along rotating cylinder DR2 circumferencial direction in 2 rows.Describe line
SL3a, SL3b, the substrate P that the upstream side (-X direction side) of the conveyance direction of substrate P is located at relative to median plane Poc2 are shone
Penetrate on face.Describe line SL4a, SL4b, the downstream (+X direction side) of the conveyance direction of substrate P is located at relative to median plane Poc2
Substrate P plane of illumination on.Describe line SL1a, SL1b~SL6a, SL6b and the width i.e. rotating cylinder of substrate P
DR1, DR2 central shaft AXo1, AXo2 are substantially parallel.
Description line SL1a, SL1b, SL3a, SL3b, SL5a, SL5b of odd number, in the Y direction (width of substrate P)
On, separate predetermined distance along the width (scanning direction) of substrate P and be configured on straight line.The description line of even number
SL2a, SL2b, SL4a, SL4b, SL6a, SL6b also similarly in the Y direction, set are separated along the width of substrate P
Every and be configured on straight line.Now, describe line SL1b to be configured in the Y direction between description line SL2a and description line SL2b.Retouch
Line drawing SL3a is configured in the Y direction to be described between line SL2b and description line SL4a.Description line SL3b is configured in the Y direction to be retouched
Between line drawing SL4a and description line SL4b.Describe line SL5a to be configured in the Y direction between description line SL4b and description line SL6a.
Describe line SL5b to be configured in the Y direction between description line SL6a and description line SL6b.It is, describe line SL as follows
Configuration：In the Y direction, from -Y direction side sequentially according to SL1a, SL2a, SL1b, SL2b, SL3a, SL4a, SL3b, SL4b,
The pattern that SL5a, SL6a, SL5b, SL6b order are described, connected with the end of Y-direction.
The light beam LB scanned along each for describing line SL1a, SL1b, SL3a, SL3b, SL5a, SL5b of odd number light
Point SP scanning direction is one-dimensional square, and is equidirectional (+Y direction).Along description line SL2a, SL2b of even number,
The light beam LB of SL4a, SL4b, SL6a, SL6b each scanning luminous point SP scanning direction is one-dimensional square, and is phase Tongfang
To (-Y direction).The light beam LB's scanned along description line SL1a, SL1b, SL3a, SL3b, SL5a, SL5b of above-mentioned odd number
Luminous point SP scanning direction (+Y direction), with being swept along description line SL2a, SL2b, SL4a, SL4b, SL6a, SL6b of even number
The light beam LB retouched luminous point SP scanning direction (-Y direction) is opposite directions.Thereby, in describe line SL1b, SL3a,
SL3b, SL5a, SL5b the description starting position position of starting point (describe), with describe line SL2a, SL2b, SL4a, SL4b,
The pattern that SL6a description starting position is described connects.Also, in description line SL1a, SL1b, SL3a, SL3b, SL5a, SL5b
Describe end position (position for describing end point), the description knot with describing line SL2a, SL2b, SL4a, SL4b, SL6a, SL6b
The pattern that beam position is described connects.In addition, under original state, description line SL1a, SL1b of the odd number on straight line,
The conveyance direction of SL5a, SL5b and description line SL2a, SL2b, SL6a, SL6b of the even number on straight line along substrate P
(rotating cylinder DR1 circumferencial direction) separates regular length (gap length) configuration.Similarly, under original state, positioned at straight line
On odd number describe line SL3a, SL3b, describe line SL4a, SL4b along substrate P with the even number on straight line
Conveyance direction (rotating cylinder DR2 circumferencial direction) separates regular length (gap length) configuration.
It is the thickness corresponding with luminous point SP size (diameter) φ in addition, describing line SL width (X-direction size)
Degree.For example, when luminous point SP effective dimensions φ is 3 μm of situation, the width for describing line SL is also 3 μm.Luminous point SP can also
According to the overlapping mode of certain length (such as luminous point SP effective dimensions φ half), projected along line SL is described.Also, sweeping
(such as describe line SL1a descriptions end point and retouching for description line SL2a in the end for retouching description line SL adjacent to each other on direction
Paint end point), also can be overlapping in the Y direction according to certain length (such as luminous point SP size φ half).
Fig. 3 is to show each description made in end (adjoining) consistent with each other for describing line SL adjacent on main scanning direction
The figure of the unit U configuration relation for describing line SLa, SLb.As shown in figure 3, the scanning for describing line SLa, SLb by delineation unit U
Length and delineation unit U description line SLa are set to Lo with describing line SLb Y-direction separation distance (gap).Therefore, it is possible to
To make the adjacent description mutual ends of line SL on main scanning direction on main scanning direction in a manner of adjoining, phase each other is configured
To delineation unit U1, U3, U5 description line SLa, SLb for describing line SLa, SLb and delineation unit U2, U4, U6.In addition,
Delineation unit U rotation center axle AXr, is set to the central point by describing the separation distance Lo between line SLa, SLb.
Fig. 4 be show make in a scanning direction the adjacent end for describing line SL each other each overlapping α/2 (regular length) when
Each delineation unit U the configuration relation for describing line SLa, SLb figure.As shown in figure 4, the scanning for describing line SLa, SLb is grown
Degree is set to Lo, and delineation unit U description line SLa is set into Lo- α with describing line SLb Y-direction separation distance (gap).Cause
This, can be matched somebody with somebody in a manner of making the adjacent description mutual ends of line SL on main scanning direction in overlapping α/2 of main scanning direction
Put toward each other to delineation unit U1, U3, U5 the description line SLa for describing line SLa, SLb and delineation unit U2, U4, U6,
SLb.In addition, delineation unit U rotation center axle AXr, is set to by describing the separation distance Lo- α between line SLa, SLb
Central point.
Control device 18 shown in Fig. 1, is controlled to exposure device EX each several part.The control device 18 includes computer
With the record media that has program recorded thereon etc., the computer is sent out by configuration processor as the control device 18 of this 1st embodiment
Wave function.Also, aligming microscope AMa (AMa1~AMa4), AMb (AMb1~AMb4) shown in Fig. 1, to detect shown in Fig. 2
Substrate P on the alignment mark MK (MK1~MK4) that is formed.Multiple aligming microscope AMa (AMa1~AMa4) are along the Y direction
Set.Similarly, multiple aligming microscope AMb (AMb1~AMb4) are also set along the Y direction.Alignment mark MK (MK1~
MK4), the pattern describe the exposure area W on the plane of illumination of substrate P is relatively aligned with substrate P
(alignment) reference mark.Aligming microscope AMa (AMa1~AMa4), in the base of the circumference surface bearing by rotating cylinder DR1
On plate P, alignment mark MK (MK1~MK4) is detected.Aligming microscope AMa (AMa1~AMa4), it is arranged on compared with from delineation unit
The luminous point SP for the light beam LB that U1, U5 are exposed on the plane of illumination of substrate P position (describing line SL1a, SL1b, SL5a, SL5b)
More lean on the upstream side (-X direction side) of the conveyance direction of substrate P.Also, aligming microscope AMb (AMb1~AMb4), by rotating cylinder
In the substrate P of DR2 circumference surface bearing, alignment mark MK (MK1~MK4) is detected.Aligming microscope AMb (AMb1~AMb4) is set
Put the luminous point SP of the light beam LB on compared with the plane of illumination for exposing to substrate P from delineation unit U3 position (describe line SL3a,
SL3b the upstream side (-X direction side) of the conveyance direction of substrate P) is more leaned on.
Aligming microscope AMa (AMa1~AMa4), AMb (AMb1~AMb4) have (not shown) by mutatis mutandis illumination light
It is projected to the light source of substrate P, photographic element (CCD (Charge Coupled Device, Charged Couple with shooting its reflected light
Element), CMOS (Complementary Metal Oxide Semiconductor, complementary metal oxide semiconductor) etc.).
The photography signal that aligming microscope AMa (AMa1~AMa4), AMb (AMb1~AMb4) are shot, is sent to control device 18.
Aligming microscope AMa (AMa1~AMa4), AMb (AMb1~AMb4), shoot the alignment being present in viewing area (not shown)
Mark MK (MK1~MK4).Each aligming microscope AMa (AMa1~AMa4), AMb (AMb1~AMb4) viewing area are along Y side
Configured to setting, and according to alignment mark MK (MK1~MK4) Y-direction position.Therefore, aligming microscope AMa1, AMb1 energy
Enough shoot alignment mark MK1, similarly, aligming microscope AMa2~AMa4, AMb2~AMb4 can shoot alignment mark MK2~
MK4.The size of the viewing area on the plane of illumination of substrate P, according to alignment mark MK (MK1~MK4) size or alignment
Precision (position finding precision) and set, it is the size of 100 μm~500 μm or so square.Control device 18, based on from pair
Quasi- microscope AMa (AMa1~AMa4), AMb (AMb1~AMb4) photography signal, detection alignment mark MK position.In addition,
It is the hardly light of the wavelength band with sensitivity, such as wavelength for the photonasty functional layer of substrate P to mutatis mutandis illumination light
For 500nm~800nm or so light.Also, aligming microscope AMa, AMb photographic element, due to needing during substrate P moves
Alignment mark MK is shot, therefore its aperture time is set as the high-speed shutter time (electric charge corresponding with the conveyance speed of substrate P
The photography times such as storage time).
Secondly, delineation unit U composition is illustrated.Each delineation unit U has identical composition, therefore real in the originally the 1st
Apply in form, illustrated by taking delineation unit U2 as an example.Hereinafter, in delineation unit U explanation, for specific delineation unit U
The configuration of interior each component or light beam and set orthogonal coordinate system XtYtZt.Orthogonal coordinate system XtYtZt Yt axles be set to just
Hand over coordinate system XYZ Y-axis parallel, orthogonal coordinate system XtYtZt is set to tilts fixed angles relative to orthogonal coordinate system XYZ around Y-axis
Degree.
Fig. 5 is the pie graph of the delineation unit U2 from-Yt (- Y) direction side, and Fig. 6 is retouching from the side of+Zt directions
Paint unit U2 pie graph.It is incident upon in delineation unit U2 two light beam LB, a light beam LB is represented with LBa, represented with LBb
Another light beam LB.Also, representing light beam (the 1st light beam) LBa luminous point SP with SPa sometimes, light beam (the 2nd light is represented with SPb
Beam) LBb luminous point SP.Luminous point (the 1st luminous point) SPa scans on description line SL2a (SLa), and luminous point (the 2nd luminous point) SPb is in description
Scanned on line SL2b (SLb).
In addition, in Fig. 6, in order to be readily appreciated that, luminous point SPa, SPb are represented relatively to describe the thicker point of line SL2a, SL2b.
Also, in Fig. 5, Fig. 6, the direction parallel with rotation center axle AXr is set to Zt directions, by the plane orthogonal with Zt directions
Upper, substrate P is set to Xt directions from processing unit PR1 via exposure device EX towards processing unit PR2 direction, will be in and Zt
In the orthogonal plane in direction, the direction orthogonal with Xt directions be set to Yt directions.It is, Fig. 5, Fig. 6 Xt, Yt, Zt three-dimensional
Coordinate, it is to revolve Fig. 1 X, Y, Z three-dimensional coordinate in a manner of Z-direction is parallel with rotation center axle AXr centered on Y-axis
Then into three-dimensional coordinate.
Delineation unit U2 possesses speculum M1, collector lens CD, three corner reflector M2, speculum M3a, M3b, off-set optical
Component (off-set optical plate) SRa, SRb, beam forming optics BFa, BFb, speculum M4, cylindrical lens CY1, speculum
M5, polygonal mirror PM, speculum M6a, M6b, f θ lens FTa, FTb, speculum M7a, M7b and cylindrical lens CY2a, CY2b light
System.Such optical system (speculum M1, collector lens CD etc.), height is integrally formed in as a delineation unit U2
In rigid framework.It is, delineation unit U2 integratedly keeps such optical system.Penetrated for two light beams LBa, LBb
The optical system entered, only fills reference marks, for two light beams LBa, LBb each respectively inject and two light beam LBa,
The optical system that LBb is arranged in pairs, a, b are filled after reference marks.Briefly, the light injected for only light beam LBa
System, fills a after reference marks, the optical system injected for only light beam LBb, b is filled after reference marks.
As shown in figure 5, two light beams LBa, LBb from light supply apparatus 14, are passing through two optical elements AOMa, AOMb
And after two collimation lenses CLa, CLb, reflected by speculum M8, delineation unit U2 is incident upon with the state parallel with Zt axles.
Delineation unit U2 two light beams LBa, LBb are incident upon, in XtZt planes, along delineation unit U2 rotation center axle AXr
It is incident upon speculum M1.Fig. 7 is to be penetrated from the side of+Zt directions by optical element AOMa, AOMb and collimation lens CLa, CLb
Enter the figure of the light path to speculum M8 light beam LBa, LBb, Fig. 8 is to be incident upon description from speculum M8 from the side of+Xt directions
The figure of unit U2 speculum M1 light beam LBa, LBb light path.In addition, in Fig. 7, Fig. 8, also sat with Xt, Yt, Zt three-dimensional
Mark system represents.
Optical element AOMa, AOMb, it is that there is transmittance person to light beam LBa, LBb, is acousto-optic varying element (AOM：
Acousto-Optic Modulator).Optical element AOMa, AOMb make the light of injection by using ultrasonic (high-frequency signal)
Beam LBa, LBb are with the diffraction angle diffraction corresponding with the frequency of high frequency waves, so as to change light beam LBa, LBb light path i.e. advance side
To.Optical element AOMa, AOMb, according to the ON/OFF for the drive signal (high-frequency signal) for carrying out self-control device 18, conducting/
Disconnect producing and make the diffraction light (diffracted beam) that light beam LBa, LBb diffraction of injection forms.
Optical element AOMa does not make to penetrate when state of the drive signal (high-frequency signal) for carrying out self-control device 18 for disconnection
The light beam LBa diffractions that enter and be passed to.Therefore, when state of the drive signal for disconnection, optical element AOMa light is passed through
Beam Lba, absorber (not shown) is incident upon without being incident upon collimation lens CLa and speculum M8.This means to be projected to substrate P
Plane of illumination on luminous point SPa intensity be tuned as low level (zero).On the other hand, in optical element AOMa according to coming from
The drive signal (high-frequency signal) of control device 18 and during the state turned on, produce form the light beam LBa diffractions of injection one
Secondary diffracted beam.Therefore, when state of the drive signal for conducting, a diffracted beam being inclined to using optical element AOMa
(being set to the light beam LBa from optical element AOMa for convenience of description), after by collimation lens CLa, it is incident upon anti-
Penetrate mirror M8.This intensity for meaning to be projected to the luminous point SPa on the plane of illumination of substrate P is tuned as high levels.
Similarly, states of the optical element AOMb in the drive signal (high-frequency signal) for carrying out self-control device 18 for disconnection
When, do not make the light beam LBb diffractions of injection and be passed to, therefore, by optical element AOMb light beam LBb, be incident upon and do not scheme
The absorber shown is without being incident upon collimation lens CLb and speculum M8.This means to be projected to the light on the plane of illumination of substrate P
Point SPb intensity is tuned as low level (zero).On the other hand, in optical element AOMb according to the driving for carrying out self-control device 18
Signal (high-frequency signal) and turn on state when, make the light beam LBb diffractions of injection, therefore, be inclined to using optical element AOMb
Light beam LBb (diffracted beam), after by collimation lens CLb, be incident upon speculum M8.This means to be projected to base
The intensity of luminous point SPb on plate P plane of illumination is tuned as high levels.Control device 18 is described according to description line SL2a
The pattern data (bit mapping) of pattern, make application at high speed to optical element AOMa drive signal ON/OFF, and base
In with describe line SL2b description pattern pattern data, make at high speed application to optical element AOMb drive signal conducting/
Disconnect.It is, luminous point SPa, SPb intensity, high levels and low level are tuned as according to pattern data.In addition, inject
To optical element AOMa, AOMb light beam LBa, LBb, with reaching the wide (beam of beam waist in optical element AOMa, AOMb
Waist mode optically focused), therefore, light beam LBa, LBb (diffraction be inclined to and exported using optical element AOMa, AOMb
Light beam) turn into diverging light, collimation lens CLa, CLb make collimated light beam of the diverging light as set beam diameter.
Past-Zt the directions of light beam LBa, LBb of injection are reflected and are directed to delineation unit U2 reflection by speculum M8
Mirror (reflecting member) M1.Through speculum M8 reflection after light beam LBa, LBb, by relative to rotation center axle AXr it is symmetrical in a manner of
It is incident upon delineation unit U2 speculum M1.Now, light beam LBa, LBb can intersect on speculum M1, can not also intersect.Fig. 6,
The example that display beams LBa, LBb are intersected in the position of the rotation center axle AXr on speculum M1 in Fig. 8.It is, light beam
LBa, LBb are incident upon speculum M1 relative to rotation center axle AXr with fixed angle.In this 1st embodiment, light beam LBa,
LBb along Yt (Y) direction, by relative to rotation center axle AXr it is symmetrical in a manner of be incident upon speculum M1.In addition, can also be as
Under type is designed, that is, light beam LBa, LBb by relative to rotation center axle AXr it is symmetrical in a manner of be abreast incident upon it is anti-
Penetrate mirror M1.
Fig. 5, Fig. 6 explanation are back to, speculum M1 is reflected the past+Xt directions of light beam LBa, LBb of injection.Through anti-
Light beam LBa, the LBb (being respectively collimated light beam) penetrated after mirror M1 reflections, as shown in fig. 6, in XtYt faces, is opened with fixed each other
Angle of release is gradually disengaged.Collector lens CD is following lens, make the respective central shaft of light beam LBa, LBb from speculum M1 in
XtYt is parallel to each other in face, and light beam LBa, LBb is each concentrated on set focal position.Collector lens CD function
Will be in following explanation, and collector lens CD front side focal position is in a manner of on the reflecting surface in speculum M1 or near it
Setting.Three corner reflector M2 will pass through the reflection of past 90 degree of-Yt (- Y) the direction side progress of collector lens CD light beam LBa and guiding
To speculum M3a, and reflection and the guiding for 90 degree being carried out by past+Yt (+Y) the direction sides of collector lens CD light beam LBb
To speculum M3b.
Speculum M3a carries out the light beam LBa past+Xt directions side of injection 90 degree of reflection.The light reflected through speculum M3a
Beam LBa, pass through off-set optical component (the 1st off-set optical component formed by parallel flat) SRa and beam forming optics
BFa and be incident upon speculum M4.Speculum M3b carries out the light beam LBb past+Xt directions side of injection 90 degree of reflection.Through reflection
The light beam LBb of mirror M3b reflections, passes through off-set optical component (the 2nd off-set optical component formed by parallel flat) SRb and light beam
Shaping optics BFb and be incident upon speculum M4.By three corner reflector M2 and speculum M3a, M3b, make on Yt directions
Expanded by the distance of each central shaft of light beam LBa, LBb after collector lens CD.Off-set optical component SRa, SRb with light beam
The plane (YtZt planes) that LBa, LBb direction of advance are orthogonal is interior, adjustment light beam LBa, LBb center.Off-set optical structure
Part SRa, SRb, there are the two block quartzy parallel-plates parallel with YtZt planes, one block of parallel-plate can tilt around Yt axles, and another piece flat
Andante can tilt around Zt axles.Above-mentioned two blocks of parallel-plates tilt rotating around Yt axles, Zt axles, thereby, in the advance with light beam LBa, LBb
In the orthogonal YtZt planes in direction, micro skew two-dimensionally is carried out to the position at light beam LBa, LBb center.Above-mentioned two pieces parallel
Plate is driven under the control of control device 18 by actuator (not shown) (drive division).Beam forming optics BFa, BFb are
Shaped beam LBa, LBb optical system, such as make to be configured to by light beam LBa, LBb of collector lens CD optically focused diameter pre-
Determine the diameter of size.
As shown in figure 5, speculum M4 makes the past-Zt directions of light beam LBa, LBb from beam forming optics BFa, BFb
Reflection.Light beam LBa, the LBb reflected through speculum M4, speculum M5 is incident upon by the 1st cylindrical lens CY1.Speculum M5
The self-reflection mirror M4 past-Xt directions of light beam LBa, LBb were reflected and the light beam LBa, LBb is incident upon polygonal mirror PM's future
Each reflecting surface RP.Light beam LBa is incident upon polygonal mirror PM the 1st reflecting surface RP from the 1st direction, light beam LBb from the 1st direction not
The 2nd same direction is incident upon the polygonal mirror PM reflecting surface RP of others the 2nd.
Polygonal mirror PM is reflected light beam LBa, LBb of injection toward f θ lens FTa, FTb.In order that light beam LBa, LBb
Luminous point SPa, SPb be scanned on the plane of illumination of substrate P, polygonal mirror PM so that inject light beam LBa, LBb deviation
Mode is reflected.Thereby, because polygonal mirror PM rotates, light beam LBa, LBb are one-dimensionally carried out in the face parallel with XtYt planes
Deviation scanning.Specifically, polygonal mirror PM is polygonal rotating mirror, its have along Zt direction of principal axis extension rotary shaft AXp, with
The multiple reflecting surface RP configured around rotary shaft AXp mode around rotary shaft AXp.In the 1st embodiment, polygonal mirror PM is tool
There are 8 reflecting surface RPs parallel with Zt axles and the polygonal rotating mirror of the shape with octagon.Centered on rotary shaft AXp and
Polygonal mirror PM is rotated toward set direction of rotation, thereby, can make to expose to the light beam LBa of reflecting surface RP pulse type,
LBb angle of reflection continuously produces change.Thereby, can be respectively by the 1st reflecting surface RP and the 2nd reflecting surface RP by light beam
LBa, LBb reflection direction deviation, make to expose to luminous point SPa, SPb of light beam LBa, LBb on the plane of illumination of substrate P along
Main scanning direction is scanned.
A polygonal mirror PM reflecting surface RP, due to making light beam LBa, LBb carry out deviation scanning, therefore can make luminous point
SPa, SPb are scanned along line SL2a, SL2b is described.Therefore, polygonal mirror PM rotates a circle, then along the illuminated of substrate P
Luminous point SPa, SPb of description line SL2a, SL2b on face scanning times are up to and reflecting surface RP quantity identical 8 times.
Polygonal mirror PM comprising the polygonal mirror drive division of motor etc. with fixed speed by being rotated.Pass through the polygonal mirror drive division, multiaspect
The mirror PM controlled device 18 of rotation controls.
In addition, when the length for describing line SL2a, SL2b is for example set into 30mm, make 3 μm luminous point SPa, SPb with each overlapping
1.5 μm of mode and pulsed illumination, and luminous point SPa, SPb are exposed into the illuminated of substrate P along line SL2a, SL2b is described
When on face, with the luminous point SP of single pass irradiation quantity (pulsed illumination number) for 20000 (30mm/1.5 μm).If also, by edge
The sweep time for luminous point SPa, SPb for describing line SL2a, SL2b is set to 200 μ sec, then during this, it is necessary to carry out 20000
The luminous point SP of secondary radiation pulses shape, therefore, the glow frequency Fs of light supply apparatus 14 are the μ sec=of Fs≤20000 time/200
100MHz。
1st cylindrical lens CY1, in the non-scan direction orthogonal with as caused by polygonal mirror PM scanning direction (direction of rotation)
On (Zt directions), light beam LBa, LBb of injection is set to converge on polygonal mirror PM reflecting surface RP.It is even if (anti-in the presence of following situation
Face RP is penetrated to tilt relative to the normal i.e. Zt axles of XtYt planes), it can also suppress its influence, the situation refers to because of the bus and Yt
The 1st parallel cylindrical lens CY1 of direction and the 2nd cylindrical lens CY2a, CY2b described later, and make reflecting surface RP relative to Zt side
To inclination.For example, luminous point SPa, the SPb that can suppress to expose to light beam LBa, LBb on the plane of illumination of substrate P (describe line
SL2a, SL2b) irradiation position, offset up because of polygonal mirror PM each reflecting surface RP minimum gradient error in Xt side.
Specifically, past-Yt (- Y) the direction sides of the light beam LBa of injection are reflected and are directed to speculum by polygonal mirror PM
M6a.Also, past+Yt (+Y) the direction sides of the light beam LBb of injection are reflected and are directed to speculum M6b by polygonal mirror PM.Speculum
The light beam LBa past-Xt directions side of injection is reflected and is directed to the optical axis AXfa's along the extension of Xt direction of principal axis by M6a
F θ lens FTa.The light beam LBb past-Xt directions side of injection is reflected and be directed to by speculum M6b to be had along Xt direction of principal axis
The optical axis AXfb (parallel with optical axis AXfa) of extension f θ lens FTb.
F θ (f- θ) lens FTa, FTb be telecentric system scanning lens, its in XtYt planes, will through speculum M6a,
Light beam LBa, LBb from polygonal mirror PM of M6b reflections, speculum is projected in a manner of parallel with optical axis AXfa, AXfb
M7a、M7b.Speculum M7a is reflected the light beam LBa of injection towards the plane of illumination of substrate P and past-Zt directions, speculum
M7b is reflected the light beam LBb of injection towards the plane of illumination of substrate P and past-Zt directions.The light reflected through speculum M7a
Beam Lba, the plane of illumination of substrate P is projected to by the 2nd cylindrical lens CY2a, the light beam LBb reflected through speculum M7b, led to
Cross the 2nd cylindrical lens CY2b and be projected to the plane of illumination of substrate P.It is parallel with Yt directions by the f θ lens FTa and bus
2nd cylindrical lens CY2a, the light beam LBa of substrate P is projected on the plane of illumination of substrate P, converging to effective diameter as several μm
The small luminous point SPa of left and right (such as 3 μm).Similarly, the 2nd f θ lens FTb and bus parallel with Yt directions cylinder is passed through
Lens CY2b, it is several μm or so (examples to be projected to the light beam LBb of substrate P on the plane of illumination of substrate P, converging to effective diameter
Such as 3 μm) small luminous point SPb.Luminous point SPa, the SPb being projected on the plane of illumination of the substrate P, pass through a polygonal mirror PM
Rotate and one-dimensionally scanned simultaneously along description line SL2a, the SL2b extended in main scanning direction (Yt directions, Y-direction).
The incidence angle θ (relative to the angle of optical axis) for the light beam injected toward f θ lens FTa, FTb, can be according to polygonal mirror PM's
The anglec of rotation (θ/2) and change.F θ lens FTa, light beam LBa luminous point SPa is projected to proportional to light beam LBa incidence angle
Image height position on the plane of illumination of substrate P.Similarly, f θ lens FTb, light beam LBb luminous point SPb is projected to and light beam
Image height position on the plane of illumination of the proportional substrate P of LBb incidence angle.If focal length is set into f, image height position is set
For y, then f θ lens FTa, FTb has y=f × θ relation (distortion aberration (distortion)).Therefore, can be saturating by the f θ
Mirror FTa, FTb, light beam LBa, LBb luminous point SPa, SPb is set correctly to carry out constant-speed scanning along Yt directions (Y-direction).As past f
θ lens FTa, FTb inject light beam LBa, LBb incidence angle θ be 0 degree when, be incident upon f θ lens FTa, FTb light beam LBa,
LBb advances along on optical axis AXfa, AXfb.
Collector lens CD above, three corner reflector M2, speculum M3a, off-set optical component SRa, beam shaping optical
System BFa, speculum M4, the 1st cylindrical lens CY1 and speculum M5, light beam LBa is guided as from the 1st direction towards polygonal mirror PM
The 1st guide-lighting optical system 20 and play function.Also, collector lens CD, three corner reflector M2, speculum M3b, off-set optical structure
Part SRb, beam forming optics BFb, speculum M4, the 1st cylindrical lens CY1 and speculum M5, as from the 1st direction not
The 2nd same direction guides light beam LBb the 2nd guide-lighting optical system 22 towards polygonal mirror PM and plays function.It is though in addition, optically focused is saturating
Mirror CD, three corner reflector M2, speculum M4, the 1st cylindrical lens CY1 and speculum M5 are set to the 1st guide-lighting optical system 20 and the 2nd
The common component of guide-lighting optical system 22, but also can by the 1st guide-lighting optical system 20 and the 2nd guide-lighting optical system 22 and individually
At least a portion in such component is set.Also, speculum M6a, f θ lens FTa, speculum M7a and the 2nd cylindrical lens CY2a,
Function is played as the 1st projection optics system 24, the 1st projection optics system 24 makes the light beam LBa reflected by polygonal mirror PM
Optically focused is simultaneously projected on description line SL2a (SLa) as luminous point SPa.Similarly, speculum M6b, f θ lens FTb, speculum
M7b and the 2nd cylindrical lens CY2b, function is played as the 2nd projection optics system 26, the 2nd projection optics system 26 make by
The light beam LBb optically focused of polygonal mirror PM reflections is simultaneously projected on description line SL2b (SLb) as luminous point SPb.1st projection optics
The projection optics system 26 of system 24 and the 2nd, is configured as follows, i.e. makes description line SLa, SLb in being on sub-scanning direction
Same position and in separating on main scanning direction.Also, so as to describe line SLa, SLb below on main scanning direction with sweep length
Interval separate mode configure the 1st projection optics system 24 and the 2nd projection optics system 26.
In the case of this 1 embodiment, even if working as makes the rotation center that light beam LBa, LBb are incident upon on speculum M1
During the position that axle AXr passes through, light beam LBa, LBb also will not abreast be incident upon speculum M1 with rotation center axle AXr, but such as
Shown in Fig. 8, injected by relative to rotation center axle AXr in a manner of fixed elevation is in (or near it) intersection on speculum M1.
Therefore, if delineation unit U2 is overall around rotation center axle AXr turns, light beam LBa, LBb relative to speculum M1 incidence angle
Degree relatively produces change.Thereby, the reflection direction of light beam LBa, LBb through speculum M1 reflections in delineation unit U2, root
According to delineation unit U2 change is two-dimensionally produced around rotation center axle AXr turn.
Fig. 9, Figure 10 be turgidly show initial positions of the delineation unit U2 not around rotation center axle AXr turns, with
Delineation unit U2 after initial position turn Δ θ z in the state of delineation unit U2 in light beam LBa reflection direction change
The figure of (change of light beam progress path).Fig. 9 is in observation speculum (reflecting member) M1 and collector lens CD in XtZt faces
The figure of configuration relation, Figure 10 are in the figure for the configuration relation that speculum M1 and collector lens CD is observed in XtYt faces.In addition, describe
The reflection direction of light beam LBb in unit U2 produces the principle of change when delineation unit U2 is around rotation center axle AXr turns, with
Light beam LBa situation is identical, therefore is illustrated only for light beam LBa.Herein, collector lens CD optical axis AXc, be set as in
Intersect on speculum M1 reflecting surface (being set as 45 ° relative to XtYt faces) with rotation center axle AXr, speculum M1 reflecting surface
It is set in collector lens CD front side focal length fa position.Further, light beam LBa, LBb, after collector lens CD
The face Pcd (rear side focus face) of side focal length fb position, after being restrained in a manner of reaching beam waist wide (minimum diameter)
Diverging.In Fig. 9, Tu10Zhong, with light beam LBa-1 shown in solid, the initial position shape that delineation unit U2 does not rotate integrally is represented
State, that is, light beam LBa when describing the line SL2a states parallel with Yt (Y) direction.With the light beam LBa- shown in 2 chain lines
2, represent light beam LBa during state of the delineation unit U2 entirety after rotation center axle AXr turn Δ θ z.
When delineation unit U2 is around rotation center axle AXr turns, light beam LBa (LBb) relative to speculum M1 reflecting surface
Relativity incident angle produce change.As shown in Figure 10, if reflection by the speculum M8 being projected to before speculum M1
Light beam LBa on face is set to LBa (M8), then according to Fig. 8 light beam orientation state aware：Under initial position, XtYt faces
The interior light beam LBa being projected on speculum M1 and light beam LBa (M8) each position, separates on the direction parallel with Yt axles.
When situation of the delineation unit U2 entirety from initial position rotation (inclination) angle delta θ z, if from speculum M1,
The position correspondence of light beam LBa (M8) on speculum M8 is relatively offset up (actually around rotation in angle delta θ z in Xt side
Dynamic central shaft AXr rotations).
Thereby, the light path (center line) of the light beam LBa-1 through speculum M1 reflections when initial position, it is single describing
After first U2 integral-rotations angle delta θ z, turn into light beam LBa-2 and tilted in XtYt faces.In addition, in Figure 10, in XtYt faces
Initial position when light beam LBa-1 center line and collector lens CD optical axis AXc the angle of the crossing, shown in Fig. 8
The center line of light beam LBa in YtZt faces is consistent with the rotation center axle AXr angle of the crossing.Therefore, it is first in rear side focus face Pcd
The convergence position BW1 of light beam LBa-1 under beginning location status, after delineation unit U2 integral-rotation angle delta θ z, as rear
The convergence position BW2 of light beam LBa-2 in the focus face Pcd of side, position is staggered (parallel offset) Δ Yh on Yt directions.According to
The geometry relational expression of Δ Yh=fy (Δ θ z) between angle delta θ z, uniquely obtains position offset Δ Yh.In addition, from
Collector lens CD towards rear side focus face Pcd light beam LBa-1 and light beam LBa-2 each center line, it is parallel with optical axis AXc.
On the other hand, as shown in Fig. 9 exaggerations, if making delineation unit U2 overall from initial position in observation in XtZt faces
The orientation state of light beam LBa-2 after anglec of rotation Δ θ z, then be incident upon speculum M1 light beam LBa center line relative to
Rotation center axle AXr is inclined upwardly in Yt side, therefore, light beam LBa-2 from the speculum M1 after anglec of rotation Δ θ z, relative to
Light beam LBa-1 (parallel with optical axis AXc) under initial position obliquely advances to Zt direction of principal axis and is incident upon collector lens
CD.Therefore, the convergence position BW1 of the light beam LBa-1 under the initial position in rear side focus face Pcd, in delineation unit U2
After integral-rotation angle delta θ z, as the convergence position BW2 of the light beam LBa-2 in rear side focus face Pcd, to Zt directions position
Stagger (parallel offset) Δ Zh.According to the geometry relational expression of the Δ Zh=fz (Δ θ z) between angle delta θ z, uniquely ask
Go out position offset Δ Zh.In addition, in the composition of this 1st embodiment, the position offset Δ Zh of Zt direction of principal axis is more than
The position offset Δ Yh of Yt direction of principal axis.Effect above is also identical for light beam LBb, is integrally revolved making delineation unit U2
After gyration Δ θ z, by collector lens CD and the position of the light beam LBb-2 in the rear side focus face Pcd that restrains, relative to
The position of light beam LBb-1 during initial position in rear side focus face Pcd, position is offset on Yt directions and Zt directions.
As described above, in this 1st embodiment, because the reflecting surface possessed such as speculum M1 is in front side focal length fa
Position collector lens CD, and can make all the time from collector lens CD project light beam LBa-2 (LBb-2) center line and light
Beam LBa-1 (LBb-1) centerline parallel.Therefore, off-set optical component SRa, SRb of configuration after collector lens CD are passed through
Gradient adjusts, so that the position offset Δ of light beam LBa, LBb caused by after delineation unit U2 integral-rotation angle delta θ z
The mode that Yh, Δ Zh are zero is modified.Thereby, two light beams LBa, LBb can be made along light path during initial position
And correctly pass through optical system afterwards.It is Δ Yh=fy (Δ θ z), Δ Zh=fz by using based on geometry relational expression
(Δ θ z) and pre-made angle delta θ z and relation table of gradient adjustment amount etc., can perform off-set optical component at high speed
SRa, SRb gradient adjustment.Thereby, even the situation of delineation unit U2 entirety turns, light beam LBa, LBb can also injected
To polygonal mirror PM reflecting surface RP appropriate location.
In addition, as long as light beam LBa, LBb from speculum M8 can be made with being penetrated on rotation center axle AXr identical axles
Enter to speculum M1, then light beam LBa, LBb will not be because delineation unit U be around rotation center axle relative to speculum M1 incident angle
AXr turns and produce change.Therefore, in delineation unit U, the reflection direction of light beam LBa, LBb through speculum M1 reflections are not
Change can be produced because of delineation unit U turn.Two light beams LBa, LBb being incident upon speculum M1 are made to be on same axle,
And it is group in a method for separating, spatially two light beams LBa, LBb in the later delineation unit U2 of speculum M1
It is right after polarizing beam splitter (polarizing beam-splitter) etc. is configured at into speculum M1 into following system
Polarization state orthogonal light beam LBa, LBb are coaxially synthesized, and it is incident upon speculum M1, and utilize light beam point
Light device etc. carries out polarization separation.
Illustrated in Fig. 9, Figure 10 by taking following situation as an example, the situation makes relative to rotation center axle AXr with fixation
Gradient and the same position that speculum M1 is incident upon relative to rotation center axle AXr symmetrical light beam LBa, LBb (collimated light beam),
Now for make relative to rotation center axle AXr on Yt directions it is symmetrical and with rotation center axle AXr in parallel with each other orientation two
The situation that bar light beam LBa, LBb (collimated light beam) are incident upon speculum M1 illustrates.Figure 11 A be from+Zt directions side turgidly
It is (anti-to be incident upon speculum when making delineation unit U2 overall around rotation center axle AXr rotating angles (first retainer) Δ θ z for display
Penetrate component) M1 light beam LBa, LBb reflection direction produce change appearance figure, Figure 11 B are the advances from light beam LBa, LBb
Observe light beam LBa, LBb in speculum M1 when making delineation unit U2 entirety rotating angle Δ θ z in direction side (+Xt directions side)
Change in location figure.
In addition, in Figure 11 A, orthogonal coordinate system XtYtZt is the orthogonal coordinate system set by delineation unit U2, because
This, the orthogonal coordinate system XtYtZt after delineation unit U2 entirety rotating angle Δ θ z turns into and inclined around Zt axles as shown in dotted line
Orthogonal coordinate system after rake angle Δ θ z.Therefore, when the initial position of the non-turns of delineation unit U2, along description line
SL2 luminous point SP main scanning direction (Yt directions) is parallel with Y-direction, but in delineation unit U2 entirety rotating angle Δ θ z feelings
During shape, along the luminous point SP for describing line SL2 of the delineation unit U2 after turn main scanning direction (Yt directions), relative to Y side
To inclination.Also, as shown in Figure 11 A, Figure 11 B, by prolong in the centre position in two light beams LBa, LBb Yt directions along Xt directions
The mode stretched is set and the line orthogonal with rotation center axle AXr is set to central shaft AXt.Central shaft AXt is equivalent to figure above
9th, the optical axis AXc of the collector lens CD in Figure 10.Further, as shown in Figure 11 A, Figure 11 B, in two reflected through speculum M1
During the situation that bar light beam LBa, LBb and central shaft AXt abreast advance, by Fig. 9 above, collector lens illustrated in fig. 10
CD is changed to the collector lens of small diameter, and is individually arranged in two respective light paths of light beam LBa, LBb.
In Figure 11 A, with speculum M1 shown in solid, represent the non-turns of delineation unit U2 initial position,
Exactly describe speculum M1 when line SL2a, SL2b state parallel with Y-direction.Also, with light beam LBa-1 shown in solid,
LBb-1, represent to reflect towards the incoming position of speculum M1 during initial position and from speculum M1 toward Xt direction of principal axis
Light beam LBa, LBb.Also, the speculum M1 ' shown in 2 chain lines, turgidly represents delineation unit U2 rotating angle Δ θ z's
The configuration of speculum M1 during state.Further, with 2 chain lines shown in light beam LBa-2, LBb-2, represent delineation unit
Light beam LBa, LBb for being reflected by speculum M1 ' during U2 rotating angle Δ θ z state.
When delineation unit U2 turns, in XtYt planes, by the anti-of speculum M1 ' light beam LBa-2, LBb-2 reflected
Direction is penetrated also to be rotated according to delineation unit U2 turn.Further, light beam LBa, LBb is incident upon speculum M1 relative position
Put (the especially position in Zt directions) and produce change because of delineation unit U2 turn, therefore, put down in vertical with central shaft AXt
In face Pv (parallel with YtZt faces), by speculum M1 ' reflection light beam LBa-2, LBb-2 each center line, as shown in Figure 11 B,
It is parallel with central shaft AXt, but position produces change around central shaft AXt.
As shown in Figure 11 B, when delineation unit U2 is initial position, the light beam LBa-1 that is reflected by speculum M1,
LBb-1, conventional ± Yt (Y) directions separate the mode configured in parallel of fixed range with central shaft AXt.If however, delineation unit U2
Rotating angle Δ θ z, then correspondingly, in a manner of depicting circular arc centered on central shaft AXt, reflected by speculum M1
Past-Zt the directions of light beam LBa-2 and the movement of+Yt directions, from the light beam LBb-2 that speculum M1 reflects toward+Zt directions and-Yt directions
It is mobile.Therefore, each light path and initial bit of two light beams LBa, LBb by each optical component after speculum M1 will be caused
Light path during configuration state is different, and can not make light beam LBa, LBb be incident upon polygonal mirror PM reflecting surface RP appropriate location.
However, in this 1st embodiment, off-set optical component SRa, SRb are provided with after speculum M1, therefore,
Can be in plane Pv, in Yt directions with being two-dimensionally adjusted on Zt directions to the respective center line of light beam LBa, LBb.Cause
This, even the situation of delineation unit U2 entirety turns, also can in off-set optical component SRa, SRb in delineation unit U2 with
Afterwards, by the respective Light path correction of light beam LBa, LBb (adjustment) be the non-turns of delineation unit U initial position when it is correct
Light path.Thereby, light beam LBa, LBb can be made to be incident upon polygonal mirror PM reflecting surface RP appropriate location.
In addition, by three corner reflector M2 and speculum M3a, M3b, make by speculum M1 light beam LBa, LBb's reflected
Interval of the center line on the Yt directions in XtYt faces expands, therefore, it is possible to shorten the speculum M1 for being incident upon delineation unit U2
Two light beams LBa, LBb each center line interval, and the light beam for being incident upon delineation unit U2 (speculum M1) can be made
LBa, LBb are close to rotation center axle AXr.Even, also can be by plane Pv as a result, the situation of delineation unit Ub turns
It is suppressed to the location variation of light beam LBa, LBb of the turn each center line smaller.
Moreover, control device 18 can be based on using aligming microscope AMa (AMa1~AMa4), AMb (AMb1~AMb4)
And the alignment mark MK (MK1~MK4) detected position, detect exposure area W inclination (gradient) or crooked (deformation).Close
In exposure area W inclination (gradient) or crooked, such as it there are the substrate transported because being wound in rotating cylinder DR1, DR2
P strip direction makes the situation of exposure area W inclination or tilts relative to central shaft AXo1, AXo2 inclination or tilt.Also,
Even the substrate P for being wound in rotating cylinder DR1, DR2 and being transported does not tilt or not crooked situation, when the pattern for forming lower floor
During layer, cause exposure area W itself crooked because substrate P tilts (toppling over) or is on the skew transported sometimes.In addition, sometimes also
The heat affecting because applying in preceding step to substrate P is had, and causes substrate P itself linear or is non-linearly deformed.
Therefore, control device 18, according to the exposure area W detected using aligming microscope AMa (AMa1~AMb4)
Entirety or a part inclination (gradient) or crooked, make delineation unit U1, U2, U5, U6 around rotation center axle AXr turns.Also,
Control device 18, according to the exposure area W detected using aligming microscope AMb (AMb1~AMb4) entirety or a part
Inclination (gradient) or crooked, make delineation unit U3, U4 around rotation center axle AXr turns.Now, control device 18, also basis
Delineation unit U (U1~U6) swirl angle, driving off-set optical component SRa, SRb.
Specifically, such as the inclination of the substrate P due to being wound in rotating cylinder DR1, DR2 and being transported is (toppling over) or crooked,
Therefore need to correspond to inclination (toppling over), the predetermined pattern that is crooked and making description also inclination or tilt.Also, as other examples
Son, when predetermined pattern being overlapped in lower pattern again and described, it is necessary to the entirety corresponding to lower pattern or one
Partial inclination or tilt and make the predetermined pattern of description also inclination or tilt.Therefore, in order that the predetermined pattern described tilts
Or it is crooked, control device 18 makes delineation unit U (U1~U6) individually turn, so that describing line SLa, SLb relative to Y-direction
Tilt.
In this way, in the 1st embodiment, delineation unit U makes light beam LBa, LBb luminous point using a polygonal mirror PM
SPa, SPb are along line SLa, SLb scanning is described, so that it is identical on sub-scanning direction in substrate P to describe line SLa, SLb
Position, and the mode separated on main scanning direction, configure the 1st projection optics system 24 and the 2nd projection optics system 26.Enter one
Step ground, two positions described between line SLa, SLb that delineation unit U rotation center axle is set on main scanning direction,
Preferably it is set in the position described the respective point midway of line SLa, SLb and halved on main scanning direction.
Thereby, even if delineation unit U turns, the luminous point by delineation unit U scanning light beams LBa, LBb can also be suppressed
Position skew increases of SPa, SPb description line SLa, the SLb in substrate P, and can be simply to description line SLa, SLb gradient
It is adjusted.On the contrary, in a manner of being in same position on main scanning direction and be spaced apart on sub-scanning direction
It is provided with the Japanese Unexamined Patent Publication 2004-117865 publications of multi-strip scanning line, is swept in making laser scanning device turn to a plurality of
When retouching the situation that the gradient of line is adjusted, scan line can be depicted centered on the rotation center position of laser scanning device
The mode of circular arc moves.Therefore, scan line is further away from rotation center position, then illuminated as caused by laser scanning device turn
The position skew of scan line on body is bigger.That is, in this 1st embodiment, due to be in phase on sub-scanning direction
Same position and the mode separated on main scanning direction, which are set, describes line SLa, SLb, therefore can not make by delineation unit U's
The position skew of description line SLa, SLb caused by turn in substrate P excessively increase.Also, describe line SL due to that can shorten
Sweep length, therefore can stably maintain to describe the configuration precision or optical property of the scan line needed for super detailed pattern.
It is identical so that each sweep length for describing line SLa, SLb to be set as, and with sweep length on main scanning direction
Line SLa, SLb mode are described in the following setting that is spaced apart, and configure the 1st projection optics system 24 and the 2nd projection optics system
26.Thereby, each delineation unit U description line SLa, SLb by multiple delineation unit U, can be made to connect on main scanning direction, and
And the position for describing line SLa, SLb skew increase of each delineation unit U in substrate P can be suppressed, and can be simply to describing
Line SLa, SLb gradient are adjusted.
Delineation unit U rotation center axle AXr, it is the description line relative to substrate P vertically through connection delineation unit U
The central point of the line segment at the respective midpoint of SLa, SLb.Thereby, description line SLa, SLb of the turn with delineation unit U can be made
Position skew be Min., and can simply to description line SLa, SLb gradient be adjusted.
Light beam LBa, LBb from light supply apparatus 14, by relative to rotation center axle AXr it is symmetrical in a manner of and be incident upon and retouch
Unit U is painted, therefore, even delineation unit U can also suppress by delineation unit U around the situation of rotation center axle AXr turns
The position skew of interior light beam LBa, LBb each center line becomes big.
Delineation unit U possesses speculum M1 in the position that rotation center axle AXr passes through, light beams of the speculum M1 to injection
LBa, LBb are reflected and are directed to the 1st guide-lighting 20 and the 2nd guide-lighting optical system 22 of optical system.Thereby, even describing single
The situation of first U turns, because light beam LBa, LBb from light supply apparatus 14 in being incident upon speculum M1 first in delineation unit U,
Therefore light beam LBa, LBb luminous point SPa, SPb can be projected to and described on line SLa, SLb.
1st guide-lighting optical system 20 possesses off-set optical component SRa, and off-set optical component SRa makes anti-by speculum M1
The light beam LBa penetrated position is offset in the plane that the direction of advance with light beam LBa is intersected, and the 2nd guide-lighting optical system 22 possesses
Off-set optical component SRb, off-set optical component SRb make the position by the speculum M1 light beam LBb reflected with light beam LBb's
Offset in the plane that direction of advance is intersected.Thereby, even the situation of delineation unit U turns, also can lead to light beam LBa, LBb
The appropriate light path crossed in delineation unit U and be incident upon polygonal mirror PM.Therefore, it is possible to suppress to make light because of delineation unit U turn
Point SPa, SPb do not expose to the plane of illumination of substrate P or luminous point SPa, SPb are projected to the description line after deviateing gradient adjustment
The problems such as SLa, SLb position, produces.
Multiple delineation unit U, it is so that each bar describes line SLa, SLb along main scanning direction (width of substrate P)
The mode of (engagement) of connecting configures.Thereby, can make to describe scope expansion on the width of substrate P.
So that the delineation unit U of given amount in multiple delineation unit U description line SLa, SLb are located at rotating cylinder DR1
The substrate P that is supported of outer peripheral face on, and description line SLa, SLb of remaining delineation unit is located at rotating cylinder DR2 periphery
The mode in substrate P that face is supported, configure multiple delineation unit U.Thereby, without the delineation unit U of whole is configured at into one
Individual rotating cylinder DR, improve the delineation unit U configuration free degree.In addition, the rotating cylinder DR of more than 3 also can be set, for 3
The more than one delineation unit U of each self-configurings of rotating cylinder DR above.
Make description line SLa, SLb (delineation unit) turn (inclination), so as to should be depicted on the plane of illumination of substrate P both
Determine pattern inclination.Thereby, the corresponding description of the shape of the exposure area W with the conveyance state of substrate P or substrate P can be made
The shape of predetermined pattern produces change.Also, it is preformed predetermined pattern ought to be overlapped in into institute on the plane of illumination of substrate P again
Entirety or the gradient of a part that can be based on lower pattern when in lower pattern to be described or the survey of nonlinear deformation
Result is measured, makes description line SLa, SLb turn (inclination).Thereby, improved relative to the overlapping accuracy for the pattern for being formed at lower floor.
In addition, description line SLa, SLb of each delineation unit U (U1~U6) are configured to the identical bits on sub-scanning direction
Put, but the diverse location being also configured on sub-scanning direction.In a word, if describe line SLa, SLb on main scanning direction that
This is separated.Even the situation, rotation center axle AXr also the plane of illumination relative to substrate P vertically through being set in
Describe the point between line SLa midpoint and description line SLb midpoint or each midpoints of the line SLa with describing line SLb is described in connection
Set central point on line segment, therefore, it is possible to make the position for describing line SLa, SLb skew with delineation unit U turn
Reduce.
Further, in this 1st embodiment, using a polygonal mirror PM carry out respectively along two describe line SLa,
SLb luminous point SPa, SPb main scanning, therefore, even as shown in Fig. 2 exposure region in the substrate P big with Y-direction width
Domain W accordingly sets 12 and describes line SL1a~SL6a, SL1b~SL6b situations, as long as polygonal mirror PM quantity also half
I.e. 6.Therefore, with polygonal mirror PM high speed rotation (such as 20,000 more than rpm), (wind is made an uproar for caused vibration or noise
Sound) also it is suppressed.
[variation of the 1st embodiment]
Above-mentioned 1st embodiment, can also there is variation as described below.
(variation 1) Figure 12 is to utilize polygonal mirror in the variation 1 of above-mentioned 1st embodiment from the side of+Zt directions
Figure during PM optical beam scanning system, figure when Figure 13 is Figure 12 optical beam scanning system from the side of+Xt directions.In addition, pin
Pair mark same symbol and the description thereof will be omitted is formed with above-mentioned 1st embodiment identical, only pair with above-mentioned 1st embodiment not
Same part illustrates.The polygonal mirror PM of this variation 1, as also shown in Figure 12 for 8 reflecting surface RPa~reflectings surface
RPh octagon, positioned at clipping rotary shaft AXp and two reflectings surface (such as reflecting surface RPa and the reflecting surface of symmetrical position
RPe, reflecting surface RPc and reflecting surface RPg etc.) it is parallel to each other.
As shown in figure 13, the light beam that speculum M4a will be advanced by beam forming optics BFa and past+Xt directions
LBa, past-Zt directions are reflected.The light beam LBa reflected by the past-Zt directions of speculum M4a, is set to by bus
After the 1st cylindrical lens CY1a parallel with Xt axles, speculum M5a is incident upon.Speculum M5a is by the past+Yt of light beam LBa of injection
Direction is reflected and is directed to polygonal mirror PM the 1st reflecting surface RPc.As shown in figure 12, polygonal mirror PM is by the light beam LBa of injection
Reflected toward speculum M5a sides (- Yt directions side) and be directed to speculum M6a.As described above described in the 1st embodiment, instead
Mirror M6a is penetrated to reflect the past-Xt directions of the light beam Lba of injection and be directed to f θ lens FTa.Similarly, speculum M4b will lead to
The light beam LBb for crossing beam forming optics BFb and advancing toward +X direction, past-Zt directions are reflected.Pass through speculum M4b
And the light beam LBb of past-Zt directions reflection, after the 1st cylindrical lens CY1b parallel with Xt axles is set to by bus, penetrate
Enter to speculum M5b.Past-Yt the directions of the light beam LBb of injection are reflected and are directed to the 2nd of polygonal mirror PM by speculum M5b
Reflecting surface RPg.Polygonal mirror PM, the light beam LBb of injection is reflected toward speculum M5b sides (+Yt directions side) and is directed to anti-
Penetrate mirror M6b.As described above described in the 1st embodiment, the past-Xt directions of the light beam LBb of injection are reflected and led by speculum M6b
Lead to f θ lens FTb.Speculum M6a, M6b, the same position being configured on Zt directions.Moreover, speculum M5a configurations are more anti-
Penetrate mirror M6a and more lean on-Zt directions side, speculum M5b configurations are more leaning on+Zt directions side compared with speculum M6b.Also, speculum M5a, M5b
The roughly the same position being arranged at speculum M6a, M6b on Xt directions.It is, speculum M5a, M5b, speculum M6a,
M6b is set along Yt directions.
Substitute the speculum M4 of above-mentioned 1st embodiment and above-mentioned speculum M4a, M4b are set, such speculum M4a,
M4b has the function equal with speculum M4.Also, substitute the 1st cylindrical lens CY1 of above-mentioned 1st embodiment and the 1st post is set
Face lens CY1a, CY1b, such 1st cylindrical lens CY1a, CY1b have the function equal with the 1st cylindrical lens CY1.Also
It is cylindrical lens CY1a, CY1b, in the non-scan direction orthogonal with as caused by polygonal mirror PM scanning direction (direction of rotation)
On (Zt directions), light beam LBa, LBb of injection is set to converge on polygonal mirror PM reflecting surface RP.Similarly, the above-mentioned 1st is substituted in fact
Apply the speculum M5 of form and speculum M5a, M5b are set, such speculum M5a, M5b have the work(equal with speculum M5
Energy.In this way, the above-mentioned 1st is individually provided with the 1st guide-lighting 20 and the 2nd guide-lighting optical system 22 of optical system is each implements shape
The speculum M4 of state, the 1st cylindrical lens CY1 and speculum M5 and winner, turn into speculum M4a, M4b, the 1st cylindrical lens
CY1a, CY1b and speculum M5a, M5b.
In addition, the Yt directions distance of light beam LBa, LBb for being incident upon speculum M4a, M4b in XtYt faces, by Fig. 6
Three shown corner reflector M2 and speculum M3a, M3b, and in a manner of the size (diameter) in the Yt directions more than polygonal mirror PM
Expand.
In this variation 1, as shown in figure 13, so that polygonal mirror PM rotary shaft AXp exists from the state parallel with Zt axles
Yt side is inclined upwardly fixed angle θ y (discontented 45 °) mode, is arranged obliquely polygonal mirror PM entirety.Therefore, polygonal mirror PM's is each
In reflecting surface RP, reflecting surface RPc, RPg positioned at position opposite with speculum M6a, M6b respectively in rotary course, relatively
It is inclined upwardly in Zt axles in Yt side fixed angle θ y.Figure 12, Figure 13 show such a polygonal mirror PM reflecting surface RPc, with clipping rotation
Rotating shaft AXp and it is relative with reflecting surface RPc to reflecting surface RPg parallel with Xt axles moments state.Now, from rotary shaft
Xt directions observation orthogonal AXp, polygonal mirror PM reflecting surface RPc, RPg light beam LBa, LBb are incident upon, relative to each reflecting surface
RPc, RPg are obliquely injected with incidence angle θ y, therefore, it is possible to make the reflection position by light beam LBa, LBb caused by polygonal mirror PM
The identical height and position being set on Zt directions.That is, speculum M6a, M6b respective Zt directions position can be made identical.Enter
One step, light beam LBa, LBb that can be by being reflected by polygonal mirror PM and towards speculum M6a, M6b each center line (advance side
To) be set as it is parallel with XtYt faces.Thereby, the Zt directions of the 1st projection optics system 24 and the 2nd projection optics system 26 can be made
Position be same position, easily description line SLa, SLb on the plane of illumination of substrate P are configured on straight line.
In addition, as shown in figure 13, when being configured to make polygonal mirror PM tilt angle theta y, make light beam LBa, LBb respectively since Yt side
To each for parallel to each other two reflecting surface RPc, the RPg for being projected to polygonal mirror PM, and make the light beam LBa on reflecting surface RPc
Launching position when highly being alignd with the Zt directions of the launching position of the light beam LBb on reflecting surface RPg, if increase tilt angle theta
Y, then it must also increase the height dimension of reflecting surface RPa~reflecting surface RPh on rotary shaft AXp directions.In the feelings of this variation 1
During shape, if increase polygonal mirror PM tilt angle theta y, though it is easily configured speculum M5a, M5b, M6a, M6b etc., rotary shaft
Reflecting surface RPa~reflecting surface RPh's of polygonal mirror PM on AXp directions becomes large-sized, and increases polygonal mirror PM quality.Cause
This, when the quality for paying the utmost attention to reduce polygonal mirror PM is to realize the situation of rotation high speed, also can make reflection on Zt directions
The launching position of light beam LBa on the RPc of face is different from the launching position of the light beam LBb on reflecting surface RPg.
Also, as shown in figure 13, from the Xt direction orthogonal with rotary shaft AXp, make to be incident upon contributing to for polygonal mirror PM
Reflecting surface RPc, RPg of description light beam LBa, LBb, are obliquely injected in YtZt faces relative to reflecting surface RPc, RPg, by
This, can make light beam LBa, LBb incident direction and reflection direction different on rotary shaft AXp directions or Zt directions.Thereby, in
From rotary shaft AXp directions or Zt directions during polygonal mirror PM situation (Figure 12 state), can make each light beam LBa, LBb with
The mode being substantially orthogonal is incident upon reflecting surface RPc, the RPg for helping to describe.That is, in the situation observed in XtYt faces
When, can by by speculum M5a, M5b reflect and towards polygonal mirror PM reflecting surface RPc, RPg light beam LBa, LBb it is each in
Heart line AXs extended line, it is set as by polygonal mirror PM rotary shaft AXp.
By forming as described above, when when being observed in XtYt faces, by polygonal mirror PM help to describe it is anti-
Light beam LBa, LBb of face RPc, RPg each reflection are penetrated, centered on center line AXs and in fixed angular range, theta s partially
To in the state of scanning, the 1st projection optics system 24 (specifically f θ lens FTa) and the 2nd projection optics system are led to
Unite 26 (specifically f θ lens FTb).Therefore, can be by even when the situation from rotary shaft AXp directions or Zt directions
Light beam LBa, LBb of the continuous pulse type for being incident upon a reflecting surface RP (RPc, RPg) effective angular range (θ s) be divided into
Impartial angular range (± θ s/2) centered on center line AXs, with single pass along describe line SLa, SLb luminous point SPa,
SPb.Thereby, spy (aberration characteristic, is focused on light beam LBa, LBb of polygonal mirror PM scannings or luminous point SPa, SPb optical property
Property, luminous point quality etc.) or constant speed improve, improve scanning accuracy.
(variation 2) Figure 14 is to utilize polygonal mirror in the variation 2 of above-mentioned 1st embodiment from the side of+Zt directions
Figure during PMa optical beam scanning system, figure when Figure 15 is Figure 14 optical beam scanning system from the side of+Xt directions.In addition, pin
Pair mark same-sign is formed with the identical of variation 1 of above-mentioned 1st embodiment, only different piece is illustrated.In addition,
The same position that speculum M5a, M5b are on Zt directions, and configuration is more leaning on+Zt directions side compared with speculum M6a, M6b.Also,
Speculum M5a, M5b are arranged at position roughly the same on Xt directions with speculum M6a, M6b.
In this variation 2, make the rotary shaft AXp and Zt of the polygonal mirror PMa with 8 reflecting surface RPa~reflecting surface RPh
Axle is parallel, and polygonal mirror PMa each reflecting surface RPa~reflecting surface is formed in a manner of relative to rotary shaft AXp tilt angle thetas y
RPh.Figure 14, Figure 15 show such a polygonal mirror PMa the 1st reflecting surface RPc, relative with reflecting surface RPc with clipping rotary shaft AXp
To the 2nd reflecting surface RPg parallel with Xt axles moments state.Moreover, as shown in figure 15, from orthogonal with rotary shaft AXp
Xt directions are observed, if relative to the reflecting surface RPc of reflecting surface RPc, RPg from oblique upper (+Zt directions) projection towards polygonal mirror PMa
Light beam LBa, towards reflecting surface RPg light beam LBb each, then can be by light beam LBa, LBb on each reflecting surface RPc, RPg
Reflection position be set as in the face parallel with XtYt faces, i.e. identical height and position on Zt directions.It is, Zt can be made
The position of light beam LBa, LBb that polygonal mirror PMa on direction is reflected center line is identical.Thereby, with above-mentioned 1st embodiment
Variation 1 similarly, the position that can make the Zt directions of the 1st projection optics system 24 and the 2nd projection optics system 26 is phase
Same position, and easily description line SLa, SLb on the plane of illumination of substrate P are configured on straight line.
Also, from Xt directions, make to be incident upon in polygonal mirror PMa reflecting surface RPa~reflecting surface RPh and clip rotary shaft
AXp and it is relative to two reflecting surface RP (such as RPc and RPg) each light beam LBa, LBb, relative to reflecting surface RP in Z
Obliquely injected on direction, therefore, if being observed in YtZt faces, as shown in figure 15, entering for light beam LBa, LBb can be made
Penetrate angle direction and separate the θ y of angle 2 in rotary shaft AXp directions (Zt directions) with reflection angle direction.Thereby, in from rotary shaft AXp
During direction (Zt directions) observation polygonal mirror PMa situation, as shown in figure 14, the respective incident direction of light beam LBa, LBb can be made
It is equidirectional with reflection direction.As a result, light beam LBa, the LBb from speculum M5a, M5b reflected by polygonal mirror PMa is penetrated
Enter to speculum M6a, M6b without being back to speculum M5a, M5b.
This variation 2 is also in the same manner as the variation 1 of Figure 12 above, by the polygonal mirror PMa reflection for helping to describe
Light beam LBa, LBb of face RPc, RPg each reflection, are inclined to centered on center line AXs and in fixed angular range, theta s
In the state of scanning, the 1st projection optics system 24 (specifically f θ lens FTa) and the 2nd projection optics system 26 are directed to
(specifically f θ lens FTb).Therefore, it is possible to will continuously be incident upon the light of the pulse type of a reflecting surface RP (RPc, RPg)
Beam LBa, LBb effective angular range (θ s) are divided into the impartial angular range (± θ s/2) centered on center line AXs, with
Luminous point of the single pass along description line SLa, SLb.Thereby, with polygonal mirror PMa scanning light beam LBa, LBb or luminous point SPa,
SPb optical property (aberration characteristic, focus characteristics, luminous point quality etc.) or constant speed improves, and improves scanning accuracy.
(variation 3) makes polygonal mirror PM rotary shaft AXp relative to Zt axles in the variation 1 of above-mentioned 1st embodiment
In Yz directions inclination angle θ y, in above-mentioned variation 2, make polygonal mirror PMa rotary shaft AXp parallel with Zt axles, and with phase
Polygonal mirror PMa each reflecting surface RPa~reflecting surface RPh is formed for Zt axle tilt angle thetas y mode.But polygonal mirror PM
Configuration or each reflecting surface RP (RPa~RPh) composition are not limited to above-mentioned variation 1, variation 2.For example, also it can be used such as
The polygonal mirror PM of composition as above-mentioned 1st embodiment, make light beam LB relative to each reflecting surface RP (with Zt axles and rotary shaft
AXp is parallel) vertical face (parallel with XtYt faces) injects from oblique upper (or lower section).Thereby, in the rotary shaft from polygonal mirror PM
During AXp directions observation polygonal mirror PM situation, in the state that each reflecting surface RP is configured in a manner of light beam LBa, LBb are vertically injected
Under, light beam LBa, LBb incident direction can be made identical with reflection direction, and can make light beam LBa, LBb incident direction with
Reflection direction staggers in rotary shaft AXp (Zt axles) direction.Therefore, polygonal mirror PM can make to be reflected by two reflecting surface RP each
Light beam LBa, LBb, centered on center line AXs and fixed angular range, theta s (angle centered on center line AXs ±
θ s/2 distribution) in be inclined to, and be directed to the 1st projection optics system 24 (specifically f θ lens FTa) and the 2nd projection
Optical system 26 (specifically f θ lens FTb).Even in this way, the situation of variation 3, also with above-mentioned 1st embodiment
Variation 1, variation 2 similarly, with polygonal mirror PM scanning light beam LBa, LBb or luminous point SPa, SPb optical property (as
Poor characteristic, focus characteristics, luminous point quality etc.) or constant speed raising, improve scanning accuracy.
(variation 4) also polarizing beam splitter PBS (PBSa, PBSb) can be used to be used as it as shown in Figure 16 A, Figure 16 B
He is formed, and other compositions use the polygonal mirror PM of octagon, and such as each of 1~variation of variation 3 above, make
It is incident upon the reflecting surface RP for the polygonal mirror PM for helping to describe light beam LBa, LBb incident direction and its reflection direction, Yu
It is equidirectional when being observed in XtYt faces, the polygonal mirror PM of above-mentioned octagon is such as above-mentioned variation 3, rotary shaft AXp
It is parallel with Zt axles, and each reflecting surface RPa~reflecting surface RPh is also parallel with rotary shaft AXp.Figure 16 A be from the side of+Zt directions on
State in the variation 4 of the 1st embodiment using polygonal mirror PM optical beam scanning system when figure, Figure 16 B are from-Xt directions side
Observe figure during Figure 16 A optical beam scanning system.In addition, pair with the 1st embodiment above, 1~variation of variation 3 it is each
Illustrated component identical element numeral same-sign, is only illustrated to different piece in person.
As shown in Figure 16 A, Figure 16 B, in this variation 4, between polygonal mirror PM and speculum M6a, light beam is configured
The polarizing beam splitter PBSa of the incident exit facet rectangular-shape parallel with each in XtYt faces, XtZt faces, in polygonal mirror PM
Between speculum M6b, the polarization of the incident exit facet rectangular-shape parallel with each in XtYt faces, XtZt faces of light beam is configured
Beam splitter PBSb.The respective polarised light parting surface of polarizing beam splitter PBSa, PBSb, be set as relative to XtYt faces with
XtZt faces tilt 45 °.Further, 1/4 wavelength plate QPa is set between polarizing beam splitter PBSa and polygonal mirror PM,
1/4 wavelength plate QPb is set between polarizing beam splitter PBSb and polygonal mirror PM.
In being formed more than, using optical element (acousto-optic varying element) AOMa (reference picture 5, Fig. 7) by after modulation
Light beam LBa, as shown in fig 16b, by the bus 1st cylindrical lens CY1a parallel with Xt axles and in convergent on Yt directions
Under state, abreast polarizing beam splitter PBSa is incident upon from+Zt directions side with Zt axles.Light beam LBa is set to turn into straight line S-polarization
After light, the most of polarised light parting surfaces by polarizing beam splitter PBSa of light beam LBa reflect, by 1/4 wavelength plate QPa and
As circularly polarized light, and towards polygonal mirror PM.When polygonal mirror PM rotary angle position, such as shown in Figure 16 A, in from having
When helping in the range of the angle ± θ s/2 that the reflecting surface PRc states parallel with XtZt faces of light beam LBa description rises, lead to
The light beam LBa for crossing 1/4 wavelength plate QPa is reflected by reflecting surface PRc, turns into straight line P polarization light again by 1/4 wavelength plate QPa,
And it is back to polarizing beam splitter PBSa.Therefore, by the reflecting surface PRc light beam LBa reflected major part, light beam is passed through
Optical splitter PBSa polarised light parting surface and towards speculum M6a.
Similarly, using optical element (acousto-optic varying element) AOMb (reference picture 5, Fig. 7) by the light beam after modulation
LBb, as shown in fig 16b, by the bus 1st cylindrical lens CY1b parallel with Xt axles and in convergent state on Yt directions
Under, abreast it is incident upon polarizing beam splitter PBSb from+Zt directions side with Zt axles.Make light beam LBb turn into straight line S-polarization light it
Afterwards, the most of polarised light parting surfaces by polarizing beam splitter PBSb of light beam LBb reflect, and are turned into by 1/4 wavelength plate QPb
Circularly polarized light, and towards polygonal mirror PM.When polygonal mirror PM rotary angle position as shown in Figure 16 A, in from contributing to light beam
When in the range of the angle ± θ s/2 that state parallel with XtZt faces one reflecting surface PRg of LBb description rises, pass through 1/4 ripple
Long slab QPb light beam LBb is reflected by reflecting surface PRg, turns into straight line P polarization light again by 1/4 wavelength plate QPb, and return
To polarizing beam splitter PBSb.Therefore, by the reflecting surface PRg light beam LBb reflected major part, polarizing beam splitter is passed through
PBSb polarised light parting surface and towards speculum M6b.
By forming as described above, the light beam LBa that is reflected by speculum M6a, the light beam LBb reflected by speculum M6b
In each leisure face parallel with XtYt faces, scanned in angular range, theta s.Also, configure as follows：Institute after speculum M6a
The optical axis AXfa of 1st projection optics system 24 (specifically f θ lens FTa) of configuration extended line, passes through speculum M6a
90-degree bent and intersect with polygonal mirror PM rotary shaft AXp, the 2nd projection optics system 26 (tool configured after speculum M6b
Be f θ lens FTb for body) optical axis AXfb extended line, by speculum M6b 90-degree bents and the rotary shaft with polygonal mirror PM
AXp intersects.Therefore, in this variation 4, polygonal mirror PM can make each reflection by two reflectings surface (such as RPc and RPg)
Light beam LBa, LBb, centered on optical axis AXfa, AXfb and in fixed angular range, theta s (centered on optical axis AXfa, AXfb
Angle ± θ s/2 distribution) in be inclined to, and be directed to the 1st projection optics system 24 (f θ lens FTa) and the 2nd projection light
System 26 (f θ lens FTb).Even in this way, the situation of variation 4, light beam LBa, the LBb or light scanned with polygonal mirror PM
Point SPa, SPb optical property (aberration characteristic, focus characteristics, luminous point quality etc.) or constant speed improve, and improve scanning accuracy.
Also, in the same manner as the 1st embodiment and its 1~variation of variation 3 above, in this variation 4, pass through a polygonal mirror
The PM respective deviation of two light beams LBa, LBb scans generated description line SLa, SLb, can also be set as following length example
Such as 30mm~80mm or so, the length is can be with the fine degree (minimum feature) or luminous point SPa, SPb with the pattern that should describe
The corresponding precision of effective dimensions (diameter) and keep linear length.
In addition, in variation 4 more than, light beam LBa, LBb of scanning are inclined to polygonal mirror PM, as shown in Figure 16 A,
In the effective angle range Theta s corresponding with description line SLa, SLb length, polarizing beam splitter PBSa, PBSb are incident upon.
Therefore, polarizing beam splitter PBSa, PBSb P polarization light and the separation degree of S-polarization light are extinction ratio, are set to maximum
Reach more than the angular range, theta s.As one of polarizing beam splitter PBSa, PBSb as described above, separated in polarised light
Lamination has hafnium oxide (HfO2) film to be had revealed that with the polarizing beam splitter that silica (SiO2) film forms in the world repeatedly in face
No. 2014/073535 publication is disclosed.
[the 2nd embodiment]
Figure 17 is the figure of the composition for the part for showing the delineation unit Ua in the 2nd embodiment.Each delineation unit Ua tools
There is identical composition, therefore, in this 2nd embodiment, also with along describing line SL2a, SL2b upper scanning point SPa, SPb
Illustrated exemplified by delineation unit Ua2.In addition, for forming mark same-sign with above-mentioned 1st embodiment identical.Also,
Only a pair part different from above-mentioned 1st embodiment illustrates.
In the 2nd embodiment, polygonal mirror PM is set in a manner of rotary shaft AXp is extended along Xt direction of principal axis, and f θ are saturating
Mirror FTa, FTb are set in a manner of its optical axis AXfa, AXfb is extended along Zt direction of principal axis.The light beam that past-Zt direction of principal axis advances
LBa, LBb be incident upon in polygonal mirror PM 8 reflecting surface RP in two reflectings surface of shape angle in 90 ° each other in YtZt faces
RP (being reflecting surface RPb, RPh in Figure 17).Polygonal mirror PM the 1st reflecting surface RP (being herein RPh), by what is injected from the 1st direction
Light beam LBa past-Yt directions side is reflected and is directed to speculum M6a.From the light beam Lba that speculum M6a reflects toward-Zt directions
Advance, after by f θ lens FTa and cylindrical lens CY2a, be incident upon substrate P.Pass through the f θ lens FTa and cylindrical lens
CY2a, the light beam LBa of substrate P is incident upon in turning into luminous point SPa on the plane of illumination of substrate P.Also, polygonal mirror PM the 2nd reflection
Face RP (being herein RPb), it will be reflected simultaneously from the light beam LBb past+Yt directions side of the 2nd direction injection different from the 1st direction
It is directed to speculum M6b.Advanced from the light beam LBb that speculum M6b reflects toward-Zt directions, saturating by f θ lens FTb and cylinder
After mirror CY2b, substrate P is incident upon.By f the θ lens FTb and cylindrical lens CY2b, the light beam LBb of substrate P is incident upon in base
Turn into luminous point SPb on plate P plane of illumination.Luminous point SPa, the SPb being projected on the plane of illumination of substrate P, pass through polygonal mirror PM
Rotation and in describe the upper constant-speed scanning of line SL2a, SL2b.
In this way, set polygonal mirror PM in a manner of rotary shaft AXp extends along Xt direction of principal axis, and with its optical axis AXfa,
The mode that AXfb extends along Zt direction of principal axis sets f θ lens FTa, FTb, it is therefore not necessary to setting as the 1st embodiment as described above
Speculum M7a, M7b, light beam LBa, LBb that speculum M7a, M7b will be advanced by f θ lens FTa, FTb past-Xt directions
Reflected toward -Z direction.Such a composition can also obtain and above-mentioned 1st embodiment identical effect.
In addition, in this 2nd embodiment, speculum M6a, f θ lens FTa and cylindrical lens CY2a are as the 1st projection light
System 24a and play function, speculum M6b, f θ lens FTb and cylindrical lens CY2b as the 2nd projection optics system 26a and
Play function.The delineation unit Ua of this 2nd embodiment also can pass through company around rotation center axle AXr turns, rotation center axle AXr
The central point of the line segment at midpoint of the midpoint for describing line SL2a with describing line SL2b is connect, and is hung down relative to the plane of illumination of substrate P
Directly pass through.
Also, in this 2nd embodiment, though without special diagram, the 1st guide-lighting optics of above-mentioned 1st embodiment of substitution
20 and the 2nd guide-lighting optical system 22 of system, so that light beam LBa, LBb from light supply apparatus 14 advance and are incident upon toward -Z direction
Polygonal mirror PM mode, configure the 1st guide-lighting optical system and the 2nd guide-lighting optics that light beam LBa, LBb are directed to polygonal mirror PM
System.
As described above described in the variation 3 of the 1st embodiment, light beam LB is set to be handed over relative to reflecting surface RP direction of rotation
The direction (direction of polygonal mirror PM rotary shaft AXp extensions) of fork is obliquely incident upon reflecting surface RP, thereby, can also make light beam
LBa, LBb incident direction and reflection direction stagger in rotary shaft AXp directions.Therefore, it is possible to obtain and above-mentioned 1st embodiment
The identical effect of variation 3.
Also, also can be as described above described in the variation 1 of the 1st embodiment, from the direction orthogonal with rotary shaft AXp
During polygonal mirror PM situation, polygonal mirror PM rotary shaft AXp is set to be tilted relative to Xt directions.Also, the above-mentioned 1st also can be used to implement
Illustrated polygonal mirror PMa in the variation 2 of form.That is, it can also make the rotary shaft AXp and Xt axles of the polygonal mirror PM in Figure 17
It is parallel, and by from the state parallel with rotary shaft AXp it is as shown in figure 15 as in a manner of tilt angle theta y, form each of polygonal mirror PM
Reflecting surface RP (RPa~RPh).Thereby, from the direction orthogonal with rotary shaft AXp, by making to be incident upon each of polygonal mirror PM
Reflecting surface RP (RPa~RPh) light beam LBa, LBb obliquely injects relative to each reflecting surface RP, and can obtain and the above-mentioned 1st
Variation 1, the identical effect of variation 2 of embodiment.
[the 3rd embodiment]
Figure 18 is the delineation unit Ub of the 3rd embodiment from-Yt (- Y) direction side pie graph, Figure 19 be from+
For the observation of Xt directions side from the figure of the delineation unit Ub of polygonal mirror PMb direction+Zt sides composition, Figure 20 is from the side of+Zt directions
From the figure of the delineation unit Ub of polygonal mirror PMb directions-Zt directions side composition.In addition, for identical with above-mentioned 1st embodiment
Composition mark same-sign.Also, only a pair part different from above-mentioned 1st embodiment illustrates.
As shown in figure 19, delineation unit Ub possesses crest line three corner reflectors (prism square) M10 parallel with Xt axles, speculum
M11a, M11b, off-set optical component SRa, SRb, bus the cylindrical lens CY1a, CY1b parallel with Xt axles, 8 reflecting surface RP
Polygonal mirror PMb, speculum M12a, M12b, speculum M13a, M13b, speculum M14a, M14b, f θ lens FTa, FTb, reflection
Mirror M15a, M15b and bus cylindrical lens CY2a, CY2b parallel with Yt axles optical system.For on two light beams
The optical system that LBa, LBb are arranged in pairs, in rear filling a, b of reference marks.
As shown in figure 19, two light beam LBa, LBb (being collimated light beam) from light supply apparatus 14, clip rotation center
Axle AXr and be arranged in parallel and past-Zt directions advance, be incident upon the crest line for the three corner reflector M10 for clipping delineation unit Ub
Different reflecting surface M10a, M10b.Light beam LBa, LBb with relative to the rotation center axle AXr parallel with Zt axles in Yt directions
Upper symmetrical mode, it is incident upon delineation unit Ub three corner reflector M10 each reflecting surface M10a, M10b.Three corner reflector M10
Reflecting surface M10a, the past-Yt directions of light beam LBa are reflected and are directed to speculum M11a, three corner reflector M10 reflection
Face M10b, the past+Yt directions of light beam LBb are reflected and are directed to speculum M11b.The light beam Lba reflected by speculum M11a
Past-Zt directions are advanced, and after by off-set optical component SRa and cylindrical lens CY1a, are incident upon polygonal mirror PMb reflecting surface
RP (such as reflecting surface RPa).The light beam LBb reflected by speculum M11b, past-Zt directions are advanced, and are passing through off-set optical component
After SRb and cylindrical lens CY1b, polygonal mirror PMb reflecting surface RP (such as reflecting surface RPe) is incident upon.Polygonal mirror PMb's is anti-
Face RPa and reflecting surface RPe are penetrated, positioned at the rotary shaft AXp for clipping polygonal mirror PMb and symmetrical position.
In this 3rd embodiment, as shown in figure 20, polygonal mirror PMb rotary shaft AXp is set as and rotation center axle
AXr is coaxial.Using three corner reflector M10 and speculum M11a, M11b (reference picture 19), make the light beam for being incident upon polygonal mirror PMb
Yt directions distance between LBa, LBb each center line expands.Thereby, can shorten be incident upon delineation unit Ub light beam LBa,
Distance between LBb optical axis, and light beam LBa, the LBb that can make to be incident upon delineation unit Ub (three corner reflector M10) are close to rotation
Dynamic central shaft AXr.As a result, even the situation of delineation unit Ub entirety turns, can also suppress the light beam with the turn
The position of LBa, LBb each center line is in significantly generation change in delineation unit Ub.Adjoint delineation unit Ub turn
The change in location of light beam LBa, LBb each center line, by the off-set optical component that function is played in the same manner as the 1st embodiment
SRa, SRb are corrected.
In addition, three corner reflector M10 reflecting surface M10a, speculum M11a, off-set optical component SRa and cylindrical lens
CY1a is sent out as the 1st guide-lighting optical system 20b for guiding the 1st reflecting surface RP (RPa) of the light beam LBa towards polygonal mirror PMb
Wave function.Also, three corner reflector M10 reflecting surface M10b, speculum M11b, off-set optical component SRb and cylindrical lens CY1b
As the 2nd guide-lighting light for guiding from 1st reflecting surface different 2nd reflecting surface RPs (RPe) of the light beam LBb towards polygonal mirror PMb
System 22b and play function.In addition, three corner reflector M10 each reflecting surface M10a, M10b, also can be individually to be arranged at
The 1st guide-lighting guide-lighting optical system 22b of optical system 20b and the 2nd level crossing.In addition, cylindrical lens CY1a (CY1b is also identical)
With light beam LBa (LBb) the convergent refracting power for only making to inject as collimated light beam on Yt directions, therefore, along Xt side
It is projected to the luminous point extended in slit-shaped on polygonal mirror PMb reflecting surface RPa (reflecting surface RPe).
If being observed in XtYt faces, the polygonal mirror PMb of this 3rd embodiment is as shown in figure 20, and profile is in positive eight side
Shape, 8 around it reflecting surface RPa~reflecting surface RPh (Figure 19 diagrams have RPa~RPe) are formed at each with relative to rotation
The mode that axle AXp (rotation center axle AXr) tilts 45 degree is formed.That is, polygonal mirror PMb turns into such as along centerline direction with suitable
Carry out cutting the shape formed when thickness aligns anistree cone, the bottom surface of the positive anistree cone is octagon and 8 sides are each
From relative to 45 degree of centerline dip.Therefore, polygonal mirror PMb each reflecting surface (RPa~RPh), the light that past-Zt directions are advanced
Beam Lba past-Yt directions side is at right angles to reflected and is directed to speculum M12a, and the light beam LBb that past-Zt directions are advanced
Past+Yt directions side is at right angles to reflected and is directed to speculum M12b.Therefore, the variation 2 of the 1st embodiment as described above
As, during polygonal mirror PMb can be with each center line AXs (coaxial with two f θ lens FTa, FTb each optical axis AXfa, AXfb)
The heart, in fixed angular range, theta s, to being reflected by such as reflecting surface RPa, RPe in 8 reflecting surface RPa~reflecting surface RPh
Light beam LBa, LBb reflected.Thereby, by polygonal mirror PMb light beam LBa, LBb luminous point SPa, SPb optical property,
Trace linearity, constant speed improve, and improve scanning accuracy (description precision).
As shown in Figure 18, Figure 20, (such as reflected from polygonal mirror PMb and what past-Xt directions were reflected by speculum M12a
Face RPa) light beam LBa, be led to f θ lens FTa via speculum M13a, M14a.Similarly, speculum M12b is passed through
And the light beam LBb from polygonal mirror PMb (such as reflecting surface RPe) of past+Xt directions reflection, via speculum M13b, M14b
It is led to f θ lens FTb.The light beam that speculum M13a will advance in crooked place p13a from the past-Xt directions of speculum M12a
Past-Zt directions the reflections of LBa, and speculum M14a is in crooked place p14a self-reflection in the future mirrors M13a past+Xt directions of light beam LBa
Reflect and be directed to f θ lens FTa.The light that speculum M13b will advance in crooked place p13b from the past+Xt directions of speculum M12b
Past-Zt directions the reflections of beam LBb, and speculum M14b is in crooked place p14b self-reflection in the future mirrors M13a past-Xt sides of light beam LBb
To reflecting and be directed to f θ lens FTb.Though in addition, omitting diagram in Figure 20, penetrated by speculum M12a, M13a, M14a
Enter to f θ lens FTa light beam Lba, by cylindrical lens CY1a effect, if when being observed in XtYt faces, turn into almost parallel
Light beam, if when being observed in XtZt faces, as shown in figure 18 as turn into divergent beams.
The light beam LBa to be advanced by the past+Xt directions of f θ lens FTa (optical axis AXfa is parallel with Xt axles), under telecentricity state,
Reflected by the past-Zt directions of speculum M15a, after by cylindrical lens CY2a, the luminous point SPa for turning into circular is projected to base
On plate P plane of illumination.Similarly, the light beam to be advanced by the past-Xt directions of f θ lens FTb (optical axis AXfb is parallel with Xt axles)
LBb, under telecentricity state, reflected by the past-Zt directions of speculum M15b, after by cylindrical lens CY2b, turn into circular
Luminous point SPb be projected on the plane of illumination of substrate P.By f θ lens FTa and cylindrical lens CY2a, the light of substrate P is projected to
Beam LBa is in converging small luminous point SPa on the plane of illumination of substrate P.Similarly, f θ lens FTb and cylindrical lens are passed through
CY2b, the light beam LBb of substrate P is projected in converging small luminous point SPb on the plane of illumination of substrate P.It is projected to substrate P
Two luminous points SPa, SPb on plane of illumination, carried out simultaneously on description line SLa, SLb because of polygonal mirror PMb rotation
One-dimensional scanning.In the situation of the composition of this 3rd embodiment, two luminous points SPa, SPb are inverse each other along line SLa, SLb is described
Movement is scanned to ground.Then, set as follows as shown in figure 20, i.e. when making polygonal mirror PMb in XtYt faces
When turning clockwise, turn into depicting pattern Yt directions connecting portion the+Yt directions end for describing line SLa with describe line SLb-
Yt directions end respectively becomes luminous point SPa, SPb scan end position.On the contrary, working as makes polygonal mirror PMb in inverse in XtYt faces
When hour hands rotate, turn into+Yt directions the end for describing line SLa and the description line SLb-Yt of the Yt directions connecting portion of depicting pattern
Direction end respectively becomes luminous point SPa, SPb scanning starting position.
In being formed more than, speculum M12a, M13a, M14a, M15a, f θ lens FTa and cylindrical lens CY2a, the is used as
1 projection optics system 24b and play function, the 1st projection optics system 24b makes to be reflected by polygonal mirror PMb and be inclined to scanning
Light beam LBa optically focused is to be projected to and describe on line SLa as luminous point SPa.Also, speculum M12b, M13b, M14b, M15b, f θ are saturating
Mirror FTb and cylindrical lens CY2b, function is played as the 2nd projection optics system 26b, the 2nd projection optics system 26b make by
Polygonal mirror PMb reflects and is inclined to the light beam LBb optically focused of scanning to be projected to and describe on line SLb as luminous point SPb.
Also, as shown in Figure 18, Figure 20, in the 3rd embodiment, reflecting surface RP to f θ lens FTa from polygonal mirror PMb,
Optical path length untill FTb, extended by speculum M12a~M14a, M12b~M14b therebetween, therefore, as f θ lens
FTa, FTb can use the focal length elder of light beam light incident side.In general, polygonal mirror PM's (PMa, PMb are also identical) is anti-
Face is penetrated, the focal length fs of the f θ lens FTa (FTb) of telecentricity light beam light incident side position (pupil location) is configured at or its is attached
Closely.Therefore, if the length of the description line SLa (SLb) on plane of illumination is set into Lss, the light beam of f θ lens will be now incident upon
Deviation angular range be set to θ s, then can approx represent Lss ≒ fssin (θ s) relation.Therefore, in line SLa will be described
(SLb), just can be correspondingly as long as the f θ lens grown using focal length fs when length Lss is set to the situation of fixed value
Ground reduces deviation angular range, theta s.This means to contribute to the single pass along the luminous point SPa (SPb) for describing line SLa (SLb)
Polygonal mirror PM (PMa, PMb) rotation angle range θ s/2 diminish, the advantages of being advantageous to high speed.
The delineation unit Ub of this 3rd embodiment, as shown in figure 20, set with staggering on Yt directions describe line SLa with
Describe line SLb so that the description line SLa of scanning point SPa, luminous point SPb each with describe line SLb on sub-scanning direction that
This separates, and on main scanning direction, end abutment or a part of overlapping.It is, describe line SLa, SLb with parastate
Under separate on sub-scanning direction (conveyance direction of substrate P), and seamlessly continuous mode configures on main scanning direction.
Therefore, when multiple such a delineation unit Ub situation is configured, such as configured in a manner of Figure 21.
Figure 21 shows one of following situation, corresponding to Fig. 2 above, will be formed along Y (Yt) directions in substrate P
Exposure area W mono- as electronic component forming region divides for six, by 6 describe line SL1a, SL1b, SL2a, SL2b,
SL3a, SLb, depicting pattern in multiple cut zone WS1~cut zone WS6 of banding each.Herein, with as above
Delineation unit Ub as Figure 18~Figure 20 is two articles of the 1st delineation unit Ub1 of identical composition and describes line SL1a, SL1b, setting
Into respectively at cut zone WS1, WS2 depicting pattern adjacent along the Y direction.Similarly, it is phase isomorphism with delineation unit Ub
Into two articles of the 2nd delineation unit Ub2 describe line SL2a, SL2b, be set to respectively at cut zone adjacent along the Y direction
WS3, WS4 depicting pattern, two articles of descriptions line SL3a, SL3b with delineation unit Ub for the 3rd delineation unit Ub3 of identical composition,
It is set to respectively at cut zone WS5, WS6 depicting pattern adjacent along the Y direction.With in cut zone WS1 and cut section
Domain WS2 connecting portion STa, cut zone WS2 and cut zone WS3 connecting portion STb, cut zone WS3 and cut zone WS4
Connecting portion STc, cut zone WS4 and cut zone WS5 connecting portion STd and cut zone WS5 and cut zone WS6 company
Socket part STe, 6 describe line SL1a ..., the respective end of SL3a, SL3b critically consistent or somewhat overlapping side in the Y direction
Formula, critically adjust the Y-direction position of each description line or each description multiplying power for describing line.
In this way, in this 3rd embodiment, be set to using delineation unit Ub (Ub1~Ub3) and scanning point SPa,
Two of SPb describe line SLa, SLb, are separated on sub-scanning direction, and on main scanning direction, end abutment or one
Divide overlapping.Even if in the situation, make rotation center axle AXr when delineation unit Ub is overall somewhat to be rotated, can also be set to phase
Central point for substrate P vertically through the line segment at two midpoints for describing line SLa, SLb of connection.Therefore, even in order to
Obtain high registration accuracy and make the overall situations around rotation center axle AXr turns of delineation unit Ub, can also suppress to pass through description
Two of unit Ub and scanning point SPa, SPb describe the position skew of line SLa, SLb in substrate P and become big, therefore, it is possible to one
Side carry out high-precision pattern plotter, on one side simply to describe line SLa, SLb gradient (in plane of illumination relative to Y-axis
Gradient) be adjusted.
In addition, in above-mentioned each embodiment (also comprising variation), multiple delineation unit U, Ua, Ub description line SL are equal
Identical sweep length is set to, but can also make sweep length different.When the situation, it can make between delineation unit U, Ua, Ub
It is different to describe line SL sweep length, in same delineation unit U, Ua, Ub, can also make description line SLa, SLb sweep length
It is different.Further, though making descriptions of the rotation center axle AXr relative to substrate P vertically through connection delineation unit U, Ua, Ub
The central point of the line segment at the respective midpoint of line SLa, SLb, but rotation center axle AXr also can be relative to the vertical side of substrate P
To, and be set in connection and describe on the line segment at the respective midpoints of line SLa, SLb.
In the situation of the 3rd embodiment more than, in order to such as the 1st embodiment, in being in cylinder along strip direction
Pattern plotter is carried out to planar by the plane of illumination of the substrate P of rotating cylinder DR1, DR2 supporting, as shown in figure 22, as long as so that logical
The speculum M15a (M15b) that crosses after delineation unit Ub f θ lens FTa (FTb) and optical axis AXfa (AXfb's) that bends prolongs
Long line towards rotating cylinder DR1 or DR2 central shaft (Pivot axle) AXo1 or AXo2 mode, by the speculum in XZ faces
M15a (M15b) gradient is set as the angle beyond 45 degree, and also with the side focused on inclined optical axis AXfa (AXfb)
Formula, cylindrical lens CY2a (CY2b) is arranged obliquely relative to XY faces.In addition, in XY faces abreast flat supporting substrates P
Situation when, such as can use No. 2013/150677 publication of International Publication No. disclosed in carrying device.Also, also it may replace
Rotating cylinder DR1, DR2 and use pad component (substrate supporting keep tool), the pad component (substrate supporting keeps tool) is in barrel surface
Shape curved surface formed with multiple fine gas squit holes (and multiple fine suction holes), and using gas bearing with
Non-contact or low friction state support substrate P rear side so that substrate P along strip direction it is cylindrical bend and support
The substrate P.Also, in the embodiment of above-mentioned 1st embodiment~the 2nd and its variation waited, may replace rotating cylinder DR1,
DR2, and use the conveyance with XY faces abreast flat supporting substrates P disclosed in No. 2013/150677 publication of International Publication No.
Device, also it can be used using gas bearing with the above-mentioned pad component (base of non-contact or low friction state support substrate P rear side
Plate supporting keeps tool).
[variation of the embodiment of the 1st embodiment~the 3rd]
The embodiment of 1st embodiment~the 3rd can also have variation as described below.
(variation 1) Figure 23 is the figure of the composition of one of display beams distribution system, and the light beam distribution system is used for will
4 descriptions that the light beam LB (two light beams LBa, LBb) that light supply apparatus 14 shown in Fig. 1 provides for example is distributed into Fig. 2
Unit U1, U2, U5, U6 each.In addition, the light beam distribution system may be not only suitable for the drawing apparatus of the 1st embodiment, also
It is applicable to the drawing apparatus of the 2nd embodiment, the 3rd embodiment and its variation waited.
The laser beam (continuous light or pulsed light) of the high briliancy of output ultraviolet range is set in light supply apparatus 14
LASER Light Source LS, the light beam from LASER Light Source LS is converted to set diameter (such as counting mm diameters) collimated light beam light beam
Expander BX, the 1st beam splitter (half-reflecting mirror) BS1 and face mirror MR1 that the light beam as collimated light beam is divided into two.By
The light beam of beam splitter BS1 reflections is incident upon the 2nd beam splitter BS2a as light beam LBa, passes through beam splitter BS1
Light beam by face mirror MR1 reflect to be incident upon the 2nd beam splitter BS2b as light beam LBb.Beam splitter BS1 segmentation
Than for 1：1, light beam LBa, LBb each luminous intensity (illumination) are roughly equal.Be incident upon beam splitter BS2a light beam LBa and
The light beam LBb for being incident upon beam splitter BS2b is further divided into two with equal intensity ratio.
It is incident upon in beam splitter BS2a light beam LBa, the 3rd is incident upon by beam splitter BS2a light beam LBa
Beam splitter BS3a (the rations of division 1：1).It is incident upon in beam splitter BS2b light beam LBb, passes through beam splitter
BS2b light beam LBb is incident upon the 3rd beam splitter BS3b (rations of division 1：1).By beam splitter BS3a, BS3b each
Two light beams LBa, LBb of reflection, the rotation center axle AXr for clipping delineation unit U1 are parallel to each other, and pass through corresponding optics
Element AOMa, AOMb (reference picture 5 etc.) and towards delineation unit U1.Then, beam splitter BS3a, BS3b each is passed through
After two light beams LBa, LBb are reflected by face mirror MR2a, MR2b respectively, the rotation center axle AXr for clipping delineation unit U2 is mutual
It is parallel, by corresponding optical element AOMa, AOMb and towards delineation unit U2.
Further, the light beam LBa reflected by beam splitter BS2a above is incident upon the 4th beam splitter BS4a
(the ration of division 1：1), the light beam LBb reflected by beam splitter BS2b above is incident upon the 4th beam splitter BS4b (segmentations
Than for 1：1).Two light beams LBa, the LBb reflected by beam splitter BS4a, BS4b each, clip delineation unit U5 rotation
Dynamic central shaft AXr is parallel to each other, by corresponding optical element AOMa, AOMb and towards delineation unit U5.Then, light is passed through
After two light beams LBa, LBb of beam optical splitter BS4a, BS4b each are reflected by face mirror MR3a, MR3b respectively, description is clipped
Unit U6 rotation center axle AXr is parallel to each other, by corresponding optical element AOMa, AOMb and towards delineation unit U6.
By more than composition, distribute to light beam LBa, LBb of 4 delineation units U1, U2, U5 each can be set to that it is roughly equal
Luminous intensity.
Moreover, the LASER Light Source in light supply apparatus 14, as long as the light beam of the high briliancy of ultraviolet range wavelength is radiated,
Also can be then any of Solid State Laser, gas laser laser.If using fiber laser light source as Solid State Laser, although
It is relatively smart small framework, still is able to obtain the ultraviolet light beam of height output, and fits easily in exposure device (drawing apparatus)
In EX body, above-mentioned fiber laser light source utilizes fiber amplifier by the infrared spectral range ripple from semiconductor laser diode
After long light beam (hundreds of MHz pulsed lights) amplification, the light of ultraviolet range wavelength is radiated by Wavelength changing element
Beam (pulsed light).Further, in the embodiment of the 1st embodiment more than~the 3rd and each variation, though to be filled in exposure
Put in EX bodies, the light of description is not provided with the delineation unit U (Ua, Ub) that can be rotated centered on rotation center axle AXr
The composition in source, but in the intensity using the light beam from semiconductor laser diode (LD) or light-emittingdiode (LED) etc. and
When fully describing the situation of (exposure) pattern, also light beam LBa, LBb can be supplied in being set in each delineation unit U (Ua, Ub)
LD or LED.But by the light source portion that above-mentioned LD or LED are formed in pattern plotter action, temperature can considerably rise, therefore,
Need to set the temperature adjusting mechanism be thermally shielded the light source portion in delineation unit U (Ua, Ub), cool down etc., will describe singly
The overall temperature change of first U (Ua, Ub) suppresses smaller.When the situation, also by optical element AOMa as shown in Figure 5,
AOMb is arranged in each delineation unit U (Ua, Ub).
In the embodiment of (variation 2) the 1st embodiment more than~the 3rd and its each variation waited, polygonal mirror PM
(PMa, PMb) is set to be configured with the 8 face bodies (or anistree cone-shaped) that 8 reflectings surface form around rotary shaft AXp with 45 degree of interval,
But the quantity of reflecting surface also can be any amount, can similarly use the face of 3 faces~6,9 faces, 10 faces, 12 faces, 15 faces, 16 faces,
The polygonal mirror in 18 faces, 20 faces etc..In general, even if the diameter of polygonal mirror is identical, reflecting surface number is more, then windage loss is smaller, because
This can be such that it rotates more at high speed.Also, in the embodiment of the 1st embodiment~the 3rd and its each variation waited, though eliminate
Diagram and explanation, but origin sensor is provided with the two of polygonal mirror PM (PMa, PMb) surroundings, the origin sensor is in multiaspect
Two light beams LBa, LBb that each of mirror PM (PMa, PMb) different reflectings surface is reflected are towards with describing line (scan line)
Corresponding to the scanning starting point difference of luminous point SPa, SPb on SLa, SLb during reflection direction, origin signal is exported.Along description
The management (offset setting etc.) of line SLa, SLb luminous point SPa, SPb scan position or luminous point SPa, SPb based on pattern data
The sequential of intensity modulation (optical element AOMa, AOMb ON/OFF) etc., be based on the origin signal and correspond to luminous point
The clock signal of SPa, SPb sweep speed and control.
[the 4th embodiment]
In the embodiment of the 1st embodiment more than~the 3rd and its each variation waited, from polygonal mirror PM (PMa,
PMb) in the light path untill f θ lens FTa, FTb, speculum M6a, M6b or M12a, M12b are provided with, speculum M6a,
M6b or M12a, M12b are in making the face of light beam LBa, LBb deviation that polygonal mirror PM (PMa, PMb) reflected (in Fig. 5, Fig. 6 reality
It is the face parallel with XtYt faces to apply in form, Figure 12~Figure 16 each embodiment, Figure 18~Figure 20 embodiment, in Figure 17
Embodiment in be the face parallel with YtZt faces) in, make light beam LBa, LBb bend.In the light beam LB from light supply apparatus 14
When (LBa, LBb) is in the situation of the ultraviolet wavelength band longer compared with 240nm or so wavelength, polygonal mirror PM (PMa, PMb) or
The reflecting surface of each speculum, in aluminium lamination of the surface of the glass or ceramic mother metal evaporation with high reflectance, further in the aluminium lamination
On be deposited for the dielectric body thin film (single or multiple lift) of anti-oxidation etc. and be made.When polygonal mirror PM situation, aluminium is utilized
To be formed the processing of mother metal body, after carrying out optical grinding as the part of reflecting surface, dielectric substance is deposited in its surface
Film (single or multiple lift).Polygonal mirror PM (PMa, PMb) or speculum M6a, M6b for the construction with such a reflecting surface,
M12a, M12b, the incidence angle for being incident upon light beam LBa, LBb of reflecting surface can be big according to the light beam deviation angle for being used for main scanning
Change to amplitude, when light beam LBa, LBb have the situation of polarization characteristic, sometimes and can not ignore reflection after light beam intensity
The influence of the tendency of change, the i.e. incident angle-dependent of the reflectivity of reflecting surface is produced according to the change of incidence angle.
Figure 24 is in YtZt faces, to the polygonal mirror PM and speculum M6a that are projected to illustrated by Figure 17 above each
Light beam LBa incidence angle or the figure that illustrates of the situation of angle of reflection.Situation illustrated by Figure 24, is also created in
In other embodiments (Fig. 5, Fig. 6, Figure 12~Figure 16, Figure 18~Figure 20).In Figure 24, when the polygonal mirror PM's in YtZt faces
One reflecting surface RPh angle, θ o be 45 ° when, with the light beam LBa that Zt axles are abreast injected in a manner of parallel with Yt axles by anti-
Penetrate after face RPh reflections, the 90-degree bent using speculum M6a, and with follow-up f θ lens FTa optical axis AXfa coaxially before
Enter.If polygonal mirror PM is set to the polygonal mirror to be turned clockwise in Figure 24, along the luminous point SPa's for describing line SL2a (SLa)
The starting point of effective scanning reaches angle, θ o- Δ θ a time point, luminous point SPa effective scanning for reflecting surface RPh in YtZt faces
End point reach angle, θ o+ Δ θ a time point in YtZt faces for reflecting surface RPh.Therefore, by polygonal mirror PM reflecting surface RPh
Reflect and towards speculum M6a light beam LBa relative to optical axis AXfa deviation angular range be ± 2 Δ θ a.When light beam LBa phases
When the deviation angle for optical axis AXfa is+2 Δ θ a, the incidence angle θ m1 for being projected to the light beam LBa of speculum M6a reflecting surface is θ
M1=45 ° -2 Δ θ a, when light beam LBa is -2 Δ θ a relative to the optical axis AXfa deviation angle, it is projected to the anti-of speculum M6a
The incidence angle θ m2 for penetrating the light beam LBa in face is the Δ θ a of θ m2=45 °+2.
Herein, shadow caused by the change of the incidence angle of the light beam LBa from being injected toward speculum M6a is illustrated using Figure 25
Ring.Figure 25 is to illustrate that make to have the light beam of the polarization characteristic of ultraviolet wavelength band to be incident upon is made up of aluminium lamination and dielectric body thin film
The characteristic CV1 of the incident angle-dependent of observed reflectivity curve map during reflecting surface, the longitudinal axis represent the reflection of reflecting surface
Rate (%), transverse axis represent the incidence angle (degree) for the light beam injected toward reflecting surface.In general, work as light beam with 0 ° of incidence angle
When (i.e. vertical incidence) is projected to reflecting surface, reflectivity is maximum.For Figure 25 characteristic CV1, maximum reflectivity 90%
Left and right.When incidence angle is 45 ° or so, reflectivity is about 87%, but as incidence angle further increases, reflectivity can be significantly
Ground reduces.When the reflectivity and characteristic CV1 identical situations of polygonal mirror PM each reflecting surface (RPh), as shown in figure 24, inject
To polygonal mirror PM reflecting surface RPh light beam LBa incidence angle, change is produced centered on 45 ° and in the range of ± Δ θ a.
Herein, if being incident upon the f θ lens combinations FTa light beam LBa Δ of maximum angle of deflection degree scope ± 2 to scan description line SLa
θ a are ± 15 ° centered on optical axis AXfa, then because Δ θ a are 7.5 °, therefore past polygonal mirror PM reflecting surface RPh injections
Light beam LBa incidence angle, change is produced centered on 45 ° and in the range of 37.5 °~52.5 °.In terms of characteristic CV1, enter
Reflectivity when firing angle is 37.5 ° is about 88%, and reflectivity when incidence angle is 52.5 ° is about 85.5%.
Content more than, f θ lens combinations are incident upon in the light beam LBa for making to be reflected by polygonal mirror PM states of remaining stationary
During FTa situation, according to characteristic CV1, describe the luminous point SPa of scanning starting point on line SLa intensity and end of scan point
The luminous point SPa at place intensity generates 88%-85.5%=2.5% difference.If this means to describe the central attached of line SLa
On the basis of near luminous point SPa intensity, then in the both ends for describing line SLa, intensity error is ± 1.25%.In shape in substrate P
Into photonasty functional layer for photoresist or dry film situation when, the permission model of the strength variance of the luminous point SP during main scanning
It is for ± 2% or so to enclose, if intensity error (deviation) is ± 1.25%, can be allowed to.
However, as shown in figure 24, incidence angle is also there are after polygonal mirror PM can be because of the main scanning for light beam LBa
It is inclined to and significantly produces the speculum M6a of change, therefore, the intensity for the luminous point SPa being projected in substrate P can be in main scanning
Bigger intensity error is produced on direction.It is described as previously explained, speculum M6a light beam LBa incidence angle is incident upon, in
Change is produced between θ m1~θ m2.When Δ θ a are set into 7.5 ° of situation, -15 ° of θ m1=45 °=30 ° ,+15 ° of θ m2=45 °
=60 °.If the incident angle-dependent of speculum M6a reflectivity is also identical with Figure 25 characteristic CV1, on description line SLa
Luminous point SPa scanning starting point, the light beam LBa injected toward speculum M6a incidence angle is θ m1=30 °, therefore, the incidence
The reflectivity of speculum M6a under angle is about 88.5%.Therefore, according to the reflectivity 88% of the reflecting surface RPh with polygonal mirror PM
Product, in luminous point SPa scanning starting point, reflectivity adds up to 77.9% (88% × 88.5%).Also, on description line SLa
Luminous point SPa end of scan point, the light beam LBa injected toward speculum M6a incidence angle is θ m2=60 °, therefore, the incidence
The reflectivity of speculum M6a under angle is about 81%.Therefore, according to the reflectivity 85.5% of the reflecting surface RPh with polygonal mirror PM
Product, in luminous point SPa end of scan point, reflectivity adds up to 69.3% (85.5% × 81%).Content more than is more
The incident angle-dependent of face mirror PM reflecting surface and the reflectivity of the total in speculum M6a reflecting surface becomes the spy in Figure 25
As property CV2.In addition, when light beam LBa is relative to polygonal mirror PM reflecting surface and the speculum M6a reflecting surface incidence angle of the rwo
For 45 ° when, the reflectivity of total is about 75.7% (87% × 87%).
As described above, speculum M6a (M6b, M12a, M12b are also identical) has the light beam with making to be reflected by polygonal mirror PM
The face (parallel with YtZt faces in Figure 17 embodiment, parallel with XtYt faces in other embodiments) of LBa (LBb) deviations
Orthogonal reflecting surface, therefore, the change of light beam LBa (LBb) incidence angle are big, for Figure 25 characteristic CV2, are opened in scanning
Initial point and end of scan point, luminous point SPa (SPb) intensity can produce about 8.6% error.The value may not be in allowed band,
If necessary, it is preferable that some amendment (adjustment) mechanisms are set.Characteristic CV1 shown in Figure 25 is one, in speculum
Reflecting surface be made up of the multilayer film of dielectric substance situation when, relative to the reflectivity of incidence angle rate of change (gradient) sometimes also
Can further it increase.Therefore, polygonal mirror PM used in reality and speculum M6a are obtained beforehand through experiment or simulation etc.
(M6b) the characteristic CV1 of respective reflectivity, and sweeping relative to luminous point SPa (SPb) described on line SLa (SLb) is obtained in advance
Retouch the dynamic trend (strength variance, gradient etc.) of the beam intensity of position.
In above-mentioned beam intensity dynamic trend for more than allowed band situation when, in speculum M6a, M6b, M12a,
In beam path after M12b, set the transmissivity on main scanning direction continuous or periodically produce the neutral density of change
Filter (ND optical filterings) plate, can optically suppress or correct the scan position relative to the luminous point SPa (SPb) in substrate P
Strength Changes tendency (strength variance, gradient etc.).Neutral density filter can be configured at speculum M6a, M6b (M12a,
M12b) in the light path between f θ lens combinations FTa, FTb or in the light path between f θ lens combinations FTa, FTb and substrate P.
In the light path after f θ lens combinations FTa, FTb, the 2nd post of plano-convex shape is provided with covering description line SLa, SLb size
Face lens CY2a, CY2b, therefore, neutral density filter can be also set near the cylindrical lens CY2a, CY2b.Also, such as
Shown in Fig. 5, Figure 18, Figure 22, make what is projected from f θ lens combinations FTa, FTb in a manner of being vertically incident upon substrate P in being provided with
When speculum M7a, M7b, M15a, M15b of scanning light beam LBa, LBb bending situation, can be also deposited in reflecting surface makes main scanning
The reflectivity of speculum M7a, M7b, M15a, M15b on direction are continuous or periodically produce the film of change, or in reflection
The neutral density filter that area layer is formed by thickness by below 0.1mm thin glass, (amendment) phase is adjusted optically
For the strength variance of luminous point SPa (SPb) main scanning direction.
Also can be by the correction mechanism amendment of electrical resistance relative to the Strength Changes of luminous point SPa (SPb) scan position
It is inclined to (strength variance, gradient etc.).Figure 26 has been displayed as the polygonal mirror PM for making to be incident upon delineation unit according to data are described
Light beam ON/OFF before (PMa, PMb), and the optical element set in a manner of shown in Fig. 5, Fig. 7 above (adjust by acousto-optic
Dependent element, intensity modulation component) AOMa, AOMb control system the block diagram of one.In Figure 26, drive circuit 100 will
The high-frequency driving signal Sdv of ON/OFF is exported to optical element AOMa (AOMb).Herein, so-called optical element AOMa
(AOMb) off-state, refer to not apply optical element AOMa (AOMb) high-frequency driving signal Sdv, and light source will be come from and filled
Put the state that 14 light beam LB is passed under state of remaining stationary as 0 sub-beams LBu；So-called conducting state, refers to
High-frequency driving signal Sdv is applied to optical element AOMa (AOMb), by a diffraction light of the light beam LB from light supply apparatus 14
As light beam LBa (LBb), with the state that set diffraction angle is inclined to it and is exported.The diffraction angle is by drive signal Sdv
The frequency (such as 80MHz) of (high-frequency signal) determines.Further, if changing drive signal Sdv amplitude, diffraction efficiency meeting
Change is produced, and the intensity of the light beam LBa (LBb) as a diffraction light can be adjusted.
Drive circuit 100, by frequency fix and the high-frequency signal from high-frequency generator SF of amplitude stability, with pixel list
Description the bit signal CLT and control signal DE that position is read by bit tandem from memory are inputted, and the memory storage has
Make the description data (pattern data) of the pixel bit projected forms formed corresponding with 1 bit.Drive circuit 100 is in retouching
Bit signal CLT is painted during logical value " 1 ", to export the high-frequency signal from high-frequency generator SF as drive signal Sdv,
During describing bit signal CLT and being logical value " 0 ", forbid sending out drive signal Sdv.Further, in drive circuit 100
Power amplifier is set, and the power amplifier can change the high frequency letter from high-frequency generator SF according to control signal DE
Number amplitude.Control signal DE is analog signal or data signal, for example, the magnifying power (gain) of indicated horsepower amplifier
Value.Herein, control signal DE is set to analog signal.
Herein, following situation is illustrated using Figure 27 timing diagram, the situation refer in along describe line SLa
(SLb) in scanning point SPa (SPb) pattern plotter action, light beam LBa (LBb) intensity is adjusted.In Figure 27,
Origin signal rotates to set angle position in polygonal mirror PM reflecting surface and starts scanning point SPa (SPb) in substrate P
Time point before, produce impulse waveform.Therefore, in polygonal mirror PM reflecting surface for 8 faces situation when, the pulse of origin signal
Waveform produces 8 times during polygonal mirror PM rotates a circle.Prolong from the impulse waveform for producing origin signal by fixed
After slow time Tsq, produce and describe Continuity signal (logical value " 1 "), describe bit signal CLT and apply to drive circuit 100, from
And begin through light beam LBa (LBb) depicting pattern.Now, control signal DE value (analog voltage) is become with following characteristic CCv
Move, i.e. increase value Ra when describing Continuity signal and being changed into logical value " 1 ", and become describing Continuity signal from logical value " 1 "
To reach value Rb when " 0 ".In Figure 27, when control signal DE value is Ro situation, the power amplification in drive circuit 100
The gain of device is set to initial value (such as 10 times).When Figure 27 situation, it is set as Ra ＜ Ro ＜ Rb, therefore, in description
Continuity signal is risen near the scanning starting point described on line SLa of " 1 ", and the gain of power amplifier is set below just
Initial value, therefore the intensity for being projected to the luminous point SPa (SPb) of substrate P is less than initial value.Also, dropped to " 0 " in describing Continuity signal
The end of scan point described on line SLa near, the gain of power amplifier is set to be higher than initial value, therefore, is projected to
The luminous point SPa (SPb) of substrate P intensity is more than initial value.Thereby, (amendment) can be adjusted to electrical resistance according to luminous point SPa
(SPb) main scanning direction position and caused strength variance.
Control signal DE as described above waveform, can be by will describe Continuity signal or origin signal inputted
Simple time constant circuit (integrating circuit etc.) and generate.Also, control signal DE characteristic CCv linear real estates in Figure 27
Changing, but also can be by appropriate filter circuit and in non-linearly generation change.In with digital information rather than analog wave
When shape authorizes control signal DE situation, as long as so that the gain of power amplifier can be changed with control signal DE digital value
Mode is deformed.
Described in Figure 26, Figure 27 as more than, the high-frequency driving signal Sdv's that makes to authorize optical element AOMa (AOMb) shakes
Width produces change and electric adjustment mechanism that the intensity of the light beam LBa (LBb) to being projected to substrate P is adjusted, to from more
The relative intensity difference that each of individual delineation unit is projected between the light beam of substrate P is also effective when being adjusted.In addition, electrical resistance
The mechanism that ground is adjusted to light beam LBa (LBb) intensity, it can also realize that for example in light supply apparatus 14 be to produce ultraviolet wavelength
During the situation of the semiconductor laser light resource of the laser beam of band or high briliancy LED light source, the glorious degrees itself of light source are carried out
Adjustment.
Also, as shown in Fig. 5, Fig. 6, Figure 17 above, when in two light beams towards the polygonal mirror PM that reflecting surface is 8 faces
In the state of LBa, LBb are parallel to each other, each of the reflecting surface of the relation in 90 ° each other in polygonal mirror PM reflecting surface is utilized
And when reflecting light beam LBa and light beam LBb, light beam LBa luminous point SPa and light beam LBb luminous point SPb is with identical sequential in substrate
It is scanned on P.However, as disclosed in No. 2015/166910 publication of International Publication No., will in timesharing (time-sharing)
, it is necessary to be set when light beam LB from a light supply apparatus 14 is divided into light beam LBa and light beam LBb situation, so that luminous point
SPa main scanning will not be performed with luminous point SPb main scanning with identical sequential.It is in figure for this simple embodiment
5th, in the composition shown in Fig. 6, Figure 17, polygonal mirror PM is used as the polygonal mirror in 9 faces using reflecting surface.In polygonal mirror be 9 faces
Situation when, such as light beam LBa is incident upon the sequential in the direction of rotation center of reflecting surface, and 9 are incident upon for other light beams LBb
The sequential of (ridge line section) between the reflecting surface and reflecting surface of the polygonal mirror in individual face.That is, by changing the quantity of reflecting surface, it can make
The sequential of luminous point SPa main scanning and luminous point SPb main scanning staggers.Also, for the composition shown in Fig. 5, Fig. 6, Figure 17, Yu Duo
Face mirror PM is 8 faces, and when making the situation that the sequential of luminous point SPa main scanning and luminous point SPb main scanning staggers, as long as by court
To polygonal mirror PM light beam LBa and light beam LBb not parallel state is set to from the state being parallel to each other.
Claims (23)
1. a kind of pattern plotter device, the light beam from light supply apparatus is set to be concentrated in point-like on irradiated body, after making optically focused
Luminous point carry out main scanning along set scan line, and subscan is carried out to above-mentioned irradiated body, thereby shone above-mentioned
Describe predetermined pattern on beam, it possesses：
Polygonal rotating mirror, rotated for above-mentioned main scanning around rotary shaft；
1st guide-lighting optical system, the 1st light beam from above-mentioned light supply apparatus is projected from the 1st direction towards above-mentioned polygonal rotating mirror；
2nd guide-lighting optical system, from 2nd direction different from above-mentioned 1st direction towards the projection of above-mentioned polygonal rotating mirror from above-mentioned
2nd light beam of light supply apparatus；
1st projection optics system, make above-mentioned 1st beam condenser that is reflected by above-mentioned polygonal rotating mirror and thrown as the 1st luminous point
It is incident upon in the 1st scan line；And
2nd projection optics system, make above-mentioned 2nd beam condenser that is reflected by above-mentioned polygonal rotating mirror and thrown as the 2nd luminous point
It is incident upon in the 2nd scan line；
So that above-mentioned 1st scan line and above-mentioned 2nd scan line are in the phase being located on above-mentioned irradiated body on above-mentioned sub-scanning direction
The mode to stagger with position and on above-mentioned main scanning direction, configure above-mentioned 1st projection optics system and above-mentioned 2nd projection optics
System.
2. a kind of pattern plotter device, the sheet material substrate to the strip of pliability is that irradiated body is swept along long side direction progress pair
Retouch and make based on describing the luminous point of data and intensity modulation along in the width side orthogonal with the long side direction of above-mentioned irradiated body
Main scanning is carried out to the scan line of extension, thereby describes the pattern corresponding with above-mentioned description data on above-mentioned irradiated body,
It possesses：
Polygonal rotating mirror, rotated for above-mentioned main scanning around rotary shaft；
1st guide-lighting optical system, the 1st light beam is projected from the 1st direction towards above-mentioned polygonal rotating mirror；
2nd guide-lighting optical system, the 2nd light beam is projected from 2nd direction different from above-mentioned 1st direction towards above-mentioned polygonal rotating mirror；
1st projection optics system, make above-mentioned 1st beam condenser that is reflected by above-mentioned polygonal rotating mirror and thrown as the 1st luminous point
It is incident upon in the 1st scan line；And
2nd projection optics system, make above-mentioned 2nd beam condenser that is reflected by above-mentioned polygonal rotating mirror and thrown as the 2nd luminous point
It is incident upon in the 2nd scan line；
So that each sweep length of above-mentioned 1st scan line and above-mentioned 2nd scan line is set into identical, and in above-mentioned main scanning direction
In a manner of being spaced apart above-mentioned 1st scan line of setting below above-mentioned sweep length is with above-mentioned 2nd scan line, configuration above-mentioned the
1 projection optics system and above-mentioned 2nd projection optics system.
3. pattern plotter device as claimed in claim 2, wherein,
So that above-mentioned 1st scan line and above-mentioned 2nd scan line are in the phase being located on above-mentioned irradiated body on above-mentioned sub-scanning direction
With the mode of position, above-mentioned 1st projection optics system and above-mentioned 2nd projection optics system are configured.
4. the pattern plotter device as described in any claim in claims 1 to 3, wherein,
Above-mentioned polygonal rotating mirror, there are the multiple reflectings surface configured in a manner of around above-mentioned rotary shaft；
Above-mentioned 1st guide-lighting optical system, so that the 1st reflecting surface being projected in multiple reflectings surface of above-mentioned polygonal rotating mirror is upper
The incident direction of the 1st light beam is stated, above-mentioned 1st light on the direction of above-mentioned rotary shaft extension and by above-mentioned 1st reflective surface
The mode that the reflection direction of beam is different is set；
Above-mentioned 2nd guide-lighting optical system, so as to be projected to being reflected with the above-mentioned 1st in multiple reflectings surface of above-mentioned polygonal rotating mirror
The incident direction of above-mentioned 2nd light beam of the 2nd different reflecting surface of face, on the direction of above-mentioned rotary shaft extension and by the above-mentioned 2nd
The mode that the reflection direction of above-mentioned 2nd light beam of reflective surface is different is set.
5. the pattern plotter device as described in any claim in Claims 1-4, wherein,
Above-mentioned polygonal rotating mirror, above-mentioned 1st guide-lighting optical system, above-mentioned 2nd guide-lighting optical system, above-mentioned 1st projection optics system
System and above-mentioned 2nd projection optics system, be formed integrally as can turn a delineation unit；
The rotation center axle of above-mentioned delineation unit, by relative to above-mentioned irradiated body vertically through the point on line segment in a manner of set
Fixed, above-mentioned line segment connects the midpoint of above-mentioned 1st scan line and the midpoint of above-mentioned 2nd scan line.
6. pattern plotter device as claimed in claim 5, wherein,
Above-mentioned 1st light beam and above-mentioned 2nd light beam, above-mentioned retouch is incident upon in a manner of turning into symmetrical relative to above-mentioned rotation center axle
Paint unit.
7. pattern plotter device as claimed in claim 6, wherein,
Above-mentioned delineation unit possesses reflecting member, and the reflecting member is carried out to above-mentioned 1st light beam injected with above-mentioned 2nd light beam
Reflect and be directed to above-mentioned 1st guide-lighting optical system and above-mentioned 2nd guide-lighting optical system.
8. pattern plotter device as claimed in claim 7, wherein,
Above-mentioned 1st guide-lighting optical system possesses the 1st off-set optical component, and the 1st off-set optical component makes above-mentioned reflecting member institute
The face bias internal that the position of above-mentioned 1st light beam of reflection intersects in the direction of advance with above-mentioned 1st light beam；
Above-mentioned 2nd guide-lighting optical system possesses the 2nd off-set optical component, and the 2nd off-set optical component makes above-mentioned reflecting member institute
The face bias internal that the position of above-mentioned 2nd light beam of reflection intersects in the direction of advance with above-mentioned 2nd light beam.
9. the pattern plotter device as described in any claim in claim 5 to 8, wherein,
It is provided with multiple above-mentioned delineation units；
So that multiple respective above-mentioned 1st scan lines of above-mentioned delineation unit and above-mentioned 2nd scan line are along above-mentioned irradiated body
The mode that width connects, configure multiple above-mentioned delineation units.
10. pattern plotter device as claimed in claim 9, it possesses：
1st rotating cylinder, have extend along the width orthogonal with the long side direction of above-mentioned irradiated body the 1st central shaft,
And the cylindric outer peripheral face with above-mentioned 1st central shaft at a distance of radii fixus, while imitating a part for above-mentioned irradiated body
Above-mentioned outer peripheral face and bend and support in long side direction, while being pivoted about with above-mentioned 1st central shaft above-mentioned to transport
Irradiated body, subscan thereby is carried out to above-mentioned irradiated body；And
2nd rotating cylinder, be arranged at the downstream of the conveyance direction of above-mentioned 1st rotating cylinder, have along with above-mentioned irradiated body
Long side direction it is orthogonal width extension the 2nd central shaft and with above-mentioned 2nd central shaft at a distance of the cylindric of radii fixus
Outer peripheral face, a part for above-mentioned irradiated body is imitated above-mentioned outer peripheral face and bend and support in long side direction, while with
Above-mentioned 2nd central shaft is pivoted about to transport above-mentioned irradiated body, thereby carries out subscan to above-mentioned irradiated body；
So as to above-mentioned 1st scan line of the above-mentioned delineation unit of given amount in multiple above-mentioned delineation units and the above-mentioned 2nd sweep
Retouch line to be located on the above-mentioned irradiated body for the outer peripheral face for being supported on above-mentioned 1st rotating cylinder, and make remaining above-mentioned delineation unit
Above-mentioned 1st scan line and above-mentioned 2nd scan line are located on the above-mentioned irradiated body for the outer peripheral face for being supported on above-mentioned 2nd rotating cylinder
Mode, configure multiple above-mentioned delineation units.
11. a kind of pattern plotter method, the light beam from light supply apparatus is set to be concentrated in point-like on irradiated body, after making optically focused
Luminous point carry out main scanning along set scan line, and subscan is carried out to above-mentioned irradiated body, thereby shone above-mentioned
Describe predetermined pattern on beam, it is comprised the following steps：
The 1st light beam from above-mentioned light supply apparatus is projected from the 1st direction towards polygonal rotating mirror；
The 2nd light beam from above-mentioned light supply apparatus is thrown from the 2nd direction different from above-mentioned 1st direction towards above-mentioned polygonal rotating mirror
Penetrate；
By the rotation of above-mentioned polygonal rotating mirror, to be incident upon the different reflectings surface of above-mentioned polygonal rotating mirror and reflect above-mentioned
1 light beam and above-mentioned 2nd light beam carry out deviation scanning；
Make above-mentioned 1st beam condenser that is reflected by above-mentioned polygonal rotating mirror and be projected to as the 1st luminous point in the 1st scan line；
And
Make above-mentioned 2nd beam condenser that is reflected by above-mentioned polygonal rotating mirror and be projected to as the 2nd luminous point in the 2nd scan line；
Above-mentioned 1st scan line is with above-mentioned 2nd scan line in the identical bits being located on above-mentioned irradiated body on above-mentioned sub-scanning direction
Put, and stagger on above-mentioned main scanning direction.
A kind of 12. pattern plotter method, while the sheet material substrate to the strip of pliability is that irradiated body enters along long side direction
Row subscan, while making based on describing the luminous point of data and intensity modulation along in orthogonal with the long side direction of above-mentioned irradiated body
Width extension scan line carry out main scanning, thereby on above-mentioned irradiated body describe it is corresponding with above-mentioned description data
Pattern, it is comprised the following steps：
1st light beam is projected from the 1st direction towards polygonal rotating mirror；
2nd light beam is projected from the 2nd direction different from above-mentioned 1st direction towards above-mentioned polygonal rotating mirror；
By the rotation of above-mentioned polygonal rotating mirror, to be incident upon the different reflectings surface of above-mentioned polygonal rotating mirror and reflect above-mentioned
1 light beam and above-mentioned 2nd light beam carry out deviation scanning；
Make above-mentioned 1st beam condenser that is reflected by above-mentioned polygonal rotating mirror and be projected to as the 1st luminous point in the 1st scan line；
And
Make above-mentioned 2nd beam condenser that is reflected by above-mentioned polygonal rotating mirror and be projected to as the 2nd luminous point in the 2nd scan line；
Each sweep length of above-mentioned 1st scan line and above-mentioned 2nd scan line is set to identical, and in above-mentioned main scanning direction with
Be spaced apart above-mentioned 1st scan line of setting and above-mentioned 2nd scan line below above-mentioned sweep length.
13. the pattern plotter method as described in claim 11 or 12, it is comprised the following steps：
Centered on rotation center axle, make above-mentioned 1st scan line and above-mentioned 2nd scan line turn, above-mentioned rotation center axle is relative
In above-mentioned irradiated body vertically through on the midpoint for connecting above-mentioned 1st scan line and the line segment at the midpoint of above-mentioned 2nd scan line
Point.
A kind of 14. pattern plotter device, while transporting irradiated body, while making the light from light supply apparatus along sub-scanning direction
Beam is concentrated on above-mentioned irradiated body in point-like, makes the luminous point after optically focused along the scan line orthogonal with above-mentioned sub-scanning direction
Main scanning is carried out, thereby describes predetermined pattern on above-mentioned irradiated body, it possesses：
Polygonal rotating mirror, rotated around set rotary shaft；
1st guide-lighting optical system, the 1st light beam from above-mentioned light supply apparatus is projected from the 1st direction towards above-mentioned polygonal rotating mirror；
2nd guide-lighting optical system, from 2nd direction different from above-mentioned 1st direction towards the projection of above-mentioned polygonal rotating mirror from above-mentioned
2nd light beam of light supply apparatus；
1st projection optics system, make above-mentioned 1st beam condenser that is reflected by above-mentioned polygonal rotating mirror and thrown as the 1st luminous point
It is incident upon in the 1st scan line；And
2nd projection optics system, make above-mentioned 2nd beam condenser that is reflected by above-mentioned polygonal rotating mirror and thrown as the 2nd luminous point
It is incident upon in the 2nd scan line；
And possess delineation unit, the delineation unit with above-mentioned irradiated body along above-mentioned main scanning direction and above-mentioned subscan
At least one direction in direction is offset horizontally by the mode for configuring above-mentioned 1st scan line and above-mentioned 2nd scan line, integratedly protects
Hold above-mentioned polygonal rotating mirror, above-mentioned 1st guide-lighting optical system, above-mentioned 2nd guide-lighting optical system, above-mentioned 1st projection optics system
And above-mentioned 2nd projection optics system and can turn；
The rotation center axle of above-mentioned delineation unit, it is set to relative to above-mentioned irradiated body vertically through above-mentioned 1st scan line
Midpoint and above-mentioned 2nd scan line midpoint between.
15. pattern plotter device as claimed in claim 14, wherein,
Above-mentioned rotation center axle, it is set in the midpoint for connecting above-mentioned 1st scan line and the line segment at the midpoint of above-mentioned 2nd scan line
Central point.
16. pattern plotter device as claimed in claim 15, wherein,
Above-mentioned 1st scan line and above-mentioned 2nd scan line, are separated on sub-scanning direction, and on above-mentioned main scanning direction
It is adjacent to each other or a part of overlapping.
A kind of 17. pattern plotter method, while transporting irradiated body, while making the light from light supply apparatus along sub-scanning direction
Beam is concentrated on above-mentioned irradiated body in point-like, makes the luminous point after optically focused along in the direction orthogonal with above-mentioned sub-scanning direction
The scan line of extension carries out main scanning, thereby describes predetermined pattern on above-mentioned irradiated body, it is comprised the following steps：
The 1st light beam from above-mentioned light supply apparatus is projected from the 1st direction towards polygonal rotating mirror；
The 2nd light beam from above-mentioned light supply apparatus is thrown from the 2nd direction different from above-mentioned 1st direction towards above-mentioned polygonal rotating mirror
Penetrate；
By the rotation of above-mentioned polygonal rotating mirror, to be incident upon the different reflectings surface of above-mentioned polygonal rotating mirror and reflect above-mentioned
1 light beam and above-mentioned 2nd light beam carry out deviation scanning；
Make above-mentioned 1st beam condenser that is reflected by above-mentioned polygonal rotating mirror and be projected to as the 1st luminous point in the 1st scan line；
Make above-mentioned 2nd beam condenser that is reflected by above-mentioned polygonal rotating mirror and be projected to as the 2nd luminous point in the 2nd scan line；
And
Centered on rotation center axle, make above-mentioned 1st scan line and above-mentioned 2nd scan line turn, above-mentioned rotation center axle is relative
It is vertical in above-mentioned irradiated body, and be set between the midpoint of above-mentioned 1st scan line and the midpoint of above-mentioned 2nd scan line.
18. pattern plotter method as claimed in claim 17, wherein,
In order that the above-mentioned predetermined pattern that should be depicted on above-mentioned irradiated body tilts and makes above-mentioned 1st scan line and the above-mentioned 2nd
Scan line turn, or, when above-mentioned predetermined pattern is overlapped on above-mentioned irradiated body into the preformed lower pattern of institute again
On to be described when, according to the entirety of above-mentioned lower pattern or a part gradient, make above-mentioned 1st scan line and the above-mentioned 2nd
Scan line turn.
19. a kind of pattern plotter device, make the light beam from light supply apparatus in carrying out main scanning on irradiated body, and make above-mentioned
Irradiated body relatively carries out subscan with above-mentioned light beam along the direction intersected with above-mentioned main scanning, thereby above-mentioned illuminated
Depicting pattern on body, it possesses：
Light is inclined to component, changes the angle of reflecting surface for above-mentioned main scanning；
1st projection optics system, projection the 1st light beam as on above-mentioned irradiated body along main scanning direction scanning light beam, on
It is the light for being projected to above-mentioned light deviation component from the 1st direction and being inclined to by above-mentioned light after the reflective surface of component to state the 1st light beam
Beam；And
2nd projection optics system, projection the 2nd light beam as on above-mentioned irradiated body along main scanning direction scanning light beam, on
It is to be projected to above-mentioned light from 2nd direction different from the 1st direction to be inclined to component and by the anti-of above-mentioned light deviation component to state the 2nd light beam
The light beam penetrated after the reflection of face；
So that by the main scanning of above-mentioned 1st light beam and formed the 1st scan line, with by the main scanning of above-mentioned 2nd light beam and
The mode that the 2nd scan line formed staggers on above-mentioned main scanning direction, configure above-mentioned 1st projection optics system and the above-mentioned 2nd
Projection optics system.
20. pattern plotter device as claimed in claim 19, wherein,
Above-mentioned 1st projection optics system is each self-contained using above-mentioned light deviation component and in master with above-mentioned 2nd projection optics system
The angle be inclined on scanning direction, the launching position with the above-mentioned light beam on main scanning direction on above-mentioned irradiated body turn into than
The f- θ lens combinations of example relation.
21. pattern plotter device as claimed in claim 20, wherein,
Above-mentioned 1st projection optics system and above-mentioned 2nd projection optics system it is each it is self-contained be configured at above-mentioned f- θ lens combinations with it is upper
State the reflecting member between light deviation component；
The reflecting member, in the face for being inclined to above-mentioned light beam by above-mentioned light deviation component, bend above-mentioned light beam.
22. pattern plotter device as claimed in claim 21, wherein,
Above-mentioned light deviation component is the polygonal rotating mirror rotated around rotary shaft, and above-mentioned 1st light beam is by the 1st of above-mentioned polygonal rotating mirror
Reflective surface, above-mentioned 2nd light beam by above-mentioned polygonal rotating mirror 2nd reflective surfaces different from above-mentioned 1st reflecting surface.
23. pattern plotter device as claimed in claim 22, it is further equipped with intensity adjustment member；
The intensity adjustment member is to above-mentioned in the Strength Changes and main scanning direction of above-mentioned 1st light beam on main scanning direction
The Strength Changes of 2nd light beam are adjusted, and the Strength Changes of above-mentioned 1st light beam on above-mentioned main scanning direction pass through the above-mentioned 1st
Light beam produces, above-mentioned master toward the change of the incidence angle of above-mentioned reflecting member injection contained in above-mentioned 1st projection optics system
The Strength Changes of above-mentioned 2nd light beam on scanning direction are by above-mentioned 2nd light beam toward contained in above-mentioned 2nd projection optics system
The change for the incidence angle that above-mentioned reflecting member is injected and produce.
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| US20230266674A1 (en) * | 2020-05-09 | 2023-08-24 | Inspec Inc. | Drawing method, drawing device, and program |
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| Publication number | Publication date |
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| JP6627875B2 (en) | 2020-01-08 |
| TW201702762A (en) | 2017-01-16 |
| KR20230173214A (en) | 2023-12-26 |
| JPWO2016204267A1 (en) | 2018-04-12 |
| CN111665687B (en) | 2023-06-16 |
| JP6614319B2 (en) | 2019-12-04 |
| JP6911907B2 (en) | 2021-07-28 |
| CN107735715B (en) | 2020-07-17 |
| WO2016204267A1 (en) | 2016-12-22 |
| HK1243772A1 (en) | 2018-07-20 |
| JP2019074748A (en) | 2019-05-16 |
| CN111665687A (en) | 2020-09-15 |
| TWI736147B (en) | 2021-08-11 |
| TWI689788B (en) | 2020-04-01 |
| JP2020064306A (en) | 2020-04-23 |
| TW202022506A (en) | 2020-06-16 |
| KR102680203B1 (en) | 2024-07-02 |
| KR20180018568A (en) | 2018-02-21 |
| CN111665686B (en) | 2024-01-05 |
| CN111665686A (en) | 2020-09-15 |
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