KR102680203B1 - Pattern drawing device and pattern drawing method - Google Patents

Abstract

The scanning line placement accuracy and optical performance required for high-detail pattern drawing are maintained stably. Pattern writing, in which a predetermined pattern is drawn on the substrate P by main scanning the spot light SP collected on the substrate P along the drawing line SL and sub-scanning the substrate P. The device EX collects the first beam LBa reflected from the polygon mirror PM and projects it as spot light SPa on the first drawing line SLa, while also reflecting the first beam LBa from the polygon mirror PM. The second beam LBb is condensed and projected onto the second drawing line SLb as spot light SPb. These two drawing lines (SLa, SLb) are at the same position on the substrate P in the direction of the sub-scanning, and are positioned shifted in the direction of the main scanning.

Description

Pattern drawing device and pattern drawing method

The present invention relates to a pattern drawing device and a pattern drawing method for drawing a pattern by scanning spot light of a beam irradiated onto an irradiated object.

As disclosed in Japanese Patent Application Laid-Open No. 2004-117865, in a laser scanning device (color laser printer) that draws an image on a photoconductor by scanning laser light, one polygon mirror is used. There is a known technology for scanning each of a plurality of laser beams and drawing an image along a plurality of scanning lines.

In Japanese Patent Laid-Open No. 2004-117865, the scanning lines generated by a plurality of laser beams deflected and scanned from each of the different reflection surfaces of one polygon mirror are separated in the sub-scanning direction, which is the movement direction of the irradiated object. A tandem type laser scanning device arranged in parallel is disclosed. In the case of the laser scanning device disclosed in Japanese Patent Application Laid-Open No. 2004-117865, the maximum dimension of the scanning line direction (main scanning direction) of an image that can be drawn on an irradiated object (photosensitive drum, etc.) is the length of one scanning line. It is set as Therefore, in order to increase the size of the main scanning direction of the image that can be drawn, it is necessary to enlarge the scanning optical system (lens, mirror, etc.) behind the polygon mirror so that the scanning line becomes longer. On the other hand, in an exposure device that draws and exposes high-precision patterns for electronic circuits with a minimum line width of about several ㎛ to 20 ㎛ by scanning spot light, the size (diameter) of the spot light is set to a fraction (1/2 to 1/2) of the minimum line width. 4) In addition to accuracy, it is necessary to control the intensity modulation of the spot light according to the data of the drawing pattern with high precision and high speed in synchronization with the projection position of the spot light on the scanning line. However, if one scanning line generated by deflection scanning of the beam using a polygon mirror is lengthened, the scanning line placement accuracy and optical performance required for high-precision pattern drawing can be stably maintained as the scanning optical system behind the polygon mirror becomes larger. It becomes difficult to do.

In the first form of the present invention, a beam from a light source device is condensed into a spot on an irradiated object, and the condensed spot light is mainly scanned along a predetermined scanning line. In addition, a pattern drawing device for drawing a predetermined pattern on the irradiated object by sub-scanning the irradiated object, comprising: a rotating multi-faceted mirror rotating around a rotation axis for the main scanning; , a first light guide optical system that projects the first beam from the light source device toward the rotating polygonal mirror from a first direction, and a second light guide optical system that projects the second beam from the light source device toward the rotating polygonal mirror in a second direction different from the first direction. a second light guiding optical system that projects from a direction toward the rotating polygonal mirror, a first projection optical system that condenses the first beam reflected from the rotating polygonal mirror and projects it as a first spot light onto a first scanning line, and the rotating A second projection optical system is provided for condensing the second beam reflected from the multi-sided mirror and projecting it as a second spot light onto a second scanning line, wherein the first scanning line and the second scanning line are aligned with the sub-scanning line on the irradiated object. The first projection optical system and the second projection optical system were arranged so that they were at the same position with respect to the direction and were shifted in the direction of the main scanning.

The second aspect of the present invention sub-scans an irradiated object, which is a flexible, long sheet substrate, in the longitudinal direction, while emitting spot light whose intensity is modulated based on drawing data. A pattern drawing device that draws a pattern according to the drawing data on the irradiated object by main scanning along a scanning line extending in a width direction perpendicular to the longitudinal direction of the irradiated object, wherein for the main scanning, a pattern is drawn around a rotation axis. A rotating polygonal mirror that rotates, a first light guiding optical system that projects a first beam from a first direction toward the rotating polygonal mirror, and a second beam that projects a second beam toward the rotating polygonal mirror from a second direction different from the first direction. a second light guiding optical system, a first projection optical system that condenses the first beam reflected from the rotating polygonal mirror and projects it on a first scanning line as a first spot light, and the second beam reflected from the rotating polygonal mirror A second projection optical system is provided for condensing light and projecting it as a second spot light onto a second scanning line, wherein each scanning length of the first scanning line and the second scanning line is set to be the same, and the first scanning line and the second scanning line are set to the same level. The first projection optical system and the second projection optical system were arranged so that two scanning lines were set apart from each other in the direction of the main scanning by an interval equal to or less than the scanning length.

In a third aspect of the present invention, a beam from a light source device is condensed into a spot on an irradiated object, and the condensed spot light is mainly scanned along a predetermined scanning line and sub-scanned the irradiated object, thereby forming a spot on the irradiated object. A pattern drawing method for drawing a predetermined pattern on an image, comprising: projecting a first beam from the light source device toward a rotating polygonal mirror from a first direction; and projecting a second beam from the light source device in a direction different from the first direction. Projecting toward the rotating polygonal mirror from another second direction, deflecting and scanning the first beam and the second beam incident on and reflecting on another reflecting surface of the rotating polygonal mirror by rotation of the rotating polygonal mirror, The first beam reflected from the rotating polygonal mirror is condensed and projected onto a first scanning line as first spot light, and the second beam reflected from the rotating polygonal mirror is condensed and projected onto a second scanning line as second spot light. and projection onto an image, wherein the first scanning line and the second scanning line are at the same position on the object to be scanned with respect to the direction of the sub-scanning, and are shifted in the direction of the main scanning.

The fourth aspect of the present invention sub-scans an irradiated object, which is a flexible, long sheet substrate, in the longitudinal direction, and transmits spot light whose intensity is modulated based on drawing data in a width direction perpendicular to the longitudinal direction of the irradiated object. A pattern drawing method for drawing a pattern according to the drawing data on the object by main scanning along an extending scanning line, the method comprising: projecting a first beam from a first direction toward a rotating polygonal mirror; and projecting a second beam from a first direction. Projecting toward the rotating polygonal mirror from a second direction different from the first direction, and the first beam and the second beam incident on and reflecting on another reflecting surface of the rotating polygonal mirror, according to the rotation of the rotating polygonal mirror. deflected scanning by concentrating the first beam reflected from the rotating polygonal mirror and projecting it onto a first scanning line as a first spot light, and concentrating the second beam reflected from the rotating polygonal mirror to create a second spot light. and projecting spot light onto a second scanning line, wherein each scanning length of the first scanning line and the second scanning line is set to be equal, and the first scanning line and the second scanning line are projected in the direction of the main scanning line. They are set separately at intervals equal to or less than the scan length.

A fifth aspect of the present invention is to convey a beam from a light source device to a spot on the irradiated object while conveying the irradiated object in the sub-scanning direction, and to main scan the condensed spot light along a scanning line perpendicular to the direction of the sub-scanning. A pattern drawing device for drawing a predetermined pattern on the irradiated object, comprising: a rotating polygonal mirror that rotates around a predetermined rotation axis; and directing a first beam from the light source device toward the rotating polygonal mirror from a first direction. a first light guiding optical system for projecting, a second light guiding optical system for projecting a second beam from the light source device toward the rotating polygonal mirror from a second direction different from the first direction, and the beam reflected from the rotating polygonal mirror A first projection optical system for condensing a first beam and projecting it on a first scanning line as first spot light, and concentrating the second beam reflected from the rotating polygonal mirror and projecting it on a second scanning line as second spot light. It has a second projection optical system, and the first scanning line and the second scanning line are arranged parallel to each other in at least one of the main scanning direction and the sub-scanning direction on the object. A first light guiding optical system, a second light guiding optical system, a first projection optical system, and a drawing unit capable of rotating while integrally holding the second projection optical system, wherein the rotational central axis of the drawing unit is the first light guiding optical system. It is set to pass perpendicularly to the irradiated object between the midpoint of the scanning line and the midpoint of the second scanning line.

In a sixth aspect of the present invention, a beam from a light source device is condensed into a spot on the irradiated object while conveying the irradiated object in the sub-scanning direction, and the condensed spot light is divided into a scanning line extending in a direction perpendicular to the sub-scanning direction. A pattern drawing method for drawing a predetermined pattern on the irradiated object by main scanning along , comprising: projecting a first beam from the light source device toward a rotating polygonal mirror from a first direction; Projecting a second beam toward the rotating polygonal mirror from a second direction different from the first direction, and the first beam and the second beam incident on and reflecting on another reflective surface of the rotating polygonal mirror, the rotating polygonal mirror Deflection scanning by rotation of the multi-sided mirror, condensing the first beam reflected from the rotating multi-mirror and projecting it on a first scanning line as a first spot light, and projecting the second beam reflected from the rotating multi-mirror onto a first scanning line. Concentrating light and projecting it onto a second scanning line as a second spot light, and centering on a rotational central axis perpendicular to the irradiated object and set between the midpoint of the first scanning line and the midpoint of the second scanning line, It includes rotating the first scan line and the second scan line.

A seventh aspect of the present invention is to main scan a beam from a light source device on an irradiated object and relatively sub-scan the irradiated object and the beam in a direction intersecting the main beam, thereby creating a pattern on the irradiated object. A pattern drawing device for drawing, comprising: an optical deflection member that changes an angle of a reflective surface for the main scanning; and a first beam projected to the optical deflection member from a first direction and reflected by the reflective surface of the optical deflection member. A first projection optical system that projects a beam scanned in the main scanning direction on an irradiated object, and a second beam that is projected onto the light deflection member from a second direction different from the first direction and reflected by the reflection surface of the light deflection member, A second projection optical system is provided to project a beam scanned in the main scanning direction on the irradiated object, a first scanning line formed by the main scanning of the first beam, and a second scanning line formed by the main scanning of the second beam. The first projection optical system and the second projection optical system were arranged so as to be positioned in the direction of the main scanning.

1 is a diagram showing a schematic configuration of a device manufacturing system including an exposure apparatus that performs exposure processing on a substrate of the first embodiment.
FIG. 2 is a diagram showing the arrangement relationship of a plurality of drawing units shown in FIG. 1 and the arrangement relationship of drawing lines of each drawing unit installed on the irradiated surface of the substrate.
Fig. 3 is a diagram showing the arrangement relationship of drawing lines of each drawing unit when the ends of adjacent drawing lines in the main scanning direction are aligned with each other.
FIG. 4 is a diagram showing the arrangement relationship of the drawing lines of each drawing unit when the ends of adjacent drawing lines in the scanning direction overlap each other by a certain length.
Fig. 5 is a configuration diagram of the drawing unit shown in Fig. 1 as seen from the -Yt (-Y) direction side.
Fig. 6 is a configuration diagram of the drawing unit shown in Fig. 5 as seen from the +Zt direction side.
FIG. 7 is a diagram showing the optical path of a beam that passes through the optical element and collimating lens shown in FIG. 5 and enters the reflecting mirror as seen from the +Zt direction.
Fig. 8 is a diagram showing the optical path of a beam incident from a reflective mirror to the reflective mirror of the writing unit as seen from the +Xt direction.
FIG. 9 is a diagram showing the arrangement relationship between a reflecting mirror as a reflecting member in the drawing unit shown in FIG. 5 and a condensing lens as seen within the XtZt plane.
FIG. 10 is a diagram showing the arrangement relationship between the reflecting mirror as the reflecting member shown in FIG. 9 and the condensing lens as seen within the XtYt plane.
FIG. 11A is a view from the +Zt direction showing how the reflection direction of a beam incident parallel to a reflection mirror as a reflection member changes when the entire drawing unit shown in FIG. 5 is rotated around the rotation center axis by a predetermined angle. , and FIG. 11B is a diagram showing the change in the position of the beam in the reflective mirror as a reflective member when the entire drawing unit shown in FIG. 5 is rotated by a predetermined angle, as seen from the direction in which the beam travels.
Fig. 12 is a diagram showing the beam scanning system using a polygon mirror in Modification Example 1 of the first embodiment when viewed from the +Zt direction.
FIG. 13 is a view of the beam scanning system of FIG. 12 when viewed from the +Xt direction.
FIG. 14 is a diagram showing the optical path of a beam incident on and reflected by a polygon mirror in Modification Example 2 of the first embodiment when viewed from the +Zt direction.
FIG. 15 is a diagram when the beam scanning system of FIG. 14 is viewed from the +Xt direction.
FIG. 16A is a view of the beam scanning system using a polygon mirror in Modification Example 4 of the first embodiment when viewed from the +Zt direction, and FIG. 16B is a view of the beam scanning system of FIG. 16A when viewed from the -Xt direction. This is a drawing of
Fig. 17 is a diagram showing the configuration of a part of a drawing unit in the second embodiment.
Fig. 18 is a configuration diagram of the drawing unit Ub of the third embodiment as seen from the -Yt (-Y) direction side.
FIG. 19 is a diagram showing the configuration of the +Zt side of the drawing unit shown in FIG. 18 from the polygon mirror as seen from the +Xt direction.
FIG. 20 is a diagram showing the configuration of the drawing unit shown in FIG. 18 on the -Zt direction side from the polygon mirror as seen from the +Zt direction side.
FIG. 21 is an example of dividing the exposure area as the electronic device formation area formed on the substrate into six in the Y (Yt) direction and drawing a pattern on each of the plurality of stripe-shaped divided areas using six drawing lines. represents.
Fig. 22 is a diagram showing an example of the arrangement angle of a reflection mirror provided behind the fθ lens of the third embodiment.
FIG. 23 is a diagram showing an example configuration of a beam distribution system for distributing two beams provided from the light source device 14 shown in FIG. 1 to each of the four drawing units shown in FIG. 2.
Fig. 24 is a diagram explaining the deflection state of the beam between the polygon mirror of the drawing unit according to the fourth embodiment and the subsequent reflection mirror.
FIG. 25 is a graph showing characteristics according to an example of the incidence angle dependence of reflectance in the polygon mirror or reflective mirror of FIG. 24.
Figure 26 is a diagram showing the configuration of a control system using an acousto-optic modulation element (AOM) for adjusting the variation in beam intensity due to the incidence angle dependence of the reflectance of the reflecting mirror.
FIG. 27 is a time chart showing an example of the waveforms and timing of signals of each part in the control system of FIG. 26.

A pattern drawing device and a pattern drawing method according to an aspect of the present invention will be described in detail below, with preferred embodiments listed and referring to the attached drawings. In addition, the form of the present invention is not limited to these embodiments, and also includes those with various changes or improvements. That is, the components described below include those that can be easily imagined by those skilled in the art and those that are substantially the same, and the components described below can be appropriately combined. Additionally, various omissions, substitutions, or changes to the components may be made without departing from the gist of the present invention.

[First Embodiment]

FIG. 1 is a diagram showing a schematic configuration of a device manufacturing system 10 including an exposure apparatus EX that performs exposure processing on a substrate (subject to be irradiated) P according to the first embodiment. In addition, in the following description, an XYZ orthogonal coordinate system is set with the direction of gravity being the Z direction, and unless otherwise specified, the X direction, Y direction, and Z direction are explained along the arrows shown in the drawings.

The device manufacturing system 10 is a manufacturing line that manufactures, for example, flexible displays as electronic devices, film-shaped touch panels, film-shaped color filters for liquid crystal display panels, or flexible wiring sheets to which electronic components are soldered. This is a built manufacturing system. Hereinafter, the description will be made assuming a flexible display as an electronic device. Examples of flexible displays include organic EL displays and liquid crystal displays. In the device manufacturing system 10, a substrate P is delivered from a supply roll (not shown) in which a flexible sheet-shaped (film-shaped) substrate (sheet substrate) P is wound into a roll, and the delivered substrate P After continuously performing various treatments on the substrate P, the substrate P after various treatments is wound on a recovery roll (not shown), which has a so-called roll-to-roll structure. The substrate P has a strip-shaped shape in which the moving direction of the substrate P is the long longitudinal direction (long axis) and the width direction is the short longitudinal direction (short axis). The substrate P sent from the supply roll is sequentially subjected to various processes in the process device PR1, the exposure device (pattern drawing device, beam scanning device) EX, and the process device PR2, etc. It is wound on a recovery roll.

In addition, the The Y direction is a direction perpendicular to the X direction in the horizontal plane and is the width direction of the substrate P. The Z direction is a direction perpendicular to the X and Y directions (upwards) and is parallel to the direction in which gravity acts.

As the substrate P, for example, a resin film or a foil made of a metal such as stainless steel or an alloy is used. Materials of the resin film include, for example, polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin, those containing at least one or more may be used. In addition, the thickness and rigidity (Young's modulus) of the substrate P are determined by determining whether the substrate P has folds or irreversible wrinkles due to buckling when passing through the conveyance path of the exposure device EX. It is good if it is in a range where this does not occur. As a base material for the substrate P, a film such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) with a thickness of about 25 μm to 200 μm is typical of a preferable sheet substrate.

Since the substrate P may receive heat in each process performed in the process device PR1, the exposure device EX, and the process device PR2, the substrate P is made of a material whose thermal expansion coefficient is not significantly large. ) is desirable to select. For example, the thermal expansion coefficient can be suppressed by mixing an inorganic filler into the resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, or silicon oxide. In addition, the substrate P may be a single layer of very thin glass with a thickness of about 100 μm manufactured by a float method or the like, or may be a laminate in which the above-mentioned resin film, foil, etc. are bonded to this very thin glass.

However, the flexibility of the substrate P means that the substrate P can be bent without shearing or breaking even if a force equivalent to its own weight is applied to the substrate P. It refers to nature. Additionally, the property of bending under a force equivalent to its own weight is also included in flexibility. Additionally, the degree of flexibility varies depending on the material, size, and thickness of the substrate P, the layer structure formed on the substrate P, and the environment such as temperature and humidity. As a result, when the substrate P is correctly wound around the conveyance direction changing members such as various conveyance rollers and rotary drums provided in the conveyance path in the device manufacturing system 10 according to the first embodiment, the substrate P buckles and folds. If the substrate P can be transported smoothly without cracks or damage (tears or cracks), it can be said to be within the range of flexibility.

The process device PR1 performs pre-processing on the substrate P subjected to exposure processing in the exposure device EX. The process device PR1 sends the substrate P that has undergone the previous process to the exposure device EX. Through this previous process, the substrate P sent to the exposure device EX is a substrate (photosensitive substrate) P having a photosensitive functional layer (photosensitive layer, photosensitive layer) formed on its surface. It is done.

This photosensitive functional layer is applied as a solution on the substrate P and dried to form a layer (film). A typical photosensitive functional layer is a photoresist, but it is a material that does not require development treatment, and a photosensitive silane coupling agent (SAM), which improves the lyophilic properties of the area irradiated with ultraviolet rays, or irradiated with ultraviolet rays. There are photosensitive reducing agents that reveal plating reducing groups in the exposed area. When a photosensitive silane coupling agent is used as the photosensitive functional layer, the pattern portion exposed to ultraviolet rays on the substrate P is modified from lyophilic to lyophilic. Therefore, by selectively applying conductive ink (ink containing conductive nanoparticles such as silver or copper) or a liquid containing semiconductor material on the lyophilic part, electrodes forming thin film transistors (TFTs), etc., semiconductors are formed. , a pattern layer that serves as insulation or connection wiring can be formed. When a photosensitive reducing agent is used as the photosensitive functional layer, plating reducing groups are exposed in the pattern portion exposed to ultraviolet rays on the substrate P. Therefore, after exposure, the substrate P is immediately immersed in a plating solution containing palladium ions or the like for a certain period of time, thereby forming (precipitating) a patterned layer of palladium. This plating process is an additive process, but in the case where the etching process is assumed to be a subtractive process, the substrate P sent to the exposure device EX has a base material of PET. Alternatively, it is acceptable to use PEN, deposit a metallic thin film such as aluminum (Al) or copper (Cu) on the entire surface or selectively, and further laminate a photoresist layer on top.

In the first embodiment, the exposure apparatus EX is a straight-drawing exposure apparatus that does not use a mask, a so-called raster scanning exposure apparatus. The exposure device EX irradiates the irradiated surface (photosensitive surface) of the substrate P supplied from the process device PR1 with a light pattern according to a predetermined pattern such as a display circuit or wiring. . As will be explained in detail below, the exposure device EX transfers the substrate P in the + While scanning (main scanning) in one dimension (on the irradiated surface of (P)) in a predetermined scanning direction (Y direction), the intensity of spot light (SP) is modulated (changed) at high speed according to pattern data (drawing data). on/off). As a result, a light pattern according to a predetermined pattern such as a display circuit or wiring is drawn and exposed on the irradiated surface of the substrate P. That is, by the sub-scanning of the substrate P and the main scanning of the spot light SP, the spot light SP is scanned relatively two-dimensionally on the irradiated surface of the substrate P, so that a predetermined pattern is formed on the substrate P. The drawing is exposed. In addition, the exposure apparatus EX repeatedly performs pattern exposure for electronic devices on the substrate P, and the substrate P is transported along the transport direction (+X direction), so that the exposure apparatus EX Thus, a plurality of exposure areas W where the pattern is exposed are provided at predetermined intervals along the long direction of the substrate P (see Fig. 2). Since an electronic device is formed in this exposure area W, the exposure area W is also an electronic device formation area. Additionally, since the electronic device is constructed by overlapping a plurality of pattern layers (layers on which patterns are formed), the pattern corresponding to each layer is exposed by the exposure device EX.

The process device PR2 performs post-processing (for example, plating processing, development/etching processing, etc.) on the substrate P exposed in the exposure device EX. Through this post-processing, a device pattern layer is formed on the substrate P.

As described above, since an electronic device is constructed by overlapping a plurality of pattern layers, one pattern layer is generated through at least each process of the device manufacturing system 10. Therefore, in order to produce an electronic device, each process of the device manufacturing system 10 as shown in FIG. 1 must be performed at least twice. Therefore, the pattern layer can be laminated by mounting the collection roll on which the substrate P is wound as a supply roll to another device manufacturing system 10. By repeating such operations, an electronic device is formed. Therefore, the substrate P after processing is in a state in which a plurality of electronic devices are connected along the elongate direction of the substrate P at a predetermined interval. That is, the substrate P is a multi-faceted substrate.

The recovery roll that collects the substrate P formed with the electronic device connected may be mounted on a dicing device (not shown). A dicing device equipped with a recovery roll divides (dices) the processed substrate P into electronic devices, thereby forming a plurality of sheet electronic devices. The size of the substrate P is, for example, about 10 cm to 2 m in the width direction (short direction) and 10 m or more in the longitudinal direction (long direction). Additionally, the dimensions of the substrate P are not limited to the above-mentioned dimensions.

Next, the exposure apparatus EX will be described in detail. The exposure apparatus EX is stored in a temperature control chamber (ECV). This temperature control chamber (ECV) maintains the inside at a predetermined temperature and a predetermined humidity, thereby suppressing shape changes due to the temperature of the substrate P transported inside, and also reducing the hygroscopicity and transportation of the substrate P. Therefore, the humidity is set in consideration of the generated static electricity. The temperature control chamber (ECV) is disposed on the installation surface E of the manufacturing plant via passive or active vibration isolation units SU1 and SU2. The vibration isolation units SU1 and SU2 reduce vibration from the installation surface E. This installation surface E may be a surface on an installation foundation (pedestal) specially laid on the floor of the factory, or it may be the floor. The exposure apparatus EX is provided with a substrate transport mechanism 12. ), a light source device 14, an exposure head 16, a control device 18, and an alignment microscope (AMa (AMa1 to AMa4), AMb (AMb1 to AMb4)).

The substrate transport mechanism 12 transports the substrate P transported from the process apparatus PR1 to the process apparatus PR2 at a predetermined speed. By this substrate transport mechanism 12, the transport path of the substrate P transported within the exposure apparatus EX is defined. The substrate transport mechanism 12 includes, in order from the upstream side (-X direction side) of the transport direction of the substrate P, an edge position controller (EPC), a drive roller R1, a tension adjustment roller RT1, and a rotary drum. It has a (cylindrical drum stage) (DR1), a tension adjustment roller (RT2), a rotating drum (cylindrical drum stage) (DR2), a tension adjustment roller (RT3), and a drive roller (R2).

Edge position controller EPC adjusts the position in the width direction (short direction of the board|substrate P as the Y direction) of the board|substrate P conveyed from process apparatus PR1. In other words, the edge position controller (EPC) determines that the position at the end (edge) in the width direction of the substrate P being transported with a predetermined tension applied is approximately ±10 to several tens of micrometers relative to the target position. The substrate P is moved in the width direction so as to fall within the range (allowable range), and the position of the substrate P in the width direction is adjusted. The edge position controller (EPC) includes a roller on which the substrate P is hung with a predetermined tension applied, and an edge sensor (not shown) that detects the position of the end portion (edge) in the width direction of the substrate P. It has an end detection unit). The edge position controller (EPC) moves the roller of the edge position controller (EPC) in the Y direction based on the detection signal detected by the edge sensor, and adjusts the position in the width direction of the substrate P. Drive roller (nip roller) R1 rotates while maintaining both front and back surfaces of the substrate P conveyed from edge position controller EPC, and conveys the substrate P toward rotary drum DR1. Edge position controller EPC is positioned in the width direction of the substrate P so that the long direction of the substrate P conveyed by the rotary drum DR1 is orthogonal to the central axis AXo1 of the rotary drum DR1. Adjust the position. The board|substrate P conveyed from drive roller R1 is caught by tension adjustment roller RT1, and is then guided to rotary drum DR1.

The rotating drum (first rotating drum) DR1 has a central axis (first central axis) AXo1 extending in the Y direction and extending in a direction intersecting the direction in which gravity acts, and a central axis (AXo1) extending in the direction intersecting the direction in which gravity acts. It has a cylindrical outer circumference of a certain radius. The rotary drum DR1 supports a part of the substrate P by bending it into a cylindrical shape in the elongated direction along this outer peripheral surface (circumferential surface), and rotates about the central axis AXo1 to move the substrate P by +X. Return in direction. The rotating drum DR1 supports the substrate P from the side opposite to the direction in which gravity acts (+Z direction side) and from the side opposite to the side on which the photosensitive surface is formed (back side). The rotating drum DR1 has an area (portion) on the substrate P on which the spot light of the beam from each of the drawing units U1, U2, U5, and U6 of the exposure head 16 described later is projected, on its circumferential surface. I support it. On both sides of the rotary drum DR1 in the Y direction, a shaft Sft1 supported by annular bearings is provided so that the rotary drum DR1 rotates around the central axis AXo1. This shaft Sft1 rotates around the central axis AXo1 by applying a rotational torque from a rotational drive source (for example, a motor or a reduction mechanism, etc.), not shown, controlled by the control device 18. Additionally, for convenience, the plane that includes the central axis (AXo1) and is parallel to the YZ plane is called the central plane (Poc1).

After the board|substrate P unloaded from rotary drum DR1 is hung by tension adjustment roller RT2, it is guided to rotary drum DR2 provided downstream from rotary drum DR1 (+X direction side). The rotary drum (second rotary drum) DR2 has the same structure as the rotary drum DR1. That is, the rotating drum DR2 has a central axis (second central axis) AXo2 extending in the Y direction and extending in a direction intersecting the direction in which gravity acts, and a cylindrical shape with a constant radius from the central axis AXo2. It has an outer peripheral surface of The rotary drum DR2 supports a part of the substrate P by bending it into a cylindrical shape in the elongated direction along this outer peripheral surface (circumferential surface), and rotates about the central axis AXo2 to move the substrate P by +X. Return in direction. Rotating drum DR2 supports the substrate P from the back side on the side opposite to the direction in which gravity acts (+Z direction side). The rotating drum DR2 supports, on its circumferential surface, a region (portion) on the substrate P where spot light of the drawing beam from each of the drawing units U3 and U4 of the exposure head 16 described later is projected. do. The rotating drum DR2 is also provided with a shaft Sft2. This shaft Sft2 rotates around the central axis AXo2 by applying a rotational torque from a rotational drive source (for example, a motor or a reduction mechanism, etc.), not shown, controlled by the control device 18. The central axis AXo1 of the rotary drum DR1 and the central axis AXo2 of the rotary drum DR2 are parallel. Also, for convenience, the plane that includes the central axis (AXo2) and is parallel to the YZ plane is called the central plane (Poc2).

The substrate P unloaded from the rotary drum DR2 is hung on the tension adjustment roller RT2 and then guided to the drive roller R2. Like the drive roller R1, the drive roller (nip roller) R2 rotates while holding both front and back surfaces of the substrate P, and conveys the substrate P toward the process device PR2. The tension adjustment rollers RT1 to RT3 are pressed in the -Z direction and apply a predetermined tension in the elongate direction to the substrate P wound and supported by rotary drums DR1 and DR2. As a result, the tension in the elongated direction applied to the substrate P caught on the rotating drums DR1 and DR2 is stabilized within a predetermined range. Additionally, the control device 18 rotates the drive rollers R1 and R2 by controlling a rotation drive source (for example, a motor, a reducer, etc.), not shown.

The light source device 14 has a light source (pulse light source) and emits a pulsed beam (pulse light, laser) LB to each of the drawing units U1 to U6. This beam LB is ultraviolet light having a peak wavelength in a wavelength band of 370 nm or less, and the emission frequency of the beam LB is set to Fs. The light source device 14 emits the beam LB at the light emission frequency Fs under the control of the control device 18.

The exposure head 16 is provided with a plurality of drawing units U (U1 to U6) into which the beam LB from the light source device 14 is incident, respectively. The exposure head 16 draws a pattern on a portion of the substrate P supported by the circumferential surfaces of the rotating drums DR1 and DR2 using a plurality of drawing units U (U1 to U6). The exposure head 16 is a so-called multi-beam type exposure head by having a plurality of drawing units U (U1 to U6) with the same configuration. The drawing units U1, U5, U2, and U6 are provided on the upper part of the rotary drum DR1, and the drawing units U3, U4 are provided on the upper part of the rotary drum DR2. The drawing units U1 and U5 are arranged on the upstream side (- . The drawing units U2 and U6 are arranged on the downstream side (+ In addition, the drawing unit U3 is arranged on the upstream side (-X direction side) of the conveyance direction of the substrate P with respect to the center plane Poc2. The drawing unit U4 is arranged on the downstream side (+X direction side) in the conveyance direction of the substrate P with respect to the center plane Poc2. The drawing units U1 and U5 and the drawing units U2 and U6 are provided symmetrically with respect to the center plane Poc1, and the drawing units U3 and U4 are provided symmetrically with respect to the center plane Poc2. It is arranged symmetrically.

Each drawing unit U (U1 to U6) converges each of the two beams LB sent from the light source device 14 on the irradiated surface of the substrate P, While projecting onto the irradiated surface of the substrate P, two spot lights SP converged on the irradiated surface of the substrate P are scanned in one dimension along two predetermined drawing lines (scan lines) SLa and SLb. The configuration of this drawing unit U will be explained in detail later, but in this first embodiment, one drawing unit U includes one rotating polygon mirror (beam deflector, light deflecting member) and two An fθ lens system (scanning optical system) is provided, and one drawing unit U (U1 to U6) forms scanning lines using spot light SP at each of two different locations on the substrate P. . Therefore, two beams LB are sent from the light source device 14 to each drawing unit U. In addition, the beam LB from the light source device 14 is split into a plurality of beams LB via a beam distribution system composed of a reflection mirror and a beam splitter (not shown), and each drawing unit It is assumed that two beams LB are incident on each of (U(U1 to U6)).

In each drawing unit U(U1 to U6), in the The two beams LB are irradiated toward the substrate P so that they move toward each other. As a result, the optical path (beam central axis) of the two beams LB extending from each drawing unit U (U1 to U6) toward the two drawing lines SLa and SLb on the substrate P is along the XZ plane. is parallel to the normal line of the irradiated surface of the substrate P. In this first embodiment, the optical path (beam central axis) of the beam LB advancing from the drawing units U1 and U5 toward the rotating drum DR1 is set so that the angle is -θ1 with respect to the center plane Poc1. It is done. The optical path (beam central axis) of the beam LB extending from the drawing units U2 and U6 toward the rotary drum DR2 is set so that the angle is +θ1 with respect to the center plane Poc1. Moreover, the optical path (beam central axis) of the beam LB advancing from the drawing unit U3 toward the rotary drum DR2 is set so that the angle is -θ1 with respect to the center plane Poc2. The optical path (beam central axis) of the beam LB extending from the drawing unit U4 toward the rotary drum DR2 is set so that the angle is +θ1 with respect to the center plane Poc2. In addition, in each drawing unit U(U1 to U6), the beam LB irradiating the two drawing lines SLa and SLb is perpendicular to the irradiated surface of the substrate P in a plane parallel to the YZ plane. To achieve this, the beam LB is irradiated toward the substrate P. That is, with respect to the main scanning direction of the spot light SP on the irradiated surface, the beam LB projected on the substrate P is scanned in a telecentric state.

A plurality of drawing units U(U1 to U6) are arranged in a predetermined arrangement relationship as shown in FIG. 2 . The two drawing lines SLa and SLb of each drawing unit U(U1 to U6) extend in the main scanning direction, that is, the Y direction, and extend in the sub-scanning direction (X direction) on the irradiated surface of the substrate P. They are at the same position with respect to , and are arranged shifted in the main scanning direction (Y direction). That is, the drawing lines SLa and SLb of each drawing unit U(U1 to U6) are arranged in parallel and spaced apart only in the main scanning direction (Y direction). In addition, the scanning lengths of the drawing lines SLa and SLb are set to be the same, and the drawing lines SLa and SLb are set to be spaced apart from each other in the main scanning direction at an interval equal to or less than the scanning length.

As shown in FIG. 2 , the drawing lines SLa and SLb of the plurality of drawing units U(U1 to U6) are aligned in the Y direction (substrate P). (width direction, main scanning direction), they are not separated from each other but are arranged to be connected to each other. Each drawing unit (U(U1 to U6)) adjusts the tilt in the A small rotation is possible with a resolution of μrad. This rotational central axis AXr is the center point (midpoint) of a line segment connecting the midpoint of the drawing line (first scanning line) SLa and the midpoint of the drawing line (second scanning line) SLb with respect to the substrate P. It is an axis that passes vertically. The extension of the axis intersects the central axis AXo1 of the rotary drum DR1 in FIG. 1 or the central axis AXo2 of the rotary drum DR2. Moreover, in the first embodiment, the drawing line SLa and the drawing line SLb of each drawing unit U (U1 to U6) are at the same position in the sub-scanning direction and are spaced apart from each other in the main scanning direction. Therefore, the rotation central axis AXr is arranged on a straight line passing through the drawing lines SLa and SLb, and is placed at the center point of the gap between the drawing lines SLa and SLb.

When the drawing unit (U(U1 to U6)) rotates (rotates) even by a small amount around the rotation central axis (AXr), the drawing lines (SLa, SLb) on which the spot light (SP) of the beam LB is scanned also change. , and rotates (rotates) around the rotation center axis (AXr) accordingly. As a result, when the drawing unit U (U1 to U6) rotates by a certain angle, the drawing lines SLa and SLb also rotate at a constant angle with respect to the Y direction (Y axis) around the rotation central axis AXr. It becomes inclined as per the angle. Each of these drawing units U(U1 to U6) rotates around the rotation central axis AXr under the control of the control device 18 by a highly responsive drive mechanism (not shown) including an actuator.

Additionally, the two drawing lines (SLa, SLb) of the drawing unit (U1) are denoted by SL1a and SL1b, and similarly, the two drawing lines (SLa, SLb) of the drawing units (U2 to U6) are denoted by SL2a and SL2b to SL6a. , it may be expressed as SL6b. In addition, the drawing lines SLa and SLb may be collectively referred to simply as the drawing line SL.

As shown in FIG. 2, the plurality of drawing units U(U1 to U6) cover the entire width direction of the exposure area W, and each drawing unit U(U1 to U6) has a scanning area. is sharing. Thereby, each drawing unit U (U1-U6) can draw a pattern for each of the plurality of areas divided in the width direction of the substrate P. For example, if the scanning length (length) of the drawing line SL is about 20 to 40 mm, by arranging a total of six drawing units U in the Y direction, the width in the Y direction that can be drawn is about 240 to 480 mm. It's wide enough. In principle, the length (scanning length) of each drawing line (SL (SL1a, SL1b to SL6a, SL6b)) is the same. That is, the scanning distance of the spot light SP of the beam LB scanned along each of the plurality of drawing lines SL (SL1a, SL1b to SL6a, SL6b) is, in principle, the same. In addition, if the width of the exposure area W is desired to be widened, this can be done by lengthening the length of the drawing line SL (SLa, SLb) itself or increasing the number of drawing units U arranged in the Y direction. there is.

The drawing lines SL1a, SL1b, SL2a, SL2b, SL5a, SL5b, SL6a, and SL6b are located on the irradiated surface of the substrate P supported by the rotating drum DR1. The drawing lines SL1a, SL1b, SL2a, SL2b, SL5a, SL5b, SL6a, and SL6b are arranged in two rows in the circumferential direction of the rotary drum DR1 with the center plane Poc1 interposed therebetween. The drawing lines SL1a, SL1b, SL5a, and SL5b are located on the irradiated surface of the substrate P on the upstream side (-X direction side) of the conveyance direction of the substrate P with respect to the center plane Poc1. The drawing lines SL2a, SL2b, SL6a, and SL6b are located on the irradiated surface of the substrate P on the downstream side (+X direction side) in the conveyance direction of the substrate P with respect to the center plane Poc1.

The drawing lines SL3a, SL3b, SL4a, and SL4b are located on the irradiated surface of the substrate P supported by the rotating drum DR2. The drawing lines SL3a, SL3b, SL4a, and SL4b are arranged in two rows in the circumferential direction of the rotary drum DR2 with the center plane Poc2 interposed therebetween. The drawing lines SL3a and SL3b are located on the irradiated surface of the substrate P on the upstream side (-X direction side) of the conveyance direction of the substrate P with respect to the center plane Poc2. The drawing lines SL4a and SL4b are located on the irradiated surface of the substrate P on the downstream side (+X direction side) in the conveyance direction of the substrate P with respect to the center plane Poc2. The drawing lines SLa1, SL1b to SL6a, and SL6b are substantially parallel to the width direction of the substrate P, that is, the central axes AXo1 and AXo2 of the rotary drums DR1 and DR2.

Odd-numbered drawing lines (SL1a, SL1b, SL3a, SL3b, SL5a, SL5b) are spaced at predetermined intervals along the width direction (scanning direction) of the substrate P with respect to the Y direction (width direction of the substrate P). It is arranged on a straight line. The even-numbered drawing lines (SL2a, SL2b, SL4a, SL4b, SL6a, SL6b) are similarly arranged on a straight line at predetermined intervals along the width direction of the substrate P in the Y direction. At this time, the drawing line SL1b is disposed between the drawing line SL2a and the drawing line SL2b in the Y direction. The drawing line SL3a is disposed between the drawing line SL2b and the drawing line SL4a in the Y direction. The drawing line SL3b is disposed between the drawing lines SL4a and SL4b in the Y direction. The drawing line SL5a is arranged between the drawing line SL4b and the drawing line SL6a in the Y direction. The drawing line SL5b is arranged between the drawing line SL6a and the drawing line SL6b in the Y direction. That is, the drawing line SL is drawn in the following order from the -Y direction side with respect to the Y direction: SL1a, SL2a, SL1b, SL2b, SL3a, SL4a, SL3b, SL4b, SL5a, SL6a, SL5b, and SL6b. The patterns are arranged to connect to each other at the ends in the Y direction.

The scanning direction of the spot light SP of the beam LB scanned along each of the odd-numbered drawing lines SL1a, SL1b, SL3a, SL3b, SL5a, and SL5b is in a one-dimensional direction, and is in the same direction ( +Y direction). The scanning direction of the spot light SP of the beam LB scanned along each of the even-numbered drawing lines SL2a, SL2b, SL4a, SL4b, SL6a, and SL6b is in a one-dimensional direction, and is in the same direction ( -Y direction). The scanning direction (+Y direction) of the spot light SP of the beam LB scanned along the odd-numbered drawing lines (SL1a, SL1b, SL3a, SL3b, SL5a, SL5b), and the even-numbered drawing lines (SL2a, The scanning direction (-Y direction) of the spot light SP of the beam LB scanned along (SL2b, SL4a, SL4b, SL6a, SL6b) is opposite to the scanning direction (-Y direction). As a result, the drawing start position (position of the drawing start point) of the drawing lines (SL1b, SL3a, SL3b, SL5a, SL5b) and the drawing start position of the drawing lines (SL2a, SL2b, SL4a, SL4b, SL6a) are drawn. The patterns follow one another. In addition, drawing is performed at the drawing end position (position of the drawing end point) of the drawing lines (SL1a, SL1b, SL3a, SL3b, SL5a, SL5b) and the drawing end position of the drawing lines (SL2a, SL2b, SL4a, SL4b, SL6a, SL6b). The patterns are connected to each other. Moreover, in the initial state, the odd-numbered drawing lines (SL1a, SL1b, SL5a, SL5b) located on a straight line and the even-numbered drawing lines (SL2a, SL2b, SL6a, SL6b) located on a straight line are connected to the substrate ( They are arranged to be spaced apart by a certain length (interval length) along the conveyance direction (P) (circumferential direction of rotary drum DR1). Similarly, in the initial state, the odd-numbered drawing lines SL3a and SL3b located on a straight line and the even-numbered drawing lines SL4a and SL4b located on a straight line are aligned in the conveyance direction of the substrate P (rotating drum). They are arranged at a certain length (interval length) along the circumferential direction of (DR2).

Additionally, the width (dimension in the X direction) of the drawing line SL is a thickness corresponding to the size (diameter) phi of the spot light SP. For example, when the effective size phi of the spot light SP is 3 μm, the width of the drawing line SL is also 3 μm. The spot light SP may be projected along the drawing line SL so as to overlap by a predetermined length (for example, half the effective size phi of the spot light SP). Additionally, the ends of the drawing lines SL that are adjacent to each other in the scanning direction (for example, the drawing end point of the drawing line SL1a and the drawing end point of the drawing line SL2a) have a predetermined length (e.g., a spot It is okay to overlap in the Y direction by half the size ϕ of the light (SP).

FIG. 3 is a diagram showing the arrangement relationship of the drawing lines SLa and SLb of each drawing unit U when the ends of the drawing lines SL adjacent to each other in the main scanning direction are aligned (adjacent to each other). As shown in FIG. 3, the scanning length of the drawing lines SLa and SLb of the drawing unit U, and the separation distance between the drawing line SLa and the drawing line SLb of the drawing unit U in the Y direction. (Gap) are all set to Lo. Therefore, the drawing lines (SLa, SLb) of the drawing units (U1, U3, U5) that face each other and the drawing lines (SLa, SLb) of the drawing units (U2, U4, U6) are adjacent to each other in the main scanning direction. (SL) can be arranged so that their ends are adjacent in the main scanning direction. Additionally, the rotational central axis AXr of the drawing unit U is set to pass through the central point of the separation distance Lo between the drawing lines SLa and SLb.

FIG. 4 shows the arrangement relationship of the drawing lines SLa and SLb of each drawing unit U when the ends of the drawing lines SL adjacent to each other in the scanning direction overlap each other by α/2 (constant length). It is a drawing. As shown in Fig. 4, the scanning length of the drawing lines SLa and SLb is set to Lo, and the separation distance (gap) in the Y direction between the drawing line SLa and the drawing line SLb of the drawing unit U is Set as Lo-α. Therefore, the drawing lines (SLa, SLb) of the drawing units (U1, U3, U5) that face each other and the drawing lines (SLa, SLb) of the drawing units (U2, U4, U6) are adjacent to each other in the main scanning direction. (SL) can be arranged so that their ends overlap at α/2 in the main scanning direction. Additionally, the rotational central axis AXr of the drawing unit U is set to pass through the central point of the separation distance Lo-α between the drawing lines SLa and SLb.

The control device 18 shown in FIG. 1 controls each part of the exposure apparatus EX. This control device 18 includes a computer and a recording medium on which a program is recorded, and the computer executes the program to function as the control device 18 of the first embodiment. In addition, the alignment microscope (AMa (AMa1 to AMa4), AMb (AMb1 to AMb4) shown in FIG. 1 is for detecting the alignment mark (MK (MK1 to MK4)) formed on the substrate P shown in FIG. 2. . A plurality of alignment microscopes (AMa (AMa1 to AMa4)) are provided along the Y direction. Similarly, a plurality of alignment microscopes (AMb (AMb1 to AMb4)) are also provided along the Y direction. The alignment marks (MK (MK1 to MK4)) are reference marks for relatively positioning (aligning) the pattern drawn on the exposure area W on the irradiated surface of the substrate P with the substrate P. The alignment microscope (AMa (AMa1 to AMa4)) detects the alignment mark (MK (MK1 to MK4)) on the substrate P supported on the circumferential surface of the rotating drum DR1. The alignment microscope (AMa (AMa1 to AMa4)) determines the position of the spot light SP of the beam LB emitted from the drawing units U1 and U5 onto the irradiated surface of the substrate P (drawing lines SL1a and SL1b). , SL5a, SL5b), and is provided on the upstream side (-X direction side) of the transport direction of the substrate P. Additionally, the alignment microscope (AMb (AMb1 to AMb4)) detects the alignment marks (MK (MK1 to MK4)) on the substrate P supported by the circumferential surface of the rotating drum DR2. The alignment microscope (AMb (AMb1 to AMb4)) is located at a position higher than the position (drawing lines SL3a, SL3b) of the spot light SP of the beam LB irradiated from the drawing unit U3 to the irradiated surface of the substrate P. It is provided on the upstream side (-X direction side) of the transport direction of the substrate P.

Alignment microscopes (AMa (AMa1 to AMa4), AMb (AMb1 to AMb4), not shown, have a light source that projects alignment illumination light onto the substrate P and an imaging device (CCD, CMOS, etc.) that captures the reflected light. . The imaging signal captured by the alignment microscope (AMa (AMa1 to AMa4) and AMb (AMb1 to AMb4)) is sent to the control device 18. The alignment microscope (AMa (AMa1 to AMa4), AMb (AMb1 to AMb4)) images the alignment mark (MK (MK1 to MK4)) present in an observation area not shown. The observation area of each alignment microscope (AMa (AMa1 to AMa4), AMb (AMb1 to AMb4)) is provided along the Y direction and is arranged according to the position of the alignment mark (MK (MK1 to MK4)) in the Y direction. . Therefore, the alignment microscopes AMa1 and AMb1 can image the alignment mark MK1, and similarly, the alignment microscopes AMa2 to AMa4 and AMb2 to AMb4 can image the alignment marks MK2 to MK4. The size of the irradiated surface of the substrate P in this observation area is set according to the size of the alignment mark (MK (MK1 to MK4)) and the alignment accuracy (position measurement accuracy), but is set at an accuracy angle of 100 to 500 μm. It's size. The control device 18 detects the position of the alignment mark MK based on imaging signals from the alignment microscopes (AMa (AMa1 to AMa4) and AMb (AMb1 to AMb4). Additionally, the illumination light for alignment is light in a wavelength range that has little sensitivity to the photosensitive functional layer of the substrate P, for example, light with a wavelength of about 500 nm to 800 nm. In addition, since the imaging device of the alignment microscope (AMa, AMb) needs to image the alignment mark (MK) while the substrate (P) is moving, a high-speed shutter time ( Imaging time, such as charge accumulation time) is set.

Next, the configuration of the drawing unit U will be described. Since each drawing unit U has the same configuration, the drawing unit U2 is taken as an example in the first embodiment. Hereinafter, in the description of the drawing unit U, an orthogonal coordinate system XtYtZt is set to specify the arrangement of each member or beam within the drawing unit U. The Yt-axis of the Cartesian coordinate system XtYtZt is set to be parallel to the Y-axis of the Cartesian coordinate system XYZ, and the Cartesian coordinate system

FIG. 5 is a configuration diagram of the drawing unit U2 viewed from the -Yt (-Y) direction side, and FIG. 6 is a configuration diagram of the drawing unit U2 viewed from the +Zt direction side. Among the two beams LB incident on the drawing unit U2, one beam LB is denoted by LBa, and the other beam LB is denoted by LBb. In addition, the spot light SP of the beam (first beam) LBa may be expressed as SPa, and the spot light SP of the beam (second beam) LBb may be expressed as SPb. The spot light (first spot light) SPa scans the drawing line SL2a (SLa), and the spot light (second spot light) SPb scans the drawing line SL2b (SLb).

Additionally, in Fig. 6, for ease of understanding, the spot lights SPa and SPb are shown as dots thicker than the drawing lines SL2a and SL2b. 5 and 6, the direction parallel to the rotational central axis AXr is the Zt direction, and the substrate P is moved from the process device PR1 to the exposure device EX on a plane perpendicular to the Zt direction. The direction toward the process device PR2 is called the Xt direction, and is on a plane orthogonal to the Zt direction, and the direction orthogonal to the Xt direction is called the Yt direction. That is, the three-dimensional coordinates of Xt, Yt, and Zt in FIGS. 5 and 6 are the three-dimensional coordinates of These are three-dimensional coordinates that have been rotated as much as possible.

The drawing unit (U2) includes a reflecting mirror (M1), a converging lens (CD), a triangular reflecting mirror (M2), a reflecting mirror (M3a, M3b), a shift optical member (shift optical plate) (SRa, SRb), and a beam forming unit. Optics (BFa, BFb), reflection mirror (M4), cylindrical lens (CY1), reflection mirror (M5), polygon mirror (PM), reflection mirror (M6a, M6b), fθ lens (FTa, FTb), reflection It is provided with an optical system of mirrors (M7a, M7b) and cylindrical lenses (CY2a, CY2b). These optical systems (reflecting mirror (M1), condensing lens (CD), etc.) are integrally formed as one drawing unit (U2) in a highly rigid case. That is, the drawing unit U2 maintains these optical systems integrally. For optical systems in which two beams (LBa, LBb) are incident together, reference numerals are simply given, and each of the two beams (LBa, LBb) is incident separately. Regarding optical systems provided as a pair, a and b are given after the reference symbols. Simply put, for optical systems in which only the beam LBa is incident, a is assigned to the end of the reference symbol, and for optical systems in which only the beam LBb is incident, b is assigned to the end of the reference symbol.

As shown in FIG. 5, the two beams (LBa, LBb) from the light source device 14 pass through the two optical elements (AOMa, AOMb) and the two collimating lenses (CLa, CLb). , is reflected by the reflection mirror M8, and enters the drawing unit U2 in a state parallel to the Zt axis. The two beams LBa and LBb incident on the drawing unit U2 enter the reflection mirror M1 along the rotational central axis AXr of the drawing unit U2 in the XtZt plane. FIG. 7 is a diagram showing the optical path of the beams LBa and LBb passing through the optical elements AOMa and AOMb and the collimating lenses CLa and CLb and entering the reflection mirror M8, as seen from the +Zt direction, and FIG. 8 is a diagram showing the optical path of the beams LBa and LBb incident on the reflection mirror M1 of the drawing unit U2 from the reflection mirror M8 as seen from the +Xt direction. Also, in Figures 7 and 8, it is shown in a three-dimensional coordinate system of Xt, Yt, and Zt.

The optical elements (AOMa, AOMb) have transparency to the beams (LBa, LBb) and are acousto-optic modulators (AOM: Acousto-Optic Modulator). The optical elements (AOMa, AOMb) use ultrasonic waves (high-frequency signals) to diffract the incident beams (LBa, LBb) at a diffraction angle depending on the frequency of the high-frequency waves, and thus to change the optical path of the beams (LBa, LBb), that is, to propagate them. change direction The optical elements AOMa and AOMb generate diffracted light (primary diffraction beam) that diffracts the incident beams LBa and LBb in response to the on/off of the driving signal (high frequency signal) from the control device 18. Turn on/off.

When the drive signal (high frequency signal) from the control device 18 is in an off state, the optical element AOMa transmits the incident beam LBa without diffracting it. Therefore, when the drive signal is in an off state, the beam LBa that has transmitted through the optical element AOMa does not enter the collimating lens CLa and the reflecting mirror M8, but enters an absorber not shown. This means that the intensity of the spot light SPa projected onto the irradiated surface of the substrate P is modulated to a low level (zero). On the other hand, when the optical element AOMa is turned on by a driving signal (high frequency signal) from the control device 18, it generates a first-order diffracted beam obtained by diffracting the incident beam LBa. Therefore, when the driving signal is in the ON state, the first-order diffracted beam deflected from the optical element AOMa (for simplicity of explanation, referred to as the beam LBa from the optical element AOMa) is directed to the collimating lens CLa. After passing through, it enters the reflection mirror (M8). This means that the intensity of the spot light SPa projected onto the irradiated surface of the substrate P is modulated to a high level.

Similarly, when the driving signal (high frequency signal) from the control device 18 is in the OFF state, the optical element AOMb transmits the incident beam LBb without diffracting it, so that the optical element AOMb transmits the incident beam LBb. One beam LBb does not enter the collimating lens CLb and the reflecting mirror M8, but enters an absorber not shown. This means that the intensity of the spot light SPb projected on the irradiated surface of the substrate P is modulated to a low level (zero). On the other hand, when the optical element AOMb is turned on by a driving signal (high frequency signal) from the control device 18, the incident beam LBb is diffracted, so that the beam LBb deflected by the optical element AOMb (First-order diffracted beam) passes through the collimating lens CLb and then enters the reflecting mirror M8. This means that the intensity of the spot light SPb projected on the irradiated surface of the substrate P is modulated to a high level. The control device 18 turns on/off the driving signal applied to the optical element AOMa at high speed based on the pattern data (bit map) of the pattern drawn by the drawing line SL2a, and also controls the drawing line SL2a. Based on the pattern data of the pattern drawn by SL2b, the driving signal applied to the optical element AOMb is turned on/off at high speed. That is, the intensity of the spot light (SPa, SPb) is modulated into high level and low level according to the pattern data. In addition, the beams (LBa, LBb) incident on the optical elements (AOMa, AOMb) are condensed to form a beam waist within the optical elements (AOMa, AOMb), so they are deflected at the optical elements (AOMa, AOMb). The beams (LBa, LBb) (primary diffraction beams) that are output are divergent light, and the collimating lenses (CLa, CLb) turn the divergent light into a parallel light beam with a predetermined beam diameter.

The reflection mirror M8 reflects the incident beams LBa, LBb in the -Zt direction and guides them to the reflection mirror (reflection member) M1 of the drawing unit U2. The beams LBa and LBb reflected by the reflecting mirror M8 enter the reflecting mirror M1 of the drawing unit U2 so as to be symmetrical with respect to the rotational central axis AXr. At this time, the beams LBa and LBb may or may not intersect on the reflection mirror M1. 6 and 8 show an example where the beams LBa and LBb intersect at the position of the rotation center axis AXr on the reflection mirror M1. That is, the beams LBa and LBb enter the reflection mirror M1 at a constant angle with respect to the rotation central axis AXr. In this first embodiment, the beams LBa and LBb are incident on the reflection mirror M1 along the Yt(Y) direction so as to be symmetrical with respect to the rotational central axis AXr. Additionally, the beams LBa and LBb may be designed to be incident on the reflection mirror M1 in parallel so as to be symmetrical with respect to the rotation central axis AXr.

Returning to the explanation of FIGS. 5 and 6, the reflection mirror M1 reflects the incident beams LBa and LBb in the +Xt direction. The beams LBa and LBb (parallel light fluxes, respectively) reflected by the reflection mirror M1 move away from each other at a constant opening angle within the XtYt plane as shown in FIG. 6. The converging lens (CD) makes the central axes of the beams (LBa, LBb) from the reflection mirror (M1) parallel to each other in the This is the lens you ordered. The function of this converging lens CD will be explained later, but the front focus position of the converging lens CD is set to be on or near the reflecting surface of the reflecting mirror M1. The triangular reflective mirror (M2) reflects the beam (LBa) that has passed through the converging lens (CD) at 90 degrees in the -Yt (-Y) direction and guides it to the reflecting mirror (M3a). The transmitted beam LBb is reflected at 90 degrees in the +Yt (+Y) direction and guided to the reflection mirror M3b.

The reflection mirror M3a reflects the incident beam LBa at 90 degrees in the +Xt direction. The beam LBa reflected by the reflection mirror M3a passes through the shift optical member (first shift optical member made of a parallel plate) SRa and the beam forming optical system BFa to the reflection mirror M4. join the company The reflection mirror M3b reflects the incident beam LBb at 90 degrees in the +Xt direction. The beam LBb reflected by the reflection mirror M3b passes through the shift optical member (second shift optical member made of a parallel plate) SRb and the beam forming optical system BFb and enters the reflection mirror M4. By the triangular reflection mirror M2 and the reflection mirrors M3a and M3b, the distance in the Yt direction of each central axis of the beams LBa and LBb that have passed through the converging lens CD is expanded. The shift optical members SRa and SRb adjust the center positions of the beams LBa and LBb within a plane (YtZt plane) orthogonal to the direction in which the beams LBa and LBb travel. The shift optical members (SRa, SRb) have two parallel plates of quartz parallel to the YtZt plane, one parallel plate can be tilted around the Yt axis, and the other parallel plate can be tilted around the Zt axis. possible. By tilting these two parallel plates around the Yt axis and Zt axis, respectively, the positions of the centers of the beams LBa and LBb are determined in two dimensions in the YtZt plane orthogonal to the direction of movement of the beams LBa and LBb. Shift the amount. These two parallel plates are driven by an actuator (drive unit), not shown, under the control of the control device 18. The beam shaping optical system (BFa, BFb) is an optical system that shapes the beams (LBa, LBb). For example, the beam forming optical system (BFa, BFb) is an optical system that shapes the diameter of the beam (LBa, LBb) condensed by a condenser lens (CD) to a diameter of a predetermined size. Shape it.

As shown in FIG. 5, the reflecting mirror M4 reflects the beams LBa and LBb from the beam forming optical systems BFa and BFb in the -Zt direction. The beams LBa and LBb reflected by the reflecting mirror M4 pass through the first cylindrical lens CY1 and enter the reflecting mirror M5. The reflecting mirror M5 reflects the beams LBa and LBb from the reflecting mirror M4 in the -Xt direction and makes them incident on another reflecting surface RP of the polygon mirror PM. The beam LBa is incident on the first reflection surface RP of the polygon mirror PM from the first direction, and the beam LBb is incident on the other side of the polygon mirror PM from a second direction different from the first direction. It is incident on the second reflecting surface (RP).

The polygon mirror (PM) reflects the incident beams (LBa, LBb) toward the fθ lenses (FTa, FTb). The polygon mirror PM deflects and reflects the incident beams LBa and LBb in order to scan the spot lights SPa and SPb of the beams LBa and LBb on the irradiated surface of the substrate P. As a result, the beams LBa and LBb are deflected and scanned in one dimension in a plane parallel to the XtYt plane by the rotation of the polygon mirror PM. Specifically, the polygon mirror (PM) is a rotating polygonal surface having a rotation axis (AXp) extending in the Zt axis direction and a plurality of reflection surfaces (RP) arranged around the rotation axis (AXp) so as to surround the rotation axis (AXp). It's amazing. In the first embodiment, the polygon mirror (PM) is a rotating polygonal mirror that has eight reflection surfaces (RP) parallel to the Zt axis and has a regular octagonal shape. By rotating this polygon mirror (PM) in a predetermined rotation direction around the rotation axis (AXp), the reflection angle of the pulse-shaped beams (LBa, LBb) irradiated to the reflection surface (RP) can be continuously changed. As a result, the reflection directions of the beams LBa and LBb are deflected by each of the first reflection surface RP and the second reflection surface RP, and the beam LBa irradiated onto the irradiated surface of the substrate P , LBb) spot light (SPa, SPb) can be scanned along the main scanning direction.

One reflection surface (RP) of the polygon mirror (PM) can scan spot lights (SPa, SPb) along the drawing lines (SL2a, SL2b) in order to deflect and scan one of the beams (LBa, LBb). there is. For this reason, in one rotation of the polygon mirror PM, the number of scans of the spot light SPa, SPb along the drawing lines SL2a, SL2b on the irradiated surface of the substrate P is at most that of the reflective surface RP. It becomes 8 times, which is the same number. The polygon mirror (PM) rotates at a constant speed by a polygon driving unit including a motor. The rotation of the polygon mirror (PM) is controlled by the control device 18 by this polygon driving unit.

In addition, the length of the drawing lines (SL2a, SL2b) is set to 30 mm, for example, and the spot lights (SPa, SPb) of 3 μm are drawn while pulsed light is emitted so that the spot lights (SPa, SPb) of 3 μm overlap by 1.5 μm. When irradiating the irradiated surface of the substrate P along the lines SL2a and SL2b, the number of spot lights (SP) irradiated in one scan (pulse emission number) is 20,000 (30 mm/1.5 μm). . In addition, if the scanning time of the spot light (SPa, SPb) along the drawing lines (SL2a, SL2b) is 200 μsec, the pulse-shaped spot light (SP) must be irradiated 20,000 times during this time, so the light source device 14 The light emission frequency Fs is Fs≥20000 times/200μsec=100MHz.

The first cylindrical lens (CY1) directs the incident beams (LBa, LBb) to the polygon mirror (PM) in the non-scanning direction (Zt direction) orthogonal to the scanning direction (rotation direction) by the polygon mirror (PM). ) converges on the reflecting surface (RP). The reflecting surface RP is aligned in the Zt direction by the first cylindrical lens CY1 whose bus line is parallel to the Yt direction and the second cylindrical lenses CY2a and CY2b described later. Even if there is an inclination (inclination of the reflection surface (RP) with respect to the Zt axis, which is the normal line of the XtYt plane), the effect can be suppressed. For example, the irradiation position of the spot light SPa, SPb (drawing line SL2a, SL2b) of the beam LBa, LBb irradiated to the irradiated surface of the substrate P is each half of the polygon mirror PM. Deviation in the Xt direction can be suppressed due to a slight inclination error for each slope (RP).

In detail, the polygon mirror PM reflects the incident beam LBa in the -Yt (-Y) direction and guides it to the reflection mirror M6a. Additionally, the polygon mirror PM reflects the incident beam LBb in the +Yt (+Y) direction and guides it to the reflection mirror M6b. The reflection mirror M6a reflects the incident beam LBa toward the -Xt direction and guides it to the fθ lens FTa having an optical axis AXfa extending in the Xt axis direction. The reflecting mirror M6b reflects the incident beam LBb toward the -Xt direction and guides it to the fθ lens FTb having an optical axis AXfb (parallel to the optical axis AXfa) extending in the Xt axis direction.

The fθ (f-θ) lenses (FTa, FTb) intersect the beams (LBa, LBb) from the polygon mirror (PM) reflected by the reflection mirrors (M6a, M6b) with the optical axes (AXfa, AXfb) in the XtYt plane. It is a telecentric scan lens that projects to the reflection mirrors (M7a, M7b) in parallel. The reflective mirror M7a reflects the incident beam LBa in the -Zt direction toward the irradiated surface of the substrate P, and the reflective mirror M7b reflects the incident beam LBb toward the irradiated surface of the substrate P. It reflects in the -Zt direction toward the slope. The beam LBa reflected by the reflection mirror M7a passes through the second cylindrical lens CY2a and is projected onto the irradiated surface of the substrate P, and the beam LBb reflected by the reflection mirror M7b is , is transmitted through the second cylindrical lens CY2b and projected onto the irradiated surface of the substrate P. By means of this fθ lens FTa and the second cylindrical lens CY2a whose bus line is parallel to the Yt direction, the beam LBa projected onto the substrate P is effectively irradiated on the irradiated surface of the substrate P. It converges into a tiny spot light (SPa) with a diameter of about a few micrometers (for example, 3 micrometers). Similarly, the beam LBb projected onto the substrate P is projected on the irradiated surface of the substrate P by the fθ lens FTb and the second cylindrical lens CY2b whose bus line is parallel to the Yt direction. It converges into a tiny spot light (SPb) with an effective diameter of about a few μm (for example, 3 μm). The spot lights (SPa, SPb) projected onto the irradiated surface of the substrate P are drawn lines (SL2a, SL2b) extending in the main scanning direction (Yt direction, Y direction) by the rotation of one polygon mirror (PM). ) is simultaneously scanned in one dimension.

The angle of incidence (θ) of the beam to the fθ lenses (FTa, FTb) (angle with respect to the optical axis) changes depending on the rotation angle (α/2) of the polygon mirror (PM). The fθ lens FTa projects the spot light SPa of the beam LBa at an image height position on the irradiated surface of the substrate P in proportion to the incident angle of the beam LBa. Similarly, the fθ lens FTb projects the spot light SPb of the beam LBb to the image height position on the irradiated surface of the substrate P in proportion to the incident angle of the beam LBb. If the focal length is f and the image position is y, the fθ lenses (FTa, FTb) have the relationship (distortion aberration) of y=f×θ. Therefore, with these fθ lenses (FTa, FTb), it becomes possible to accurately scan the spot lights (SPa, SPb) of the beams (LBa, LBb) in the Yt direction (Y direction) at a constant speed. When the angle of incidence (θ) of the beams (LBa, LBb) onto the fθ lenses (FTa, FTb) is 0 degrees, the beams (LBa, LBb) incident on the fθ lenses (FTa, FTb) are on the optical axes (AXfa, AXfb). So we move on.

The above condensing lens (CD), triangular reflection mirror (M2), reflection mirror (M3a), shift optical member (SRa), beam shaping optical system (BFa), reflection mirror (M4), first cylindrical lens (CY1), And the reflection mirror M5 functions as the first light guiding optical system 20 that guides the beam LBa from the first direction toward the polygon mirror PM. In addition, a condenser lens (CD), a triangular reflection mirror (M2), a reflection mirror (M3b), a shift optical member (SRb), a beam shaping optical system (BFb), a reflection mirror (M4), and a first cylindrical lens (CY1). , and the reflection mirror M5 functions as the second light guiding optical system 22 that guides the beam LBb toward the polygon mirror PM from a second direction different from the first direction. In addition, the condenser lens (CD), the triangular reflection mirror (M2), the reflection mirror (M4), the first cylindrical lens (CY1), and the reflection mirror (M5) are connected to the first light guide optical system 20 and the second reflection mirror. Although common members are used in the light guiding optical system 22, at least some of these members may be provided separately in the first light guiding optical system 20 and the second light guiding optical system 22. In addition, the reflection mirror M6a, the fθ lens (FTa), the reflection mirror M7a, and the second cylindrical lens CY2a converge the beam LBa reflected from the polygon mirror PM to produce spot light. (SPa) and functions as the first projection optical system 24 that projects on the drawing line SL2a (SLa). Likewise, the reflective mirror M6b, the fθ lens FTb, the reflective mirror M7b, and the second cylindrical lens CY2b converge the beam LBb reflected from the polygon mirror PM to produce spot light. (SPb) functions as a second projection optical system 26 that projects on the drawing line SL2b (SLb). The first projection optical system 24 and the second projection optical system 26 are arranged so that the drawing lines SLa and SLb are at the same position in the sub-scanning direction and are spaced apart in the main scanning direction. Additionally, the first projection optical system 24 and the second projection optical system 26 are arranged so that the drawing lines SLa and SLb are spaced apart from each other in the main scanning direction by an interval equal to or less than the scanning length.

In the case of the first embodiment, even when the beams LBa and LBb are incident on the position where the rotation center axis AXr on the reflection mirror M1 passes, the beams LBa and LBb are connected to the rotation center axis AXr. ) does not enter the reflecting mirror M1 in parallel, but enters so as to intersect on (or near) the reflecting mirror M1 with a constant inclination with respect to the rotational central axis AXr, as shown in FIG. 8. Accordingly, when the entire drawing unit U2 rotates around the rotation central axis AXr, the angle of incidence of the beams LBa and LBb with respect to the reflection mirror M1 changes relatively. As a result, the reflection direction of the beams LBa and LBb reflected by the reflection mirror M1 within the drawing unit U2 is two-dimensional according to the rotation around the rotational central axis AXr of the drawing unit U2. turns into an enemy

9 and 10 show beam LBa in an initial position state in which the drawing unit U2 is not rotated around the rotation central axis AXr, and in a state in which the drawing unit U2 is rotated by Δθz from the initial position. ) is a diagram that exaggerates the change in reflection direction (change in beam path) within the drawing unit U2. FIG. 9 shows the arrangement relationship between the reflecting mirror (reflecting member) M1 and the converging lens (CD) in the XtZt plane, and FIG. 10 shows the arrangement relationship between the reflecting mirror (M1) and the condensing lens (CD) in the XtYt plane. It was seen in In addition, the principle of changing the reflection direction of the beam LBb in the drawing unit U2 when the drawing unit U2 is rotated around the rotational central axis AXr is the same as that of the beam LBa, so that the beam LBa ) will only be explained. Here, the optical axis (AXc) of the condenser lens (CD) is set to intersect the central axis of rotation (AXr) on the reflection surface of the reflection mirror (M1) (set at 45° with respect to the XtYt plane), and the condenser lens (CD) The reflecting surface of the reflecting mirror M1 is set at a position of the front focal length fa. Furthermore, the beams LBa and LBb diverge after converging to become the beam waist (minimum diameter) at the plane Pcd (rear focal plane) at the position of the rear focal length fb of the converging lens CD. 9 and 10, the beam LBa-1 shown by a solid line is in an initial position state in which the entire drawing unit U2 is not rotating, that is, the drawing line SL2a is parallel to the Yt (Y) direction. It shows the beam (LBa) in the state. The beam LBa-2 indicated by the two-dot chain line represents the beam LBa when the entire drawing unit U2 is rotated by Δθz around the rotation center axis AXr.

When the drawing unit U2 rotates around the rotation central axis AXr, the relative angle of incidence of the beam LBa (LBb) with respect to the reflecting surface of the reflecting mirror M1 changes. As shown in FIG. 10, if the beam LBa projected on the reflection surface of the reflection mirror M8 immediately before the reflection mirror M1 is LBa(M8), as is clear from the beam orientation state in FIG. 8, The respective positions within the XtYt plane of the beam LBa and the beam LBa(M8) projected on the reflection mirror M1 are spaced apart in a direction parallel to the Yt axis in the initial position state. When the entire drawing unit U2 rotates (tilts) by an angle Δθz from the initial position state, when viewed from the reflection mirror M1, the position of the beam LBa(M8) on the reflection mirror M8 corresponds to the angle Δθz. It is relatively shifted in the Xt direction (actually rotated around the central axis of rotation (AXr)).

Accordingly, the optical path (center line) of the beam LBa-1 reflected by the reflection mirror M1 in the initial position state is such that the beam LBa-2 changes after the entire drawing unit U2 rotates by the angle Δθz. and slopes within the XtYt plane. In addition, in FIG. 10, the intersection angle within the It coincides with the intersection angle between the center line and the central axis of rotation (AXr) in the YtZt plane. Therefore, the convergence position BW1 within the rear focal plane Pcd of the beam LBa-1 in the initial position state is within the rear focal plane Pcd after rotation of the entire imaging unit U2 at an angle Δθz. The convergence position BW2 of the beam LBa-2 is shifted (parallel shifted) by ΔYh in the Yt direction. The positional deviation amount ΔYh is between the angle Δθz and is uniquely obtained by the geometric relational expression ΔYh=fy(Δθz). In addition, the center lines of the beam LBa-1 and the beam LBa-2 heading from the converging lens CD to the rear focal plane Pcd are both parallel to the optical axis AXc.

On the other hand, as exaggeratedly shown in FIG. 9, when the orientation state of the beam LBa-2 is viewed within the Since the center line of the beam LBa is inclined in the Yt direction with respect to the rotation central axis AXr, the beam LBa-2 from the reflection mirror M1 after rotation at the angle Δθz is the beam LBa-2 in the initial position. 1 (parallel to the optical axis AXc)), it proceeds obliquely in the direction of the Zt axis and enters the condensing lens CD. Therefore, the convergence position BW1 within the rear focal plane Pcd of the beam LBa-1 in the initial position state is the rear focal plane Pcd after rotation of the angle Δθz of the entire drawing unit U2. Within the convergence position BW2 of the beam LBa-2, the position is shifted (parallel shifted) by ΔZh in the Zt direction. The positional deviation amount ΔZh is between the angle Δθz and is uniquely obtained from the geometric relational expression ΔZh=fz(Δθz). In addition, in the configuration of the first embodiment, the positional shift amount ΔZh in the Zt-axis direction is larger than the positional shift amount ΔYh in the Yt-axis direction. The above effect is the same for the beam LBb, and after rotating the entire drawing unit U2 by the angle Δθz, the beam LBb-2 within the rear focal plane Pcd converges by the converging lens CD. The position is shifted in the Yt direction and the Zt direction with respect to the position within the rear focal plane Pcd of the beam LBb-1 in the initial position state.

As described above, in the first embodiment, the condenser lens (CD) on which the reflection surface of the reflection mirror M1 is provided is provided at the position of the front focal length fa, so that the beam emitted from the condenser lens (CD) The center line of (LBa-2(LBb-2)) and the center line of the beam (LBa-1(LBb-1)) can always be parallel. Therefore, the amount of positional deviation ΔYh of the beams LBa and LBb that occurs after the entire drawing unit U2 rotates by the angle Δθz by adjusting the tilt of the shift optical members SRa and SRb disposed behind the converging lens CD , ΔZh) is corrected to be zero. As a result, the two beams LBa and LBb can correctly pass through the subsequent optical system according to the optical path in the initial position state. Tilt adjustment of the shift optical members (SRa, SRb) is done by using a relationship table between the angle Δθz and the tilt adjustment amount created in advance based on the geometric relations ΔYh=fy(Δθz) and ΔZh=fz(Δθz), etc. It can run at high speed. As a result, even when the entire drawing unit U2 rotates, the beams LBa and LBb can be made incident on the reflection surface RP of the polygon mirror PM at an appropriate position.

Moreover, if the beams LBa and LBb from the reflecting mirror M8 can be made to enter the reflecting mirror M1 on the same axis as the rotational central axis AXr, then the beams LBa and LBb of the drawing unit U around the rotational central axis AXr Due to the rotation, the angle of incidence of the beams LBa and LBb on the reflection mirror M1 does not change. Therefore, within the drawing unit U, the reflection direction of the beams LBa and LBb reflected by the reflection mirror M1 does not change due to the rotation of the drawing unit U. While the two beams (LBa, LBb) incident on the reflection mirror (M1) are coaxial, in the writing unit (U2) after the reflection mirror (M1), there is one beam that spatially separates the two beams (LBa, LBb). The method is to place a polarizing beam splitter, etc. behind the reflecting mirror (M1), coaxially synthesize the beams (LBa, LBb) whose polarization states are orthogonal to each other, enter the reflecting mirror (M1), and split the polarization by the polarizing beam splitter, etc. It is to make a plan.

9 and 10, beams LBa, LBb (parallel beams) that have a constant inclination with respect to the rotational central axis AXr and are symmetrical with respect to the rotational central axis AXr are reflected by the reflection mirror M1. Although the case was described as an example of incident at the same position, two beams (LBa, LBb) (parallel beams) are symmetrical to the Yt direction with respect to the rotation center axis (AXr) and are oriented parallel to the rotation center axis (AXr). A case where is incident on the reflecting mirror M1 will be described. FIG. 11A shows the beams (LBa, LBb) incident on the reflection mirror (reflection member) M1 when the entire drawing unit U2 is rotated around the rotation center axis AXr by an angle (predetermined angle) Δθz. This is a diagram exaggerating the change in the reflection direction from the +Zt direction, and FIG. 11B shows the beams LBa and LBb from the reflection mirror M1 when the entire drawing unit U2 is rotated by the angle Δθz. This is a diagram showing the positional change viewed from the direction in which the beams LBa and LBb travel (+Xt direction).

In addition, in FIG. 11A, the orthogonal coordinate system XtYtZt is set for the drawing unit U2, so the orthogonal coordinate system It becomes as steep as it is. Therefore, when the drawing unit U2 is in the initial position and is not rotating, the main scanning direction (Yt direction) of the spot light SP along the drawing line SL2 is parallel to the Y direction, but the entire drawing unit U2 When rotated by the angle Δθz, the main scanning direction (Yt direction) of the spot light SP along the drawing line SL2 of the drawing unit U2 after rotation is inclined with respect to the Y direction. In addition, as shown in Figures 11a and 11b, the two beams (LBa, LBb) are set to extend in the do. This central axis AXt corresponds to the optical axis AXc of the converging lens CD in FIGS. 9 and 10 above. In addition, in the case where the two beams (LBa, LBb) reflected by the reflection mirror (M1) proceed parallel to the central axis (AXt) as shown in Figures 11a and 11b, the condensing lens described in Figures 9 and 10 above (CD) is changed to a small diameter one and is provided individually in each optical path of the two beams (LBa, LBb).

In FIG. 11A, the reflection mirror M1 indicated by a solid line is a reflection mirror in the initial position when the drawing unit U2 is not rotating, that is, when the drawing lines SL2a and SL2b are parallel to the Y direction. (M1) is shown. In addition, the beams LBa-1 and LBb-1 shown in solid lines are the incident position on the reflection mirror M1 at the initial position, and the beam reflected in the Xt-axis direction by the reflection mirror M1 ( LBa, LBb) are shown. In addition, the reflection mirror M1' indicated by a two-dot chain line exaggerates the arrangement of the reflection mirror M1 when the drawing unit U2 is rotated by the angle Δθz. In addition, the beams LBa-2, LBb-2 indicated by the two-dot chain line are the beams LBa, LBb reflected by the reflection mirror M1' when the drawing unit U2 is rotated by the angle Δθz. It represents.

When the drawing unit U2 rotates, in the XtYt plane, the reflection direction of the beams LBa-2 and LBb-2 reflected by the reflection mirror M1' also rotates according to the rotation of the drawing unit U2. Furthermore, because the relative position (particularly the position in the Zt direction) of the beams LBa and LBb incident on the reflection mirror M1 changes due to the rotation of the drawing unit U2, the plane perpendicular to the central axis AXt In (Pv (parallel to the YtZt plane)), each center line of the beams LBa-2 and LBb-2 reflected by the reflection mirror M1' is parallel to the central axis AXt, as shown in FIG. 11B. , the position changes to rotate around the central axis (AXt).

As shown in FIG. 11B, when the drawing unit U2 is in the initial position, the beams LBa-1 and LBb-1 reflected by the reflection mirror M1 are ±Yt(Y) from the central axis AXt. They are located parallel to each other at a certain distance in each direction. However, when the drawing unit U2 rotates by the angle Δθz, the beam LBa-2 reflected by the reflection mirror M1 moves in the -Zt direction and +Yt so as to draw an arc around the central axis AXt. direction, and the beam LBb-2 reflected by the reflection mirror M1 moves in the +Zt direction and -Yt direction. Therefore, the optical paths of the two beams (LBa, LBb) passing through each optical member after the reflection mirror (M1) become different from the optical paths at the initial position, and the reflection surface (RP) of the polygon mirror (PM) ), the beams (LBa, LBb) cannot be incident on the appropriate position.

However, in the first embodiment, since the shift optical members SRa and SRb are provided after the reflection mirror M1, the respective center lines of the beams LBa and LBb are aligned with the Yt direction in the plane Pv. It can be adjusted two-dimensionally in the Zt direction. Therefore, even when the entire drawing unit U2 rotates, the drawing unit U rotates each optical path of the beams LBa and LBb after the shift optical members SRa and SRb in the drawing unit U2. It can be corrected (adjusted) to the correct optical path when the initial position is not in position. As a result, the beams LBa and LBb can be incident on the reflective surface RP of the polygon mirror PM at an appropriate position.

In addition, the triangular reflection mirror M2 and the reflection mirrors M3a and M3b widen the distance in the Yt direction within the The interval between the center lines of the two beams (LBa, LBb) incident on the reflection mirror M1 of the unit U2 can be shortened, and the beam LBa incident on the writing unit U2 (reflection mirror M1) can be shortened. , LBb) can be brought closer to the central axis of rotation (AXr). As a result, even when the drawing unit Ub rotates, the amount of change in position within the plane Pv of each center line of the beams LBa and LBb due to the rotation can be suppressed small.

However, the control device 18 operates the exposure area ( It is possible to detect the inclination (tilt) or distortion (deformation) of W). The inclination or distortion of the exposure area W is, for example, caused by the fact that the longitudinal direction of the substrate P being wound and transported around the rotary drums DR1 and DR2 is inclined with respect to the central axes AXo1 and AXo2. The exposure area W may be inclined or distorted due to being tilted or distorted. In addition, even when the substrate P being wound and transported around the rotary drums DR1 and DR2 is not inclined or distorted, the substrate P may be inclined (tilted) during formation of the lower pattern layer. Alternatively, the exposure area W itself may be deformed due to being transported crookedly. In addition, the substrate P itself may be deformed linearly or non-linearly due to the thermal influence applied to the substrate P in the previous process.

Therefore, the control device 18 controls the drawing units U1 and U2 according to the inclination or distortion of the entire or partial exposure area W detected using the alignment microscope AMa (AMa1 to AMb4). , U5, U6) are rotated around the rotation center axis (AXr). In addition, the control device 18 controls the drawing units U3 and U4 according to the inclination or distortion of the entire or partial exposure area W detected using the alignment microscope (AMb (AMb1 to AMb4)). Rotate around the rotation center axis (AXr). At this time, the control device 18 also drives the shift optical members SRa and SRb according to the rotation angle of the drawing unit U (U1 to U6).

Specifically, for example, since the substrate P being wound and transported around the rotary drums DR1 and DR2 is inclined (inclined) or skewed, a predetermined drawing is performed according to the inclination (tilt) and skewness. The pattern also needs to be tilted or transformed. Also, as another example, when drawing new predetermined patterns overlapping each other on the lower layer pattern, it is necessary to tilt or deform the predetermined pattern to be drawn depending on the inclination or distortion of all or part of the lower layer pattern. occurs. Therefore, in order to tilt or deform the predetermined pattern to be drawn, the control device 18 individually rotates the drawing units U (U1 to U6) to move the drawing lines SLa and SLb in the Y direction. Inclined about.

In this way, in the first embodiment, a drawing unit (U) scans the spot lights (SPa, SPb) of the beams (LBa, LBb) along the drawing lines (SLa, SLb) using one polygon mirror (PM). ), the first projection optical system 24 and the second projection optical system ( 26) was placed. In addition, a drawing unit (U) is provided at a position between the main scanning directions of the two drawing lines (SLa, SLb), preferably at a position that divides the midpoint position in the main scanning direction of each of the drawing lines (SLa, SLb) into two. ) Set the central axis of rotation.

As a result, even if the drawing unit U is rotated, the spot light SPa, SPb of the beams LBa, LBb is scanned by the drawing unit U on the substrate P of the drawing lines SLa, SLb. It is possible to suppress the positional misalignment from becoming large, and it becomes possible to easily adjust the inclination of the drawing lines SLa and SLb. Conversely, in Japanese Patent Laid-Open No. 2004-117865, in which a plurality of scanning lines are provided at the same position in the main scanning direction and spaced apart from each other in the sub-scanning direction, when the laser scanning device is rotated to adjust the inclination of the plurality of scanning lines, The scanning line moves to draw an arc centered on the rotational center position of the laser scanning device. Therefore, the farther the scanning line is from the rotation center position, the greater the displacement of the scanning line's position on the irradiated object due to rotation of the laser scanning device. That is, in the first embodiment, the drawing lines SLa, SLb are set to be at the same position in the sub-scanning direction and spaced apart in the main scanning direction, so the drawing lines SLa, SLb are changed by rotation of the drawing unit U. ) on the substrate P can be prevented from becoming unnecessarily large. Additionally, since the scanning length of the drawing line SL can be shortened, the scanning line arrangement accuracy and optical performance required for high-detail pattern drawing can be stably maintained.

The first projection optical system 24 and the second projection optical system 24 are set so that the respective scanning lengths of the drawing lines SLa and SLb are set to be the same, and the drawing lines SLa and SLb are set separately at intervals equal to or less than the scanning length in the direction of the main scanning. 2 The projection optical system 26 is placed. This makes it possible to connect the drawing lines (SLa, SLb) of each drawing unit (U) to each other in the main scanning direction with the plurality of drawing units (U), and also allows the drawing lines ( It is possible to suppress an increase in the positional deviation of SLa, SLb) on the substrate P, and it also becomes possible to easily adjust the inclination of the drawing lines SLa, SLb.

The rotational central axis AXr of the drawing unit U was made to pass perpendicularly to the substrate P through the center point of a line segment connecting the midpoints of the drawing lines SLa and SLb of the drawing unit U. As a result, the inclination of the drawing lines SLa and SLb can be easily adjusted while minimizing the positional deviation of the drawing lines SLa and SLb due to rotation of the drawing unit U.

The beams LBa, LBb from the light source device 14 enter the drawing unit U so as to be symmetrical with respect to the rotational central axis AXr, so that the drawing unit U rotates around the rotational central axis AXr. Even in one case, it is possible to suppress an increase in the positional deviation of the center lines of the beams LBa and LBb passing through the drawing unit U.

The drawing unit U has a reflection mirror M1 that reflects the incident beams LBa and LBb and guides them to the first light guiding optical system 20 and the second light guiding optical system 22, and has a rotation central axis AXr. It is provided at a passing location. As a result, even when the drawing unit U is rotated, the beams LBa, LBb from the light source device 14 first enter the reflection mirror M1 within the drawing unit U, so that the drawing line SLa , SLb), the spot lights (SPa, SPb) of the beams (LBa, LBb) can be projected.

The first light guide optical system 20 includes a shift optical member SRa that shifts the position of the beam LBa reflected from the reflection mirror M1 on a plane intersecting the direction of travel of the beam LBa, 2 The light guiding optical system 22 is provided with a shift optical member SRb that shifts the position of the beam LBb reflected from the reflection mirror M1 on a plane intersecting the travel direction of the beam LBb. As a result, even when the drawing unit U is rotated, the beams LBa and LBb can be made to pass through an appropriate optical path in the drawing unit U and enter the polygon mirror PM. Therefore, due to the rotation of the drawing unit U, the spot light SPa, SPb is not irradiated to the irradiated surface of the substrate P, or the spot light SPa is irradiated at a position away from the drawing line SLa, SLb after tilt adjustment. , SPb) can be prevented from being projected.

The plurality of drawing units U are arranged so that the respective drawing lines SLa and SLb are connected to each other (connected to each other) along the main scanning direction (width direction of the substrate P). As a result, the range that can be drawn in the width direction of the substrate P can be expanded.

Among the plurality of drawing units U, drawing lines SLa and SLb of a predetermined number of drawing units U are located on the substrate P supported on the outer peripheral surface of the rotary drum DR1, and drawing of the remaining drawing units A plurality of drawing units U were arranged so that the lines SLa and SLb were positioned on the substrate P supported on the outer peripheral surface of the rotary drum DR2. Thereby, it becomes unnecessary to arrange all the drawing units U on one rotary drum DR, and the degree of freedom in arranging the drawing units U is improved. Moreover, three or more rotary drums DR may be provided, and one or more drawing units U may be disposed for each of the three or more rotary drums DR.

In order to tilt a predetermined pattern to be drawn on the irradiated surface of the substrate P, the drawing lines SLa and SLb (drawing units) are rotated (tilted). As a result, the shape of a predetermined pattern to be drawn can be changed according to the transport state of the substrate P or the shape of the exposure area W of the substrate P. In addition, when drawing a new predetermined pattern on the lower layer pattern previously formed on the irradiated surface of the substrate P, based on the measurement results of the slope or non-linear deformation of the whole or part of the lower layer pattern, The drawing lines (SLa, SLb) can be rotated (tilted). This improves the overlapping precision of the pattern formed in the lower layer.

In addition, the drawing lines (SLa, SLb) of each drawing unit (U(U1 to U6)) are arranged at the same position in the sub-scanning direction, but they may be arranged in different positions in the sub-scanning direction. The point is that the drawing lines SLa and SLb should be spaced apart from each other in the main scanning direction. Even in this case, the rotational central axis AXr is a point set between the midpoint of the drawing line SLa and the midpoint of the drawing line SLb, or the midpoints of the drawing line SLa and the drawing line SLb. Since the center point set on the line segment connecting

Furthermore, in the first embodiment, the main scanning of the spot light SPa and SPb along each of the two drawing lines SLa and SLb is performed by one polygon mirror PM, as shown in FIG. 2. As shown, even when 12 drawing lines (SL1a to SL6a, SL1b to SL6b) are set corresponding to the exposure area (W) on the substrate (P) with a wide width in the Y direction, the number of polygon mirrors (PM) is half. It ends with 6 letters. Therefore, vibration and noise (wind noise) generated along the high-speed rotation (for example, 20,000 rpm or more) of the polygon mirror (PM) are also suppressed.

[Modification of the first embodiment]

The first embodiment can also be modified as follows.

(Modification 1) FIG. 12 is a view of the beam scanning system using a polygon mirror (PM) in Modification 1 of the above-mentioned first embodiment when viewed from the +Zt direction, and FIG. 13 is a view of the beam main of FIG. 12. This is a drawing when the four seasons are viewed from the +Xt direction. In addition, the same components as those in the first embodiment are given the same reference numerals, their descriptions are omitted, and only the parts that are different from those in the first embodiment are described. The polygon mirror (PM) of this modification 1 is also a regular octagon with eight reflection surfaces (RPa to RPh) as shown in Figure 12, and two reflection surfaces located symmetrically with the rotation axis (AXp) in between ( For example, the reflective surfaces (RPa) and the reflective surfaces (RPe), the reflective surfaces (RPc) and the reflective surfaces (RPg), etc.) are parallel to each other.

As shown in FIG. 13, the reflection mirror M4a reflects the beam LBa passing through the beam forming optical system BFa and traveling in the +Xt direction in the -Zt direction. The beam LBa reflected in the -Zt direction by the reflecting mirror M4a passes through the first cylindrical lens CY1a, whose busbar is set parallel to the Xt axis, and then enters the reflecting mirror M5a. . The reflection mirror M5a reflects the incident beam LBa in the +Yt direction and guides it to the first reflection surface RPc of the polygon mirror PM. As shown in FIG. 12, the polygon mirror PM reflects the incident beam LBa toward the reflection mirror M5a (-Yt direction side) and guides it to the reflection mirror M6a. As explained in the first embodiment above, the reflection mirror M6a reflects the incident beam LBa in the -Xt direction and guides it to the fθ lens FTa. Similarly, the reflecting mirror M4b reflects the beam LBb that passes through the beam forming optical system BFb and travels in the +X direction in the -Zt direction. The beam LBb reflected in the -Zt direction by the reflecting mirror M4b passes through the first cylindrical lens CY1b, whose busbar is set parallel to the Xt axis, and then enters the reflecting mirror M5b. . The reflection mirror M5b reflects the incident beam LBb in the -Yt direction and guides it to the second reflection surface RPg of the polygon mirror PM. The polygon mirror PM reflects the incident beam LBb toward the reflection mirror M5b (+Yt direction side) and guides it to the reflection mirror M6b. As described in the first embodiment, the reflecting mirror M6b reflects the incident beam LBb in the -Xt direction and guides it to the fθ lens FTb. Reflecting mirrors M6a and M6b are arranged at the same position with respect to the Zt direction. In addition, the reflecting mirror M5a is placed on the -Zt direction side rather than the reflecting mirror M6a, and the reflecting mirror M5b is placed on the +Zt direction side rather than the reflecting mirror M6b. Additionally, the reflecting mirrors M5a and M5b and the reflecting mirrors M6a and M6b are provided at approximately the same position with respect to the Xt direction. That is, the reflecting mirrors M5a and M5b and the reflecting mirrors M6a and M6b are provided along the Yt direction.

These reflection mirrors M4a and M4b are provided in place of the reflection mirror M4 of the first embodiment, and have the same function as the reflection mirror M4. In addition, the first cylindrical lenses CY1a and CY1b are provided in place of the first cylindrical lens CY1 of the first embodiment, and have the same function as the first cylindrical lens CY1. . That is, the cylindrical lenses (CY1a, CY1b) direct the incident beams (LBa, LBb) to the polygon mirror in the non-scanning direction (Zt direction) orthogonal to the scanning direction (rotation direction) by the polygon mirror (PM). (PM) converges on the reflecting surface (RP). Similarly, the reflective mirrors M5a and M5b are provided in place of the reflective mirror M5 in the first embodiment, and have the same function as the reflective mirror M5. In this way, the reflecting mirror M4, the first cylindrical lens CY1, and the reflecting mirror M5 of the first embodiment are connected to the first light guiding optical system 20 and the second light guiding optical system 22. The reflection mirrors M4a and M4b, the first cylindrical lenses CY1a and CY1b, and the reflection mirrors M5a and M5b are provided separately from each other.

In addition, the distance in the Yt direction within the It is enlarged to be larger than the dimension (diameter) of the mirror (PM) in the Yt direction.

In this modification example 1, as shown in FIG. 13, the rotation axis AXp of the polygon mirror PM is tilted in the Yt direction from a state parallel to the Zt axis by a certain angle θy (less than 45°). ) Place the entire thing at an angle. Therefore, among the reflective surfaces RP of the polygon mirror PM, the reflective surfaces RPc and RPg located to face each of the reflective mirrors M6a and M6b during rotation are aligned in the Yt direction with respect to the Zt axis. It is inclined by a certain angle θy. 12 and 13 show that the reflection surface RPc of such a polygon mirror PM and the reflection surface RPg opposing the reflection surface RPc with the rotation axis AXp in between are all parallel to the Xt axis. It represents the state at the moment of occurrence. At this time, the beams (LBa, LBb) incident on the reflecting surfaces (RPc, RPg) of the polygon mirror (PM) when viewed from the direction Since it is incident at , the reflection position of the beams (LBa, LBb) by the polygon mirror (PM) can be set to the same height position with respect to the Zt direction. That is, the positions of the reflecting mirrors M6a and M6b in the Zt direction can be made the same. In addition, each center line (direction of travel) of the beams LBa and LBb reflected from the polygon mirror PM and heading toward the reflection mirrors M6a and M6b can be set parallel to the XtYt plane. As a result, the positions of the first projection optical system 24 and the second projection optical system 26 in the Zt direction can be set to the same position, and the drawing lines SLa and SLb on the irradiated surface of the substrate P can be set to the same position. It becomes easier to place on a straight line.

Also, as shown in FIG. 13, the polygon mirror (PM) is tilted by an angle θy, and each of the beams (LBa, LBb) is directed to each of the two mutually parallel reflection surfaces (RPc, RPg) of the polygon mirror (PM) in the Yt direction. In the case where the projection position is configured to project from the reflection surface RPc and the height in the Zt direction of the projection position of the beam LBa on the reflection surface RPc matches the projection position of the beam LBb on the reflection surface RPg, the inclination angle θy is increased. Then, it is necessary to increase the height of the reflecting surfaces (RPa to RPh) in the direction of the rotation axis (AXp). In the case of Modification 1, if the inclination angle θy of the polygon mirror (PM) is increased, placement of the reflection mirrors (M5a, M5b, M6a, M6b, etc.) becomes easier, while the reflection surface (RPa) of the polygon mirror (PM) becomes easier. The dimension in the direction of the rotation axis (AXp) of ~RPh) increases, and the mass of the polygon mirror (PM) increases. Therefore, in the case where priority is given to reducing the mass of the polygon mirror (PM) in order to speed up rotation, in the Zt direction, the projection position of the beam LBa on the reflecting surface RPc and the beam on the reflecting surface RPg ( It is okay to change the projection position of LBb).

In addition, as shown in FIG. 13, the beams LBa and LBb incident on the reflecting surfaces RPc and RPg contributing to the drawing of the polygon mirror PM are viewed from the direction Xt orthogonal to the rotation axis AXp. By making RPc, RPg) incident at an angle in the YtZt plane, the incident direction and reflection direction of the beams (LBa, LBb) can be changed in the rotation axis (AXp) direction or the Zt direction. As a result, when the polygon mirror PM is viewed from the rotation axis AXp direction or the Zt direction (state in FIG. 12), each beam (LBa, LBb) is directed to the reflection surfaces (RPc, RPg) that contribute to drawing. It can be incident so that it is approximately perpendicular. That is, when viewed from within the It can be set to pass through the rotation axis (AXp) of the polygon mirror (PM).

By configuring in this way, when viewed from within the In a state of bias scanning in a certain angle range θs, the first projection optical system 24 (specifically, the fθ lens (FTa)) and the second projection optical system 26 (specifically, the fθ lens (FTb)) Guided. Therefore, when viewed from the rotation axis (AXp) direction or the Zt direction, for one scan of the spot light (SPa, SPb) along the drawing line (SLa, SLb), one reflection surface (RP(RPc, RPg)) The effective reflection angle range (θs) of the pulsed beams (LBa, LBb) continuously incident on can be divided into an equal angle range (±θs/2) centered on the center line (AXs). As a result, the optical performance (aberration characteristics, focus characteristics, spot quality, etc.) and constant velocity of the beams (LBa, LBb) and spot lights (SPa, SPb) scanned by the polygon mirror (PM) are improved, and the scanning precision is improved. It improves.

(Modification 2) FIG. 14 is a view of the beam scanning system using the polygon mirror (PMa) in Modification 2 of the above-described first embodiment when viewed from the +Zt direction, and FIG. 15 is a view of the beam main of FIG. 14. This is a drawing when the four seasons are viewed from the +Xt direction. In addition, the same components as those in Modification 1 of the first embodiment are given the same reference numerals, and only the different parts are explained. Additionally, the reflecting mirrors M5a and M5b are at the same position with respect to the Zt direction and are disposed on the +Zt direction side than the reflecting mirrors M6a and M6b. Additionally, the reflecting mirrors M5a and M5b and the reflecting mirrors M6a and M6b are provided at approximately the same position with respect to the Xt direction.

In this modification 2, the rotation axis (AXp) of the polygon mirror (PMa) having eight reflection surfaces (RPa to RPh) is parallel to the Zt axis, and each reflection surface (RPa to RPh) of the polygon mirror (PMa) is It was formed to be inclined at an angle θy with respect to the rotation axis (AXp). 14 and 15 show that the first reflective surface RPc of the polygon mirror PMa and the second reflective surface RPg opposite the reflective surface RPc with the rotation axis AXp in between are both Xt. It represents the moment when it becomes parallel to the axis. And, as shown in FIG. 15, when viewed from the direction When projected from the inclined upper part (+Zt direction) with respect to the reflecting surfaces (RPc, RPg), the reflection position of the beam (LBa, LBb) on each reflecting surface (RPc, RPg) is within the plane parallel to the XtYt plane, that is, Zt It can be set at the same height position with respect to direction. That is, the positions of the center lines of the beams (LBa, LBb) reflected by the polygon mirror (PM) in the Zt direction can be made the same. As a result, as in Modification 1 of the first embodiment, the positions of the first projection optical system 24 and the second projection optical system 26 in the Zt direction can be set to the same position, so that the position of the substrate P It becomes easy to arrange the drawing lines (SLa, SLb) on the irradiated surface on a straight line.

In addition, when viewed from the Since the incident beams (LBa, LBb) are incident at an angle inclined in the Z direction with respect to the reflection surface (RP), when viewed from within the YtZt plane, the incident angle direction and reflection angle direction of the beams (LBa, LBb) are as shown in FIG. 15. , can be separated by an angle of 2θy in the direction of the rotation axis (AXp) (Zt direction). As a result, when the polygon mirror PMa is viewed from the rotation axis AXp direction (Zt direction), the incident direction and reflection direction of the beams LBa and LBb can be set to the same direction, as shown in FIG. 14. . As a result, the beams LBa, LBb from the reflection mirrors M5a, M5b reflected by the polygon mirror PMa do not return to the reflection mirrors M5a, M5b, but enter the reflection mirrors M6a, M6b. .

In this modified example 2, as in modified example 1 of FIG. 12, the beams (LBa, LBb) reflected from each of the reflecting surfaces (RPc, RPg) contributing to the drawing of the polygon mirror (PMa) are centered at the center line (AXs). ), the first projection optical system 24 (specifically, the fθ lens (FTa)) and the second projection optical system 26 (specifically, the fθ lens ( You will be guided to FTb)). Therefore, for one scan of spot light along the drawing line (SLa, SLb), the effective reflection angle range of the pulsed beam (LBa, LBb) continuously incident on one reflection surface (RP(RPc, RPg)) (θs) can be distributed into an equal angular range (±θs/2) centered on the center line (AXs). As a result, the optical performance (aberration characteristics, focus characteristics, spot quality, etc.) and constant velocity of the beams (LBa, LBb) and spot lights (SPa, SPb) scanned from the polygon mirror (PMa) are improved, and the scanning precision is improved. It improves.

(Modification 3) In Modification 1 of the first embodiment, the rotation axis AXp of the polygon mirror PM is inclined in the Yz direction with respect to the Zt axis by an angle θy, and in Modification 2, the polygon mirror ( The rotation axis (AXp) of the polygon mirror (PMa) was parallel to the Zt axis, and each reflective surface (RPa to RPh) of the polygon mirror (PMa) was formed to be inclined at an angle θy with respect to the Zt axis. However, the arrangement of the polygon mirror PM and the configuration of each reflection surface RP (RPa to RPh) are not limited to the above modification examples 1 and 2. For example, using a polygon mirror (PM) of the same configuration as the first embodiment, each reflection surface (RP) (parallel to the Zt axis and rotation axis (AXp)) and a plane perpendicular (parallel to the XtYt plane) It is okay to make the beam LB incident from the inclined upper part (or lower part). As a result, when the polygon mirror (PM) is viewed from the direction of the rotation axis (AXp) of the polygon mirror (PM), in a state where each reflection surface (RP) is positioned so that the beams (LBa, LBb) are vertically incident, the beam (LBa) , LBb) can be made the same as the incident direction and reflection direction, and the incident direction and reflection direction of the beams (LBa, LBb) can be shifted in the direction of the rotation axis (AXp) (Zt axis). Therefore, the polygon mirror (PM) divides the beams (LBa, LBb) reflected from each of the two reflection surfaces (RP) into a certain angle range θs (centered on the center line (AXs)) with the center line (AXs) as the center. is deflected to the middle of the angle ±θs/2), and is transferred to the first projection optical system 24 (specifically, the fθ lens (FTa)) and the second projection optical system 26 (specifically, the fθ lens (FTb)). You can be guided. In this way, even in the case of Modification 3, as in Modifications 1 and 2 of the first embodiment, the optical performance of the beams (LBa, LBb) or spot lights (SPa, SPb) scanned from the polygon mirror (PM) ( Aberration characteristics, focus characteristics, spot quality, etc.) and constant velocity are improved, and scanning precision is improved.

(Modification 4) As in Modification 3 above, a regular octagonal polygon mirror (PM) is used where the rotation axis (AXp) is parallel to the Zt axis and each reflection surface (RPa to RPh) is also parallel to the rotation axis (AXp). Therefore, as in each of the preceding modifications 1 to 3, the incident direction and reflection direction of the beams (LBa, LBb) incident on the reflection surface (RP) of the polygon mirror (PM) contributing to drawing are determined within the XtYt plane. In another configuration where the beam is oriented in the same direction when viewed, a polarizing beam splitter (PBS (PBSa, PBSb)) may be used, as shown in FIGS. 16A and 16B. FIG. 16A is a view of the beam scanning system using a polygon mirror (PM) in Modification Example 4 of the first embodiment when viewed from the +Zt direction, and FIG. 16B is a view of the beam scanning system of FIG. 16A in the -Xt direction. This is a drawing as seen from the side. In addition, the same reference numerals are given to the same members as those described in each of the first embodiment and modification examples 1 and 2 above, and only the different parts are explained.

16A and 16B, in this modification example 4, between the polygon mirror PM and the reflection mirror M6a, the entrance/exit surface of the beam has a rectangular parallelepiped shape parallel to each of the XtYt plane and the XtZt plane. A polarizing beam splitter (PBSa) is disposed between the polygon mirror (PM) and the reflection mirror (M6b), and has a rectangular parallelepiped-shaped polarizing beam splitter (PBSb) whose beam entrance/exit plane is parallel to each of the XtYt plane and XtZt plane. is placed. Each polarization separation surface of the polarizing beam splitter (PBSa, PBSb) is set to be inclined at 45° with respect to either the XtYt plane or the XtZt plane. In addition, a 1/4 wave plate (QPa) is provided between the polarizing beam splitter (PBSa) and the polygon mirror (PM), and a 1/4 wave plate (QPa) is provided between the polarizing beam splitter (PBSb) and the polygon mirror (PM). A plate (QPb) is prepared.

In the above configuration, the beam LBa, which has been modulated by the optical element (acousto-optic modulation element) AOMa (see FIGS. 5 and 7), has a first cylindrical beam whose bus bar is parallel to the Xt axis, as shown in FIG. 16B. While converging in the Yt direction by the drical lens (CY1a), it is incident on the polarizing beam splitter (PBSa) from the +Zt direction side, parallel to the Zt axis. When the beam (LBa) is linearly S-polarized, most of the beam (LBa) is reflected from the polarization separation surface of the polarizing beam splitter (PBSa), passes through the 1/4 wave plate (QPa), becomes circularly polarized, and becomes a polygon mirror ( PM). The rotation angle position of the polygon mirror PM is, for example, as shown in FIG. 16A, at an angle ±θs/2 from the state in which one reflection surface PRc contributing to drawing by the beam LBa is parallel to the XtZt plane. When within the range, the beam (LBa) passing through the 1/4 wave plate (QPa) is reflected from the reflection surface (PRc), passes through the 1/4 wave plate (QPa) again, becomes linear P polarization, and is sent to the polarizing beam splitter. It comes back to (PBSa). Therefore, most of the beam LBa reflected from the reflection surface PRc passes through the polarization separation surface of the polarizing beam splitter PBSa and heads toward the reflection mirror M6a.

Similarly, the beam LBb modulated by the optical element (acousto-optic modulation element) AOMb (see FIGS. 5 and 7) has a first cylindrical bus bar parallel to the Xt axis, as shown in FIG. 16B. While converging in the Yt direction by the lens CY1b, it is incident on the polarizing beam splitter (PBSb) from the +Zt direction side, parallel to the Zt axis. When the beam LBb is linearly S-polarized, most of the beam LBb is reflected from the polarization separation surface of the polarizing beam splitter (PBSb), passes through the 1/4 wave plate (QPb), and becomes circularly polarized, forming a polygon mirror ( PM). As shown in FIG. 16A, the rotation angle position of the polygon mirror PM is within the range of angle ±θs/2 from the state in which one reflection surface PRg contributing to drawing by the beam LBb is parallel to the XtZt plane. At this time, the beam (LBb) that has passed through the 1/4 wave plate (QPb) is reflected from the reflection surface (PRg), passes through the 1/4 wave plate (QPb) again, becomes linear P polarization, and is sent to the polarization beam splitter (PBSb). returns to Therefore, most of the beam LBb reflected from the reflection surface PRg passes through the polarization separation surface of the polarizing beam splitter PBSb and heads toward the reflection mirror M6b.

With the above configuration, each of the beam LBa reflected from the reflection mirror M6a and the beam LBb reflected from the reflection mirror M6b is scanned within the angle range θs in a plane parallel to the XtYt plane. do. In addition, the extension of the optical axis AXfa of the first projection optical system 24 (specifically, the fθ lens FTa) disposed behind the reflection mirror M6a is bent by 90° at the reflection mirror M6a to form a polygon mirror. The extension of the optical axis AXfb of the second projection optical system 26 (specifically, the fθ lens FTb), which intersects the rotation axis AXp of (PM) and is disposed behind the reflection mirror M6b, is a reflection mirror. It is bent by 90° in (M6b) and placed to intersect the rotation axis (AXp) of the polygon mirror (PM). Therefore, also in this modification 4, the polygon mirror PM reflects the beams LBa and LBb reflected from each of the two reflection surfaces (for example, RPc and RPg) with the optical axes AXfa and AXfb as the center. By deflecting to a certain angular range θs (middle of the angle ±θs/2 centered on the optical axes AXfa, AXfb), the first projection optical system 24 (fθ lens (FTa)) and the second projection optical system 26 ( It can be guided by an fθ lens (FTb). In this way, even in the case of Modification 4, the optical performance (aberration characteristics, focus characteristics, spot quality, etc.) and isokinesis of the beams (LBa, LBb) or spot lights (SPa, SPb) scanned from the polygon mirror (PM) are This improves scanning precision. In addition, as in the first embodiment and its modifications 1 to 3, in this modification 4, polarization is generated by scanning the respective polarizations of the two beams (LBa, LBb) using one polygon mirror (PM). The drawing line (SLa, SLb) is a length that can maintain linearity with precision according to the fineness (minimum line width) of the pattern to be drawn or the effective dimension (diameter) of the spot light (SPa, SPb), for example. For example, it can be set to about 30~80mm.

In addition, in the above modified example 4, the beams LBa and LBb deflected and scanned by the polygon mirror PM are within the effective angle range θs corresponding to the length of the drawing lines SLa and SLb, as shown in FIG. 16A. It enters the polarizing beam splitter (PBSa, PBSb). Accordingly, the extinction ratio, which is the degree of separation between P-polarized light and S-polarized light, of the polarizing beam splitters (PBSa, PBSb) is set to be maximum over the angular range θs or more. As an example of such a polarizing beam splitter (PBSa, PBSb), a film of hafnium oxide (HfO2) and a film of silicon dioxide (SiO2) are repeatedly laminated on the polarization separation surface, as described in the pamphlet of International Publication No. 2014/073535. It has been disclosed.

[Second Embodiment]

FIG. 17 is a diagram showing a partial configuration of the drawing unit Ua in the second embodiment. Since each drawing unit Ua has the same configuration, the second embodiment also uses the drawing unit Ua2, which scans the spot lights SPa and SPb along the drawing lines SL2a and SL2b, as an example. do. In addition, the same symbols are assigned to the same components as those in the first embodiment. In addition, only the parts that are different from the above first embodiment will be described.

In the second embodiment, the polygon mirror PM is provided so that the rotation axis AXp extends in the It is provided. Among the eight reflection surfaces (RP) of this polygon mirror (PM), two reflection surfaces (RP) forming an angle of 90° with each other in the YtZt plane (reflection surfaces (RPb, RPh in Fig. 17)) have -Zt axis. Beams (LBa, LBb) traveling in this direction are incident. The first reflection surface RP (here RPh) of the polygon mirror PM reflects the beam LBa incident from the first direction toward the -Yt direction and guides it to the reflection mirror M6a. The beam LBa reflected by the reflection mirror M6a travels in the -Zt direction, passes through the fθ lens FTa and the cylindrical lens CY2a, and then enters the substrate P. By this fθ lens FTa and cylindrical lens CY2a, the beam LBa incident on the substrate P becomes spot light SPa on the irradiated surface of the substrate P. In addition, the second reflection surface RP (RPb here) of the polygon mirror PM reflects the beam LBb incident from a second direction different from the first direction in the +Yt direction to form a reflection mirror M6b. Guide to: The beam LBb reflected by the reflection mirror M6a travels in the -Zt direction, passes through the fθ lens FTb and the cylindrical lens CY2b, and then enters the substrate P. By this fθ lens FTb and cylindrical lens CY2b, the beam LBb incident on the substrate P becomes spot light SPb on the irradiated surface of the substrate P. The spot lights SPa and SPb projected onto the irradiated surface of the substrate P scan the drawing lines SL2a and SL2b at a constant speed by rotating the polygon mirror PM.

In this way, the polygon mirror (PM) is provided so that the rotation axis (AXp) extends in the Xt-axis direction, and the fθ lenses (FTa, FTb) are provided so that their optical axes (AXfa, AXfb) extend in the Zt-axis direction. As in the first embodiment, there is no need to provide reflection mirrors M7a and M7b that reflect the beams LBa and LBb passing through the fθ lenses FTa and FTb and traveling in the -Xt direction in the -Z direction. . Even with this configuration, the same effect as the first embodiment can be obtained.

Additionally, in the second embodiment, the reflection mirror M6a, the fθ lens (FTa), and the cylindrical lens CY2a function as the first projection optical system 24a, and the reflection mirror M6a and the fθ lens function as the first projection optical system 24a. The lens FTb and the cylindrical lens CY2b function as the second projection optical system 26a. The drawing unit Ua of the second embodiment can also be rotated around the rotational central axis AXr, and the rotational central axis AXr connects the midpoint of the drawing line SL2a and the midpoint of the drawing line SL2b. It passes through the center point of the line segment and passes perpendicularly to the irradiated surface of the substrate P.

Moreover, in this second embodiment, although not specifically shown, instead of the first light guiding optical system 20 and the second light guiding optical system 22 of the first embodiment, a beam LBa from the light source device 14 is used. The first and second light guiding optical systems are arranged to guide the beams (LBa, LBb) to the polygon mirror (PM) so that LBb) proceeds in the -Z direction and enters the polygon mirror (PM).

As described in Modification Example 3 of the first embodiment, the beam LB is tilted with respect to the direction intersecting the rotation direction of the reflection surface RP (the direction in which the rotation axis AXp of the polygon mirror PM extends). By making it incident on the reflection surface RP, it is also possible to shift the incident direction and reflection direction of the beams LBa and LBb in the direction of the rotation axis AXp. Therefore, the same effect as Modification Example 3 of the first embodiment can be obtained.

In addition, as described in Modification 1 of the first embodiment, the polygon mirror PM has the rotation axis AXp of the polygon mirror PM in the Xt direction when viewed from a direction perpendicular to the rotation axis AXp. It's okay to tilt it. Additionally, the polygon mirror (PMa) described in Modification Example 2 of the first embodiment may be used. That is, the rotation axis (AXp) of the polygon mirror (PM) in Figure 17 is parallel to the Xt axis, and each reflective surface (RP (RPa to RPh)) of the polygon mirror (PM) is parallel to the rotation axis (AXp). As shown in FIG. 15, it may be formed to be inclined by an angle θy. As a result, the beams (LBa, LBb) incident on each reflective surface (RP(RPa to RPh)) of the polygon mirror (PM) viewed from the direction perpendicular to the rotation axis (AXp) are tilted with respect to each reflective surface (RP). By irradiating the light, the same effects as those of Modification Examples 1 and 2 of the first embodiment can be obtained.

[Third Embodiment]

FIG. 18 is a configuration diagram of the drawing unit Ub in the third embodiment as seen from the -Yt (-Y) direction side, and FIG. 19 is a configuration diagram of the drawing unit Ub on the +Zt side from the polygon mirror PMb. FIG. 20, a view seen from the direction side, is a view of the configuration of the drawing unit Ub on the -Zt direction side from the polygon mirror PMb as seen from the +Zt direction side. In addition, the same symbols are assigned to the same components as those in the first embodiment. In addition, only the parts that are different from the above first embodiment will be described.

As shown in FIG. 19, the drawing unit Ub includes a triangular reflection mirror (right-angle mirror) M10 whose ridge line is parallel to the Xt axis, reflection mirrors M11a and M11b, shift optical members SRa and SRb, and a bus bar. Cylindrical lenses (CY1a, CY1b) parallel to the It has an optical system of fθ lenses (FTa, FTb), reflection mirrors (M15a, M15b), and cylindrical lenses (CY2a, CY2b) whose bus lines are parallel to the Yt axis. The optical members provided as a pair for the two beams LBa and LBb are given a and b after the reference numerals.

As shown in FIG. 19, the two beams LBa and LBb (both parallel light beams) from the light source device 14 are lined up in parallel across the rotation center axis AXr and proceed in the -Zt direction, and are drawn. It is incident on other reflection surfaces M10a and M10b sandwiched between the ridges of the triangular reflection mirror M10 of the unit Ub. These beams (LBa, LBb) are reflected on each reflection surface (M10a, M10b) of the triangular reflection mirror (M10) of the writing unit (Ub) so as to be symmetrical in the Yt direction with respect to the rotational central axis (AXr) parallel to the Zt axis. join the company The reflective surface M10a of the triangular reflective mirror M10 reflects the beam LBa in the -Yt direction and guides it to the reflective mirror M11a, and the reflective surface M10b of the triangular reflective mirror M10 reflects the beam (LBa) in the -Yt direction. LBb) is reflected in the +Yt direction and guided to the reflection mirror (M11b). The beam (LBa) reflected by the reflection mirror (M11a) proceeds in the -Zt direction, passes through the shift optical member (SRa) and the cylindrical lens (CY1a), and then passes through the reflection surface (RP) of the polygon mirror (PMb). ) (e.g., reflecting surface (RPa)). The beam (LBb) reflected by the reflection mirror (M11b) proceeds in the -Zt direction, passes through the shift optical member (SRb) and the cylindrical lens (CY1b), and then passes through the reflection surface (RP) of the polygon mirror (PMb). ) (e.g., reflecting surface (RPe)). The reflection surface (RPa) and the reflection surface (RPe) of the polygon mirror (PMb) are positioned symmetrically with the rotation axis (AXp) of the polygon mirror (PMb) in between.

In the third embodiment, as shown in FIG. 20, the rotation axis AXp of the polygon mirror PMb is set to be coaxial with the rotation center axis AXr. In the triangular reflection mirror M10 and the reflection mirrors M11a and M11b (see FIG. 19), the distance in the Yt direction between the respective center lines of the beams LBa and LBb incident on the polygon mirror PMb is expanded. As a result, the distance between the optical axes of the beams LBa and LBb incident on the drawing unit Ub can be shortened, and the beams LBa and LBb incident on the drawing unit Ub (triangular reflection mirror M10) can be shortened. ) can be brought close to the central axis of rotation (AXr). As a result, even when the entire drawing unit Ub rotates, it is possible to suppress the positions of each center line of the beams LBa and LBb following the rotation from changing significantly within the drawing unit Ub. The change in position of each center line of the beams LBa and LBb due to the rotation of the drawing unit Ub is corrected by the shift optical members SRa and SRb that function similarly to the first embodiment.

In addition, the reflection surface M10a of the triangular reflection mirror M10, the reflection mirror M11a, the shift optical member SRa, and the cylindrical lens CY1a direct the beam LBa to the polygon mirror PMb. It functions as the first light guiding optical system 20b that guides the light toward the first reflection surface RP (RPa). In addition, the reflecting surface M10b of the triangular reflecting mirror M10, the reflecting mirror M11b, the shift optical member SRb, and the cylindrical lens CY1b direct the beam LBb to the polygon mirror PMb. It functions as a second light guide optical system 22b that guides the light toward a second reflection surface (RP(RPe)) that is different from the first reflection surface. In addition, each reflection surface M10a, M10b of the triangular reflection mirror M10 may be a flat mirror provided separately from the first light guide optical system 20b and the second light guide optical system 22b. In addition, the cylindrical lens (CY1a (CY1b is also the same)) has a refractive power that converges the beam (LBa (LBb)) incident as a parallel light flux only in the Yt direction, so the reflection surface of the polygon mirror (PMb) ( On RPa (reflective surface (RPe)), spot light extending in a slit shape in the Xt direction is projected.

The polygon mirror (PMb) of the third embodiment has a regular octagonal appearance as shown in FIG. 20 when viewed from within the XtYt plane, and eight reflection surfaces (RPa to RPh) formed around it (RPa to RPh in FIG. 19 Each of (RPe shown) is formed to be inclined by 45 degrees with respect to the rotation axis AXp (rotation central axis AXr). In other words, the polygon mirror (PMb) has a regular octagonal bottom and each of the eight sides is inclined at 45 degrees with respect to the center line. It is shaped like a regular octagonal pyramid cut to an appropriate thickness in the direction of the center line. Therefore, each reflection surface (RPa to RPh) of the polygon mirror (PMb) reflects the beam (LBa) traveling in the -Zt direction at a right angle to the -Yt direction and guides it to the reflection mirror (M12a), and guides the beam (LBa) traveling in the -Zt direction to the reflection mirror (M12a). The traveling beam LBb is reflected at a right angle in the +Y direction and guided to the reflection mirror M12b. Therefore, as in Modification 2 of the first embodiment, the polygon mirror (PMb) reflects the beams (LBa, LBb) reflected from, for example, the reflective surfaces (RPa, RPe) among the eight reflective surfaces (RPa to RPh). Can be reflected in a certain angle range θs around each center line (AXs (coaxial with each optical axis (AXfa, AXfb) of the two fθ lenses (FTa, FTb))). As a result, the optical performance, scanning linearity, and constant velocity of the spot light (SPa, SPb) of the beams (LBa, LBb) by the polygon mirror (PMb) are improved, and scanning precision (drawing precision) is improved.

18 and 20, the beam LBa from the polygon mirror PMb (for example, the reflection surface RPa) reflected in the -Xt direction by the reflection mirror M12a is reflected by the reflection mirror M13a. , is guided to the fθ lens (FTa) via M14a). Similarly, the beam LBb from the polygon mirror (PMb (e.g., reflective surface (RPe))) reflected in the + FTb). The reflecting mirror M13a reflects the beam LBa traveling in the -Xt direction from the reflecting mirror M12a in the -Zt direction at the bending position p13a, and the reflecting mirror M14a reflects the reflecting mirror M13a. ) is reflected in the +Xt direction at the bending position (p14a) and guided to the fθ lens (FTa). The reflecting mirror M13b reflects the beam LBb traveling in the + The beam (LBb) is reflected in the -Xt direction at the bending position (p14b) and guided to the fθ lens (FTb). In addition, although not shown in FIG. 20, the beam LBa incident on the fθ lens FTa through the reflection mirrors M12a, M13a, and M14a is XtYt by the action of the cylindrical lens CY1a. When viewed within the plane, it is a roughly parallel light flux, and when viewed within the XtZt plane, it is a divergent light flux as shown in Figure 18.

The beam LBa passing through the fθ lens FTa (the optical axis AXfa is parallel to the Xt axis) and traveling in the +Xt direction is reflected in the -Zt direction by the reflection mirror M15a in a telecentric state, After passing through the cylindrical lens CY2a, it is projected as circular spot light SPa on the irradiated surface of the substrate P. Likewise, the beam LBb passing through the fθ lens (FTb (the optical axis (AXfb) is parallel to the Xt axis)) and traveling in the - After being reflected and transmitted through the cylindrical lens CY2b, it is projected as circular spot light SPb on the irradiated surface of the substrate P. By the fθ lens FTa and the cylindrical lens CY2a, the beam LBa projected onto the substrate P is converged as a minute spot light SPa on the irradiated surface of the substrate P. Similarly, the beam LBb projected on the substrate P is converged as a minute spot light SPb on the irradiated surface of the substrate P by the fθ lens FTb and the cylindrical lens CY2b. By rotating one polygon mirror PMb, two spot lights SPa and SPb projected on the irradiated surface of the substrate P are simultaneously one-dimensionally scanned on the drawing lines SLa and SLb. In the case of the configuration of the third embodiment, the two spot lights SPa and SPb scan and move in opposite directions along the drawing lines SLa and SLb. Then, as shown in Figure 20, when the polygon mirror (PMb) is rotated clockwise within the The ends of are set to be the scanning end positions of the spot lights SPa and SPb, respectively. Conversely, when the polygon mirror (PMb) is rotated counterclockwise within the , are set to be the scanning start positions of the spot lights SPa and SPb, respectively.

In the above configuration, the reflection mirrors (M12a, M13a, M14a, M15a), the fθ lens (FTa), and the cylindrical lens (CY2a) collect the beam (LBa) that is reflected from the polygon mirror (PMb) and deflected and scanned. Thus, it functions as a first projection optical system 24b that projects spot light SPa onto the drawing line SLa. In addition, the reflection mirrors (M12b, M13b, M14b, M15b), the fθ lens (FTb), and the cylindrical lens (CY2b) collect the beam (LBb) that is reflected from the polygon mirror (PMb) and deflected and scanned into a spot. It functions as a second projection optical system 26b that projects light SPb onto the drawing line SLb.

18 and 20, in the third embodiment, the optical path length from the reflection surface RP of the polygon mirror PMb to the fθ lenses (FTa, FTb) is the reflection mirror M12a therebetween. Since it is delayed by ~M14a, M12b~M14b), an fθ lens (FTa, FTb) with a long focal length on the beam incident side can be used. In general, the reflecting surface of a polygon mirror (PM (PMa, PMb is also the same)) is at the position (pupil position) of the focal length fs on the beam incident side of the telecentric fθ lens (FTa (FTb)). placed nearby. Therefore, if the length of the drawing line SLa(SLb) on the irradiated surface is Lss, and the deflection angle range of the beam incident on the fθ lens at that time is θs, approximately, Lss≒fs·sin(θs ) is expressed as a relationship. Therefore, when the length Lss of the drawing line SLa(SLb) is set to a constant value, if an fθ lens with a long focal length fs is used, the deflection angle range θs can be reduced accordingly. This means that the rotation angle range θs/2 of the polygon mirror (PM (PMa, PMb)) contributing to one scan of the spot light (SPa (SPb)) along the drawing line (SLa (SLb)) becomes small. , there is an advantage that it leads to high speed.

As shown in Fig. 20, the drawing unit Ub according to the third embodiment has a drawing line SLa and a drawing line SLb through which the spot light SPa and the spot light SPb are respectively scanned, The drawing line SLa and SLb are set to be offset in the Yt direction so that they are spaced apart from each other in the sub-scanning direction and their ends are adjacent to each other or partially overlap in the main scanning direction. That is, the drawing lines SLa and SLb are arranged in a parallel state so that they are spaced apart in the sub-scanning direction (transfer direction of the substrate P) and are continuous without gap in the main scanning direction. Therefore, in the case of arranging a plurality of such drawing units Ub, they are arranged as shown in FIG. 21, for example.

In Fig. 21, corresponding to Fig. 2 above, the exposure area W as an electronic device formation area formed on the substrate P is divided into six in the Y (Yt) direction, and a plurality of stripe-shaped divided areas WS1 are shown. ~WS6) shows an example of drawing a pattern using six drawing lines (SL1a, SL1b, SL2a, SL2b, SL3a, SL3b). Here, the two drawing lines (SL1a, SL1b) by the first drawing unit (Ub1), which has the same configuration as the drawing unit (Ub) shown in FIGS. 18 to 20, are divided into divided areas (WS1, WS1) adjacent to each other in the Y direction. WS2) is set to draw patterns. Similarly, the two drawing lines (SL2a, SL2b) by the second drawing unit (Ub2) of the same configuration as the drawing unit (Ub) are set to draw patterns in the divided areas (WS3, WS4) adjacent in the Y direction, respectively. , the two drawing lines SL3a and SL3b by the third drawing unit Ub3, which has the same configuration as the drawing unit Ub, are set to draw patterns in the divided areas WS5 and WS6 adjacent to each other in the Y direction. The joint (STa) between the partition (WS1) and the partition (WS2), the junction (STb) between the partition (WS2) and the partition (WS3), the junction between the partition (WS3) and the partition (WS4) (STc), the junction STd between the divided areas WS4 and WS5, and the junction STe between the divided areas WS5 and WS6, six drawing lines SL1a,... , SL3a, and SL3b), the position of each drawing line in the Y direction and the drawing magnification for each drawing line are precisely adjusted so that the respective ends of the lines exactly coincide with each other in the Y direction or overlap slightly.

In this way, in the third embodiment, the two drawing lines SLa and SLb on which the spot light SPa and SPb are scanned by the drawing unit Ub (Ub1 to Ub3) are spaced apart from each other in the sub-scanning direction. In addition, the ends are set to be adjacent or partially overlap with respect to the main scanning direction. Even in this case, the rotational central axis AXr, when the entire drawing unit Ub is slightly rotated, has the center point of the line segment connecting the midpoints of the two drawing lines SLa and SLb perpendicular to the substrate P. It can be set to pass. Therefore, even when the entire drawing unit Ub is rotated around the rotational central axis AXr in order to obtain high overlap accuracy, the two drawing lines on which the spot light SPa and SPb are scanned by the drawing unit Ub Since the increase in positional deviation of (SLa, SLb) on the substrate P can be suppressed, the inclination of the drawing line (SLa, SLb) (inclination with respect to the Y axis within the surface to be irradiated) while performing high-precision pattern drawing. can be easily adjusted.

In addition, in each of the above-mentioned embodiments (including modifications), the drawing lines SL of the plurality of drawing units U, Ua, Ub are all set to the same scanning length, but the scanning lengths may be different. In this case, it is okay to make the scanning length of the drawing line (SL) different between the drawing units (U, Ua, Ub), and among the same drawing units (U, Ua, Ub), the scanning length of the drawing line (SLa, SLb) It's okay to do it differently. In addition, the rotational central axis AXr was made to pass perpendicularly to the substrate P through the center point of the line segment connecting the midpoints of the drawing lines SLa and SLb of the drawing units U, Ua, and Ub. It may be set in a direction perpendicular to the substrate P and on a line segment connecting the midpoints of the drawing lines SLa and SLb.

In the case of the above third embodiment, in order to perform pattern drawing on the irradiated surface of the substrate P supported in a cylindrical shape in the elongated direction by the rotating drums DR1 and DR2 as in the first embodiment, as shown in FIG. 22 As shown, an extension of the optical axis AXfa (AXfb) bent by the reflection mirror M15a (M15b) behind the fθ lens (FTa (FTb)) of the drawing unit Ub is the rotating drum DR1 or DR2. ), the inclination in the )) can also be arranged at an angle with respect to the XY plane to fit the inclined optical axis (AXfa(AXfb)). In addition, when supporting the substrate P flatly and parallel to the In addition, in order to support the substrate P by bending it into a cylindrical shape in the elongate direction, a large number of fine gas blowing holes (and a large number of fine suction holes) are formed on the surface curved into a cylindrical shape, and the back surface of the substrate P A pad member (substrate support holder) that supports the side in a non-contact or low-friction state with a gas bearing may be used instead of the rotating drums DR1 and DR2. Also, in the first and second embodiments and their modifications, instead of the rotating drums DR1 and DR2, the substrate P disclosed in the pamphlet of International Publication No. 2013/150677 is flattened parallel to the XY plane. You may use a transfer device that supports the substrate P, or you may use the above-described pad member (substrate support holder) that supports the back side of the substrate P in a non-contact or low-friction state with a gas bearing.

[Modifications of the first to third embodiments]

The first to third embodiments can also be modified as follows.

(Modification 1) FIG. 23 shows the beam LB (two beams LBa, LBb) provided from the light source device 14 shown in FIG. 1, for example, into four drawing units ( This is a diagram showing an example configuration of a beam distribution system for distribution to each of U1, U2, U5, and U6). In addition, this beam distribution system can be applied not only to the first embodiment, but also to any of the drawing devices according to the second and third embodiments and their modifications.

The light source device 14 includes a laser light source LS that outputs a laser beam (continuous light or pulsed light) with high brightness in the ultraviolet region, and a beam from the laser light source LS with a predetermined diameter (for example, a diameter of several mm). A beam expander (BX) that converts the beam into a parallel beam of light, a first beam splitter (half mirror) (BS1) that splits the beam that has become a parallel beam into two, and a mirror (MR1) are provided. The beam reflected from the beam splitter BS1 enters the second beam splitter BS2a as the beam LBa, and the beam passing through the beam splitter BS1 is reflected from the mirror MR1 to form the beam LBb. It is incident on the second beam splitter (BS2b). The splitting ratio of the beam splitter BS1 is 1:1, and the light intensities (illuminance) of the beams LBa and LBb are approximately the same. The beam LBa incident on the beam splitter BS2a and the beam LBb incident on the beam splitter BS2b are further divided into two with the same intensity ratio.

Among the beams LBa that have passed through the beam splitter BS2a, the beam LBa that has passed through the beam splitter BS2a is incident on the third beam splitter BS3a (splitting ratio is 1:1). Among the beams LBb incident on the beam splitter BS2b, the beam LBb that passed through the beam splitter BS2b is incident on the third beam splitter BS3b (splitting ratio is 1:1). The two beams LBa and LBb reflected from each of the beam splitters BS3a and BS3b become parallel to each other across the rotational central axis AXr of the drawing unit U1, and are transmitted to the corresponding optical elements AOMa. AOMb) (see FIG. 5, etc.) is directed to the drawing unit U1. Then, the two beams LBa and LBb that passed through each of the beam splitters BS3a and BS3b are reflected by the mirrors MR2a and MR2b, respectively, and then travel between the rotational central axes AXr of the writing unit U2. are placed in parallel with each other and are directed toward the drawing unit U2 via the corresponding optical elements AOMa and AOMb.

In addition, the beam LBa reflected from the front beam splitter BS2a is incident on the fourth beam splitter BS4a (splitting ratio is 1:1), and the beam LBb reflected from the front beam splitter BS2b ) is incident on the fourth beam splitter BS4b (splitting ratio is 1:1). The two beams LBa and LBb reflected from each of the beam splitters BS4a and BS4b become parallel to each other across the rotation center axis AXr of the drawing unit U5, and are transmitted to the corresponding optical elements AOMa. It is directed to the drawing unit (U5) via AOMb). Then, the two beams LBa and LBb that passed through each of the beam splitters BS4a and BS4b are reflected by the mirrors MR3a and MR3b, respectively, and then travel between the rotational central axes AXr of the writing unit U6. are placed in parallel with each other and are directed toward the drawing unit U6 via the corresponding optical elements AOMa and AOMb. With the above configuration, the beams LBa and LBb distributed to each of the four drawing units U1, U2, and U5 are all set to approximately the same light intensity.

However, the laser light source in the light source device 14 may be either a solid laser or a gas laser as long as it emits a high-brightness beam with a wavelength in the ultraviolet region. As a solid-state laser, a fiber laser light source is used that amplifies an infrared wavelength beam (pulse light of hundreds of MHz) from a semiconductor laser diode with a fiber amplifier and then radiates it as an ultraviolet wavelength beam (pulse light) by a wavelength conversion element. If so, a high-output ultraviolet beam can be obtained regardless of the relatively compact case, and assembly into the main body of the exposure device (drawing device) EX becomes easy. In addition, in the above first to third embodiments and each modification, a drawing unit U(Ua, Ub) that can rotate around the rotational central axis AXr within the main body of the exposure apparatus EX is provided with a drawing unit U(Ua, Ub). Although the configuration does not provide a light source, if sufficient pattern drawing (exposure) is possible with the intensity of the beam from a semiconductor laser diode (LD) or light emitting diode (LED), etc., each drawing unit (U(Ua, Ub) ) You may provide an LD or LED that supplies beams (LBa, LBb). However, since the temperature of the light source unit of these LDs and LEDs rises considerably during the pattern drawing operation, a temperature adjustment mechanism such as insulation and cooling of the light source unit within the drawing unit (U(Ua, Ub)) is provided, and drawing It is necessary to suppress the temperature change of the entire unit (U(Ua, Ub)) to small. In this case, optical elements AOMa and AOMb as shown in FIG. 5 are also provided in each drawing unit U(Ua, Ub).

(Modification 2) In the above first to third embodiments and their respective modifications, the polygon mirror PM (PMa, PMb) has eight reflective surfaces arranged at 45-degree intervals around the rotation axis AXp. It is made in the shape of an octahedron (or octagonal pyramid), but the number of reflecting surfaces can be any number, such as 3 to 6 sides, 9 sides, 10 sides, 12 sides, 15 sides, 16 sides, 18 sides, 20 sides, etc. Polygon mirrors can be used similarly. In general, even for polygons of the same diameter, as the number of reflective surfaces increases, wind loss decreases, so it is possible to rotate at a higher speed. In addition, although illustration and description are omitted in the first to third embodiments and their respective modifications, two beams (LBa, LBb) are reflected from each of the different reflecting surfaces of the polygon mirror (PM (PMa, PMb)). ) is the reflection direction corresponding to the scanning start point of the spot light (SPa, SPb) on the drawing line (scan line (SLa, SLb)). The origin sensor that outputs the origin signal at the timing is a polygon mirror (PM ( It is provided at two locations around PMa and PMb)). Management of the scanning position of the spot light (SPa, SPb) along the drawing line (SLa, SLb) (offset settings, etc.), and intensity modulation of the spot light (SPa, SPb) based on pattern data (optical elements (AOMa, AOMb) ) On/Off timing, etc. are controlled based on the origin signal and a clock signal corresponding to the scanning speed of the spot light (SPa, SPb).

[Fourth Embodiment]

In the above first to third embodiments and their respective modifications, in the optical path from the polygon mirror (PM(PMa, PMb)) to the fθ lens (FTa, FTb), the polygon mirror (PM(PMa, PMb)) The plane on which the reflecting beams LBa and LBb are deflected (a plane parallel to the In the embodiment, reflection mirrors M6a and M6b or reflection mirrors M12a and M12b that bend the beams LBa and LBb are provided in a plane parallel to the YtZt plane. When the beam (LB(LBa, LBb)) from the light source device 14 is in the ultraviolet wavelength range longer than the wavelength of about 240 nm, the polygon mirror (PM(PMa, PMb)) or the reflective surface of each reflective mirror is a base material of glass or ceramics. It is made by depositing an aluminum layer with high reflectivity on the surface, and then depositing a dielectric thin film (single layer or multiple layers) on top to prevent oxidation. In the case of a polygon mirror (PM), the base material itself is formed and processed from aluminum, the part that becomes the reflective surface is optically polished, and then a dielectric thin film (single layer or multiple layers) is deposited on the surface. In polygon mirrors (PM(PMa, PMb)) or reflective mirrors (M6a, M6b, M12a, M12b) having such a reflective surface structure, the incident angle of the beam (LBa, LBb) incident on the reflective surface is the beam for main scanning. It changes greatly depending on the angle of deflection, and when the beams (LBa, LBb) have polarization characteristics, the intensity of the reflected beam tends to change with changes in the angle of incidence, that is, the dependence of the reflectance of the reflecting surface on the angle of incidence. There are cases where the impact cannot be ignored.

FIG. 24 is a diagram illustrating in the YtZt plane the situation of the incident angle and reflection angle of the beam LBa projected onto each of the polygon mirror PM and reflection mirror M6a explained in FIG. 17 above. The situation described in FIG. 24 may similarly occur in other embodiments (FIGS. 5, 6, 12 to 16, and 18 to 20). In Figure 24, when the angle θo within the YtZt plane of one reflection surface (RPh) of the polygon mirror (PM) is 45°, the beam (LBa) incident parallel to the Zt axis is parallel to the Yt axis. After reflection at (RPh), it is bent at 90° at the reflection mirror (M6a) and proceeds coaxially with the optical axis (AXfa) of the subsequent fθ lens (FTa). Assuming that the polygon mirror (PM) is rotating clockwise in Fig. 24, the effective scanning start point of the spot light (SPa) along the drawing line (SL2a (SLa)) is the reflection surface (RPh) within the YtZt plane. This is the point in time when the angle becomes θo-Δθa, and the effective scanning end point of the spot light SPa is the time when the reflection surface RPh becomes the angle θo+Δθa within the YtZt plane. Accordingly, the deflection angle range of the beam LBa reflected from the reflection surface RPh of the polygon mirror PM and heading toward the reflection mirror M6a with respect to the optical axis AXfa is ±2Δθa. When the deflection angle of the beam LBa with respect to the optical axis AXfa is +2Δθa, the incident angle θm1 of the beam LBa projected on the reflection surface of the reflection mirror M6a is θm1 = 45°-2Δθa, and the optical axis AXfa ), when the deflection angle of the beam LBa is -2Δθa, the incident angle θm2 of the beam LBa projected on the reflection surface of the reflection mirror M6a is θm2=45°+2Δθa.

Here, using FIG. 25, the influence of the change in the angle of incidence of the beam LBa on the reflection mirror M6a will be explained. Figure 25 is a graph explaining the characteristic CV1 of the incident angle dependence of the reflectance that can be seen when a beam with polarization characteristics in the ultraviolet range is incident on a reflective surface composed of an aluminum layer and a dielectric thin film, and the vertical axis represents the reflective surface. It represents the reflectance (%), and the horizontal axis represents the angle of incidence (degrees) of the beam onto the reflecting surface. In general, when a beam is projected onto a reflective surface at an incident angle of 0° (i.e., normal incidence), the reflectivity is maximum. In the case of characteristic CV1 in Figure 25, the maximum reflectance is about 90%. When the angle of incidence is around 45°, the reflectance is about 87%, but as the angle of incidence becomes larger, the reflectance decreases significantly. When the reflectance of each reflective surface RPh of the polygon mirror PM is equal to the characteristic CV1, as shown in FIG. 24, the angle of incidence of the beam LBa incident on the reflective surface RPh of the polygon mirror PM is: It varies in the range of ±Δθa centered at 45°. Here, assuming that the maximum deflection angle range ±2Δθa of the beam LBa incident on the fθ lens system FTa to scan the drawing line SLa is ±15° around the optical axis AXfa, Δθa is 7.5° Therefore, the angle of incidence of the beam LBa on the reflecting surface RPh of the polygon mirror PM varies in the range of 37.5° to 52.5° centered on 45°. On characteristic CV1, the reflectance at an incident angle of 37.5° is about 88%, and at an incident angle of 52.5°, the reflectance is about 85.5%.

From the above, when the beam LBa reflected by the polygon mirror PM is incident on the fθ lens system FTa as is, the intensity of the spot light SPa at the scanning start point on the drawing line SLa and the intensity of the spot light SPa at the scanning end point The intensity of the spot light (SPa) has a difference of 88% - 85.5% = 2.5% compared to the characteristic CV1. This means that, based on the intensity of the spot light SPa near the center of the drawing line SLa, there is an intensity error of ±1.25% at both ends of the drawing line SLa. When the photosensitive functional layer formed on the substrate (P) is a photoresist or dry film, the allowable range of intensity unevenness of spot light (SP) during main scanning is said to be about ±2%, and ±1.25%. Any intensity error (non-uniformity) is acceptable.

However, as shown in FIG. 24, since there is a reflection mirror M6a whose incident angle changes significantly due to the deflection for the main scanning of the beam LBa behind the polygon mirror PM, the spot light projected on the substrate P ( The intensity of SPa) causes a larger intensity error with respect to the main scanning direction. As previously explained, the angle of incidence of the beam LBa incident on the reflection mirror M6a varies between θm1 and θm2. When Δθa is set to 7.5°, θm1=45°-15°=30°, θm2=45°+15°=60°. Assuming that the incident angle dependence of the reflectance of the reflection mirror M6a is the same as the characteristic CV1 in Fig. 25, at the scanning start point of the spot light SPa on the drawing line SLa, the beam LBa to the reflection mirror M6a is Since the angle of incidence is θm1 = 30°, the reflectance of the reflection mirror M6a at that angle of incidence is approximately 88.5%. Therefore, by multiplying the reflectance of 88% on the reflection surface (RPh) of the polygon mirror (PM), at the scanning start point of the spot light (SPa), the total is 77.9% (88% × 88.5%). It becomes the reflectance. Moreover, at the scanning end point of the spot light SPa on the drawing line SLa, the angle of incidence of the beam LBa on the reflection mirror M6a is θm2 = 60°, so the reflectance of the reflection mirror M6a at that angle of incidence is It is about 81%. Therefore, multiplied by the reflectance of 85.5% on the reflection surface RPh of the polygon mirror PM, the total reflectance becomes 69.3% (85.5% x 81%) at the scanning end point of the spot light SPa. From the above, the incident angle dependence of the total reflectance on the reflective surface of the polygon mirror PM and the reflective surface of the reflective mirror M6a becomes the characteristic CV2 in FIG. 25. Additionally, when the incident angle of the beam (LBa) on both the reflecting surface of the polygon mirror (PM) and the reflecting surface of the reflecting mirror (M6a) is 45°, the total reflectance is about 75.7% (87% × 87%). do.

As described above, the reflection mirror M6a (the same applies to M6b, M12a, and M12b) has a surface on which the beam LBa (LBb) reflected by the polygon mirror PM is deflected (in the embodiment of FIG. 17, the YtZt surface and Since it has a reflection surface orthogonal to the plane (parallel, parallel to the ), an error of approximately 8.6% occurs between the scanning start point and the scanning end point. This value is not necessarily an acceptable range, and it is desirable to provide some correction (adjustment) mechanism if necessary. The characteristic CV1 shown in FIG. 25 is an example. When the reflecting surface of the reflecting mirror is composed of a multilayer dielectric film, the rate of change (slope) of the reflectance with respect to the angle of incidence may become larger. Therefore, the reflectance characteristic CV1 of each of the actually used polygon mirror (PM) and reflection mirror (M6a (M6b)) is obtained in advance through experiments or simulations, and the spot light (SPa (SPb)) on the drawing line (SLa (SLb)) is calculated in advance. )) Obtain the trend of change in beam intensity (intensity unevenness, slope, etc.) for the scanning position.

When the tendency of the change in beam intensity is greater than the allowable range, a neutral density filter (ND filter) plate whose transmittance in the main scanning direction changes continuously or stepwise in the beam optical path behind the reflection mirrors (M6a, M6b, M12a, M12b). is provided, and the tendency of intensity change (intensity unevenness, tilt, etc.) with respect to the scanning position of the spot light SPa (SPb) on the substrate P can be optically suppressed or corrected. The light sensitive filter plate is located in the optical path between the reflection mirrors (M6a, M6b (M12a, M12b)) and the fθ lens system (FTa, FTb), or in the optical path between the fθ lens system (FTa, FTb) and the substrate P. It can be placed. In the optical path behind the fθ lens system (FTa, FTb), second cylindrical lenses CY2a and CY2b of plano-convex shape are provided with dimensions covering the drawing lines (SLa, SLb), so CY2a and CY2b of these cylindrical lenses A photosensitive filter plate may be provided near . In addition, as shown in FIGS. 5, 18, and 22, the reflection mirrors M7a, M7b bend the scanning beams LBa, LBb emitted from the fθ lens systems FTa, FTb to be perpendicular to the substrate P. , M15a, M15b), a thin film that continuously or stepwise changes the reflectance in the main scanning direction of the reflecting mirrors (M7a, M7b, M15a, M15b) is deposited on the reflecting surface, or a thin glass with a thickness of 0.1 mm or less is used. It is acceptable to optically adjust (correct) the intensity unevenness of the spot light (SPa (SPb)) with respect to the main scanning position by laminating a photosensitive filter plate on the reflecting surface.

Correction of the tendency of intensity change (intensity unevenness, slope, etc.) with respect to the scanning position of the spot light (SPa (SPb)) is also possible using an electrical correction mechanism. Figure 26 shows an optical element ( This is a block diagram showing an example of a control system of an acousto-optic modulation element and intensity adjustment member (AOMa, AOMb). In FIG. 26, the drive circuit 100 outputs a high-frequency driving signal Sdv for on/off to the optical element AOMa (AOMb). Here, the off state of the optical element AOMa(AOMb) means that the high-frequency driving signal Sdv is not applied to the optical element AOMa(AOMb), and the beam LB from the light source device 14 remains at 0. It is in a state of transmission as a second beam LBu, and in the on state, a high-frequency driving signal Sdv is applied to the optical element AOMa (AOMb), and the first order diffraction of the beam LB from the light source device 14 occurs. Light is deflected at a predetermined diffraction angle and output as a beam (LBa (LBb)). The diffraction angle is determined by the frequency (for example, 80 MHz) of the driving signal Sdv (high frequency signal). Moreover, by changing the amplitude of the driving signal Sdv, the diffraction efficiency changes, and the intensity of the beam LBa (LBb), which is the first-order diffracted light, can be adjusted.

The drive circuit 100 receives a high-frequency signal from a high-frequency oscillator (SF) with a constant frequency and stable amplitude, and a memory that stores drawing data (pattern data) in a bitmap format in which 1 pixel corresponds to 1 bit. , a drawing bit signal (CLT) and a control signal (DE) read as bit serial in pixel units are input. The drive circuit 100 outputs a high-frequency signal from the high-frequency oscillator (SF) as a drive signal (Sdv) while the drawing bit signal (CLT) has the logic value “1”, and the drawing bit signal (CLT) has the logic value of “1”. While it is “0”, transmission of the drive signal (Sdv) is prohibited. Additionally, within the drive circuit 100, a power amplifier is provided that varies the amplitude of the high-frequency signal from the high-frequency oscillator SF in accordance with the control signal DE. The control signal DE is an analog or digital signal, for example, a value indicating the amplification factor (gain) of the power amplifier. Here, the control signal DE is an analog signal.

Here, using the time chart in FIG. 27, the intensity of the beam LBa (LBb) is adjusted during the pattern drawing operation in which the spot light SPa (SPb) is scanned along the drawing line SLa (SLb). Explain. In Figure 27, the origin signal is a pulse waveform at the point just before the reflection surface of the polygon mirror PM rotates to a predetermined angle position and scanning of the spot light SPa (SPb) begins on the substrate P. Occurs. Therefore, when the reflection surface of the polygon mirror (PM) is 8, the pulse waveform of the origin signal occurs 8 times during one rotation of the polygon mirror (PM). After the pulse waveform of the origin signal is generated, a drawing ON signal (logic value "1") is generated after a certain delay time Tsq, the drawing bit signal (CLT) is applied to the drive circuit 100, and the beam (LBa) ) pattern drawing is started. At this time, the value (analog voltage) of the control signal (DE) increases from the value Ra at the point when the drawing ON signal becomes the logic value "1", and when the drawing ON signal changes from the logic value "1" to "0". At this point, the characteristic CCv transitions to the value Rb. In Fig. 27, when the value of the control signal DE is Ro, the gain of the power amplifier in the drive circuit 100 is set to the initial value (for example, 10 times). In the case of Figure 27, since Ra < Ro < Rb is set, the gain of the power-up is set lower than the initial value near the scanning start point on the drawing line SLa where the drawing ON signal rises to "1", so the substrate ( The intensity of the spot light (SPa (SPb)) projected on P) becomes smaller than the initial value. In addition, near the scanning end point on the drawing line SLa where the drawing ON signal drops to "0", the gain of the power-up is set higher than the initial value, so the spot light (SPa (SPb) projected on the substrate P The intensity of )) becomes greater than the initial value. This makes it possible to electrically adjust (correct) the intensity unevenness that occurs depending on the position of the spot light SPa (SPb) in the main scanning direction.

The waveform of this control signal DE can be generated by a simple time constant circuit (integrator circuit, etc.) that inputs a drawing ON signal or an origin signal. In addition, although the characteristic CCv of the control signal DE is set to change linearly in Figure 27, it may be changed non-linearly by an appropriate filter circuit. When the control signal (DE) is given as digital information rather than an analog waveform, it is good to modify the gain of the power amplifier so that it can be changed to a digital value of the control signal (DE).

As explained in FIGS. 26 and 27 above, the amplitude of the high-frequency driving signal Sdv applied to the optical element AOMa (AOMb) is changed, and the intensity of the beam LBa (LBb) projected onto the substrate P is changed. The electrical adjustment mechanism for adjusting is also effective when adjusting the relative intensity difference between the beams projected onto the substrate P from each of the plurality of drawing units. In addition, the mechanism for electrically adjusting the intensity of the beam LBa (LBb) is a semiconductor laser light source in which the light source device 14 generates a laser beam in the ultraviolet range, or in the case of a high-brightness LED light source, the light emission brightness itself of the light source. It can also be realized by adjusting .

In addition, as shown in FIGS. 5, 6, and 17 above, even when the two beams (LBa, LBb) whose reflection surfaces are directed toward the 8-sided polygon mirror (PM) are parallel to each other, the reflection of the polygon mirror (PM) When the beam (LBa) and the beam (LBb) are reflected from each of the reflective surfaces that are in a 90° relationship with each other, spot light (SPa) by the beam (LBa) and spot light by the beam (LBb) (SPb) scans the substrate P at the same timing. However, as disclosed in the pamphlet of International Publication No. 2015/166910, when the beam LB from one light source device 14 is divided into beams LBa and LBb in time division, spot light It is necessary to set it so that the main scan by (SPa) and the main scan by spot light (SPb) are not executed at the same timing. A simple embodiment for this is to use a polygon mirror (PM) with 9 reflective surfaces in the configuration shown in FIGS. 5, 6, and 17. In the case of a 9-sided polygon mirror, for example, at the timing when the beam LBa is incident on the center of the rotation direction of one reflecting surface, the other beam LBb reflects the reflecting surface of the 9-sided polygon mirror. The timing is to enter between the slope and the ridge. In other words, by changing the number of reflection surfaces, it becomes possible to deviate the timing of the main reflection by spot light (SPa) and the main reflection by spot light (SPb). In addition, in the configuration shown in Figs. 5, 6, and 17, when the timing of the main reflection by the spot light (SPa) and the main reflection by the spot light (SPb) are shifted while maintaining the 8-sided polygon mirror (PM) The beam LBa and the beam LBb facing the polygon mirror PM may be changed from being parallel to each other to being non-parallel.

Claims (23)

While sub-scanning an irradiated object, which is a flexible, long sheet substrate, in the longitudinal direction, spot light whose intensity is modulated based on drawing data is beamed in the longitudinal direction of the irradiated object. A pattern drawing device that draws a pattern according to the drawing data on the irradiated object by performing main scanning along a scanning line extending in an orthogonal width direction,
A rotating multi-plane mirror rotating around a rotation axis for the main scanning,
a first light guiding optical system that projects a first beam from a first direction toward the rotating polygonal mirror;
a second light guiding optical system that projects a second beam toward the rotating polygonal mirror from a second direction different from the first direction;
a first projection optical system for condensing the first beam reflected from the rotating polygonal mirror and projecting it as a first spot light onto a first scanning line;
a second projection optical system that condenses the second beam reflected from the rotating polygonal mirror and projects it as a second spot light onto a second scanning line;
Each scan length of the first scan line and the second scan line is set to be the same, and the first scan line and the second scan line are set to be separated from each other by an interval equal to or less than the scan length in the direction of the main scan. A pattern drawing device comprising a projection optical system and the second projection optical system. In claim 1,
A pattern drawing device in which the first projection optical system and the second projection optical system are arranged so that the first scanning line and the second scanning line are at the same position with respect to the direction of the sub-scanning on the irradiated object. In claim 1 or claim 2,
The rotating polygonal mirror has a plurality of reflecting surfaces arranged to surround the rotating axis,
The first light guide optical system is configured to reflect the incident direction of the first beam projected on a first reflective surface among the plurality of reflective surfaces of the rotating polygonal mirror from the first reflective surface with respect to the direction in which the rotation axis extends. 1 It is arranged to be different from the reflection direction of the beam,
The second light guide optical system determines the incident direction of the second beam projected on a second reflective surface different from the first reflective surface among the plurality of reflective surfaces of the rotating polygonal mirror, with respect to the direction in which the rotation axis extends. A pattern drawing device provided to change the reflection direction of the second beam reflected from a reflective surface. In claim 1,
The rotating polygonal mirror, the first light guiding optical system, the second light guiding optical system, the first projection optical system, and the second projection optical system are integrally formed as one rotatable drawing unit,
A pattern drawing device wherein the central axis of rotation of the drawing unit is set to pass perpendicularly to the object to be irradiated through a point on a line segment connecting the midpoint of the first scanning line and the midpoint of the second scanning line. In claim 4,
The first beam and the second beam are incident on the drawing unit so as to be symmetrical with respect to the central axis of rotation. In claim 5,
The pattern drawing device wherein the drawing unit includes a reflection member that reflects the incident first beam and the second beam and guides them to the first light guide optical system and the second light guide optical system. In claim 6,
The first light guide optical system includes a first shift optical member that shifts the position of the first beam reflected from the reflection member in a plane intersecting the direction of travel of the first beam,
The pattern drawing device wherein the second light guide optical system includes a second shift optical member that shifts the position of the second beam reflected from the reflection member in a plane intersecting the direction of travel of the second beam. The method according to any one of claims 4 to 6,
A plurality of the drawing units are provided,
A pattern drawing device in which a plurality of the drawing units are arranged so that the first scanning line and the second scanning line of the plurality of drawing units are connected to each other along the width direction of the irradiated object. In claim 8,
It has a first central axis extending in a width direction perpendicular to the longitudinal direction of the irradiated object, and a cylindrical outer peripheral surface with a predetermined radius from the first central axis, and a portion of the irradiated object is extended along the outer peripheral surface in the longitudinal direction. a first rotating drum that sub-scans the irradiated object by rotating about the first central axis and conveying the irradiated object while being curved and supported;
It is provided on the downstream side of the conveyance direction of the first rotating drum, and has a second central axis extending in a width direction perpendicular to the longitudinal direction of the object to be irradiated, and a cylindrical outer peripheral surface with a constant radius from the second central axis. A second rotating drum is provided for sub-scanning the irradiated object by rotating around the second central axis to convey the irradiated object while supporting it by bending a portion of the irradiated object along the outer peripheral surface in the longitudinal direction. ,
Among the plurality of drawing units, the first scanning line and the second scanning line of a predetermined number of the drawing units are located on the object to be irradiated supported on the outer peripheral surface of the first rotating drum, and the first scanning lines of the remaining drawing units A pattern drawing device in which the plurality of drawing units are arranged so that a scanning line and a second scanning line are positioned on the object supported on the outer peripheral surface of the second rotary drum. While sub-scanning an irradiated object, which is a flexible, long sheet substrate, in the longitudinal direction, spot light whose intensity is modulated based on drawing data is mainly scanned along a scanning line extending in the width direction perpendicular to the longitudinal direction of the irradiated object. A pattern drawing method for drawing a pattern according to the drawing data on the irradiated object,
projecting a first beam from a first direction toward a rotating multi-mirror;
projecting a second beam toward the rotating polygonal mirror from a second direction different from the first direction;
deflecting and scanning the first beam and the second beam that are incident and reflected on another reflective surface of the rotating polygonal mirror by rotation of the rotating polygonal mirror;
Concentrating the first beam reflected from the rotating polygonal mirror and projecting it as a first spot light onto a first scanning line;
Concentrating the second beam reflected from the rotating polygonal mirror and projecting it as a second spot light onto a second scanning line,
A pattern drawing method in which the scan lengths of the first scan line and the second scan line are set to be the same, and the first scan line and the second scan line are set to be separated in the direction of the main scan by an interval equal to or less than the scan length. . In claim 10,
Including rotating the first scanning line and the second scanning line around a rotation center axis that passes perpendicularly to the subject through a point on a line segment connecting the midpoint of the first scanning line and the midpoint of the second scanning line. How to draw a pattern. While transporting the irradiated object in the direction of the sub-scanning beam, the beam from the light source device is condensed into a spot on the irradiated object, and the condensed spot light is mainly scanned along a scanning line perpendicular to the direction of the sub-scanning beam, thereby forming a beam on the irradiated object. A pattern drawing device for drawing a predetermined pattern, comprising:
A rotating multi-plane mirror rotating around a predetermined rotation axis,
a first light guiding optical system that projects a first beam from the light source device toward the rotating polygonal mirror from a first direction;
a second light guiding optical system that projects a second beam from the light source device toward the rotating polygonal mirror from a second direction different from the first direction;
a first projection optical system for condensing the first beam reflected from the rotating polygonal mirror and projecting it as a first spot light onto a first scanning line;
a second projection optical system that condenses the second beam reflected from the rotating polygonal mirror and projects it as a second spot light onto a second scanning line;
The rotating polygonal mirror, the first light guide optical system, and the second scanning line are disposed so that the first scanning line and the second scanning line are arranged offset in parallel in at least one of the main scanning direction and the sub-scanning direction on the irradiated object. a drawing unit that integrally holds the light guide optical system, the first projection optical system, and the second projection optical system and is rotatable;
A pattern drawing device wherein the rotational central axis of the drawing unit is set to pass perpendicularly to the irradiated object between the midpoint of the first scanning line and the midpoint of the second scanning line. In claim 12,
The pattern drawing device wherein the rotation central axis is set at the center point of a line segment connecting the midpoint of the first scanning line and the midpoint of the second scanning line. In claim 13,
The pattern drawing device wherein the first scanning line and the second scanning line are spaced apart from each other in the sub-scanning direction and are adjacent to or partially overlap each other in the main scanning direction. Concentrating the beam from the light source device into a spot on the irradiated object while conveying the irradiated object in the direction of the sub-scanning beam, and main scanning the condensed spot light along a scanning line extending in a direction perpendicular to the direction of the sub-scanning beam, A pattern drawing method for drawing a predetermined pattern on an irradiated object, comprising:
projecting a first beam from the light source device toward a rotating polygonal mirror from a first direction;
projecting a second beam from the light source device toward the rotating polygonal mirror from a second direction different from the first direction;
deflecting and scanning the first beam and the second beam that are incident and reflected on another reflective surface of the rotating polygonal mirror by rotation of the rotating polygonal mirror;
Concentrating the first beam reflected from the rotating polygonal mirror and projecting it as a first spot light onto a first scanning line;
Concentrating the second beam reflected from the rotating polygonal mirror and projecting it as a second spot light on a second scanning line;
A pattern drawing method comprising rotating the first scanning line and the second scanning line around a rotation central axis that is perpendicular to the irradiated object and is set between the midpoint of the first scanning line and the midpoint of the second scanning line. . In claim 15,
The first scanning line and the second scanning line are rotated to tilt the predetermined pattern to be drawn on the irradiated object, or the predetermined pattern is newly drawn on the lower layer pattern previously formed on the irradiated object. A pattern drawing method in which the first scanning line and the second scanning line are rotated in response to an inclination of the entire or part of the pattern of the lower layer when drawing overlapping each other. delete delete delete delete delete delete delete

Images